TWI848519B - 半導體裝置及其製造方法 - Google Patents

半導體裝置及其製造方法 Download PDF

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Publication number
TWI848519B
TWI848519B TW112101313A TW112101313A TWI848519B TW I848519 B TWI848519 B TW I848519B TW 112101313 A TW112101313 A TW 112101313A TW 112101313 A TW112101313 A TW 112101313A TW I848519 B TWI848519 B TW I848519B
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TW
Taiwan
Prior art keywords
manufacturing
same
semiconductor device
semiconductor
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TW112101313A
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English (en)
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TW202336868A (zh
Inventor
唐浩明
陳書涵
簡筠珊
李達元
志安 徐
陳宗儒
丁一心
王涵聖
Original Assignee
台灣積體電路製造股份有限公司
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Priority claimed from US17/837,848 external-priority patent/US20230274938A1/en
Application filed by 台灣積體電路製造股份有限公司 filed Critical 台灣積體電路製造股份有限公司
Publication of TW202336868A publication Critical patent/TW202336868A/zh
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Publication of TWI848519B publication Critical patent/TWI848519B/zh

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TW112101313A 2022-02-25 2023-01-12 半導體裝置及其製造方法 TWI848519B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US202263314045P 2022-02-25 2022-02-25
US63/314,045 2022-02-25
US17/837,848 US20230274938A1 (en) 2022-02-25 2022-06-10 Method of manufacturing semiconductor devices and semiconductor devices
US17/837,848 2022-06-10

Publications (2)

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TW202336868A TW202336868A (zh) 2023-09-16
TWI848519B true TWI848519B (zh) 2024-07-11

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Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20200035808A1 (en) 2018-07-30 2020-01-30 International Business Machines Corporation Semiconductor device having two-part spacer

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20200035808A1 (en) 2018-07-30 2020-01-30 International Business Machines Corporation Semiconductor device having two-part spacer

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