TWI846446B - Copper column installation device and automated copper column installation equipment - Google Patents

Abstract

A copper column installation device comprises: a body, at least one side wall of which is provided with at least one air inlet; a plurality of feed ports, located on an upper surface of the body, each of the feed ports comprises a plurality of feed holes, each of the feed holes comprises a first through-hole portion in a step-like tapering funnel shape and a second through-hole portion in a tubular shape closely connected to the lower side of the first through-hole portion, each of the first through-hole portions can accommodate a plurality of copper columns, each of the second through-hole portions can accommodate only one of the copper columns, and Each of the second perforated portions has a lateral slot to communicate with the at least one air intake port of the main body; an exhaust device to connect to the at least one air intake port; and a screen plate having a first positioning position and a second positioning position. When the screen plate is located at the first positioning position, it allows multiple copper columns to pass through the screen plate and fall downward onto multiple connecting pads of a base plate; and when the screen plate is located at the second positioning position, it can prevent any of the copper columns from passing through the screen plate.

Description

Copper column installation device and automated copper column installation equipment

The present invention relates to a copper column mounting solution for a substrate, and more particularly to a technical solution for rapidly and accurately mounting a plurality of copper columns on a substrate in batches.

When manufacturing printed circuit boards (PCBs), general electronics factories must first apply solder paste on each connection pad of the PCB, then place multiple copper pillars on the corresponding connection pads of the PCB, and then heat the PCB to melt the solder, thereby completing the production of the printed circuit.

When placing copper pillars on connection pads of printed circuit boards, an automated copper pillar placement device such as a robot arm or a needle implantation device is generally used. However, the placement efficiency of existing copper pillar placement devices still has room for improvement.

Therefore, a novel copper pillar mounting solution for a substrate is urgently needed in the art.

One purpose of the present invention is to disclose a copper column installation device, which can ensure that a plurality of copper columns to be placed each stay in a feed hole by means of a pneumatic brake device in combination with a screen plate, so as to effectively prevent the copper columns from falling downward during the movement of the copper column installation device.

Another object of the present invention is to disclose a copper column installation device, which can suck out any copper column to be placed upward through an upward suction device when the copper column is stuck in a feed hole.

Another object of the present invention is to disclose a copper pillar installation device, which can place multiple copper pillars onto multiple corresponding connection pads of a substrate in a batch feeding operation through multiple feeding holes arranged in a predetermined pattern, thereby improving the copper pillar installation efficiency of the substrate.

Another object of the present invention is to disclose a copper column mounting device, which can ensure that each funnel-shaped feed hole can smoothly guide and deliver a copper column through a plurality of step-like tapered funnel-shaped feed holes and a vibration device, thereby smoothly mounting a plurality of copper columns on a plurality of corresponding connection pads of a substrate in a batch manner.

Another object of the present invention is to disclose an automated copper pillar installation device, which can ensure that multiple copper pillars can be successfully installed on multiple corresponding connection pads of a substrate in a batch manner through the aforementioned copper pillar installation device, thereby improving the copper pillar installation efficiency of the substrate.

In order to achieve the above-mentioned purpose, a copper column mounting device is proposed, which has: A body, at least one side wall of which is provided with at least one air inlet; A plurality of feed ports are located on an upper surface of the body, each of the feed ports comprises a plurality of feed holes, the feed holes are arranged in a predetermined pattern, each of the feed holes comprises a first perforated portion in a step-like, funnel-shaped manner and a second perforated portion in a tubular shape closely connected to the lower portion of the first perforated portion, each of the first perforated portions can accommodate a plurality of copper pillars, each of the second perforated portions can only accommodate one of the copper pillars, and each of the second perforated portions is connected to a release hole on a lower surface of the body, wherein each of the second perforated portions has a lateral slot, and the at least one air intake port of the body is connected to the lateral slot of each of the second perforated portions; an exhaust device is used to connect to the at least one air intake port; and A screen plate is disposed on the lower surface of the body in a horizontally movable manner and has a plurality of discharge holes, wherein the screen plate has a first positioning position and a second positioning position, when the screen plate is located at the first positioning position, the discharge holes are correspondingly connected with the release holes to form a plurality of channels for the plurality of copper columns to pass through the screen plate and fall downward onto a plurality of connecting pads of a base plate; and when the screen plate is located at the second positioning position, the discharge holes are not correspondingly connected with the release holes to prevent any of the copper columns from passing through the screen plate.

In one embodiment, the screen plate is driven by a micro-driving device to move to the first positioning position or the second positioning position.

In a possible embodiment, the micro-actuator has a micro-actuator, and the micro-actuator can be a piezoelectric actuator, a stepper motor, an electric cylinder or an electromagnetic actuator.

In one embodiment, the micro-actuator drives the screen plate to move according to a control voltage, and the control voltage is determined according to a sensing signal of an optical ruler.

In one embodiment, the copper column installation device further has an upward suction device for sucking any of the copper columns upward through a corresponding feed hole when the copper column is stuck.

In one embodiment, when the vacuum device performs a vacuum operation, it applies a lateral force to one of the copper columns in each of the second perforated portions through each of the lateral grooves to fix each of the copper columns in each of the second perforated portions; and when the vacuum device stops the vacuum operation, it causes each of the second perforated portions to release one of the copper columns so that multiple of the copper columns fall downward.

In one embodiment, the pattern formed by the connection pads of the substrate corresponds to the predetermined pattern.

In one embodiment, the copper column installation device further includes a vibration device, which is in contact with the main body to guide one of the plurality of copper columns in each of the first through-hole portions into a corresponding second through-hole portion by vibrating the main body.

To achieve the aforementioned object, the present invention further proposes an automated copper column installation device, which has a feeding device and the copper column installation device as described above, and the feeding device is used to transfer a plurality of the copper columns to the feed ports of the copper column installation device.

In order to enable the review committee to further understand the structure, features, purpose, and advantages of this creation, the following are attached with diagrams and detailed descriptions of the preferred specific implementation examples.

Please refer to Figures 1 to 3 together, wherein Figure 1 is a top view schematic diagram of an embodiment of the copper column mounting device of the present invention; Figure 2 is a sectional three-dimensional view of the copper column mounting device of Figure 1 taken along the section line A-A; and Figure 3 is a partial sectional view of the copper column mounting device of Figure 1 taken along the section line A-A.

As shown in FIGS. 1 to 3 , a copper column installation device 100 comprises a body 110 , a plurality of feed ports 120 , at least one air inlet 130 , a vibration device 140 and a screen plate 150 .

The feed ports 120 are located on an upper surface of the body 110. Each feed port 120 includes a plurality of feed holes 121. The feed holes 121 are arranged in a predetermined pattern (a square in this embodiment). Each feed hole 121 includes a first through-hole portion 121a in a stepped funnel shape and a second through-hole portion 121b in a tubular shape closely connected to the lower portion of the first through-hole portion 121a. Each first through-hole portion 121a can accommodate a plurality of copper pillars 10, and each second through-hole portion 121b can only accommodate one copper pillar 10. , each second perforated portion 121b is connected to a release hole 111 on a lower surface of the body 110, and each second perforated portion 121b has a lateral slot 121b1, and the at least one air inlet 130 of the body 110 is connected to the lateral slot 121b1 of each second perforated portion 121b, wherein the stepped side wall of the first perforated portion 121a in a stepped and gradually tapering funnel shape is shown in the enlarged view of the local area B in FIG. 3, and the position of the lateral slot 121b1 is shown in the enlarged view of the local area C in FIG. 2.

The at least one air inlet 130 is disposed on at least one side wall of the main body 110 to be connected to an air extraction device (not shown in the figure), and is connected to the side slots 121b1 of each second perforated portion 121b.

The vibration device 140 is in contact with the main body 110 to vibrate the main body 110 to guide one of the copper pillars 10 in each first through-hole portion 121a into a corresponding second through-hole portion 121b.

The screen plate 150 is disposed on the lower surface of the body 110 in a horizontally movable manner, and has a plurality of discharge holes 151, wherein the screen plate 150 has a first positioning position and a second positioning position. When the screen plate 150 is located at the first positioning position, the discharge holes 151 are correspondingly connected with the release holes 111 to form a plurality of channels for a plurality of copper pillars 10 to pass through the screen plate 150 and fall downward onto a plurality of connecting pads of a substrate; and when the screen plate 150 is located at the second positioning position, the discharge holes 151 are not correspondingly connected with the release holes 111 and can prevent any copper pillar 10 from passing through the screen plate 150.

During operation, the copper column installation device 100 can drive the screen plate 150 to move to the second positioning position through a micro-driving device (not shown in the figure) and perform a vacuum operation through the vacuum device to ensure that the copper columns 10 located in the main body 110 will not fall downward during the movement of the copper column installation device 100. When the vacuum device performs the vacuum operation, it applies a lateral force to a copper column 10 in each second perforated portion 121b through each lateral groove 121b1 to fix each copper column 10 in each second perforated portion 121b. In addition, when the copper column mounting device 100 moves to a position above a substrate, the vacuum operation can be stopped by the vacuum device and the screen plate 150 can be driven to the first position by the micro-actuator, so that each second perforated portion 121b releases a copper column 10 to a plurality of corresponding connection pads (not shown in the figure) of the substrate. In addition, the micro-actuator can drive the screen plate 150 to generate a movement amount according to a control voltage, and the control voltage can be determined according to a sensing signal of an optical ruler (not shown in the figure). In detail, the micro-actuator can have a micro-actuator, and the micro-actuator can be a piezoelectric actuator, a stepping motor, an electric cylinder or an electromagnetic actuator. Since the optical ruler and the micro-actuators are both known technologies, their principles are not described in detail here.

In addition, the copper column mounting device 100 can be realized by a 3D printing process, an engraving process or a milling process; or it can be composed of a plurality of layers, and these layers can be realized by a 3D printing process, an engraving process or a milling process.

In addition, the patterns formed by the connection pads of the substrate correspond to the predetermined pattern.

In addition, the copper column installation device 100 may further include an upward suction device (not shown in the figure) for sucking any copper column 10 upward through a corresponding feed hole 121 when the copper column 10 is stuck.

According to the above description, the present invention further proposes an automated copper column installation device. Please refer to FIG4, which is a schematic diagram of an embodiment of the automated copper column installation device of the present invention. As shown in FIG4, an automated copper column installation device 200 has a control circuit 210, a feeding device 220, a copper column installation device 230, a conveyor belt 240, an exhaust device 250, a micro-drive device 260 and an upward exhaust device 270, wherein the conveyor belt 240 is used to carry a substrate 20, and the copper column installation device 230 is implemented by the copper column installation device 100.

During operation, the control circuit 210 drives the feeding device 220 to transfer the plurality of copper pillars 10 to the copper pillar installation device 230, and then drives the exhaust device 250 and the micro-driving device 260 so that the copper pillar installation device 230 can batch-feed the plurality of copper pillars 10 onto the plurality of corresponding connection pads (not shown in the figure) of the substrate 20 according to the above-mentioned operation mode. Afterwards, the control circuit 210 drives the conveyor belt 240 to transfer the substrate 20 to a heating zone to weld each of the copper pillars 10 onto a corresponding connection pad. In addition, when any copper pillar 10 is stuck in a feed hole, the upward exhaust device 270 can be driven to suck air into the feed hole to suck the copper pillar 10 upward.

In addition, the heating device of the heating zone can be a reflow furnace, an infrared heating lamp or a hot air gun.

Through the above disclosed design, the present invention has the following advantages:

1. The copper column installation device of the present invention can ensure that multiple copper columns to be placed each stay in a feed hole by using a pneumatic brake device in combination with a screen plate, so as to effectively prevent the copper columns from falling downward during the movement of the copper column installation device.

2. The copper column installation device of the present invention can suck out any copper column to be placed upwards through an upward suction device when the copper column is stuck in a feed hole.

3. The copper pillar installation device of the present invention can place multiple copper pillars onto multiple corresponding connection pads of a substrate in a batch feeding operation through multiple feeding holes arranged in a predetermined pattern, thereby improving the copper pillar installation efficiency of the substrate.

4. The copper column installation device of the present invention can ensure that each funnel-shaped feed hole can smoothly guide and deliver a copper column through a plurality of step-like funnel-shaped feed holes and a vibration device, thereby smoothly installing a plurality of copper columns on a plurality of corresponding connection pads of a substrate in a batch manner.

5. The automated copper pillar installation equipment of the present invention can ensure that multiple copper pillars can be smoothly installed on multiple corresponding connection pads of a substrate in a batch manner through the aforementioned copper pillar installation device, thereby improving the copper pillar installation efficiency of the substrate.

The invention disclosed in this case is a preferred embodiment. Any partial changes or modifications that are derived from the technical concept of this case and are easily inferred by people familiar with the art do not deviate from the scope of the patent rights of this case.

In summary, this case shows that its purpose, means and effects are all different from the known technology, and it is the first invention that is practical and indeed meets the patent requirements for invention. We sincerely request the review committee to examine this carefully and grant a patent as soon as possible to benefit the society. This is our utmost prayer.

10: Copper Column

20: Substrate

100: Copper column installation device

110: Body

111: Release hole

120: Feeding port

121: Feed hole

121a: first perforated portion

121b: second perforated portion

121b1: Side slotting

130: Intake

140: Vibration device

150: Screen plate

151: Discharge perforation

200:Automated copper column installation equipment

210: Control circuit

220: Feeding device

230: Copper column installation device

240:Conveyor belt

250:Exhaust equipment

260:Micro drive device

270: Upward suction device

B: Local area

C: Local area

FIG. 1 is a schematic top view of an embodiment of the copper column installation device of the present invention; FIG. 2 is a cross-sectional perspective view of the copper column installation device of FIG. 1; FIG. 3 is a partial cross-sectional view of the copper column installation device of FIG. 1; and FIG. 4 is a schematic view of an embodiment of the automated copper column installation equipment of the present invention.

111: Release hole

120: Feeding port

121: Feed hole

121b1: Lateral slotting

130: Intake port

140:Vibration device

150: Screen plate

151: Discharge perforation

C: Local area

Claims (16)

A copper column installation device, comprising: A main body, at least one side wall of which is provided with at least one air inlet; A plurality of feed ports, located on an upper surface of the main body, each of the feed ports comprises a plurality of feed holes, the feed holes are arranged in a predetermined pattern, each of the feed holes comprises a first perforated portion in a step-like, funnel-shaped manner and a second perforated portion in a tubular shape closely connected to the lower portion of the first perforated portion, each of the first perforated portions can accommodate a plurality of copper columns, each of the second perforated portions can accommodate only one copper column, and each of the second perforated portions is connected to a release hole on a lower surface of the main body, wherein each of the second perforated portions has a lateral slot, and the at least one air inlet of the main body is connected to the lateral slot of each of the second perforated portions; a vacuum device connected to the at least one suction port; and a screen plate disposed on the lower surface of the body in a horizontally movable manner and having a plurality of discharge holes, wherein the screen plate has a first positioning position and a second positioning position, and when the screen plate is located at the first positioning position, the discharge holes are correspondingly connected to the release holes to form a plurality of channels for the plurality of copper columns to pass through the screen plate and fall downward to a plurality of connection pads of a base plate; and when the screen plate is located at the second positioning position, the discharge holes are not correspondingly connected to the release holes and can prevent any of the copper columns from passing through the screen plate. A copper column mounting device as described in claim 1, wherein the screen plate is driven by a micro-driving device to move to the first positioning position or the second positioning position. A copper column mounting device as described in claim 2, wherein the micro-actuator has a micro-actuator, and the micro-actuator is an actuator selected from a group consisting of a piezoelectric actuator, a stepping motor, an electric control cylinder and an electromagnetic actuator. A copper column mounting device as described in claim 2, wherein the micro-actuator drives the screen plate to produce a movement amount according to a control voltage, and the control voltage is determined according to a sensing signal of an optical ruler. The copper column installation device as described in claim 1 further has an upward suction device for sucking any of the copper columns upward through a corresponding feed hole when the copper column is stuck. A copper column installation device as described in claim 1, wherein, when the vacuum device performs a vacuum operation, it applies a lateral force to one of the copper columns in each of the second perforated portions through each of the lateral slots to fix each of the copper columns in each of the second perforated portions; and when the vacuum device stops the vacuum operation, it causes each of the second perforated portions to release one of the copper columns so that a plurality of the copper columns fall downward. A copper pillar mounting device as described in claim 1, wherein the pattern formed by the connection pads of the substrate corresponds to the predetermined pattern. The copper column mounting device as described in claim 1 further comprises a vibration device, which is in contact with the main body so as to vibrate the main body to guide one of the plurality of copper columns in each of the first through-hole portions into a corresponding second through-hole portion. An automated copper column installation device comprises a feeding device and the copper column installation device as described in claim 1, wherein the feeding device is used to transfer a plurality of the copper columns to the feed ports of the copper column installation device. The automated copper column mounting device as described in claim 9 has a micro-driving device to drive the screen plate to move to the first positioning position or the second positioning position. An automated copper column mounting apparatus as described in claim 10, wherein the micro-actuator has a micro-actuator, and the micro-actuator is an actuator selected from a group consisting of a piezoelectric actuator, a stepping motor, an electric control cylinder and an electromagnetic actuator. An automated copper column mounting device as described in claim 10, wherein the micro-actuator drives the screen plate to produce a movement amount according to a control voltage, and the control voltage is determined according to a sensing signal of an optical ruler. The automated copper column installation equipment as described in claim 9 has an upward suction device for sucking any of the copper columns upward through a corresponding feed hole when the copper column is stuck. An automated copper column installation device as described in claim 9, wherein, when the vacuum device performs a vacuum operation, it applies a lateral force to one of the copper columns in each of the second perforated portions through each of the lateral slots to fix each of the copper columns in each of the second perforated portions; and when the vacuum device stops the vacuum operation, it causes each of the second perforated portions to release one of the copper columns so that a plurality of the copper columns fall downward. An automated copper pillar mounting device as described in claim 9, wherein the pattern formed by the connection pads of the substrate corresponds to the predetermined pattern. The automated copper column installation equipment as described in claim 9 has a vibration device, which abuts against the main body to guide one of the multiple copper columns in each first perforation portion into a corresponding second perforation portion by vibrating the main body.

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