TWI845833B - 形成圖案的方法和製造半導體裝置的方法 - Google Patents

形成圖案的方法和製造半導體裝置的方法 Download PDF

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Publication number
TWI845833B
TWI845833B TW110112591A TW110112591A TWI845833B TW I845833 B TWI845833 B TW I845833B TW 110112591 A TW110112591 A TW 110112591A TW 110112591 A TW110112591 A TW 110112591A TW I845833 B TWI845833 B TW I845833B
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TW
Taiwan
Prior art keywords
semiconductor devices
manufacturing semiconductor
forming pattern
pattern
forming
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TW110112591A
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English (en)
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TW202232243A (zh
Inventor
陳勁達
林華泰
吳漢威
黃建元
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台灣積體電路製造股份有限公司
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Priority claimed from US17/175,366 external-priority patent/US11961738B2/en
Application filed by 台灣積體電路製造股份有限公司 filed Critical 台灣積體電路製造股份有限公司
Publication of TW202232243A publication Critical patent/TW202232243A/zh
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Publication of TWI845833B publication Critical patent/TWI845833B/zh

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TW110112591A 2021-02-12 2021-04-07 形成圖案的方法和製造半導體裝置的方法 TWI845833B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US17/175,366 US11961738B2 (en) 2021-02-12 2021-02-12 Method of manufacturing semiconductor devices
US17/175,366 2021-02-12

Publications (2)

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TW202232243A TW202232243A (zh) 2022-08-16
TWI845833B true TWI845833B (zh) 2024-06-21

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Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20190348292A1 (en) 2018-05-10 2019-11-14 International Business Machines Corporation Transferring euv resist pattern to eliminate pattern transfer defectivity

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20190348292A1 (en) 2018-05-10 2019-11-14 International Business Machines Corporation Transferring euv resist pattern to eliminate pattern transfer defectivity

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