TWI844866B - Memory device - Google Patents
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本發明是有關於一種記憶體裝置,且特別是有關於一種可降低佈局面積並維持負載平衡的記憶體裝置。The present invention relates to a memory device, and more particularly to a memory device capable of reducing layout area and maintaining load balance.
在所謂的開放式位元線(open bit-line)架構的動態隨機存取記憶體中,感測放大器需設置在於每個記憶胞區塊的兩邊。其中,每個記憶胞區塊會被拆分成兩個相同的數量並透過二邊的感測放大器進行讀寫。In a DRAM with an open bit-line architecture, sense amplifiers are placed on both sides of each memory cell block. Each memory cell block is split into two equal parts and read and written through sense amplifiers on both sides.
在此架構下,習知記憶體邊緣的兩個記憶胞區塊會由於僅有一半被連接至感測放大器而無法正常的進行讀寫。也就是說,習知記憶體中會有二個完整尺寸的記憶胞區塊無法使用,造成佈局面積的浪費。這樣的配置在大尺寸的記憶體中或許並不顯著。但在小尺寸的記憶體中(例如應用於人工智慧計算的記憶體),無法使用的記憶胞區塊相對於記憶體的電路尺寸比例會顯著的增加,進而大幅的影響製造成本。Under this architecture, the two memory cell blocks at the edge of the learning memory cannot be read or written normally because only half of them are connected to the sense amplifier. In other words, there will be two full-sized memory cell blocks in the learning memory that cannot be used, resulting in a waste of layout area. Such a configuration may not be significant in large-sized memories. However, in small-sized memories (such as memories used in artificial intelligence calculations), the ratio of unusable memory cell blocks to the circuit size of the memory will increase significantly, thereby greatly affecting the manufacturing cost.
本發明提供一種記憶體裝置,在維持感測放大器的兩輸入端間的負載平衡的前提下,有效降低電路佈局所需的面積。The present invention provides a memory device which effectively reduces the area required for circuit layout while maintaining load balance between two input terminals of a sense amplifier.
本發明的記憶體裝置包括至少一記憶胞區塊、第一邊界區塊、第二邊界區塊、多個第一感測放大器以及多個第二感測放大器。第一邊界區塊耦接至多條第一字元線,其中第一字元線中的至少其中之一接收被致能的第一字元線信號。第二邊界區塊耦接至多條第二字元線,其中第二字元線中的至少其中之一接收被致能的第二字元線信號。第一感測放大器設置在該第一邊界區塊與記憶胞區塊間,分別耦接至記憶胞區塊的多條第一位元線,並分別耦接至第一邊界區塊的多條第二位元線。第二感測放大器設置在第二邊界區塊與記憶胞區塊間,分別耦接至記憶胞區塊的多條第三位元線,並分別耦接至第二邊界區塊的多條第四位元線。The memory device of the present invention includes at least one memory cell block, a first boundary block, a second boundary block, a plurality of first sense amplifiers, and a plurality of second sense amplifiers. The first boundary block is coupled to a plurality of first word lines, wherein at least one of the first word lines receives an enabled first word line signal. The second boundary block is coupled to a plurality of second word lines, wherein at least one of the second word lines receives an enabled second word line signal. The first sense amplifier is disposed between the first boundary block and the memory cell block, and is respectively coupled to a plurality of first bit lines of the memory cell block, and is respectively coupled to a plurality of second bit lines of the first boundary block. The second sense amplifier is arranged between the second boundary block and the memory cell block, and is respectively coupled to a plurality of third bit lines of the memory cell block, and is respectively coupled to a plurality of fourth bit lines of the second boundary block.
基於上述,本發明在記憶胞區塊的兩側邊分別設置第一邊界區塊以及第二邊界區塊。並利用使第一邊界區塊以及第二邊界區塊中的部分字元線被致能來提供負載至對應的感測放大器,以使感測放大器的兩輸入端的負載可以平衡,提升感測放大器的感測動作的反應速率。Based on the above, the present invention sets a first boundary block and a second boundary block on both sides of the memory cell block, respectively, and enables part of the word lines in the first boundary block and the second boundary block to provide loads to the corresponding sense amplifiers, so that the loads of the two input terminals of the sense amplifiers can be balanced, thereby improving the response rate of the sensing action of the sense amplifiers.
請參照圖1,圖1繪示本發明一實施例的記憶體裝置的示意圖。記憶體裝置100包括記憶胞區塊MBK、邊界區塊BK1、BK2以及感測放大器(sense amplifier, SA)111~11N以及121~12N。在本實施例中,邊界區塊BK1以及BK2可分別設置在記憶胞區塊MBK的兩個不同的側邊。邊界區塊BK1耦接多條字元線AWL1~AWLK,其中字元線AWL1~AWLK中的至少一條接收維持被致能的字元線信號。邊界區塊BK2則耦接多條字元線BWL1~BWLL,其中字元線BWL1~BWLL中的至少一條也接收維持被致能的字元線信號。Please refer to FIG. 1, which shows a schematic diagram of a memory device according to an embodiment of the present invention. The memory device 100 includes a memory cell block MBK, boundary blocks BK1, BK2, and sense amplifiers (SA) 111-11N and 121-12N. In this embodiment, the boundary blocks BK1 and BK2 can be respectively arranged at two different sides of the memory cell block MBK. The boundary block BK1 is coupled to a plurality of word lines AWL1-AWLK, wherein at least one of the word lines AWL1-AWLK receives a word line signal to maintain being enabled. The boundary block BK2 is coupled to a plurality of word lines BWL1 -BWLL, wherein at least one of the word lines BWL1 -BWLL also receives a word line signal to maintain being enabled.
感測放大器(SA)111~11N耦接在記憶胞區塊MBK以及邊界區塊BK1間。感測放大器(SA)111~11N的第一輸入端分別耦接至記憶胞區塊MBK的多條位元線BL11~BL1N。感測放大器(SA)111~11N的第二輸入端則分別耦接至記憶胞區塊MBK的多條位元線BL21~BL2N。The sense amplifiers (SA) 111-11N are coupled between the memory cell block MBK and the boundary block BK1. The first input terminals of the sense amplifiers (SA) 111-11N are respectively coupled to a plurality of bit lines BL11-BL1N of the memory cell block MBK. The second input terminals of the sense amplifiers (SA) 111-11N are respectively coupled to a plurality of bit lines BL21-BL2N of the memory cell block MBK.
感測放大器(SA)121~12N耦接在記憶胞區塊MBK以及邊界區塊BK2間。感測放大器(SA)121~12N的第一輸入端分別耦接至記憶胞區塊MBK的多條位元線BL31~BL3N。感測放大器(SA)121~12N的第二輸入端則分別耦接至記憶胞區塊MBK的多條位元線BL41~BL4N。其中,記憶胞區塊MBK的位元線BL11~BL1N與位元線BL31~BL3N是不同的位元線。其中,位元線BL11~BL1N例如是記憶胞區塊MBK中的第奇數條位元線,位元線BL31~BL3N例如是記憶胞區塊MBK中的第偶數條位元線。The sense amplifiers (SA) 121~12N are coupled between the memory cell block MBK and the boundary block BK2. The first input terminals of the sense amplifiers (SA) 121~12N are respectively coupled to the multiple bit lines BL31~BL3N of the memory cell block MBK. The second input terminals of the sense amplifiers (SA) 121~12N are respectively coupled to the multiple bit lines BL41~BL4N of the memory cell block MBK. The bit lines BL11~BL1N and the bit lines BL31~BL3N of the memory cell block MBK are different bit lines. The bit lines BL11~BL1N are, for example, the odd bit lines in the memory cell block MBK, and the bit lines BL31~BL3N are, for example, the even bit lines in the memory cell block MBK.
在此請注意,在本實施例中,邊界區塊BK1的字元線AWL1~AWLK的數量,少於記憶胞區塊MBK的字元線WL1~WLM的總數量。邊界區塊BK2的字元線BWL1~BWLL的數量,同樣少於記憶胞區塊MBK的字元線WL1~WLM的總數量。並且,邊界區塊BK1的字元線AWL1~AWLK的數量與邊界區塊BK2的字元線BWL1~BWLL的數量可以相同或不相同。Please note that in this embodiment, the number of word lines AWL1 to AWLK of the boundary block BK1 is less than the total number of word lines WL1 to WLM of the memory cell block MBK. The number of word lines BWL1 to BWLL of the boundary block BK2 is also less than the total number of word lines WL1 to WLM of the memory cell block MBK. Furthermore, the number of word lines AWL1 to AWLK of the boundary block BK1 and the number of word lines BWL1 to BWLL of the boundary block BK2 may be the same or different.
請注意,在本實施例中,邊界區塊BK1耦接多條字元線AWL1~AWLK中,接收被致能的字元線信號的數量,可以根據對應的感測放大器(SA)111~11N的第一輸入端上的負載來決定。在本實施例中,邊界區塊BK1中具有多個成陣列排列的負載元件LC1。其中的每一負載元件LC1耦接至對應的各字元線AWL1~AWLK以及對應的各位元線BL21~BL2N。負載元件LC1可提供一電容性負載,並在當對應的字元線接收被致能的字元線信號時,提供電容性負載至對應的位元線上。因此,在本實施例中,透過控制接收被致能的字元線信號的字元線AWL1~AWLK的數量,可以達到調整每一位元線BL21~BL2N上的負載的目的。Please note that in this embodiment, the number of word line signals received by the boundary block BK1 from among the multiple word lines AWL1~AWLK coupled to the boundary block BK1 can be determined according to the load on the first input terminal of the corresponding sense amplifier (SA) 111~11N. In this embodiment, the boundary block BK1 has a plurality of load elements LC1 arranged in an array. Each of the load elements LC1 is coupled to the corresponding word lines AWL1~AWLK and the corresponding bit lines BL21~BL2N. The load element LC1 can provide a capacitive load and provide a capacitive load to the corresponding bit line when the corresponding word line receives the enabled word line signal. Therefore, in this embodiment, the load on each bit line BL21 to BL2N can be adjusted by controlling the number of word lines AWL1 to AWLK receiving the enabled word line signal.
類似地,在本實施例中,邊界區塊BK2耦接多條字元線BWL1~BWLL中,接收被致能的字元線信號的數量,可以根據對應的感測放大器(SA)121~12N的第一輸入端上的負載來決定。在本實施例中,邊界區塊BK2中具有多個成陣列排列的負載元件LC2。其中的每一負載元件LC2耦接至對應的各字元線BWL1~BWLL以及對應的各位元線BL41~BL4N。負載元件LC2可提供一電容性負載,並在當對應的字元線接收被致能的字元線信號時,提供電容性負載至對應的位元線上。因此,在本實施例中,透過控制接收被致能的字元線信號的字元線BWL1~BWLL的數量,可以達到調整每一位元線BL41~BL4N上的負載的目的。Similarly, in the present embodiment, the number of word line signals received by the boundary block BK2 from among the multiple word lines BWL1-BWLL that are coupled can be determined according to the load on the first input terminal of the corresponding sense amplifier (SA) 121-12N. In the present embodiment, the boundary block BK2 has a plurality of load elements LC2 arranged in an array. Each of the load elements LC2 is coupled to the corresponding word lines BWL1-BWLL and the corresponding bit lines BL41-BL4N. The load element LC2 can provide a capacitive load, and when the corresponding word line receives the enabled word line signal, the capacitive load is provided to the corresponding bit line. Therefore, in this embodiment, the load on each bit line BL41 to BL4N can be adjusted by controlling the number of word lines BWL1 to BWLL that receive the enabled word line signal.
在此,透過調整字元線AWL1~AWLK以及BWL1~BWLL中接收被致能的字元線信號的數量,可以使感測放大器(SA)111~11N以及感測放大器(SA)121~12N的每一者的兩輸入端上的負載的平衡度,以維持感測放大器(SA)111~11N以及感測放大器(SA)121~12N的感測動作的準確度。值得一提的,本發明實施例可透過調整字元線AWL1~AWLN以及BWL1~BWLL中接收被致能的字元線信號的數量,來使感測放大器(SA)111~11N以及感測放大器(SA)121~12N的每一者的兩輸入端間的負載的差值小於一預設臨界值(或使兩輸入端間的負載相等),以維持其負載平衡度。Here, by adjusting the number of word line signals enabled by word lines AWL1-AWLK and BWL1-BWLL, the load on the two input terminals of each of the sense amplifiers (SA) 111-11N and the sense amplifiers (SA) 121-12N can be balanced to maintain the accuracy of the sensing action of the sense amplifiers (SA) 111-11N and the sense amplifiers (SA) 121-12N. It is worth mentioning that the embodiment of the present invention can adjust the number of word line signals received and enabled in word lines AWL1-AWLN and BWL1-BWLL so as to make the difference in load between the two input terminals of each of the sense amplifiers (SA) 111-11N and the sense amplifiers (SA) 121-12N less than a preset critical value (or make the load between the two input terminals equal) to maintain the load balance.
附帶一提的,負載元件LC1、LC可以為一記憶胞、電容或其他可以提供電容性負載的電子元件,沒有特定的限制。此外,未接收被致能的字元線信號的字元線AWL1~AWLN以及BWL1~BWLL,可接收被禁能的字元線信號。Incidentally, the load elements LC1, LC can be a memory cell, a capacitor or other electronic elements that can provide capacitive loads, without specific limitations. In addition, the word lines AWL1~AWLN and BWL1~BWLL that do not receive the enabled word line signal can receive the disabled word line signal.
此外,記憶胞區塊MBK包括多個記憶胞MC。每一記憶胞MC耦接至對應的各位元線BL11~BL1N、BL31~BL3N,以及對應的各字元線WL1~WLM。在本實施例中,記憶胞MC可以為動態隨機存取記憶胞或其他類型的記憶胞,記憶體裝置100可以為一開放式位元(open bit-line)架構的動態隨機存取記憶裝置。In addition, the memory cell block MBK includes a plurality of memory cells MC. Each memory cell MC is coupled to corresponding bit lines BL11-BL1N, BL31-BL3N, and corresponding word lines WL1-WLM. In this embodiment, the memory cell MC may be a dynamic random access memory cell or other types of memory cells, and the memory device 100 may be a dynamic random access memory device with an open bit-line architecture.
本實施例的感測放大器(SA)111~11N以及感測放大器(SA)121~12N可以應用任意本領域具通常知識者所熟知的感測放大電路來實施,沒有一定的限制。The sense amplifiers (SA) 111 - 11N and the sense amplifiers (SA) 121 - 12N of this embodiment can be implemented by using any sense amplifier circuit known to those skilled in the art without any particular limitation.
基於本實施例所設置的邊界區塊BK1、BK2中,僅具有少數量的字元線,因此,邊界區塊BK1、BK2的每一者所需的佈局面積可以小於一個完整的記憶胞區塊MBK的佈局面積。也因此,在維持感測放大器(SA)111~11N以及感測放大器(SA)121~12N的負載平衡的前提下,本實施例的記憶體裝置100所需的電路佈局面積可以有效的被減小,降低電路所需的成本。Since the boundary blocks BK1 and BK2 provided in the present embodiment have only a small number of word lines, the layout area required for each of the boundary blocks BK1 and BK2 can be smaller than the layout area of a complete memory cell block MBK. Therefore, under the premise of maintaining the load balance of the sense amplifiers (SA) 111-11N and the sense amplifiers (SA) 121-12N, the circuit layout area required for the memory device 100 of the present embodiment can be effectively reduced, thereby reducing the cost required for the circuit.
接著請參照圖2,圖2繪示本發明另一實施例的記憶體裝置的示意圖。記憶體裝置200包括記憶胞區塊MBK、邊界區塊BK1、BK2、感測放大器(SA)211~214以及221~224以及控制器240。本實施例中,記憶胞區塊MBK、邊界區塊BK1、BK2以及感測放大器(SA)211~214以及221~224間的耦接關係與前述的實施例相同,在此不多贅述。與前述實施例不相同的,記憶體裝置200中設置控制器240。其中控制器240耦接邊界區塊BK1、BK2。控制器240用以產生控制信號CT1、CT2,並提供控制信號CT1、CT2分別至邊界區塊BK1、BK2,以控制邊界區塊BK1、BK2上的字元線AWL1~AWLK以及BWL1~BWLL中接收被致能的字元線信號的數量。Next, please refer to FIG. 2, which shows a schematic diagram of a memory device of another embodiment of the present invention. The
在細節上,字元線AWL1~AWLK可耦接至開關電路231,字元線BWL1~BWLL則可耦接至開關電路232。開關電路231以及232並分別接收控制信號CT1以及CT2。開關電路231可根據控制信號CT1以使字元線AWL1~AWLK的第一部分接收致能電壓EWN,並使字元線AWL1~AWLK的第二部分接收禁能電壓DISW。並藉此調整感測放大器(SA)211~214的一輸入端上的負載。開關電路232則可根據控制信號CT2以使字元線BWL1~BWLL的第一部分接收致能電壓EWN,並使字元線BWL1~BWLL的第二部分接收禁能電壓DISW。並藉此調整感測放大器(SA)221~224的一輸入端上的負載。In detail, word lines AWL1-AWLK can be coupled to a
在本實施例中,控制器240可不需針對感測放大器(SA)211~214以及221~224的輸入端上的負載執行實際的偵測動作,而是根據感測放大器(SA)211~214以及221~224的感測動作的反應速率來調整對應耦接的字元線AWL1~AWLK以及BWL1~BWLL接收中被致能的字元線數量。In this embodiment, the
在另一實施例中,控制器240也可針對感測放大器(SA)211~214耦接至記憶胞陣列MBK的輸入端上的負載進行偵測,並根據偵測的結果來產生控制信號CT1。控制器240另可針對感測放大器(SA)221~224耦接至記憶胞陣列MBK的輸入端上的負載進行偵測,並根據偵測的結果來產生控制信號CT2。關於負載的偵測動作,控制器240可針對所要偵測的端點施加一電流(或電壓),並透過量測所述端點上的電壓(或電流)來計算出負載。In another embodiment, the
開關電路231中包括多個開關,每一開關用以根據控制信號CT1的一位元來選擇使對應的字元線(字元線AWL1~AWLK的其中之一)接收致能電壓EWN或禁能電壓DISW。其中致能電壓EWN等於被致能的字元線信號,禁能電壓DISW則等於被禁能的字元線信號。在本發明實施例中,致能電壓EWN大於禁能電壓DISW。開關電路232可具有與開關電路231相同的電路架構及動作,在此不多贅述。The
值得一提的,控制器240可以為內嵌在記憶體裝置200中的電路(例如數位電路),並在記憶體裝置200動作過程中,即時地產生控制信號CT1、CT2,並進行感測放大器(SA)211~224的輸入端的負載平衡動作。在其他實施例中,控制器240也可以為記憶體裝置200外部的電路(例如外部的測試電路)。在這樣的情況下,控制器240可提供控制信號CT1、CT2以使字元線AWL1~AWLK、BWL1~BWLL中固定數量的字元線被綁定(tie)以接收致能電壓EWN。It is worth mentioning that the
請參照圖3,圖3繪示本發明另一實施例的記憶體裝置的示意圖。記憶體裝置300包括記憶胞區塊MBK1、MBK2、邊界區塊BK1、BK2以及感測放大器(SA)311~334。與前述實施例不相同的,本實施例的記憶體裝置300中具有多個記憶胞區塊MBK1、MBK2。記憶胞區塊MBK1、MBK2依序耦接在邊界區塊BK1以及邊界區塊BK2間。記憶胞區塊MBK1以及MBK2分別耦接字元線WL11~WL1M以及字元線WL21~WL2M。其中字元線WL11~WL1M的總數量以及字元線WL21~WL2M的總數量可以是相等的。且邊界區塊BK1耦接的字元線AWL1~AWLM的數量以及邊界區塊BK2耦接的字元線BWL1~BWLL的數量均小於字元線WL11~WL1M的總數量以及字元線WL21~WL2M的總數量。以記憶胞區塊MBK1以及MBK2的每一者具有4百萬位元組的記憶容量為範例,記憶體裝置300可具有8百萬位元組的記憶容量。Please refer to FIG. 3, which is a schematic diagram of a memory device of another embodiment of the present invention. The
在一示例中,記憶胞區塊MBK1以及MBK2的每一者可耦接至512條字元線,邊界區塊BK1、BK2可僅耦接至數條或數十條字元線。亦即,邊界區塊BK1、BK2的每一者的佈局面積,遠小於記憶胞區塊MBK1以及MBK2的每一者的佈局面積。In one example, each of the memory cell blocks MBK1 and MBK2 can be coupled to 512 word lines, and the boundary blocks BK1 and BK2 can be coupled to only a few or dozens of word lines. That is, the layout area of each of the boundary blocks BK1 and BK2 is much smaller than the layout area of each of the memory cell blocks MBK1 and MBK2.
此外,在其他示例中,邊界區塊BK1、BK2間可設置三個或三個以上的記憶胞區塊。其中記憶胞區塊的數量並沒有一定的限制。In addition, in other examples, three or more memory cell blocks may be disposed between the boundary blocks BK1 and BK2, wherein the number of memory cell blocks is not limited.
綜上所述,本發明的記憶體裝置透過在記憶體裝置中設置邊界區塊,透過邊界區塊以提供負載至相鄰的感測放大器的輸入端。更進一步的,本發明的記憶體裝置透過調整邊界區塊上的位元線的被致能的數量,以調整對應提供的負載,來使感測放大器的二輸入端間的負載可以平衡,提升感測放大器的反應速率。In summary, the memory device of the present invention provides a load to the input terminal of the adjacent sense amplifier by setting a boundary block in the memory device. Furthermore, the memory device of the present invention adjusts the number of enabled bit lines on the boundary block to adjust the corresponding provided load, so that the load between the two input terminals of the sense amplifier can be balanced, thereby improving the response rate of the sense amplifier.
100、200、300:記憶體裝置
111~11N、121~12N、211~214、221~224、311~314、321~324、331~334:感測放大器(SA)
240:控制器
AWL1~AWLK、BWL1~BWLL、WL1~WLM:字元線
BK1、BK2:邊界區塊
BL11~BL1N、BL21~BL2N、BL31~BL3N、BL41~BL4N:位元線
CT1、CT2:控制信號
DIS:禁能電壓
EWN:致能電壓
LC1、LC2:負載元件
MBK、MBK1、MBK2:記憶胞區塊
MC:記憶胞
100, 200, 300:
圖1繪示本發明一實施例的記憶體裝置的示意圖。 圖2繪示本發明另一實施例的記憶體裝置的示意圖。 圖3繪示本發明另一實施例的記憶體裝置的示意圖。 FIG. 1 is a schematic diagram of a memory device according to an embodiment of the present invention. FIG. 2 is a schematic diagram of a memory device according to another embodiment of the present invention. FIG. 3 is a schematic diagram of a memory device according to another embodiment of the present invention.
100:記憶體裝置
111~11N、121~12N:感測放大器(SA)
AWL1~AWLK、BWL1~BWLL、WL1~WLM:字元線
BK1、BK2:邊界區塊
BL11~BL1N、BL21~BL2N、BL31~BL3N、BL41~BL4N:位元線
LC1、LC2:負載元件
MBK:記憶胞區塊
MC:記憶胞
100:
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US20150364178A1 (en) * | 2014-06-16 | 2015-12-17 | Chan-kyung Kim | Memory cores of resistive type memory devices, resistive type memory devices and method of sensing data in the same |
US9978435B1 (en) * | 2017-01-25 | 2018-05-22 | Winbond Electronics Corporation | Memory device and operation methods thereof |
TW202213714A (en) * | 2020-09-27 | 2022-04-01 | 大陸商長江存儲科技有限責任公司 | On-chip capacitor in three-dimensional semiconductor device and methods of forming the same |
US20220139447A1 (en) * | 2020-09-22 | 2022-05-05 | Changxin Memory Technologies, Inc. | Integrated circuit |
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US20150364178A1 (en) * | 2014-06-16 | 2015-12-17 | Chan-kyung Kim | Memory cores of resistive type memory devices, resistive type memory devices and method of sensing data in the same |
US9978435B1 (en) * | 2017-01-25 | 2018-05-22 | Winbond Electronics Corporation | Memory device and operation methods thereof |
US20220139447A1 (en) * | 2020-09-22 | 2022-05-05 | Changxin Memory Technologies, Inc. | Integrated circuit |
TW202213714A (en) * | 2020-09-27 | 2022-04-01 | 大陸商長江存儲科技有限責任公司 | On-chip capacitor in three-dimensional semiconductor device and methods of forming the same |
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