TWI843160B - Methods for fabricating an oxygen-free hard copper rod and diode element - Google Patents

Abstract

The present invention disclosed a method for fabricating an oxygen-free hard copper rod and a diode element. Firstly, an electrolytic copper object is placed in an electromagnetic induction furnace to melt the electrolytic copper object into a copper liquid, and the deoxidizer is placed on the copper liquid to isolate the copper liquid from oxygen. Next, a graphite forming tube is placed in the copper liquid, and upward continuous casting is performed to form an oxygen-free copper rod on the graphite forming tube. Next, the oxygen-free copper rod is fed into a cold forging machine to produce a microcrystalline copper rod. The microcrystalline copper rod is fed into a giant pulling machine to produce an oxygen-free hard copper rod to improve conductivity and surface brightness. When a diode element is formed, the oxygen-free hard copper rods are connected to a diode structure to form the diode element, and the oxygen-free hard copper rods are used as the conductive terminal of the diode element.

Description

Manufacturing method of oxygen-free hard copper bars and diode components

The present invention relates to a method for manufacturing a component, and in particular to a method for manufacturing an oxygen-free hard copper bar and a diode component.

Copper acts as an electrical conductor in electrical wires. Copper wire is used in power generation, transmission, distribution, telecommunications furnaces, electronic circuits, and countless types of electrical equipment. Wiring in buildings is the most important market for the copper industry. About half of all copper ever mined is used to make wire.

The conventional method of making copper wire involves the following steps. Electrolytic copper (either electrorefined, electro won, or both) is melted, cast into rod form, and hot rolled into bar form. The bar is then cold worked in a drawing die to systematically reduce its dimensions while elongating the wire. In a typical operation, the copper bar manufacturer casts the molten electrolytic copper into a bar whose cross-section is substantially trapezoidal with rounded edges and a cross-section of approximately 7 square inches; the bar then passes through a preparation stage to trim its corners and then passes through a 12-roller station to emerge as a copper bar of 0.3125 mm diameter. The copper strip is then reduced to the desired wire size through a standard round drawing die. Typically, these reduction steps are performed in a series of machines, plus a final annealing step and, in some cases, an intermediate annealing step to soften the processed copper wire. Traditional copper wire manufacturing methods not only consume considerable energy and require a lot of labor and investment costs, but also fail to produce copper wire that is bright and meets customer requirements.

Therefore, the present invention aims at the above-mentioned troubles and proposes a method for manufacturing oxygen-free hard copper bars and diode components to solve the problems arising from the prior art.

The present invention provides a method for manufacturing oxygen-free hard copper bars and diode components, which improves conductivity and surface brightness.

In one embodiment of the present invention, a method for manufacturing an oxygen-free hard copper bar comprises the following steps: placing an electrolytic copper material in an electromagnetic induction furnace to melt the electrolytic copper material into a copper liquid, and placing a deoxidizer on the copper liquid to isolate the copper liquid from oxygen; placing a graphite forming tube in the copper liquid, and performing upward continuous casting to form an oxygen-free copper rod on the graphite forming tube; determining whether the cross-sectional diameter of the oxygen-free copper rod is substantially 20 mm: if so, proceeding to the next step; and if not, using the oxygen-free copper rod as the electrolytic copper material and returning to the step of placing the electrolytic copper material in the electromagnetic induction furnace; placing the oxygen-free copper rod in the copper liquid. The copper rod is fed into a cold forging machine to produce a microcrystalline copper rod; it is determined whether the cross-sectional diameter of the microcrystalline copper rod is substantially 14-16 mm: if so, proceed to the next step; and if not, the microcrystalline copper rod is used as an electrolytic copper object and returns to the step of placing the electrolytic copper object in an electromagnetic induction furnace; the microcrystalline copper rod is fed into a giant drawing machine to produce an oxygen-free hard copper bar; and it is determined whether the cross-sectional diameter of the oxygen-free hard copper bar is substantially 8-12 mm: if so, end; and if not, the oxygen-free hard copper bar is used as an electrolytic copper object and returns to the step of placing the electrolytic copper object in an electromagnetic induction furnace.

In one embodiment of the present invention, a method for manufacturing a diode element comprises the following steps: placing electrolytic copper in an electromagnetic induction furnace to melt the electrolytic copper into copper liquid, placing a deoxidizer on the copper liquid to isolate the copper liquid from oxygen; placing a graphite forming tube in the copper liquid and performing upward continuous casting to form a graphite forming tube. forming an oxygen-free copper rod on the surface; determining whether the cross-sectional diameter of the oxygen-free copper rod is substantially 20 mm: if so, proceeding to the next step; and if not, treating the oxygen-free copper rod as an electrolytic copper object and returning to the step of placing the electrolytic copper object in an electromagnetic induction furnace; feeding the oxygen-free copper rod into a cold forging forming machine to produce a microcrystalline copper rod; determining whether the microcrystalline copper Whether the cross-sectional diameter of the rod is substantially 14-16 mm: if so, proceed to the next step; and if not, use the microcrystalline copper rod as an electrolytic copper object and return to the step of placing the electrolytic copper object in an electromagnetic induction furnace; send the microcrystalline copper rod into a giant drawing machine to produce an oxygen-free hard copper bar; determine whether the cross-sectional diameter of the oxygen-free hard copper bar is substantially 8-12 mm: if so, proceed to the next step; and if not, use the oxygen-free hard copper bar as an electrolytic copper object and return to the step of placing the electrolytic copper object in an electromagnetic induction furnace; and connect the oxygen-free hard copper bar to a diode structure to form a diode element, and use the oxygen-free hard copper bar as a conductive terminal of the diode element.

In one embodiment of the present invention, the electrolytic copper material is an electrolytic copper plate.

In one embodiment of the present invention, the deoxidizer includes graphite and charcoal.

In one embodiment of the present invention, the electromagnetic induction furnace is substantially operated at 1150±10 degrees Celsius.

In one embodiment of the present invention, the cold forging machine is substantially operated at 460-530 degrees Celsius.

Based on the above, the manufacturing method of oxygen-free hard copper bars and diode components uses a cold forging machine to change the copper crystal of the oxygen-free copper rod to improve the conductivity and surface brightness.

In order to enable the Honorable Review Committee to have a deeper understanding and knowledge of the structural features and effects achieved by the present invention, we would like to provide a better embodiment diagram and a detailed description as follows:

10: Electrolytic copper

12: Electromagnetic induction furnace

14: Copper liquid

16: Deoxidizer

17: Heat source

18: High heat protection cover

20: Graphite forming tube

S10, S12, S14, S16, S18, S20, S22, S24, S26: Steps

x, y, z: voltage

Figure 1 is a flow chart of a method for producing oxygen-free hard copper bars according to one embodiment of the present invention.

Figure 2 is a schematic diagram of an electromagnetic induction furnace according to one embodiment of the present invention.

Figure 3 is a flow chart of a method for manufacturing a diode element according to one embodiment of the present invention.

The embodiments of the present invention will be further explained below with the help of the relevant drawings. As far as possible, the same reference numerals in the drawings and the specification represent the same or similar components. In the drawings, the shapes and thicknesses may be exaggerated for the sake of simplicity and convenience. It is understood that the components not specifically shown in the drawings or described in the specification are in the form known to the ordinary skilled person in the relevant technical field. The ordinary skilled person in this field can make various changes and modifications based on the content of the present invention.

The following is a method for making oxygen-free hard copper bars, which uses a cold forging machine to change the copper crystals of the oxygen-free copper bars to improve the conductivity and surface brightness.

FIG. 1 is a flow chart of a method for producing oxygen-free hard copper bars according to an embodiment of the present invention, and FIG. 2 is a schematic diagram of an electromagnetic induction furnace according to an embodiment of the present invention. Please refer to FIG. 1 and FIG. 2 for the following description of the method for producing oxygen-free hard copper bars. First, as shown in step S10, an electrolytic copper material 10 is placed in an electromagnetic induction furnace 12 to melt the electrolytic copper material 10 into a copper liquid 14, and a deoxidizer 16 is placed on the copper liquid 14 to isolate the copper liquid 14 from oxygen. In certain embodiments of the present invention, the electrolytic copper material may be an electrolytic copper plate of LME A grade with a purity of 99.95%. The deoxidizer 16 may include, but is not limited to, graphite and charcoal. In order to effectively melt the electrolytic copper material 10 into copper liquid 14, the electromagnetic induction furnace 12 can actually be operated at 1150±10 degrees Celsius. The electromagnetic induction furnace 12 is composed of a coil as a heat source 17, a high-temperature protective sleeve 18, an iron core and a melt channel, and receives a three-phase voltage x, y, z, which can be 90~420 volts. The graphite forming tube 20 is sleeved in the high-temperature protective sleeve 18. The low-voltage side of the electromagnetic induction furnace 12 is composed of a short-circuited melt channel. After power is turned on, under the action of electromagnetic induction, a large current is generated inside the melt channel to melt the electrolytic copper plate into copper liquid 14.

When electrolytic copper material 10 is to be produced, a thick plate can be made in advance as an anode, pure copper can be made into a thin sheet as a cathode, and a mixture of sulfuric acid and copper sulfate can be used as an electrolyte. After power is applied, copper dissolves from the anode into copper ions and moves to the cathode. After reaching the cathode, it obtains electrons and precipitates pure copper at the cathode. This is called electrolytic copper. Impurities in crude copper, such as iron and zinc that are more active than copper, will dissolve into ions along with copper. Since these ions are less likely to precipitate than copper ions, these ions can be prevented from precipitating on the cathode by properly adjusting the potential difference during electrolysis. Impurities that are less active than copper, such as gold and silver, settle at the bottom of the electrolytic cell. The copper plates produced in this way, called electrolytic copper, are of extremely high purity.

Next, as shown in step S12, the graphite forming tube 20 is placed in the copper liquid 14, and the upward continuous casting is performed to form an oxygen-free copper rod on the graphite forming tube 20. As shown in step S14, it is determined whether the cross-sectional diameter of the oxygen-free copper rod is substantially 20 mm. If so, step S16 is performed. If not, the oxygen-free copper rod is used as an electrolytic copper material and the process returns to step S10. As shown in step S16, the oxygen-free copper rod is sent to a cold forging forming machine to produce a microcrystalline copper rod. The cold forging machine can be operated at 460-530 degrees Celsius to impact the oxygen-free copper rod with ions to change its copper crystals and improve the conductivity and surface brightness, while making the microcrystalline copper rod soft. Next, as shown in step S18, it is determined whether the cross-sectional diameter of the microcrystalline copper rod is substantially 14-16 mm. If so, step S20 is performed. If not, the microcrystalline copper rod is used as an electrolytic copper object and returns to step S10. As shown in step S20, the microcrystalline copper rod is fed into a giant drawing machine to produce an oxygen-free hard copper bar. Finally, as shown in step S22, it is determined whether the cross-sectional diameter of the oxygen-free hard copper strip is actually 8-12 mm. If so, as shown in step S24, the entire process is terminated. If not, the oxygen-free hard copper strip is used as electrolytic copper and returns to step S10. Since the above method uses high-purity raw copper greater than or equal to 99.998%, the conductivity of the hard copper strip with a cross-sectional diameter greater than 6 mm can be increased to more than 101%, and the cross-sectional diameter tolerance of the hard copper strip is less than ±0.02 mm. The composition of the oxygen-free hard copper strip can be shown in Table 1, which includes the first sample and the second sample.

FIG. 3 is a flow chart of a method for manufacturing a diode element according to an embodiment of the present invention. Please refer to FIG. 3 for the following method for manufacturing a diode element. FIG. 3 replaces step S24 of FIG. 1 with step S26. The remaining steps of FIG. 3 are the same as the remaining steps of FIG. 1 and are not described in detail here. In step S26, an oxygen-free hard copper bar is connected to the diode structure to form a diode element, and the oxygen-free hard copper bar is used as a conductive terminal of the diode element.

According to the above-mentioned embodiment, the method for manufacturing oxygen-free hard copper bars and diode components utilizes a cold forging machine to change the copper crystals of the oxygen-free copper bars to improve the conductivity and surface brightness.

The above is only a preferred embodiment of the present invention and is not intended to limit the scope of implementation of the present invention. Therefore, all equivalent changes and modifications based on the shape, structure, features and spirit described in the patent application scope of the present invention should be included in the patent application scope of the present invention.

S10, S12, S14, S16, S18, S20, S22, S24: Steps

Claims (8)

A method for manufacturing oxygen-free hard copper bars comprises the following steps: placing an electrolytic copper material in an electromagnetic induction furnace to melt the electrolytic copper material into copper liquid, placing a deoxidizer on the copper liquid to isolate the copper liquid from oxygen; placing a graphite forming tube in the copper liquid and performing upward continuous casting to form an oxygen-free hard copper bar on the graphite forming tube. copper rod; determining whether the cross-sectional diameter of the oxygen-free copper rod is substantially 20 mm: if so, proceeding to the next step; and if not, using the oxygen-free copper rod as the electrolytic copper object and returning to the step of placing the electrolytic copper object in the electromagnetic induction furnace; feeding the oxygen-free copper rod into a cold forging forming machine to produce a microcrystalline copper rod, wherein the cold forging forming The molding machine is substantially operated at 460-530 degrees Celsius to impact the oxygen-free copper rod with ions to change its copper crystals; determine whether the cross-sectional diameter of the microcrystalline copper rod is substantially 14-16 mm: if so, proceed to the next step; and if not, use the microcrystalline copper rod as the electrolytic copper object and place the electrolytic copper object back to the electromagnetic induction The process comprises the following steps: feeding the microcrystalline copper rod into a giant drawing machine to produce an oxygen-free hard copper bar; and determining whether the cross-sectional diameter of the oxygen-free hard copper bar is substantially 8-12 mm: if so, ending; and if not, using the oxygen-free hard copper bar as the electrolytic copper object and returning to the step of placing the electrolytic copper object in the electromagnetic induction furnace. The method for producing oxygen-free hard copper bars as described in claim 1, wherein the electrolytic copper material is an electrolytic copper plate. A method for producing oxygen-free hard copper bars as described in claim 1, wherein the deoxidizer comprises graphite and charcoal. A method for producing oxygen-free hard copper bars as described in claim 1, wherein the electromagnetic induction furnace is substantially operated at 1150±10 degrees Celsius. A method for manufacturing a diode element comprises the following steps: placing an electrolytic copper material in an electromagnetic induction furnace to melt the electrolytic copper material into a copper liquid, placing a deoxidizer on the copper liquid to isolate the copper liquid from oxygen; placing a graphite forming tube in the copper liquid and performing upward continuous casting to form an oxygen-free copper rod on the graphite forming tube; determining the cross-sectional diameter of the oxygen-free copper rod; and determining whether the cross-sectional diameter of the oxygen-free copper rod is greater than the cross-sectional diameter of the oxygen-free copper rod. Whether the diameter is substantially 20 mm: if so, proceed to the next step; and if not, use the oxygen-free copper rod as the electrolytic copper object and return to the step of placing the electrolytic copper object in the electromagnetic induction furnace; send the oxygen-free copper rod into a cold forging forming machine to produce a microcrystalline copper rod, wherein the cold forging forming machine is substantially operated at 460-530 degrees Celsius to bombard the oxygen-free copper rod with ions. copper rod to change its copper crystal; determine whether the cross-sectional diameter of the microcrystalline copper rod is substantially 14-16 mm: if so, proceed to the next step; and if not, use the microcrystalline copper rod as the electrolytic copper object and return to the step of placing the electrolytic copper object in the electromagnetic induction furnace; send the microcrystalline copper rod into a giant drawing machine to produce an oxygen-free hard copper bar; determine the oxygen-free hard copper bar Is the cross-sectional diameter substantially 8-12 mm: If yes, proceed to the next step; and if no, use the oxygen-free hard copper strip as the electrolytic copper object and return to the step of placing the electrolytic copper object in the electromagnetic induction furnace; and connect the oxygen-free hard copper strip to the diode structure to form a diode element, and use the oxygen-free hard copper strip as the conductive terminal of the diode element. A method for manufacturing a diode element as described in claim 5, wherein the electrolytic copper material is an electrolytic copper plate. A method for manufacturing a diode element as described in claim 5, wherein the deoxidizer comprises graphite and charcoal. A method for manufacturing a diode element as described in claim 5, wherein the electromagnetic induction furnace is substantially operated at 1150±10 degrees Celsius.

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