TWI839997B - Wafer transfer apparatus and wafer transfer system - Google Patents

Abstract

A wafer transfer apparatus includes an exit load lock chamber, a receiving indexer, a sensor assembly, and a controller. The exit load lock chamber has an outer door. The receiving indexer is liftably located at a side of the exit load lock chamber having the exit load lock valve, and is configured to receive a wafer transferred from the exit load lock chamber. The side of the exit load lock chamber and the receiving indexer have a gap therebetween. The sensor assembly is located between the side of the exit load lock chamber and the receiving indexer. An orthogonal projection of the sensor assembly is located in the gap. The sensor assembly is configured to detect the wafer in the gap. The controller is electrically connected to the outer door and the sensor assembly. When the sensor assembly detects the wafer in the gap, the controller is configured to stop the movement of the outer door and the movement of the receiving indexer.

Description

Wafer transfer equipment and wafer transfer system

The present disclosure relates to a wafer transport device and a wafer transport system having the wafer transport device.

With the advancement of technology, electronic devices containing semiconductor components are becoming more common, so the production and transportation of wafers are becoming more and more important. In some semiconductor machines, the order of wafer transportation is: sending indexer, loading load lock chamber, process chamber, unloading load lock chamber and receiving indexer. Traditionally, wafer sensors are installed in the chamber or next to the robot arm to prevent wafer damage. However, since the position of the wafer falling between the unloading load lock chamber and the receiving indexer cannot be detected by the above configuration, the exit valve of the unloading load lock chamber and the receiving indexer will continue to operate, and the wafer will be broken due to the closing of the exit valve or the lifting of the receiving indexer, causing damage to the product and thus leading to economic losses.

One technical aspect of the present disclosure is a wafer transfer device.

According to some embodiments of the present disclosure, a wafer transport device includes a load-out chamber, a receiving indexer, a detection assembly and a controller. The load-out chamber has an exit valve. The receiving indexer is liftably located on a side of the load-out chamber having the exit valve, and is configured to receive wafers transferred from the load-out chamber. There is a distance between the side of the load-out chamber and the receiving indexer. The detection assembly is located between the side of the load-out chamber and the receiving indexer, and the vertical projection of the detection assembly is located within the distance, and is configured to detect wafers in the distance. The controller electrically connects the exit valve and the detection assembly, wherein when the detection assembly detects a wafer in the distance, the controller is configured to stop the movement of the exit valve and the receiving indexer.

In some embodiments, the detection component has a signal transmitter receiver and a signal reflector. The signal transmitter receiver is located above the signal reflector. The signal reflector is configured to reflect the signal from the signal transmitter receiver back to the signal transmitter receiver.

In some embodiments, when the receiving indexer of the wafer transport device receives a wafer transferred from a load-out chamber, and the wafer is located in the distance between the side of the load-out chamber and the receiving indexer, the signal transmitting receiver and the signal reflector are respectively located on the upper and lower sides of the wafer so that the signal is blocked by the wafer.

In some implementations, the signal transmitter receiver is vertically aligned with the signal reflector.

In some embodiments, the signal transmitting receiver is located above the top surface of the unloading chamber and the top surface of the receiving indexer.

In some embodiments, the signal reflector is located below the top surface of the unload chamber and the top surface of the receiving indexer.

In some implementations, the wafer transport device further includes an electromagnetic valve that electrically connects the outlet valve and the controller.

In some embodiments, the unloading chamber further includes an inlet valve opposite to the outlet valve.

Another technical aspect of the present disclosure is a wafer transport system.

According to some embodiments of the present disclosure, a wafer transport system includes a wafer transport equipment and an electronic device. The wafer transport equipment includes a load-out chamber, a receiving indexer, a detection assembly and a controller. The load-out chamber has an exit valve. The receiving indexer is liftably located on a side of the load-out chamber having the exit valve, and is configured to receive wafers transferred from the load-out chamber. There is a distance between the side of the load-out chamber and the receiving indexer. The detection assembly is located between the side of the load-out chamber and the receiving indexer, and the vertical projection of the detection assembly is located within the distance, and is configured to detect wafers in the distance. The controller electrically connects the exit valve and the detection assembly, wherein when the detection assembly detects a wafer in the distance, the controller is configured to stop the movement of the exit valve and the receiving indexer. The electronic device is electrically connected to a controller of the wafer transport apparatus and includes an alarm configured to sound an alarm when the controller stops the movement of the outlet valve and the receiving indexer.

In some embodiments, the wafer transport system further includes an electromagnetic valve that is electrically connected to an outlet valve of the unloading chamber, a controller, and an electronic device.

In the above-mentioned embodiment of the present disclosure, since the detection component of the wafer transport equipment is located between the side of the unloading chamber and the receiving indexer, and the vertical projection of the detection component is located within the distance, when the wafer falls between the unloading chamber and the receiving indexer during transport, it can be detected by the detection component. In addition, since the controller is electrically connected to the outlet valve and the detection component, the movement of the outlet valve and the receiving indexer can be stopped by the controller. With such a configuration, the wafer transport equipment can not only detect whether the wafer falls between the unloading chamber and the receiving indexer, but also avoid wafer breakage and related economic losses caused by the movement of the outlet valve and the receiving indexer through the controller.

The embodiments disclosed below provide many different embodiments, or examples, for implementing the different features of the subject matter provided. Specific examples of components and arrangements are described below to simplify the present invention. Of course, these examples are only examples and are not intended to be limiting. In addition, the present invention may repeat component symbols and/or letters in each example. This repetition is for the purpose of simplicity and clarity, and does not itself specify the relationship between the various embodiments and/or configurations discussed.

Spatially relative terms such as "below," "beneath," "lower," "above," "upper," and the like may be used herein for descriptive purposes to describe the relationship of one element or feature to another element or feature as illustrated in the accompanying figures. Spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the accompanying figures. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

FIG. 1 is a schematic side view of a wafer transport apparatus 100 according to an embodiment of the present disclosure, wherein a wafer 150 is located in a load-out chamber 110. FIG. 2 is a schematic side view of the wafer transport apparatus 100 of FIG. 1, wherein the wafer 150 is located in a receiving indexer 120. Referring to FIG. 1 and FIG. 2 together, the wafer transport apparatus 100 includes a load-out chamber 110, a receiving indexer 120, a detection assembly 130, and a controller 140. The load-out chamber 110 has an exit valve 112, and the exit valve 112 is configured to allow the wafer 150 to be unloaded from the load-out chamber 110. The receiving indexer 120 is located at a side of the load-out chamber 110 having the exit valve 112 in a liftable position. For example, the receiving indexer 120 can rise in the direction D1 or fall in the direction D2 outside the exit valve 112. The receiving indexer 120 is configured to receive the wafer 150 transferred from the unloading chamber 110. There is a distance D between the side of the unloading chamber 110 having the exit valve 112 and the receiving indexer 120. When the wafer 150 is transferred, the wafer 150 can be transferred from the unloading chamber 110 to the receiving indexer 120 through the distance D. After the wafer 150 is normally transferred to the receiving indexer 120, the receiving indexer 120 can rise in the direction D1 to wait for receiving the next wafer. The detection assembly 130 is located between the side of the unloading chamber 110 having the exit valve 112 and the receiving indexer 120, and the vertical projection of the detection assembly 130 is located within the distance D. The detection assembly 130 is configured to detect whether the wafer 150 exists in the spacing D.

In addition, the controller 140 is electrically connected to the outlet valve 112 and the detection assembly 130. The controller 140 can control the opening and closing of the outlet valve 112 and the signal detected by the receiving detection assembly 130. When the detection assembly 130 detects the presence of the wafer 150 in the spacing D (to be described in FIG. 3 ), the controller 140 is configured to stop the closing of the outlet valve 112 and the lifting and lowering of the receiving indexer 120. In some embodiments, the unloading chamber 110 can be a load interlock vacuum chamber, the receiving indexer 120 can be a wafer cassette, and the wafer 150 can be a silicon wafer or a silicon carbide wafer, but this is not intended to limit the present disclosure.

FIG. 3 is a side view schematic diagram of the wafer transporting apparatus 100 in FIG. 1 during the process of transporting the wafer 150 from the unloading chamber 110 to the receiving indexer 120. Since the detection assembly 130 of the wafer transporting apparatus 100 is located between the side of the unloading chamber 110 and the receiving indexer 120, and the vertical projection of the detection assembly 130 is located within the spacing D, when the wafer 150 falls between the unloading chamber 110 and the receiving indexer 120 during transport, it can be detected by the detection assembly 130. In addition, since the controller 140 is electrically connected to the outlet valve 112 and the detection assembly 130, the controller 140 can stop the outlet valve 112 from closing and the receiving indexer 120 from ascending and descending, so as to avoid the wafer 150 from being broken due to the outlet valve 112 closing or the receiving indexer 120 ascending and descending. In this way, the wafer transport device 100 can not only detect whether the wafer 150 has fallen between the unloading chamber 110 and the receiving indexer 120, but also prevent the outlet valve 112 and the receiving indexer 120 from being actuated to cause the wafer 150 to be broken and generate related economic losses through the controller 140.

In this embodiment, the detection component 130 of the wafer transmission device 100 has a signal transmitter and receiver 132 and a signal reflector 134. The signal transmitter and receiver 132 is located above the signal reflector 134. The signal transmitter and receiver 132 is configured to transmit a signal 136 and receive a signal 138 reflected from the signal reflector 134. The signals 136 and 138 can be optical signals, but are not limited thereto. The signal reflector 134 is configured to reflect the signal 136 from the signal transmitter and receiver 132 into a signal 138. During the transmission of the wafer 150, if the signal transmitter receiver 132 of the detection assembly 130 receives the signal 138 reflected from the signal reflector 134, it means that there is no wafer 150 in the spacing D, and the outlet valve 112 and the receiving indexer 120 will not be affected and continue to operate. On the contrary, if the signal transmitter receiver 132 of the detection assembly 130 does not receive the signal 138 or only receives a part of the signal 138, it means that there is a wafer 150 in the spacing D, and the controller 140 will stop closing the outlet valve 112 to avoid damage to the wafer 150 and economic loss caused by the closing of the outlet valve 112. In addition, the controller 140 may also stop the receiving indexer 120 from rising or falling (eg, rising in the direction D1 ) to prevent the wafer 150 from being broken when the receiving indexer 120 is raised or lowered when the wafer 150 has not completely entered the receiving indexer 120 .

In addition, the signal transmitter and receiver 132 and the signal reflector 134 of the detection assembly 130 are aligned in the vertical direction, so that the signal reflector 134 can reflect the signal 136 from the signal transmitter and receiver 132, and will not fail to reflect the signal 136 due to misalignment. In addition, the signal transmitter and receiver 132 is located above the top surface of the unloading chamber 110 and the top surface of the receiving indexer 120, so that when the receiving indexer 120 receives the wafer 150 transmitted from the unloading chamber 110 during the transmission of the wafer 150, it can be ensured that the wafer 150 will not be blocked by the signal transmitter and receiver 132 and cannot be transmitted. The signal reflector 134 is located below the top surface of the unloading chamber 110 and the top surface of the receiving indexer 120, and is located below the transmission path of the wafer 150, so that during the transmission process of the wafer 150, it can be ensured that the wafer 150 will not be blocked by the signal reflector 134 and cannot be transmitted.

In the present embodiment, the wafer transport device 100 may further include an electromagnetic valve 160. The electromagnetic valve 160 electrically connects the exit valve 112 of the unloading chamber 110 and the controller 140. The electromagnetic valve 160 is configured so that the controller 140 can stop the exit valve 112 from closing. During the wafer 150 transport process, the signal transmitter receiver 132 of the detection assembly 130 receives the signal 138 reflected from the signal reflector 134, indicating that there is no wafer 150 in the spacing D. The controller 140 will not cut off the signal of the electromagnetic valve 160, so that the exit valve 112 can be closed normally. On the contrary, if the signal transmitter and receiver 132 of the detection assembly 130 does not receive the signal 138 or only receives a part of the signal 138, it means that there is a wafer 150 in the spacing D, and the controller 140 will cut off the signal of the electromagnetic valve 160 to stop the exit valve 112 from closing, so as to avoid damage to the wafer 150 and economic loss caused by the closing of the exit valve 112. In addition, the unloading chamber 110 may also have an entrance valve 114. The entrance valve 114 is located on the side opposite to the exit valve 112 of the unloading chamber 110, and is configured so that the wafer 150 can enter the unloading chamber 110 from the process chamber through the entrance valve 114.

As shown in FIG. 2 , during the transmission of the wafer 150, after the receiving indexer 120 receives the wafer 150 transmitted from the unloading chamber 110, the wafer 150 is located in the receiving indexer 120. At this time, the vertical projection of the wafer 150 does not overlap with the spacing D. The signal transmitter receiver 132 of the detection assembly 130 will receive the signal 138 reflected from the signal reflector 134, indicating that there is no wafer 150 in the spacing D. The controller 140 will not cut off the signal of the solenoid valve 160, so that the exit valve 112 can be closed normally, and the receiving indexer 120 can rise in the direction D1 to wait for receiving the next wafer.

As shown in FIG. 3 , during the transmission of the wafer 150, when a portion of the wafer 150 is located in the distance D between the side of the unloading chamber 110 having the exit valve 112 and the receiving indexer 120 (that is, the wafer 150 falls within the distance D), since the signal transmitter and receiver 132 and the signal reflector 134 are located on the upper and lower sides of the wafer 150, the signal 136 is blocked by the wafer 150, and the signal reflector 134 cannot receive the signal 136 from the signal transmitter and receiver 132, so the detection component 130 cannot generate the signal 138. In this way, the signal transmitter receiver 132 cannot receive the signal 138, indicating that there is a wafer 150 in the spacing D, and the controller 140 cuts off the signal of the electromagnetic valve 160 to stop the exit valve 112 from closing, so as to avoid damage to the wafer 150 and economic losses caused by the closing of the exit valve 112. In addition, the controller 140 can also stop the lifting of the receiving indexer 120 to avoid the wafer 150 from being broken when the receiving indexer 120 is lifted before the wafer 150 completely enters the receiving indexer 120.

It should be understood that the connection relationship and function of the components described above will not be repeated, and it is better to explain them first. In the following description, a wafer transport system having the aforementioned wafer transport device 100 will be described.

FIG. 4 is a side schematic diagram of a wafer transport system 200 according to an embodiment of the present disclosure. FIG. 5 is a side schematic diagram of the wafer transport system 200 of FIG. 4 in the process of transferring a wafer 150 from a load-out chamber 110 to a receiving indexer 120. Referring to FIG. 4 and FIG. 5 simultaneously, the wafer transport system 200 includes the aforementioned wafer transport equipment 100 and an electronic device 210. The electronic device 210 is electrically connected to the controller 140 of the wafer transport equipment 100. The electronic device 210 includes an alarm 212. In some embodiments, the electronic device 210 is, for example, a machine-side computer or a factory-side computer, but this is not intended to limit the present disclosure. When the controller 140 stops the movement of the exit valve 112 and the receiving indexer 120 of the unloading chamber 110, the alarm 212 is configured to issue an alarm. During the transfer of the wafer 150, after the receiving indexer 120 receives the wafer 150 transferred from the unloading chamber 110, when the wafer 150 is located in the receiving indexer 120 and the vertical projection of the wafer 150 does not overlap with the spacing D, the signal transmitter receiver 132 of the detection assembly 130 will receive the signal 138 reflected from the signal reflector 134, indicating that there is no wafer 150 in the spacing D, the exit valve 112 and the receiving indexer 120 will not be affected and continue to operate, and the alarm 212 will not issue an alarm.

As shown in FIG. 5 , during the transfer of the wafer 150, when a portion of the wafer 150 is located in the distance D between the side of the unloading chamber 110 having the exit valve 112 and the receiving indexer 120 (that is, the wafer 150 falls within the distance D), since the signal transmitter and receiver 132 and the signal reflector 134 are located on the upper and lower sides of the wafer 150, the signal 136 is blocked by the wafer 150, and the signal reflector 134 cannot receive the signal 136 from the signal transmitter and receiver 132, and therefore cannot generate the signal 138. In this way, the signal transmitter receiver 132 does not receive the signal 138, which means that there is a wafer 150 in the spacing D. The controller 140 cuts off the signal of the electromagnetic valve 160, so that the outlet valve 112 stops closing, so as to avoid damage to the wafer 150 and economic losses caused by the closing of the outlet valve 112. The controller 140 can also stop the lifting of the receiving indexer 120 to avoid the wafer 150 from being broken when the receiving indexer 120 is lifted before the wafer 150 completely enters the receiving indexer 120. In addition, the controller 140 causes the alarm 212 of the electronic device 210 to issue an alarm to inform the user of the wafer transport system 200 of the information that the wafer 150 has fallen in the spacing D, so as to facilitate subsequent troubleshooting operations (such as cleaning, maintenance, repair, etc.).

The foregoing summarizes the features of several embodiments so that those skilled in the art can better understand the aspects of the present disclosure. Those skilled in the art should understand that they can easily use the present disclosure as a basis for designing or modifying other processes and structures to achieve the same purpose and/or achieve the same advantages as the embodiments described herein. Those skilled in the art should also recognize that such equivalent constructions do not depart from the spirit and scope of the present disclosure, and that they can make various changes, substitutions and modifications here without departing from the spirit and scope of the present disclosure.

100: Wafer transport equipment 110: Unload chamber 112: Exit valve 114: Entry valve 120: Receiver indexer 130: Detection assembly 132: Signal transmitter receiver 134: Signal reflector 136: Signal 138: Signal 140: Controller 150: Wafer 160: Solenoid valve 200: Wafer transport system 210: Electronic device 212: Alarm D: Distance D1, D2: Direction

The disclosure is best understood from the following embodiments when read in conjunction with the accompanying drawings. Note that various features are not drawn to scale, in accordance with standard practice in the industry. In fact, the dimensions of various features may be arbitrarily increased or decreased for clarity of discussion. FIG. 1 illustrates a schematic side view of a wafer transport apparatus according to an embodiment of the disclosure, wherein a wafer is located in a load-out chamber. FIG. 2 illustrates a schematic side view of the wafer transport apparatus of FIG. 1, wherein a wafer is located in a receiving indexer. FIG. 3 illustrates a schematic side view of the wafer transport apparatus of FIG. 1 during the process of transferring a wafer from a load-out chamber to a receiving indexer. FIG. 4 illustrates a schematic side view of a wafer transport system according to an embodiment of the disclosure. FIG. 5 is a schematic side view of the wafer transport system in FIG. 4 during the process of transferring the wafer from the unloading chamber to the receiving indexer.

100: Wafer transfer equipment

110: Load out of chamber

112:Exit valve

114:Entrance valve

120: receiving indexer

130: Detection component

132: Signal transmitter and receiver

134:Signal reflector

136:Signal

138:Signal

140: Controller

150: Wafer

160:Solenoid valve

D: Spacing

D1,D2: Direction

Claims (8)

A wafer transport device comprises: a load-out chamber having an outlet valve; a receiving indexer which is movably located on a side of the load-out chamber having the outlet valve and is configured to receive a wafer transported from the load-out chamber, wherein there is a distance between the side of the load-out chamber and the receiving indexer; a detection assembly which is located between the side of the load-out chamber and the receiving indexer, and the vertical projection of the detection assembly is located within the distance, and is configured to detect the wafer in the distance, wherein the detection assembly has a signal transmitter and receiver and a signal reflector, and the signal transmitter and receiver is located on the signal reflector. The signal reflector is configured to reflect a signal from the signal transmitting receiver back to the signal transmitting receiver. When the receiving indexer receives the wafer transmitted from the unloading chamber and the wafer is located in the gap between the side of the unloading chamber and the receiving indexer, the signal transmitting receiver and the signal reflector are respectively located on the upper and lower sides of the wafer so that the signal is blocked by the wafer; and a controller electrically connected to the outlet valve and the detection assembly, wherein when the detection assembly detects the wafer in the gap, the controller is configured to stop the movement of the outlet valve and the receiving indexer. The wafer transport device as described in claim 1, wherein the signal transmitter receiver and the signal reflector are aligned in the vertical direction. The wafer transport device as described in claim 1, wherein the signal transmitting receiver is located above the top surface of the unloading chamber and the top surface of the receiving indexer. The wafer transport device as described in claim 1, wherein the signal reflector is located below the top surface of the unloading chamber and the top surface of the receiving indexer. The wafer transport device as described in claim 1 further includes: an electromagnetic valve electrically connecting the outlet valve and the controller. The wafer transfer device as described in claim 1, wherein the unloading chamber further comprises: an entrance valve, opposite to the exit valve. A wafer transport system includes: a wafer transport device, including: a load-out chamber having an exit valve; a receiving indexer, which is movably located on a side of the load-out chamber having the exit valve and is configured to receive a wafer transferred from the load-out chamber, wherein there is a distance between the side of the load-out chamber and the receiving indexer; a detection assembly, which is located between the side of the load-out chamber and the receiving indexer, and the vertical projection of the detection assembly is located within the distance, and is configured to detect the wafer in the distance, wherein the detection assembly has a signal transmitter receiver and a signal reflector, the signal transmitter receiver is located above the signal reflector, and the signal reflector is configured to reflect a signal from the signal transmitter receiver back to the load-out chamber. A signal transmitter receiver, when the receiving indexer receives the wafer transmitted from the unloading chamber, and the wafer is located in the gap between the side of the unloading chamber and the receiving indexer, the signal transmitter receiver and the signal reflector are respectively located on the upper and lower sides of the wafer so that the signal is blocked by the wafer; and a controller electrically connected to the outlet valve and the detection assembly, wherein when the detection assembly detects the wafer in the gap, the controller is configured to stop the movement of the outlet valve and the receiving indexer; and an electronic device electrically connected to the controller of the wafer transport equipment, the electronic device including an alarm, when the controller stops the movement of the outlet valve and the receiving indexer, the alarm is configured to issue an alarm. The wafer transport system as described in claim 7 further includes: an electromagnetic valve electrically connected to the exit valve of the unloading chamber, the controller and the electronic device.

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