CN112540372A - Cylinder groove wafer detection system - Google Patents
Cylinder groove wafer detection system Download PDFInfo
- Publication number
- CN112540372A CN112540372A CN201910891341.5A CN201910891341A CN112540372A CN 112540372 A CN112540372 A CN 112540372A CN 201910891341 A CN201910891341 A CN 201910891341A CN 112540372 A CN112540372 A CN 112540372A
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- China
- Prior art keywords
- wafer
- cylinder
- signal
- cylinder groove
- sonar
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S15/00—Systems using the reflection or reradiation of acoustic waves, e.g. sonar systems
- G01S15/88—Sonar systems specially adapted for specific applications
- G01S15/89—Sonar systems specially adapted for specific applications for mapping or imaging
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S15/00—Systems using the reflection or reradiation of acoustic waves, e.g. sonar systems
- G01S15/02—Systems using the reflection or reradiation of acoustic waves, e.g. sonar systems using reflection of acoustic waves
- G01S15/04—Systems determining presence of a target
Abstract
The invention relates to a cylinder groove wafer detection system which comprises a sonar device, a controller and a cylinder groove, wherein the sonar device is arranged on the cylinder wall of the cylinder groove, and the sonar device is mutually connected with the controller. After the wafer moving device takes out the wafer in the cylinder groove, the sonar device detects whether the wafer fragment residue exists in the cylinder groove. And if the sonar device detects that broken wafers remain in the cylinder groove after the wafer moving device takes out the wafers in the cylinder groove, the wafer moving device is locked, and the wafer moving device stops continuously putting the subsequent wafers into the cylinder groove. The cylinder groove wafer detection system provided by the invention can detect the wafer fragment residues in the cylinder groove and automatically stop the wafer moving device under the condition that the wafer fragments exist in the cylinder groove so as to prevent the wafer fragments from colliding with the subsequently placed wafers to cause greater harm.
Description
Technical Field
The invention relates to the technical field of semiconductor manufacturing, in particular to a cylinder groove wafer detection system.
Background
Semiconductor manufacturing involves a variety of different processes, and in many process steps, wafers are transferred by mechanical means.
As shown in fig. 1, in the related art, during the sulfuric acid treatment of the wafer, it is necessary to transfer the wafer 8 from the transfer cylinder tank 1 to the chemical cylinder tank 2 by a robot arm, and in the subsequent process, it is necessary to transfer the wafer 8 from the chemical cylinder tank 2 to the cleaning cylinder tank 3 by a robot arm again.
In the chemical cylinder groove 2, the photoresist on the surface of the wafer 8 reacts with the chemical liquid (such as acid liquor) to generate gas, so that the wafer 8 floats in the cylinder groove and is easy to be dislocated with the wafer guide rail, and the wafer 8 is easy to be broken when the robot arm clamps the dislocated wafer. The fragments remain in the cylinder groove, when the next group of wafers 8 enter the cylinder groove, secondary wafer collision will occur, which causes the inclination and/or fragments of the wafers entering the cylinder groove later, and influences the manufacture and processing of the product.
Fig. 2 shows a prior art optical sensing device 7, wherein an optical sensor includes an emitter 5 and a receiver 6, which can detect whether there is still wafer fragments 4 remaining in the cylinder groove, and when the optical sensor detects the laser beam passing through the cylinder groove, it indicates that there is no wafer remaining in the cylinder groove. However, this prior art technique does not detect the wafer 8 or wafer fragment 4 remaining at the bottom of the cylinder groove and the remaining portion not in the path of the laser beam, and therefore these fragments will continue to damage the entire system equipment. And the light sensor has high requirements on the transparency of the cylinder groove and the liquid.
Therefore, there is a need for a device capable of more effectively detecting wafer fragments, which can be applied to opaque cylinder grooves, and can lock a mechanical arm when wafer residues occur in the cylinder grooves, so as to prevent the wafer residues from causing larger disasters.
Disclosure of Invention
In order to overcome the defects in the prior art, the invention aims to provide a cylinder groove wafer detection system which can realize wafer fragment detection at different positions in different cylinder grooves and is added with a function of stopping the continuous wafer placing process under the condition that wafer fragment residues exist in the cylinder grooves.
To achieve the above and other objects, the present invention provides a cylinder tank wafer inspection system, which includes a sonar device disposed on a cylinder wall of a cylinder tank, a controller, and the cylinder tank, the sonar device being communicatively coupled to the controller.
According to some embodiments of the invention, the controller comprises: an operating system; a display system; and a locking system interconnected with the operating system.
According to some embodiments of the invention, the sonar equipment includes a signal transmitting unit and a signal receiving unit, the signal transmitting unit transmits a transmitting signal to interact with an object within the coverage area of the transmitting signal and feeds back the receiving signal to the signal receiving unit, and the operating system is communicatively coupled with the signal receiving unit of the sonar equipment.
According to some embodiments of the present invention, the sonar device abnormal signal detection section is set by the operating system.
According to some embodiments of the present invention, the display system displays whether or not the sonar signal in the detection section is abnormal.
According to some embodiments of the invention, a locking system is coupled to the wafer movement device for terminating a wafer deposit operation of the wafer movement device.
According to some embodiments of the invention, the sonar device is removably disposed on the cylinder wall of the cylinder trough.
According to some embodiments of the invention, further comprising an alarm system, the alarm system being coupled to the operating system.
According to some embodiments of the present invention, the operating system is operable to set an alarm time threshold, and the operating system triggers the alarm system to issue an alarm signal when the lock-out time of the wafer movement device exceeds the alarm time threshold.
According to some embodiments of the present invention, when wafer residue occurs in the abnormal signal detection section, the signal device displays the sonar signal abnormality in the detection section; the controller activates a lock system and an alarm system, the lock system terminating the wafer put operation of the wafer moving device; the alarm system emits a beep alarm and/or a light alarm.
Compared with the prior art, the cylinder groove wafer detection system provided by the invention can effectively detect the wafer fragment residues, and the device can be applied to various cylinder grooves. In addition, the wafer moving device can be stopped when the wafer residue in the cylinder groove is detected, so that the subsequent wafers are prevented from entering and causing larger damage.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other embodiments can be obtained by using the drawings without creative efforts.
FIG. 1 is a schematic view of the transfer of some prior art wafers in different cylinder slots;
FIG. 2 is a schematic diagram of a prior art light sensing device;
FIG. 3 is a schematic diagram illustrating the effect of wafer fragments in a cylinder slot on a subsequent wafer in the prior art;
FIG. 4 is a schematic structural diagram of a cylinder groove wafer inspection system according to an embodiment of the present invention;
FIG. 5 is a flowchart illustrating the control of a wafer moving device in a wafer inspecting system according to an embodiment of the present invention;
FIG. 6 is a schematic diagram of the operation of a sonar device of a wafer inspection system for a cylinder tank when a wafer is normally placed in the cylinder tank according to an embodiment of the present invention;
fig. 7 is a schematic diagram of the operation of a sonar device of a cylinder tank wafer detecting system when there is a wafer fragment in the cylinder tank according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the following embodiments of the present invention are described in further detail with reference to the accompanying drawings.
It should be noted that all expressions using "first" and "second" in the embodiments of the present invention are used for distinguishing two entities with the same name but different names or different parameters, and it should be noted that "first" and "second" are merely for convenience of description and should not be construed as limitations of the embodiments of the present invention, and they are not described in any more detail in the following embodiments.
In view of the above, the embodiment of the invention provides a cylinder slot wafer inspection system 100. Fig. 1 shows a schematic diagram of the transfer of some wafers in different tanks in the prior art, as shown in fig. 1, there are many different processing modes in the semiconductor manufacturing process, for example, in an apparatus for wet chemical etching semiconductor wafers, a conveying tank 1, a chemical tank 2 and a cleaning tank 3 are generally provided, wherein the chemical tank 2 is often filled with other corrosive liquids such as acid solution, and in order to avoid the corrosion problem, a sonar device 9 of a tank wafer inspection system according to an embodiment of the present invention is installed on an outer tank wall 10 of the tank.
Fig. 2 is a schematic diagram showing the operation of the prior art photo-sensing detection device, and the cylinder tank 7 in fig. 2 and subsequent figures is any cylinder tank to be detected whether the wafer fragment 4 is contained or not, including the conveying cylinder tank 1, the chemical cylinder tank 2 and the cleaning cylinder tank 3, and the cylinder tank 7 includes, but is not limited to, the conveying cylinder tank 1, the chemical cylinder tank 2 and the cleaning cylinder tank 3. As can be seen from fig. 2, the wafer 8 in the cylinder groove 7 is detected by the optical sensor, which is actually a wafer on the connecting line of the optical transmitter 5 and the optical receiver 6, and the wafer fragment 4 in the cylinder groove is not detected by the optical sensor when the wafer fragment 4 is at the bottom of the cylinder groove or at other positions not on the connecting line of the optical transmitter 5 and the optical receiver 6. Fig. 3 is a schematic diagram illustrating an influence of a wafer fragment 4 in a cylinder slot 7 on a subsequently entered wafer 8 in the prior art, and it can be seen from fig. 3 that, when the wafer fragment 4 remains in the cylinder slot 7, after the subsequent wafer 8 enters, the wafer fragment 4 collides with the wafer 8 subsequently entering the cylinder slot, so that the wafer 8 is tilted and/or collided, which causes a greater hazard.
Therefore, the present invention provides a cylinder groove wafer inspection system 100, and fig. 4 is a schematic structural diagram of the cylinder groove wafer inspection system according to the embodiment of the present invention. In some embodiments, the cylinder slot wafer inspection system 100 includes: sonar device 9, a controller (not shown), and cylinder trough 7, sonar device 9 being disposed on an outer cylinder wall 10 of cylinder trough 7, sonar device 9 being interconnected with the controller.
Fig. 5 is a flowchart illustrating the control of the wafer moving device in the cylinder slot wafer inspection system 100 according to the embodiment of the present invention. The controller of cylinder groove wafer inspection system 100 is interconnected with a wafer moving device (not shown), which may be a communication link, which may be a wireless link or a wired link, for the purpose of detecting the presence of wafer fragment 4 or wafer 8 in cylinder groove 7 by sonar device 9 and controlling the wafer moving device to place wafer 8 into cylinder groove 7 according to the presence of wafer fragment 4 or wafer 8 in cylinder groove 7. As shown in fig. 5, the cylinder groove wafer inspection system 100 of the present invention detects whether a wafer or wafer fragment is present in the cylinder groove, and when the wafer or wafer fragment is present, the locking system stops further movement of the wafer moving device to avoid further wafer damage caused by subsequent operations. And when there is no wafer or wafer fragment, the wafer moving means continues to perform the wafer putting-in operation under the control of the controller.
Specifically, the controller further includes: an operating system (not shown), a display system (not shown), and a locking system (not shown) that is interconnected with the operating system.
The sonar device 9 is provided with a signal transmitting part (not shown) and a signal receiving part (not shown), wherein a transmitting signal 11 transmitted by the signal transmitting part interacts with an object in a transmitting signal coverage area and feeds a receiving signal 12 back to the signal receiving part, and an operating system is connected with the signal receiving part of the sonar device 9. According to some embodiments of the present invention, the received signal 12 received by the signal receiving section is processed and converted into image data, the operating system sets a sonar device 9 abnormal signal detection section based on the image data, and the display system displays an image of the detection section based on the image data of the detection section set by the operating system; according to other embodiments of the invention, the display system displays whether the sonar signals in the detection section are abnormal according to the change of the signal difference between the transmitting signal 11 and the receiving signal 12 of the sonar device, and when the signal difference between the transmitting signal 11 and the receiving signal 12 of the sonar device is abnormal, the display system displays 'abnormal'; when the signal difference between the transmitting signal 11 and the receiving signal 12 of the sonar device is not abnormally changed, the display system displays 'normal'. The locking system is also coupled to the wafer handling device, which may be communicatively coupled, preferably wirelessly coupled, but may also be coupled in other ways, such as a wired coupling, which functions to terminate the wafer deposit operation of the wafer handling device when the locking system is in an activated state.
According to some embodiments of the invention, sonar device 9 is removably mounted to a cylinder wall 10 of cylinder tank 7. That is, the sonar device 9 can be detached and attached to the cylinder wall 10 of a different cylinder tank 7, and combined with a different cylinder tank 7 and a controller to form a cylinder tank wafer inspection system. Different cylinder grooves 7 may have different sizes, shapes, and the like, and the detection section corresponding to the current cylinder groove 7 can be set by the sonar device 9 and the operating system of the controller. The display system displays whether the sonar signals in the detection interval are abnormal or not according to the change of the signal difference between the transmitting signal 11 and the receiving signal 12 of the sonar device, and when the signal difference between the transmitting signal 11 and the receiving signal 12 of the sonar device is abnormal, the display system displays 'abnormal'; when the signal difference between the transmitting signal 11 and the receiving signal 12 of the sonar device is not abnormally changed, the display system displays 'normal'.
Fig. 6 is a schematic diagram showing the operation of sonar device 9 in cylinder tank wafer inspection system 100 when wafer 8 is normally placed in cylinder tank 7 according to the present invention; fig. 7 is a schematic diagram showing the operation of sonar device 9 of cylinder tank wafer inspection system 100 according to the present invention when wafer fragments 4 are present in cylinder tank 7. In both cases, sonar device 9 is able to detect the presence of wafer 8 or wafer fragment 4 in cylinder groove 7, i.e. detect that cylinder groove 7 is not empty. At this time, the handling system triggers the locking system, which controls the wafer moving device such that the wafer placing operation of the wafer moving device is terminated, and in this locked state, the wafer moving device does not transfer the wafer 8 into the cylinder groove 7.
According to some embodiments of the present invention, the cylinder trough wafer inspection system 100 has an alarm system that is coupled to an operating system. When the wafer 8 in the cylinder groove 7 is transferred out by the wafer transfer device when the detected wafer 8 in the cylinder groove 7 is not abnormally left in the case of normal operation, the cylinder groove 7 is in an empty groove period, and the empty groove period occurs in the cylinder groove 7 every other time period for putting the wafer 8 into the cylinder groove 7 and transferring the wafer 8 out of the cylinder groove 7, and the time period for putting the wafer 8 into the cylinder groove 7 and transferring the wafer 8 out of the cylinder groove 7 is simply referred to as an empty groove period.
When the wafer moving device works normally and no wafer is left in the cylinder groove 7, a time period that the cylinder groove 7 is empty occurs every other empty groove period, and at the time, the locking time for placing the wafer in the wafer moving device is not greater than a time threshold, so that the controller does not trigger the alarm system to send out an alarm signal.
And when a wafer is broken in the cylinder groove 7 at a certain moment, the broken wafer 4 remains in the cylinder groove 7, the sonar device 9 detects that the wafer 8 or the broken wafer 4 exists in the cylinder groove 7, in this case, the cylinder groove 7 does not have the empty groove phenomenon, the wafer putting operation of the wafer transfer device is in a state of being locked all the time, and when the locking time of the wafer putting operation of the wafer transfer device is greater than the set time threshold, the alarm system is triggered to send out an alarm signal. The alarm signal of the alarm system is a buzzer alarm and/or a light alarm.
The foregoing is an exemplary embodiment of the present disclosure, but it should be noted that various changes and modifications could be made herein without departing from the scope of the present disclosure as defined by the appended claims. The functions, steps and/or actions of the method claims in accordance with the disclosed embodiments described herein need not be performed in any particular order. Furthermore, although elements of the disclosed embodiments of the invention may be described or claimed in the singular, the plural is contemplated unless limitation to the singular is explicitly stated.
It should be understood that, as used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly supports the exception. It should also be understood that "and/or" as used herein is meant to include any and all possible combinations of one or more of the associated listed items.
The numbers of the embodiments disclosed in the embodiments of the present invention are merely for description, and do not represent the merits of the embodiments.
Those of ordinary skill in the art will understand that: the discussion of any embodiment above is meant to be exemplary only, and is not intended to intimate that the scope of the disclosure, including the claims, of embodiments of the invention is limited to these examples; within the idea of an embodiment of the invention, also technical features in the above embodiment or in different embodiments may be combined and there are many other variations of the different aspects of the embodiments of the invention as described above, which are not provided in detail for the sake of brevity. Therefore, any omissions, modifications, substitutions, improvements, and the like that may be made without departing from the spirit and principles of the embodiments of the present invention are intended to be included within the scope of the embodiments of the present invention.
Claims (10)
1. A cylinder-trough wafer inspection system, comprising a sonar device disposed on a wall of a cylinder trough, a controller, and the cylinder trough, the sonar device communicatively coupled with the controller.
2. The cylinder trough wafer inspection system of claim 1, wherein the controller comprises:
an operating system;
a display system; and
a locking system intercoupled with the operating system.
3. The cylinder trough wafer detection system of claim 2, wherein the sonar device includes a signal emitting component and a signal receiving component, wherein a transmitted signal emitted by the signal emitting component interacts with an object within a coverage area of the transmitted signal and feeds back a received signal to the signal receiving component, and wherein the operating system is communicatively coupled to the signal receiving component of the sonar device.
4. The cylinder trough wafer inspection system of claim 3, wherein sonar equipment abnormal signal detection sections are set by the operating system.
5. The cylinder trough wafer detection system of claim 4, wherein the display system displays whether the sonar signals in the detection zone are abnormal.
6. The cylinder trough wafer inspection system of claim 1, wherein the locking system is coupled with the wafer mover for terminating a wafer deposit operation of the wafer mover.
7. The cylinder trough wafer inspection system of claim 1, wherein the sonar device is removably disposed on a cylinder wall of the cylinder trough.
8. The cylinder trough wafer inspection system of claim 1, further comprising an alarm system coupled with the handling system.
9. The cylinder groove wafer inspection system of claim 8, wherein the operating system is operable to set an alarm time threshold, the operating system triggering an alarm system to issue an alarm signal when the wafer movement device lock time exceeds the alarm time threshold.
10. The cylinder trough wafer detection system according to any one of claims 1-9, wherein when wafer residue occurs in the abnormal signal detection section, the signal device displays the sonar signal abnormality in the detection section; the controller activates the lock system and the alarm system, the lock system terminating the wafer put operation of the wafer moving device; the alarm system issues a beep alarm and/or a light alarm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910891341.5A CN112540372A (en) | 2019-09-20 | 2019-09-20 | Cylinder groove wafer detection system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910891341.5A CN112540372A (en) | 2019-09-20 | 2019-09-20 | Cylinder groove wafer detection system |
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| CN112540372A true CN112540372A (en) | 2021-03-23 |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20010043735A1 (en) * | 1998-10-15 | 2001-11-22 | Eugene Smargiassi | Detection of wafer fragments in a wafer processing apparatus |
| CN1591775A (en) * | 2003-08-15 | 2005-03-09 | 阿斯莫国际公司 | Method and apparatus for mapping of wafers located inside a closed wafer cassette |
| US20060232432A1 (en) * | 2005-04-13 | 2006-10-19 | Yu-Hung Huang | Safety monitoring mechanism of a wafer fabrication platform |
| US20070177788A1 (en) * | 2006-01-31 | 2007-08-02 | David Liu | System and method for detecting wafer failure in wet bench applications |
| CN103604415A (en) * | 2013-10-23 | 2014-02-26 | 上海华力微电子有限公司 | Crystal boat inclination automatic induction apparatus |
| CN105044206A (en) * | 2015-06-05 | 2015-11-11 | 汕头市超声仪器研究所有限公司 | Automatic detection method for phased array probe |
-
2019
- 2019-09-20 CN CN201910891341.5A patent/CN112540372A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20010043735A1 (en) * | 1998-10-15 | 2001-11-22 | Eugene Smargiassi | Detection of wafer fragments in a wafer processing apparatus |
| CN1591775A (en) * | 2003-08-15 | 2005-03-09 | 阿斯莫国际公司 | Method and apparatus for mapping of wafers located inside a closed wafer cassette |
| US20060232432A1 (en) * | 2005-04-13 | 2006-10-19 | Yu-Hung Huang | Safety monitoring mechanism of a wafer fabrication platform |
| US20070177788A1 (en) * | 2006-01-31 | 2007-08-02 | David Liu | System and method for detecting wafer failure in wet bench applications |
| CN101013138A (en) * | 2006-01-31 | 2007-08-08 | 台湾积体电路制造股份有限公司 | System and method for detecting wafer |
| CN103604415A (en) * | 2013-10-23 | 2014-02-26 | 上海华力微电子有限公司 | Crystal boat inclination automatic induction apparatus |
| CN105044206A (en) * | 2015-06-05 | 2015-11-11 | 汕头市超声仪器研究所有限公司 | Automatic detection method for phased array probe |
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