TWI835586B - Manufacturing method of autofocus camera module, autofocus camera module and electronic device - Google Patents

Abstract

The present application provides a manufacturing method of autofocus camera module, including the following steps: a first group of mirrors, a liquid lens and a circuit board assembly are provided. The first group of mirrors comprises a first mirror base and a first lens group housed in the first mirror base. One surface of the liquid lens has a plurality of pads, and the circuit board assembly includes a driving element; At least two first conductive lines are formed on the surface of the first mirror base; Implanting solder on the pads of the liquid lens; The liquid lens is welded to one side of the first mirror base through the solder, and two pads of the liquid lens are electrically connected to one end of the first conductive line; The side of the first group of mirrors that is away from the liquid lens is set on the circuit board assembly, and the other end of the first conductive line is electrically connected to the driving element, so that the driving element drives the liquid lens through the first conductive line to realize zoom. The application also provides an autofocus camera module and an electronic device.

Description

Autofocus camera module, manufacturing method and electronic device thereof

The present application relates to the technical fields of electronic and optical devices, and in particular to an autofocus camera module and a manufacturing method thereof, as well as an electronic device including an autofocus camera module.

Liquid lens technology is similar to the human eye, has no delay, small response time, miniaturization, and is not affected by gravity, magnetism, mechanical vibration, etc., and has been widely used in autofocus camera modules. The autofocus camera modules currently in mass production on the market place the packaged liquid lens element at the front of the lens, or divide the lens into two groups, and insert the liquid lens between the two groups of lens components (add-in architecture ). Among them, the packaged liquid mirror element uses silver glue and solder to export the signal through the flexible board or conductive line (LDS), while the unpackaged liquid lens is connected to the lens base with LDS line by wiring. to export the signal.

The polymer light-transmitting structure of a liquid lens (film) cannot maintain a stable shape like a mold-injected lens when it is not powered. Therefore, liquid lenses must be installed and tested after general lens assembly tests. This means that in addition to ensuring the stability of the quality of the liquid lens itself, its assembly accuracy must also comply with the overall lens design. In the known add-in process of two-group lens components, the liquid lens is pre-dotted in the glue groove on the first group lens group through the glue, and then the liquid lens mechanical alignment (LHA) is placed on the first group lens group. After the glue solidifies, the wire bonding machine is used to bond the liquid lens to the LDS line on the first group lens group, and finally the second group lens group is mounted on the first group lens group using the LHA. This process still has the following problems:

(1) Since LDS lines need to be formed on the surface of the lens holder of the first group of lens groups, the lens holder still needs to go through processes such as laser molding and chemical plating after injection molding. Therefore, its local dimensions will be slightly changed and require multiple verifications. Meet design tolerances.

(2) The liquid lens is placed through a mechanism (LHA) that aligns the upper opening of the first lens group with the light-transmitting area in the center of the liquid lens. The offset tolerance will further increase the tolerance when superimposed. And because the liquid lens is solidified through glue, the height difference of the glue around it will also make the tilt tolerance larger.

(3) The gold wire requires a certain temperature of about 80°C for smooth joining. It is common knowledge that the heating area of the machine is at the bottom. In order to allow the heat energy to be transferred upward, the heating block is usually set to above 120°C. Since there are already lenses in the first group of lenses, the lenses cannot withstand temperatures above 85°C for a long time, so they cannot operate in the original way. It is necessary to develop another device for air-to-air heating or use a low-temperature aluminum wire machine. .

In view of this, this application provides an autofocus camera module and its manufacturing method. It uses flip chip welding (Flip Chip) technology to encapsulate the liquid lens, which can quickly verify the quality of the lens component, accurately control offset and tilt, and reduce tolerances. And it can avoid heating problems caused by wiring.

In addition, the present application also provides an electronic device including the autofocus camera module.

One embodiment of the present application provides a method for manufacturing an autofocus camera module, which includes the following steps: A first lens group, a liquid lens and a circuit board component are provided. The first lens group includes a first lens holder and a first lens group contained in the first lens holder. A surface of the liquid lens has a plurality of pads, the circuit board component including a driver component; forming at least two first conductive lines on the surface of the first lens holder; Implanting solder into the soldering pad of the liquid lens; The liquid lens is welded to one side of the first lens holder by the solder, and two pads of the liquid lens are electrically connected to one of the first conductive lines respectively; The side of the first lens group facing away from the liquid lens is disposed on the circuit board element, and the first conductive line is electrically connected to the driving element, so that the driving element passes through the third A conductive circuit drives the liquid lens to achieve zooming.

This application also provides an autofocus camera device, including a circuit board component and a lens mechanism provided on the circuit board component. The circuit board component includes a driving component, and the lens mechanism includes a first lens group and a liquid lens. The first lens group includes a first lens holder and a first lens group contained in the first lens holder. The first lens holder is disposed on one side of the circuit board component, and the liquid lens has a plurality of Welding pads, each of which is implanted with solder, and the liquid lens is welded to the side of the first mirror holder away from the circuit board component by the solder, and the surface of the first mirror holder is provided with at least Two first conductive lines, each of the conductive lines is electrically connected to one of the pads, and a side of the first conductive line away from the liquid lens is electrically connected to the driving element.

This application also provides another autofocus camera device, including a circuit board component and a lens mechanism disposed on the circuit board component. The circuit board component includes a driving component. The lens mechanism includes a first lens group, a second lens group A lens group and a liquid lens disposed between the first lens group and the second lens group. The first lens group includes a first lens holder and a first lens contained in the first lens holder. group, the first lens holder is arranged on one side of the circuit board component; the second lens group includes a second lens holder and a second lens group contained in the second lens holder, and the second lens group The mirror holder is disposed on a side of the first mirror holder away from the circuit board component; the liquid lens has a plurality of soldering pads, each of the soldering pads is implanted with solder, and the liquid lens is welded to the lens by the solder. The second mirror holder faces one side of the first mirror holder.

The first application also provides an electronic device including the autofocus camera module.

Compared with the conventional technology that uses wire connection, the manufacturing method of the autofocus camera module provided by this application is to first implant solder on the pad on the liquid lens, and then directly use flip-chip soldering technology to electrically connect it. The first lens group is electrically connected to the driving element on the circuit board component through the first conductive line on the first lens group, thereby achieving driving zoom. The quality of the first lens group can be quickly verified without dispensing glue, and the offset and tilt of the liquid lens can be accurately controlled during welding. By using flip-chip welding, heat can be directly conducted from the heated liquid lens to the joint area with the first lens group without using an additional heating device. The production method is simple and efficient, and the assembly tolerance is reduced and the precision is higher.

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, rather than all of the embodiments.

In the description of the present application, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "upward", "downward", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the attached drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or component referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the said features.

In order to further elaborate on the technical means and effects adopted by this application to achieve the intended purpose, the following detailed description of this application is given below in conjunction with the accompanying drawings and preferred embodiments.

Referring to Figures 1 to 15, a first embodiment of the present application provides a method of manufacturing an autofocus camera module 100, which includes the following steps:

Step S11, please refer to Figure 1. A first lens holder 11 is provided. The first lens holder 11 includes a first base 13, a first lens barrel 12 and a first lens cover 14 connected in sequence. The base 11 is provided with a first light hole 15 .

In step S12, please refer to FIG. 2. A first conductive circuit 16 is provided on the outer surface of the first lens holder 11.

Specifically, laser direct structuring (LDS) technology is used to directly carve a conductive path on the outer surface of the first lens holder 11 by using a computer to control the laser running trajectory, and then use chemical plating to quickly activate the circuit pattern. A first conductive trace 16 is formed. The number of the first conductive lines 16 is at least two.

Step S12 may also include surface treatment of the first conductive line 16 with thickened gold to enhance its conductive performance.

In this embodiment, the first mirror base 11 is made of plastic, and the first conductive line 16 extends from the first mirror cover 14 to the first base 13 .

In step S13 , please refer to FIG. 3 , a first lens group 17 is placed in the first lens barrel 12 to obtain a first lens group 10 .

Step S14, please refer to Figure 4 to provide a liquid lens 20. The liquid lens 20 has a plurality of soldering pads 21 on one surface. The liquid lens 20 has a liquid light-transmitting area 22, and solder is provided on the soldering pads 21. 25.

Wherein, the surface of the liquid lens 20 has at least four solder pads 21 . In this embodiment, the liquid lens 20 is generally rectangular, and the four soldering pads 21 are respectively provided at four corners of the liquid lens 20 . The light-transmitting area 22 is located at the center of the liquid lens 20 . The solder 25 may be, but is not limited to, gold balls or silver balls.

The solder used in conventional surface mount technology (SMT) usually contains flux, which will contaminate the lens during the low-temperature hot pressing process and cannot be used directly on aluminum pads. In this embodiment, the solder 25 is a gold ball and does not contain solder resist. In the subsequent process of combining with the first lens group 10 (see Figure 5) through heat and ultrasonic waves, it will not contaminate the first lens group 10 (see Figure 5). Lens set 17. During the actual operation, a ball planting machine is used to place a gold ball on the surface of the four pads 21 of the liquid lens 20 respectively.

Specifically, the light-transmitting area 22 of the liquid lens 20 is in a slightly concave state (plano-convex) when no electricity is applied. After applying a positive voltage, the lens will gradually become convex (plano-convex). When a negative voltage is applied, the lens will become convex. It will gradually become concave (plano-concave), so the zoom can be controlled by electric drive.

It can be understood that when the solder 25 (Buming) is provided on the liquid lens 20 , a jig can be used to electrically connect the first conductive line 16 to verify the quality of the first lens group 10 .

In step S15, please refer to FIG. 5 to electrically connect the liquid lens 20 to the first lens group 10.

Specifically, the liquid lens 20 is soldered to the first lens cover 14 through the solder 25 , and the two soldering pads 21 are electrically connected to the two first conductive lines 16 respectively. The light-transmitting area 22 is arranged corresponding to the first light-passing hole 15 .

In this embodiment, the number of the first conductive lines 16 is four, and each of the first conductive lines 16 is electrically connected to one of the pads 21 .

During actual operation, the liquid lens 20 can be sucked in using flip chip welding technology, the liquid lens 20 and the first lens cover 14 can be bonded through heat and ultrasonic waves, and the bonding area can be protected by glue.

By setting the solder 25 and then welding it to the first lens group 10 using Flip Chip technology, the offset and tilt of the liquid lens 20 can be precisely controlled. And the heat can be directly transferred from the heated liquid lens 20 to the joint area without the need for other additional devices.

In step S16 , please refer to FIG. 6 , a second lens group 30 is installed on the first lens group 10 to obtain the lens mechanism 1 .

The second lens group 30 includes a second lens base 31 and a second lens group 32 located in the second lens base 31 . A second light hole 33 is provided through the second lens base 31 .

The second lens holder 31 includes a connected second lens barrel 311 and a second lens cover 312. The second lens barrel 311 is disposed on the first lens holder 11. The second lens group 32 and The liquid lens 20 is received in the second lens barrel 311 , and the second light hole 33 , the light transmission area 22 and the first light hole 15 are arranged correspondingly.

In step S21, please refer to FIG. 7 to provide a circuit board 40.

Step S22 , please refer to FIG. 8 , at least two driving elements 41 are disposed on one surface of the circuit board 40 , and the driving elements 41 are electrically connected to the circuit board 40 .

It is understood that the circuit board 40 may also be provided with other passive components such as capacitors and inductors.

In this embodiment, the driving element 41 is disposed around the circuit board 40 .

In step S23 , please refer to FIGS. 9 and 10 , a package 42 is provided on the surface of the circuit board 40 to cover the driving element 41 .

Specifically, an injection molding process (Molding) can be used to provide plastic (such as epoxy resin) on the surface of the circuit board 40 , and after the plastic is cured, the package 42 is formed to cover the driving element 41 .

In this embodiment, step S23 also includes grinding the package body 42 to a suitable size and keeping the surface of the package body 42 free of dust and impurities, thereby ensuring the accuracy of subsequent processes.

The package body 42 has a first opening 43 therethrough, and the surface of the circuit board 40 is exposed by the first opening 43 . The package body 42 has a supporting surface 421 facing away from the circuit board 40 , and a stepped groove 422 is formed in the supporting surface 421 . The stepped groove 422 is disposed adjacent to the central area of the circuit board 40 and connected to the first opening 43 .

In step S24 , please refer to FIG. 11 , a second conductive circuit 45 is provided on the surface of the package 42 .

The second conductive line 45 extends from the supporting surface 421 to the surface of the circuit board 40 , and is electrically connected to the circuit board 40 . In this embodiment, the second conductive line 45 is arranged to avoid the step groove 422 .

Step S25, please refer to FIG. 12 and FIG. 13, a photosensitive chip 50 is disposed on the surface of the circuit board 40, and the photosensitive chip 50 is electrically connected to the circuit board by wire bonding.

The photosensitive chip 50 and the driving element 41 are on the same surface, and the photosensitive chip 50 is exposed through the first opening 43 . The photosensitive chip 50 is electrically connected to the circuit board 40 through the wire 51 .

In step S26 , please refer to FIG. 14 , a filter 60 is set on the package 42 to obtain the circuit board component 2 .

Wherein, the optical filter 60 is disposed in the stepped groove 422 , and the optical filter 60 is disposed opposite to the photosensitive chip 50 . Specifically, the periphery of the optical filter 60 can be fixed in the step groove 422 by adhesive.

In step S30, please refer to FIG. 15. The lens mechanism 1 is arranged on the circuit board component 2 to obtain the autofocus camera module 100.

The first base 13 is disposed on the supporting surface 421 of the package 42 , so that part of the optical filter 60 is partially accommodated in the first base 13 . The first conductive line 16 is electrically connected to the second conductive line 45 , so that the liquid lens 20 is electrically connected to the circuit board 40 . The liquid lens 20 is electrically connected to the driving element 41 through the first conductive line 16 and the second conductive line 45. By controlling the driving element 41, the liquid lens 20 can be electrically driven to achieve zooming. .

In this embodiment, the number of the second conductive lines 45 is four, and each of the second conductive lines 45 is electrically connected to one of the first conductive lines 16 . It can be understood that among the four second conductive lines 45, one is used to connect the positive signal, one is used to connect the negative signal, and the other two are open connections.

The autofocus camera module 100 has an optical axis O. The central axes of the lens mechanism 1 and the circuit board component 2 are coaxially arranged with the optical axis O, and the first light hole 15 is light-transmitting. The area 22 and the second light hole 33 are arranged corresponding to the optical filter 60 and the photosensitive wafer 50 .

Specifically, it also includes: disposing a first conductor 101 between the first conductive line 16 and the second conductive line 45 , and disposing a second conductor between the second conductive line 45 and the circuit board 40 . Conductor 102 to achieve electrical connection.

Wherein, the first conductor 101 and the second conductor 102 are conductive silver glue or solder.

The manufacturing method of the autofocus camera module 100 provided in this application is to first implant solder 25 on the pad 21 on the liquid lens 20, and then directly use flip-chip soldering technology to electrically connect to the first group lens. The first group lens group 10 is electrically connected to the driving element 41 through the first conductive line 16 on the first group lens group 10 and the second conductive line 45 on the circuit board component 2, thereby achieving driving zoom. Compared with the conventional technology that uses wire connection, this production method can quickly verify the quality of the first lens group 10 without dispensing glue, and can accurately control the offset and tilt of the liquid lens 20 during welding. By using flip-chip welding, heat can be directly conducted from the heated liquid lens 20 to the joint area with the first lens group 10 without using an additional heating device. The production method is simple and efficient, and the assembly tolerance is reduced and the precision is higher.

Referring to FIG. 15 , the first embodiment of the present application also provides an autofocus camera module 100 manufactured using the above manufacturing method, including a circuit board component 2 and a lens mechanism 1 disposed on the circuit board component 2 .

The lens mechanism 1 includes a first lens group 10, a liquid lens 20 and a second lens group 30. The first lens group 10 is provided on the circuit board component 2, the liquid lens 20 and the second lens group 30. The second lens group 30 is disposed on the side of the first lens group 10 away from the circuit board component 2 , and the liquid lens 20 is disposed between the first lens group 10 and the second lens group 30 . The first lens group 10 includes a first lens holder 11 and a first lens group 17 accommodated in the first lens holder 11 . A first conductive circuit 16 is provided on the outer surface of the first lens holder 11 . A plurality of solder pads 21 are provided on the surface of the liquid lens 20, and solder 25 is provided on each of the solder pads 21. The liquid lens 20 is flip-chip soldered to the first lens through the solder 25. The base 11 and the liquid lens 20 are electrically connected to the first conductive circuit 16 . The second lens group 30 includes a second lens holder 31 and a second lens group 32 contained in the second lens holder 31. The second lens holder 31 is provided on the first lens holder 11, so The liquid lens 20 is received in the second lens holder 31 .

The first lens holder 11 is provided with a first light hole 15 , the liquid lens 20 is provided with a liquid light-transmitting area 22 in the center, and the second lens holder 31 is provided with a second light hole 15 . 33. The first light hole 15, the light transmission area 22 and the second light hole 33 are arranged correspondingly.

In this embodiment, four solder pads 21 are provided on the surface of the liquid lens 20 . There are at least two first conductive lines 16, and each first conductive line 16 is electrically connected to one of the pads 21. One of the first conductive lines 16 is connected to the positive signal, and the other first conductive line 16 is connected to the positive signal. Line 16 is connected to the negative signal.

The circuit board component 2 includes a circuit board 40, a driving element 41, a package 42, a photosensitive chip 50 and a filter 60. The driving element 41 and the photosensitive chip 50 are disposed on the same surface of the circuit board 40. The circuit board 40 is electrically connected. The package 42 covers the driving element 41 , the first lens holder 11 and the filter 60 are provided on the surface of the package 42 away from the circuit board, and the filter 60 is partially accommodated. in the first lens holder 11 . The package body 42 has a first opening 43 therethrough, and the photosensitive chip 50 is exposed through the first opening 43 . A second conductive line 45 is provided on the surface of the package 42 away from the first opening 43. One end of the second conductive line 45 is electrically connected to the first conductive line 16 through the first conductor 101. The other end is electrically connected to the circuit board 40 through the second conductor 102, so that the driving element 41 can electrically drive the liquid lens 20 through the second conductive line 45 and the first conductive line 16 to Implement zoom.

The autofocus camera module 100 has an optical axis O, and the central axes of the lens mechanism 1 and the circuit board component 2 are coaxially arranged with the optical axis O.

Please refer to Figures 16 to 17. This application also provides an auto-focus camera module 200, which is different from the auto-focus camera module 100 in the structure of the circuit board component 2, specifically in:

The autofocus camera module 200 includes a circuit board component 2a and a lens mechanism 1 disposed on the circuit board component 2a. The circuit board component 2a includes a circuit board 40a, a driving element 41a, a package 42a, a second conductive line 45a, a photosensitive chip 50a and a filter 60a. The circuit board 40a is provided with a through hole 401. The driving element 41 and the photosensitive chip 50a are respectively disposed on two opposite surfaces of the circuit board 40a. The package 42a covers the driving element 41a. The optical filter 60a is disposed on the surface of the circuit board 40a and is opposite to the photosensitive chip 50a through the through hole 401. The second conductive line 45a is provided on the surface of the package 42a away from the through hole 401, and the second conductive line 45a is electrically connected to the driving element 41a.

In this embodiment, a groove 402 is recessed in the surface of the circuit board 40a facing away from the lens mechanism 1. The groove 402 is connected with the through hole 401, and the photosensitive chip 50a is disposed on the inside the groove 402. Wherein, the package body 42a is provided with a first opening 43a, the first opening 43a is connected with the through hole 401, and the optical filter 60a and the photosensitive chip 50a are connected through the first opening. The hole 43a is exposed.

Please refer to Figure 18. The third embodiment of the present application also provides an autofocus camera module 300. The structure is roughly the same as the autofocus camera module 100, but the difference is:

The autofocus camera module 300 also includes a liquid lens 20a and a protective cover 70. A third conductive circuit 35 is provided on the surface of the second lens holder 31. The third conductive circuit 35 is electrically connected to the first conductive circuit. Line 16. The liquid lens 20a is flip-chip welded to the side of the second lens holder 31 away from the first lens holder 11, and the liquid lens 20a is electrically connected to the third conductive line 35. The protective cover 70 is disposed on the side of the second lens holder 31 away from the first lens holder 11 , and the protective cover 70 covers the liquid lens 20a. The protective cover 70 is provided with a second opening 71 , and part of the liquid lens 20 a is exposed through the second opening 71 so that light can pass through.

The autofocus camera module 300 can further improve the autofocus performance by providing the liquid lens 20 and the liquid lens 20a.

Please refer to Figure 19. The fourth embodiment of the present application also provides an auto-focus camera module 400, which has roughly the same structure as the auto-focus camera module 100, except that:

The second mirror holder 31 also has a second base 313 , and the second base 313 is provided on the first mirror holder 11 . A third conductive line 35 is provided on the surface of the second base 313 , and the third conductive line 35 is electrically connected to the first conductive line 16 . The liquid lens 20 is flip-chip welded to the surface of the second base 313 facing the first lens holder 11 .

Please refer to Figure 20. The fifth embodiment of the present application also provides an auto-focus camera module 500, which has roughly the same structure as the auto-focus camera module 300, except that:

The second mirror holder 31 also has a second base 313 , and the second base 313 is provided on the first mirror holder 11 . A third conductive line 35 is provided on the surface of the second lens holder 31 , and the third conductive line 35 is electrically connected to the first conductive line 16 . The liquid lens 20 is flip-chip welded to the surface of the second base 313 facing the first lens holder 11 .

Referring to Figure 21, the present application also provides an electronic device 1000 including the above-mentioned autofocus camera module 100. The electronic device 1000 can be a mobile phone, a wearable/handheld device, an aerial camera, etc. In this embodiment, the electronic device 1000 is a mobile phone.

The above embodiments are only used to illustrate the present application, but the actual application process cannot be limited to this embodiment. For those of ordinary skill in the art, other modifications and changes made based on the technical concept of this application should fall within the patent scope of this application.

100, 200, 300, 400, 500: Autofocus camera module 1: Lens mechanism 10: The first group of lenses 11:First mirror holder 12:First lens barrel 13:First base 14:First lens cover 15: First light hole 16: First conductive line 17: First lens group 20, 20a: Liquid lens 21: Pad 22: Translucent area 25:Solder 30: The second group of lenses 31:Second mirror holder 311:Second lens barrel 312:Second mirror cover 313:Second base 32: Second lens group 33: Second light hole 35:Third conductive line 2. 2a: Circuit board components 40, 40a: circuit board 401:Through hole 402: Groove 41, 41a: driving components 42, 42a: package 421:Support surface 422:Step groove 43, 43a: first opening 45, 45a: Second conductive line 50, 50a: photosensitive chip 51, 51a: Wire 52: Solder ball 60, 60a: filter 70:Protective cover 71:Second opening 101: First conductor 102: Second conductor O: optical axis 1000:Electronic devices

Figure 1 is a schematic structural diagram of the first lens holder according to the first embodiment of the present application. FIG. 2 is a schematic structural diagram after a first conductive circuit is provided on the surface of the first lens holder shown in FIG. 1 . FIG. 3 is a schematic structural diagram of a first lens group obtained by arranging a first lens group in the first lens holder shown in FIG. 1 . Figure 4 is a schematic structural diagram of a liquid lens according to the first embodiment of the present application. FIG. 5 is a schematic structural diagram after the liquid lens shown in FIG. 4 is installed in the first lens group shown in FIG. 3 . FIG. 6 is a schematic structural diagram of a lens mechanism obtained by arranging a second lens group on the first lens group shown in FIG. 5 . FIG. 7 is a schematic structural diagram of a circuit board according to the first embodiment of the present application. FIG. 8 is a schematic structural diagram after passive components are installed on the surface of the circuit board shown in FIG. 7 . FIG. 9 is a schematic structural diagram of a package installed on the surface of the circuit board shown in FIG. 8 to cover the passive components. FIG. 10 is a schematic structural diagram of the package shown in FIG. 9 after grinding. FIG. 11 is a schematic structural view of the package shown in FIG. 10 after a second conductive line is provided on the side thereof. FIG. 12 is a schematic structural diagram after a photosensitive chip is installed on the surface of the circuit board shown in FIG. 11 . FIG. 13 is a schematic structural diagram after the photosensitive chip shown in FIG. 12 is electrically connected to the circuit board using wires. FIG. 14 is a schematic structural diagram of a circuit board component obtained after placing an optical filter in the stepped groove shown in FIG. 13 . FIG. 15 is a schematic structural diagram of an autofocus camera module obtained by arranging the lens mechanism shown in FIG. 6 on the circuit board component shown in FIG. 14 . FIG. 16 is a schematic structural diagram of a circuit board component according to the second embodiment of the present application. FIG. 17 is a schematic structural diagram of an autofocus camera module according to the second embodiment of the present application. Figure 18 is a schematic structural diagram of an autofocus camera module according to the third embodiment of the present application. Figure 19 is a schematic structural diagram of an autofocus camera module according to the fourth embodiment of the present application. FIG. 20 is a schematic structural diagram of an autofocus camera module according to the fifth embodiment of the present application. FIG. 21 is a schematic structural diagram of an electronic device according to the first embodiment of the present application.

100:Autofocus camera module

1: Lens mechanism

10: The first group of lenses

11:First mirror holder

15: First light hole

16: First conductive line

17: First lens group

20:Liquid lens

21: Pad

22: Translucent area

25:Solder

30: The second group of lenses

31:Second mirror holder

32: Second lens group

33: Second light hole

2: Circuit board components

40:Circuit board

41: Drive components

42:Package

45: Second conductive line

50: Photosensitive chip

51:Wire

60: Filter

101: First conductor

102: Second conductor

O: optical axis

Claims (5)

A method for manufacturing an autofocus camera module, the improvement of which includes the following steps: providing a first lens group, a liquid lens and a circuit board component, the first lens group including a first lens base and a first lens group accommodated in the third A first lens group in a lens holder, a surface of the liquid lens has a plurality of pads, the circuit board component includes a driving component; at least two first conductive lines are formed on the surface of the first lens holder; Solder is implanted in the soldering pads of the liquid lens; the liquid lens is welded to one side of the first lens base through the solder, and two of the soldering pads of the liquid lens are electrically connected to one One end of the first conductive line; a second lens group is provided on the side of the first lens holder with the liquid lens, and the second lens group includes a second lens holder and a second lens group accommodated in the second lens holder In the second lens group, at least two third conductive lines are provided on the surface of the second lens holder, and each of the third conductive lines is electrically connected to one of the first conductive lines; the liquid lens is accommodated in The second lens holder; welding and disposing another liquid lens on the side of the second lens holder away from the first lens holder, and the other liquid lens is electrically connected to the third conductive circuit; and the The side of the first lens group away from the liquid lens is disposed on the circuit board element, and the other end of the first conductive line is electrically connected to the driving element, so that the driving element passes through the The first conductive circuit drives the liquid lens to achieve zooming. The manufacturing method according to claim 1, wherein the first lens holder includes a first base, a first lens barrel and a first lens cover connected in sequence, and the step "forming at least two holes on the surface of the first lens holder" "a first conductive line" includes: using laser direct forming technology to form at least two first conductive lines on the surface of the first mirror base, each of the first conductive lines extending from the surface of the first mirror cover to The surface of the first base; The step "welding the liquid lens to one side of the first lens base through the solder" includes: welding the liquid lens to the first lens cover through the solder. The manufacturing method according to claim 1, wherein the circuit board component further includes a circuit board, a photosensitive chip, a package and a filter, and the photosensitive chip and the driving element are provided on the surface of the circuit board, The package covers the driving element, the optical filter is disposed on a side of the package away from the circuit board, and the optical filter and the photosensitive chip are arranged oppositely. A second conductive line is provided on the surface, and the manufacturing method of the circuit board component includes the following steps: setting a driving component on the surface of the circuit board; setting a package on the surface of the circuit board to cover the driving component; At least two second conductive lines are formed on the surface of the package, and the second conductive lines are electrically connected to the driving element; a photosensitive chip is provided on the surface of the circuit board with the driving element; and a photosensitive chip is provided on the surface of the package away from the driving element. A light filter is arranged on one side of the circuit board, and the light filter and the photosensitive chip are arranged oppositely; step "arrange the side of the first group lens group away from the liquid lens on the circuit board "Board component" also includes: electrically connecting each of the first conductive lines to one of the second conductive lines. An autofocus camera module is improved in that it includes a circuit board component and a lens mechanism provided on the circuit board component, the circuit board component includes a driving component, and the lens mechanism includes a first lens group and a liquid lens, The first lens group includes a first lens holder and a first lens group contained in the first lens holder. The first lens holder is disposed on one side of the circuit board component, and the liquid lens has multiple Each solder pad is implanted with solder, and the liquid lens is welded to the side of the first lens holder away from the circuit board component by the solder. The surface of the first lens holder is provided with At least two first conductive lines, each of the conductive lines is electrically connected to one of the pads, the side of the first conductive line away from the liquid lens is electrically connected to the driving element, the autofocus camera module Also includes the second group Lens group, the second lens group includes a second lens holder and a second lens group contained in the second lens holder, the second lens holder is arranged such that the first lens holder faces away from the circuit board component On one side, the liquid lens is contained in the second lens holder, and at least two third conductive lines are provided on the surface of the second lens holder, and each of the third conductive lines is electrically connected to one of the first Conductive circuit, another liquid lens is provided on the side of the second lens holder away from the first lens holder, and the liquid lens is electrically connected to the third conductive circuit. An electronic device, improved by including the autofocus camera module as described in claim 4.

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