TWI833152B - Peeler and scraper mechanism thereof - Google Patents
Peeler and scraper mechanism thereof Download PDFInfo
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- TWI833152B TWI833152B TW111102099A TW111102099A TWI833152B TW I833152 B TWI833152 B TW I833152B TW 111102099 A TW111102099 A TW 111102099A TW 111102099 A TW111102099 A TW 111102099A TW I833152 B TWI833152 B TW I833152B
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- film material
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- 239000000463 material Substances 0.000 claims description 95
- 230000000694 effects Effects 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 12
- 238000000034 method Methods 0.000 description 10
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000005381 potential energy Methods 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 1
- 239000005041 Mylar™ Substances 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
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Abstract
Description
本發明係關於一種刮刀機構,特別是一種剝膜機的刮刀機構。 The present invention relates to a scraper mechanism, in particular to a scraper mechanism of a film stripping machine.
按,在半導體或電子零組件的產業中,於部分製程會需要在基板上貼附多層膜料其中最外層離型模用以防止灰塵沾附、達到靜電防護或是阻絕與空氣接觸。貼附膜料的作業流程包含貼膜程序和最外層的離型模撕膜程序。於貼膜程序,多層膜主要膜料被貼附於基板上,並且主要膜料上方為後續被撕除的離型膜料。於撕膜程序,離型膜料被撕除以顯露出主要膜料。 According to the industry, in the semiconductor or electronic component industry, in some processes, it is necessary to attach multiple layers of film material to the substrate, with the outermost release mold being used to prevent dust from adhering, achieve electrostatic protection, or block contact with the air. The operation process of attaching film materials includes the film application process and the outermost release mold tearing process. In the film application process, the main film material of the multi-layer film is attached to the substrate, and above the main film material is the release film material that is subsequently torn off. In the film tearing process, the release film material is torn off to reveal the main film material.
目前,業界已普遍採用自動化設備來撕除基板上的膜料,然而主要膜料溢出的問題可能影響設備進行撕膜程序。具體來說,貼膜程序中的主要膜料會被加熱後貼附於基板上,此時主要膜料若流動性較高可能會從離型膜料的邊緣溢出而包覆離型膜料的周邊區域,導致後續的撕膜程序難以將離型膜料與主要膜料分開。為了解決上述問題,有一種方案是在貼膜程序完成後以雷射燒除溢出的主要膜料,但雷射能量可能會損害到基板上的電路圖案,因此除了雷射燒除溢出膜料的方法外,還需要開發其他 解決方案。 At present, the industry has generally used automated equipment to remove film materials from substrates. However, the main problem of film material overflow may affect the equipment's film removal process. Specifically, the main film material in the film application process will be heated and then attached to the substrate. At this time, if the main film material has high fluidity, it may overflow from the edge of the release film material and cover the periphery of the release film material. area, making it difficult to separate the release film material from the main film material in the subsequent tearing process. In order to solve the above problem, one solution is to use laser to burn off the main overflowing film material after the film application process is completed. However, the laser energy may damage the circuit pattern on the substrate. Therefore, in addition to laser burning off the overflowing film material, In addition, it is necessary to develop other solution.
鑒於以上問題,本發明揭露一種刮刀機構,其實質上解決因習知技術的限制和缺陷所致之一或多個問題。本發明還揭露含有此刮刀機構的撕膜機。 In view of the above problems, the present invention discloses a scraper mechanism, which substantially solves one or more problems caused by limitations and defects of the conventional technology. The invention also discloses a film tearing machine containing the scraper mechanism.
本發明所揭露的刮刀機構包含一承載座、一刀具以及一彈性件。刀具樞接於承載座。彈性件連接承載座與刀具,且彈性件可藉由刀具相對承載座活動而產生形變。 The scraper mechanism disclosed in the present invention includes a bearing seat, a cutter and an elastic member. The tool is pivotally connected to the bearing seat. The elastic member connects the bearing base and the cutter, and the elastic member can be deformed by the movement of the cutter relative to the bearing base.
本發明另揭露的刮刀機構包含一承載座、一刀具以及一路徑長度調整件。刀具樞接於承載座。路徑長度調整件設置於承載座,且路徑長度調整件用以限制刀具相對承載座活動的路徑長。 The scraper mechanism also disclosed in the present invention includes a bearing base, a cutter and a path length adjustment member. The tool is pivotally connected to the bearing seat. The path length adjustment member is arranged on the bearing base, and the path length adjustment member is used to limit the path length of the tool relative to the bearing base.
本發明所揭露的撕膜機包含前述的刮刀機構以及一撕膜裝置。刮刀機構用以將膜料的邊緣與另一膜料分離,且撕膜裝置用以將所述膜料與所述另一膜料完全分離。 The film tearing machine disclosed in the present invention includes the aforementioned scraper mechanism and a film tearing device. The scraper mechanism is used to separate the edge of the film material from another film material, and the film tearing device is used to completely separate the film material from the other film material.
根據本發明揭露的刮刀機構及撕膜機,刀具經由彈性件與承載座相連,因而彈性件提供刀具具有一定程度的可活動性。對於主要膜料從離型膜料邊緣溢出的情況來說,當具有可活動性之刀具的刀片碰觸到主要膜料時,刀片能夠保持沿著主要膜料的表面移動而不會插入主要膜料內部。接著,當刀具的刀片碰觸到離型膜料時,刀具可以藉由彈性件以及自身重量下移而使刀 片伸入到離型膜料下方,進而將離型膜料與主要膜料分離。採用本發明的刮刀機構進行撕膜可以免去預先用雷射燒除溢出膜料的步驟。 According to the scraper mechanism and film tearing machine disclosed in the present invention, the cutter is connected to the bearing base through an elastic member, so the elastic member provides the cutter with a certain degree of mobility. For the case where the main film material overflows from the edge of the release film material, when the blade of the movable tool touches the main film material, the blade can keep moving along the surface of the main film material without inserting into the main film material. material inside. Then, when the blade of the tool touches the release film material, the tool can move downward through the elastic member and its own weight. The film extends under the release film material to separate the release film material from the main film material. Using the scraper mechanism of the present invention to tear off the film can eliminate the need to use laser to burn out the overflowing film material in advance.
以上之關於本揭露內容之說明及以下之實施方式之說明係用以示範與解釋本發明之精神與原理,並且提供本發明之專利申請範圍更進一步之解釋。 The above description of the present disclosure and the following description of the embodiments are used to demonstrate and explain the spirit and principles of the present invention, and to provide further explanation of the patent application scope of the present invention.
1:刮刀機構 1: Scraper mechanism
2:撕膜機 2: Film tearing machine
3:撕膜裝置 3: Film tearing device
10:承載座 10: Bearing seat
20:刀具 20: Knives
210:連接件 210: Connector
211:穿槽 211: Groove
220:刀片 220:Blade
221:漸縮刀尖 221: tapering tip
230:柱狀件 230: Column parts
231:公母匹配結構 231:Male and female matching structure
30:彈性件 30: Elastic parts
40:路徑長度調整件 40: Path length adjustment piece
410:干涉端部 410: Interference end
50:限位件 50:Limiting piece
A、B:膜料 A, B: membrane material
S:基板 S:Substrate
圖1為根據本發明一實施例之刮刀機構的立體示意圖。 Figure 1 is a schematic perspective view of a scraper mechanism according to an embodiment of the present invention.
圖2為圖1之刮刀機構的剖切示意圖。 FIG. 2 is a schematic cross-sectional view of the scraper mechanism of FIG. 1 .
圖3至圖6為使用包含圖1刮刀機構的撕膜機從基板上撕除膜料的示意圖。 Figures 3 to 6 are schematic diagrams of using a film tearing machine including the scraper mechanism in Figure 1 to remove film material from a substrate.
以下在實施方式中詳細敘述本發明之詳細特徵以及優點,其內容足以使任何熟習相關技藝者了解本發明之技術內容並據以實施,且根據本說明書所揭露之內容、申請專利範圍及圖式,任何熟習相關技藝者可輕易地理解本發明相關之目的及優點。以下之實施例係進一步詳細說明本發明之觀點,但非以任何觀點限制本發明之範疇。 The detailed features and advantages of the present invention are described in detail below in the implementation mode. The content is sufficient to enable anyone skilled in the relevant art to understand the technical content of the present invention and implement it according to the content disclosed in this specification, the patent scope and the drawings. , anyone familiar with the relevant art can easily understand the relevant objectives and advantages of the present invention. The following examples further illustrate the aspects of the present invention in detail, but do not limit the scope of the present invention in any way.
請參照圖1和圖2,其中圖1為根據本發明一實施例之刮刀機構的立體示意圖,及圖2為圖1之刮刀機構的剖切示意圖。在本實施例中,刮刀機構1包含承載座10、刀具20、彈性
件30以及路徑長度調整件40。刀具20樞接於承載座10,彈性件30連接承載座10與刀具20,且路徑長度調整件40可設置於承載座10。承載座10可藉由馬達(未另繪示)或手動驅使而帶動刀具20、彈性件30與路徑長度調整件40一併移動。
Please refer to FIGS. 1 and 2 , wherein FIG. 1 is a schematic perspective view of a scraper mechanism according to an embodiment of the present invention, and FIG. 2 is a schematic cross-sectional view of the scraper mechanism of FIG. 1 . In this embodiment, the
刀具20可包含連接件210以及固定於連接件210的刀片220。連接件210樞接於承載座10,且彈性件30連接承載座10與連接件210,使得連接件210可相對承載座10轉動。刀片220於末端形成漸縮刀尖221。於漸縮刀尖221,刀片220的厚度朝末端逐漸遞減。
The
彈性件30設置於刀具20與承載座10之間。彈性件30例如但不限於是盤型彈簧,其一端固定於承載座10並且相對另一端固定於刀具20的連接件210。
The
路徑長度調整件40用以限制刀具20相對承載座10活動的路徑長。詳細來說,路徑長度調整件40可相對承載座10移動接近或遠離刀具20,並且路徑長度調整件40與刀具20干涉而限制刀具20活動的路徑長。在本實施例中,路徑長度調整件40可包含具有斜面的干涉端部410,且刀具20可進一步包含有柱狀件230。柱狀件230位於連接件210的穿槽211內,且柱狀件230具有與干涉端部410之斜面匹配的另一斜面。路徑長度調整件40可相對承載座10移動插入刀具20中以與柱狀件230接觸而形成公母匹配結構231,並且藉由干涉端部410插入穿槽211的幅度
調整刀具20的可活動程度。本實施例藉由分別形成在路徑長度調整件40與刀具20上的兩個斜面之間的接觸來影響刀具20活動的路徑長,但本發明並不以此為限。在部分實施例中,可以藉由分別形成在路徑長度調整件與刀具上的凹凸面匹配來調整路徑長。
The path
另外,於本實施例中,刮刀機構1可進一步包含固定於承載座10的限位件50。刀具20設置於承載座10與限位件50之間,且限位件50位於刀具20相對承載座10轉動的路徑上。更具體來說,限位件50為一板件例如金屬板件,其相對彈性件30傾斜設置。刀具20之連接件210位於承載座10與限位件50之間。刀具20之刀片220的延伸方向與限位件50的延伸方向可實質上平行。
In addition, in this embodiment, the
圖3至圖6為使用包含圖1刮刀機構的撕膜機從基板上撕除膜料的示意圖。撕膜機2包含刮刀機構1(參見圖3至圖6)以及撕膜裝置3(參見圖6)。刮刀機構1用以將膜料A的邊緣與膜料B分離。撕膜裝置3用以將膜料A與膜料B完全分離。膜料A例如但不限於是麥拉(Mylar)膜,且膜料B例如但不限於是ABF膜,其貼附於基板S表面上。膜料B自膜料A的邊緣溢出,並且膜料B圍繞膜料A的周邊區域或是甚至覆蓋膜料A的周邊區域。
Figures 3 to 6 are schematic diagrams of using a film tearing machine including the scraper mechanism in Figure 1 to remove film material from a substrate. The
如圖2和圖3所示,刮刀機構1的承載座10可藉由馬達或其他動力源(未另繪示)驅使而帶動刀具20、彈性件30與
路徑長度調整件40一併移動,進而接近膜料A與膜料B。藉由承載座10的移動讓刀具20沿著基板S的表面靠近膜料B邊緣,進而刀具20的刀片220可接觸到基板S與膜料B相黏附的交界處。
As shown in Figures 2 and 3, the bearing
如圖2和圖4所示,持續驅動承載座10移動,則刀具20的刀片220會自基板S與膜料B的交界處移動至膜料B的表面上。在刀片220移動至膜料B表面的過程中,刀具20的刀片220可能脫離膜料B表面,此時彈性件30產生形變,並且刀具20的連接件210與限位件50之間產生縫隙。形變的彈性件30隨即釋放彈性位能復原,並且彈性件30釋放之彈性位能驅動刀具20相對承載座10做小幅度的轉動,進而令刀片220復位至膜料B表面。在膜料B具有高表面硬度的情況下,刀具20藉由彈簧具有一定程度的可活動性,因此能夠保持沿著膜料B的表面移動而不會插入膜料B內部。
As shown in FIGS. 2 and 4 , if the
此外,能藉由路徑長度調整件40調控刀具20相對承載座10轉動的路徑長(即,上下晃動程度)。舉例來說,參照圖2和圖4,在膜料B表面硬度較高或是厚度較厚的情況下,操作人員可拉動路徑長度調整件40,以使干涉端部410遠離穿槽211內的柱狀件230,此時由於干涉端部410之斜面與柱狀件230之斜面接觸面積較小,因此刀具20相對承載座10有較長的可轉動路徑而具有較大程度的可活動性,這讓刀片220的漸縮刀尖221
可以被抬升至更高高度。
In addition, the path length of the
如圖2和圖5所示,持續驅動承載座10移動,則刀具20的刀片220會沿著膜料B的表面移動而抵達至膜料A、B的交界處。在膜料A、B的交界處,膜料A未被膜料B覆蓋,或是覆蓋在膜料A上的膜料B厚度非常薄。由於刀具20的可活動性,在膜料A較軟的情況下,刀具20可以藉由彈性件30以及自身重量下移而使刀片220自膜料A、B的交界處伸入到膜料A下方。由於刀片220的刺入導致膜料A的邊緣與膜料B分離,即膜料A邊緣的少部分被撕除,而膜料A的其餘部分仍貼附於膜料B的表面上。
As shown in FIGS. 2 and 5 , if the
如圖2和圖6所示,撕膜裝置3(例如吸盤或膠帶滾輪)附著於已與膜料B分離的少部分膜料A,並且撕膜裝置3移動而帶動膜料A沿著撕膜裝置3的移動方向從膜料B上被連續地分離。
As shown in Figures 2 and 6, the film tearing device 3 (such as a suction cup or tape roller) is attached to a small portion of the film material A that has been separated from the film material B, and the
綜上所述,根據本發明所揭露的刮刀機構及撕膜機,刀具經由彈性件與承載座相連,因而彈性件提供刀具具有一定程度的可活動性。對於主要膜料從離型膜料邊緣溢出的情況來說,當具有可活動性之刀具的刀片碰觸到主要膜料時,刀片能夠保持沿著主要膜料的表面移動而不會插入主要膜料內部。接著,當刀具的刀片碰觸到離型膜料時,刀具可以藉由彈性件以及自身重量下移而使刀片伸入到離型膜料下方,進而將離型膜料與主要膜料 分離。採用本發明的刮刀機構進行撕膜可以免去預先用雷射燒除溢出膜料的步驟。 To sum up, according to the scraper mechanism and film tearing machine disclosed in the present invention, the cutter is connected to the bearing base through an elastic member, so the elastic member provides the cutter with a certain degree of mobility. For the case where the main film material overflows from the edge of the release film material, when the blade of the movable tool touches the main film material, the blade can keep moving along the surface of the main film material without inserting into the main film material. material inside. Then, when the blade of the tool touches the release film material, the tool can move downward through the elastic member and its own weight to extend the blade under the release film material, thereby separating the release film material from the main film material. separation. Using the scraper mechanism of the present invention to tear off the film can eliminate the need to use laser to burn out the overflowing film material in advance.
對於本領域具有通常知識者顯而易見的是,在不脫離本發明的範圍下,可對本發明進行多種修改及變化。因此,本發明涵蓋本發明所提供之修改及變化,且這些修改及變化落於本申請專利範圍。 It will be apparent to those of ordinary skill in the art that various modifications and variations can be made in the present invention without departing from the scope of the invention. Therefore, the present invention covers the modifications and changes provided by the present invention, and these modifications and changes fall within the patent scope of the present application.
1:刮刀機構 1: Scraper mechanism
10:承載座 10: Bearing seat
20:刀具 20: Knives
210:連接件 210: Connector
220:刀片 220:Blade
221:漸縮刀尖 221: tapering tip
30:彈性件 30: Elastic parts
40:路徑長度調整件 40: Path length adjustment piece
50:限位件 50:Limiting piece
Claims (8)
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TW111102099A TWI833152B (en) | 2022-01-19 | 2022-01-19 | Peeler and scraper mechanism thereof |
JP2022199836A JP2023105793A (en) | 2022-01-19 | 2022-12-14 | Film stripping machine, and scraper mechanism |
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TW111102099A TWI833152B (en) | 2022-01-19 | 2022-01-19 | Peeler and scraper mechanism thereof |
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TWI833152B true TWI833152B (en) | 2024-02-21 |
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Citations (4)
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TWM350955U (en) * | 2008-06-04 | 2009-02-11 | Phoenix Prec Technology Corp | Obstacle-removing adjuster |
JP4223826B2 (en) * | 2003-02-13 | 2009-02-12 | 株式会社リコー | Component peeling tool and component peeling device |
TWM429175U (en) * | 2011-12-26 | 2012-05-11 | C Sun Mfg Ltd | Film-peeling device and wafer film pressing apparatus |
CN112474213A (en) * | 2020-10-21 | 2021-03-12 | 广东鼎泰机器人科技有限公司 | Pressure feedback scraper device |
-
2022
- 2022-01-19 TW TW111102099A patent/TWI833152B/en active
- 2022-12-14 JP JP2022199836A patent/JP2023105793A/en active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4223826B2 (en) * | 2003-02-13 | 2009-02-12 | 株式会社リコー | Component peeling tool and component peeling device |
TWM350955U (en) * | 2008-06-04 | 2009-02-11 | Phoenix Prec Technology Corp | Obstacle-removing adjuster |
TWM429175U (en) * | 2011-12-26 | 2012-05-11 | C Sun Mfg Ltd | Film-peeling device and wafer film pressing apparatus |
CN112474213A (en) * | 2020-10-21 | 2021-03-12 | 广东鼎泰机器人科技有限公司 | Pressure feedback scraper device |
Also Published As
Publication number | Publication date |
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JP2023105793A (en) | 2023-07-31 |
TW202330386A (en) | 2023-08-01 |
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