TWI831226B - capacitor - Google Patents

Abstract

The present invention provides a capacitor with excellent reliability. The capacitor 1 includes: a capacitor layer 10 having at least one capacitor part 30; and a through-hole conductor 60 provided to penetrate the capacitor part 30 in the thickness direction T of the capacitor layer 10; the capacitor part 30 has: at least one main surface An anode plate 31 having a porous layer 34, a dielectric layer 35 disposed on the surface of the porous layer 34, and a cathode layer 36 disposed on the surface of the dielectric layer 35; the through-hole conductor 60 includes a first through-hole conductor 62, which is provided on at least the inner wall surface of the first through hole 63 penetrating the capacitor part 30 in the thickness direction T; the first through hole conductor 62 is electrically connected to the end surface of the anode plate 31, and the end surface of the anode plate 31 is in the thickness direction. The plane direction U orthogonal to T faces the inner wall surface of the first through-hole 63; the first hole 34A is present in the porous layer 34; a part of the first through-hole conductor 62 is included inside the first hole 34A.

Description

capacitor

This invention relates to capacitors.

Patent Document 1 discloses a printed wiring board in which an aluminum substrate is used as a conductive circuit. It is characterized by having an aluminum substrate with a penetrating clearance hole; and a connection layer that covers the surface of the aluminum substrate and is self-contained. The inner layer is composed of a zinc film, a nickel plating layer and a first copper plating layer; the insulating layer is treated with black oxide on the surface of the connecting layer that covers the surface side of the aluminum substrate and the gap hole, and is passed through the black oxide layer. The connection layer treated with oxide is connected to the aluminum substrate; the through hole is formed on the insulating layer where the gap hole is located and the diameter is smaller than the gap hole; the copper circuit is formed on the outer surface of the insulating layer; the second copper plating layer, It is formed on the back side of the aluminum substrate; and has a conductive path connecting the copper circuit and the second copper plating layer in the through hole.

Patent Document 2 discloses a solid electrolytic capacitor including a laminate in which a capacitor element is laminated, and the capacitor element has an anode body having a porous layer on the surface of an anode core, and an anode body provided on the surface of the porous layer. A dielectric layer, a solid electrolyte layer disposed on the surface of the dielectric layer, and a cathode portion disposed on the surface of the solid electrolyte layer; an outer casing covering the laminate; and an anode external electrode disposed on the first end surface of the outer casing. , and is electrically connected to the anode core; and the cathode external electrode is disposed on the second end face facing the first end face of the exterior body, and is electrically connected to the cathode portion; the above-mentioned solid electrolytic capacitor is characterized by: On the first end surface side of the body, the end surface of the anode core is introduced inward relative to the end surface of the porous layer, and the distance between the end surface of the anode core and the inner surface of the anode external electrode is 0.01 μm or more and 20 μm or less, and is drawn out A conductor connects the end surface of the anode core to the inner surface of the anode external electrode. [Prior technical literature] [Patent Document]

[Patent Document 1] Japanese Patent Application Laid-Open No. 8-321666 [Patent Document 2] Japanese Patent Application Publication No. 2020-53588

[Problem to be solved by the invention]

In the printed wiring board described in Patent Document 1, since the aluminum substrate used as the conductive path is a bulk substrate, the aluminum substrate has a porous layer on the surface of the aluminum core like the solid electrolytic capacitor described in Patent Document 2. Compared with the situation, it is difficult to reduce the connection resistance between the aluminum substrate and the connection layer. Therefore, even if the structure of the printed wiring board described in Patent Document 1 is used for a capacitor, it is difficult to improve reliability.

On the other hand, in the solid electrolytic capacitor described in Patent Document 2, an anode body having a porous layer on the surface of the anode core is used. However, in the solid electrolytic capacitor described in Patent Document 2, when the lead-out conductor is provided, the end surface of the anode core is subjected to plating treatment represented by zincate treatment. Therefore, by this plating treatment, the porous layer is easily eroded. Therefore, in the solid electrolytic capacitor described in Patent Document 2, defects are likely to occur in the porous layer, and it is difficult to improve reliability. Furthermore, in the solid electrolytic capacitor described in Patent Document 2, the end surface of the porous layer and the inner surface of the anode external electrode are not metal-bonded. Therefore, it is difficult to reduce the connection resistance between the porous layer and the anode external electrode, and it is difficult to improve reliability.

The present invention is made to solve the above-mentioned problems, and aims to provide a capacitor with excellent reliability. [Means to solve problems]

The capacitor of the present invention is characterized in that it includes: a capacitor layer having a capacitor portion; and a through-hole conductor provided so as to penetrate the capacitor portion in the thickness direction of the capacitor layer; and the capacitor portion has: on at least one main surface An anode plate having a porous layer, a dielectric layer disposed on the surface of the above-mentioned porous layer, and a cathode layer disposed on the surface of the above-mentioned dielectric layer; the above-mentioned through-hole conductor includes a first through-hole conductor, which is disposed on At least the inner wall surface of the first through hole penetrating the capacitor part in the thickness direction; the first through hole conductor is electrically connected to the end surface of the anode plate, and the end surface of the anode plate is in a plane direction orthogonal to the thickness direction. Facing the inner wall surface of the first through-hole, a first hole is present in the porous layer, and a part of the first through-hole conductor is included inside the first hole. [Effects of the invention]

According to the present invention, a capacitor excellent in reliability can be provided.

Next, the capacitor of the present invention will be described. In addition, the present invention is not limited to the following configurations, and appropriate changes can be made within the scope that does not deviate from the gist of the present invention. In addition, the present invention also includes a plurality of combinations of each of the preferred configurations described below.

The capacitor of the present invention includes: a capacitor layer having a capacitor part; and a through-hole conductor provided so as to penetrate the capacitor part in the thickness direction of the capacitor layer.

Hereinafter, a capacitor array in the form of an array is shown in the figure as an example of the capacitor of the present invention, and an example of the capacitor of the present invention is explained.

FIG. 1 is a schematic perspective view of a capacitor array in the form of an array as an example of the capacitor of the present invention.

The capacitor array 1 shown in FIG. 1 includes a capacitor layer 10 and a through-hole conductor 60 .

The capacitor layer 10 may have a plurality of capacitor parts 30 as shown in FIG. 1 , or may have one capacitor part 30 .

When the capacitor layer 10 has a plurality of capacitor portions 30, it is preferable that the plurality of capacitor portions 30 are divided by a plurality of through portions and arranged planarly. In addition, the plurality of capacitor portions 30 each constitute a capacitor.

When the capacitor layer 10 has a plurality of capacitor portions 30, the plurality of capacitor portions 30 may be arranged in a linear shape or in a planar shape. In addition, the plurality of capacitor units 30 may be arranged regularly or irregularly. The plurality of capacitor portions 30 may all be the same in size, planar shape, etc., or may be partially or entirely different.

The capacitor layer 10 may include two or more types of capacitor portions 30 with different areas.

The capacitor layer 10 may also include a capacitor portion 30 whose planar shape is not rectangular. In this specification, rectangle means square or rectangle. Therefore, the capacitor layer 10 may include a capacitor portion 30 whose planar shape is, for example, a polygonal shape other than a rectangular shape such as a quadrangle, a triangle, a pentagon, or a hexagon, a shape including a curved portion, a circle, an ellipse, or the like. In this case, the capacitor layer 10 may include two or more types of capacitor portions 30 with different planar shapes. In addition, the capacitor layer 10 may or may not include the capacitor part 30 whose planar shape is rectangular, in addition to the capacitor part 30 whose planar shape is not rectangular.

When the capacitor layer 10 has one capacitor part 30, the capacitor array 1 corresponds to a single capacitor.

The through-hole conductor 60 , more specifically, the first through-hole conductor 62 and the second through-hole conductor 64 are each provided so as to penetrate the capacitor portion 30 in the thickness direction T of the capacitor layer 10 .

In the capacitor of the present invention, the capacitor part has an anode plate with a porous layer on at least one main surface, a dielectric layer provided on the surface of the porous layer, and a cathode layer provided on the surface of the dielectric layer.

FIG. 2 is a schematic cross-sectional view showing an example of a cross-section of the capacitor array along the line segment A1-A2 in FIG. 1 . In addition, the line segment A1-A2 in FIG. 2 corresponds to the line segment A1-A2 in FIG. 1 .

As shown in FIG. 2 , the capacitor part 30 includes an anode plate 31 , a dielectric layer 35 , and a cathode layer 36 .

The anode plate 31 has a core portion 32 and a porous layer 34 .

The core 32 preferably contains metal, preferably a valve metal.

Examples of the valve metal include: metal monomers such as aluminum, tantalum, niobium, titanium, and zirconium; alloys containing at least one of these metal monomers; and the like. Among them, aluminum or aluminum alloy is preferred.

The porous layer 34 is provided on at least one main surface of the core 32 . That is, the porous layer 34 may be provided on only one main surface of the core part 32, or may be provided on both main surfaces of the core part 32 as shown in FIG. 2. As described above, the anode plate 31 has the porous layer 34 on at least one main surface.

The porous layer 34 is preferably an etching layer formed by etching the surface of the anode plate 31 .

Details of the internal structure of the porous layer 34 will be described later.

The shape of the anode plate 31 is preferably flat plate shape, more preferably foil shape. As mentioned above, in this specification, "plate shape" also includes "foil shape".

The dielectric layer 35 is disposed on the surface of the porous layer 34 . More specifically, the dielectric layer 35 is provided along the surface (contour) of each pore present in the porous layer 34 .

The dielectric layer 35 is preferably composed of an oxide film of the valve metal. For example, when the anode plate 31 is an aluminum foil, the anode plate 31 is subjected to an anodizing treatment (also called a chemical conversion treatment) in an aqueous solution containing ammonium adipate or the like to form the oxidation layer that becomes the dielectric layer 35 membrane. Since the dielectric layer 35 is formed along the surface of the porous layer 34 , pores (recesses) are provided in the dielectric layer 35 .

The cathode layer 36 is disposed on the surface of the dielectric layer 35 .

As shown in FIG. 2 , the cathode layer 36 preferably includes a solid electrolyte layer 36A provided on the surface of the dielectric layer 35 and a conductor layer 36B provided on the surface of the solid electrolyte layer 36A.

Examples of materials constituting the solid electrolyte layer 36A include conductive polymers such as polypyrroles, polythiophenes, and polyanilines. Among them, polythiophenes are preferred, and poly(3,4-ethylene dioxythiophene) (PEDOT) is particularly preferred. In addition, the conductive polymer may also contain dopants such as polystyrene sulfonic acid (PSS).

The solid electrolyte layer 36A preferably includes an inner layer filling the pores (concave portions) of the dielectric layer 35 and an outer layer covering the surface of the dielectric layer 35 .

Conductor layer 36B preferably includes at least one of a conductive resin layer and a metal layer. That is, the conductor layer 36B may include only a conductive resin layer, may include only a metal layer, or may include both a conductive resin layer and a metal layer.

Examples of the conductive resin layer include a conductive adhesive layer containing at least one conductive filler selected from the group consisting of silver fillers, copper fillers, nickel fillers, and carbon fillers.

Examples of the metal layer include metal plating films, metal foils, and the like. The metal layer preferably contains at least one metal selected from the group consisting of nickel, copper, silver, and an alloy containing at least one of these metals as a main component.

In this specification, the main component means the elemental component with the largest weight proportion.

The conductor layer 36B may include, for example, a carbon layer provided on the surface of the solid electrolyte layer 36A, and a copper layer provided on the surface of the carbon layer.

The carbon layer is formed in a predetermined area by applying carbon paste to the surface of the solid electrolyte layer 36A using, for example, a sponge transfer method, a screen printing method, a dispenser coating method, an inkjet printing method, or the like.

The copper layer is formed in a predetermined area by applying copper paste to the surface of the carbon layer using, for example, a sponge transfer method, a screen printing method, a jet coating method, a dispenser coating method, an inkjet printing method, or the like.

As described above, the capacitor part 30 shown in FIG. 2 has the anode plate 31 with the porous layer 34 on at least one main surface, the dielectric layer 35 provided on the surface of the porous layer 34, and the dielectric layer 35 provided on the surface of the porous layer 34. cathode layer 36 on the surface of layer 35. Thereby, the capacitor part 30 constitutes an electrolytic capacitor. In addition, when the cathode layer 36 has the solid electrolyte layer 36A, the capacitor portion 30 constitutes a solid electrolytic capacitor.

In the capacitor of the present invention, the through-hole conductor includes a first through-hole conductor, which is provided on at least the inner wall surface of the first through-hole that penetrates the capacitor part in the thickness direction; the first through-hole conductor is electrically connected to the end surface of the anode plate, and the first through-hole conductor is electrically connected to the end surface of the anode plate. The end surface of the anode plate faces the inner wall surface of the first through hole in a surface direction orthogonal to the thickness direction.

As shown in FIG. 2 , the first through-hole conductor 62 is provided to penetrate the capacitor portion 30 in the thickness direction T of the capacitor layer 10 . More specifically, the first through-hole conductor 62 is provided on at least the inner wall surface of the first through-hole 63 penetrating the capacitor portion 30 in the thickness direction T.

The first through-hole conductor 62 is electrically connected to the end surface of the anode plate 31 which faces the inner wall surface of the first through-hole 63 in the surface direction U perpendicular to the thickness direction T. In the example shown in FIG. 2 , the first through-hole conductor 62 is connected to the end surface of the anode plate 31 .

In addition, there are a plurality of plane directions U, but one of them is representatively shown in FIGS. 1 and 2 .

On the end surface of the anode plate 31 electrically connected to the first through-hole conductor 62, the core portion 32 and the porous layer 34 are exposed. Therefore, in addition to the core portion 32 , electrical connection with the first through-hole conductor 62 is also formed in the porous layer 34 .

The first through-hole conductor 62 is formed as follows, for example. First, the first through-hole 63 is formed by drilling, laser processing, or the like on the portion where the first through-hole conductor 62 is to be formed. Then, the first through-hole conductor 62 is formed by metallizing the inner wall surface of the first through-hole 63 with a low-resistance metal such as copper, gold, or silver. When forming the first through-hole conductor 62 , for example, by metallizing the inner wall surface of the first through-hole 63 using electroless copper plating, electrolytic copper plating, or the like, processing can be facilitated. In addition, as a method of forming the first through-hole conductor 62 , in addition to metallizing the inner wall surface of the first through-hole 63 , the first through-hole 63 may also be filled with metal, a composite material of metal and resin, or the like. method.

In the capacitor of the present invention, the first through-hole conductor has an anode connection layer located on the end surface side of the anode plate, and the anode connection layer is preferably in contact with the end surface of the anode plate.

As shown in FIG. 2 , the first through-hole conductor 62 preferably has an anode connection layer 68 located on the end surface side of the anode plate 31 . Furthermore, as shown in FIG. 2 , the anode connecting layer 68 is preferably in contact with the end surface of the anode plate 31 .

Since the first through-hole conductor 62 has the anode connection layer 68 located on the end surface side of the anode plate 31, the anode connection layer 68 serves as a barrier layer for the anode plate 31, more specifically, as a barrier layer for the core portion 32 and the porous layer 34. It functions as a barrier layer. By using the anode connecting layer 68 as described above, the dissolution of the anode plate 31 caused by the chemical solution treatment for forming the conductive portion 20 and the like described later is suppressed, and the penetration of the chemical solution into the capacitor portion 30 is suppressed. Therefore, the reliability of the capacitor array 1 is easily improved, and the reliability of the capacitors constituting the capacitor array 1 is easily improved.

As shown in FIG. 2 , the anode connection layer 68 may also include a first anode connection layer 68A and a second anode connection layer 68B in order from the end surface side of the anode plate 31 .

Among the anode connecting layers 68 , for example, the first anode connecting layer 68A may be a layer containing zinc as its main component, and the second anode connecting layer 68B may be a layer containing nickel or copper as its main component. In this case, the first anode connection layer 68A is formed on the end surface of the anode plate 31 by, for example, zincate treatment to replace and precipitate zinc, and then the second anode connection layer 68B is formed by, for example, electroless nickel plating. It is formed on the surface of the first anode connection layer 68A by processing or electroless copper plating. In addition, the first anode connection layer 68A may disappear when the second anode connection layer 68B is formed. In this case, the anode connection layer 68 may be composed of only the second anode connection layer 68B.

The anode connection layer 68 preferably includes a layer containing nickel as its main component. In this case, damage to the metal (for example, aluminum) constituting the anode plate 31 is reduced, so the barrier properties of the anode connecting layer 68 to the anode plate 31 are easily improved.

As shown in FIG. 2 , in the thickness direction T, the size of the anode connecting layer 68 is preferably larger than the size of the anode plate 31 . In this case, since the entire end surface of the anode plate 31 is covered by the anode connection layer 68, the barrier property of the anode connection layer 68 to the anode plate 31 is easily improved.

In the thickness direction T, the size of the anode connecting layer 68 is preferably greater than 100% and less than 200% of the size of the anode plate 31 .

In the thickness direction T, the size of the anode connecting layer 68 may be the same as the size of the anode plate 31 , or may be smaller than the size of the anode plate 31 .

In addition, the first through-hole conductor 62 may not have the anode connection layer 68 located on the end surface side of the anode plate 31 .

In the capacitor of the present invention, when viewed from the thickness direction, the first through-hole conductor preferably extends over the entire circumference of the first through-hole and is electrically connected to the end surface of the anode plate.

As shown in FIGS. 1 and 2 , when viewed from the thickness direction T, the first through-hole conductor 62 preferably extends over the entire circumference of the first through-hole 63 and is electrically connected to the end surface of the anode plate 31 . As shown in FIG. 2 , when the first through-hole conductor 62 has the anode connection layer 68 located on the end surface side of the anode plate 31 , when viewed from the thickness direction T, the anode connection layer 68 in the first through-hole conductor 62 The other parts are preferably connected to the anode connection layer 68 over the entire circumference of the first through hole 63 . In this case, in the first through-hole conductor 62, the contact area between the anode connecting layer 68 and the portion other than the anode connecting layer 68 increases, so the connection resistance between the anode connecting layer 68 and the portion other than the anode connecting layer 68 is likely to decrease. As a result, the connection resistance between the first through-hole conductor 62 and the anode plate 31 tends to decrease, and therefore the equivalent series resistance (ESR) of the capacitor portion 30 tends to decrease. Furthermore, in the first through-hole conductor 62, the adhesion between the anode connecting layer 68 and the portion other than the anode connecting layer 68 is easily improved, so the thermal stress caused by the thermal stress between the anode connecting layer 68 and the portion other than the anode connecting layer 68 increases. It is difficult for defects such as peeling between the layers to occur.

As shown in FIG. 2 , the capacitor array 1 , more specifically, the capacitors constituting the capacitor array 1 preferably further have a conductive portion 20 electrically connected to the first through-hole conductor 62 . In the example shown in FIG. 2 , the conductive portion 20 is provided on the surface of the first through-hole conductor 62 . The conductive portion 20 can function as the capacitor array 1 , more specifically, as a connection terminal of the capacitor portion 30 .

Examples of the constituent material of the conductive portion 20 include low-resistance metals such as silver, gold, and copper. In this case, the conductive portion 20 is formed by, for example, plating the surface of the first through-hole conductor 62 .

In order to improve the adhesion between the conductive part 20 and other components, here, in order to improve the adhesion between the conductive part 20 and the first through-hole conductor 62, the constituent material of the conductive part 20 may also be selected from silver filler, copper A mixed material of at least one conductive filler and resin from the group consisting of fillers, nickel fillers and carbon fillers.

As shown in FIGS. 1 and 2 , the capacitor array 1 , more specifically the capacitors constituting the capacitor array 1 , preferably further includes a first resin filling portion 29A, which is formed by filling the first through hole 63 with a resin material. . In the example shown in FIGS. 1 and 2 , the first resin filling portion 29A is provided in the space surrounded by the first through-hole conductor 62 on the inner wall surface of the first through-hole 63 . If the space in the first through-hole 63 is eliminated by providing the first resin filling portion 29A, the occurrence of delamination of the first through-hole conductor 62 is suppressed.

The thermal expansion coefficient of the first resin filled portion 29A is preferably greater than the thermal expansion coefficient of the first through-hole conductor 62 . More specifically, the thermal expansion coefficient of the resin material filled in the first through-hole 63 is preferably greater than the thermal expansion coefficient of the constituent material of the first through-hole conductor 62 (for example, copper). In this case, since the resin material filled in the first resin filling part 29A, more specifically, the first through hole 63 expands in a high temperature environment, the first through hole conductor 62 passes from the first through hole 63 The inner side faces the outer side and is pressed against the inner wall surface of the first through-hole 63, so the occurrence of delamination of the first through-hole conductor 62 is sufficiently suppressed.

The thermal expansion coefficient of the first resin filling portion 29A may be the same as the thermal expansion coefficient of the first through-hole conductor 62 , or may be smaller than the thermal expansion coefficient of the first through-hole conductor 62 . More specifically, the thermal expansion coefficient of the resin material filled in the first through-hole 63 may be the same as the thermal expansion coefficient of the material constituting the first through-hole conductor 62 , or may be smaller than the thermal expansion coefficient of the material constituting the first through-hole conductor 62 . .

The capacitor array 1, more specifically the capacitors constituting the capacitor array 1, may not have the first resin filling portion 29A. In this case, the first through-hole conductor 62 is preferably provided not only on the inner wall surface of the first through-hole 63 but also on the entire interior of the first through-hole 63 .

As shown in FIG. 2 , the capacitor layer 10 preferably further has an insulating portion 25 provided on the surface of the capacitor portion 30 .

As shown in FIG. 2 , the insulating part 25 preferably includes a first insulating part 25A provided on the surface of the capacitor part 30 and a second insulating part 25B provided on the surface of the first insulating part 25A.

Examples of the constituent materials of the first insulating part 25A and the second insulating part 25B include resin materials such as epoxy, phenol, and polyimide, or resin materials such as epoxy, phenol, and polyimide combined with silicon dioxide, oxide, etc. Mixed materials with inorganic fillers such as aluminum, etc.

The constituent materials of the first insulating part 25A and the second insulating part 25B may be the same as each other, or may be different from each other.

Next, the internal structure of the porous layer will be described.

In the capacitor of the present invention, the first hole is present in the porous layer, and a part of the first through-hole conductor is included inside the first hole.

FIG. 3 is a schematic cross-sectional view showing an enlarged state of the area Z in FIG. 2 .

In addition, although not shown in FIG. 3 , the dielectric layer 35 is provided on the surface of the porous layer 34 , more specifically, along the surface (contour) of each pore present in the porous layer 34 .

As shown in FIG. 3 , first pores 34A are present in the porous layer 34 .

A part of the first through-hole conductor 62 is included inside the first hole 34A. In the example shown in FIG. 3 , a part of the anode connection layer 68 , more specifically, a part of the first anode connection layer 68A is included inside the first hole 34A. Thereby, the adhesion between the porous layer 34 and the first through-hole conductor 62, more specifically, the adhesion between the porous layer 34 and the anode connection layer 68 is easily improved. As a result, defects such as peeling between the porous layer 34 and the first through-hole conductor 62 , more specifically, peeling between the porous layer 34 and the anode connection layer 68 are less likely to occur, thereby improving the reliability of the capacitor array 1 Furthermore, the reliability of the capacitors constituting the capacitor array 1 is improved.

The existence of the first hole in the porous layer containing a part of the first through-hole conductor is confirmed, for example, as follows. First, by cutting the capacitor, here the capacitor array, through the center of the first through-hole when viewed from the thickness direction as shown in FIG. 2 and along the conductor including the porous layer and the first through-hole The cross section of the capacitor in the thickness direction is exposed. Next, a scanning electron microscope (SEM) is used to photograph the exposed cross-section of the capacitor. Here, an enlarged image of the porous layer as shown in Figure 3 in the exposed cross-section of the capacitor array is photographed. Then, element mapping is performed on the obtained magnified image using wavelength dispersion X-ray spectroscopy (WDX), energy dispersion X-ray spectroscopy (EDX), etc., thereby confirming that the porous layer contains the third 1 through-hole conductor is part of the first hole.

In the capacitor of the present invention, it is preferable that the first hole is present on the end surface of the porous layer constituting the end surface of the anode plate.

As shown in FIG. 3 , the first hole 34A is preferably present in the end surface of the porous layer 34 constituting the end surface of the anode plate 31 . In this case, since the first hole 34A is exposed on the end surface of the porous layer 34, it can be said that the porous layer is in a state before a part of the first through-hole conductor 62 is included in the first hole 34A. The end surface of 34 becomes finely concave and convex.

When the end surface of the porous layer 34 becomes finely uneven, the first through-hole conductor 62 connected to the end surface of the porous layer 34 enters the recessed portion of the end surface of the porous layer 34, more specifically, enters the first hole 34A. middle. For example, as shown in FIG. 3 , when the first through-hole conductor 62 has the anode connecting layer 68 located on the end surface side of the anode plate 31 , if the end surface of the porous layer 34 becomes finely uneven, the anode connecting layer 68 , more specifically, the first anode connecting layer 68A enters the recessed portion of the end surface of the porous layer 34 , and more specifically, enters the first hole 34A. Therefore, the adhesion between the porous layer 34 and the anode connecting layer 68 can be more easily improved. As a result, defects such as peeling between the porous layer 34 and the anode connecting layer 68 are less likely to occur, so the reliability of the capacitor array 1 is further improved, and the reliability of the capacitors constituting the capacitor array 1 is further improved.

In the capacitor of the present invention, a second hole is further provided in the porous layer, and an insulating material is included inside the second hole. The porous layer includes an insulating region where the insulating material is present inside the second hole, and is insulating in the plane direction. The first through-hole conductor-side outer end of the region is preferably located on the opposite side to the first through-hole conductor with respect to the first through-hole conductor-side outer end of the porous layer.

As shown in FIG. 3 , second pores 34B further exist in the porous layer 34 .

An insulating material 34C is included inside the second hole 34B. Thereby, the porous layer 34 includes the insulating region where the insulating material 34C exists inside the second hole 34B. Since the porous layer 34 includes an insulating region, the insulation between the anode plate 31 and the cathode layer 36 is ensured and short circuit between the two is prevented.

In FIG. 3 , in the porous layer 34 , the hatched area of the insulating material 34C corresponds to the insulating area. As described above, the insulating region is not a region that exists continuously in the porous layer 34 but is a region that exists discontinuously.

As shown in FIGS. 1 and 2 , the insulating area where the insulating material 34C exists is preferably disposed around the first through-hole conductor 62 . In this case, the insulation between the anode plate 31 and the cathode layer 36 is fully ensured, and short circuit between the two is fully prevented.

Examples of the insulating material 34C include resin materials such as epoxy, phenol, and polyimide, or mixed materials of resin materials such as epoxy, phenol, and polyimide and inorganic fillers such as silicon dioxide and alumina.

As shown in FIG. 3 , in the plane direction U, the outer end E1 of the insulating region on the first through-hole conductor 62 side is located closer to the first through-hole conductor 62 than the outer end E2 of the porous layer 34 on the first through-hole conductor 62 side. The side opposite the hole conductor 62 (here the left side). Thereby, the surface area of the portion including the material (for example, aluminum) other than the insulating material 34C on the end surface of the porous layer 34 constituting the end surface of the anode plate 31 increases.

If the surface area of the portion containing materials other than the insulating material 34C on the end surface of the porous layer 34 is increased, the coating properties of the first through-hole conductor 62 connected to the end surface of the porous layer 34 will be improved. For example, as shown in FIG. 3 , when the first through-hole conductor 62 has the anode connection layer 68 located on the end surface side of the anode plate 31 , if the end surface of the porous layer 34 includes a portion of material other than the insulating material 34C When the surface area of the anode connecting layer 68 is increased, the coating properties of the anode connecting layer 68, more specifically, the first anode connecting layer 68A are improved. If the coverage of the anode connecting layer 68 on the end surface of the porous layer 34 is improved, the barrier properties of the anode connecting layer 68 on the porous layer 34 will be improved, and the barrier properties of the anode connecting layer 68 on the anode plate 31 will also be improved. As a result, the dissolution of the anode plate 31 produced during the chemical solution treatment for forming the conductive portion 20 and the like is suppressed, and the penetration of the chemical solution into the capacitor portion 30 is suppressed. Therefore, the reliability of the capacitor array 1 is further improved, and the reliability of the capacitors constituting the capacitor array 1 is further improved.

If the surface area of the end surface of the porous layer 34 including materials other than the insulating material 34C is increased, electrical connection with the first through-hole conductor 62 in the porous layer 34 in addition to the core portion 32 can be easily performed. , therefore the connection resistance between the first through-hole conductor 62 and the anode plate 31 is reduced. As a result, the equivalent series resistance of the capacitor part 30 is reduced, so the reliability of the capacitor array 1 is further improved, and the reliability of the capacitors constituting the capacitor array 1 is further improved.

The outer end of the first through-hole conductor side of the insulating region is relative to the center of the first through-hole when viewed from the thickness direction as shown in FIG. 2 and along the thickness direction including the porous layer and the first through-hole conductor. The cross section of the capacitor is set as follows, for example. First, by cutting off the capacitor, in this case the capacitor array, the above-mentioned cross section as shown in FIG. 2 is exposed. Next, a scanning electron microscope is used to photograph the exposed cross-section of the capacitor. Here, an enlarged image of the porous layer shown in Figure 3 in the exposed cross-section of the capacitor array is photographed. Then, by performing element mapping using wavelength dispersion X-ray spectroscopy on the obtained magnified image, the insulating region where the insulating material exists is confirmed within the porous layer. Furthermore, in the plane direction, the end of the insulating region closest to the first through-hole conductor side is set as the outer end of the insulating region on the first through-hole conductor side.

The outer end of the porous layer on the first through-hole conductor side is set as follows, for example. First, by performing element mapping using wavelength dispersion X-ray spectroscopy on the enlarged image obtained by the above method, the entire range of the porous layer including the insulating region is confirmed. Furthermore, in the plane direction, the end of the porous layer closest to the first through-hole conductor side is set as the outer end of the porous layer on the first through-hole conductor side.

In the capacitor of the present invention, in the planar direction, the outer end of the first through-hole conductor side of the insulating region set by the above method is longer than the outer end of the first through-hole conductor side of the porous layer set by the above method. In other words, it suffices to be located on the opposite side to the first through-hole conductor.

In the capacitor of the present invention, for example, during the production of the capacitor, here, during the production of the capacitor array, the insulating material is filled in the pores inside the porous layer, and then plasma treatment is performed. The insulating material near the end surface of the porous layer is selectively removed, so that the surface direction is adjusted to: the outer end of the first through-hole conductor side of the insulating region is larger than the outer end of the first through-hole conductor side of the porous layer, Located on the opposite side to the first through-hole conductor.

In the plane direction U, the distance between the outer end E1 of the insulating region on the first through-hole conductor 62 side and the outer end E2 of the porous layer 34 on the first through-hole conductor 62 side is preferably greater than 0 μm and less than 20 μm.

In the capacitor of the present invention, when the first region in the porous layer is set to cover the range from the outer end on the side of the first through-hole conductor to a position separated by the thickness of the porous layer in the plane direction, the first region The area ratio of the voids is preferably 0 area% or more and 30 area% or less.

As shown in FIG. 3 , in the porous layer 34 , when the first through-hole conductor 62 side outer end E2 is set to cover the range to a position P1 separated by the thickness of the porous layer 34 in the plane direction U, In the case of region R1, the area ratio of the voids in the first region R1 is preferably 0 area% or more and 30 area% or less. That is, in the first region R1 near the end surface of the porous layer 34, the area ratio of voids excluding all materials including the first through-hole conductor 62 and the insulating material 34C is preferably as low as 0 area % or more, and Less than 30% of area. Therefore, when the first through-hole conductor 62 connected to the end surface of the porous layer 34, more specifically the anode connecting layer 68, is formed by plating treatment represented by zincate treatment, the porous Over-etching near the end surface of layer 34 is suppressed. As a result, corrosion caused by chlorine, water, etc. remaining inside the porous layer 34 is suppressed, so the reliability of the capacitor array 1 is further improved, and the reliability of the capacitors constituting the capacitor array 1 is further improved.

When the area ratio of the voids in the first region R1 exceeds 30 area %, the first through-hole conductor 62 connected to the end surface of the porous layer 34 is formed by plating treatment represented by zincate treatment. More specifically, in the case of the anode connection layer 68 , the vicinity of the end surface of the porous layer 34 is over-etched by passing through the voids, thereby creating a larger space inside the porous layer 34 . As a result, corrosion caused by chlorine, water, etc. remaining inside the porous layer 34 occurs, so the reliability of the capacitor array 1 is reduced, and the reliability of the capacitors constituting the capacitor array 1 is also reduced.

The area ratio of the void in the first region is relative to the capacitor along the thickness direction including the porous layer and the first through-hole conductor as shown in FIG. 2 through the center of the first through-hole when viewed from the thickness direction. The profile is set as follows, for example. First, by cutting off the capacitor, in this case the capacitor array, the above-mentioned cross section as shown in FIG. 2 is exposed. Next, a scanning electron microscope is used to photograph the exposed cross-section of the capacitor. Here, an enlarged image of the porous layer shown in Figure 3 in the exposed cross-section of the capacitor array is photographed. Then, element mapping is performed using wavelength dispersion X-ray spectroscopy on the obtained enlarged image, thereby confirming the region where voids exist within the porous layer. At this time, the voids exposed at the end surface of the porous layer are also included in the region where the voids exist. On the other hand, use the above method to set the outer end of the first through-hole conductor side of the porous layer, and confirm the thickness of the porous layer from the outer end of the first through-hole conductor side to the distance away from the porous layer in the plane direction. The first area of the range up to the position of the degree. Furthermore, the area ratio of the area where the void exists in the first area is measured using image analysis software. Then, the measured area ratio is set as the area ratio of the voids in the first region.

In addition, in the above method, the area where the void exists is confirmed by performing elemental mapping that combines a scanning electron microscope and wavelength dispersion X-ray spectroscopy on the exposed cross section of the capacitor. However, a scanning electron microscope can also be used. Elemental mapping and other analysis methods combined with energy dispersive X-ray spectroscopy are used to confirm the areas where voids exist.

In FIG. 3 , a void 34V excluding all materials including the first through-hole conductor 62 and the insulating material 34C is shown as the void. However, in addition to the void 34V, the void also includes the first hole 34A, The second hole 34B generally includes the inside of a hole of a certain material, that is, an empty portion that is not completely filled with material.

In the capacitor of the present invention, for example, when manufacturing the capacitor, here, when manufacturing the capacitor array, it is preferable to fill the pores inside the porous layer with an insulating material, and then use plasma treatment or the like to fill the pores. The insulating material present near the end surface of the porous layer is selectively removed, and the area ratio of the voids in the first region is adjusted to 0 area% or more and 30 area% or less.

In the capacitor of the present invention, the porous layer is set to a position extending from the outer end of the insulating region on the opposite side to the first through-hole conductor toward the first through-hole conductor and away from the porous layer in the plane direction. When the area ratio of the voids in the second area is the second area, the area ratio of the voids in the second area is preferably larger than the area ratio of the voids in the first area.

As shown in FIG. 3 , in the porous layer 34 , when it is set from the outer end E3 of the insulating region on the opposite side to the first through-hole conductor 62 and away from the porous layer 34 in the plane direction U toward the first through-hole conductor 62 When the thickness of the second region R2 is the range from the position P2, the area ratio of the voids in the second region R2 is preferably larger than the area ratio of the voids in the first region R1. In this case, as shown in FIG. 3 , even if there is an insulating region in the second region R2 , the area ratio of the voids in the second region R2 is larger than the area ratio of the voids in the first region R1 . That is, although the insulation region exists in the second region R2, the range of the insulation region in the second region R2 can be said to be smaller than the range of the insulation region in the first region R1.

Here, when the insulating material 34C is filled in the second hole 34B, for example, the insulating material 34C is provided on the surface of the porous layer 34 (dielectric layer 35 ), so that the insulating material 34C is removed from the porous layer 34 It penetrates along the thickness direction T from the surface, more specifically, from the surface of the porous layer 34 toward the core 32 .

At this time, of the insulating material 34C provided on the surface of the porous layer 34, the portion located on the opposite side to the first through-hole conductor 62 is on the surface of the porous layer 34 and faces toward the opposite side to the first through-hole conductor 62. Expands in surface direction U.

Furthermore, of the insulating material 34C provided on the surface of the porous layer 34, the portion located on the opposite side to the first through-hole conductor 62 penetrates into the porous layer 34 in the thickness direction T while facing the first through-hole conductor 62. The hole conductor 62 oozes out in the surface direction U on the opposite side. When the insulating material 34C oozes out in the plane direction U as described above, its infiltration width decreases from the surface of the porous layer 34 toward the core 32 . As a result, an exuded region of the insulating material 34C is formed as a region near the outer end E3 on the opposite side to the first through-hole conductor 62 among the insulating regions in the porous layer 34 .

As described above, although the insulating region exists in the second region R2, the insulating region existing in the second region R2 includes the exuded region of the insulating material 34C. Therefore, the range of the insulation region in the second region R2 is smaller than the range of the insulation region in the first region R1. That is, the area ratio of the voids in the second region R2 is larger than the area ratio of the voids in the first region R1.

Based on the above, when the area ratio of the voids in the second region R2 is greater than the area ratio of the voids in the first region R1, it can be said that there is an exudation region of the insulating material 34C formed by the above method in the second region R2. .

The area ratio of the void in the second region is relative to the capacitor along the thickness direction including the porous layer and the first through-hole conductor when viewed through the center of the first through-hole as shown in FIG. 2 The cross section is set as follows, for example. First, the area where voids exist is confirmed in the porous layer using the above method. On the other hand, using the above method, an insulating region is confirmed in the porous layer, and the end of the insulating region located on the opposite side to the first through-hole conductor in the plane direction is set as the end of the insulating region and the first through-hole conductor. The outer end on the opposite side. Furthermore, in the porous layer, a second region covering the range from the outer end of the insulating region on the opposite side to the first through-hole conductor to the position facing the first through-hole conductor and separated in the plane direction by the thickness of the porous layer is confirmed. . Furthermore, image analysis software is used to measure the area ratio of the area where the void exists in the second area. Then, the measured area ratio is set as the area ratio of the voids in the second region.

Relative to the area ratio of the voids in the second region R2, the area ratio of the voids in the first region R1 is preferably greater than 0% and less than 80%.

Although not shown in FIG. 3 , in addition to the first hole 34A, the second hole 34B, and the void 34V, the porous layer 34 may also contain materials other than the first through-hole conductor 62 and the insulating material 34C. , such as the holes of the solid electrolyte layer 36A.

In the capacitor of the present invention, it is preferable that the through-hole conductor further includes a second through-hole conductor provided on at least the inner wall surface of the second through-hole of the capacitor portion in which the first through-hole conductor is provided, and 2 The through-hole conductor is electrically connected to the cathode layer.

FIG. 4 is a schematic cross-sectional view showing an example of a cross-section of the capacitor array along the line segment B1-B2 in FIG. 1 . In addition, the line segment B1-B2 in Figure 4 corresponds to the line segment B1-B2 in Figure 1 .

As shown in FIG. 4 , the capacitor array 1 , more specifically the capacitors constituting the capacitor array 1 , preferably further includes a second through-hole conductor 64 .

As shown in FIG. 4 , the second through-hole conductor 64 is provided to penetrate the capacitor portion 30 in the thickness direction T of the capacitor layer 10 . More specifically, the second through-hole conductor 64 is preferably provided on at least the inner wall surface of the second through-hole 65 penetrating the capacitor portion 30 shown in FIG. 2 and the like in which the first through-hole conductor 62 is provided in the thickness direction T. superior.

As shown in FIG. 4 , the second through-hole conductor 64 is preferably electrically connected to the cathode layer 36 . Here, in the example shown in FIG. 4 , the conductive portion 40 is provided on the surface of the second through-hole conductor 64 and functions as the capacitor array 1 , more specifically, as a connection terminal of the capacitor portion 30 . In the example shown in FIG. 4 , the via-hole conductor 42 is provided so as to penetrate the insulating portion 25 in the thickness direction T and connect to the conductive portion 40 and the cathode layer 36 . Therefore, in the example shown in FIG. 4 , the second through-hole conductor 64 is electrically connected to the cathode layer 36 via the conductive portion 40 and the through-hole conductor 42 . In this case, the capacitor array 1 can be miniaturized, and the capacitors constituting the capacitor array 1 can also be miniaturized.

The second through-hole conductor 64 is formed as follows, for example. First, a through hole is formed by performing drilling processing, laser processing, etc. on the portion where the second through-hole conductor 64 is to be formed. Next, the formed through-hole is filled with the constituent material of the second insulating portion 25B (for example, a resin material) to form an insulating layer. Then, the second through hole 65 is formed by drilling, laser processing, or the like on the formed insulating layer. At this time, by making the diameter of the second through hole 65 smaller than the diameter of the insulating layer, the constituent material of the second insulating portion 25B is present between the just formed through hole and the second through hole 65 . Then, the second through-hole conductor 64 is formed by metallizing the inner wall surface of the second through-hole 65 with a low-resistance metal such as copper, gold, or silver. When forming the second through-hole conductor 64 , for example, by metallizing the inner wall surface of the second through-hole 65 using electroless copper plating, electrolytic copper plating, or the like, processing becomes easier. In addition, as for the method of forming the second through-hole conductor 64, in addition to the method of metallizing the inner wall surface of the second through-hole 65, the second through-hole 65 may also be filled with metal, a composite material of metal and resin, or the like. method.

Examples of the constituent material of the conductive portion 40 include low-resistance metals such as silver, gold, and copper. In this case, the conductive portion 40 is formed by, for example, plating the surface of the second through-hole conductor 64 .

In order to improve the adhesion between the conductive part 40 and other components, here, to improve the adhesion between the conductive part 40 and the second through-hole conductor 64, a filler selected from the group consisting of silver filler, copper filler, nickel filler and carbon filler may also be used. A mixed material of at least one conductive filler and resin in the group is used as the constituent material of the conductive portion 40 .

The through-hole conductor 42 may be made of the same material as the conductive part 40 , for example.

The through-hole conductor 42 is formed, for example, by plating the inner wall surface of a through-hole provided so as to penetrate the insulating portion 25 in the thickness direction T, or by performing heat treatment after filling the conductive paste.

The capacitor array 1, more specifically, the capacitors constituting the capacitor array 1 are preferably as shown in FIGS. 1 and 4, and further have a second resin filling portion 29B in which the second through hole 65 is filled with a resin material. In the example shown in FIGS. 1 and 4 , the second resin filling portion 29B is provided in the space surrounded by the second through-hole conductor 64 on the inner wall surface of the second through-hole 65 . If the space in the second through-hole 65 is eliminated by providing the second resin filling portion 29B, the occurrence of delamination of the second through-hole conductor 64 is suppressed.

The thermal expansion coefficient of the second resin filled portion 29B is preferably greater than the thermal expansion coefficient of the second through-hole conductor 64 . More specifically, the thermal expansion coefficient of the resin material filled in the second through-hole conductor 65 is preferably greater than the thermal expansion coefficient of the constituent material of the second through-hole conductor 64 (for example, copper). In this case, since the resin material filled in the second resin filling part 29B, more specifically, the second through hole 65 expands in a high temperature environment, the second through hole conductor 64 passes from the second through hole The inner side of 65 faces outward and is pressed against the inner wall surface of the second through-hole 65, so the occurrence of delamination of the second through-hole conductor 64 is sufficiently suppressed.

The thermal expansion coefficient of the second resin filling portion 29B may be the same as the thermal expansion coefficient of the second through-hole conductor 64, or may be smaller than the thermal expansion coefficient of the second through-hole conductor 64. More specifically, the thermal expansion coefficient of the resin material filled in the second through-hole 65 may be the same as the thermal expansion coefficient of the material constituting the second through-hole conductor 64 , or may be smaller than the thermal expansion coefficient of the material constituting the second through-hole conductor 64 . .

The capacitor array 1, more specifically the capacitors constituting the capacitor array 1, may not have the second resin filling portion 29B. In this case, the second through-hole conductor 64 is preferably provided not only on the inner wall surface of the second through-hole 65 but also on the entire interior of the second through-hole 65 .

In the capacitor of the present invention, it is preferable that the capacitor layer further includes: a first insulating part provided on the surface of the capacitor part, and a second insulating part provided on the surface of the first insulating part, and the second insulating part is provided on the anode. Extends between the board and the second through-hole conductor.

Like FIG. 2 , as shown in FIG. 4 , the capacitor layer 10 preferably further has an insulating portion 25 provided on the surface of the capacitor portion 30 .

Like FIG. 2 , as shown in FIG. 4 , the insulating part 25 preferably includes a first insulating part 25A provided on the surface of the capacitor part 30 and a second insulating part provided on the surface of the first insulating part 25A. 25B.

That is, the capacitor layer 10 preferably further includes the first insulating part 25A provided on the surface of the capacitor part 30 and the second insulating part 25B provided on the surface of the first insulating part 25A.

When the capacitor layer 10 has the first insulating part 25A and the second insulating part 25B, as shown in FIG. 4 , the second insulating part 25B is preferably extended between the anode plate 31 and the second through-hole conductor 64 . In the example shown in FIG. 4 , the second insulating portion 25B is in contact with both the anode plate 31 and the second through-hole conductor 64 . By the second insulating portion 25B extending between the anode plate 31 and the second through-hole conductor 64, the insulation between the anode plate 31 and the second through-hole conductor 64 is improved, and the insulation between the anode plate 31 and the cathode layer 36 is improved. The insulation is ensured and short circuit between the two is prevented.

When the second insulating portion 25B extends between the anode plate 31 and the second through-hole conductor 64, as shown in FIG. 4, it is preferable to expose the end surface of the anode plate 31 that is in contact with the second insulating portion 25B. core 32 and porous layer 34 . In this case, since the contact area between the second insulating part 25B and the porous layer 34 is increased, the adhesion between the two is improved, so that defects such as peeling between the second insulating part 25B and the porous layer 34 are less likely to occur. produce.

When the core portion 32 and the porous layer 34 are exposed on the end surface of the anode plate 31 that is in contact with the second insulating portion 25B, it is preferable to fill the pores in the porous layer 34 with the insulating material 34C, as shown in Figure 4 As shown, the insulating area where the insulating material 34C exists is provided around the second through-hole conductor 64 . In this case, the insulation between the anode plate 31 and the second through-hole conductor 64 and the insulation between the anode plate 31 and the cathode layer 36 are sufficiently ensured, and short circuit between them is fully prevented.

When the core portion 32 and the porous layer 34 are exposed on the end surface of the anode plate 31 that is in contact with the second insulating portion 25B, it is preferable that the constituent material of the second insulating portion 25B enters the pores of the porous layer 34. In this case, the mechanical strength of the porous layer 34 is improved, and the occurrence of delamination caused by the pores in the porous layer 34 is suppressed.

The thermal expansion coefficient of the second insulating portion 25B is preferably greater than the thermal expansion coefficient of the second through-hole conductor 64 . More specifically, the thermal expansion coefficient of the material constituting the second insulating portion 25B is preferably greater than the thermal expansion coefficient of the material (for example, copper) of the second through-hole conductor 64 . In this case, when the second insulating part 25B, more specifically, the material constituting the second insulating part 25B expands in a high-temperature environment, the porous layer 34 and the second through-hole conductor 64 are compressed, so that they are separated. The occurrence of layers is fully suppressed.

The thermal expansion coefficient of the second insulating part 25B may be the same as the thermal expansion coefficient of the second through-hole conductor 64, or may be smaller than the thermal expansion coefficient of the second through-hole conductor 64. More specifically, the thermal expansion coefficient of the material constituting the second insulating portion 25B may be the same as that of the material constituting the second through-hole conductor 64 , or may be smaller than the thermal expansion coefficient of the material constituting the second through-hole conductor 64 .

The capacitor of the present invention is used, for example, in composite electronic components. The composite electronic component as described above includes, for example, the capacitor of the present invention, an external electrode provided outside the capacitor of the present invention and electrically connected to the anode plate and the cathode layer respectively, and an electronic component electrically connected to the external electrode.

Among composite electronic components, the electronic components electrically connected to the external electrodes can be passive components, active components, both passive components and active components, or a composite of passive components and active components.

Examples of passive components include inductors.

Examples of active components include: memory, GPU (Graphical Processing Unit, graphics processor), CPU (Central Processing Unit, central processing unit), MPU (Micro Processing Unit, microprocessor), PMIC (Power Management IC, power management IC) )wait.

When the capacitor of the present invention is used in a composite electronic component, for example, the capacitor of the present invention is used as a substrate for constructing the electronic component as described above. Therefore, by forming the entire capacitor of the present invention into a sheet shape, and further forming the electronic components included in the capacitor of the present invention into a sheet form, it is possible to pass through-hole conductors penetrating the electronic components in the thickness direction. The capacitor of the present invention and the electronic component are electrically connected in the thickness direction. As a result, passive components and active components as electronic components can be constructed as an integrated module.

For example, a switching regulator can be formed by electrically connecting a capacitor of the present invention between a voltage regulator containing semiconductor active components and a load supplying a converted DC voltage.

In composite electronic components, a circuit layer may be formed on one main surface of a capacitor matrix sheet on which a plurality of capacitors of the present invention are arranged, and then the circuit layer may be electrically connected to a passive component or an active component of the electronic component.

Alternatively, the capacitor of the present invention may be disposed in a cavity previously provided on the substrate, embedded in resin, and then a circuit layer may be formed on the resin. Passive components or active components that are other electronic components can also be mounted in other cavities of the substrate.

Alternatively, the capacitor of the present invention may be mounted on a smooth carrier such as a wafer or glass. After forming an outer layer including resin, a circuit layer may be formed, and then the circuit layer may be electrically connected to a passive component or active component as an electronic component. element.

1: Capacitor array 10: Capacitor layer 20, 40: Conductive part 25:Insulation Department 25A: 1st insulation part 25B: 2nd insulation part 29A: 1st resin filling part 29B: 2nd resin filling part 30:Capacitor Department 31:Anode plate 32: Core 34: Porous layer 34A: Hole 1 34B: Hole 2 34C: Insulating materials 34V: empty hole 35: Dielectric layer 36:Cathode layer 36A: Solid electrolyte layer 36B: Conductor layer 42:Through hole conductor 60:Through hole conductor 62: 1st through-hole conductor 63: 1st through hole 64: 2nd through-hole conductor 65: 2nd through hole 68: Anode connection layer 68A: 1st anode connection layer 68B: 2nd anode connection layer E1: The outer end of the first through-hole conductor side of the insulation area E2: The outer end of the first through-hole conductor side of the porous layer E3: The outer end of the insulation area opposite to the first through-hole conductor P1: From the outer end of the first through-hole conductor side of the porous layer to the position separated from the porous layer in the surface direction by the thickness of the porous layer P2: A position starting from the outer end of the insulating region on the opposite side to the first through-hole conductor and facing the first through-hole conductor and away from the porous layer in the surface direction by the thickness of the porous layer R1: Region 1 R2: Region 2 T: Thickness direction U:face direction

[Fig. 1] is a schematic perspective view showing a capacitor array in the form of an array as an example of the capacitor of the present invention. 2 is a schematic cross-sectional view showing an example of a cross-section of a capacitor array including a cross-section along line segment A1-A2 in FIG. 1 . [Fig. 3] is a schematic cross-sectional view showing an enlarged state of the area Z in Fig. 2. [Fig. FIG. 4 is a schematic cross-sectional view showing an example of a cross-section of the capacitor array including a cross-section along the line segment B1-B2 in FIG. 1 .

25A: 1st insulation part

29A: 1st resin filling part

31:Anode plate

32: Core

34: Porous layer

34A: Hole 1

34B: Hole 2

34C: Insulating materials

34V: empty hole

36:Cathode layer

36A: Solid electrolyte layer

36B: Conductor layer

62: 1st through-hole conductor

68: Anode connection layer

68A: 1st anode connection layer

68B: 2nd anode connection layer

E1: The outer end of the first through-hole conductor side of the insulation area

E2: The outer end of the first through-hole conductor side of the porous layer

E3: The outer end of the insulation area opposite to the first through-hole conductor

P1: From the outer end of the first through-hole conductor side of the porous layer to the position separated from the porous layer in the surface direction by the thickness of the porous layer

P2: A position starting from the outer end of the insulating region on the opposite side to the first through-hole conductor and facing the first through-hole conductor and away from the porous layer in the surface direction by the thickness of the porous layer

R1: Region 1

R2: Region 2

T: Thickness direction

U:face direction

Claims (9)

A capacitor having: a capacitor layer having a capacitor portion; and The through-hole conductor is provided so as to penetrate the capacitor part in the thickness direction of the capacitor layer; The capacitor part has an anode plate with a porous layer on at least one main surface, a dielectric layer provided on the surface of the porous layer, and a cathode layer provided on the surface of the dielectric layer; The through-hole conductor includes a first through-hole conductor provided on at least the inner wall surface of the first through-hole penetrating the capacitor part in the thickness direction; The first through-hole conductor is electrically connected to an end surface of the anode plate, and the end surface of the anode plate faces the inner wall surface of the first through-hole in a plane direction orthogonal to the thickness direction; The first pore exists in the above-mentioned porous layer; A portion of the first through-hole conductor is included inside the first hole. Such as the capacitor of claim 1, wherein, The first hole is present in the end surface of the porous layer constituting the end surface of the anode plate. Such as the capacitor of claim 1, wherein, A second pore further exists in the above-mentioned porous layer; Contain insulating material inside the above-mentioned second hole; The porous layer includes an insulating area where the insulating material exists inside the second hole; In the plane direction, the outer end of the insulating region on the first through-hole conductor side is located on the opposite side to the first through-hole conductor than the outer end of the porous layer on the first through-hole conductor side. Such as the capacitor of claim 3, wherein, In the above-mentioned porous layer, when a first region is set covering the range from the outer end on the conductor side of the first through-hole to a position spaced apart from the thickness of the above-mentioned porous layer in the above-mentioned surface direction, the first region in the above-mentioned first region The area ratio of voids is 0 area% or more and 30 area% or less. Such as the capacitor of claim 4, wherein, In the above-mentioned porous layer, a thickness extending from the outer end of the insulating region opposite to the side opposite to the above-mentioned first through-hole conductor, towards the above-mentioned first through-hole conductor, and away from the above-mentioned porous layer in the above-mentioned surface direction is set. When the second area of the range up to the position is reached, the area ratio of the voids in the second area is greater than the area ratio of the voids in the first area. A capacitor as claimed in any one of items 1 to 5, wherein, The first through-hole conductor has an anode connection layer located on the end surface side of the anode plate; The anode connection layer is in contact with the end surface of the anode plate. A capacitor as claimed in any one of items 1 to 5, wherein, When viewed from the thickness direction, the first through-hole conductor is electrically connected to the end surface of the anode plate over the entire circumference of the first through-hole. A capacitor as claimed in any one of items 1 to 5, wherein, The through-hole conductor further includes a second through-hole conductor provided on at least the inner wall surface of the second through-hole of the capacitor part through which the first through-hole conductor is provided in the thickness direction; The second through-hole conductor is electrically connected to the cathode layer. Such as the capacitor of claim 8, wherein, The capacitor layer further includes: a first insulating part provided on the surface of the capacitor part, and a second insulating part provided on the surface of the first insulating part; The second insulating portion extends between the anode plate and the second through-hole conductor.