TWI831064B - Chip socket assembly and heat dissipation module thereof - Google Patents

Abstract

A chip socket assembly includes a housing loaded with conductive terminals, a support member is pivotally connected to the housing and a heat dissipation module fixed to the support member. The heat dissipation module includes a first radiating block and a second radiating block attached to the first block. The second radiating block is used to press on a chip module for transmitting the heats. The first heat dissipation block is internally provided with a pipeline filled with dissipation liquid. The flowing liquid in the first heat dissipation block carries away the heat from the chip module.

Description

Chip Connector Assemblage

The invention relates to a chip connector assembly having a heat dissipation module.

For relevant prior art, please refer to Chinese Invention Patent No. CN106654645A. This patent discloses an interconnected and interconnected board integration and heat dissipation integrated control box, which includes a box body, a cooling cover, a liquid cooling cover and a circuit board. There are liquid cooling channels and liquid cooling fins on the outer bottom of the box to cool the chip. The circuit board is installed in the box and is packaged into a heat dissipation integrated control box by a cooling cover and a liquid cooling cover. However, the above cooling The system is large in size, and the encapsulated liquid cooling channel is prone to liquid leakage, thus affecting product quality.

Therefore, it is necessary to provide a new chip connector combination to solve the above problems.

The technical problem to be solved by the present invention is to provide a liquid-cooled heat dissipation chip connector assembly.

In order to solve the above technical problems, the present invention can adopt the following technical solution: a chip connector assembly, which includes a base body carrying conductive terminals, a support member and a heat dissipation module, the heat dissipation module is fixed to the support member, the The support member is pivotally connected to the base, and the heat dissipation module includes a first heat dissipation block and a second heat dissipation block fixed to each other. The second heat dissipation block can press against a chip to transfer heat; the first heat dissipation block The heat dissipation block is provided with interconnected circulation pipes and a liquid heat dissipation medium located in the circulation pipes.

In order to solve the above technical problems, the present invention can also adopt the following technical solution: a heat dissipation module of a chip connector, including a first heat dissipation block and a second heat dissipation block, and the second heat dissipation block is fixed on The first heat dissipation block and the second heat dissipation block can press against the chip to transfer heat; the first heat dissipation block is provided with mutually penetrating circulation pipes and a liquid heat dissipation medium located in the circulation pipes. .

Compared with the prior art, the present invention has the following beneficial effects: the present invention is provided with mutually penetrating circulation pipes and a liquid heat dissipation medium located in the circulation pipes inside the first heat dissipation block, and achieves this through the flow of the liquid heat dissipation medium in the circulation pipes. The effect of dissipating heat from the chip.

100: Chip connector combination

1: base body

11: Base

12: Containment chamber

2:Support

200:wafer

201:Containment space

21:First support member

211:frame

212:First Containment Space

213:First border

214: Second border

22:Second support member

221: Bearing part

222: Second Containment Space

223:First inner wall

224:Second inner wall

225: Extension cavity

226:Stairway

227: Lateral wall

228: Holding hole

3: Cooling module

301: Base plate

31:First heat sink block

311: First side

312:Screw hole

32:Second heat sink block

321: Main part

322:Extension Department

323:Implantation slot

4: Pivot axis

51: Holding parts

52:Lock bolt structure

53:Screw

6: Circulation pipeline

61:First opening

62:First Pipeline

63:Second Pipeline

631: First bending part

632: Second bending part

633:Connection part

64:Third Pipe

65:Second opening

7: Cover

The first figure is a schematic three-dimensional view of the chip connector assembly of the present invention; the second figure is a partially exploded view of the first figure; the third figure is a partially exploded view of the second figure; and the fourth figure is a three-dimensional view of the chip connector assembly of the present invention. Exploded view; Figure 5 is a schematic perspective view of Figure 4 from another angle; Figure 6 is a partially exploded perspective view of Figure 5; Figure 7 is a schematic perspective view of Figure 6 from another angle; Figure 8 is a schematic perspective view of Figure 6 from another angle. The three-dimensional exploded view of the heat dissipation module; the ninth figure is a three-dimensional schematic diagram from another angle in the eighth figure; the tenth figure is a schematic diagram of the circulation pipe in the first heat dissipation block; the eleventh figure is along the dotted line XI-XI in the ninth figure , and the twelfth figure is a schematic three-dimensional view of another embodiment of the chip connector assembly of the present invention.

In order to facilitate a better understanding of the purpose, structure, characteristics, effects, etc. of the present invention, the present invention will be further described with reference to the drawings and specific embodiments. In the present invention, there is no specific limitation on the first and second elements in this case, and the sequence is not limited. They are only used to distinguish the component names.

Referring to Figures 1 to 11, a chip connector assembly 100 includes a chip connector and a heat dissipation module 3. The chip connector includes a base 1 carrying conductive terminals (not shown), And the support member 2 is pivotally connected to the base 1, and the heat dissipation module 3 is fixed to the support member 2.

The base 1 includes a base 11 and a receiving cavity 12 formed by the base 11 , and a chip 200 is received in the receiving cavity 12 . A pivot shaft 4 is installed at one end of the base 11 , and the support member 2 is pivotally connected to the base body 1 through the pivot shaft 4 .

Referring to the sixth and seventh figures, the support member 2 is provided with a receiving space 201 penetrating the upper and lower surfaces of the support member 2, and the heat dissipation module 3 is received in the receiving space 201. The support member 2 includes a first support member 21 and a second support member 22. The first support member 21 is provided with a rectangular frame 211 and a first receiving space 212 surrounded by the frame 211. , the second supporting member 22 is received in the first receiving space 212 and is held by the first supporting member 21 through the retaining member 51 . The frame 211 includes a first frame 213 arranged oppositely and a second frame 214 connected to the first frame 213. The inner side of the first frame 213 is inclined and is narrow at the top and wide at the bottom to cooperate with the heat dissipation. Module 3 matches. The first frame 213 is provided with a holding member 51 for holding the second supporting member 22 .

The second support member 22 is provided with a frame-shaped bearing portion 221 and a second receiving space 222 surrounded by the bearing portion 221 . The bearing portion 221 includes a pair of opposite first inner walls 223 and The two second inner walls 224 are connected to the first inner wall 223 , and a pair of the first inner wall 223 and the second inner wall 224 form the second receiving space 222 . The two first inner walls 223 include two extension cavities 225 formed inwardly from the surface thereof and a step portion 226 corresponding to the extension cavities 225. The second receiving space 222 is connected with the extension cavities 225, so The second receiving space 222 penetrates the upper and lower surfaces of the second support member 22 , and the extension cavity 225 does not penetrate the lower surface of the second support member 22 . The two outer side walls 227 of the bearing portion 221 corresponding to the two second inner walls 224 are provided with holding holes 228 that match the holding member 51 for the holding member 51 to be inserted.

Referring to Figures 8 to 11, the heat dissipation module 3 includes a first heat dissipation block 31 and a second heat dissipation block 32 fixed to each other. The second heat dissipation block 32 can press against the chip 200 , to transfer heat. The first heat dissipation block 31 and the second heat dissipation block 32 are fixed together by a plurality of locking bolt structures 52 . The first heat dissipation block 31 and the second heat dissipation block 32 are both rectangular and arranged up and down. The first heat dissipation block 31 is provided with a mutually penetrating circulation pipe 6 and a liquid heat dissipation medium (not shown) located in the circulation pipe 6. The liquid heat dissipation medium is water, ethylene glycol or propylene glycol. The heat generated by the wafer 200 is taken away, Of course, in other embodiments, the liquid heat dissipation medium is not limited to the above three types, and any other liquid material suitable as a liquid heat dissipation medium can be used.

Please refer to the key points shown in Figures 10 and 11. The circulation pipes 6 are arranged in a curved shape inside the first heat dissipation block 31 and are arranged axially symmetrically. Starting from the first opening 61 , the circulation pipe 6 is sequentially provided with a first pipe 62 , a second pipe 63 , a third pipe 64 and a second opening 65 that communicate with each other. The first opening 61 and the second opening 65 are both provided with water pipes (not shown) for the liquid heat dissipation medium to enter or flow out, and the first and second openings 61 and 65 are located on the first The same side of the heat sink 31. In this embodiment, the first opening 61 and the second opening 62 are both provided on the upper surface of the first heat dissipation block 31 to facilitate connection with an external water pipe. In other embodiments, they may also be provided. on other surfaces or sides. The first pipe 62 and the third pipe 64 are linear, and the second pipe 63 is curved and is located at the center of the first heat dissipation block 31 . The second pipe 63 is provided with a first bending part 631 connected with the first pipe 62, a second bending part 632 connected with the third pipe 64, and a first bending part 631 connected with the third pipe 64. The connecting portion 633 of the two bending portions 632, the first bending portion 631 and the second bending portion 632 are S-shaped, the connecting portion 633 is U-shaped, and the two ends of the U-shape are connected to the first and second bending portions respectively. Department 631, 632. The first heat dissipation block 31 is provided with a first side 311 corresponding to the first frame 213 of the first support member 21. The first side 311 is inclined and matches the first frame 213 so as to Put it into the first heat dissipation block 31 . In this embodiment, the liquid heat dissipation medium flows through the water connection pipe through the first opening 61 and sequentially flows through the first pipe 62, the second pipe 63, and the third pipe 64, and then flows into another pipe through the second opening 65. A water pipe is connected to realize liquid circulation. In this embodiment, the liquid heat dissipation medium can also enter from the second opening 65 and flow out from the first opening 61, which is not specifically limited and can be set according to specific conditions. In the present invention, the liquid heat dissipation medium flows through the loop in the circulation pipe 6 to take away the heat generated by the wafer to achieve the purpose of cooling. In order to achieve better heat dissipation effect, a cooling system (not shown) is provided outside the heat dissipation module 3 to cool down the liquid heat dissipation medium. The cooled liquid heat dissipation medium then flows back into the circulation pipe 6 . The present invention can adjust the heat dissipation speed of the heat dissipation module 3 by adjusting the temperature of the liquid heat dissipation medium and the speed of the circulation.

The second heat dissipation block 32 is provided with a main body 321 and a heat sink extending outward from the main body 321 . Two extension parts 322 are arranged opposite to each other, and the extension parts 322 are correspondingly received in the extension cavity 225 and pressed above the step part 226. The main body part 321 is received in the third In the second receiving space 222, its lower surface is in contact with the chip 200. A concave bottom plate 301 is provided on the lower surface of the second heat dissipation block 32 , and the bottom plate 301 matches the bottom surface of the second heat dissipation block 32 . The main body 321 of the second heat dissipation block 32 has an implant groove 323 recessed from its upper surface. A temperature detector (not shown) is installed in the implant groove 323 for monitoring the temperature of the chip 200 . time temperature.

The chip connector assembly 100 of the present invention also includes a cover 7 disposed above the heat dissipation module 3 . Other heat sinks (not shown) may be disposed in the cover 7 and are fixed thereon by first screws 53 . The support member 2 is provided to achieve better heat dissipation effect. Of course, in other embodiments, the radiator can be omitted to reduce costs. As shown in Figure 12, the second screw 54 is used to pass through the screw hole 312 of the first radiator 31 to secure the first radiator. 31 is fixed to the support 22 to install other components according to specific needs.

It should be pointed out that the above are only the best embodiments of the present invention, not all implementations. Any equivalent changes to the technical solution of the present invention made by those of ordinary skill in the art after reading the description of the present invention are all considered to be the basis of the present invention. covered by the patent application.

21:First support member

225: Extension cavity

212:First Containment Space

213:First border

214: Second border

22:Second support member

223:First inner wall

224:Second inner wall

226:Stairway

227: Lateral wall

228:Tongzhi hole

31:First heat sink block

32:Second heat sink block

Claims (10)

A chip connector assembly includes: a base body that carries conductive terminals and is used to accommodate a chip; a support member that is pivotally connected to the base body and is provided with a receiving space penetrating the upper and lower surfaces of the support member; and a heat dissipation module, which is fixed to the support; wherein the heat dissipation module includes a first heat dissipation block and a second heat dissipation block that are independent and fixed to each other, and the second heat dissipation block can extend into the receiving space. And press against the wafer to transfer heat; the first heat dissipation block is provided with mutually connected circulation pipes and a liquid heat dissipation medium flowing in the circulation pipes, and the area of the first heat dissipation block is larger than that of the second heat dissipation block. The heat dissipation block is located directly above the second heat dissipation block. The first heat dissipation block is covered above the support member, and the upper surface of the first heat dissipation module is provided with a first opening for the liquid heat dissipation medium to enter or flow out. and second opening. The chip connector assembly according to claim 1, wherein the circulation channel includes a first channel, a second channel, and a third channel that are connected to each other in sequence; the first channel and the third channel are linear, and the third channel is The two pipes are curved and are located at the center of the first heat dissipation block. A heat dissipation module of a chip connector, wherein the chip connector includes: a base body, which carries conductive terminals and is used to accommodate a chip; a support member, which is pivotally connected to the base body and has a penetrating support member Accommodating spaces on the upper and lower surfaces; the heat dissipation module is fixed to the support and includes: a first heat dissipation block that can be covered above the support; and a second heat dissipation block that is connected to the first heat dissipation module. Independent and fixed to each other, and located directly below the first heat dissipation block, the area of the first heat dissipation block is larger than the second heat dissipation block, and the upper surface of the first heat dissipation module is provided with a liquid heat dissipation module. The first opening and the second opening for medium to enter or flow out, the second heat dissipation block can extend into the receiving space and press against one of the wafers to transfer heat; wherein, the first heat dissipation block is provided with an internal A penetrating circulation pipe and a liquid heat dissipation medium located in the circulation pipe. The heat dissipation module of the chip connector according to claim 3, wherein the flow pipe is arranged in a curved shape inside the first heat dissipation block. The heat dissipation module of the chip connector according to claim 4, wherein the first opening and the second opening are both provided with water pipes, and the first and second openings are located on the same side of the first heat dissipation block. side. The heat dissipation module of the chip connector according to claim 5, wherein the circulation channel is sequentially provided with a first channel, a second channel, a third channel and a second opening that communicate with each other starting from the first opening; The first pipe and the third pipe are linear, and the second pipe is curved and located at the center of the first heat dissipation block. The heat dissipation module of the chip connector according to claim 6, wherein the second pipe is provided with a first bending part connected to the first pipe and a second bending part connected to the third pipe. And a connecting part connecting the first bending part and the second bending part, the first bending part and the second bending part are S-shaped, the connecting part is U-shaped, and the two ends of the U-shaped part are respectively connected to the first bending part and the second bending part. 1. The second bending part. The heat dissipation module of the chip connector according to claim 7, wherein the flow channel is arranged axially symmetrically. The heat dissipation module of the chip connector according to claim 3, wherein the first heat dissipation block and the second heat dissipation block are fixed together by a plurality of lock bolt structures. The heat dissipation module of the chip connector according to claim 3, wherein the second heat dissipation block is provided with an implant groove inwardly from one side thereof, and a temperature detector is installed in the implant groove.

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