KR100736814B1 - A manufacturing methof of thermal siphon type heat sink - Google Patents

Abstract

A method for managing a heat sink integrated with a thermal siphon is provided to facilitate the heat sink having a high efficiency heat spreader at a low cost by forming the heat spreader for containing a perforated plate and operational fluid, forming chambers for evaporating operational fluid in the heat sink, and welding the heat spreader and the heat sink. The chambers are formed by pressing aluminum or copper cooling fin plates(10a,10b) for forming a cooling fin(10) to a predetermined depth. The cooling fin plates, of which bottom is open, are joined by facing the chambers with each other and a fluid operating chamber is formed by welding a joining part(12). The aluminum or copper heat spreader(20) is formed by welding a spreader cover(20b) penetrating a fin assembly part(22b) to an opened upper side of a heat spreader box(20a) for receiving the operational fluid at intervals. A lower side of the cooling fin is welded in a vertical direction to each fin assembly part of the horizontal heat spreader. The heat spreader includes the perforated plate(30) in a fluid receiving chamber(22a) of the spreader box.

Description

A method for manufacturing a thermal cyphon integrated heat sink {A manufacturing methof of thermal siphon type heat sink}

1 is a perspective view of a heat radiation fin plate for forming a heat radiation fin according to the basic embodiment of the present invention.

2 and 3 are a perspective view and a cross-sectional view of the heat dissipation fin formed in accordance with the basic embodiment of the present invention by welding to the heat strainer housing the working fluid and the porous plate.

Figure 4 is a perspective view of the heat sink according to the manufacturing method of the present invention.

5 is a perspective view and a cross-sectional view of the heat dissipation fin formed in accordance with the application of the present invention by welding to the heat-strainer housing the working fluid and the porous plate.

Figure 6 is a perspective view of the heat sink according to the manufacturing method of the present invention application embodiment.

Explanation of symbols on the main parts of the drawings

10: heat radiation fins 10a, 10b: heat radiation fin plate

12: junction 14: fluid working chamber

20: heat spreader 20a: spreader enclosure

20b: Spreader cover 22a: fluid receiving chamber

22b: pin assembly 24b: joint fastening groove

30: perforated plate 32: working fluid

The present invention relates to a method for manufacturing a thermal-siphon integrated heat sink using welding, and more particularly, a heat spreader in which a porous plate and a working fluid are accommodated as a lower structure, and a heat dissipation fin that forms a chamber space by bonding is formed as an upper structure. The present invention relates to a method for manufacturing a thermal-siphon integrated heat sink in which the heat dissipation limit of the extruded heat sink can be structurally improved by integrally structuring them by welding.

As is well known, optical communication parts, electrical and electronic parts are almost semiconductor devices, and the trend of miniaturization is a problem of miniaturization. Therefore, cooling and incubation are absolutely necessary due to heat noise, shortening of life and unstable output characteristics. For example, the PC has been developed with high integration due to high performance and high speed, but the development of technology for efficiently dispersing and cooling the heat generated by the increase in the heat generation density due to the high integration has not been accompanied.

On the other hand, the miniaturization of electronic devices due to the high integration of electronic chips requires the solution of complex thermal problems in electronic components or systems. The problem of removing heat generated by high integration of electronic chips is getting more and more important, but this problem is very diverse and complicated depending on the size and shape of the chip, the amount of heat generated and the internal thermal resistance. After all, the lifetime or reliability of an electronic chip depends largely on the operating temperature of the chip.

In particular, it is known that the life of the chip decreases by more than 50% every time the operating temperature of the electronic chip is increased by 10 ° C. above the design temperature. Therefore, it is no exaggeration to say that the development of various cooling technologies that can remove high heat flux while keeping the temperature of electronic chips low affects the lifespan and development speed of electronic devices.

In general, heat sinks are based on RSF (Rectangular Straight Fin) type in which the heat radiation fins in the vertical direction are plate-shaped, and SRSF (Split Rectangilar Straight Fin) type and PF (Pin Fin) type are also widely used, and increase the heat dissipation per unit area. Porous form is also introduced as a structure for the situation. The existing heat sink has a heat conduction from the heat source to the heat sink in the horizontal direction, which is the bottom of the heat sink, heat conduction from the heat sink of the heat sink to the heat sink in the vertical direction, and the heat sink is cooled by contact with air.

Most of the heat sinks currently being used are extruded, but they exhibit limitations in use due to problems of heat release, and thus, there is no special alternative other than the method of increasing the heat sink. That is, since the temperature difference between the ends of the heat sink constituting the heat sink in the horizontal direction and the heat radiation fin in the vertical direction is large, the heat transfer amount is inevitably reduced, so the heat dissipation amount is limited.

Therefore, the present invention was developed in view of the above circumstances, and the heat dissipation fin formed in the horizontal structure of the lower portion has a heat spreader structure in which the perforated plate and the working fluid are accommodated, and the heat dissipation fin which is integrated as a vertical structure upward from the working fluid is By forming the chamber space to be evaporated to be integrally structured by mutual welding, it is easy to manufacture a heat sink having a heat spreader function that has a high heat exchanger efficiency compared to a conventional single extrusion heat sink, and at a low cost. It is an object of the present invention to provide a method for manufacturing a thermal cyphonic integrated heat sink that can be manufactured.

As a technical means for achieving the above object, the method for manufacturing a thermal-siphon integrated heat sink of the present invention comprises the steps of: forming a chamber space by pressing to a predetermined depth against a heat radiation fin plate to form a heat radiation fin as an aluminum plate or a copper plate material; And joining the heat dissipation fin plates on both sides so that the chamber spaces face each other and welding the joint to each other to form the heat dissipation fins at the lower side of the chamber space being formed as a fluid working chamber, and a spreader housing accommodating the working fluid. Welding the spreader cover penetrated through the fin assembly at a predetermined interval with respect to the open upper side of the heat spreader to form a heat spreader, and welding the lower side of the heat radiation fin in the vertical direction with respect to each fin assembly of the horizontal heat spreader The product is configured to include.

In addition, the heat spreader is formed as any one of aluminum or copper plate material with a heat radiating fin, the porous plate of the porous material is provided in the fluid receiving chamber of the spreader housing accommodated in the working fluid. Furthermore, the heat dissipation fin is characterized in that the entire surface is embossed or bent to increase the heat exchange contact area with air.

Hereinafter, with reference to the accompanying drawings of the preferred embodiment of the method and the configuration relationship thereby a thermal cyphon integrated heat sink of the present invention will be described in detail.

1 to 3 is a manufacturing method according to the basic embodiment of the present invention, the heat spreader 20 in the horizontal direction is formed on the lower side and the heat dissipation fins 10 of the upper side formed with a chamber space therein by welding to each other the heat The manufacturing process is integrally structured by welding to the upper side of the spreader 20 at a predetermined interval.

As shown in the figure, the heat sink according to the manufacturing method of the present invention, unlike the conventional heat sink, which is a simple sealed structure filled inside, the heat spreader 20 and the heat spreader 20 which is a heat sink forming a bottom surface in the horizontal direction The working fluid 32 filled in the fluid receiving chamber 22a of the heat spreader 20 is vaporized (evaporated) by a heat source of the electronic device heating element while forming a horizontal direction so as to be heat-exchanged with surrounding air. The inner space is made of a mutual welding coupling with the heat radiation fin 10 formed by the fluid working chamber 14 by bonding to each other.

That is, the heat sink integrated heat sink of the present invention has a heat spreader (Heat spreader) in which the working fluid 32 is accommodated inside the heat sink formed in the horizontal direction downward, and also has a space inside the heat sink fin 10 to the bottom The working fluid (steam) generated by the heat spreader 20 of the heat enters the space of the heat dissipation fin 10, the heat dissipation fin 10 is in contact with the air to condense the working fluid 32 and the condensed liquid again the heat spreader ( A heat sink with a thermophone function is returned.

First, the heat spreader 20 which functions as a heat sink and is filled with a working fluid capable of rapidly reacting and evaporating the heat source of the heating element has an open upper side of the spreader enclosure 20a having a space formed inside the fluid receiving chamber 22a. Spreader cover 20b through which pin assembly portion 22b is penetrated at regular intervals is integrally structured by welding.

In addition, the horizontal heat spreader 20 is provided with a porous plate 30 made of a porous material together with the working fluid 32 in the fluid receiving chamber 22a therein, which is the working fluid from the heat spreader 20. (32) The efficiency of heat exchange with external air to steam is to be increased.

Particularly, these spreader enclosures 20a and the spreader cover 20b constituting the heat spreader 20 are preferably welded to each other by brazing welding or electric resistance welding, and are formed through the spreader cover 20b at a predetermined interval to be cooled. Each of the pin assemblies 22b to which the pins 10 are welded to each other is formed in the case of the heat dissipation fins 10 according to the basic embodiment, in which the joining portions 12, which are coupling ends, protrude to a predetermined length. The junction part fastening groove 24b is recessed so that the joint part 12 of the heat dissipation fin 10 can be fastened and welded to both sides.

Of course, in the case of the heat dissipation fin 10 produced by the application of Figures 4 to 6, the joining portion, which is a coupling end portion, does not protrude, so that the joining portion fastening groove 24b is recessed to both sides of the pin assembly portion 22b. There is no.

The heat spreader 20 is welded to each fin assembly 22b formed on the spreader cover 20b of the heat dissipation fins 10 of the manufacturing method according to the basic embodiment or the application embodiment, first, As shown in FIGS. 1 to 3, the heat dissipation fins 10 according to the basic embodiment are aluminum plates or copper plate materials such as the heat spreader 20, and both heat dissipation fin plates 10a which form chamber spaces of a predetermined depth by pressing. 10b are integrally structured by welding by joining each other to face each other with respect to the chamber space.

Of course, the heat dissipation fins 10 in which both of the heat dissipation fin plates 10a and 10b are integrally structured by joining each other so that the working fluid 32 of the heat spreader 20 can be evaporated and circulated are inside the working fluid 32. While the operating space of the fluid working chamber 14 forms the lower side is assembled to each of the fin assembly (22b) of the heat spreader is a form that is open so that the space can communicate.

That is, the heat dissipation fin plates 10a and 10b are press-molded to form a chamber space in which the fluid receiving chamber 22a is formed at a predetermined depth when assembled to the plate-shaped heat dissipation fin plates 10a and 10b, respectively. It can be integrally structured by welding to the junction part 12 in the state which bonded together the chamber space facing each other.

As described above, the heat radiation fins 10a and 10b are joined to each other to form a fluid working chamber 14 having a predetermined depth by various molding methods according to a basic embodiment or an application embodiment. 10, the lower side of the heat spreader is mounted on each fin assembly (22b) of the heat spreader 20 and is also integrally structured by welding, so that the heat spreader having a higher heat exchange efficiency than the conventional single extrusion heat sink The heat sink having the function can be manufactured easily and at low cost.

In addition, the thermosyphon integrated heat sink formed by the manufacturing method of the present invention is basically filled with the working fluid 32 in the fluid receiving chamber 22a of the heat spreader 20, in some cases the working fluid ( 32) the porous plate 30, which is a porous material, is installed to increase the heat exchange efficiency of the working fluid 32 with the external air, and in particular, the heat dissipation fin 10 may increase the heat exchange contact area with the air. It is preferable that the entire surface is embossed or bent to weld bond with the heat spreader 20.

In this way, the thermosyphone integrated heat sink of the present invention constituted by a manufacturing method includes a working fluid in which a heat spreader 20 directly contacted and fixed to a heating element is reacted with a heat source from the heating element and filled therein. 22) is evaporated and the steam is transferred to the upper heat dissipation fin 10, which is a plurality of integrated spaces, so that heat exchange with the outside air can be made more quickly and smoothly.

On the other hand, the thermosyphone integrated heat sink formed by the manufacturing method of the present invention is based on the fact that the porous plate 30 is provided in the fluid receiving chamber 22a of the heat spreader 20 filled with the working fluid 32 However, in some cases, the fluid working chamber 14 of the heat dissipation fin 10 may also be formed in the porous plate or the perforated plate so that the heat exchange efficiency with the outside air is increased while the working fluid 32 from the heat spreader 20 is evaporated. Of course, other porous materials can be provided.

As described above, according to the method for manufacturing a thermal-siphon integrated heat sink of the present invention, a heat spreader in which a porous plate and a working fluid are accommodated is formed as a lower structure, and heat dissipation fins are formed as an upper structure in which a chamber space is formed by joining. By integrally structuring, the heat emission limit of the extruded heat sink can be structurally improved, which is easy to manufacture and inexpensive to produce a heat sink having a heat spreader function having a high heat exchange efficiency compared to a conventional single extruded heat sink. It provides effects that can be produced.

Claims (3)

Forming a chamber space by pressing the heat radiating fin plates 10a and 10b to an aluminum plate or a copper plate to a predetermined depth to form the heat radiating fins 10; The heat dissipation fins 10a and 10b of the both sides are bonded to each other so that the chamber spaces face each other and welded to the junction 12 so that the inner chamber spaces are formed as the fluid working chamber 14 and the heat dissipation fins 10 opened at the lower side thereof. ), Forming a heat spreader 20 by welding the spreader cover 20b through which the pin assembly 22b is penetrated at a predetermined interval with respect to the open upper side of the spreader enclosure 20a in which the working fluid 32 is accommodated; , A method for manufacturing a thermal-siphon integrated heat sink comprising a product comprising the step of welding the lower side of the heat dissipation fin (10) in a vertical direction with respect to each fin assembly portion (22b) of the horizontal heat spreader (20). The method of claim 1, The heat spreader 20 is formed of any one of aluminum or copper plate together with the heat dissipation fins 10, and a porous plate of porous material in the fluid receiving chamber 22a of the spreader enclosure 20a in which the working fluid 32 is accommodated. 30) a method for manufacturing a thermal cyphonic integrated heat sink, characterized in that provided. The method of claim 1, The heat dissipation fin 10 is a method for manufacturing a thermal cyphon integrated heat sink, characterized in that the entire surface is embossed or bent so that the heat exchange contact area with air can be increased.

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