TWI830499B - Control device of cleaning solution temperature in wafer cleaning equipment and wafer cleaning equipment - Google Patents

Abstract

A control device for cleaning solution temperature in a wafer cleaning device and a wafer cleaning device. The device comprises a refrigeration chip module, a control module and a first temperature measuring device; The refrigeration chip module is set on the outer wall of the cleaning tank. The control module flexibly controls the refrigeration chip module based on the current temperature and target temperature of the cleaning solution in the cleaning tank, so as to achieve flexible switching between the heating and cooling functions, thus flexibly controlling the temperature of the cleaning solution. As the semiconductor refrigeration chip in the refrigeration chip module is in the working state, a certain temperature difference will be generated between the first chip and the second chip, The utility model can avoid the thermal deformation of the protective shell of the cleaning tank caused by the high heating temperature of the cleaning solution, and has the effect of cooling the protective shell.

Description

Control device for cleaning liquid temperature in wafer cleaning equipment and wafer cleaning equipment

The present application relates to the field of semiconductor technology, and in particular to a device for controlling the temperature of a cleaning liquid in a wafer cleaning equipment and a wafer cleaning equipment.

Wafer cleaning equipment is mainly divided into single-wafer semiconductor cleaning equipment and tank-type semiconductor cleaning equipment for batch cleaning. Among them, tank-type semiconductor cleaning equipment is widely used due to its high pass rate and large production capacity. Tank-type semiconductor cleaning equipment is widely used in cleaning. During the wafer process, different chemicals need to be configured in the cleaning tank depending on the surface residues that need to be removed. In order to achieve the best cleaning effect, the concentration and temperature of the chemicals often need to be adjusted according to the needs of the process. control.

In the related art, when controlling the temperature of chemicals in the cleaning tank, it is necessary to paste a heating body or a heating body with a radiation heating function on the outer surface of the cleaning tank to form a cleaning tank with a heating function; however, this solution is not good Control the temperature of the heating body, and it is easy to cause the heating temperature of the cleaning fluid to be too high due to the heating temperature being too high, which in turn leads to the problem of thermal deformation of the protective shell outside the cleaning tank.

The purpose of the embodiments of the present application is to provide a cleaning liquid temperature in a wafer cleaning equipment The temperature control device and the wafer cleaning equipment are used to solve the problem that the temperature control in the existing technology is not flexible and accurate when controlling the temperature of the cleaning liquid in the wafer cleaning equipment, and it is easy to cause the heating temperature of the cleaning liquid to be too high, which may cause damage outside the cleaning tank. The problem of thermal deformation of the protective shell.

In order to solve the above technical problems, the embodiment of the present application is implemented as follows:

In a first aspect, embodiments of the present application provide a device for controlling the temperature of cleaning liquid in wafer cleaning equipment. The control device includes: at least one refrigeration chip module, a control module and a first temperature measurement device; wherein, at least one of the refrigeration chip The module is attached to the outer wall of the cleaning tank of the wafer cleaning equipment. Each of the refrigeration chip modules includes at least two semiconductor refrigeration chips that are thermally connected in sequence. Each of the semiconductor refrigeration chips includes a first chip body and a a second sheet body; the first sheet body and the second sheet body are respectively connected to the control module; the first temperature measuring device is used to measure the current temperature of the cleaning liquid in the cleaning tank and transmit the current temperature to The control module; the control module, used to control the first polarity applied to the first body in the semiconductor refrigeration chip and the first polarity applied to the semiconductor refrigeration chip according to the current temperature and the target temperature of the cleaning liquid. The second polarity of the second sheet, and the amount of power applied between the first sheet and the second sheet.

In a second aspect, embodiments of the present application provide a wafer cleaning equipment. The wafer cleaning equipment includes: a cleaning tank and a device for controlling the temperature of the cleaning liquid in the wafer cleaning equipment as described in the first aspect.

Using the technical solution of the embodiment of the present application, a refrigeration chip module is provided on the outer wall of the cleaning tank, and then the first chip applied to the semiconductor refrigeration chip is controlled by the control module based on the target temperature of the current temperature of the cleaning liquid in the cleaning tank. and the electrode polarity of the second piece, as well as the amount of power applied between the first piece and the second piece, to flexibly control the temperature of the cleaning liquid in the cleaning tank. This not only achieves the desired temperature of the cleaning liquid, The heating effect can also reduce the cleaning fluid from high temperature to low temperature, thereby achieving heating and cooling. The flexible switching of functions can make the temperature control more precise; and because when the semiconductor refrigeration chip is in working condition, there will be a certain temperature difference between the first chip body and the second chip body, which can protect the cleaning tank. The outer shell has the effect of cooling and protecting, thereby preventing the thermal deformation of the protective outer shell caused by the excessive heating temperature of the cleaning fluid in the cleaning tank.

10: Control device for cleaning fluid temperature

20:Cleaning tank

101: Refrigeration module

102:Control module

103: The first temperature measuring device

104:Protective shell

105: Second temperature measuring device

107:Power supply

106: Rectifier and voltage stabilizing circuit

1021: First power supply polarity switching circuit

1022: Second power supply polarity switching circuit

1023: First power adjustment circuit

1024: Second power adjustment circuit

1045: Central control circuit

10451: First control circuit

10452: Second control circuit

The present disclosure is best understood from the following detailed description when read in conjunction with the accompanying drawings. It should be noted that in accordance with standard practice in the industry, the various components are not drawn to scale. In fact, the dimensions of the various components may be arbitrarily increased or reduced for clarity of discussion.

Figure 1 is a first specific structural schematic diagram of a cleaning liquid temperature control device in a wafer cleaning equipment according to an embodiment of the present application.

FIG. 2 is a second specific structural schematic diagram of a cleaning liquid temperature control device in a wafer cleaning equipment according to an embodiment of the present application.

Figure 3 is a third specific structural schematic diagram of a cleaning liquid temperature control device in a wafer cleaning equipment according to an embodiment of the present application.

Figure 4 is a fourth specific structural schematic diagram of a cleaning liquid temperature control device in a wafer cleaning equipment according to an embodiment of the present application.

Figure 5 is a fifth specific structural schematic diagram of a cleaning liquid temperature control device in a wafer cleaning equipment according to an embodiment of the present application.

FIG. 6 is a schematic diagram of a sixth specific structure of a device for controlling the temperature of a cleaning liquid in a wafer cleaning equipment according to an embodiment of the present application.

Figure 7 is a schematic structural diagram of a wafer cleaning equipment according to an embodiment of the present application.

The following disclosure provides many different implementations of different components for implementing the disclosure Example or instance. Specific examples of components and configurations are described below to simplify the present disclosure. Of course, these are examples only and are not intended to be limiting. For example, the following description in which a first member is formed over or on a second member may include embodiments in which the first member and the second member are formed in direct contact, and may also include embodiments in which additional members Embodiments may be formed between the first member and the second member such that the first member and the second member may not be in direct contact. Additionally, the present disclosure may repeat reference numbers and/or letters in various instances. This repetition is for simplicity and clarity and does not inherently indicate a relationship between the various embodiments and/or configurations discussed.

In addition, for ease of description, spatially relative terms such as “below,” “below,” “lower,” “above,” “upper,” and the like may be used herein to describe one element or component in relation to another(s). The relationship between components or components, as illustrated in the figure. Spatially relative terms are intended to cover different orientations of the device in use or operation other than the orientation depicted in the figures. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

Notwithstanding that the numerical ranges and parameters setting forth the broad scope of the disclosure are approximations, the values stated in the specific examples are reported as precisely as possible. Any numerical value, however, inherently contains certain errors necessarily resulting from the standard deviation found in their respective testing measurements. Furthermore, as used herein, the term "about" generally means within 10%, 5%, 1% or 0.5% of a given value or range. Alternatively, the term "approximately" means within one acceptable standard error of the mean when considered by one of ordinary skill in the art. Except in operating/working examples, or unless otherwise expressly specified, all numerical ranges such as quantities, durations of time, temperatures, operating conditions, ratios of quantities, and the like for materials disclosed herein, Quantities, values and percentages should be understood to be modified in all instances by the term "approximately". Accordingly, unless indicated to the contrary, the numerical parameters set forth in the patent claims of this disclosure and accompanying invention claims It is an approximate value that can be changed as needed. At a minimum, each numerical parameter should be interpreted in light of the number of reported significant digits and by applying ordinary rounding techniques. Ranges may be expressed herein as from one endpoint to the other endpoint or between two endpoints. All ranges disclosed herein include endpoints unless otherwise specified.

Embodiments of the present application provide a device for controlling the temperature of the cleaning liquid in the wafer cleaning equipment and the wafer cleaning equipment, so as to solve the problem that the temperature control in the prior art when controlling the temperature of the cleaning liquid in the wafer cleaning equipment is not flexible and accurate enough, and is easy to cause errors. The heating temperature of the cleaning fluid is too high, causing the protective shell outside the cleaning tank to be heated and deformed.

In order to enable those in the technical field to better understand the technical solutions in the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described The embodiments are only some of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative efforts should fall within the scope of protection of this application.

Figure 1 is a specific structural schematic diagram of a device for controlling the temperature of the cleaning liquid in a wafer cleaning equipment according to an embodiment of the present application. As shown in Figure 1, the control device includes: at least one refrigeration module 101, a control module 102 and The first temperature measuring device 103; wherein, at least one refrigeration chip module 101 is attached to the outer wall of the cleaning tank 20 of the wafer cleaning equipment, and each refrigeration chip module 101 includes at least two semiconductor refrigeration chips that are thermally connected in sequence. , each semiconductor refrigeration chip includes a first chip body and a second chip body; the first chip body and the second chip body are connected to the control module 102; where, in order to simplify the specific structure of the refrigeration chip module 101, in Figure 1 It only illustrates the situation that the refrigeration chip module 101 includes two semiconductor refrigeration chips (i.e., the first semiconductor refrigeration chip and the second semiconductor refrigeration chip), which does not constitute a restriction on the specific structure of the refrigeration chip module 101. For the refrigeration chip When the module 101 includes three semiconductor refrigeration pieces, it is enough to arrange the third semiconductor refrigeration piece outside the second piece of the second semiconductor refrigeration piece in sequence, and so on, which will not be described again here.

The above-mentioned first temperature measuring device 103 is used to measure the current temperature of the cleaning liquid in the cleaning tank 20 and transmit the current temperature to the control module 102 .

The above control module 102 is used to control the first polarity applied to the first sheet in the semiconductor refrigeration chip and the second polarity applied to the second sheet in the semiconductor refrigeration chip according to the current temperature and target temperature of the cleaning liquid in the wafer cleaning equipment. the second polarity, and the amount of power applied between the first sheet and the second sheet.

Wherein, each of the above-mentioned semiconductor refrigeration chips can be a thermocouple pair connected by two different semiconductors, one of which is the positive electrode of the semiconductor refrigeration chip (i.e., the first chip or the second chip), and the other semiconductor (i.e., the first chip or the second chip) is the positive electrode of the semiconductor refrigeration chip. That is, the second body or the first body) is the negative electrode of the semiconductor refrigeration chip. When a voltage is applied between the positive electrode and the negative electrode of the semiconductor refrigeration chip, a certain junction temperature difference will occur between the two semiconductors. Generally speaking, the The junction temperature difference can be about 60°C to 70°C, causing one of the semiconductors to become a hot side and the other semiconductor to become a cold side. Normally, when a positive voltage is applied to the positive electrode of the semiconductor refrigeration chip, the semiconductor corresponding to the positive electrode becomes a semiconductor. The hot side of the refrigeration piece (that is, applying a positive voltage to the positive electrode of the semiconductor refrigeration piece will cause the semiconductor corresponding to the positive electrode to heat). When a negative voltage is applied to the negative electrode of the semiconductor refrigeration piece, the semiconductor corresponding to the negative electrode becomes the cold side of the semiconductor refrigeration piece (i.e. Applying a negative voltage to the negative electrode of the semiconductor refrigeration chip will cause the semiconductor corresponding to the negative electrode to cool down); when the voltage applied to the positive electrode of the semiconductor refrigeration chip changes from positive voltage to negative voltage, the semiconductor corresponding to the positive electrode will change from hot to cold. surface (that is, the semiconductor corresponding to the positive electrode changes from heating to cooling), when the voltage applied to the negative electrode of the semiconductor refrigeration chip changes from negative voltage to positive voltage, the semiconductor corresponding to the negative electrode will change from the cold surface to the hot surface (that is, the negative electrode corresponds to the cold surface). The semiconductor changes from cooling to heating), that is, when the polarity of the voltage applied between the two semiconductors in the semiconductor refrigeration chip switches When changing, the hot side of the semiconductor refrigeration chip will change to the cold side, and the cold side of the semiconductor refrigeration chip will change to the hot side.

During specific implementation, it is assumed that two different semiconductors contained in each semiconductor refrigeration chip are the first chip and the second chip, where the first chip corresponds to the positive electrode of the semiconductor refrigeration chip, and the second chip corresponds to the semiconductor. The negative electrode of the refrigeration piece; when a positive voltage is applied to the first piece of the semiconductor refrigeration piece, the first piece can be turned into a hot surface and generate heat; when a negative voltage is applied to the second piece of the semiconductor refrigeration piece, the third piece can be made The two pieces become cold surface refrigeration; further, the control module 102 can be used to switch the polarity of the power applied between the first piece and the second piece in the semiconductor refrigeration piece, that is, the control module 102 can be used to control the polarity of the power applied to the semiconductor refrigeration piece. The first polarity of the first piece in the semiconductor refrigeration piece, and the second polarity applied to the second piece of the semiconductor refrigeration piece, when the polarity of the power supply applied between the first piece and the second piece of the semiconductor refrigeration piece is switched When, the first polarity applied to the first piece of the semiconductor refrigeration chip is controlled to change from positive voltage to negative voltage (that is, the voltage applied to the first piece of the semiconductor refrigeration chip changes from positive voltage to negative voltage), The first sheet body can be changed from the hot surface to the cold surface, thereby achieving the effect of cooling the cleaning liquid in the cleaning tank 20, and controlling the second polarity applied to the second sheet body in the semiconductor refrigeration chip to change from negative voltage to When the voltage is positive (that is, the voltage applied on the second body of the semiconductor refrigeration chip changes from negative voltage to positive voltage), the second body can be changed from the cold surface to the hot surface, thereby realizing cleaning in the cleaning tank 20 The effect of heating the liquid.

Using the technical solution of the embodiment of the present application, the refrigeration chip module 101 is installed on the outer wall of the cleaning tank 20, and then the control module 102 controls the target temperature applied to the semiconductor refrigeration chip based on the current temperature of the cleaning liquid in the cleaning tank 20. The electrode polarity of the first sheet and the second sheet and the amount of power applied between the first sheet and the second sheet are used to flexibly control the temperature of the cleaning liquid in the cleaning tank 20, which not only enables Achieve the temperature rise of the cleaning fluid The heating effect can also reduce the cleaning liquid from high temperature to low temperature, thereby achieving flexible switching of heating and cooling functions, which can make the temperature control more precise; and because the semiconductor refrigeration chip is in working condition, the second There will be a certain temperature difference between one piece of body and the second piece of body, which can have the effect of cooling and protecting the protective shell of the cleaning tank, thereby preventing the protective shell from being damaged due to excessive heating temperature of the cleaning fluid in the cleaning tank. The problem of thermal deformation.

Furthermore, considering that the outer wall area of the cleaning tank 20 of the wafer cleaning equipment may be relatively large, and due to the size limitation of each refrigeration chip module 101, it may be necessary to install multiple refrigeration chip modules 101 on the outer wall of the cleaning tank 20. , so as to cover the entire outer wall of the cleaning tank 20. Based on this, a plurality of refrigeration chip modules 101 are arranged in an array on the outer wall of the cleaning tank 20 of the wafer cleaning equipment.

Specifically, there are multiple refrigeration chip modules 101; each refrigeration chip module 101 is disposed in a different outer wall area of the cleaning tank 20; wherein, each first semiconductor refrigeration chip in the plurality of refrigeration chip modules 101 is connected in parallel with The control module 102 is connected, and each second semiconductor refrigeration chip in the plurality of refrigeration chip modules 101 is connected in parallel to the control module 102 .

Specifically, each refrigeration chip module 101 can be regarded as a whole. Taking the refrigeration chip module 101 including two semiconductor refrigeration chips as an example, for example, the first semiconductor refrigeration chip and the second semiconductor refrigeration chip together constitute a refrigeration chip. Chip module 101, in which the first semiconductor refrigeration chip and the second semiconductor refrigeration chip can be semiconductor refrigeration chips with the same power, or semiconductor refrigeration chips with different powers, which can be flexibly set according to actual needs; further, they can be cleaned during cleaning The outer wall of the slot 20 is covered with a plurality of refrigeration chip modules 101 in an array distribution. Among them, the first chip body and the second chip body in each semiconductor refrigeration chip in the refrigeration chip module 101 are connected in series and then in parallel at their respective control units. In the module 102, for example, assume that there are three refrigeration chip modules 101, and each refrigeration chip module 101 There are two semiconductor refrigeration chips in the refrigeration chip module. As shown in Figure 2, the first semiconductor refrigeration chip in the first refrigeration chip module 101, the first semiconductor refrigeration chip in the second refrigeration chip module 101, and the third refrigeration chip module 101 The first semiconductor refrigeration pieces are connected in parallel and then connected to the control module 102 together, and the first piece and the second piece in each first semiconductor refrigeration piece are connected in series; and the second semiconductor refrigeration piece in the first refrigeration piece module 101 , the second semiconductor refrigeration chip in the second refrigeration chip module 101, and the second semiconductor refrigeration chip in the third refrigeration chip module 101 are connected in parallel and connected to the control module 102 together, and the first semiconductor refrigeration chip in each second semiconductor refrigeration chip is connected in parallel. The chip body and the second chip body are connected in series. Furthermore, the second chip body of the first semiconductor refrigeration chip in each refrigeration chip module 101 is connected with the first chip body of the second semiconductor refrigeration chip in the respective module. Bonded together with a thermally conductive adhesive with good thermal conductivity. In order to simplify the specific structure of the refrigeration chip module 101, FIG. 2 only illustrates the case where each refrigeration chip module 101 includes two semiconductor refrigeration chips (i.e., a first semiconductor refrigeration chip and a second semiconductor refrigeration chip). , does not constitute a restriction on the specific structure of the refrigeration chip module 101. For the case where each refrigeration chip module 101 includes at least three semiconductor refrigeration chips, refer to the above-mentioned Figure 2. Each refrigeration chip module 101 includes two As for the specific structure of the semiconductor refrigeration chip, each third semiconductor refrigeration chip in the plurality of refrigeration chip modules 101 is connected in parallel and connected to the control module 102, and so on, which will not be described again here.

During specific implementation, the heating cleaning can be calculated based on the preset heating rate, the power required when the cleaning liquid in the cleaning tank 20 is heated to the preset maximum temperature (ie, the maximum value of the target temperature), and the experimentally estimated power loss. The total power required by the cleaning liquid in the tank 20, and according to the total power, design a certain quantity and specifications (for example, the package size of the refrigeration chip module 101, the power of the refrigeration chip module 101, and the voltage) of the refrigeration chip module 101; it is also possible to set the actual number of semiconductor refrigeration chips in the refrigeration chip module 101 to be greater than the theoretically required target number of semiconductor refrigeration chips, so that the current flow can be flexibly controlled according to actual process requirements. The number of semiconductor refrigeration fins that need to be activated enables the cleaning fluid temperature control device to The usage scenarios of the device are diversified so that the need to heat the cleaning fluid to a higher target temperature can be met later by increasing the number of activated semiconductor refrigeration elements.

In the embodiment provided by this application, by arranging multiple refrigeration chip modules 101 in an array on the outer wall of the cleaning tank 20, it is possible to deploy the refrigeration chip modules 101 in a larger area on the outer wall of the cleaning tank 20, thereby increasing the number of cleaning operations. The area of the heating area on the outer wall of the tank 20 is determined, and the semiconductor refrigeration fins at the same position in the multiple refrigeration pellet modules 101 are connected in parallel and then connected to the control module 102, so that the control module 102 can control the multiple refrigeration pellet modules 101 individually. Control, thereby achieving more flexible control of multiple refrigeration chip modules 101. It can be decided according to actual needs to control which areas of the refrigeration chip modules 101 on the outer wall of the cleaning tank 20 are opened or closed, thereby improving the outer wall of the cleaning tank 20. Flexibility in controlling heating zones.

Further, considering that in order to accurately detect the actual temperature between two adjacent semiconductor refrigeration chips in the refrigeration chip module 101, for example, detecting the second body of the first semiconductor refrigeration chip and the third body of the second semiconductor refrigeration chip. The actual temperature between one piece of the semiconductor refrigeration piece can be accurately controlled to achieve precise control of the power applied to the semiconductor refrigeration piece and the electrode polarity applied to the first piece and the second piece of the semiconductor refrigeration piece. Therefore, the two pieces can be A second temperature measuring device is added between the semiconductor refrigeration pieces, so that the control module 102 determines how to control the electrode polarity applied to the first and second pieces of the semiconductor refrigeration piece based on the actual temperature measured by the second temperature measuring device. , and the amount of power applied between the first body and the second body. This can not only achieve more precise control of the temperature of the cleaning fluid, but also avoid the problem of the first body and the second body in the semiconductor refrigeration chip. The electrode polarity switching of the body causes the temperature of the second body close to the semiconductor refrigeration chip of the protective shell 104 to be too high, which leads to the problem of thermal deformation of the protective shell of the cleaning tank. Based on this, as shown in Figure 3, the outside of the above-mentioned cleaning tank 20 A protective shell 104 is also provided, and a second temperature measuring device 105 is also provided between at least two semiconductor refrigeration chips;

The above-mentioned second temperature measuring device 105 is used to measure the actual temperature of the first body of the semiconductor refrigeration chip close to the protective shell 104, and transmit the measured actual temperature to the control module 102.

The control module 102 is also used to determine whether to switch the first polarity applied to the first piece of the semiconductor refrigeration piece and the second piece of the semiconductor refrigeration piece based on the actual temperature and the maximum heat-resistant temperature of the protective shell 104. the second polarity of the body, and if the judgment result is yes, switch the first polarity of the first piece body and the second polarity of the second piece body, or if the judgment result is no, adjust the first polarity of the first piece body and the second polarity of the second piece body. The amount of power applied between the chip and the second chip.

Specifically, the above-mentioned second temperature measuring device 105 can be disposed between any two adjacent semiconductor refrigeration chips, and the actual temperature of the first or second piece of the semiconductor refrigeration chip is detected through the second temperature measuring device 105. So that the control module 102 can accurately control the electrode polarity applied to the first and second sheets in the semiconductor refrigeration chip and the amount of power applied between the first and second sheets based on the actual temperature. . In specific implementation, the second temperature measuring device 105 can be disposed between two adjacent semiconductor refrigeration chips adjacent to the protective shell 104. For example, if the refrigeration chip module includes two semiconductor refrigeration chips, the second temperature measuring device 105 can be placed between the first semiconductor refrigeration chip A second temperature measuring device 105 is arranged between the chip and the second semiconductor refrigeration chip. If the refrigeration chip module includes three semiconductor refrigeration chips, and the first semiconductor refrigeration chip is provided with sequential thermal conductive connections from the outer wall of the cleaning tank to the protective shell 104. , the second semiconductor refrigeration piece and the third semiconductor refrigeration piece, then at least the second temperature measuring device 105 needs to be set between the third semiconductor refrigeration piece and the second semiconductor refrigeration piece; specifically, the second temperature measuring device 105 is set at The situation between two adjacent semiconductor refrigeration pieces adjacent to the protective shell 104, since the junction temperature difference of each semiconductor refrigeration piece is known, therefore, based on the actual temperature measured by the second temperature measuring device 105 and the adjacent protective shell The junction temperature of the semiconductor refrigeration chip is 104 difference, it can be determined whether the temperature of the second semiconductor refrigeration chip adjacent to the protective housing 104 exceeds the maximum heat-resistant temperature of the protective housing 104, so that the protective housing 104 can be better protected.

Furthermore, considering that when the temperature of the semiconductor refrigeration chip is too high, if the electrode polarities of the first piece and the second piece in the semiconductor refrigeration piece are directly switched, the temperature of the protective shell 104 may be too high. Therefore, you can first The cooling effect is achieved by adjusting the power of at least one semiconductor refrigeration chip. When the temperature of the first semiconductor refrigeration chip adjacent to the protective shell 104 drops to a certain temperature, the power is switched to the at least one semiconductor refrigeration chip. The electrode polarity of the first piece and the second piece ensures that the protective shell 104 is within the allowable temperature range, that is, the maximum heat-resistant temperature of the protective shell 104 is not exceeded. Based on this, the above-mentioned control module 102 is also specifically used to When the actual temperature measured by the second temperature measuring device 105 is greater than or equal to the first preset value, the power applied between the first sheet and the second sheet is adjusted based on the actual temperature until the actual temperature is less than the above-mentioned third sheet. A preset value, and when the actual temperature is less than the first preset value, it is determined to switch the first polarity and the second polarity, that is, when the actual temperature measured by the second temperature measuring device 105 is less than the first preset value, this The first polarity applied to the first piece of the semiconductor refrigeration piece and the second polarity applied to the second piece of the semiconductor refrigeration piece can be switched.

Among them, the above-mentioned first preset value is set according to the difference between the maximum heat-resistant temperature and the junction temperature difference of the semiconductor refrigeration chip close to the protective shell 104, that is, the above-mentioned first preset value is set according to the maximum heat-resistant temperature of the protective shell 104 and the junction temperature difference close to the protective shell 104. It is related to the difference between the junction temperatures of the semiconductor refrigeration pieces of the housing 104 . The junction temperature difference of the semiconductor refrigeration chip may be related to the power applied to the semiconductor refrigeration chip. Therefore, the junction temperature difference of the semiconductor refrigeration chip may be determined based on the power currently applied to the semiconductor refrigeration chip. That is to say, the first preset The setting value can change dynamically; in addition, considering that during actual use, only some semiconductor refrigeration units may be activated, so Therefore, the junction temperature difference of the semiconductor refrigeration chip that determines the first preset value is the junction temperature difference of the semiconductor refrigeration chip in the working state.

Specifically, taking the refrigeration chip module 101 schematically shown in FIG. 1 including a first semiconductor refrigeration chip and a second semiconductor refrigeration chip as an example, the device for controlling the temperature of the cleaning liquid in the wafer cleaning equipment provided by the embodiment of the present application is carried out. It is explained that first, for the situation that the current temperature measured by the first temperature measuring device 103 is room temperature, the cleaning liquid in the cleaning tank 20 needs to be heated, that is, the current temperature is lower than the target temperature, and the heating state is the initial heating state. During specific implementation, the control module 102 controls the first polarity of the first piece of the first semiconductor refrigeration piece to be positive, and controls the second polarity of the second piece of the first semiconductor refrigeration piece to be negative; and controls the second polarity of the second semiconductor refrigeration piece. The first polarity of the first body in the chip is positive, and the second polarity of the second body in the second semiconductor refrigeration chip is controlled to be negative, and the power level and application applied to the first semiconductor refrigeration chip are adjusted through the control module 102 The power level on the second semiconductor refrigeration chip. If the temperature of the first piece of the second semiconductor refrigeration piece is greater than the temperature of the second piece of the first semiconductor refrigeration piece, the first piece of power can be increased through heat transfer. The temperature of the second body of the semiconductor refrigeration chip, and thus the junction temperature difference of the first semiconductor refrigeration chip, causes the temperature of the first body of the first semiconductor refrigeration chip to be higher, thereby causing the heating temperature of the cleaning liquid to be higher.

During specific implementation, it can be decided according to the actual situation which semiconductor refrigeration chip is activated. For example, if the target temperature is less than the sum of the difference between the room temperature and the junction temperature of the first semiconductor refrigeration chip, only the first semiconductor refrigeration chip can be activated; for example, if the target temperature If it is greater than the sum of the temperature difference between the room temperature and the junction temperature of the first semiconductor refrigeration piece, the first semiconductor refrigeration piece and the second semiconductor refrigeration piece can be activated at the same time.

Furthermore, for the situation where the temperature of the heated cleaning liquid needs to be cooled down, that is, the current temperature measured by the first temperature measuring device 103 is greater than the target temperature, the first semiconductor refrigeration chip or the second semiconductor refrigeration chip can be switched. The electrodes of one piece and the second piece property, the cold surface temperature of the switched semiconductor refrigeration chip is used to quickly cool down the cleaning liquid. Specifically, the control module 102 can be used to control the first and second chip bodies in the first semiconductor refrigeration chip according to the actual situation. Switch the electrode polarity, or control the switching of the electrode polarity of the first and second sheets in the second semiconductor refrigeration chip through the control module 102; at the same time, it is considered that when the current temperature of the cleaning liquid is too high, the first The temperature between the semiconductor refrigeration piece and the second semiconductor refrigeration piece (that is, the actual temperature measured by the second temperature measuring device 105) is also too high. Therefore, it is necessary to first adjust the temperature applied to the first semiconductor refrigeration piece and the second semiconductor refrigeration piece through the control module 102. The power of the semiconductor refrigeration piece can further achieve the effect of cooling the first semiconductor refrigeration piece and the second semiconductor refrigeration piece, so that the distance between the second piece of the first semiconductor refrigeration piece and the first piece of the second semiconductor refrigeration piece is When the temperature (that is, the actual temperature measured by the second temperature measuring device 105) is less than the first preset value, the polarity of the electrode applied to the first semiconductor refrigeration piece or the second semiconductor refrigeration piece can be switched, that is, based on the second measurement The actual temperature measured by the temperature device 105 adjusts the amount of power applied between the first chip and the second chip. Until the actual temperature is less than the first preset value, the power applied to the first semiconductor refrigeration chip or the second semiconductor can be adjusted. The electrode polarity of the cooling plate is switched.

For example, for the case where the refrigeration chip module 101 includes three semiconductor refrigeration chips, and the first semiconductor refrigeration chip, the second semiconductor refrigeration chip and the third semiconductor refrigeration chip are sequentially thermally connected from the outer wall of the cleaning tank to the protective shell 104 , and a second temperature measuring device 105 is set between the third semiconductor refrigeration piece and the second semiconductor refrigeration piece; assuming that the first preset value is the difference between the maximum heat-resistant temperature and the junction temperature difference of the third semiconductor refrigeration piece, if the second measurement The actual temperature measured by the temperature device 105 (that is, the actual temperature between the second body of the second semiconductor refrigeration piece and the first body of the third semiconductor refrigeration piece) is greater than or equal to the maximum heat-resistant temperature and the temperature of the third semiconductor refrigeration piece. The difference between the junction temperature difference, and the target temperature is less than the difference between the maximum heat-resistant temperature and the junction temperature difference of the third semiconductor refrigeration piece, then it is necessary to adjust the power applied to the first semiconductor refrigeration piece, the second semiconductor refrigeration piece and the third semiconductor refrigeration piece. The size of the semiconductor refrigeration piece is adjusted when the actual temperature between the second body of the second semiconductor refrigeration piece and the first body of the third semiconductor refrigeration piece is less than the difference between the maximum heat-resistant temperature and the junction temperature difference of the third semiconductor refrigeration piece. (that is, the first preset value), the polarity of the first semiconductor refrigeration piece, the second semiconductor refrigeration piece, or the third refrigeration piece can be switched.

For another example, for the case where the refrigeration chip module 101 includes two semiconductor refrigeration chips, it is assumed that the first preset value is the difference between the maximum heat-resistant temperature and the junction temperature difference of the second semiconductor refrigeration chip. If the second temperature measuring device 105 measures The actual temperature (that is, the actual temperature between the second body of the first semiconductor refrigeration piece and the first body of the second semiconductor refrigeration piece) is greater than or equal to the difference between the maximum heat-resistant temperature and the junction temperature difference of the second semiconductor refrigeration piece, and If the target temperature is less than the difference between the maximum heat-resistant temperature and the junction temperature of the second semiconductor refrigeration piece, it is necessary to adjust the power applied to the first semiconductor refrigeration piece and the second semiconductor refrigeration piece. When the second piece of the first semiconductor refrigeration piece Only when the actual temperature between the body and the first body of the second semiconductor refrigeration chip is less than the difference between the maximum heat-resistant temperature and the junction temperature of the second semiconductor refrigeration chip (i.e. the first preset value), the first semiconductor refrigeration chip can be Or switch the polarity of the second refrigeration piece.

Furthermore, in the case where the temperature of the cooling liquid needs to be heated again, the polarity applied to the first semiconductor refrigeration chip or the polarity of the second semiconductor refrigeration chip can be directly switched. For example, if the refrigeration chip mold is The polarity of the first body of the first semiconductor refrigeration chip in the group is positive and the polarity of the second body is negative, and the polarity of the first body of the second semiconductor refrigeration chip is negative and the polarity of the second body is positive. , then the polarity of the second semiconductor refrigeration piece is directly switched, so that the polarity of the first piece of the second semiconductor refrigeration piece changes from negative to positive (that is, the cold side becomes the hot side), and then the polarity is applied to the second semiconductor refrigeration piece through adjustment. The power of the semiconductor refrigeration piece increases the temperature of the first piece of the second semiconductor refrigeration piece, and then increases the temperature of the second piece of the first semiconductor refrigeration piece through heat transfer, and then increases the temperature of the second piece of the first semiconductor refrigeration piece through the junction of the first semiconductor refrigeration piece. temperature difference, increase the The temperature of the first piece of a semiconductor refrigeration piece is then heated by the cleaning liquid in the cleaning tank.

It should be noted that, for the case where the refrigeration chip module includes at least three semiconductor refrigeration chips, reference can be made to the above specific control process, which will not be described again here.

Among them, it is considered that when controlling the temperature of the cleaning liquid in the cleaning tank 20, it is mainly to control the temperature of the cleaning liquid of the wafer, and when heating the cleaning liquid, it is necessary to ensure that the protective shell 104 of the cleaning tank 20 will not be heated due to heating. The temperature is too high, resulting in softening and deformation. Normally, activating two semiconductor refrigeration chips can meet the temperature adjustment needs of the wafer cleaning fluid. Therefore, taking the refrigeration chip module 101 including two semiconductor refrigeration chips as an example, of course refrigeration The chip module 101 can also include at least three semiconductor refrigeration chips. For application scenarios where the target temperature of the cleaning fluid is less than a certain value, only two semiconductor refrigeration chips can be activated, that is, the two semiconductor refrigeration chips can be controlled to be in a working state. Specifically, , at least two semiconductor refrigeration chips in the above-mentioned refrigeration chip module 101 include: a first semiconductor refrigeration chip and a second semiconductor refrigeration chip.

Wherein, the first piece of the first semiconductor refrigeration piece is disposed on the outer wall of the cleaning tank 20, the second piece of the first semiconductor refrigeration piece is thermally connected to the first piece of the first semiconductor refrigeration piece, and the second piece of the first semiconductor refrigeration piece is thermally connected. The first piece of the semiconductor refrigeration piece is thermally connected to the second piece of the first semiconductor refrigeration piece, and the second piece of the second semiconductor refrigeration piece is thermally connected to the first piece of the second semiconductor refrigeration piece. Close to protective housing 104.

Specifically, when controlling the heating of the cleaning liquid in the cleaning tank 20 (that is, the current temperature measured by the first temperature measuring device 103 is less than the target temperature), a positive temperature can be applied to the first body of the first semiconductor refrigeration chip. voltage, a negative voltage is applied to the second piece of the first semiconductor refrigeration piece, so that the junction temperature difference between the first piece and the second piece of the first semiconductor refrigeration piece causes the first semiconductor refrigeration piece to The first piece becomes the hot surface and generates heat, thereby heating the cleaning liquid in the cleaning tank 20. At the same time, a positive voltage can be applied to the first piece of the second semiconductor refrigeration piece. A negative voltage is applied to the second body of the second semiconductor refrigeration chip, so that the third body of the second semiconductor refrigeration chip is caused by the junction temperature difference generated between the first body and the second body of the second semiconductor refrigeration chip. One piece becomes the hot surface and generates heat. Since the second piece of the first semiconductor refrigeration piece is thermally connected to the first piece of the second semiconductor refrigeration piece, the first piece of the second semiconductor refrigeration piece The heat of the first semiconductor refrigeration piece can be transferred to the second piece of the first semiconductor refrigeration piece through heat transfer to increase the temperature of the second piece of the first semiconductor refrigeration piece (that is, by increasing the temperature of the second piece of the second semiconductor refrigeration piece). The temperature of one piece heats the second piece in the first semiconductor refrigeration piece), and then through the junction temperature difference generated between the first piece and the second piece of the first semiconductor refrigeration piece, the temperature in the cleaning tank is The first body of the first semiconductor refrigeration chip on the outer wall of 20 can reach a higher temperature, thereby causing the cleaning liquid in the cleaning tank 20 to reach a higher temperature, and at this time, the first body of the first semiconductor refrigeration chip can reach a higher temperature. The temperature is the sum of the temperature difference between the first body of the second semiconductor refrigeration piece and the junction temperature of the first semiconductor refrigeration piece, and the temperature of the first body of the first semiconductor refrigeration piece can reach the highest temperature of the second piece of the second semiconductor refrigeration piece. The sum of the body temperature and the maximum junction temperature difference of the first semiconductor refrigeration piece.

At the same time, since the second body of the second semiconductor refrigeration piece is the cold surface at this time, the temperature of the second body of the second semiconductor refrigeration piece close to the protective shell 104 is much lower than that of the first body of the first semiconductor refrigeration piece. temperature, and the temperature difference between the first body of the first semiconductor refrigeration piece and the second body of the second semiconductor refrigeration piece is the sum of the junction temperature difference of the first semiconductor refrigeration piece and the junction temperature difference of the second semiconductor refrigeration piece , for example, assume that the junction temperature difference of the first semiconductor refrigeration piece is 70°, and the junction temperature difference of the second semiconductor refrigeration piece is 60°. When the temperature of the first body of the first semiconductor refrigeration piece reaches 140°C, the first semiconductor refrigeration piece The temperature of the second body of the second semiconductor refrigeration chip is 70°. At this time, the temperature of the first body of the second semiconductor refrigeration chip needs to be controlled at about 70°C. When the temperature of the first body of the second semiconductor refrigeration chip is controlled at At 70℃, due to the junction of the second semiconductor refrigeration chip The temperature difference is 60°, so the temperature of the second body of the second semiconductor refrigeration chip will be maintained at about 10°C, so even if the cleaning liquid in the cleaning tank 20 needs to be heated to a higher temperature (i.e., the temperature of the second body of the first semiconductor refrigeration chip) The temperature of one piece of the second semiconductor refrigeration piece is higher), or the protective shell 104 of the cleaning tank 20 can be maintained at a lower temperature (that is, the second piece of the second semiconductor refrigeration piece) by using the sum of the junction temperature differences of the two semiconductor refrigeration pieces. temperature is lower).

Specifically, by controlling the electrode polarity and power applied to the semiconductor refrigeration chip in the refrigeration chip module 101 through the control module 102, in addition to controlling the heating of the cleaning liquid in the cleaning tank 20, the cleaning liquid in the cleaning tank 20 can also be controlled. Perform cooling control (that is, the current temperature measured by the first temperature measuring device 103 is greater than the target temperature), that is, perform cooling control on the heated cleaning fluid. During specific implementation, the control module 102 may be used to control the amount of power applied between the first and second sheets of the first semiconductor refrigeration sheet, and to control the first sheet and the second sheet of the second semiconductor refrigeration sheet. The amount of power applied between the chips reduces the temperature of the first chip in the first semiconductor refrigeration chip and the temperature of the first chip in the second semiconductor refrigeration chip, and then switches the power applied to the second semiconductor refrigeration chip. The polarity of the power supply between one piece and the second piece causes the voltage applied on the first piece of the second semiconductor refrigeration piece to change from positive voltage to negative voltage, that is, the first piece of the second semiconductor refrigeration piece changes from positive voltage to negative voltage. The hot surface becomes the cold surface, and then the heat of the second body of the first semiconductor refrigeration piece is transferred to the first body of the second semiconductor refrigeration piece through heat transfer, that is, through the first body of the second semiconductor refrigeration piece. The chip body cools down the second chip body in the first semiconductor refrigeration chip, and then lowers the temperature of the first chip body in the first semiconductor refrigeration chip through the junction temperature difference of the first semiconductor refrigeration chip, thereby achieving the cleaning tank 20 . The cooling effect of the cleaning fluid. Among them, because the heat transfer method is used to control the temperature, there is no need to rely entirely on power to control the temperature. Therefore, the purpose of reducing power consumption can be achieved, and due to the simultaneous use of heat transfer and power, it can Achieve controllable temperature control, thereby making temperature control more precise.

In specific implementation, although the first piece of the first semiconductor refrigeration piece is disposed on the outer wall of the cleaning tank 20 and can directly heat the cleaning liquid in the cleaning tank 20, taking into account the specific heat capacity of the cleaning liquid during the heating process Due to factors such as changes and environmental changes, the temperature of the first semiconductor refrigeration chip is often not directly equal to the temperature of the cleaning fluid in the cleaning tank 20. Therefore, in order to ensure the accuracy of temperature control, , the first temperature measuring device 103 can be used to instantly measure the current temperature of the cleaning liquid in the cleaning tank 20, and transmit the current temperature to the control module 102, so that the control module 102 controls the application to the cleaning liquid according to the current temperature and the target temperature of the cleaning liquid. The first polarity of the first piece of the semiconductor refrigeration piece, the second polarity applied to the second piece of the semiconductor refrigeration piece, and the amount of power applied between the first piece and the second piece, and then Precise control of the temperature of the cleaning fluid in the cleaning tank 20 is achieved.

Furthermore, it is considered that the junction temperature difference and heat transfer principle of the second semiconductor refrigeration piece can be used to cool the second piece of the first semiconductor refrigeration piece to achieve the purpose of reducing power consumption. At the same time, it is considered that in the semiconductor refrigeration When the temperature of the chip is too high, if the electrode polarities of the first chip and the second chip in the second semiconductor refrigeration chip are directly switched, it may cause the temperature of the protective shell 104 to be too high and cause deformation. Based on this, The above control module 102 is also specifically used to control the temperature based on the actual temperature measured by the second temperature measuring device 105 when it is greater than or equal to the difference between the maximum heat-resistant temperature of the protective shell 104 and the junction temperature difference of the second semiconductor refrigeration chip. The actual temperature measured by the second temperature measuring device 105 adjusts the amount of power applied to the first semiconductor refrigeration piece and the amount of power applied to the second semiconductor refrigeration piece.

When the actual temperature measured by the second temperature measuring device 105 is less than the difference between the maximum heat-resistant temperature of the protective shell 104 and the junction temperature difference of the second semiconductor refrigeration piece, the switch is applied to the first piece of the second semiconductor refrigeration piece. The first polarity of the body and the second polarity applied to the second sheet body, so that the first sheet body in the second semiconductor refrigeration sheet reduces the first semiconductor refrigeration sheet through heat transfer. The temperature of the second body in the body cooling fin.

When the current temperature of the cleaning fluid reaches the second preset value, the amount of power applied between the first body and the second body of the first semiconductor refrigeration chip is adjusted so that the current temperature of the cleaning fluid reaches the target temperature. .

Specifically, for the case where each refrigeration chip module 101 includes two semiconductor refrigeration chips, that is, the refrigeration chip module 101 includes a first semiconductor refrigeration chip and a second semiconductor refrigeration chip, correspondingly, the above-mentioned first preset value is protection The difference between the maximum heat-resistant temperature of the housing 104 and the junction temperature difference of the second semiconductor refrigeration chip; during specific implementation, the refrigeration chip module 101 may only include the first semiconductor refrigeration chip and the second semiconductor refrigeration chip, or The refrigeration chip module 101 may include not only the first semiconductor refrigeration chip and the second semiconductor refrigeration chip, but also a third semiconductor refrigeration chip, etc., but only two semiconductor refrigeration chips need to be activated according to actual needs; specifically, if the second semiconductor refrigeration chip If the actual temperature between the first semiconductor refrigeration piece and the second semiconductor refrigeration piece measured by the temperature measuring device 105 is greater than or equal to the difference between the maximum heat-resistant temperature of the protective shell 104 and the junction temperature difference of the second semiconductor refrigeration piece, then it is required First adjust the power applied to the first semiconductor refrigeration piece and the power applied to the second semiconductor refrigeration piece so that the temperature between the first semiconductor refrigeration piece and the second semiconductor refrigeration piece reaches the allowable temperature range, that is, the second Only when the actual temperature measured by the temperature measuring device 105 is less than the difference between the maximum heat-resistant temperature of the protective shell 104 and the junction temperature difference of the second semiconductor refrigeration piece can the polarity of the electrode applied to the second semiconductor refrigeration piece be switched, that is, when it is allowed When the polarity of the second semiconductor refrigeration piece is switched within the range, the first polarity applied to the first piece and the second polarity applied to the second piece in the second semiconductor refrigeration piece are switched so that the polarity of the second semiconductor refrigeration piece is The first body changes from a hot surface to a cold surface, and the temperature of the second body in the first semiconductor refrigeration chip is reduced through heat transfer, thereby reducing power consumption.

Specifically, before switching the polarity of the electrode applied to the second semiconductor refrigeration chip Then, the second body of the second semiconductor refrigeration chip shown in the above-mentioned Figure 1 changes from the cold surface to the hot surface, and the first body of the second semiconductor refrigeration chip changes from the hot surface to the cold surface, so that the second body of the second semiconductor refrigeration chip changes from the hot surface to the cold surface. The temperature of the first of the two semiconductor refrigeration pieces decreases, thereby lowering the temperature of the second piece of the first semiconductor refrigeration piece through heat transfer, and then lowering the temperature of the first semiconductor refrigeration piece through the junction temperature difference of the first semiconductor refrigeration piece. The temperature of the first sheet body is adjusted so that the current temperature of the cleaning liquid reaches a second preset value. The second preset value may not be fixed. For example, the second preset value may be a self-switching second preset value. When the time elapsed from the moment when the electrode polarity of the semiconductor refrigeration piece reaches the current temperature value of the cleaning fluid after the preset time period, the power can be adjusted. Alternatively, the value can also be fixed, for example, a temperature is preset. The threshold (ie, the above-mentioned second preset value) is compared with the current temperature and the temperature threshold to determine whether the current temperature reaches the second preset value. If it reaches the second preset value, the power can be adjusted. Further, if the second preset value is greater than the target temperature, it is necessary to reduce the amount of power applied between the first body and the second body of the first semiconductor refrigeration chip so that the current temperature of the cleaning fluid reaches the target temperature. ; If the second preset value is less than the target temperature, it is necessary to increase the amount of power applied between the first body and the second body in the first semiconductor refrigeration chip so that the current temperature of the cleaning fluid reaches the target temperature, that is, After heat transfer, if the current temperature of the cleaning fluid does not reach the target temperature, the power applied between the first and second wafers in the first semiconductor refrigeration chip can also be adjusted so that the current temperature of the cleaning fluid reaches the target temperature. target temperature.

Furthermore, after the cleaning liquid in the cleaning tank 20 is cooled, the cleaning liquid can also be heated on the basis of cooling. Specifically, the control module 102 is used to switch the temperature applied to the first piece of the second semiconductor refrigeration piece. The first polarity and the second polarity applied to the second sheet body are such that the first sheet body in the second semiconductor refrigeration sheet increases the temperature of the second sheet body in the first semiconductor refrigeration sheet through heat transfer (i.e. The first body of the second semiconductor refrigeration chip changes from the cold surface to the hot surface), and then the gap between the first body and the second body of the second semiconductor refrigeration chip can be adjusted. The applied power raises the temperature of the first body of the second semiconductor refrigeration piece to a temperature higher than the temperature of the second body of the first semiconductor refrigeration piece, thereby raising the temperature of the first semiconductor refrigeration piece through heat transfer. The temperature of the second piece in the first semiconductor refrigeration piece, and then the junction temperature difference of the first semiconductor refrigeration piece makes the temperature of the first piece in the first semiconductor refrigeration piece higher, thereby increasing the temperature of the cleaning fluid. Among them, the temperature is increased by heat transfer. The temperature of the cleaning liquid in the cleaning tank 20 can reduce the overall power consumption of the control device.

In the embodiment provided by this application, the power applied to the first semiconductor refrigeration piece and the second semiconductor refrigeration piece is first adjusted to reduce the temperature between the first semiconductor refrigeration piece and the second semiconductor refrigeration piece to allow switching of the second semiconductor refrigeration piece. Within the range of the electrode polarity of the semiconductor refrigeration piece, and then switching the electrode polarity applied to the second semiconductor refrigeration piece, the temperature of the first piece of the first semiconductor refrigeration piece can be lowered through heat transfer, thereby achieving The cooling of the cleaning fluid can keep the temperature of the protective shell 104 within the allowable temperature range. If the temperature of the cleaning fluid has not reached the target temperature after heating or cooling the cleaning fluid through heat transfer, the first cleaning fluid will continue to be heated or cooled. The amount of power applied between the first and second pieces of the semiconductor refrigeration chip is adjusted so that the current temperature of the cleaning fluid reaches the target temperature, that is, the polarity of the electrodes applied to the semiconductor refrigeration chip can be switched during heating. At the same time, a cooling effect is produced, and the cooling rate can be accurately controlled by adjusting the voltage (power adjustment circuit), thereby making the temperature control accuracy higher and utilizing heat transfer to improve energy efficiency.

It should be noted that the above-mentioned refrigeration chip module 101 may include two semiconductor refrigeration chips, or may include multiple semiconductor refrigeration chips. During specific implementation, the refrigeration chip module 101 may be configured to include multiple semiconductor refrigeration chips, and then according to The actual process requirements (i.e., combining the maximum target temperature of the cleaning fluid and the maximum heat-resistant temperature of the protective shell 104) determine to start two semiconductor refrigeration fins or start at least three semiconductor refrigeration fins (i.e., use two or at least three and a half The junction temperature difference of the conductor refrigeration piece reduces the temperature of the second piece of the semiconductor refrigeration piece close to the protective shell 104, thereby ensuring that when the current temperature of the cleaning fluid reaches the maximum value of the target temperature, the protective shell 104 can still not exceed the maximum heat-resistant temperature. ), where the number of semiconductor refrigeration fins that need to be activated (i.e., the target number) is positively related to the maximum value of the target temperature, and negatively related to the maximum heat-resistant temperature of the protective shell 104. This can make the use scenarios of the cleaning fluid temperature control device diverse. Specifically, the above-mentioned control module 102 is specifically used to determine the target number of semiconductor refrigeration chips that need to be started based on the maximum value of the target temperature of the cleaning fluid and the maximum heat-resistant temperature of the protective shell 104, and place the target number close to the outer wall of the cleaning tank 20 A number of semiconductor refrigeration chips are determined as target semiconductor refrigeration chips (for example, semiconductor refrigeration chips 1, semiconductor refrigeration chips 2, and semiconductor refrigeration chips 3 in the refrigeration chip module 101 are sequentially arranged from the outer wall of the cleaning tank 20 to the protective shell 104. If determined If the target number is 2, then control the semiconductor refrigeration chip 1 and the semiconductor refrigeration chip 2 to be in the working state), and then control the first chip applied to the target semiconductor refrigeration chip according to the current temperature and target temperature of the cleaning fluid in the wafer cleaning equipment. The first polarity of the body, the second polarity applied to the second body in the target semiconductor refrigeration chip, and the amount of power applied between the first body and the second body; wherein, for the control applied to at least three The specific implementation process of the electrode polarity and power level of the first and second semiconductor refrigeration chips can be referred to the specific control process for the two semiconductor refrigeration chips, which will not be described again here.

Further, considering that heat needs to be transferred between the second sheet body in the first semiconductor refrigeration piece and the first sheet body in the second semiconductor refrigeration piece, and when the heat transfer tends to be stable, the first The second body of the semiconductor refrigeration piece and the first body of the second semiconductor refrigeration piece need to be kept at the same temperature to make the temperature control of the semiconductor refrigeration piece more precise. Therefore, in order to improve the heat conduction in each semiconductor refrigeration piece The heat conduction effect of the connected first piece and the second piece is improved, and one semiconductor of the two adjacent semiconductor refrigeration pieces connected by heat conduction is improved. The heat conduction effect between the first body of the refrigeration piece and the second body of another semiconductor refrigeration piece. The first body and the second body of each semiconductor refrigeration piece are bonded by a thermally conductive adhesive. The first The semiconductor refrigeration piece and the second semiconductor refrigeration piece are bonded by a thermally conductive adhesive, that is, the second piece of the first semiconductor refrigeration piece and the first piece of the second semiconductor refrigeration piece are bonded by a thermally conductive adhesive.

In this embodiment, the second piece of the first semiconductor refrigeration piece and the first piece of the second semiconductor refrigeration piece are bonded with a thermally conductive adhesive with good thermal conductivity, so that the heat transfer effect is better. , thereby making the temperature control of the semiconductor refrigeration chip more precise.

Furthermore, it is considered that the temperature of the cleaning liquid in the cleaning tank 20 can be flexibly controlled by switching the polarity of the electrode applied to the semiconductor refrigeration chip and adjusting the power applied to the semiconductor refrigeration chip, thereby heating the cleaning liquid. Or the cooling effect, in order to further improve the switching flexibility of the electrode polarity applied to the multiple semiconductor refrigeration chips, and further improve the adjustment flexibility of the power applied to the multiple semiconductor refrigeration chips, based on this, the above-mentioned control module 102 includes: at least Two power supply polarity switching circuits, at least two power conditioning circuits and a central control circuit.

Among them, the first body of each semiconductor refrigeration chip is connected to the power supply through a power supply polarity switching circuit and a power adjustment circuit; the second body of each semiconductor refrigeration chip is connected through another power supply polarity switching circuit and another power supply polarity switching circuit. A power conditioning circuit is connected to the power supply.

The above-mentioned central control circuit is respectively connected to the first temperature measuring device 103, at least two power supply polarity switching circuits and at least two power adjustment circuits.

The above-mentioned central control circuit is used to control the first polarity applied to the first sheet body and the second polarity applied to the second sheet body through the power supply polarity switching circuit according to the current temperature and the target temperature of the cleaning fluid, and through the power adjustment circuit Control between the first body and the second body The amount of power applied.

Specifically, the refrigeration chip module 101 includes a first semiconductor refrigeration chip and a second semiconductor refrigeration chip as an example. Correspondingly, the first semiconductor refrigeration chip and the second semiconductor refrigeration chip in the refrigeration chip module 101 are respectively different from each other. The power supply polarity switching circuit is connected to different power adjustment circuits. Specifically, as shown in Figure 4, the above-mentioned control module 102 includes: a first power supply polarity switching circuit 1021, a second power supply polarity switching circuit 1022, and a first power adjustment circuit 1023. , the second power regulation circuit 1024 and the central control circuit 1045; wherein, the first semiconductor refrigeration chip of the refrigeration chip module 101 is connected to the power supply 107 through the first power supply polarity switching circuit 1021 and the first power regulation circuit 1023, and the refrigeration chip The second semiconductor refrigeration chip of the module 101 is connected to the power supply 107 through the second power supply polarity switching circuit 1022 and the second power adjustment circuit 1024; and the central control circuit 1045 is connected to the first temperature measuring device 103 and the first power supply polarity switching respectively. The circuit 1021, the second power supply polarity switching circuit 1022, the first power adjustment circuit 1023 and the second power adjustment circuit 1024 are connected.

Specifically, the above-mentioned central control circuit 1045 can be a circuit with functions of temperature detection, polarity switching control and power adjustment control. Correspondingly, the above-mentioned central control circuit 1045 is used to receive the current temperature of the cleaning fluid measured by the first temperature measuring device 103, And based on the difference between the current temperature of the cleaning fluid and the target temperature, the first power supply polarity switching circuit 1021 is controlled to switch the first polarity applied to the first piece of the first semiconductor refrigeration piece and the third polarity applied to the second piece. bipolarity, and calculate the power required to be adjusted by the first power adjustment circuit 1023, and then adjust the power applied to the first semiconductor refrigeration chip; and control the second power supply polarity switching circuit 1022 to switch the power applied to the second semiconductor refrigeration chip. The first polarity of the first chip and the second polarity applied to the second chip are used to calculate the power required to be adjusted by the second power adjustment circuit 1024, thereby adjusting the power applied to the second semiconductor refrigeration chip.

Furthermore, if there are multiple refrigeration chip modules 101, as shown in Figure 5, taking three refrigeration chip modules 101 as an example, the specific circuit structure of the control device will be described. In the first refrigeration chip module 101 The first semiconductor refrigeration piece, the first semiconductor refrigeration piece in the second refrigeration piece module 101, and the first semiconductor refrigeration piece in the third refrigeration piece module 101 are connected in parallel and connected to the first power supply polarity switching circuit 1021 and the first power. The circuit 1023 is adjusted, and the first and second sheets in each first semiconductor refrigeration chip are connected in series; and the second semiconductor refrigeration chip in the first refrigeration chip module 101 and the second semiconductor refrigeration chip in the second refrigeration chip module 101 are connected in series. The semiconductor refrigeration chip and the second semiconductor refrigeration chip in the third refrigeration chip module 101 are connected in parallel and connected to the second power supply polarity switching circuit 1022 and the second power adjustment circuit 1024, and the first semiconductor refrigeration chip in each second semiconductor refrigeration chip is The chip body and the second chip body are connected in series. Furthermore, the second chip body of the first semiconductor refrigeration chip in each refrigeration chip module 101 is connected with the first chip body of the second semiconductor refrigeration chip in the respective module. Bonded together with a thermally conductive adhesive with good thermal conductivity.

In the embodiment provided by this application, for each refrigeration chip module 101, separate power supply polarity switching circuits and power adjustment circuits are designed for each semiconductor refrigeration chip in the refrigeration chip module 101, which can be realized through the central controller. The individual control of multiple semiconductor refrigeration chips in the refrigeration chip module 101 can flexibly control the temperature of the cleaning liquid in the cleaning tank 20, and can realize flexible switching of heating and cooling functions, thereby making the temperature control more accurate. .

Furthermore, when controlling the temperature of the cleaning liquid in the cleaning tank 20, it is necessary to adjust the voltage applied between the first and second sheets of the semiconductor refrigeration chip to adjust the DC output to the semiconductor refrigeration chip. The size of the voltage is then adjusted to the amount of power applied between the first chip and the second chip. Considering that the power supply is usually an AC power supply, in order to improve the power supply applied to the semiconductor refrigeration chip by controlling the power adjustment loop of power Stability, based on this, on the premise that the power supply 107 is an AC power supply, the control module 102 further includes: a rectifier and voltage stabilizing circuit, and the rectifier and voltage stabilizing circuit is disposed between the power adjustment circuit and the power supply 107.

The above-mentioned rectifier and voltage stabilizing circuit is used to convert the alternating current provided by the power supply 107 to obtain the required direct current, and transmit the direct current to the power adjustment circuit; the above-mentioned power adjustment circuit is used to adjust the output power to the semiconductor refrigeration chip. The magnitude of the DC voltage is used to adjust the amount of power applied between the first sheet and the second sheet.

Wherein, the above-mentioned rectifier and voltage stabilizing circuit may include: a transformer, a rectifier circuit and a voltage stabilizing circuit; the above-mentioned power supply 107 may be an AC power supply circuit; specifically, the above-mentioned rectifying and stabilizing circuit converts the AC power provided by the power supply 107 into heating The direct current required by the cleaning liquid in the cleaning tank 20 (that is, the direct current required by the semiconductor refrigeration chip) is transmitted to the power adjustment circuit, so that the power adjustment circuit adjusts the direction of the semiconductor refrigeration chip under the control of the central control circuit 1045. The magnitude of the output DC voltage further adjusts the magnitude of power applied between the first sheet and the second sheet in the semiconductor refrigeration sheet.

In the embodiment provided by this application, by arranging a rectifier and voltage stabilizing circuit between the power adjustment circuit and the power supply 107, the AC power provided by the power supply 107 can be converted into the DC power required by the semiconductor refrigeration chip, and can be adjusted by the power adjustment circuit. The magnitude of the direct current is used to adjust the amount of power applied between the first body and the second body of the semiconductor refrigeration chip, thereby achieving precise control of the temperature of the semiconductor refrigeration chip.

In a specific embodiment, after adding a second temperature measurement device, the second temperature measurement device can be directly connected to the central control circuit 1045 in the control device. In order to further improve the performance of the first temperature measurement device 103 and the second temperature measurement device, The temperature measurement accuracy of the temperature device 105 is improved, and the control of the central control circuit 1045 on multiple power supply polarity switching circuits and multiple power adjustment circuits is improved. Control flexibility, as shown in Figure 6, the central control circuit 1045 may include: a first control circuit 10451 and a second control circuit 10452, wherein the first temperature measurement device 103 is connected to the first control circuit 10451, and the first semiconductor The refrigeration chip is connected to the first control circuit 10451 through the first power supply polarity switching circuit 1021 and the first power adjustment circuit 1023; the second temperature measuring device 105 is connected to the second control circuit 10452, and the second semiconductor refrigeration chip is connected through the second power supply The polarity switching circuit 1022 and the second power adjustment circuit 1024 are connected to the second control circuit 10452; one end of the rectifier and voltage stabilizing circuit 106 is connected to the first power adjustment circuit 1023 and the second power adjustment circuit 1024, and the other end is connected to the power supply 107 connected.

Specifically, considering that switching the polarity of the semiconductor refrigeration chip may cause the temperature of the protective shell 104 to be too high, it is necessary to first determine whether to allow switching to be applied to the semiconductor based on the actual temperature measured by the second temperature measuring device 105 The first polarity of the first piece in the refrigeration piece and the second polarity applied to the second piece. The specific implementation process of electrode polarity switching and power adjustment of the semiconductor refrigeration piece refers to the above content and will not be described again here. .

Specifically, the above-mentioned first control circuit 10451 is used to receive the current temperature of the cleaning fluid measured by the first temperature measurement device 103, and control the first power supply polarity switching circuit 1021 based on the difference between the current temperature of the cleaning fluid and the target temperature. Switch the first polarity applied to the first piece of the first semiconductor refrigeration piece and the second polarity applied to the second piece, and calculate the amount of power that needs to be adjusted by the first power adjustment circuit 1023, and then adjust the amount of power applied to the second piece. The power level on a semiconductor refrigeration chip; correspondingly, the above-mentioned second control circuit 10452 is used to receive the actual temperature between the first semiconductor refrigeration chip and the second semiconductor refrigeration chip measured by the second temperature measurement device 105, and based on the actual temperature and the maximum heat-resistant temperature of the protective shell, control the second power supply polarity switching circuit 1022 to switch the first polarity applied to the first piece of the second semiconductor refrigeration piece and the second polarity applied to the second piece, and calculate the second The power required to be adjusted by the power adjustment circuit 1024 is large. small, thereby adjusting the power applied to the second semiconductor refrigeration chip.

Specifically, for the cooling process of the cleaning liquid in the cleaning tank 20, the polarity of the electrode applied to the first semiconductor refrigeration piece can be switched, so that the first piece of the first semiconductor refrigeration piece changes from the hot surface to the cold surface, and then directly The cleaning fluid is cooled down. At this time, the second body of the first semiconductor refrigeration chip will change from the cold surface to the hot surface. Therefore, if the temperature of the first body of the first semiconductor refrigeration chip is high before switching the polarity, it will Afterwards, the temperature of the second body of the first semiconductor refrigeration chip will also be higher, and then the temperature of the first body of the second semiconductor refrigeration chip will be raised through heat transfer, and the temperature of the second body of the second semiconductor refrigeration chip will be raised. The temperature of the chip body further causes the problem of the temperature of the protective shell 104 being too high. Therefore, after the polarity is switched, the temperature of the second chip body in the second semiconductor refrigeration chip cannot be higher than the maximum heat-resistant temperature of the protective shell 104.

Specifically, before switching the polarity, it can be determined whether to switch the first polarity applied to the semiconductor refrigeration chip based on the above-mentioned actual temperature and the difference between the maximum heat-resistant temperature of the protective housing 104 and the junction temperature difference of the semiconductor refrigeration chip close to the protective housing. The first polarity of the chip and the second polarity applied to the second chip are used to cool the cleaning liquid by switching the electrode polarities of the first and second chips in the first semiconductor refrigeration chip, for example, in Before switching the polarity, if the actual temperature between the first semiconductor refrigeration piece and the second semiconductor refrigeration piece is greater than or equal to the difference between the maximum heat-resistant temperature of the protective shell 104 and the junction temperature difference of the semiconductor refrigeration piece close to the protective shell, that is, the first The actual temperature measured by the second temperature measuring device 105 is greater than or equal to the difference between the maximum heat-resistant temperature of the protective housing 104 and the junction temperature difference of the semiconductor refrigeration chip close to the protective housing. After the polarity is switched, the first semiconductor refrigeration chip will The temperature of the second piece of the first semiconductor refrigeration piece increases, which causes the temperature of the second piece of the first semiconductor refrigeration piece to be greater than the maximum heat-resistant temperature of the protective shell 104, which in turn affects the protective shell 104. Therefore, before switching the polarity, , the actual temperature between the first semiconductor refrigeration piece and the second semiconductor refrigeration piece is less than the maximum temperature of the protective shell 104 The difference between the heat resistance temperature and the junction temperature difference of the semiconductor refrigeration chip close to the protective shell.

Specifically, for the cooling process of the cleaning liquid in the cleaning tank 20, the polarity of the electrode applied to the second semiconductor refrigeration chip can also be switched, so that the first piece of the second semiconductor refrigeration piece becomes a cold surface, and the heat transfer The method of lowering the temperature of the second body of the first semiconductor refrigeration piece is to lower the temperature of the first body of the first semiconductor refrigeration piece through the junction temperature difference of the first semiconductor refrigeration piece, thereby cooling the cleaning liquid. At this time The temperature of the first body of the second semiconductor refrigeration chip (that is, the actual temperature measured by the second temperature measuring device 105) must be at least less than the difference between the maximum heat-resistant temperature of the protective shell 104 and the junction temperature of the semiconductor refrigeration chip close to the protective shell. difference.

In the embodiment provided by this application, a second temperature measuring device 105 is added between the second body of the first semiconductor refrigeration piece and the first body of the second semiconductor refrigeration piece, so that the control device can be based on the second measurement. The actual temperature measured by the temperature device 105 determines whether to switch the first polarity applied to the first piece of the semiconductor refrigeration piece and the second polarity applied to the second piece, so that the cleaning liquid is processed by switching the polarity. During cooling, the temperature increase of the semiconductor refrigeration chip close to the protective housing 104 will not affect the protective housing 104 of the cleaning tank 20 , and the temperature control can be more accurate.

Using the technical solution of the embodiment of the present application, a refrigeration chip module is provided on the outer wall of the cleaning tank, and then the first chip applied to the semiconductor refrigeration chip is controlled by the control module based on the target temperature of the current temperature of the cleaning liquid in the cleaning tank. and the electrode polarity of the second piece, as well as the amount of power applied between the first piece and the second piece, to flexibly control the temperature of the cleaning liquid in the cleaning tank. This not only achieves the desired temperature of the cleaning liquid, The heating effect can also reduce the cleaning liquid from high temperature to low temperature, thereby achieving flexible switching between heating and cooling functions, which can make the temperature control more precise; and because the semiconductor refrigeration chip is in the upper working state , there will be a certain temperature difference between the first piece and the second piece, so that It can have the effect of cooling and protecting the protective shell of the cleaning tank, thereby preventing the problem of thermal deformation of the protective shell due to excessive heating temperature of the cleaning fluid in the cleaning tank.

In summary, specific embodiments of the subject matter have been described. Other embodiments are within the scope of the appended claims. In some cases, the actions documented in the claim can be performed in a different order and still achieve the desired results. Additionally, the processes depicted in the figures do not necessarily require the specific order shown, or sequential order, to achieve desirable results. In certain implementations, multiplexing and parallel processing may be advantageous.

The above is a device for controlling the temperature of the cleaning liquid in the wafer cleaning equipment provided by the embodiment of the present application. Based on the same idea, the embodiment of the present application also provides a wafer cleaning equipment.

As shown in Figure 7, the above-mentioned wafer cleaning equipment includes: a cleaning tank 20 and a control device 10 for the temperature of the cleaning liquid in the above-mentioned wafer cleaning equipment; wherein, the refrigeration module 101 in the control module 102 is disposed on the outer wall of the cleaning tank 20 On the above, at least two semiconductor refrigeration chips are arranged in sequence between the outer wall of the cleaning tank 20 and the protective shell 104 , and the first temperature measuring device 103 is arranged in the cleaning tank 20 .

In the wafer cleaning equipment of the embodiment of the present application, a refrigeration chip module is installed on the outer wall of the cleaning tank, and then the control module controls the first chip applied to the semiconductor refrigeration chip based on the target temperature of the current temperature of the cleaning liquid in the cleaning tank. The electrode polarity of the body and the second body, as well as the amount of power applied between the first body and the second body, are used to flexibly control the temperature of the cleaning liquid in the cleaning tank. The heating effect can also reduce the cleaning liquid from high temperature to low temperature, thereby achieving flexible switching of heating and cooling functions, which can make temperature control more precise; and because the semiconductor refrigeration chip is in working condition , there will be a certain temperature difference between the first piece and the second piece, which can have the effect of cooling and protecting the protective shell of the cleaning tank, thereby preventing the cleaning tank from being damaged. The heating temperature of the cleaning fluid inside is too high, causing the protective shell to be heated and deformed.

It should be noted that the control device 10 for the temperature of the cleaning liquid in the wafer cleaning equipment is based on the control device shown in FIGS. 1 to 6 above. Therefore, the specific implementation of this embodiment can be referred to the aforementioned control of the temperature of the cleaning liquid in the wafer cleaning equipment. The specific implementation of the device will not be repeated again.

The foregoing content summarizes the features of several embodiments so that those skilled in the art may better understand the aspects of the present disclosure. Those skilled in the art should appreciate that they may readily use the present disclosure as a basis for designing or modifying other processes and structures for carrying out the same purposes and/or achieving the same advantages of the embodiments described herein. Those skilled in the art should also understand that such equivalent constructions do not depart from the spirit and scope of the disclosure, and that they can be variously changed, replaced, and altered herein without departing from the spirit and scope of the disclosure.

20:Cleaning tank

101: Refrigeration module

102:Control module

103: The first temperature measuring device

Claims (11)

A device for controlling the temperature of cleaning liquid in wafer cleaning equipment, wherein the control device includes: at least one refrigeration chip module, a control module and a first temperature measurement device; wherein at least one of the refrigeration chip module is attached to the On the outer wall of a cleaning tank of the wafer cleaning equipment, each of the refrigeration chip modules includes at least two semiconductor refrigeration chips that are thermally connected in sequence. Each of the semiconductor refrigeration chips includes a first piece and a second piece. body; the first body and the second body are both connected to the control module; the first temperature measuring device is used to measure the current temperature of the cleaning liquid in the cleaning tank and transmit the current temperature to the control module ; The control module is used to control the first polarity applied to the first piece of the semiconductor refrigeration piece and the second piece of the semiconductor refrigeration piece according to the current temperature and the target temperature of the cleaning liquid. the second polarity of the body, and the amount of power applied between the first body and the second body. The control device according to claim 1, wherein the control module includes: at least two power supply polarity switching circuits, at least two power adjustment circuits and a central control circuit; wherein the first chip of each semiconductor refrigeration chip Each body is connected to a power supply through a power supply polarity switching circuit and a power adjustment circuit; the second body of each semiconductor refrigeration chip is connected through another power supply polarity switching circuit and another power adjustment circuit. Connected to the power supply; the first temperature measurement device, at least two power supply polarity switching circuits and at least two power adjustment circuits are connected to the central control circuit; The central control circuit is used to control the first polarity applied to the first sheet body and the second polarity applied to the second sheet body through the power supply polarity switching circuit according to the current temperature and the target temperature, and through the The power adjustment circuit controls the amount of power applied between the first sheet and the second sheet. The control device according to claim 1, wherein a protective shell is provided outside the cleaning tank, and a second temperature measuring device is provided between at least two of the semiconductor refrigeration fins; the second temperature measuring device is used for measuring The actual temperature of the first body of the semiconductor refrigeration chip close to the protective shell, and transmits the actual temperature to the control module; the control module is also used to determine based on the actual temperature and the maximum heat-resistant temperature of the protective shell. Whether to switch the first polarity applied to the first piece of the semiconductor refrigeration piece and the second polarity applied to the second piece, and if the judgment result is yes, switch the first polarity and the third piece Bipolarity, or if the judgment result is no, adjust the amount of power applied between the first sheet and the second sheet. The control device according to claim 3, wherein the control module is also used to adjust the first sheet and the second sheet based on the actual temperature when the actual temperature is greater than or equal to a first preset value. until the actual temperature is less than the first preset value; and when the actual temperature is less than the first preset value, it is determined to switch the first polarity and the second polarity, the first preset value The setting value is set based on the difference between the maximum heat-resistant temperature and the junction temperature difference of the semiconductor refrigeration chip close to the protective shell. The control device according to claim 3, wherein the at least two semiconductor refrigeration pieces include: A first semiconductor refrigeration piece and a second semiconductor refrigeration piece; wherein, the first piece of the first semiconductor refrigeration piece is disposed on the outer wall of the cleaning tank, and the second piece of the first semiconductor refrigeration piece is connected to the outer wall of the cleaning tank. The first piece of the first semiconductor refrigeration piece is thermally connected to the second piece of the second semiconductor refrigeration piece. The first piece of the second semiconductor refrigeration piece is thermally connected to the second piece of the first semiconductor refrigeration piece. The second piece is thermally connected to the first piece of the second semiconductor refrigeration piece and is close to the protective shell. The control device as claimed in claim 5, wherein the control module is further configured to, when the actual temperature is greater than or equal to the difference between the maximum heat-resistant temperature and the junction temperature difference of the second semiconductor refrigeration chip, based on The actual temperature adjusts the power applied to the first semiconductor refrigeration chip and the power applied to the second semiconductor refrigeration chip; when the actual temperature is less than the junction temperature difference between the maximum heat-resistant temperature and the second semiconductor refrigeration chip If there is a difference, switch the first polarity applied to the first piece of the second semiconductor refrigeration piece and the second polarity applied to the second piece, so that the third polarity of the second semiconductor refrigeration piece is One piece reduces the temperature of the second piece in the first semiconductor refrigeration piece through heat transfer; when the current temperature reaches the second preset value, the first piece in the first semiconductor refrigeration piece is adjusted. The amount of power applied between the chip body and the second chip body is such that the current temperature reaches the target temperature. The control device according to claim 6, wherein the second preset value includes the value of the cleaning liquid in the cleaning tank measured by the first temperature measuring device after the time elapsed from the switching moment reaches the preset time period. The current temperature value; or, the second preset value is a preset temperature threshold. The control device as claimed in claim 1, wherein the number of the refrigeration fin modules is multiple, and the plurality of refrigeration fin modules are arranged in an array on the outer wall of the cleaning tank. The control device according to claim 5, wherein the first sheet body and the second sheet body are bonded by a thermally conductive adhesive, and the first semiconductor refrigeration piece and the second semiconductor refrigeration piece are bonded by the thermally conductive adhesive. bonding. The control device according to claim 2, wherein the power supply is an AC power supply, and the control module further includes: a rectifier and voltage stabilizing circuit, the rectifier and voltage stabilizing circuit is disposed between the power adjustment circuit and the power supply. ; The rectifier and voltage stabilizing circuit is used to convert the alternating current provided by the power supply to obtain the required direct current, and transmit the direct current to the power adjustment circuit; the power adjustment circuit is used to adjust the supply to the semiconductor refrigeration The magnitude of the DC voltage output by the chip is used to adjust the amount of power applied between the first chip body and the second chip body. A wafer cleaning equipment, wherein the wafer cleaning equipment includes: a cleaning tank and a cleaning liquid temperature control device as described in any one of claims 1 to 10.