CN204468004U - Dish-washing machine desiccant dehumidification structure and dish-washing machine - Google Patents
Dish-washing machine desiccant dehumidification structure and dish-washing machine Download PDFInfo
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- CN204468004U CN204468004U CN201520128137.5U CN201520128137U CN204468004U CN 204468004 U CN204468004 U CN 204468004U CN 201520128137 U CN201520128137 U CN 201520128137U CN 204468004 U CN204468004 U CN 204468004U
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Abstract
The utility model is applicable to dish-washing machine field, disclose dish-washing machine desiccant dehumidification structure and dish-washing machine, dish-washing machine desiccant dehumidification structure comprises the inner bag with washing inner chamber and the semi-conductor condensation assembly be installed on inner bag, semi-conductor condensation assembly comprises the semiconductor chilling plate wearing and be installed on inner bag, be located at inner bag and be electrically connected the power supply of semiconductor chilling plate and be installed in inner bag and enclose with inner bag the condensing cover forming condensation chamber outward, condensing cover runs through the intercommunicating pore being provided with and being communicated with washing inner chamber and condensation chamber, semiconductor chilling plate has refrigeration section and heats portion, and refrigeration section to be arranged in inner bag and to be contained in condensation chamber, the portion of heating is located at outside inner bag.The utility model, at the drying stage of dish-washing machine, carrying out condensed steam by the refrigeration section in condensation chamber makes it form drop collection in condensation chamber, effectively to reduce the air humidity in washing inner chamber, and make steam not easily condensation formation water droplet on tableware, and then improve the drying property of dish-washing machine.
Description
Technical field
The utility model belongs to dish-washing machine field, particularly relates to dish-washing machine desiccant dehumidification structure and has the dish-washing machine of this dish-washing machine desiccant dehumidification structure.
Background technology
The washing process of dish-washing machine generally comprises pre-wash stage, master washes stage, rinse stage and drying stage, and because drying stage is in the final stage of washing process, therefore the drying property of dish-washing machine directly affects the satisfaction of user to product.
In prior art, in order to promote the drying property of dish-washing machine, the means of normal employing have adds bright dish agent, raising rinse temperature, drying stage ventilation and Zeolite dehydration etc., but, these means all effectively can not reduce the air humidity in inner bag, thus easily on tableware condensation form water droplet, and then had a strong impact on the lifting of dish-washing machine drying property.
Utility model content
The purpose of this utility model is to overcome above-mentioned the deficiencies in the prior art, provide dish-washing machine desiccant dehumidification structure and dish-washing machine, which solve existing dish-washing machine affects the lifting of dish-washing machine drying property because air humidity in inner bag is large technical problem at drying stage.
For achieving the above object, the technical solution adopted in the utility model is: dish-washing machine desiccant dehumidification structure, comprise the inner bag with washing inner chamber and the semi-conductor condensation assembly be installed on described inner bag, described semi-conductor condensation assembly comprises the semiconductor chilling plate wearing and be installed on described inner bag, be located at described inner bag and be electrically connected the power supply of described semiconductor chilling plate and be installed in described inner bag and enclose with described inner bag the condensing cover forming condensation chamber outward, described condensing cover runs through the intercommunicating pore being provided with and being communicated with described washing inner chamber and described condensation chamber, described semiconductor chilling plate has refrigeration section and heats portion, and described refrigeration section to be arranged in described inner bag and to be contained in described condensation chamber, the described portion of heating is located at outside described inner bag.
Particularly, described inner bag comprises and is positioned at the top board above described washing inner chamber, the side plate being positioned at described washing inner chamber periphery and the base plate be positioned at below described washing inner chamber, and described semi-conductor condensation assembly is installed on described top board or described side plate.
Preferably, described semi-conductor condensation assembly is installed on described top board, and the bottom covering department that described condensing cover has and described top board interval is oppositely arranged and the cover portion, side be connected between described bottom covering department and described top board, described intercommunicating pore is located in cover portion, described side.
Preferably, described semi-conductor condensation assembly also comprises the gauge tap be located between power supply and described semiconductor chilling plate.
Preferably, described intercommunicating pore place is provided with the adjustment means for controlling described intercommunicating pore openings of sizes.
Preferably, described adjustment means is formed in one shutter on described condensing cover or the swingable baffle plate be connected on described condensing cover.
Preferably, the semiconductor component that described semiconductor chilling plate comprises hot junction insulating trip, cold junction insulating trip and is located between described hot junction insulating trip and described cold junction insulating trip, the two ends of described power supply are electrically connected the two ends of described semiconductor component respectively, described hot junction insulating trip for described in heat portion, described cold junction insulating trip is described refrigeration section.
Preferably, described semiconductor component comprises several P-type semiconductors, several N-type semiconductors and several electric-conductors, each described P-type semiconductor and described N-type semiconductor alternate intervals are arranged between described hot junction insulating trip and described cold junction insulating trip, each described electric-conductor respectively interval to be located on described hot junction insulating trip and described cold junction insulating trip and to be connected in series each described P-type semiconductor and described N-type semiconductor, the two ends of described power supply be electrically connected respectively be positioned at insulating trip two ends, described hot junction two described in electric-conductor.
Preferably, described electric-conductor is conducting resinl or metallic conductor, the two ends of each described P-type semiconductor are fastenedly connected described hot junction insulating trip and described cold junction insulating trip respectively by each described electric-conductor, and the two ends of each described N-type semiconductor are fastenedly connected described hot junction insulating trip and described cold junction insulating trip respectively by each described electric-conductor.
Further, the utility model additionally provides dish-washing machine, and it comprises above-mentioned dish-washing machine desiccant dehumidification structure.
The dish-washing machine desiccant dehumidification structure that the utility model provides and dish-washing machine, by setting up semi-conductor condensation assembly on inner bag, and enclose formation condensation chamber especially by condensing cover and inner bag inwall, condensation chamber and washing inner chamber is communicated with by the intercommunicating pore on condensing cover, the refrigeration section of semiconductor chilling plate being extended is located in condensation chamber, like this, at the drying stage of dish-washing machine, by starting semi-conductor condensation assembly, to make, the refrigeration section in condensation chamber is condensable to enter the steam of condensation chamber and makes steam form drop collection in condensation chamber in intercommunicating pore, effectively to reduce the air humidity in washing inner chamber, and then be beneficial to the drying efficiency improving dish-washing machine, and make steam not easily condensation formation water droplet on tableware, improve the drying effect of dish-washing machine, lifting for dish-washing machine drying property provides a kind of new solution.Simultaneously, the utility model employing semiconductor chilling plate carries out the steam in condensation inner bag, also can obtain following beneficial effect: on the one hand due to semiconductor chilling plate mechanical transmission in process of refrigerastion, therefore, noiselessness in its work, is beneficial to the lifting preventing dish-washing machine noise; On the other hand due to semiconductor chilling plate in process of refrigerastion without any need for liquid or gaseous refrigerant, therefore it is longer that it can not produce pollution sources, life-span, is beneficial to the environmental-protecting performance and service life that ensure dish-washing machine; Again on the one hand because the refrigerating efficiency of semiconductor chilling plate is high, therefore be beneficial to the drying efficiency improving dish-washing machine further, and be beneficial to the electric energy saving dish-washing machine.
Accompanying drawing explanation
Fig. 1 is the structural representation of the dish-washing machine desiccant dehumidification structure that the utility model embodiment provides;
Fig. 2 is the partial structurtes schematic diagram that semi-conductor condensation assembly that the utility model embodiment provides is installed on inner bag.
Detailed description of the invention
In order to make the purpose of this utility model, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the utility model, and be not used in restriction the utility model.
It should be noted that, when element is called as on " being fixed on " or " being arranged at " another element, it can directly on another element or may there is centering elements simultaneously.When an element is known as " connection " another element, it can be directly connect another element or may there is centering elements simultaneously.
Also it should be noted that, the orientation term such as left and right, upper and lower, the top in the utility model embodiment, end, is only relative concept or be reference with the normal operating condition of product each other, and should not be regarded as have restrictive.
As depicted in figs. 1 and 2, the dish-washing machine desiccant dehumidification structure that the utility model embodiment provides, comprise the inner bag 1 with washing inner chamber 10 and the semi-conductor condensation assembly 2 be installed on inner bag 1, semi-conductor condensation assembly 2 comprises the semiconductor chilling plate 21 wearing and be installed on inner bag 1, be located at inner bag 1 outer and be electrically connected the power supply 22 of semiconductor chilling plate 21 and be installed in inner bag 1 and enclose with inner bag 1 condensing cover 23 forming condensation chamber 20, condensing cover 23 runs through the intercommunicating pore 231 being provided with and being communicated with washing inner chamber 10 and condensation chamber 20, semiconductor chilling plate 21 has refrigeration section and heats portion, and refrigeration section to be arranged in inner bag 1 and to be contained in condensation chamber 20, the portion of heating is located at outside inner bag 1.Power supply 22 is that semi-conductor condensation assembly 2 freezes the power part of condensation, is located at outside inner bag 1 by power supply 22, is beneficial to the seal request reducing power supply 22 and install, and is beneficial to and prevents from washings from producing power supply 22 interfering.Semiconductor chilling plate 21 is that semi-conductor condensation assembly 2 freezes the execution unit of condensation.The setting of condensing cover 23, can prevent washings byte to be ejected on semiconductor chilling plate 21 on the one hand, be beneficial to protective semiconductor cooling piece 21; Can be used for the water droplet that collection semiconductor cooling piece 21 condensed steam is formed on the other hand, to prevent the water droplet formed by semiconductor chilling plate 21 condensation from dropping onto on the tableware of washing inner chamber 10, and then be beneficial to the drying effect ensureing dish-washing machine.The setting of intercommunicating pore 231 on condensing cover 23, is mainly used in ensureing that the drying stage steam washed in inner chamber 10 can enter in condensation chamber 20 and carries out condensation.The utility model embodiment, at the drying stage of dish-washing machine, by starting semi-conductor condensation assembly 2, to make, the refrigeration section in condensation chamber 20 is condensable to enter the steam of condensation chamber 20 and makes steam form drop collection in condensation chamber 20 in intercommunicating pore 231, effectively to reduce the air humidity in washing inner chamber 10, and then be beneficial to the drying efficiency improving dish-washing machine, and make steam not easily condensation formation water droplet on tableware, improve the drying effect of dish-washing machine, the lifting for dish-washing machine drying property provides a kind of new solution.Simultaneously, the utility model embodiment employing semiconductor chilling plate 21 carries out the steam in condensation inner bag 1, also can obtain following beneficial effect: on the one hand due to semiconductor chilling plate 21 mechanical transmission in process of refrigerastion, therefore, noiselessness in its work, is beneficial to the lifting preventing dish-washing machine noise; On the other hand due to semiconductor chilling plate 21 in process of refrigerastion without any need for liquid or gaseous refrigerant, therefore it is longer that it can not produce pollution sources, life-span, is beneficial to the environmental-protecting performance and service life that ensure dish-washing machine; Again on the one hand because the refrigerating efficiency of semiconductor chilling plate 21 is high, therefore be beneficial to the drying efficiency improving dish-washing machine further, and be beneficial to the electric energy saving dish-washing machine.
Particularly, power supply 22 has positive pole and negative pole and its constant polarity, and the constant polarity of power supply 22 refers to that the polarity of power supply 22 can not change, and namely the positive pole of power supply 22 and negative pole can not convert.Power supply 22 preferably adopts dc source 22, and dc source 22 specifically can be dry cell or battery or dc generator etc., the constant polarity of dc source 22, meets the design performance requirement of power supply 22, and it has simple, the compact feature of structure.Of course, in embody rule, power supply 22 also can adopt the combination of AC power 22, transformer and rectifier, like this, by the rectified action of rectifier, also can reach the object of the constant polarity making power supply 22, thus also can meet the design performance requirement of power supply 22.
Particularly, as depicted in figs. 1 and 2, inner bag 1 comprises and is positioned at the top board 11 above washing inner chamber 10, the side plate 12 being positioned at washing inner chamber 10 periphery and the base plate 13 be positioned at below washing inner chamber 10, and semi-conductor condensation assembly 2 is installed on top board 11 or side plate 12.Due at drying stage, steam in inner bag 1 can be gathered in the top of washing inner chamber 10 in a large number, therefore, semi-conductor condensation assembly 2 is installed on top board 11 or side plate 12, be beneficial to steam to enter better in condensation chamber 20 and carry out condensation, thus be beneficial to the condensed steam effect ensureing semi-conductor condensation assembly 2, and then be beneficial to the lifting of dish-washing machine drying property.
Preferably, as depicted in figs. 1 and 2, semi-conductor condensation assembly 2 is installed on top board 11, and the bottom covering department 232 that condensing cover 23 has and top board 11 interval is oppositely arranged and the cover portion, side 233 be connected between bottom covering department 232 and top board 11, intercommunicating pore 231 is located in cover portion, side 233.Semi-conductor condensation assembly 2 is installed on top board 11, the condensed steam effect of semi-conductor condensation assembly 2 can be made to reach optimum state; And intercommunicating pore 231 is located at cover portion, Zhao Bu233 side, side 233, under ensureing that the steam in washing inner chamber 10 smooth and easyly can enter the prerequisite of condensation chamber 20, be also beneficial to the phenomenon preventing non-dry stage wash water from spurting into condensation chamber 20 better and occur.
Preferably, the modes of removably connecting such as condensing cover 23 is connected by buckle or screw is spirally connected are installed on inner bag 1, like this, are beneficial to the fast assembling-disassembling of condensing cover 23.Thus condensing cover 23 can be disassembled when accumulating a certain amount of condensed water in it is outwelled by the condensed water in condensation chamber 20, occur with the phenomenon preventing the condensed water in condensation chamber 20 from too much affecting semi-conductor condensation assembly 2 condensation effect.Of course, in embody rule, also can in the non-dry stage of dish-washing machine, by the positive pole of reversal connection power supply 22, negative pole with the refrigeration section of exchanging semiconductor chilling plate 21 with heat portion, like this, also can effectively the condensate evaporation in condensation chamber 20 be fallen.
Further, as depicted in figs. 1 and 2, semi-conductor condensation assembly 2 also comprises the gauge tap 24 be located between power supply 22 and semiconductor chilling plate 21.Power supply 22, to connect especially by wired in series between semiconductor chilling plate 21 and gauge tap 24.Gauge tap 24 for controlling the running status of semi-conductor condensation assembly 2, namely for controlling the connecting and disconnecting of power supply 22 and semiconductor chilling plate 21; In embody rule, can carry out by gauge tap 24 switch on power 22 and semiconductor chilling plate 21 at the drying stage of dish-washing machine, enter steam in condensation chamber 20 to be carried out condensation by the refrigerating operaton of semiconductor chilling plate 21, thus reach the object promoting dish-washing machine drying property; And carry out deenergization 22 and the connection of semiconductor chilling plate 21 in the non-dry stage by gauge tap 24, to avoid semi-conductor condensation assembly 2 to flog a dead horse, thus avoid the waste of electric energy.
Preferably, intercommunicating pore 231 place is provided with the adjustment means (not shown) for controlling intercommunicating pore 231 openings of sizes, like this, be convenient to the openings of sizes of carrying out flexible modulation intercommunicating pore 231 according to the concrete using state of dish-washing machine, such as, by adjustment means, the opening of intercommunicating pore 231 is turned down in the non-dry stage of dish-washing machine the state being even adjusted to and the opening of intercommunicating pore 231 is closed completely, during to prevent the non-dry stage, washings are ejected in condensation chamber 20 from intercommunicating pore 231; And by adjustment means, the opening of intercommunicating pore 231 is tuned up at the drying stage of dish-washing machine the state being even adjusted to maximum open, carry out condensation to ensure that steam can enter in condensation chamber 20 fast, and then be beneficial to the drying efficiency and drying effect that ensure dish-washing machine.
Preferably, adjustment means is formed in one shutter on condensing cover 23 or the swingable baffle plate be connected on condensing cover 23.Shutter is connected to form by swingable blade, and the window of shutter is the intercommunicating pore 231 of condensing cover 23.Shutter and baffle plate all have the feature that structure is simple, be easy to setting, thus are beneficial to the structure simplifying semi-conductor condensation assembly 2.
Particularly, as depicted in figs. 1 and 2, the semiconductor component 213 that semiconductor chilling plate 21 comprises hot junction insulating trip 211, cold junction insulating trip 212 and is located between hot junction insulating trip 211 and cold junction insulating trip 212, the two ends of power supply 22 are electrically connected the two ends of semiconductor component 213 respectively, hot junction insulating trip 211 is for heating portion, and cold junction insulating trip 212 is refrigeration section.Hot junction insulating trip 211 and cold junction insulating trip 212 are that semiconductor chilling plate 21 is directly used in the parts with external agency heat exchange.
More specifically, as depicted in figs. 1 and 2, semiconductor component 213 comprises several P-type semiconductors 2131, several N-type semiconductor 2132 and several electric-conductors 2133, each P-type semiconductor 2131 and N-type semiconductor 2132 alternate intervals spread configuration are between hot junction insulating trip 211 and cold junction insulating trip 212, each electric-conductor 2133 respectively interval to be located on hot junction insulating trip 211 and cold junction insulating trip 212 and to be connected in series each P-type semiconductor 2131 and N-type semiconductor 2132, the two ends of power supply 22 are electrically connected on two electric-conductor 2 two ends being positioned at hot junction insulating trip 211 two ends respectively, like this, power supply 22 can be made, each electric-conductor 2133, each P-type semiconductor 2131 and each N-type semiconductor 2132 are connected in series formation one current loop, and the heat that it produces can be passed to hot junction insulating trip 211 with on cold junction insulating trip 212 by electric-conductor 2133.Due to power supply 22, hot junction insulating trip 211, hot junction absolutely on electric-conductor 2133 be all positioned at outside inner bag 1, therefore, the positive pole of power supply 22 is connected with two electric-conductors 2133 being positioned at hot junction insulating trip 211 two ends respectively with negative pole, the cabling of optimization wire can be beneficial to.
Preferably, electric-conductor 2133 is conducting resinl or metallic conductor, the two ends of each P-type semiconductor 2131 are fastenedly connected hot junction insulating trip 211 and cold junction insulating trip 212 respectively by each electric-conductor 2133, and the two ends of each N-type semiconductor 2132 are fastenedly connected hot junction insulating trip 211 and cold junction insulating trip 212 respectively by each electric-conductor 2133.As a better embodiment of the utility model embodiment, electric-conductor 2133 adopts high temperature resistant with resistance to low temperature all preferably conducting resinl, the two ends of each P-type semiconductor 2131 are respectively by each conductive adhesive hot junction insulating trip 211 and cold junction insulating trip 212, and the two ends of each N-type semiconductor 2132 are respectively by each conductive adhesive hot junction insulating trip 211 and cold junction insulating trip 212.Conducting resinl electric conductivity is good, is beneficial to the conductive effect ensureing semiconductor component 213.And conducting resinl has good viscosity, P-type semiconductor 2131 and N-type semiconductor 2132 can be bonded and fixed between hot junction insulating trip 211 and cold junction insulating trip 212 by it, like this, it is under guarantee semiconductor component 213 has the prerequisite of excellent conductive performance, P-type semiconductor 2131 and N-type semiconductor 2132 can be avoided to need extra limiting component to carry out fixing phenomenon is installed, thus simplify the structure of semiconductor component 213 and save the cost of semiconductor component 213.Of course, in embody rule, electric-conductor 2133 also can adopt electric conductivity preferably metallic conductor, as aluminium component or copper material component etc., and metallic conductor specifically can adopt bond to carry out one end of bonding P-type semiconductor 2131 and the other end of hot junction insulating trip 211, bonding P-type semiconductor 2131 and one end of cold junction insulating trip 212, bonding N-type semiconductor 2132 and the other end of hot junction insulating trip 211, bonding N-type semiconductor 2132 and cold junction insulating trip 212.
Further, the utility model embodiment still provides dish-washing machine, and it comprises above-mentioned dish-washing machine desiccant dehumidification structure.The dish-washing machine that the utility model embodiment provides also comprises to be located at for the bowl and basket assembly 3 holding tableware (not shown), the shell (not shown) etc. being located at the spray arm device (not shown) in washing inner chamber 10 and covering in outside inner bag 1 in washing inner chamber 10, and bowl and basket assembly 3 specifically can comprise the upper dish basket 31 and lower bowl basket 32 that arrange in upper-lower position.The dish-washing machine that the utility model embodiment provides, owing to being provided with above-mentioned dish-washing machine desiccant dehumidification structure, therefore, improve drying effect and the drying efficiency of dish-washing machine dramatically, and then be beneficial to raising user to the satisfaction of product.
The foregoing is only preferred embodiment of the present utility model; not in order to limit the utility model; all do within spirit of the present utility model and principle any amendment, equivalent to replace or improvement etc., all should be included within protection domain of the present utility model.
Claims (10)
1. dish-washing machine desiccant dehumidification structure, it is characterized in that: comprise the inner bag with washing inner chamber and the semi-conductor condensation assembly be installed on described inner bag, described semi-conductor condensation assembly comprises the semiconductor chilling plate wearing and be installed on described inner bag, be located at described inner bag and be electrically connected the power supply of described semiconductor chilling plate and be installed in described inner bag and enclose with described inner bag the condensing cover forming condensation chamber outward, described condensing cover runs through the intercommunicating pore being provided with and being communicated with described washing inner chamber and described condensation chamber, described semiconductor chilling plate has refrigeration section and heats portion, and described refrigeration section to be arranged in described inner bag and to be contained in described condensation chamber, the described portion of heating is located at outside described inner bag.
2. dish-washing machine desiccant dehumidification structure as claimed in claim 1, it is characterized in that: described inner bag comprises and is positioned at the top board above described washing inner chamber, the side plate being positioned at described washing inner chamber periphery and the base plate be positioned at below described washing inner chamber, and described semi-conductor condensation assembly is installed on described top board or described side plate.
3. dish-washing machine desiccant dehumidification structure as claimed in claim 2, it is characterized in that: described semi-conductor condensation assembly is installed on described top board, the bottom covering department that described condensing cover has and described top board interval is oppositely arranged and the cover portion, side be connected between described bottom covering department and described top board, described intercommunicating pore is located in cover portion, described side.
4. the dish-washing machine desiccant dehumidification structure as described in any one of claims 1 to 3, is characterized in that: described semi-conductor condensation assembly also comprises the gauge tap be located between power supply and described semiconductor chilling plate.
5. the dish-washing machine desiccant dehumidification structure as described in any one of claims 1 to 3, is characterized in that: described intercommunicating pore place is provided with the adjustment means for controlling described intercommunicating pore openings of sizes.
6. dish-washing machine desiccant dehumidification structure as claimed in claim 5, is characterized in that: described adjustment means is formed in one shutter on described condensing cover or the swingable baffle plate be connected on described condensing cover.
7. the dish-washing machine desiccant dehumidification structure as described in any one of claims 1 to 3, it is characterized in that: the semiconductor component that described semiconductor chilling plate comprises hot junction insulating trip, cold junction insulating trip and is located between described hot junction insulating trip and described cold junction insulating trip, the two ends of described power supply are electrically connected the two ends of described semiconductor component respectively, described hot junction insulating trip for described in heat portion, described cold junction insulating trip is described refrigeration section.
8. dish-washing machine desiccant dehumidification structure as claimed in claim 7, it is characterized in that: described semiconductor component comprises several P-type semiconductors, several N-type semiconductors and several electric-conductors, each described P-type semiconductor and described N-type semiconductor alternate intervals are arranged between described hot junction insulating trip and described cold junction insulating trip, each described electric-conductor respectively interval to be located on described hot junction insulating trip and described cold junction insulating trip and to be connected in series each described P-type semiconductor and described N-type semiconductor, the two ends of described power supply be electrically connected respectively be positioned at insulating trip two ends, described hot junction two described in electric-conductor.
9. dish-washing machine desiccant dehumidification structure as claimed in claim 8, it is characterized in that: described electric-conductor is conducting resinl or metallic conductor, the two ends of each described P-type semiconductor are fastenedly connected described hot junction insulating trip and described cold junction insulating trip respectively by each described electric-conductor, and the two ends of each described N-type semiconductor are fastenedly connected described hot junction insulating trip and described cold junction insulating trip respectively by each described electric-conductor.
10. dish-washing machine, is characterized in that: comprise the dish-washing machine desiccant dehumidification structure as described in any one of claim 1 to 9.
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| CN201520128137.5U CN204468004U (en) | 2015-03-05 | 2015-03-05 | Dish-washing machine desiccant dehumidification structure and dish-washing machine |
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| CN201520128137.5U CN204468004U (en) | 2015-03-05 | 2015-03-05 | Dish-washing machine desiccant dehumidification structure and dish-washing machine |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104665742A (en) * | 2015-03-05 | 2015-06-03 | 佛山市顺德区美的洗涤电器制造有限公司 | Drying and dehumidifying structure for dish-washing machine and dish-washing machine |
| CN107149452A (en) * | 2016-03-03 | 2017-09-12 | 杭州三花家电热管理系统有限公司 | Dish-washing machine with drying system |
| CN108113613A (en) * | 2016-11-30 | 2018-06-05 | 博西华电器（江苏）有限公司 | Dish-washing machine |
| TWI830499B (en) * | 2021-11-30 | 2024-01-21 | 大陸商北京北方華創微電子裝備有限公司 | Control device of cleaning solution temperature in wafer cleaning equipment and wafer cleaning equipment |
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2015
- 2015-03-05 CN CN201520128137.5U patent/CN204468004U/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104665742A (en) * | 2015-03-05 | 2015-06-03 | 佛山市顺德区美的洗涤电器制造有限公司 | Drying and dehumidifying structure for dish-washing machine and dish-washing machine |
| CN107149452A (en) * | 2016-03-03 | 2017-09-12 | 杭州三花家电热管理系统有限公司 | Dish-washing machine with drying system |
| CN107149452B (en) * | 2016-03-03 | 2020-08-07 | 三花亚威科电器设备（芜湖）有限公司 | Dish washer with drying system |
| CN108113613A (en) * | 2016-11-30 | 2018-06-05 | 博西华电器（江苏）有限公司 | Dish-washing machine |
| CN108113613B (en) * | 2016-11-30 | 2021-12-07 | 博西华电器（江苏）有限公司 | Dish washing machine |
| TWI830499B (en) * | 2021-11-30 | 2024-01-21 | 大陸商北京北方華創微電子裝備有限公司 | Control device of cleaning solution temperature in wafer cleaning equipment and wafer cleaning equipment |
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Effective date of registration: 20221213 Address after: 241000 west side of 3 / F, No.5 office building, new energy and new materials gathering area, Fuzhou Road, Jiangbei District, Wuhu City, Anhui Province Patentee after: Wuhu Midea intelligent kitchen electricity Manufacturing Co.,Ltd. Address before: 528311 Beijiao Town Industrial Park, Shunde District, Foshan City, Guangdong Province Patentee before: FOSHAN SHUNDE MIDEA WASHING APPLIANCES MANUFACTURING Co.,Ltd. |
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