TWI830359B - Package structure of fingerprint recognition chip module and method for manufacturing the same - Google Patents
Package structure of fingerprint recognition chip module and method for manufacturing the same Download PDFInfo
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- TWI830359B TWI830359B TW111133045A TW111133045A TWI830359B TW I830359 B TWI830359 B TW I830359B TW 111133045 A TW111133045 A TW 111133045A TW 111133045 A TW111133045 A TW 111133045A TW I830359 B TWI830359 B TW I830359B
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Abstract
Description
本發明係關於一種晶片模組的封裝結構及其製作方法,特別是關於一種指紋辨識晶片模組的封裝結構及其製作方法。The present invention relates to a packaging structure of a chip module and a manufacturing method thereof, in particular to a packaging structure of a fingerprint identification chip module and a manufacturing method thereof.
現有的指紋辨識裝置像是光學式指紋辨識器由於光源輔助照明辨識功能具有較大體積,而電容式指紋辨識器雖然結構輕薄,但是電容式指紋辨識器的上方設有讓使用者需手指貼附於外表面的保護蓋板,使得保護蓋板的外表面中設置於感測區塊的凹槽影響到電子設備的外觀完整性。Existing fingerprint recognition devices such as optical fingerprint readers are large in size due to the light source auxiliary illumination recognition function. Although capacitive fingerprint readers have a light and thin structure, there is a structure on the top of the capacitive fingerprint reader that the user needs to attach with their fingers. The protective cover on the outer surface causes the groove provided in the sensing block in the outer surface of the protective cover to affect the appearance integrity of the electronic device.
一般來說,指紋辨識晶片封裝結構主要包含線路載板、指紋辨識晶片、多個導線以及封裝膠體,上述的指紋感測區域大多是位於指紋辨識晶片表面,且包覆於指紋辨識晶片的封裝膠體厚度會影響指紋辨識晶片封裝結構的感測靈敏度。Generally speaking, the fingerprint recognition chip packaging structure mainly includes a circuit carrier board, a fingerprint recognition chip, a plurality of wires, and packaging colloid. Most of the above-mentioned fingerprint sensing areas are located on the surface of the fingerprint recognition chip and cover the packaging colloid of the fingerprint recognition chip. The thickness will affect the sensing sensitivity of the fingerprint recognition chip packaging structure.
因此,需要提出改良的封裝結構與製作方法,以在顧及外觀的考量下縮減封裝結構體積與厚度並維持封裝結構所包含的元件。Therefore, it is necessary to propose improved packaging structures and manufacturing methods to reduce the volume and thickness of the packaging structure while maintaining the components included in the packaging structure while taking the appearance into consideration.
為達到有效解決上述問題之目的,本發明提出一種指紋辨識晶片模組的封裝結構之製作方法,包括:提供具有晶片設置區的一線路載板;設置具有一辨識區的一指紋辨識晶片於晶片設置區;電性連接指紋辨識晶片與線路載板;塗佈一材料塗層於線路載板的晶片設置區上,且材料塗層覆蓋指紋辨識晶片;以及形成一覆蓋層於部分之晶片設置區上方,而露出辨識區。In order to effectively solve the above problems, the present invention proposes a method for manufacturing a packaging structure of a fingerprint identification chip module, which includes: providing a circuit carrier board with a chip setting area; and setting a fingerprint identification chip with an identification area on the chip. Setting area; electrically connecting the fingerprint identification chip and the circuit carrier board; coating a material coating on the chip setting area of the circuit carrier board, and the material coating covers the fingerprint identification chip; and forming a covering layer on part of the chip setting area above, revealing the identification area.
根據本發明一實施例,該線路載板是硬式基板或軟式基板。According to an embodiment of the present invention, the circuit carrier board is a rigid substrate or a flexible substrate.
根據本發明一實施例,所塗佈的該材料塗層厚度小於25um,並具有在2~8範圍內的介電常數。According to an embodiment of the present invention, the thickness of the applied material coating is less than 25um, and has a dielectric constant in the range of 2 to 8.
根據本發明一實施例,該覆蓋層為一複合塑料框或液態膠體並具有小於80um的厚度。According to an embodiment of the present invention, the covering layer is a composite plastic frame or liquid colloid and has a thickness of less than 80um.
根據本發明一實施例,該封裝結構之製作方法於塗佈該材料層之前,進一步設置未經封裝之一安全加密晶片、一微處理器晶片、一電源處理晶片、至少一電阻元件及至少一電容元件於該晶片設置區;電性連接該安全加密晶片、該微處理器晶片、該電源處理晶片、該電阻元件、該電容元件、該指紋辨識晶片與線路載板;該塗佈該材料塗層及形成該覆蓋層於該安全加密晶片、該微處理器晶片、該電源處理晶片、該電阻元件及該電容元件上。According to an embodiment of the present invention, before coating the material layer, the manufacturing method of the packaging structure further includes an unpackaged security encryption chip, a microprocessor chip, a power processing chip, at least one resistor element and at least one The capacitive element is in the chip setting area; electrically connected to the security encryption chip, the microprocessor chip, the power processing chip, the resistive element, the capacitive element, the fingerprint identification chip and the circuit carrier board; the coating material is layer and forming the covering layer on the security encryption chip, the microprocessor chip, the power processing chip, the resistive element and the capacitive element.
本發明另提出一種指紋辨識晶片模組的封裝結構,包括一線路載板、一指紋辨識晶片、一材料塗層以及一覆蓋層。線路載板具有一晶片設置區。指紋辨識晶片具有一辨識區,設置在晶片設置區中,且電性連接至線路載板。材料塗層塗佈於線路載板的晶片設置區上,覆蓋指紋辨識晶片。覆蓋層形成於部分的晶片設置區上方,辨識區露出覆蓋層。The present invention also proposes a packaging structure of a fingerprint identification chip module, which includes a circuit carrier board, a fingerprint identification chip, a material coating and a covering layer. The circuit carrier board has a chip setting area. The fingerprint identification chip has an identification area, which is arranged in the chip setting area and is electrically connected to the circuit carrier board. The material coating is coated on the chip setting area of the circuit carrier board and covers the fingerprint recognition chip. The covering layer is formed over part of the chip setting area, and the covering layer is exposed in the identification area.
根據本發明一實施例,該封裝結構進一步包含一安全加密晶片、一微處理器晶片、一電源處理晶片、至少一電阻元件及至少一電容元件,設置於該晶片設置區,且電性連接該指紋辨識晶片及該線路載板。According to an embodiment of the present invention, the package structure further includes a security encryption chip, a microprocessor chip, a power processing chip, at least one resistive element and at least one capacitive element, which are disposed in the chip setting area and electrically connected to the Fingerprint identification chip and the circuit carrier board.
通過使用本發明製作方法的製作的指紋辨識晶片模組的封裝結構,藉由材料塗層及覆蓋層的封裝方式,能在顧及外觀的考量下縮減封裝結構體積與厚度並維持封裝結構所包含的元件。By using the packaging structure of the fingerprint recognition chip module produced by the manufacturing method of the present invention, through the packaging method of material coating and covering layer, the volume and thickness of the packaging structure can be reduced while taking into account the appearance while maintaining the packaging structure. element.
以下配合圖式及元件符號對本發明的實施方式做更詳細的說明,俾使熟習本發明所屬技術領域中之通常知識者在研讀本說明書後可據以實施本發明。本文所用術語僅用於闡述特定實施例,而並非旨在限制本發明。The following is a more detailed description of the embodiments of the present invention with reference to drawings and component symbols, so that those skilled in the technical field to which the present invention belongs can implement the present invention accordingly after reading this description. The terminology used herein is for describing particular embodiments only and is not intended to be limiting of the invention.
圖1係使用本發明一實施例的指紋辨識晶片模組的封裝結構的智慧卡示意圖,圖2係圖1實施例的指紋辨識晶片模組10的封裝結構的背面示意圖。請參照圖1,智慧卡1包含指紋辨識晶片模組10與智慧卡晶片20,指紋辨識晶片模組10可與智慧卡晶片20透過串行週邊介面(serial peripheral interface, SPI)或積體電路介接匯流排(inter-integrated circuit bus, I
2C)等方式進行單/雙向通訊。指紋辨識晶片模組10包含指紋辨識晶片100、電源處理晶片(power management unit, PMU)110、微處理器晶片(micro processing unit, MCU)120、安全加密(security encryption, SE)晶片130、以及被動元件140,電源處理晶片110、微處理器晶片120、以及被動元件140與指紋辨識晶片100耦接。指紋辨識晶片100具有辨識區AA,電源處理晶片110與微處理器晶片120耦接,用於將外部電源控制在1.8V~5V之電源供應單元,可提供微處理器晶片120與安全加密晶片130等內部元件使用。安全加密晶片130與微處理器晶片120耦接,其加密格式可以為AES或HMAC。微處理器晶片120可以為ARM/RISC-V/8051等可運算與加密的微處理單元。被動元件140為電阻及/或電容。指紋辨識晶片100、電源處理晶片110、微處理器晶片120、安全加密晶片130、以及可視需求改變數量的被動元件140可視實際應用(不限金融領域)而變動或調換。請參照圖2,指紋辨識晶片模組10的背面包含複數個金屬接點150,可供指紋辨識晶片模組10搭接至智慧卡的電路基板上的線路(未圖示)。
FIG. 1 is a schematic diagram of a smart card using the packaging structure of the fingerprint identification chip module according to an embodiment of the present invention. FIG. 2 is a schematic view of the back of the packaging structure of the fingerprint
本發明的指紋辨識晶片模組的封裝結構之製作方法,包含:提供具有一晶片設置區的一線路載板,並在晶片設置區設置具有辨識區的指紋辨識晶片;電性連接指紋辨識晶片與線路載板;塗佈材料塗層於線路載板的晶片設置區上,且材料塗層覆蓋指紋辨識晶片;形成一覆蓋層於部分之晶片設置區上方,而露出辨識區。The manufacturing method of the packaging structure of the fingerprint identification chip module of the present invention includes: providing a circuit carrier board with a chip setting area, and setting a fingerprint identification chip with an identification area in the chip setting area; electrically connecting the fingerprint identification chip and Circuit carrier board; apply a material coating on the chip setting area of the circuit carrier board, and the material coating covers the fingerprint identification chip; form a covering layer above part of the chip setting area to expose the identification area.
圖3A~圖3D係根據本發明一實施例的指紋辨識晶片模組的封裝結構的製作流程示意圖。如圖3A所示,在線路載板12上設置指紋辨識晶片100、未經封裝的電源處理晶片110、未經封裝的微處理器晶片120、未經封裝的安全加密晶片130、被動元件140等,以打線11電性連接指紋辨識晶片100、電源處理晶片110、微處理器晶片120、安全加密晶片130與線路載板12上的線路,以表面貼焊技術(Surface mount tech, SMT)將被動元件140固定至載板12。3A to 3D are schematic diagrams of the manufacturing process of the packaging structure of the fingerprint recognition chip module according to an embodiment of the present invention. As shown in FIG. 3A , a
接著,如圖3B所示,施加打線膠21在打線11上,以保護各種晶片與線路載板12的電性連接。Next, as shown in FIG. 3B ,
接著,如圖3C所示,將材料塗層22塗佈於線路載板12的晶片設置區上,且材料塗層22覆蓋指紋辨識晶片100、電源處理晶片110、微處理器晶片120、安全加密晶片130及被動元件140。Next, as shown in FIG. 3C , the
最後,如圖3D所示,在部分的晶片設置區上方形成覆蓋層23,露出指紋辨識晶片100的辨識區AA區覆蓋層的底部與材料塗層22通過打線11的突起部位匹配貼合,並在表面維持平坦。Finally, as shown in FIG. 3D , a covering
在此實施例中,線路載板12具有晶片設置區,且線路載板除了可使用玻璃環氧樹脂多層材(FR-4)組成的硬式基板、軟性印刷電路板(Flexible Print Circuit, FPC)組成的軟性基板之外,亦可為雙馬來醯亞胺三嗪樹脂(BT樹脂)基板、ABF(Ajinomoto Build-up Film)基板、MIS基板(即C2iM(Copper Connection in Molding)基板)、聚醯亞胺(MPI)軟板或液晶高分子(Liquid Crystal Polymer, LCP)軟板。指紋辨識晶片100的指紋晶片感測器材質可以為矽(Si)、玻璃、導電薄膜等材質製作而成,塗佈於晶片設置區上的材料塗層22,的材料可選用液晶高分子(liquid crystal polymer, LCP)樹脂材料加上玻璃纖維,材料塗層22的厚度約大於10um且小於25um,硬度大於3H,並具有在2~8範圍內的介電常數。覆蓋層23為一複合材料(塑料)或液態膠體,例如二氧化矽與樹酯混合物,可經熱貼合或光固形的方式附著在非感測區的材料層22上,以保護指紋辨識晶片100、電源處理晶片110、微處理器晶片120、安全加密晶片130等晶片、被動元件、打線及線路,覆蓋層23的厚度不大於80um。若指紋辨識晶片模組的封裝結構應用於圖1所示的智慧卡,辨識區AA及智慧卡晶片20覆蓋材料塗層22之後,其上方不會有覆蓋層23。In this embodiment, the
通過使用本發明製作方法的製作的指紋辨識晶片模組的封裝結構,藉由材料塗層及覆蓋層的封裝方式,能在顧及外觀的考量下縮減封裝結構體積與厚度並維持封裝結構所包含的元件。By using the packaging structure of the fingerprint recognition chip module produced by the manufacturing method of the present invention, through the packaging method of material coating and covering layer, the volume and thickness of the packaging structure can be reduced while taking into account the appearance while maintaining the packaging structure. element.
本發明不限於上述實施例,對於本技術領域的技術人員顯而易見的是,在不脫離本發明的精神或範疇的情況下,可對本發明作出各種修改和變化。The present invention is not limited to the above-described embodiments, and it is obvious to those skilled in the art that various modifications and changes can be made to the present invention without departing from the spirit or scope of the invention.
因此,本發明旨在涵蓋對本發明或落入所附申請專利範圍及其均等範疇內所作的修改與變化。Therefore, it is intended that the present invention covers the modifications and variations of this invention that may come within the scope of the appended claims and their equivalents.
1:智慧卡1:Smart card
10:指紋辨識晶片模組10:Fingerprint recognition chip module
11:打線11:Threading
12:線路載板12: Line carrier board
20:智慧卡晶片20:Smart card chip
21:打線膠21: Wire glue
22:材料塗層22: Material coating
23:覆蓋層23: Covering layer
100:指紋辨識晶片100:Fingerprint identification chip
110:電源處理晶片110:Power processing chip
120:微處理器晶片120:Microprocessor chip
130:安全加密晶片130:Security encryption chip
140:被動元件140: Passive components
150:金屬接點150:Metal contact
AA:辨識區AA: identification area
圖1係使用本發明一實施例的指紋辨識晶片模組的封裝結構的智慧卡示意圖; 圖2係圖1所示指紋辨識晶片模組封裝結構的背面示意圖; 圖3A~圖3D係根據本發明一實施例的封裝結構的製作流程示意圖。 Figure 1 is a schematic diagram of a smart card using the packaging structure of a fingerprint recognition chip module according to an embodiment of the present invention; Figure 2 is a schematic view of the back of the fingerprint recognition chip module packaging structure shown in Figure 1; 3A to 3D are schematic diagrams of the manufacturing process of a packaging structure according to an embodiment of the present invention.
1:智慧卡 1:Smart card
10:指紋辨識晶片模組 10:Fingerprint recognition chip module
20:智慧卡晶片 20:Smart card chip
23:覆蓋層 23: Covering layer
100:指紋辨識晶片 100:Fingerprint identification chip
110:電源處理晶片 110:Power processing chip
120:微處理器晶片 120:Microprocessor chip
130:安全加密晶片 130:Security encryption chip
140:被動元件 140: Passive components
AA:辨識區 AA: identification area
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Publication number | Priority date | Publication date | Assignee | Title |
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US20170255324A1 (en) * | 2016-03-02 | 2017-09-07 | Japan Display Inc. | Card type device |
TWM612841U (en) * | 2021-02-19 | 2021-06-01 | 安帝司股份有限公司 | Fingerprint identification smart card |
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Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20170255324A1 (en) * | 2016-03-02 | 2017-09-07 | Japan Display Inc. | Card type device |
TWM612841U (en) * | 2021-02-19 | 2021-06-01 | 安帝司股份有限公司 | Fingerprint identification smart card |
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