TWI830359B - Package structure of fingerprint recognition chip module and method for manufacturing the same - Google Patents

Abstract

A package structure of a fingerprint recognition chip module and a method for manufacturing the same are provided, and the method includes: providing a carrier plate with a chip accommodation area; setting a fingerprint recognition chip having a recognition area in the chip accommodation areas; and electrically connecting the fingerprint recognition chip and the circuit carrier; coating a coating material on the chip accommodation area of the carrier plate, and the coating material covering the fingerprint recognition chip; and forming the covering layer above a part of the chip accommodation area except for the recognition area.

Description

Packaging structure of fingerprint recognition chip module and manufacturing method thereof

The present invention relates to a packaging structure of a chip module and a manufacturing method thereof, in particular to a packaging structure of a fingerprint identification chip module and a manufacturing method thereof.

Existing fingerprint recognition devices such as optical fingerprint readers are large in size due to the light source auxiliary illumination recognition function. Although capacitive fingerprint readers have a light and thin structure, there is a structure on the top of the capacitive fingerprint reader that the user needs to attach with their fingers. The protective cover on the outer surface causes the groove provided in the sensing block in the outer surface of the protective cover to affect the appearance integrity of the electronic device.

Generally speaking, the fingerprint recognition chip packaging structure mainly includes a circuit carrier board, a fingerprint recognition chip, a plurality of wires, and packaging colloid. Most of the above-mentioned fingerprint sensing areas are located on the surface of the fingerprint recognition chip and cover the packaging colloid of the fingerprint recognition chip. The thickness will affect the sensing sensitivity of the fingerprint recognition chip packaging structure.

Therefore, it is necessary to propose improved packaging structures and manufacturing methods to reduce the volume and thickness of the packaging structure while maintaining the components included in the packaging structure while taking the appearance into consideration.

In order to effectively solve the above problems, the present invention proposes a method for manufacturing a packaging structure of a fingerprint identification chip module, which includes: providing a circuit carrier board with a chip setting area; and setting a fingerprint identification chip with an identification area on the chip. Setting area; electrically connecting the fingerprint identification chip and the circuit carrier board; coating a material coating on the chip setting area of the circuit carrier board, and the material coating covers the fingerprint identification chip; and forming a covering layer on part of the chip setting area above, revealing the identification area.

According to an embodiment of the present invention, the circuit carrier board is a rigid substrate or a flexible substrate.

According to an embodiment of the present invention, the thickness of the applied material coating is less than 25um, and has a dielectric constant in the range of 2 to 8.

According to an embodiment of the present invention, the covering layer is a composite plastic frame or liquid colloid and has a thickness of less than 80um.

According to an embodiment of the present invention, before coating the material layer, the manufacturing method of the packaging structure further includes an unpackaged security encryption chip, a microprocessor chip, a power processing chip, at least one resistor element and at least one The capacitive element is in the chip setting area; electrically connected to the security encryption chip, the microprocessor chip, the power processing chip, the resistive element, the capacitive element, the fingerprint identification chip and the circuit carrier board; the coating material is layer and forming the covering layer on the security encryption chip, the microprocessor chip, the power processing chip, the resistive element and the capacitive element.

The present invention also proposes a packaging structure of a fingerprint identification chip module, which includes a circuit carrier board, a fingerprint identification chip, a material coating and a covering layer. The circuit carrier board has a chip setting area. The fingerprint identification chip has an identification area, which is arranged in the chip setting area and is electrically connected to the circuit carrier board. The material coating is coated on the chip setting area of the circuit carrier board and covers the fingerprint recognition chip. The covering layer is formed over part of the chip setting area, and the covering layer is exposed in the identification area.

According to an embodiment of the present invention, the package structure further includes a security encryption chip, a microprocessor chip, a power processing chip, at least one resistive element and at least one capacitive element, which are disposed in the chip setting area and electrically connected to the Fingerprint identification chip and the circuit carrier board.

By using the packaging structure of the fingerprint recognition chip module produced by the manufacturing method of the present invention, through the packaging method of material coating and covering layer, the volume and thickness of the packaging structure can be reduced while taking into account the appearance while maintaining the packaging structure. element.

The following is a more detailed description of the embodiments of the present invention with reference to drawings and component symbols, so that those skilled in the technical field to which the present invention belongs can implement the present invention accordingly after reading this description. The terminology used herein is for describing particular embodiments only and is not intended to be limiting of the invention.

FIG. 1 is a schematic diagram of a smart card using the packaging structure of the fingerprint identification chip module according to an embodiment of the present invention. FIG. 2 is a schematic view of the back of the packaging structure of the fingerprint identification chip module 10 according to the embodiment of FIG. 1 . Please refer to Figure 1. The smart card 1 includes a fingerprint recognition chip module 10 and a smart card chip 20. The fingerprint recognition chip module 10 can communicate with the smart card chip 20 through a serial peripheral interface (SPI) or an integrated circuit. Connect to bus (inter-integrated circuit bus, I ² C) and other methods for one/two-way communication. The fingerprint recognition chip module 10 includes a fingerprint recognition chip 100, a power management unit (PMU) 110, a microprocessor unit (MCU) 120, a security encryption (SE) chip 130, and a passive The component 140 , the power processing chip 110 , the microprocessor chip 120 , and the passive component 140 are coupled with the fingerprint recognition chip 100 . The fingerprint identification chip 100 has an identification area AA. The power processing chip 110 is coupled to the microprocessor chip 120 and is used to control the external power supply at 1.8V~5V. The power supply unit can provide the microprocessor chip 120 and the security encryption chip 130 and other internal components. The security encryption chip 130 is coupled to the microprocessor chip 120, and its encryption format may be AES or HMAC. The microprocessor chip 120 may be an ARM/RISC-V/8051 or other microprocessing unit capable of computing and encrypting. The passive component 140 is a resistor and/or a capacitor. The fingerprint recognition chip 100, the power processing chip 110, the microprocessor chip 120, the security encryption chip 130, and the number of passive components 140 that can be changed according to the needs can be changed or replaced according to the actual application (not limited to the financial field). Referring to FIG. 2 , the back of the fingerprint recognition chip module 10 includes a plurality of metal contacts 150 for connecting the fingerprint recognition chip module 10 to circuits (not shown) on the circuit substrate of the smart card.

The manufacturing method of the packaging structure of the fingerprint identification chip module of the present invention includes: providing a circuit carrier board with a chip setting area, and setting a fingerprint identification chip with an identification area in the chip setting area; electrically connecting the fingerprint identification chip and Circuit carrier board; apply a material coating on the chip setting area of the circuit carrier board, and the material coating covers the fingerprint identification chip; form a covering layer above part of the chip setting area to expose the identification area.

3A to 3D are schematic diagrams of the manufacturing process of the packaging structure of the fingerprint recognition chip module according to an embodiment of the present invention. As shown in FIG. 3A , a fingerprint recognition chip 100 , an unpackaged power processing chip 110 , an unpackaged microprocessor chip 120 , an unpackaged security encryption chip 130 , passive components 140 , etc. are provided on the circuit carrier board 12 , the fingerprint recognition chip 100, the power processing chip 110, the microprocessor chip 120, the security encryption chip 130 and the circuit carrier board 12 are electrically connected with the wiring 11, and the passive circuit is connected using surface mount tech (SMT). Component 140 is secured to carrier board 12 .

Next, as shown in FIG. 3B , wire bonding glue 21 is applied on the wires 11 to protect the electrical connections between various chips and the circuit carrier board 12 .

Next, as shown in FIG. 3C , the material coating 22 is coated on the chip setting area of the circuit carrier board 12 , and the material coating 22 covers the fingerprint recognition chip 100 , the power processing chip 110 , the microprocessor chip 120 , and the security encryption chip. Chip 130 and passive components 140 .

Finally, as shown in FIG. 3D , a covering layer 23 is formed above part of the chip setting area, exposing the identification area AA of the fingerprint identification chip 100. The bottom of the covering layer is matched with the material coating 22 through the protruding parts of the bonding wires 11, and Maintain a flat surface.

In this embodiment, the circuit carrier board 12 has a chip setting area, and the circuit carrier board can be composed of a rigid substrate made of glass epoxy resin multilayer material (FR-4) or a flexible printed circuit board (FPC). In addition to flexible substrates, it can also be bismaleimide triazine resin (BT resin) substrate, ABF (Ajinomoto Build-up Film) substrate, MIS substrate (i.e. C2iM (Copper Connection in Molding) substrate), polyethylene imine (MPI) flexible board or liquid crystal polymer (Liquid Crystal Polymer, LCP) flexible board. The fingerprint chip sensor material of the fingerprint recognition chip 100 can be made of silicon (Si), glass, conductive film and other materials. The material coating 22 coated on the chip setting area can be made of liquid crystal polymer (liquid crystal polymer). Crystal polymer (LCP) resin material plus glass fiber, the thickness of the material coating 22 is approximately greater than 10um and less than 25um, the hardness is greater than 3H, and has a dielectric constant in the range of 2~8. The covering layer 23 is a composite material (plastic) or liquid colloid, such as a mixture of silicon dioxide and resin, which can be attached to the material layer 22 in the non-sensing area through thermal bonding or light solidification to protect the fingerprint recognition chip. 100. Power processing chip 110, microprocessor chip 120, security encryption chip 130 and other chips, passive components, wiring and circuits, the thickness of the covering layer 23 is not greater than 80um. If the packaging structure of the fingerprint identification chip module is applied to the smart card shown in Figure 1, after the identification area AA and the smart card chip 20 are covered with the material coating 22, there will be no covering layer 23 above them.

By using the packaging structure of the fingerprint recognition chip module produced by the manufacturing method of the present invention, through the packaging method of material coating and covering layer, the volume and thickness of the packaging structure can be reduced while taking into account the appearance while maintaining the packaging structure. element.

The present invention is not limited to the above-described embodiments, and it is obvious to those skilled in the art that various modifications and changes can be made to the present invention without departing from the spirit or scope of the invention.

Therefore, it is intended that the present invention covers the modifications and variations of this invention that may come within the scope of the appended claims and their equivalents.

1:Smart card

10:Fingerprint recognition chip module

11:Threading

12: Line carrier board

20:Smart card chip

21: Wire glue

22: Material coating

23: Covering layer

100:Fingerprint identification chip

110:Power processing chip

120:Microprocessor chip

130:Security encryption chip

140: Passive components

150:Metal contact

AA: identification area

Figure 1 is a schematic diagram of a smart card using the packaging structure of a fingerprint recognition chip module according to an embodiment of the present invention; Figure 2 is a schematic view of the back of the fingerprint recognition chip module packaging structure shown in Figure 1; 3A to 3D are schematic diagrams of the manufacturing process of a packaging structure according to an embodiment of the present invention.

1:Smart card

10:Fingerprint recognition chip module

20:Smart card chip

23: Covering layer

100:Fingerprint identification chip

110:Power processing chip

120:Microprocessor chip

130:Security encryption chip

140: Passive components

AA: identification area

Claims (10)

A method for manufacturing a packaging structure of a fingerprint identification chip module, including: providing a circuit carrier board with a chip setting area; placing a fingerprint identification chip with an identification area in the chip setting area; electrically connecting the chip setting area with a bonding wire The fingerprint identification chip and the circuit carrier board are coated with a material coating on the chip setting area of the circuit carrier board, and the material coating covers the fingerprint identification chip, and the thickness of the applied material coating is less than 25um. ; And forming a covering layer over part of the chip setting area, and the bottom of the covering layer exposing the identification area matches the protruding portion of the material coating through the bonding line, and remains flat on the surface. The manufacturing method of the packaging structure of the fingerprint recognition chip module as described in claim 1, wherein the circuit carrier board is a rigid substrate or a flexible substrate. The manufacturing method of the packaging structure of the fingerprint identification chip module as described in claim 1, wherein the applied material coating has a dielectric constant in the range of 2 to 8. The manufacturing method of the packaging structure of the fingerprint recognition chip module as described in claim 1, wherein the covering layer is a composite plastic frame or liquid colloid and has a thickness of less than 80um. The method for making the packaging structure of the fingerprint recognition chip module as described in claim 1, before coating the material layer, further provides an unpackaged security encryption chip, a microprocessor chip, a power processing chip, at least A resistive element and at least one capacitive element in the chip setting area; electrically connected to the security encryption chip, the microprocessor chip, the power processing chip, the resistive element, the capacitive element, the fingerprint identification chip and the circuit carrier board; Coating the material coating and forming the covering layer on the security encryption chip, the microprocessor chip, the power processing chip, the resistive element and the capacitive element. A packaging structure of a fingerprint identification chip module, including: a circuit carrier board with a chip setting area; A fingerprint identification chip has an identification area, is arranged in the chip setting area, and is electrically connected to the circuit carrier board with a dozen wires; a material coating is coated on the chip setting area of the circuit carrier board, Covering the fingerprint identification chip, wherein the thickness of the material coating is less than 25um; and a covering layer is formed above part of the chip setting area, and the bottom of the covering layer exposing the identification area and the material coating pass through the bonding line The protrusions fit closely and remain flat on the surface. The packaging structure of the fingerprint recognition chip module as described in claim 6, wherein the circuit carrier board is a rigid substrate or a flexible substrate. The packaging structure of the fingerprint recognition chip module as described in claim 6, wherein the applied material coating has a dielectric constant in the range of 2 to 8. The packaging structure of the fingerprint recognition chip module as described in claim 6, wherein the covering layer is a composite plastic frame or liquid colloid and has a thickness of less than 80um. The packaging structure of the fingerprint identification chip module as described in claim 6 further includes a security encryption chip, a microprocessor chip, a power processing chip, at least one resistive element and at least one capacitive element, which are disposed in the chip setting area , and electrically connect the fingerprint recognition chip and the circuit carrier board.

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