TWI828920B - Cutting method of workpiece - Google Patents

Cutting method of workpiece Download PDF

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Publication number
TWI828920B
TWI828920B TW109120954A TW109120954A TWI828920B TW I828920 B TWI828920 B TW I828920B TW 109120954 A TW109120954 A TW 109120954A TW 109120954 A TW109120954 A TW 109120954A TW I828920 B TWI828920 B TW I828920B
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Taiwan
Prior art keywords
cutting
workpiece
position detection
outer peripheral
peripheral portion
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TW109120954A
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Chinese (zh)
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TW202101571A (en
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牧野香一
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日商迪思科股份有限公司
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B28D5/029—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a plurality of cutting blades
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0064—Devices for the automatic drive or the program control of the machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B28D5/023—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a cutting blade mounted on a carriage
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
    • G01B21/02—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness
    • G01B21/08—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness for measuring thickness
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection

Abstract

[課題]考量被加工物的外周圓的中心相對於卡盤台的旋轉中心的偏移量與被加工物的厚度不均，而切割被加工物的外周部。[解決手段]提供一種被加工物的切割方法，其具備下列步驟：高度位置檢測步驟，使用高度位置檢測單元，檢測被加工物的正面之外周部的多個點的高度位置；邊緣位置檢測步驟，一邊進行高度位置檢測步驟，一邊使用邊緣位置檢測單元檢測邊緣位置；以及外周部切割步驟，一邊基於被加工物的中心與卡盤台的旋轉中心的偏移量而調整切割刀片的位置，且基於在高度位置檢測步驟所檢測出的多個點的高度位置而調整深度，並一邊切割被加工物的外周部，其中，被加工物的中心是從在邊緣位置檢測步驟所檢測出的邊緣位置計算出。[Issue] The outer peripheral portion of the workpiece is cut by considering the offset amount of the center of the outer circumference of the workpiece with respect to the rotation center of the chuck table and the uneven thickness of the workpiece. [Solution] Provide a method for cutting an object to be processed, which has the following steps: a height position detection step, using a height position detection unit to detect the height positions of multiple points on the front outer peripheral part of the object to be processed; an edge position detection step , while performing the height position detection step, detecting the edge position using the edge position detection unit; and the outer peripheral portion cutting step, adjusting the position of the cutting blade based on the offset between the center of the workpiece and the rotation center of the chuck table, and The outer peripheral portion of the workpiece is cut while adjusting the depth based on the height positions of the plurality of points detected in the height position detection step, where the center of the workpiece is determined from the edge position detected in the edge position detection step. Calculate.

Description

被加工物的切割方法Cutting method of workpiece

本發明係關於一種被加工物的切割方法，在檢測出被加工物的外周部的高度位置與外周部的邊緣位置後，切割被加工物的外周部。The present invention relates to a method of cutting an object to be processed. After detecting the height position and the edge position of the outer peripheral part of the object to be processed, the outer peripheral part of the object to be processed is cut.

在切割以半導體晶圓作為代表的板狀的被加工物時，例如是使用切割裝置；其中，切割裝置具備保持被加工物的卡盤台以及裝設有環狀的切割刀片的切割單元。切割單元例如是具有：主軸；圓環狀的切割刀片，裝設在主軸的一端側；以及旋轉驅動源，裝設在主軸的另一端側。When cutting a plate-shaped workpiece represented by a semiconductor wafer, for example, a cutting device is used. The cutting device includes a chuck table holding the workpiece and a cutting unit equipped with an annular cutting blade. The cutting unit has, for example, a main shaft; an annular cutting blade installed on one end side of the main shaft; and a rotational drive source installed on the other end side of the main shaft.

在切割被加工物的情況，例如是在以卡盤台的保持面保持被加工物的一面側的狀態，將旋轉的切割刀片的下端定位在比被加工物的一面還低的位置。然後，藉由使卡盤台與切割單元相對移動，而沿著此移動的路線切割被加工物。When cutting an object to be processed, for example, the lower end of the rotating cutting blade is positioned lower than one side of the object to be processed while the holding surface of the chuck table holds one side of the object to be processed. Then, by relatively moving the chuck table and the cutting unit, the workpiece is cut along the moving path.

但是，在藉由研削被加工物的背面側而薄化被加工物時，則例如是使用研削裝置；其中，研削裝置係具備保持被加工物的卡盤台以及配置在卡盤台的上方的研削單元。However, when the workpiece is thinned by grinding the back side of the workpiece, for example, a grinding device is used. The grinding device includes a chuck table that holds the workpiece and a chuck table that is disposed above the chuck table. Grinding unit.

研削單元例如是具有成為旋轉軸的主軸。而在主軸的下表面側，固定有圓盤狀的輪安裝件。又，在輪安裝件的下表面側，則裝設有圓環狀的研削輪。在此研削輪的下表面側，則環狀地設有多個研削磨石。The grinding unit has, for example, a spindle that serves as a rotation axis. On the lower surface side of the main shaft, a disc-shaped wheel mounting member is fixed. In addition, an annular grinding wheel is installed on the lower surface side of the wheel mounting member. A plurality of grinding stones are annularly provided on the lower surface side of the grinding wheel.

在研削被加工物的情況，係在以卡盤台保持被加工物的正面側的狀態使卡盤台旋轉，還將研削單元的主軸作為旋轉軸，使研削輪往與卡盤台相同的方向旋轉。然後，藉由將研削輪的下表面側按壓至被加工物的背面側，而研削被加工物的背面側。When grinding the workpiece, the chuck table is rotated with the chuck table holding the front side of the workpiece, and the spindle of the grinding unit is used as the rotation axis to move the grinding wheel in the same direction as the chuck table. Rotate. Then, by pressing the lower surface side of the grinding wheel against the back side of the workpiece, the back side of the workpiece is ground.

然而，圓盤狀的被加工物因為一般在外周部會具有斜角，所以當研削並薄化被加工物，則在被加工物的外周部中剖面形狀會如刀緣般尖而銳利。當刀緣形成，則被加工物容易以外周部為起點而損壞。However, a disc-shaped workpiece generally has an oblique angle at the outer periphery. Therefore, when the workpiece is ground and thinned, the cross-sectional shape of the outer peripheral portion of the workpiece will be as sharp as a knife edge. When the cutting edge is formed, the workpiece is easily damaged starting from the peripheral part.

於是，為了防止研削時外周部的損壞，已知一種技術，首先，藉由切割裝置切割被加工物的正面側的外周部，去除預定的厚度（亦即進行修邊），之後則以研削裝置研削被加工物的背面側（例如參照專利文獻1）。Therefore, in order to prevent the outer peripheral portion from being damaged during grinding, a technique is known. First, a cutting device is used to cut the outer peripheral portion of the front side of the workpiece to remove a predetermined thickness (that is, trimming), and then a grinding device is used. The back side of the workpiece is ground (for example, see Patent Document 1).

在進行修邊時，例如是以卡盤台吸引並保持被加工物的背面側。接著，在將以主軸作為旋轉軸而旋轉的切割刀片切入被加工物的正面側的外周部的狀態下，使卡盤台旋轉。 [習知技術文獻] [專利文獻]When trimming, for example, a chuck table is used to attract and hold the back side of the workpiece. Next, the chuck table is rotated in a state where the cutting blade rotating with the main shaft as the rotation axis cuts into the outer peripheral portion of the front side of the workpiece. [Known technical documents] [Patent Document]

[專利文獻1]日本特開2000－173961號公報。[Patent Document 1] Japanese Patent Application Publication No. 2000-173961.

[發明所欲解決的課題] 在進行修邊時，當圓盤狀的被加工物的外周圓的中心從卡盤台的旋轉中心偏移，則即使將切割刀片定位在被加工物的外周部，隨著卡盤台的旋轉，相對於被加工物之切割刀片的位置會偏移。[Problem to be solved by the invention] During trimming, when the center of the outer circumference of the disc-shaped workpiece deviates from the rotation center of the chuck table, even if the cutting blade is positioned on the outer circumference of the workpiece, as the chuck table rotates , the position of the cutting blade relative to the workpiece will be offset.

又，當在被加工物的外周部的周向中被加工物的厚度不均，則即使將切割刀片的下端定位於被加工物的預定深度，隨著卡盤台的旋轉，往被加工物的切割刀片的切入深度會變化。Furthermore, when the thickness of the workpiece is uneven in the circumferential direction of the outer peripheral portion of the workpiece, even if the lower end of the cutting blade is positioned at a predetermined depth of the workpiece, the workpiece will be cut as the chuck table rotates. The depth of cut of the blade will vary.

本發明為有鑒於所述問題點而完成者，目的在於，考量被加工物的外周圓的中心相對於卡盤台的旋轉中心的偏移量與被加工物的厚度不均，而切割被加工物的外周部。The present invention was completed in view of the above problems, and its purpose is to cut and process the workpiece by taking into consideration the offset amount of the center of the outer circumference of the workpiece with respect to the rotation center of the chuck table and the uneven thickness of the workpiece. the periphery of the object.

[解決課題的技術手段] 若根據本發明的一態樣，係提供一種被加工物的切割方法，其使用切割裝置切割被加工物的正面側的外周部，該切割裝置具備：卡盤台，保持圓盤狀的該被加工物；第一切割單元與第二切割單元，分別具有可切割保持在該卡盤台的該被加工物的切割刀片；邊緣位置檢測單元，固定在該第一切割單元，並檢測該被加工物的該外周部的邊緣位置；及高度位置檢測單元，固定在該第二切割單元，並檢測保持在該卡盤台的該被加工物的正面的高度位置；該被加工物的切割方法具備下列步驟：保持步驟，以露出該被加工物的該正面側的方式，用該卡盤台保持該被加工物的背面側；高度位置檢測步驟，使用該高度位置檢測單元，檢測該被加工物的該正面之該外周部的多個點的高度位置；邊緣位置檢測步驟，一邊進行該高度位置檢測步驟，一邊使用該邊緣位置檢測單元檢測該邊緣位置；以及外周部切割步驟，一邊基於該被加工物的中心與該卡盤台的旋轉中心的偏移量而調整該第一切割單元與該第二切割單元其中一者的切割刀片的位置，且基於在該高度位置檢測步驟所檢測出的該多個點的高度位置而調整該其中一者的切割刀片對該被加工物的切入深度，並一邊切割該被加工物的該外周部，其中，該被加工物的中心是從在該邊緣位置檢測步驟所檢測出的該邊緣位置計算出。[Technical means to solve the problem] According to one aspect of the present invention, a method for cutting a workpiece is provided, which uses a cutting device to cut the outer peripheral portion of the front side of the workpiece. The cutting device is provided with a chuck table and holds the disc-shaped workpiece. Processed object; the first cutting unit and the second cutting unit each have a cutting blade that can cut the processed object held on the chuck table; an edge position detection unit is fixed on the first cutting unit and detects the processed object The edge position of the outer peripheral portion of the object; and a height position detection unit, fixed on the second cutting unit, and detecting the height position of the front face of the workpiece held on the chuck table; the cutting method of the workpiece includes The following steps: a holding step, using the chuck table to hold the back side of the workpiece in a manner that exposes the front side of the workpiece; a height position detection step, using the height position detection unit to detect the workpiece the height positions of multiple points of the outer peripheral portion of the front surface; an edge position detection step, using the edge position detection unit to detect the edge position while performing the height position detection step; and an outer peripheral portion cutting step, based on the being The position of the cutting blade of one of the first cutting unit and the second cutting unit is adjusted based on the offset between the center of the workpiece and the rotation center of the chuck table, and based on the height position detection step detected The height positions of the plurality of points are used to adjust the cutting depth of one of the cutting blades into the object to be processed, while cutting the outer peripheral portion of the object to be processed, wherein the center of the object to be processed is from the edge. The edge position detected in the position detection step is calculated.

較佳地，該邊緣位置檢測單元是以可見光拍攝被攝體的照相機或雷射位移計。Preferably, the edge position detection unit is a camera or laser displacement meter that uses visible light to photograph the object.

又，較佳地，該高度位置檢測單元是背壓式感測器。Furthermore, preferably, the height position detection unit is a back pressure sensor.

若根據本發明的其他態樣，係提供一種被加工物的切割方法，其使用切割裝置切割被加工物的正面側的外周部，該切割裝置具備：卡盤台，保持圓盤狀的該被加工物；第一切割單元與第二切割單元，分別具有可切割保持在該卡盤台的該被加工物的切割刀片；邊緣位置檢測單元，固定在該第一切割單元，並檢測該被加工物的該外周部的邊緣位置；及高度位置檢測單元，固定在該第二切割單元，並檢測保持在該卡盤台的該被加工物的正面的高度位置；該被加工物的切割方法具備下列步驟：保持步驟，以露出該被加工物的該正面側的方式，用該卡盤台保持該被加工物的背面側；邊緣位置檢測步驟，使用該邊緣位置檢測單元，檢測該邊緣位置；高度位置檢測步驟，一邊基於該被加工物的中心與該卡盤台的旋轉中心的偏移量而調整該高度位置檢測單元的位置，一邊檢測該被加工物的該正面之該外周部的多個點的高度位置，其中，該被加工物的中心是從在該邊緣位置檢測步驟所檢測出的該邊緣位置計算出；以及外周部切割步驟，一邊基於該偏移量而調整該第一切割單元與該第二切割單元其中一者的切割刀片的位置，且基於在該高度位置檢測步驟所檢測出的該多個點的高度位置而調整該其中一者的切割刀片對該被加工物的切入深度，並一邊切割該被加工物的該外周部。According to another aspect of the present invention, a method for cutting a workpiece is provided, which uses a cutting device to cut the outer peripheral portion of the front side of the workpiece. The cutting device is provided with a chuck table, and the workpiece is held in a disk shape. Processed object; the first cutting unit and the second cutting unit each have a cutting blade that can cut the processed object held on the chuck table; an edge position detection unit is fixed on the first cutting unit and detects the processed object The edge position of the outer peripheral portion of the object; and a height position detection unit, fixed on the second cutting unit, and detecting the height position of the front face of the workpiece held on the chuck table; the cutting method of the workpiece includes The following steps: a holding step, using the chuck table to hold the back side of the workpiece in a manner that exposes the front side of the workpiece; an edge position detection step, using the edge position detection unit to detect the edge position; In the height position detection step, the position of the height position detection unit is adjusted based on the offset amount between the center of the workpiece and the rotation center of the chuck table, while detecting the polygonality of the outer peripheral portion of the front surface of the workpiece. the height position of a point, wherein the center of the workpiece is calculated from the edge position detected in the edge position detection step; and a peripheral cutting step, adjusting the first cutting based on the offset amount The position of the cutting blade of one of the unit and the second cutting unit is adjusted based on the height positions of the plurality of points detected in the height position detection step. Cut into the depth while cutting the outer peripheral portion of the workpiece.

[發明功效] 在本發明之一態樣的被加工物的切割方法中，係在高度位置檢測步驟中，檢測圓盤狀的被加工物的正面之外周部的多個點的高度位置。更進一步，一邊進行高度位置檢測步驟，一邊使用邊緣位置檢測單元進行檢測被加工物的邊緣位置的邊緣位置檢測步驟。而在高度位置檢測步驟與邊緣位置檢測步驟之後，則進行切割被加工物的外周部的外周部切割步驟。[Invention effect] In the method for cutting a workpiece according to one aspect of the present invention, in the height position detection step, the height positions of a plurality of points on the front outer peripheral portion of the disk-shaped workpiece are detected. Furthermore, while performing the height position detection step, an edge position detection step of detecting the edge position of the workpiece is performed using an edge position detection unit. After the height position detection step and the edge position detection step, an outer peripheral portion cutting step of cutting the outer peripheral portion of the workpiece is performed.

在外周部切割步驟，基於被加工物的中心與卡盤台的旋轉中心的偏移量，調整切割刀片的位置；其中，被加工物的中心是從在邊緣位置檢測步驟所檢測出的外周部的邊緣位置計算出。更進一步，在外周部切割步驟，還基於在高度位置檢測步驟所測量出的多個點的高度位置，調整切割刀片對被加工物的切入深度。In the outer peripheral portion cutting step, the position of the cutting blade is adjusted based on the offset between the center of the workpiece and the rotation center of the chuck table; where the center of the workpiece is the outer peripheral portion detected in the edge position detection step. The edge position is calculated. Furthermore, in the peripheral cutting step, the cutting depth of the cutting blade into the workpiece is adjusted based on the height positions of the plurality of points measured in the height position detection step.

如此，因為基於被加工物的中心與卡盤台的旋轉中心的偏移量而調整切割刀片的位置，所以相較於未調整切割刀片的位置的情況，能以預先設定的寬度正確地切割外周部。In this way, since the position of the cutting blade is adjusted based on the offset between the center of the workpiece and the rotation center of the chuck table, the outer periphery can be accurately cut with a preset width compared to a case where the position of the cutting blade is not adjusted. department.

又，因為基於外周部的高度位置而調整切割刀片的切入深度，所以相較於未調整切入深度的情況，能抑制從表面切入的切入深度的不均，並使切入深度大致固定。除此之外，藉由一邊進行高度位置檢測步驟一邊進行邊緣位置檢測步驟，相較於兩者分別單獨進行的情況，能縮短檢測作業所需的時間。Furthermore, since the cutting depth of the cutting blade is adjusted based on the height position of the outer peripheral portion, variation in the cutting depth from the surface can be suppressed and the cutting depth can be made substantially constant compared to a case where the cutting depth is not adjusted. In addition, by performing the edge position detection step while performing the height position detection step, the time required for the detection operation can be shortened compared to the case where both are performed separately.

參照隨附圖式，針對本發明一態樣的實施方式做說明。圖1係切割裝置2的立體圖。切割裝置2具備裝配有各構成要素的基台4。在基台4的上表面，係設有X軸移動機構（加工進給單元）6。An embodiment of one aspect of the present invention will be described with reference to the accompanying drawings. Figure 1 is a perspective view of the cutting device 2. The cutting device 2 includes a base 4 on which various components are mounted. On the upper surface of the base 4, an X-axis moving mechanism (processing feed unit) 6 is provided.

X軸移動機構6具有大致平行於X軸方向（加工進給方向、前後方向）的一對X軸導軌8，X軸移動台10可滑動地安裝在X軸導軌8。The X-axis moving mechanism 6 has a pair of X-axis guide rails 8 substantially parallel to the X-axis direction (processing feed direction, front-rear direction), and the X-axis moving table 10 is slidably mounted on the X-axis guide rails 8 .

在X軸移動台10的下表面（背面）側則設有螺帽部（未圖示），平行於X軸導軌8的X軸滾珠螺桿12以可旋轉的態樣與此螺帽部連結。A nut portion (not shown) is provided on the lower surface (back surface) side of the X-axis moving stage 10 , and the X-axis ball screw 12 parallel to the X-axis guide rail 8 is rotatably connected to the nut portion.

在X軸滾珠螺桿12的一端部，連結有X軸脈衝馬達14。藉由以X軸脈衝馬達14使X軸滾珠螺桿12旋轉，X軸移動台10會沿著X軸導軌8在X軸方向上移動。An X-axis pulse motor 14 is connected to one end of the X-axis ball screw 12 . By rotating the X-axis ball screw 12 with the X-axis pulse motor 14 , the X-axis moving stage 10 moves in the X-axis direction along the X-axis guide rail 8 .

在X軸移動台10的上表面側（正面側），設有圓柱狀的θ工作台16。θ工作台16具備馬達等的旋轉驅動源（未圖示），在θ工作台16上，設有工作台基台18a等。A cylindrical θ table 16 is provided on the upper surface side (front side) of the X-axis moving stage 10 . The θ table 16 is provided with a rotation drive source (not shown) such as a motor, and the θ table 16 is provided with a table base 18 a and the like.

工作台基台18a具有大致呈圓柱的形狀，並連結於θ工作台16的上表面。在工作台基台18a的周圍設有工作台蓋18b，而在此工作台蓋18b的X軸方向的一側與另一側，係設有可伸縮的蛇腹狀的蓋構件（未圖示）。The table base 18 a has a substantially cylindrical shape and is connected to the upper surface of the θ table 16 . A workbench cover 18b is provided around the workbench base 18a, and retractable bellows-shaped cover members (not shown) are provided on one side and the other side of the workbench cover 18b in the X-axis direction. .

工作台蓋18b與蓋構件係覆蓋包含X軸移動台10的X軸移動機構6的上方。在工作台基台18a的上表面，設有圓盤狀的卡盤台20。The table cover 18 b and the cover member cover the upper side of the X-axis moving mechanism 6 including the X-axis moving stage 10 . A disk-shaped chuck table 20 is provided on the upper surface of the table base 18a.

卡盤台20係隔著工作台基台18a而連結於θ工作台16。因此，卡盤台20係以大致平行於Z軸方向（切入進給方向、上下方向）的直線作為旋轉軸24（參照圖2（B））而可旋轉。The chuck table 20 is connected to the θ table 16 via the table base 18a. Therefore, the chuck table 20 is rotatable using a straight line substantially parallel to the Z-axis direction (cutting feed direction, up-down direction) as the rotation axis 24 (see FIG. 2(B) ).

卡盤台20具有框體20a。框體20a係由不鏽鋼等的金屬所形成，並具有：構成底面的圓盤部；以及圓環狀的環狀部，位在圓盤部的上表面側並具有預定的寬度。The chuck table 20 has a frame 20a. The frame 20a is made of metal such as stainless steel, and has a disc portion constituting a bottom surface and an annular annular portion located on the upper surface side of the disc portion and having a predetermined width.

藉由圓盤部與環狀部，從而在框體20a的上表面側形成有凹部。在此凹部係固定有保持板20b。保持板20b例如是以多孔質陶瓷所形成。The disc portion and the annular portion form a recessed portion on the upper surface side of the frame 20a. The retaining plate 20b is fixed to this recessed part. The holding plate 20b is formed of, for example, porous ceramics.

保持板20b係透過形成在框體20a的流路而連接噴射器等的吸引源（未圖示）。當運作吸引源，則會在保持板20b的上表面產生負壓。The holding plate 20b is connected to a suction source (not shown) such as an injector through a flow path formed in the frame 20a. When the suction source is operated, negative pressure will be generated on the upper surface of the holding plate 20b.

在保持板20b上係載置有被加工物11等。被加工物11例如是由矽晶等的半導體所形成的圓盤狀的晶圓，而在其正面11a側具有元件區域與包圍元件區域的外周剩餘區域。The workpiece 11 etc. are placed on the holding plate 20b. The workpiece 11 is, for example, a disk-shaped wafer made of a semiconductor such as silicon crystal, and has an element region and a peripheral remaining region surrounding the element region on the front surface 11 a side.

元件區域係以排列為格子狀的分割預定線（切割道）而更進一步劃分為多個區域，在各區域則形成有IC（Integrated Circuit，積體電路）、LSI（Large Scale Integration，大型積體電路）等的元件。The component area is further divided into multiple areas based on planned division lines (dicing lanes) arranged in a grid. In each area, IC (Integrated Circuit), LSI (Large Scale Integration) are formed. circuit) and other components.

當在使被加工物11的背面11b側接觸框體20a與保持板20b各自的上表面的狀態下產生負壓，則被加工物11會被卡盤台20所保持。因此，一般係將框體20a的上表面與保持板20b的上表面合稱為卡盤台20的保持面20c。而被加工物11則以此保持面20c所保持。When negative pressure is generated with the back surface 11b side of the workpiece 11 in contact with the upper surfaces of the frame 20a and the holding plate 20b, the workpiece 11 is held by the chuck table 20. Therefore, the upper surface of the frame 20a and the upper surface of the holding plate 20b are generally referred to as the holding surface 20c of the chuck table 20. The workpiece 11 is held by this holding surface 20c.

但是，卡盤台20亦可只以框體20a所構成。在此情況，於框體20a的環狀部的上表面則設有多個吸引口（未圖示）。而多個吸引口例如在俯視卡盤台20的情況下，係在周向以大致等間隔而設置。However, the chuck table 20 may be composed of only the frame 20a. In this case, a plurality of suction openings (not shown) are provided on the upper surface of the annular portion of the frame 20a. For example, when the chuck table 20 is viewed from above, the plurality of suction ports are provided at substantially equal intervals in the circumferential direction.

各吸引口係位在形成於環狀部之厚度方向的流路的一端。而此流路的另一端透過形成在圓盤部的流路（未圖示）而連接噴射器等的吸引源（未圖示）。當運作吸引源，則因為在環狀部的上表面會產生負壓，所以被加工物11會被吸引保持在環狀部的上表面。Each suction port is located at one end of the flow path formed in the thickness direction of the annular portion. The other end of this flow path is connected to a suction source (not shown) such as an injector through a flow path (not shown) formed in the disc portion. When the suction source is operated, negative pressure will be generated on the upper surface of the annular portion, so the workpiece 11 will be attracted and held on the upper surface of the annular portion.

因此，卡盤台20就不必具有保持板20b。而在框體20a的上表面形成有吸引口的情況，係將框體20a的上表面稱為卡盤台20的保持面20c。Therefore, the chuck table 20 does not need to have the holding plate 20b. On the other hand, when the suction port is formed on the upper surface of the frame 20a, the upper surface of the frame 20a is called the holding surface 20c of the chuck table 20.

在基台4的上表面，設有跨越X軸移動機構6的門形的支撐構造30。在支撐構造30的前表面上部，設有2組的切割單元移動機構32，其分別具有分度進給單元與切入進給單元。首先，針對分度進給單元做說明。A door-shaped support structure 30 spanning the X-axis moving mechanism 6 is provided on the upper surface of the base 4 . On the upper part of the front surface of the support structure 30, two sets of cutting unit moving mechanisms 32 are provided, each of which has an indexing feeding unit and a cutting feeding unit. First, let’s explain the indexing feed unit.

各切割單元移動機構32係配置在支撐構造30的前表面，且共同具備大致平行於Y軸方向（分度進給方向、左右方向）的一對Y軸導軌34。構成各切割單元移動機構32的Y軸移動板36可滑動地被安裝在Y軸導軌34。Each cutting unit moving mechanism 32 is disposed on the front surface of the support structure 30 and includes a pair of Y-axis guide rails 34 that are substantially parallel to the Y-axis direction (indexing feed direction, left-right direction). The Y-axis moving plate 36 constituting each cutting unit moving mechanism 32 is slidably mounted on the Y-axis guide rail 34 .

在各Y軸移動板36的背面側，則設有螺帽部（未圖示）。而大致平行於Y軸導軌34的Y軸滾珠螺桿38以可旋轉的態樣與各螺帽部連結。A nut portion (not shown) is provided on the back side of each Y-axis moving plate 36 . The Y-axis ball screw 38 that is substantially parallel to the Y-axis guide rail 34 is rotatably connected to each nut portion.

在各Y軸滾珠螺桿38的一端部係連結有Y軸脈衝馬達40。若以Y軸脈衝馬達40旋轉Y軸滾珠螺桿38，則Y軸移動板36會沿著Y軸導軌34在Y軸方向上移動。A Y-axis pulse motor 40 is connected to one end of each Y-axis ball screw 38 . When the Y-axis ball screw 38 is rotated by the Y-axis pulse motor 40 , the Y-axis moving plate 36 moves in the Y-axis direction along the Y-axis guide rail 34 .

在各Y軸移動板36的前表面（表面）係設有切入單元。切入單元具有大致平行於Z軸方向的一對Z軸導軌42，此一對Z軸導軌42是設在Y軸移動板36的前表面。A cutting unit is provided on the front surface (surface) of each Y-axis moving plate 36 . The cutting unit has a pair of Z-axis guide rails 42 substantially parallel to the Z-axis direction. The pair of Z-axis guide rails 42 are provided on the front surface of the Y-axis moving plate 36 .

Z軸移動板44可滑動地安裝在Z軸導軌42。在各Z軸移動板44的背面側則設有螺帽部（未圖示）。而，平行於Z軸導軌42的Z軸滾珠螺桿46以可旋轉的態樣與各螺帽部連結。The Z-axis moving plate 44 is slidably mounted on the Z-axis guide rail 42 . A nut portion (not shown) is provided on the back side of each Z-axis moving plate 44 . However, the Z-axis ball screw 46 parallel to the Z-axis guide rail 42 is rotatably connected to each nut portion.

在各Z軸滾珠螺桿46的一端部連結有Z軸脈衝馬達48。若以Z軸脈衝馬達48旋轉Z軸滾珠螺桿46，則Z軸移動板44會沿著Z軸導軌42在Z軸方向上移動。A Z-axis pulse motor 48 is connected to one end of each Z-axis ball screw 46 . When the Z-axis ball screw 46 is rotated by the Z-axis pulse motor 48 , the Z-axis moving plate 44 moves in the Z-axis direction along the Z-axis guide rail 42 .

在位於Y軸方向一側的Z軸移動板44的下部，固定有用以切割被加工物11的第一切割單元50。又，在位於Y軸方向另一側的Z軸移動板44的下部，則固定有用以切割被加工物11的第二切割單元60。A first cutting unit 50 for cutting the workpiece 11 is fixed to a lower portion of the Z-axis moving plate 44 located on one side in the Y-axis direction. In addition, the second cutting unit 60 for cutting the workpiece 11 is fixed to the lower part of the Z-axis moving plate 44 located on the other side in the Y-axis direction.

附帶一提的是，第一切割單元50與第二切割單元60相對於卡盤台20的X軸方向位置係能利用輸入至X軸脈衝馬達14的脈衝訊號的脈衝數等而特定出。Incidentally, the X-axis direction positions of the first cutting unit 50 and the second cutting unit 60 relative to the chuck table 20 can be specified based on the pulse number of the pulse signal input to the X-axis pulse motor 14 and the like.

又，第一切割單元50與第二切割單元60相對於卡盤台20的Y軸方向位置係能利用輸入至Y軸脈衝馬達40的脈衝訊號的脈衝數而特定出。同樣地，第一切割單元50與第二切割單元60相對於卡盤台20的Z軸方向位置係能利用輸入至Z軸脈衝馬達48的脈衝訊號的脈衝數而特定出。In addition, the Y-axis direction positions of the first cutting unit 50 and the second cutting unit 60 relative to the chuck table 20 can be specified based on the pulse number of the pulse signal input to the Y-axis pulse motor 40 . Similarly, the Z-axis direction positions of the first cutting unit 50 and the second cutting unit 60 relative to the chuck table 20 can be specified using the pulse number of the pulse signal input to the Z-axis pulse motor 48 .

於此，參照圖2（A）與圖2（B），針對第一切割單元50與第二切割單元60做說明。圖2（A）係第一切割單元50等的俯視圖，圖2（B）係第一切割單元50等的局部剖面側視圖。Here, the first cutting unit 50 and the second cutting unit 60 will be described with reference to FIGS. 2(A) and 2(B) . FIG. 2(A) is a top view of the first cutting unit 50 and the like, and FIG. 2(B) is a partial cross-sectional side view of the first cutting unit 50 and the like.

第一切割單元50具有主軸外殼52。主軸54的一部分以可旋轉的態樣被容納在主軸外殼52。而在主軸54中從主軸外殼52突出的一端側，則裝設有環狀的切割刀片56。The first cutting unit 50 has a spindle housing 52 . A part of the spindle 54 is rotatably accommodated in the spindle housing 52 . An annular cutting blade 56 is installed on one end side of the spindle 54 protruding from the spindle housing 52 .

切割刀片56係在外周部具有可切割被加工物11的切刃。切割刀片56例如是輪轂型的切割刀片。在主軸54的另一端側，則連結有作為旋轉驅動源的馬達（未圖示）。當運作馬達，則切割刀片56會以主軸54為旋轉軸而旋轉。The cutting blade 56 has a cutting edge capable of cutting the workpiece 11 at its outer periphery. The cutting blade 56 is, for example, a hub-type cutting blade. A motor (not shown) as a rotational drive source is connected to the other end side of the spindle 54 . When the motor is operated, the cutting blade 56 will rotate with the main shaft 54 as the rotation axis.

在主軸外殼52的X軸方向的另一側，係固定有照相機單元（邊緣位置檢測單元）58。照相機單元58係以可見光拍攝以卡盤台20的保持面20c所保持的被加工物11等的被攝體。A camera unit (edge position detection unit) 58 is fixed to the other side of the spindle housing 52 in the X-axis direction. The camera unit 58 photographs a subject such as the workpiece 11 held by the holding surface 20 c of the chuck table 20 using visible light.

照相機單元58例如是具有接物鏡（未圖示）與CCD影像感測器、CMOS影像感測器等的攝像元件（未圖示）。照相機單元58係透過接物鏡而以攝像元件接受來自被攝體的光（可見光），藉此拍攝被攝體。The camera unit 58 is, for example, an imaging element (not shown) having an objective lens (not shown) and a CCD image sensor, a CMOS image sensor, or the like. The camera unit 58 uses an imaging element to receive light (visible light) from a subject through an objective lens, thereby photographing the subject.

第二切割單元60亦具有主軸外殼62、主軸64以及切割刀片66等。第二切割單元60的構造因為相同於第一切割單元50，所以省略進一步的說明。The second cutting unit 60 also has a spindle housing 62, a spindle 64, a cutting blade 66, and the like. Since the structure of the second cutting unit 60 is the same as that of the first cutting unit 50, further description is omitted.

在主軸外殼62的X軸方向的另一側，固定有背壓式感測單元（高度位置檢測單元）68。背壓式感測單元68例如是以不接觸被加工物11的方式，檢測以卡盤台20的保持面20c所保持的被加工物11的正面11a的高度位置。On the other side of the spindle housing 62 in the X-axis direction, a back pressure sensing unit (height position detection unit) 68 is fixed. For example, the back pressure sensing unit 68 detects the height position of the front surface 11 a of the workpiece 11 held by the holding surface 20 c of the chuck table 20 without contacting the workpiece 11 .

於此，針對背壓式感測單元68的構造做說明。背壓式感測單元68包含一端連接氣體供給源（未圖示）的氣體供給管（未圖示）。在此氣體供給管的另一端係連接有噴嘴68a。Here, the structure of the back pressure sensing unit 68 will be described. The back pressure sensing unit 68 includes a gas supply pipe (not shown) with one end connected to a gas supply source (not shown). A nozzle 68a is connected to the other end of the gas supply pipe.

氣體供給管具有從氣體供給管的一端與另一端之間的位置分歧的分歧部（未圖示）。分歧部係連接微差壓力計（未圖示）內的第一氣體室。微差壓力計具有第一氣體室與從此第一氣體室空間性地分離的第二氣體室。The gas supply pipe has a branching part (not shown) branched from the position between one end and the other end of the gas supply pipe. The branch part is connected to the first gas chamber in the differential pressure gauge (not shown). The differential pressure gauge has a first gas chamber and a second gas chamber spatially separated from the first gas chamber.

第一氣體室與第二氣體室係藉由隔膜（未圖示）所分離，而在隔膜係安裝有應變計（未圖示）。又，在第二氣體室連接有氣體釋放管（未圖示），氣體釋放管的內部的壓力係維持在固定的氣壓。The first gas chamber and the second gas chamber are separated by a diaphragm (not shown), and a strain gauge (not shown) is installed on the diaphragm. In addition, a gas release pipe (not shown) is connected to the second gas chamber, and the pressure inside the gas release pipe is maintained at a fixed air pressure.

接著，針對使用背壓式感測單元68測量從噴嘴68a的下端到位在噴嘴68a下方的物體的未知距離的方法做說明。附帶一提的是，噴嘴68a的高度位置是藉由Z軸脈衝馬達48精密地控制。Next, a method of using the back pressure sensing unit 68 to measure an unknown distance from the lower end of the nozzle 68 a to an object below the nozzle 68 a will be described. Incidentally, the height position of the nozzle 68a is precisely controlled by the Z-axis pulse motor 48.

在噴嘴68a的下方係設有物體（例如被加工物11）。當以預定的氣壓從噴嘴68a噴射氣體，則氣體會被物體所反射，反射的氣體的一部分會灌入至噴嘴68a內。灌入至噴嘴68a內的氣體量（反射量）會根據噴嘴68a的下端與物體的表面的距離而變化。因此，第一氣體室的壓力會根據此距離而變化。An object (for example, the workpiece 11) is arranged below the nozzle 68a. When gas is injected from the nozzle 68a with a predetermined air pressure, the gas will be reflected by the object, and part of the reflected gas will be poured into the nozzle 68a. The amount of gas poured into the nozzle 68a (the amount of reflection) changes depending on the distance between the lower end of the nozzle 68a and the surface of the object. Therefore, the pressure of the first gas chamber changes depending on this distance.

當在第一氣體室與第二氣體室之間產生壓力差，則應變計的阻抗值會變化。當應變計的阻抗值變化，則連接應變計的電壓計（未圖示）的電壓值會變化。舉例而言，當噴嘴68a與物體的距離變大則電壓值會變小，當此距離變小則電壓值變大。像這樣的距離與電壓值的對應關係（圖表、對應表等）是預先被測量並記憶在控制部（未圖示）的記憶裝置等。When a pressure difference is generated between the first gas chamber and the second gas chamber, the impedance value of the strain gauge will change. When the impedance value of the strain gauge changes, the voltage value of the voltmeter (not shown) connected to the strain gauge will change. For example, when the distance between the nozzle 68a and the object becomes larger, the voltage value becomes smaller, and when the distance becomes smaller, the voltage value becomes larger. Such a correspondence between distance and voltage values (graph, correspondence table, etc.) is measured in advance and stored in a memory device or the like of a control unit (not shown).

然後基於各個預先測量的距離與電壓值的對應關係，測量從噴嘴68a的下端到位在噴嘴68a下方的物體的表面的未知距離。舉例而言，從噴嘴68a往物體的表面噴射氣體後，利用上述的對應關係，將以電壓計所測量的電壓值換算成距離，藉此測量到物體的表面的未知距離。Then based on the corresponding relationship between each pre-measured distance and the voltage value, an unknown distance from the lower end of the nozzle 68a to the surface of the object below the nozzle 68a is measured. For example, after the gas is injected from the nozzle 68a to the surface of the object, the voltage value measured by the voltmeter is converted into a distance using the above-mentioned correspondence relationship, thereby measuring the unknown distance to the surface of the object.

於此返回圖1繼續說明。在第一切割單元50與第二切割單元60各自的下方，設有檢測切割刀片56的下端位置（高度）的刀片位置檢測單元70。Return to Figure 1 to continue the explanation. Below each of the first cutting unit 50 and the second cutting unit 60 , a blade position detection unit 70 that detects the lower end position (height) of the cutting blade 56 is provided.

X軸移動機構6、θ工作台16、切割單元移動機構32、第一切割單元50、照相機單元58、第二切割單元60、背壓式感測單元68以及刀片位置檢測單元70等係分別連接於控制部（未圖示）。控制部係配合被加工物11的加工條件等而控制X軸移動機構6等。The X-axis moving mechanism 6, theta table 16, the cutting unit moving mechanism 32, the first cutting unit 50, the camera unit 58, the second cutting unit 60, the back pressure sensing unit 68 and the blade position detection unit 70 are connected respectively. in the control department (not shown). The control unit controls the X-axis moving mechanism 6 and the like in accordance with the processing conditions of the workpiece 11 and the like.

控制部是藉由包含CPU（Central Processing Unit，中央處理器）等的處理裝置及快閃記憶體等的記憶裝置的電腦所構成。藉由依循記憶在記憶裝置的程式等的軟體而運作處理裝置，控制部會作為使軟體與處理裝置（硬體資源）共同作用的具體手段而發揮功能。The control unit is composed of a computer including a processing device such as a CPU (Central Processing Unit) and a storage device such as a flash memory. By operating the processing device in accordance with software such as programs stored in the memory device, the control unit functions as a concrete means for the software and the processing device (hardware resources) to cooperate.

接著，針對後述的被加工物11的切割方法做說明：使用上述的切割裝置2切割並去除被加工物11的正面11a側的外周部。圖3係第一實施方式的被加工物11的切割方法的流程圖。Next, a method of cutting the workpiece 11 described below: using the cutting device 2 described above to cut and remove the outer peripheral portion of the front surface 11a side of the workpiece 11 will be described. FIG. 3 is a flowchart of the cutting method of the workpiece 11 according to the first embodiment.

在第一實施方式，首先，以保持面20c保持被加工物11的背面11b側，使被加工物11的正面11a露出（保持步驟（S10））。在保持步驟（S10）之後，使用背壓式感測單元68，檢測被加工物11的正面11a之外周部的多個點的高度位置（高度位置檢測步驟（S20））。In the first embodiment, first, the back surface 11 b side of the workpiece 11 is held by the holding surface 20 c to expose the front surface 11 a of the workpiece 11 (holding step ( S10 )). After the holding step (S10), the back pressure sensing unit 68 is used to detect the height positions of a plurality of points on the outer peripheral portion of the front surface 11a of the workpiece 11 (height position detection step (S20)).

在高度位置檢測步驟（S20），首先，以第一切割單元50與第二切割單元60彼此不接觸的方式，將照相機單元58的接物鏡與背壓式感測單元68的噴嘴68a定位在被加工物11的外周部上的相異區域。In the height position detection step (S20), first, the objective lens of the camera unit 58 and the nozzle 68a of the back pressure sensing unit 68 are positioned in such a way that the first cutting unit 50 and the second cutting unit 60 do not contact each other. A different area on the outer peripheral part of the workpiece 11.

在圖4（A）與圖4（B）表示第一切割單元50與第二切割單元60的配置的一例子。圖4（A）係載置有被加工物11的卡盤台20等的俯視圖，圖4（B）係載置有被加工物11的卡盤台20等的局部剖面側視圖。An example of the arrangement of the first cutting unit 50 and the second cutting unit 60 is shown in FIG. 4(A) and FIG. 4(B) . FIG. 4(A) is a plan view of the chuck table 20 and the like on which the workpiece 11 is placed, and FIG. 4(B) is a partial cross-sectional side view of the chuck table 20 and the like on which the workpiece 11 is placed.

接著，從噴嘴68a朝向外周部11c的正面11a的一個點，以預定的壓力瞬間噴射空氣等的氣體。然後，正面11a的一個點的高度會藉由控制部計算出。Next, gas such as air is instantaneously sprayed at a predetermined pressure from the nozzle 68a toward a point on the front surface 11a of the outer peripheral portion 11c. Then, the height of a point on the front surface 11a is calculated by the control unit.

接著，在使卡盤台20旋轉預定角度並靜止後，再次從噴嘴68a對外周部11c的正面11a的另一個點瞬間噴射氣體。如此，依序反覆進行從噴嘴68a噴射氣體與使卡盤台20旋轉預定角度的動作。Next, after the chuck table 20 is rotated by a predetermined angle and stopped, the gas is instantaneously injected from the nozzle 68 a to another point on the front surface 11 a of the outer peripheral portion 11 c. In this way, the operations of injecting gas from the nozzle 68 a and rotating the chuck table 20 by a predetermined angle are sequentially repeated.

圖5（A）係用以說明高度位置檢測步驟（S20）的被加工物11的俯視圖。在本實施方式，係花費預定的時間（例如17秒）而如圖5（A）所示，分別在正面11a的外周部11c中相異的9個點（P1到P9），檢測從噴嘴68a的下端到被加工物11的正面11a的第一距離。FIG. 5(A) is a top view of the workpiece 11 for explaining the height position detection step (S20). In this embodiment, it takes a predetermined time (for example, 17 seconds) to detect the slave nozzle 68a at nine different points (P1 to P9) in the outer peripheral portion 11c of the front surface 11a as shown in FIG. 5(A). The first distance from the lower end to the front surface 11a of the workpiece 11.

附帶一提的是，從保持面20c到噴嘴68a的下端的第二距離則是使用Z軸脈衝馬達48等預先測量。因此，藉由從第二距離減去第一距離，而計算出以保持面20c為基準的被加工物11的正面11a的高度Z（亦即，正面11a的高度Z＝第二距離－第一距離）。Incidentally, the second distance from the holding surface 20c to the lower end of the nozzle 68a is measured in advance using the Z-axis pulse motor 48 or the like. Therefore, by subtracting the first distance from the second distance, the height Z of the front surface 11a of the workpiece 11 based on the holding surface 20c is calculated (that is, the height Z of the front surface 11a = the second distance - the first distance). distance).

圖5（B）係表示在外周部11c的多個點的高度之資料的例子。附帶一提的是，在圖5（B）係表示將在周向中相鄰的2個點的高度以線性補償的圖表A。圖表A如後述，在調整外周部11c的切入深度時被利用。FIG. 5(B) is an example of data showing the heights of a plurality of points on the outer peripheral portion 11c. Incidentally, FIG. 5(B) shows a graph A in which the heights of two adjacent points in the circumferential direction are linearly compensated. As will be described later, the graph A is used when adjusting the cutting depth of the outer peripheral portion 11c.

在本實施方式，係一邊進行高度位置檢測步驟（S20），一邊使用照相機單元58拍攝被加工物11，並基於拍攝得到的影像，檢測被加工物11的外周部11c的邊緣位置（邊緣位置檢測步驟（S30））。In this embodiment, while performing the height position detection step (S20), the object to be processed 11 is photographed using the camera unit 58, and the edge position of the outer peripheral portion 11c of the object to be processed 11 is detected based on the photographed image (edge position detection). step (S30)).

在邊緣位置檢測步驟（S30），係拍攝在高度位置檢測步驟（S20）被檢測高度位置之外周部11c的多個點中任意的數個點（例如4個點）。圖6係用以說明邊緣位置檢測步驟（S30）的被加工物11等的俯視圖。In the edge position detection step (S30), any number of points (for example, four points) among the plurality of points on the outer peripheral portion 11c whose height position was detected in the height position detection step (S20) are photographed. FIG. 6 is a top view of the workpiece 11 etc. for explaining the edge position detection step (S30).

舉例而言，在高度位置檢測步驟（S20）所使用的噴嘴68a位在圖6所示的P5的上方的情況，則將在邊緣位置檢測步驟（S30）所使用的照相機單元58的接物鏡定位在圖6所示的P9的上方。惟須注意的是，接物鏡與噴嘴68a的配置並非限定為此例子。For example, when the nozzle 68a used in the height position detection step (S20) is located above P5 shown in FIG. 6, the objective lens of the camera unit 58 used in the edge position detection step (S30) is positioned Above P9 shown in Figure 6. However, it should be noted that the configuration of the objective lens and the nozzle 68a is not limited to this example.

在邊緣位置檢測步驟（S30），例如是拍攝包含在正面11a的外周部11c中相異的4個點（P2、P5、P7以及P9）的區域。附帶一提的是，在邊緣位置檢測步驟（S30）所拍攝的區域並非限定為只有4個點。In the edge position detection step (S30), for example, a region including four different points (P2, P5, P7, and P9) in the outer peripheral portion 11c of the front surface 11a is imaged. Incidentally, the area captured in the edge position detection step (S30) is not limited to only four points.

在藉由拍攝所得到的各影像中，對應1像素的實際長度（μm）係預先被設定。又，在各影像中各像素的（X，Y）座標會在切割裝置2中自動被計算出。因此，藉由處理由拍攝所得到的各影像，檢測位在P2、P5、P7以及P9附近的4個點，亦即檢測外周圓上相異的4個點的位置座標（p2、p5、p7以及p9）。In each image obtained by shooting, the actual length (μm) corresponding to 1 pixel is set in advance. In addition, the (X, Y) coordinates of each pixel in each image are automatically calculated in the cutting device 2 . Therefore, by processing each image obtained by shooting, four points located near P2, P5, P7, and P9 are detected, that is, the position coordinates of four different points on the outer circumference (p2, p5, p7 and p9).

藉由此4個點，檢測內接於4個點的外周圓（亦即外周部11c的邊緣）的位置。附帶一提的是，在邊緣位置檢測步驟（S30），並沒有必要特定出外周部11c的外周圓的全部座標，只要特定出外周圓的3個點以上的座標即可。Using these four points, the position of the outer circumferential circle inscribed in the four points (that is, the edge of the outer peripheral portion 11c) is detected. Incidentally, in the edge position detection step (S30), it is not necessary to specify all the coordinates of the outer circumferential circle of the outer peripheral portion 11c. It is sufficient to specify the coordinates of three or more points of the outer circumferential circle.

附帶一提的是，在本實施方式中，一邊進行步驟S20一邊進行步驟S30係意指在步驟S20中進行氣體的噴射及計算高度Z的時間，與在步驟S30中進行拍攝及檢測多個點的座標位置的時間是部分或全部重疊。Incidentally, in this embodiment, performing step S30 while performing step S20 means that the time for injecting gas and calculating the height Z in step S20 and photographing and detecting a plurality of points in step S30 The coordinate positions of the time are partially or completely overlapping.

在本實施方式中，藉由一邊進行高度位置檢測步驟（S20）一邊進行邊緣位置檢測步驟（S30），相較於兩者分別單獨進行的情況，能縮短檢測作業所需的時間。亦即，相較於兩者分別單獨進行的情況，能解決縮短檢測作業所需的時間的課題。In this embodiment, by performing the edge position detection step (S30) while performing the height position detection step (S20), the time required for the detection operation can be shortened compared to the case where both are performed separately. That is, the problem of shortening the time required for the inspection operation can be solved compared to the case where the two are performed separately.

舉例而言，在步驟S20與步驟S30分別單獨進行的情況，高度位置檢測步驟（S20）需要17秒，並且，邊緣位置檢測步驟（S30）需要15秒。然而，例如藉由在進行步驟S20的時間17秒內亦一併進行步驟S30，則相較於兩者分別單獨進行的情況，能縮短約一半的檢測作業所需的時間。For example, when steps S20 and S30 are performed separately, the height position detection step (S20) takes 17 seconds, and the edge position detection step (S30) takes 15 seconds. However, for example, by performing step S30 within 17 seconds of performing step S20, the time required for the detection operation can be shortened by about half compared to the case where the two are performed separately.

在邊緣位置檢測步驟（S30）之後，例如是使用檢測出的p2、p5、p7以及p9的（X，Y）座標，並藉由控制部計算出在俯視被加工物11的情況下的外周圓的中心11d（中心位置計算步驟（S40））。After the edge position detection step (S30), for example, using the detected (X, Y) coordinates of p2, p5, p7, and p9, the control unit calculates the outer circumferential circle when the workpiece 11 is viewed from above. center 11d (center position calculation step (S40)).

附帶一提的是，亦可一邊進行步驟S20一邊進行步驟S30與步驟S40。亦即，在步驟S20中進行氣體的噴射及計算高度Z的時間，與在步驟S30中進行拍攝及檢測多個點的座標位置的時間及在步驟S40中進行計算出中心11d的時間可部分或全部重疊。Incidentally, step S30 and step S40 may be performed while step S20 is performed. That is, the time for injecting the gas and calculating the height Z in step S20, the time for photographing and detecting the coordinate positions of multiple points in step S30, and the time for calculating the center 11d in step S40 may be partially or All overlap.

在步驟S40，係計算出三角形p2p5p7所外接的圓的中心（亦即外心）的（X，Y）座標Wc1。舉例而言，藉由求出直線p2p5的垂直平分線與直線p5p7的垂直平分線的交點座標，而計算出Wc1。In step S40, the (X, Y) coordinate Wc1 of the center (that is, the circumcenter) of the circle circumscribed by the triangle p2p5p7 is calculated. For example, Wc1 is calculated by finding the intersection coordinates of the perpendicular bisector of the straight line p2p5 and the perpendicular bisector of the straight line p5p7.

再以相同方式，計算出三角形p5p7p9的外心的（X，Y）座標Wc2、三角形p7p9p2的外心的（X，Y）座標Wc3以及三角形p9p2p5的外心的（X，Y）座標Wc4。然後，例如將Wc1、Wc2、Wc3、Wc4的平均值令為中心11d。Then in the same way, calculate the (X, Y) coordinate Wc2 of the circumcenter of triangle p5p7p9, the (X, Y) coordinate Wc3 of the circumcenter of triangle p7p9p2, and the (X, Y) coordinate Wc4 of the circumcenter of triangle p9p2p5. Then, for example, let the average value of Wc1, Wc2, Wc3, and Wc4 be the center 11d.

但是，如圖6所示，被加工物11的中心11d會有從卡盤台20的旋轉中心26偏移的情況。在圖6，係表示連結中心11d與旋轉中心26的直線沿著X軸方向的情況，而中心11d與旋轉中心26的偏移量（亦即偏心量）則以偏移量B表示。However, as shown in FIG. 6 , the center 11 d of the workpiece 11 may be offset from the rotation center 26 of the chuck table 20 . In FIG. 6 , the straight line connecting the center 11d and the rotation center 26 is shown along the X-axis direction, and the offset amount (that is, the eccentricity amount) between the center 11d and the rotation center 26 is represented by the offset amount B.

在步驟S20、步驟S30以及步驟S40之後，則使用第一切割單元50與第二切割單元60其中一者的切割刀片，切割被加工物11的外周部11c（外周部切割步驟（S50））。圖7係用以說明外周部切割步驟（S50）的被加工物11等的局部剖面側視圖。After steps S20 , S30 and S40 , the outer peripheral portion 11 c of the object 11 is cut using the cutting blade of one of the first cutting unit 50 and the second cutting unit 60 (outer peripheral portion cutting step ( S50 )). FIG. 7 is a partial cross-sectional side view of the workpiece 11 etc. for explaining the outer peripheral portion cutting step (S50).

在圖7所示的例子，係使用第一切割單元50切割外周部11c。惟須注意的是，亦可使用第二切割單元60切割外周部11c。在外周部切割步驟（S50），首先，將主軸54作為旋轉軸而使切割刀片56以預定的旋轉數（例如30000rpm）旋轉。In the example shown in FIG. 7 , the first cutting unit 50 is used to cut the outer peripheral portion 11c. However, it should be noted that the second cutting unit 60 can also be used to cut the outer peripheral portion 11c. In the outer peripheral portion cutting step ( S50 ), first, the cutting blade 56 is rotated at a predetermined number of rotations (for example, 30,000 rpm) using the main shaft 54 as a rotation axis.

然後，在使切割刀片56旋轉的狀態，將切割刀片56的下端定位在比正面11a還低且比背面11b還高的預定高度。藉此，調整切割刀片56切入被加工物11的外周部11c的深度（亦即切入深度）。Then, while the cutting blade 56 is being rotated, the lower end of the cutting blade 56 is positioned at a predetermined height that is lower than the front surface 11 a and higher than the back surface 11 b. Thereby, the depth at which the cutting blade 56 cuts into the outer peripheral portion 11 c of the workpiece 11 (that is, the cutting depth) is adjusted.

之後，使用X軸移動機構6使卡盤台20在X軸方向上移動，使切割刀片56切入外周部11c中P1的位置。接著，使卡盤台20在繞著旋轉軸24的預定方向（例如以俯視卡盤台20為順時針方向）旋轉。Thereafter, the X-axis moving mechanism 6 is used to move the chuck table 20 in the X-axis direction, so that the cutting blade 56 cuts into the position P1 in the outer peripheral portion 11c. Next, the chuck table 20 is rotated in a predetermined direction around the rotation axis 24 (for example, the clockwise direction when the chuck table 20 is viewed from above).

惟須注意的是，因為中心11d與旋轉中心26會偏移，所以在已固定切割刀片56的位置的情況，要去除的外周部11c的寬度在外周部11c的周向的不同位置會變得不同。於是，在外周部切割步驟（S50），如圖8（A）至圖8（D）所示，係基於偏移量B一邊調整切割刀片56的位置一邊切割外周部11c。However, it should be noted that because the center 11d and the rotation center 26 will be offset, when the position of the cutting blade 56 is fixed, the width of the outer peripheral portion 11c to be removed will become different at different positions in the circumferential direction of the outer peripheral portion 11c. different. Then, in the outer peripheral portion cutting step (S50), as shown in FIGS. 8(A) to 8(D) , the outer peripheral portion 11c is cut while adjusting the position of the cutting blade 56 based on the offset amount B.

附帶一提的是，在圖8（A）至圖8（D），須留意的是被加工物11的大小、偏移量B等係相較於圖6誇大地表示。圖8（A）係卡盤台20的旋轉角度為0度的情況下被加工物11等的俯視圖。圖8（A）係表示將切割刀片56切入外周部11c中P1的位置的狀態。Incidentally, in FIGS. 8(A) to 8(D) , it should be noted that the size of the workpiece 11 , offset amount B, etc. are exaggerated compared to FIG. 6 . FIG. 8(A) is a plan view of the workpiece 11 etc. when the rotation angle of the chuck table 20 is 0 degrees. FIG. 8(A) shows a state in which the cutting blade 56 is cut into the position P1 in the outer peripheral portion 11c.

接著，使卡盤台20例如以固定的旋轉速度在以俯視為順時針的方向旋轉。此時，位在切割刀片56的下方的外周部11c，因為偏移量B而導致相較於圖8（A）所示的P1的情況會以往Y軸方向的一側突出的方式移動。Next, the chuck table 20 is rotated in a clockwise direction in a plan view at a fixed rotation speed, for example. At this time, due to the offset amount B, the outer peripheral portion 11 c located below the cutting blade 56 moves to protrude to one side in the Y-axis direction compared to the case of P1 shown in FIG. 8(A) .

於是，為了使要去除的外周部11c的寬度固定，係隨著卡盤台20的旋轉，將切割刀片56往Y軸方向的一側移動。圖8（B）係卡盤台20的旋轉角度為90度的情況下被加工物11等的俯視圖。Then, in order to fix the width of the outer peripheral portion 11c to be removed, the cutting blade 56 is moved to one side in the Y-axis direction as the chuck table 20 rotates. FIG. 8(B) is a top view of the workpiece 11 etc. when the rotation angle of the chuck table 20 is 90 degrees.

更進一步，當使卡盤台20旋轉，則位在切割刀片56的下方的外周部11c，因為偏移量B而導致往與圖8（A）所示的情況相同的位置移動。於是，為了使要去除的外周部11c的寬度固定，係將切割刀片56往Y軸方向的另一側移動。圖8（C）係卡盤台20的旋轉角度為180度的情況下被加工物11等的俯視圖。Furthermore, when the chuck table 20 is rotated, the outer peripheral portion 11 c located below the cutting blade 56 moves to the same position as shown in FIG. 8(A) due to the offset amount B. Then, in order to fix the width of the outer peripheral portion 11c to be removed, the cutting blade 56 is moved to the other side in the Y-axis direction. FIG. 8(C) is a top view of the workpiece 11 etc. when the rotation angle of the chuck table 20 is 180 degrees.

更進一步，當使卡盤台20旋轉，則位在切割刀片56的下方的外周部11c，因為偏移量B而導致相較於圖8（A）所示的情況更往Y軸方向的另一側移動。於是，為了使要去除的外周部11c的寬度固定，則將切割刀片56往Y軸方向的另一側移動。圖8（D）係卡盤台20的旋轉角度為270度的情況下被加工物11等的俯視圖。Furthermore, when the chuck table 20 is rotated, the outer peripheral portion 11 c located below the cutting blade 56 is moved further in the Y-axis direction than the situation shown in FIG. 8(A) due to the offset amount B. Move sideways. Then, in order to fix the width of the outer peripheral portion 11c to be removed, the cutting blade 56 is moved to the other side in the Y-axis direction. FIG. 8(D) is a top view of the workpiece 11 etc. when the rotation angle of the chuck table 20 is 270 degrees.

更進一步，當使卡盤台20旋轉，則位在切割刀片56的下方的外周部11c，因為偏移量B而導致相較於圖8（A）所示的情況更往Y軸方向的一側移動。於是，為了使要去除的外周部11c的寬度固定，則將切割刀片56往Y軸方向的一側移動。Furthermore, when the chuck table 20 is rotated, the outer peripheral portion 11c located below the cutting blade 56 is moved further in the Y-axis direction than the situation shown in FIG. 8(A) due to the offset amount B. Move sideways. Then, in order to fix the width of the outer peripheral portion 11c to be removed, the cutting blade 56 is moved to one side in the Y-axis direction.

如此，因為基於中心11d與旋轉中心26的偏移量B而調整切割刀片56的位置，所以相較於未調整切割刀片56的位置的情況，能以預先設定的寬度正確地切割外周部11c。In this way, since the position of the cutting blade 56 is adjusted based on the offset B between the center 11d and the rotation center 26, the outer peripheral portion 11c can be accurately cut with a preset width compared to a case where the position of the cutting blade 56 is not adjusted.

附帶一提的是，在外周部切割步驟（S50），為了使要去除的外周部11c的寬度固定，除了將切割刀片56沿著Y軸方向移動之外，亦可根據所需，將卡盤台20沿著X軸方向移動。Incidentally, in the outer peripheral portion cutting step (S50), in order to fix the width of the outer peripheral portion 11c to be removed, in addition to moving the cutting blade 56 along the Y-axis direction, the chuck may also be moved as necessary. The stage 20 moves along the X-axis direction.

但是，如上述圖表A（參照圖5（B））所示，外周部11c的高度位置並非固定。於是，在外周部切割步驟（S50），係以往外周部11c的切入深度成為固定的方式，隨著卡盤台20的旋轉而調整切割刀片56的切入深度。However, as shown in the above-mentioned graph A (see FIG. 5(B) ), the height position of the outer peripheral portion 11 c is not fixed. Then, in the outer peripheral portion cutting step ( S50 ), the cutting depth of the cutting blade 56 is adjusted as the chuck table 20 rotates so that the cutting depth of the outer peripheral portion 11 c is fixed.

亦即，在外周部切割步驟（S50），係一邊基於偏移量B而調整切割刀片56的位置，且基於由高度位置檢測步驟（S20）所檢測出的多個點的高度位置而調整切入深度，並一邊切割外周部11c。That is, in the outer peripheral portion cutting step (S50), the position of the cutting blade 56 is adjusted based on the offset amount B, and the cutting is adjusted based on the height positions of the plurality of points detected in the height position detection step (S20). depth while cutting the outer peripheral portion 11c.

在本實施形態的外周部切割步驟（S50），係以從圖表A所示的高度藉由切割而去除預定的深度C（參照圖5（B））的方式，調整切割刀片56的下端的高度。附帶一提的是，將外周部切割步驟（S50）後的外周部11c的高度以圖5（B）的圖表D（虛線）表示。In the outer peripheral portion cutting step (S50) of this embodiment, the height of the lower end of the cutting blade 56 is adjusted so that a predetermined depth C (see FIG. 5(B) ) is removed by cutting from the height shown in the diagram A. . Incidentally, the height of the outer peripheral portion 11c after the outer peripheral portion cutting step (S50) is shown by graph D (dashed line) in FIG. 5(B).

在本實施方式中，因為基於外周部11c的高度位置而調整切割刀片56的切入深度，所以相較於未調整切入深度的情況，能抑制從正面11a切入的切入深度的不均。亦即，相較於未調整切入深度的情況，能使切入深度大致固定。In this embodiment, since the cutting depth of the cutting blade 56 is adjusted based on the height position of the outer peripheral portion 11c, unevenness in the cutting depth from the front surface 11a can be suppressed compared to a case where the cutting depth is not adjusted. That is, compared with the case where the depth of penetration is not adjusted, the depth of penetration can be made substantially constant.

接著，針對第二實施方式做說明。圖9係第二實施方式的被加工物11的切割方法的流程圖。在第二實施方式，首先進行保持步驟（S10）。然後，在保持步驟（S10）後，則進行邊緣位置檢測步驟（S30）。Next, the second embodiment will be described. FIG. 9 is a flowchart of the cutting method of the workpiece 11 according to the second embodiment. In the second embodiment, the holding step (S10) is performed first. Then, after the holding step (S10), the edge position detection step (S30) is performed.

在邊緣位置檢測步驟（S30），係相同於第一實施方式，例如是花費15秒的時間，拍攝正面11a的外周部11c的邊緣中相異的4個點。然後，藉由處理各影像，檢測外周部11c的邊緣之4個點的位置座標（亦即p2、p5、p7以及p9的（X，Y）座標）。In the edge position detection step ( S30 ), similar to the first embodiment, it takes, for example, 15 seconds to capture four different points on the edge of the outer peripheral portion 11 c of the front surface 11 a. Then, by processing each image, the position coordinates of four points on the edge of the outer peripheral portion 11c (that is, the (X, Y) coordinates of p2, p5, p7, and p9) are detected.

藉此，檢測出外周部11c的邊緣位置。在邊緣位置檢測步驟（S30）之後，則在中心位置計算步驟（S40）中使用檢測出的上述4個點的（X，Y）座標，計算出被加工物11的外周圓的中心11d。Thereby, the edge position of the outer peripheral part 11c is detected. After the edge position detection step (S30), the center position calculation step (S40) uses the detected (X, Y) coordinates of the four points to calculate the center 11d of the outer circumference of the workpiece 11.

接著，基於由步驟S40所檢測出的中心11d與旋轉中心26的偏移量B，一邊調整背壓式感測單元68的噴嘴68a的位置，一邊檢測正面11a的外周部11c的多個點的高度位置（高度位置檢測步驟（S45））。Next, based on the offset B between the center 11d and the rotation center 26 detected in step S40, while adjusting the position of the nozzle 68a of the back pressure sensing unit 68, a plurality of points of the outer peripheral portion 11c of the front surface 11a are detected. Height position (height position detection step (S45)).

舉例而言，在高度位置檢測步驟（S45），相同於圖8（A）至（D），係基於偏移量B而調整背壓式感測單元68的Y軸方向的位置，藉此將噴嘴68a定位在正面11a的外周部11c的正上方。For example, in the height position detection step (S45), similar to FIGS. 8(A) to (D) , the position of the back pressure sensing unit 68 in the Y-axis direction is adjusted based on the offset amount B, thereby The nozzle 68a is positioned directly above the outer peripheral portion 11c of the front surface 11a.

在高度位置檢測步驟（S45），例如是花費17秒的時間，分別在正面11a的外周部11c中相異的9個點（P1到P9），檢測從噴嘴68a的下端到被加工物11的正面11a的距離。In the height position detection step (S45), it takes, for example, 17 seconds to detect the height from the lower end of the nozzle 68a to the workpiece 11 at nine different points (P1 to P9) in the outer peripheral portion 11c of the front surface 11a. Distance from the front 11a.

在第二實施方式，因為基於偏移量B而調整噴嘴68a的位置，所以相較於未調整噴嘴68a的位置的情況，能更正確地將噴嘴68a定位在正面11a的外周部11c。是以，能更正確地檢測外周部11c的高度。亦即，相較於未基於偏移量B而調整噴嘴68a的位置的情況，能解決更正確地檢測外周部11c的高度的課題。In the second embodiment, since the position of the nozzle 68a is adjusted based on the offset amount B, the nozzle 68a can be positioned more accurately on the outer peripheral portion 11c of the front surface 11a than when the position of the nozzle 68a is not adjusted. Therefore, the height of the outer peripheral portion 11c can be detected more accurately. That is, compared with the case where the position of the nozzle 68a is not adjusted based on the offset amount B, the problem of detecting the height of the outer peripheral portion 11c more accurately can be solved.

在步驟S45之後，則相同於第一實施方式，一邊基於偏移量B而調整切割刀片56的位置，且基於在步驟S45所檢測出的多個點的高度位置而調整切入深度，並一邊切割外周部11c（外周部切割步驟（S50））。After step S45, it is the same as the first embodiment, while adjusting the position of the cutting blade 56 based on the offset amount B, and adjusting the cutting depth based on the height positions of the plurality of points detected in step S45, while cutting The outer peripheral portion 11c (outer peripheral portion cutting step (S50)).

如此，因為基於偏移量B而調整切割刀片56的位置，所以相較於未調整切割刀片56的位置的情況，能以預先設定的寬度正確地切割外周部11c。In this way, since the position of the cutting blade 56 is adjusted based on the offset amount B, the outer peripheral portion 11c can be accurately cut with a preset width compared to a case where the position of the cutting blade 56 is not adjusted.

更進一步，因為基於外周部11c的高度位置而調整切割刀片56的切入深度，所以相較於未調整切入深度的情況，能抑制從正面11a切入的切入深度的不均。亦即，相較於未調整切入深度的情況，能使切入深度大致固定。Furthermore, since the cutting depth of the cutting blade 56 is adjusted based on the height position of the outer peripheral portion 11c, variation in the cutting depth from the front surface 11a can be suppressed compared to a case where the cutting depth is not adjusted. That is, compared with the case where the depth of penetration is not adjusted, the depth of penetration can be made substantially constant.

除此之外，上述實施方式的構造、方法等只要不脫離本發明目的之範圍就能適當變更並實施。舉例而言，亦可使用雷射位移計（邊緣位置檢測單元）72來取代照相機單元58而檢測被加工物11的外周部11c的位置。In addition, the structures, methods, etc. of the above-described embodiments can be appropriately modified and implemented without departing from the scope of the purpose of the present invention. For example, a laser displacement meter (edge position detection unit) 72 may be used instead of the camera unit 58 to detect the position of the outer peripheral portion 11 c of the workpiece 11 .

圖10係使用雷射位移計72進行邊緣位置檢測步驟（S30）的情況下之被加工物11等的局部剖面側視圖。雷射位移計72具有射出寬幅的雷射光束L的雷射光束照射單元72a。又，雷射位移計72還具有受光元件（未圖示），接受來自雷射光束L所照射的物體的反射光。FIG. 10 is a partial cross-sectional side view of the workpiece 11 etc. when the edge position detection step (S30) is performed using the laser displacement meter 72. The laser displacement meter 72 has a laser beam irradiation unit 72a that emits a wide laser beam L. In addition, the laser displacement meter 72 further includes a light receiving element (not shown) that receives reflected light from an object irradiated with the laser beam L.

在檢測被加工物11的外周部11c的邊緣位置的情況，首先，係以保持面20c保持被加工物11的背面11b側。接著，在被加工物11的徑向中，將橫切過外周部11c的寬幅的雷射光束L從雷射光束照射單元72a往正面11a與保持面20c照射。然後，以受光元件接受來自被加工物11的反射光。When detecting the edge position of the outer peripheral portion 11 c of the workpiece 11 , first, the back surface 11 b side of the workpiece 11 is held by the holding surface 20 c. Next, a wide laser beam L crossing the outer peripheral portion 11 c in the radial direction of the workpiece 11 is irradiated from the laser beam irradiation unit 72 a to the front surface 11 a and the holding surface 20 c. Then, the light-receiving element receives the reflected light from the object 11 .

從雷射光束照射單元72a到物體的距離例如可藉由三角測量定理來測量。在從外周部11c的邊緣往內側一段預定長度的區域，所測量的距離係大致固定。舉例而言，從雷射光束照射單元72a到正面11a的距離會成為大致固定的距離E1。The distance from the laser beam irradiation unit 72a to the object can be measured by the triangulation theorem, for example. In a region of a predetermined length inward from the edge of the outer peripheral portion 11c, the measured distance is substantially constant. For example, the distance from the laser beam irradiation unit 72a to the front surface 11a becomes a substantially fixed distance E1.

然而，隨著靠近外周部11c的邊緣，所測量的距離會逐漸變大。然後，當抵達外周部11c的邊緣，所測量的距離會變成比距離E1還大的大致固定的距離E2。而距離E2即為從雷射光束照射單元72a到保持面20c的距離。However, the measured distance gradually becomes larger as it approaches the edge of the outer peripheral portion 11c. Then, when reaching the edge of the outer peripheral portion 11c, the measured distance becomes a substantially fixed distance E2 that is larger than the distance E1. The distance E2 is the distance from the laser beam irradiation unit 72a to the holding surface 20c.

因此，在被加工物11的徑向中所測量到的距離之輪廓，會以外周部11c的邊緣位置為界線而大致呈階梯狀。由於雷射光束L所照射的（X，Y）座標是預先被設定，因此藉由在所測量到的距離之輪廓中特定出從距離E1到距離E2變化的（X，Y）座標，而能檢測外周部11c的邊緣中一點的座標。同樣地，例如只要取得外周部11c的邊緣中3個點以上的座標，即能檢測出外周部11c的邊緣中4個點的位置座標。Therefore, the outline of the distance measured in the radial direction of the workpiece 11 will have a substantially stepped shape bounded by the edge position of the outer peripheral portion 11c. Since the (X, Y) coordinates irradiated by the laser beam L are set in advance, the (X, Y) coordinates that change from the distance E1 to the distance E2 can be specified in the measured distance profile. The coordinates of a point on the edge of the outer peripheral portion 11c are detected. Similarly, for example, by acquiring the coordinates of three or more points on the edge of the outer peripheral portion 11c, the position coordinates of four points on the edge of the outer peripheral portion 11c can be detected.

2:切割裝置 4:基台 6:X軸移動機構（加工進給單元） 8:X軸導軌 10:X軸移動台 11:被加工物 11a:正面 11b:背面 11c:外周部 11d:中心 12:X軸滾珠螺桿 14:X軸脈衝馬達 16:θ工作台 18a:工作台基台 18b:工作台蓋 20:卡盤台 20a:框體 20b:保持板 20c:保持面 24:旋轉軸 26:旋轉中心 30:支撐構造 32:切割單元移動機構（分度進給單元、切入進給單元） 34:Y軸導軌 36:Y軸移動板 38:Y軸滾珠螺桿 40:Y軸脈衝馬達 42:Z軸導軌 44:Z軸移動板 46:Z軸滾珠螺桿 48:Z軸脈衝馬達 50:第一切割單元 52:主軸外殼 54:主軸 56:切割刀片 58:照相機單元（邊緣位置檢測單元） 60:第二切割單元 62:主軸外殼 64:主軸 66:切割刀片 68:背壓式感測單元（高度位置檢測單元） 68a:噴嘴 70:刀片位置檢測單元 72:雷射位移計 72a:雷射光束照射單元 A,D:圖表 B:偏移量 C:深度 E1,E2:距離 L:雷射光束2: Cutting device 4:Abutment 6:X-axis moving mechanism (processing feed unit) 8:X-axis guide rail 10:X-axis moving stage 11: Processed objects 11a: Front 11b: Back 11c: Peripheral part 11d: Center 12:X-axis ball screw 14:X-axis pulse motor 16:θ workbench 18a:Workbench base 18b: workbench cover 20:Chuck table 20a:frame 20b: Holding plate 20c: Keep surface 24:Rotation axis 26:Rotation center 30:Support structure 32: Cutting unit moving mechanism (indexing feeding unit, cutting feeding unit) 34: Y-axis guide rail 36: Y-axis moving plate 38: Y-axis ball screw 40: Y-axis pulse motor 42:Z-axis guide rail 44:Z-axis moving plate 46:Z-axis ball screw 48:Z-axis pulse motor 50: First cutting unit 52:Spindle housing 54:Spindle 56:Cutting blade 58: Camera unit (edge position detection unit) 60: Second cutting unit 62:Spindle housing 64: Spindle 66:Cutting blade 68: Back pressure sensing unit (height position detection unit) 68a:Nozzle 70: Blade position detection unit 72:Laser Displacement Meter 72a:Laser beam irradiation unit A,D:Graph B:Offset C: Depth E1,E2: distance L:Laser beam

圖1係切割裝置的立體圖。 圖2（A）係第一切割單元等的俯視圖，圖2（B）係第一切割單元等的局部剖面側視圖。 圖3係第一實施方式的被加工物的切割方法的流程圖。 圖4（A）係載置有被加工物的卡盤台等的俯視圖，圖4（B）係載置有被加工物的卡盤台等的局部剖面側視圖。 圖5（A）係用以說明高度位置檢測步驟的被加工物的俯視圖，圖5（B）係表示在外周部的多個點的高度之資料的例子。 圖6係用以說明邊緣位置檢測步驟的被加工物等的俯視圖。 圖7係用以說明外周部切割步驟的被加工物等的局部剖面側視圖。 圖8（A）係卡盤台的旋轉角度為0度的情況下被加工物等的俯視圖，圖8（B）係卡盤台的旋轉角度為90度的情況下被加工物等的俯視圖，圖8（C）係卡盤台的旋轉角度為180度的情況下被加工物等的俯視圖，圖8（D）係卡盤台的旋轉角度為270度的情況下被加工物等的俯視圖。 圖9係第二實施方式的被加工物的切割方法的流程圖。 圖10係使用雷射位移計進行邊緣位置檢測步驟的情況下之被加工物等的局部剖面側視圖。Figure 1 is a perspective view of the cutting device. FIG. 2(A) is a top view of the first cutting unit and the like, and FIG. 2(B) is a partial cross-sectional side view of the first cutting unit and the like. FIG. 3 is a flowchart of a method of cutting a workpiece according to the first embodiment. FIG. 4(A) is a plan view of the chuck table and the like on which the workpiece is placed, and FIG. 4(B) is a partial cross-sectional side view of the chuck table and the like on which the workpiece is placed. FIG. 5(A) is a top view of the workpiece for explaining the height position detection step, and FIG. 5(B) is an example of data showing the heights of a plurality of points on the outer periphery. FIG. 6 is a top view of the workpiece and the like for explaining the edge position detection step. FIG. 7 is a partial cross-sectional side view of the workpiece etc. for explaining the outer peripheral portion cutting step. Figure 8(A) is a top view of the workpiece, etc. when the rotation angle of the chuck table is 0 degrees. Figure 8(B) is a top view of the workpiece, etc. when the rotation angle of the chuck table is 90 degrees. FIG. 8(C) is a top view of the workpiece and the like when the rotation angle of the chuck table is 180 degrees, and FIG. 8(D) is a top view of the workpiece and the like when the rotation angle of the chuck table is 270 degrees. FIG. 9 is a flowchart of a method for cutting a workpiece according to the second embodiment. FIG. 10 is a partial cross-sectional side view of a workpiece etc. when performing an edge position detection step using a laser displacement meter.

20:卡盤台 20:Chuck table

20a:框體 20a:Frame

20b:保持板 20b: Holding plate

20c:保持面 20c: Keep surface

24:旋轉軸 24:Rotation axis

50:第一切割單元 50: First cutting unit

52:主軸外殼 52:Spindle housing

54:主軸 54:Spindle

56:切割刀片 56:Cutting blade

58:照相機單元(邊緣位置檢測單元) 58: Camera unit (edge position detection unit)

60:第二切割單元 60: Second cutting unit

62:主軸外殼 62:Spindle housing

64:主軸 64: Spindle

66:切割刀片 66:Cutting blade

68:背壓式感測單元(高度位置檢測單元) 68: Back pressure sensing unit (height position detection unit)

68a:噴嘴 68a:Nozzle

Claims (4)

一種被加工物的切割方法，其使用切割裝置切割被加工物的正面側的外周部，其特徵在於，該切割裝置具備： 卡盤台，保持圓盤狀的該被加工物； 第一切割單元與第二切割單元，分別具有可切割保持在該卡盤台的該被加工物的切割刀片； 邊緣位置檢測單元，固定在該第一切割單元，並檢測該被加工物的該外周部的邊緣位置；及 高度位置檢測單元，固定在該第二切割單元，並檢測保持在該卡盤台的該被加工物的正面的高度位置； 該被加工物的切割方法具備下列步驟： 保持步驟，以露出該被加工物的該正面側的方式，用該卡盤台保持該被加工物的背面側； 高度位置檢測步驟，使用該高度位置檢測單元，檢測該被加工物的該正面之該外周部的多個點的高度位置； 邊緣位置檢測步驟，一邊進行該高度位置檢測步驟，一邊使用該邊緣位置檢測單元檢測該邊緣位置；以及 外周部切割步驟，一邊基於該被加工物的中心與該卡盤台的旋轉中心的偏移量而調整該第一切割單元與該第二切割單元其中一者的切割刀片的位置，且基於在該高度位置檢測步驟所檢測出的該多個點的高度位置而調整該其中一者的切割刀片對該被加工物的切入深度，並一邊切割該被加工物的該外周部，其中，該被加工物的中心是從在該邊緣位置檢測步驟所檢測出的該邊緣位置計算出。A method of cutting an object to be processed, which uses a cutting device to cut the outer peripheral portion of the front side of the object to be processed, characterized in that the cutting device is equipped with: The chuck table holds the disc-shaped workpiece; The first cutting unit and the second cutting unit respectively have cutting blades capable of cutting the workpiece held on the chuck table; An edge position detection unit is fixed on the first cutting unit and detects the edge position of the outer peripheral portion of the object to be processed; and a height position detection unit, fixed to the second cutting unit, and detecting the height position of the front face of the workpiece held on the chuck table; The cutting method of the workpiece includes the following steps: The holding step is to use the chuck table to hold the back side of the workpiece in a manner that exposes the front side of the workpiece; The height position detection step uses the height position detection unit to detect the height positions of multiple points on the outer peripheral portion of the front surface of the workpiece; The edge position detection step is to use the edge position detection unit to detect the edge position while performing the height position detection step; and In the outer peripheral portion cutting step, the position of the cutting blade of one of the first cutting unit and the second cutting unit is adjusted based on the offset between the center of the workpiece and the rotation center of the chuck table, and based on The height position of the plurality of points detected in the height position detection step is used to adjust the cutting depth of one of the cutting blades into the workpiece while cutting the outer peripheral portion of the workpiece, wherein the workpiece is The center of the workpiece is calculated from the edge position detected in the edge position detection step. 如請求項1所述之被加工物的切割方法，其中， 該邊緣位置檢測單元是以可見光拍攝被攝體的照相機或雷射位移計。The cutting method of the workpiece as described in claim 1, wherein, The edge position detection unit is a camera or laser displacement meter that photographs the subject using visible light. 如請求項1或2所述之被加工物的切割方法，其中， 該高度位置檢測單元是背壓式感測器。The cutting method of the workpiece as described in claim 1 or 2, wherein, The height position detection unit is a back pressure sensor. 一種被加工物的切割方法，其使用切割裝置切割被加工物的正面側的外周部，其特徵在於，該切割裝置具備： 卡盤台，保持圓盤狀的該被加工物； 第一切割單元與第二切割單元，分別具有可切割保持在該卡盤台的該被加工物的切割刀片； 邊緣位置檢測單元，固定在該第一切割單元，並檢測該被加工物的該外周部的邊緣位置；及 高度位置檢測單元，固定在該第二切割單元，並檢測保持在該卡盤台的該被加工物的正面的高度位置； 該被加工物的切割方法具備下列步驟： 保持步驟，以露出該被加工物的該正面側的方式，用該卡盤台保持該被加工物的背面側； 邊緣位置檢測步驟，使用該邊緣位置檢測單元，檢測該邊緣位置； 高度位置檢測步驟，一邊基於該被加工物的中心與該卡盤台的旋轉中心的偏移量而調整該高度位置檢測單元的位置，一邊檢測該被加工物的該正面之該外周部的多個點的高度位置，其中，該被加工物的中心是從在該邊緣位置檢測步驟所檢測出的該邊緣位置計算出；以及 外周部切割步驟，一邊基於該偏移量而調整該第一切割單元與該第二切割單元其中一者的切割刀片的位置，且基於在該高度位置檢測步驟所檢測出的該多個點的高度位置而調整該其中一者的切割刀片對該被加工物的切入深度，並一邊切割該被加工物的該外周部。A method of cutting an object to be processed, which uses a cutting device to cut the outer peripheral portion of the front side of the object to be processed, characterized in that the cutting device is equipped with: The chuck table holds the disc-shaped workpiece; The first cutting unit and the second cutting unit respectively have cutting blades capable of cutting the workpiece held on the chuck table; An edge position detection unit is fixed on the first cutting unit and detects the edge position of the outer peripheral portion of the object to be processed; and a height position detection unit, fixed to the second cutting unit, and detecting the height position of the front face of the workpiece held on the chuck table; The cutting method of the workpiece includes the following steps: The holding step is to use the chuck table to hold the back side of the workpiece in a manner that exposes the front side of the workpiece; The edge position detection step uses the edge position detection unit to detect the edge position; In the height position detection step, the position of the height position detection unit is adjusted based on the offset amount between the center of the workpiece and the rotation center of the chuck table, while detecting the polygonality of the outer peripheral portion of the front surface of the workpiece. The height position of a point, wherein the center of the workpiece is calculated from the edge position detected in the edge position detection step; and The outer peripheral portion cutting step adjusts the position of the cutting blade of one of the first cutting unit and the second cutting unit based on the offset amount, and based on the height position detection step of the plurality of points detected The cutting depth of one of the cutting blades in the workpiece is adjusted according to the height position, while cutting the outer peripheral portion of the workpiece.
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