JP6362908B2 - Method for processing laminated circular plate - Google Patents

Method for processing laminated circular plate Download PDF

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JP6362908B2
JP6362908B2 JP2014077871A JP2014077871A JP6362908B2 JP 6362908 B2 JP6362908 B2 JP 6362908B2 JP 2014077871 A JP2014077871 A JP 2014077871A JP 2014077871 A JP2014077871 A JP 2014077871A JP 6362908 B2 JP6362908 B2 JP 6362908B2
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laminated
circular plate
holding
holding table
flat portion
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JP2015199141A (en
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淳 小松
淳 小松
浩吉 湊
浩吉 湊
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Disco Corp
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Description

本発明は、積層円形板状物を加工する加工方法に関する。   The present invention relates to a processing method for processing a laminated circular plate.

ウェーハなどの円形板状物の上に円形板状物よりも小さいサイズの封止樹脂などの積層部が形成されて構成された積層円形板状物においては、積層部の側面が、円形板状物に近づくにつれて径が大きくなるように傾斜していることがあるため、積層部の外周に沿って切削して積層部をトリミングする加工が行われている(例えば、特許文献1及び特許文献2参照)。   In a laminated circular plate formed by forming a laminated portion such as a sealing resin having a size smaller than the circular plate on a circular plate such as a wafer, the side surface of the laminated portion is a circular plate. Since it may incline so that a diameter may become large as it approaches a thing, the process which cuts along the outer periphery of a lamination | stacking part and trims a lamination | stacking part is performed (for example, patent document 1 and patent document 2) reference).

円形板状物の中心と積層部の中心とが一致していれば、トリミング時に、積層円形板状物を保持する保持テーブルの中心と円形板状物の中心とを一致させ、その状態で、保持テーブルを回転させるとともに保持テーブルの中心から所定距離離れた位置に切削ブレードを位置付けて積層部に切り込ませることにより、積層部の外周縁に沿って中心から一定距離離れた位置を切削することができる。円形板状物の中心と保持テーブルの回転軸とを一致させるために、例えば、円形板状物を仮置きテーブルに仮置きして円形板状物の中心を所定の位置に位置決めしてから保持テーブルに搬送することが行われている。   If the center of the circular plate and the center of the laminated portion coincide with each other, at the time of trimming, the center of the holding table that holds the laminated circular plate and the center of the circular plate are made coincident, Rotate the holding table and position the cutting blade at a predetermined distance from the center of the holding table and cut it into the laminated part to cut a position away from the center along the outer peripheral edge of the laminated part Can do. In order to align the center of the circular plate and the rotation axis of the holding table, for example, the circular plate is temporarily placed on a temporary table and the center of the circular plate is positioned at a predetermined position and then held. It is carried to the table.

特開2003−273053号公報JP 2003-273053 A 特開2004−207459号公報Japanese Patent Laid-Open No. 2004-207459

しかし、円形板状物の上に円形板状物よりも小さいサイズの封止樹脂などの積層部が形成された積層円形板状物においては、円形板状物に対する積層部の積層位置にばらつきがあり、円形板状物の中心と積層部の中心とが一致していない場合がある。この場合は、保持テーブルの回転軸と円形板状物の中心とが一致するように積層円形板状物を保持テーブルに保持したとしても、保持テーブルの回転軸と積層部の中心とが一致せず、積層部の中心から一定距離離れた所望の位置をトリミングできないという問題がある。このため、積層部の外周部分をトリミングして積層部の外周部分に存在する傾斜部を除去しようとしても、傾斜部を完全に除去できなかったり、平坦に形成された部分を除去しすぎてしまったりするという問題が生じていた。   However, in a laminated circular plate in which a laminated portion such as a sealing resin having a size smaller than that of the circular plate is formed on the circular plate, there is a variation in the lamination position of the laminated portion with respect to the circular plate. In some cases, the center of the circular plate does not coincide with the center of the laminated portion. In this case, even if the laminated circular plate is held on the holding table so that the rotation axis of the holding table and the center of the circular plate are coincident, the rotation axis of the holding table and the center of the laminated portion are coincident. Therefore, there is a problem that a desired position that is a predetermined distance away from the center of the laminated portion cannot be trimmed. For this reason, even if an attempt is made to trim the outer peripheral portion of the laminated portion to remove the inclined portion existing in the outer peripheral portion of the laminated portion, the inclined portion cannot be completely removed or the flat portion is removed too much. There was a problem of getting stuck.

本発明は、このような問題にかんがみなされたもので、円形板状物の上に積層部が形成された積層円形板状物を加工するにあたり、積層部の所望の位置を加工できるようにすることを目的とする。   The present invention has been considered in view of such a problem. In processing a laminated circular plate in which a laminated portion is formed on a circular plate, a desired position of the laminated portion can be processed. For the purpose.

本発明に係る加工方法は、所定サイズを有する円形板状物上に該所定サイズより小さいサイズの円形平坦部と該円形平坦部から外周側に向けて傾斜し該円形平坦部を囲繞する傾斜部とを有する積層部が形成された積層円形板状物の加工方法であって、積層円形板状物を保持する保持面を有する回転可能なチャックテーブルの該保持面において積層円形板状物の該円形板状物側を保持して該積層部を露出させる保持ステップと、該保持ステップを実施した後、該円形平坦部と該傾斜部との境界位置を検出する検出ステップと、該検出ステップで検出した該境界位置に基づいて、該積層部に回転する切削ブレードを切り込ませつつ積層円形板状物を保持した該保持テーブルを回転させることで、該傾斜部を除去する切削ステップとを備え、該検出ステップでは、撮像手段を用いて、該積層部の該傾斜部が写らないように該保持テーブルの回転軸に対して光軸が傾斜した角度から該積層部を撮像し、撮像画像に基づいて該境界位置を検出するA processing method according to the present invention includes a circular flat portion having a size smaller than a predetermined size on a circular plate-like object having a predetermined size, and an inclined portion that inclines from the circular flat portion toward the outer peripheral side and surrounds the circular flat portion. A method for processing a laminated circular plate having a laminated portion formed thereon, wherein the laminated circular plate-like object is formed on the holding surface of a rotatable chuck table having a holding surface for holding the laminated circular plate-like object. A holding step for holding the circular plate-like object side to expose the laminated portion, a detecting step for detecting a boundary position between the circular flat portion and the inclined portion after the holding step, and a detecting step A cutting step for removing the inclined portion by rotating the holding table holding the laminated circular plate-like material while cutting a cutting blade rotating in the laminated portion based on the detected boundary position. , the detection In the step, the stacking unit is imaged from an angle at which the optical axis is tilted with respect to the rotation axis of the holding table so that the inclined portion of the stacking unit is not captured, and the stacking unit is imaged based on the captured image. Detect the boundary position .

本発明に係る加工方法によれば、検出ステップで検出した円形平坦部と傾斜部との境界位置に基づいて、積層部に回転する切削ブレードを切り込ませつつ積層円形板状物を保持した保持テーブルを回転させることで傾斜部を除去するため、円形板状物の中心と積層部の中心とがすれていても、積層部の所望の位置を切削することができ、傾斜部を完全に除去できなかったり平坦に形成された部分を除去しすぎてしまったりすることがない。   According to the processing method according to the present invention, based on the boundary position between the circular flat portion and the inclined portion detected in the detection step, the laminated circular plate-like object is held while the rotating blade is cut into the laminated portion. Since the inclined part is removed by rotating the table, the desired position of the laminated part can be cut even if the center of the circular plate and the center of the laminated part are slipped, and the inclined part is completely removed. It is not possible to remove or remove the flat portion.

また、撮像手段を用いて、積層部の傾斜部が写らないように保持テーブルの回転軸に対して光軸が傾斜した角度で積層部を撮像し、撮像画像に基づいて境界位置を検出することにより、円形平坦部と傾斜部との境界の位置を正確に検出することができる。 Further, by using the imaging means, the optical axis images the laminated portion at an angle inclined to the rotational axis of the holding table as the inclined portion of the laminate is not reflected, that to detect the boundary position based on the captured image Thus , the position of the boundary between the circular flat portion and the inclined portion can be accurately detected.

保持ステップを示す側面図。The side view which shows a holding | maintenance step. 検出ステップを示す側面図。The side view which shows a detection step. 検出ステップの別の例を示す側面図。The side view which shows another example of a detection step. 算出ステップを示す平面図。The top view which shows a calculation step. 切削ステップを示す側面図。The side view which shows a cutting step. 切削ステップを示す平面図。The top view which shows a cutting step.

図1に示す積層円形板状物10は、ウェーハなどの円板状の円形板状物11と、円形板状物11の表面に封止された樹脂などによって形成された積層部12とを備えている。積層部12は、例えば円形板状物11の表面に形成されているパターンをモールドするものであり、円錐台形状に形成され、円形板状物11の表面に平行な円形の円形平坦部122と、円形平坦部122の周囲を囲繞し円形板状物11に近づくにつれて外周側に向けて傾斜した傾斜部123とを備えている。円形平坦部122の径は、円形板状物11の径よりも小さい。   A laminated circular plate 10 shown in FIG. 1 includes a disk-like circular plate 11 such as a wafer, and a laminated portion 12 formed of a resin or the like sealed on the surface of the circular plate 11. ing. The laminated portion 12 molds, for example, a pattern formed on the surface of the circular plate-like object 11, is formed in a truncated cone shape, and has a circular circular flat portion 122 parallel to the surface of the circular plate-like object 11. In addition, an inclined portion 123 that surrounds the periphery of the circular flat portion 122 and is inclined toward the outer peripheral side as the circular plate-like object 11 is approached. The diameter of the circular flat portion 122 is smaller than the diameter of the circular plate-like object 11.

円形板状物11の中心軸と、積層部12の中心軸とは、ほぼ一致しているが、積層加工精度の影響などにより完全には一致していないことがある。このような積層円形板状物10に対して、積層部12の外周縁に沿って切削を施して傾斜部123を除去する。   The central axis of the circular plate-like object 11 and the central axis of the laminated portion 12 substantially coincide with each other, but may not completely coincide with each other due to the influence of lamination processing accuracy. The laminated circular plate 10 is cut along the outer peripheral edge of the laminated portion 12 to remove the inclined portion 123.

(1)保持ステップ
まず、保持テーブル20で積層円形板状物10を保持する。保持テーブル20は、XY平面に平行な保持面21を備え、保持面21に垂直な±Z方向に平行な回転軸29を中心として回転可能となっている。回転軸29は、保持面21の中心を通っている。保持ステップでは、円形板状物11の裏面を下(−Z方向)に向けて積層円形板状物10を保持テーブル20の保持面21に載置し、保持テーブル20は、保持面21において、載置された積層円形板状物10を吸引保持する。保持テーブル20に保持された積層円形板状物10は、円形板状物11の裏面が保持テーブル20の保持面21に接触して保持され、積層部12の円形平坦部122が上(+Z方向)側に露出する。
(1) Holding Step First, the laminated circular plate 10 is held by the holding table 20. The holding table 20 includes a holding surface 21 parallel to the XY plane, and is rotatable about a rotation axis 29 parallel to the ± Z direction perpendicular to the holding surface 21. The rotating shaft 29 passes through the center of the holding surface 21. In the holding step, the laminated circular plate 10 is placed on the holding surface 21 of the holding table 20 with the back surface of the circular plate 11 facing down (−Z direction). The mounted laminated circular plate 10 is sucked and held. The laminated circular plate-like object 10 held by the holding table 20 is held with the back surface of the circular plate-like object 11 coming into contact with the holding surface 21 of the holding table 20, and the circular flat portion 122 of the laminated portion 12 is upward (+ Z direction). ) Side exposed.

(2)検出ステップ
保持ステップを実施した後、積層円形板状物10が保持テーブル20に保持された状態で、例えば図2に示す撮像手段30を用いて、円形平坦部122と傾斜部123との境界124の水平位置(XY平面内における位置)を検出する。撮像手段30は、円形平坦部122よりも上方(+Z方向側)でかつ、円形平坦部122と傾斜部123との境界124よりも保持テーブル20の回転軸29に近い位置に配置され、光軸39が±Z方向に対して所定の角度αを有し、円形平坦部122と傾斜部123との境界124付近を内側から斜めに撮影する。
(2) Detection Step After the holding step, the circular flat plate 122 and the inclined portion 123 are used, for example, with the imaging means 30 shown in FIG. The horizontal position of the boundary 124 (the position in the XY plane) is detected. The imaging means 30 is arranged above the circular flat portion 122 (on the + Z direction side) and at a position closer to the rotation axis 29 of the holding table 20 than the boundary 124 between the circular flat portion 122 and the inclined portion 123, and the optical axis. 39 has a predetermined angle α with respect to the ± Z directions, and the vicinity of the boundary 124 between the circular flat portion 122 and the inclined portion 123 is photographed obliquely from the inside.

角度αは、傾斜部123が円形平坦部122の陰に隠れて撮像手段30が撮影する画像に写らないように設定される。例えば、保持テーブル20の回転軸29に対する傾斜部123の傾き角度がβである場合、α>βとなるように、角度αを設定すればよい。そして、撮像手段30が撮影した画像を解析することにより積層部12のエッジを境界124として検出する。撮像手段30が撮影した画像には傾斜部123が写っていないため、円形平坦部122の外周縁である境界124を鮮明に検出することができる。なお、検出ステップでは、傾斜部123が画像に写ったとしても、光量調整や画像処理などにより傾斜部123を除去可能である場合は、傾斜部123が完全に隠れる角度で撮像しなくてもよい。   The angle α is set so that the inclined portion 123 is hidden behind the circular flat portion 122 and is not reflected in the image captured by the imaging unit 30. For example, when the inclination angle of the inclined portion 123 with respect to the rotation axis 29 of the holding table 20 is β, the angle α may be set so that α> β. Then, the edge of the stacked unit 12 is detected as the boundary 124 by analyzing the image captured by the imaging unit 30. Since the inclined portion 123 is not shown in the image captured by the imaging unit 30, the boundary 124 that is the outer peripheral edge of the circular flat portion 122 can be detected clearly. In the detection step, even if the inclined portion 123 is captured in the image, if the inclined portion 123 can be removed by light amount adjustment, image processing, or the like, it is not necessary to take an image at an angle at which the inclined portion 123 is completely hidden. .

図3に示すように、背圧センサ40を用いて、円形平坦部122と傾斜部123との境界124の位置を検出する構成であってもよい。背圧センサ40は、ノズル41から−Z方向に向けてエアなどの流体48を噴射し、ノズル41内における流体48の圧力を測定する。ノズル41を−Z方向に動かしていき、ノズル41と測定対象物との間の距離が近づくと、ノズル41内における流体48の圧力が高くなることを利用して、測定対象物の表面の高さ(±Z方向における位置)を、測定対象物に接触することなく測定する。背圧センサ40は、非接触式高さ位置検出手段の一例である。   As shown in FIG. 3, the back pressure sensor 40 may be used to detect the position of the boundary 124 between the circular flat portion 122 and the inclined portion 123. The back pressure sensor 40 ejects a fluid 48 such as air from the nozzle 41 in the −Z direction, and measures the pressure of the fluid 48 in the nozzle 41. When the nozzle 41 is moved in the −Z direction and the distance between the nozzle 41 and the measurement object approaches, the pressure of the fluid 48 in the nozzle 41 increases, and the surface height of the measurement object is increased. The height (position in the ± Z direction) is measured without contacting the measurement object. The back pressure sensor 40 is an example of a non-contact type height position detection unit.

このようにして円形平坦部122の高さを測定しながら、背圧センサ40を、保持テーブル20の回転軸29に近い側から、保持テーブル20の径方向外側へ向けて移動させる。すると、最初のうちは、背圧センサ40によって測定される高さはほぼ一定であるが、背圧センサ40の測定位置が円形平坦部122と傾斜部123との境界124を越えると、背圧センサ40によって測定される高さが−Z方向に変化する。そこで、背圧センサ40によって測定される高さが変化し始めたときの背圧センサ40の測定位置に基づいて、保持テーブル20の回転軸29と、円形平坦部122と傾斜部123との境界124との間のXY平面内における距離を算出する。高さが変化し始めたときの測定位置に基づいて境界124の位置を検出するので、傾斜部123の影響を受けず、円形平坦部122と傾斜部123との境界124の位置を正確に検出することができる。   In this way, while measuring the height of the circular flat portion 122, the back pressure sensor 40 is moved from the side close to the rotation shaft 29 of the holding table 20 toward the radially outer side of the holding table 20. Then, initially, the height measured by the back pressure sensor 40 is substantially constant, but when the measurement position of the back pressure sensor 40 exceeds the boundary 124 between the circular flat portion 122 and the inclined portion 123, the back pressure is measured. The height measured by the sensor 40 changes in the −Z direction. Therefore, based on the measurement position of the back pressure sensor 40 when the height measured by the back pressure sensor 40 starts to change, the boundary between the rotating shaft 29 of the holding table 20, the circular flat portion 122 and the inclined portion 123. The distance in the XY plane with respect to 124 is calculated. Since the position of the boundary 124 is detected based on the measurement position when the height starts to change, the position of the boundary 124 between the circular flat portion 122 and the inclined portion 123 is accurately detected without being affected by the inclined portion 123. can do.

なお、非接触式高さ位置検出手段は、背圧センサ40に限らず、例えばレーザハイト計であってもよい。レーザハイト計は、レーザ光を測定対象物に照射し、測定対象物に当たって反射した反射光を受光することにより、測定対象物までの距離を測定する。   The non-contact type height position detecting means is not limited to the back pressure sensor 40, and may be a laser height meter, for example. The laser height meter measures the distance to the measurement object by irradiating the measurement object with laser light and receiving the reflected light that is reflected by the measurement object.

このように、円形平坦部122の高さを非接触で測定することにより、傾斜部123の影響による測定誤差の発生を防ぐことができる。なお、非接触式高さ位置検出手段は、保持テーブル20に対して径方向に相対移動させることができるものであればよく、上述したように非接触式高さ位置検出手段自体を移動させる構成であってもよいし、測定位置だけを移動させるものであってもよい。あるいは、非接触式高さ位置検出手段は移動させず、保持テーブル20を移動させる構成であってもよい。   Thus, by measuring the height of the circular flat portion 122 in a non-contact manner, it is possible to prevent the occurrence of measurement errors due to the influence of the inclined portion 123. The non-contact type height position detecting means may be any means that can be moved relative to the holding table 20 in the radial direction. As described above, the non-contact type height position detecting means itself is moved. Alternatively, only the measurement position may be moved. Alternatively, the holding table 20 may be moved without moving the non-contact type height position detecting means.

検出ステップでは、保持テーブル20の回転軸29と、円形平坦部122と傾斜部123との境界124との間の距離を計測した後、保持テーブル20を回転させる。保持テーブル20が所定の角度回転したら回転を停止し、保持テーブル20の回転軸29と、円形平坦部122と傾斜部123との境界124との間の距離をもう一度計測する。計測終了後、保持テーブル20を更に回転させ、所定の角度回転したら回転を停止し、保持テーブル20の回転軸29と、円形平坦部122と傾斜部123との境界124との間の距離を更にもう一度計測する。このようにして、保持テーブル20の回転軸29と、円形平坦部122と傾斜部123との境界124との間の距離を少なくとも3回計測する。なお、保持テーブル20が回転せずに、撮像手段30や非接触式高さ検出手段が平坦部122の外周に沿って移動して計測を行う構成としてもよい。   In the detection step, after measuring the distance between the rotating shaft 29 of the holding table 20 and the boundary 124 between the circular flat portion 122 and the inclined portion 123, the holding table 20 is rotated. When the holding table 20 rotates by a predetermined angle, the rotation is stopped, and the distance between the rotating shaft 29 of the holding table 20 and the boundary 124 between the circular flat portion 122 and the inclined portion 123 is measured again. After completion of the measurement, the holding table 20 is further rotated, and when it is rotated by a predetermined angle, the rotation is stopped, and the distance between the rotating shaft 29 of the holding table 20 and the boundary 124 between the circular flat portion 122 and the inclined portion 123 is further increased. Measure again. In this way, the distance between the rotating shaft 29 of the holding table 20 and the boundary 124 between the circular flat portion 122 and the inclined portion 123 is measured at least three times. In addition, it is good also as a structure which the measurement means 30 and a non-contact-type height detection means move along the outer periphery of the flat part 122, without the holding table 20 rotating.

(3)算出ステップ
次に、検出ステップで計測した円形平坦部122と傾斜部123との境界124と保持テーブル20の回転軸29との間の距離、及び、計測時における保持テーブル20の回転角度に基づいて、検出した円形平坦部122と傾斜部123との境界124の位置を算出する。例えば、保持テーブル20の回転軸29と円形平坦部122との交点を原点として境界124のXY座標を算出する。少なくとも3回計測するので、少なくとも3つの座標が算出される。
(3) Calculation Step Next, the distance between the boundary 124 between the circular flat portion 122 and the inclined portion 123 measured in the detection step and the rotating shaft 29 of the holding table 20, and the rotation angle of the holding table 20 at the time of measurement. Based on this, the position of the boundary 124 between the detected circular flat portion 122 and the inclined portion 123 is calculated. For example, the XY coordinates of the boundary 124 are calculated with the intersection point between the rotation axis 29 of the holding table 20 and the circular flat portion 122 as the origin. Since measurement is performed at least three times, at least three coordinates are calculated.

次に、算出ステップでは、図4に示すように、検出ステップで算出した円形平坦部122と傾斜部123との境界124の位置に基づいて、保持テーブル20の回転軸29と円形平坦部122の中心との間のずれを算出する。   Next, in the calculation step, as shown in FIG. 4, based on the position of the boundary 124 between the circular flat portion 122 and the inclined portion 123 calculated in the detection step, the rotation axis 29 of the holding table 20 and the circular flat portion 122 The deviation from the center is calculated.

3箇所の境界位置に基づき、円形平坦部122の中心の位置を算出することができる。例えば、下記数式(1)、数式(2)及び数式(3)により、検出ステップで算出した積層部12の境界124の3つの位置A(X1,Y1),B(X2,Y2),C(X3,Y3)を通る円の中心点O’(XC,YC)と半径Rとを算出する。   Based on the three boundary positions, the center position of the circular flat portion 122 can be calculated. For example, the following three positions A (X1, Y1), B (X2, Y2), C () of the boundary 124 of the stacked portion 12 calculated in the detection step by the following formula (1), formula (2), and formula (3). A center point O ′ (XC, YC) and a radius R of a circle passing through X3, Y3) are calculated.

Figure 0006362908
Figure 0006362908

Figure 0006362908
Figure 0006362908

Figure 0006362908
Figure 0006362908

次に、下記数式(4)及び数式(5)により、原点Oと中心点O’との間の距離dと、線分OO’がX軸となす角度φとを算出する。   Next, the distance d between the origin O and the center point O ′ and the angle φ formed by the line segment OO ′ and the X axis are calculated by the following formulas (4) and (5).

Figure 0006362908
Figure 0006362908

Figure 0006362908
Figure 0006362908

距離dは、保持テーブル20の回転軸29と円形平坦部122の中心との間の距離(ずれ)を表し、角度φは、保持テーブル20の回転軸29から見た保持テーブル20の所定方向(X軸方向)に対する円形平坦部122の中心の方向を表す。   The distance d represents the distance (displacement) between the rotating shaft 29 of the holding table 20 and the center of the circular flat portion 122, and the angle φ is a predetermined direction of the holding table 20 as viewed from the rotating shaft 29 of the holding table 20 ( The direction of the center of the circular flat portion 122 with respect to the (X-axis direction) is represented.

(4)切削ステップ
次に、図5に示すように、保持テーブル20に積層円形板状物10が保持された状態で、保持テーブル20を回転させ、切削手段50を用いて積層部12の外周部分を切削する。切削手段50は、スピンドル52の先端に切削ブレード51が装着されて構成されており、スピンドル52は、±Y方向に平行でかつ保持テーブル20の回転軸29と交わる回転軸59を中心として回転することにより切削ブレード51を回転させる。
(4) Cutting Step Next, as shown in FIG. 5, the holding table 20 is rotated while the laminated circular plate 10 is held on the holding table 20, and the outer periphery of the laminated portion 12 is cut using the cutting means 50. Cut the part. The cutting means 50 is configured by attaching a cutting blade 51 to the tip of a spindle 52, and the spindle 52 rotates around a rotation axis 59 that is parallel to the ± Y direction and intersects the rotation axis 29 of the holding table 20. As a result, the cutting blade 51 is rotated.

そして、検出ステップで検出した積層部12第二円形板状物12の境界124外周縁の位置に基づいて、保持テーブル20の回転角度に応じて、保持テーブル20の径方向である±Y方向に切削ブレード51を移動させて切込み位置を調整し、切削ブレード51を−Z方向に移動させて積層部12に切り込ませつつ保持テーブル20を回転させることにより、積層部12の境界124外周縁に沿って切削し、傾斜部123を除去する。このときの切削ブレード51の切込み深さは、積層部12を完全切断できる深さであり、切削ブレード51の下端が円形板状物11の表面に切り込まない深さである。   Then, based on the position of the outer peripheral edge of the boundary 124 of the stacked portion 12 second circular plate 12 detected in the detection step, in the ± Y direction that is the radial direction of the holding table 20 according to the rotation angle of the holding table 20 The cutting blade 51 is moved to adjust the cutting position, and the cutting blade 51 is moved in the −Z direction to cut the laminated table 12 and rotate the holding table 20. It cuts along, and the inclined part 123 is removed. The cutting depth of the cutting blade 51 at this time is a depth at which the laminated portion 12 can be completely cut, and is a depth at which the lower end of the cutting blade 51 does not cut into the surface of the circular plate-like object 11.

例えば、円形平坦部122と傾斜部123との境界124から距離eだけ内側の位置から傾斜部123の最外周の先端部125までの所定幅を切削除去したい場合、算出ステップで算出した円形平坦部122と傾斜部123との境界124の半径Rから距離eを差し引いた差(R−e)を半径rとし、算出ステップで算出した円形平坦部122の中心点O’から半径rの位置に除去すべき所定幅以上の刃厚の切削ブレードの一側面を位置付けて切り込ませる。を切削すればよい。保持テーブル20の回転角度をθとすると、図6に示すように、保持テーブル20の回転軸29から見た積層部12の中心の方向が+X方向となす角度は、(θ+φ)である。そこで、例えば下記数式6により、保持テーブル20の回転軸29と切削ブレード51の切込み位置との間の距離yを算出する。積層部12の1回転で切削除去できない刃厚の切削ブレードを使用する場合、即ち境界124から距離eだけ内側の位置から傾斜部123の先端部125までの所定幅より薄い厚みの切削ブレードを使用する場合には、境界124や境界124の中心点O’から半径rの位置にその切削ブレードを切り込ませた後、保持テーブル20を必要回数回転させるとともに切削ブレードを外周方向に移動させながら切削することを繰り返し、所定幅のトリミングを行う。   For example, when it is desired to cut and remove a predetermined width from the position inside the distance 124 from the boundary 124 between the circular flat portion 122 and the inclined portion 123 to the outermost end portion 125 of the inclined portion 123, the circular flat portion calculated in the calculation step The difference (R−e) obtained by subtracting the distance e from the radius R of the boundary 124 between the boundary 122 and the inclined portion 123 is defined as the radius r, and is removed from the center point O ′ of the circular flat portion 122 calculated in the calculation step to the position of the radius r. A side surface of the cutting blade having a thickness greater than a predetermined width to be cut is positioned and cut. Can be cut. Assuming that the rotation angle of the holding table 20 is θ, as shown in FIG. 6, the angle formed by the direction of the center of the stacked portion 12 viewed from the rotation shaft 29 of the holding table 20 with the + X direction is (θ + φ). Therefore, the distance y between the rotary shaft 29 of the holding table 20 and the cutting position of the cutting blade 51 is calculated by, for example, Equation 6 below. When using a cutting blade having a blade thickness that cannot be removed by one rotation of the laminated portion 12, that is, using a cutting blade having a thickness smaller than a predetermined width from a position e inside the boundary 124 to a tip portion 125 of the inclined portion 123. When cutting, the cutting blade is cut at a position of radius r from the boundary 124 or the center point O ′ of the boundary 124, and then the holding table 20 is rotated as many times as necessary and cutting is performed while moving the cutting blade in the outer circumferential direction. This is repeated to perform trimming with a predetermined width.

Figure 0006362908
Figure 0006362908

保持テーブル20の回転に伴って角度θが変化するので、距離yも変化する。距離yの変化に追随するように切削ブレード51を±Y方向に移動させながら切削することにより、積層部12の外周部分を円周状に切削する。このように、算出ステップで算出されたずれを補正するように切削ブレード51と保持テーブル20とを保持面21の面方向と平行な方向に相対移動させながら切削することにより、積層部12の中心が積層円形板状物10全体の中心からずれている場合であっても、積層部12の所望の位置を切削し、傾斜部123を完全に除去することができる。   Since the angle θ changes as the holding table 20 rotates, the distance y also changes. By cutting while moving the cutting blade 51 in the ± Y direction so as to follow the change in the distance y, the outer peripheral portion of the laminated portion 12 is cut into a circumferential shape. As described above, the cutting blade 51 and the holding table 20 are cut while being relatively moved in a direction parallel to the surface direction of the holding surface 21 so as to correct the deviation calculated in the calculation step, thereby obtaining the center of the stacked portion 12. Even when it is deviated from the center of the entire laminated circular plate 10, the desired position of the laminated portion 12 can be cut and the inclined portion 123 can be completely removed.

なお、切削ステップでは、保持テーブル20の回転角度に応じて切削ブレード51の±Y方向の位置を変化させるのではなく、保持テーブル20の回転角度にかかわらず、切削ブレード51の±Y方向の位置を一定に保つようにしてもよい。   In the cutting step, the position of the cutting blade 51 in the ± Y direction is not changed depending on the rotation angle of the holding table 20, but the position of the cutting blade 51 in the ± Y direction regardless of the rotation angle of the holding table 20. May be kept constant.

例えば、算出ステップで算出した円形平坦部122と傾斜部123との境界124の半径Rから、原点Oと中心点O’保持テーブル20の回転軸29と円形平坦部122の中心との間の距離dを差し引いた差(R−d)を算出し、切削ブレード51を、保持テーブル20の回転軸29から距離(R−d)だけ離れた位置に位置付ける。距離(R−d)は、保持テーブル20の回転軸29と、円形平坦部122と傾斜部123との境界124との間の距離の最小値であるから、この状態で保持テーブル20を回転させてその外周側の切削を行えば、切削ブレード51を移動させなくても、傾斜部123を完全に除去することができる。この場合は、刃厚が厚いタイプの切削ブレードを用いたり、保持テーブル20を複数回回転させ切削ブレード51を外周側に移動させたりしながら切削を行う。保持テーブル20の回転角度に応じて切削ブレード51の位置を複雑な制御によって変える必要がないので、制御が容易となる。   For example, the distance between the origin O and the rotation axis 29 of the center point O ′ holding table 20 and the center of the circular flat portion 122 from the radius R of the boundary 124 between the circular flat portion 122 and the inclined portion 123 calculated in the calculation step. A difference (R−d) obtained by subtracting d is calculated, and the cutting blade 51 is positioned at a position away from the rotation shaft 29 of the holding table 20 by a distance (R−d). Since the distance (Rd) is the minimum value of the distance between the rotation axis 29 of the holding table 20 and the boundary 124 between the circular flat portion 122 and the inclined portion 123, the holding table 20 is rotated in this state. If the outer peripheral side is cut, the inclined portion 123 can be completely removed without moving the cutting blade 51. In this case, the cutting is performed while using a cutting blade with a thick blade thickness or rotating the holding table 20 a plurality of times to move the cutting blade 51 to the outer peripheral side. Since it is not necessary to change the position of the cutting blade 51 by complicated control according to the rotation angle of the holding table 20, the control becomes easy.

また、算出ステップを省略し、検出ステップで検出した、保持テーブル20の回転軸29と、円形平坦部122と傾斜部123との境界124との距離の中から最も小さいものを選択し、保持テーブル20の回転軸29と、円形平坦部122と傾斜部123との境界124との間の距離の最小値とみなし、その境界位置に切削ブレード51を位置付けてもよい。そうすることにより、円形平坦部122の中心点や半径を求めるための複雑な計算をする必要がなくなる。   Further, the calculation step is omitted, and the smallest one is selected from the distances between the rotation axis 29 of the holding table 20 and the boundary 124 between the circular flat portion 122 and the inclined portion 123 detected in the detection step. The cutting blade 51 may be positioned at the boundary position, assuming that the distance between the 20 rotation shafts 29 and the boundary 124 between the circular flat portion 122 and the inclined portion 123 is the minimum value. By doing so, it is not necessary to perform complicated calculations for obtaining the center point and radius of the circular flat portion 122.

その場合は、本当の最小値は、実測値のうちの最小値より小さいと考えられるため、実測値の中の最小値より保持テーブル20の回転軸29に近い位置に切削ブレード51を位置付けて保持テーブル20を複数回回転させ切削ブレード51を外周側に移動させながら切削を行ったり、刃厚の厚い切削ブレードを用いて切削を行ったりすれば、傾斜部123を完全に除去することができる。   In this case, since the actual minimum value is considered to be smaller than the minimum value of the actually measured values, the cutting blade 51 is positioned and held at a position closer to the rotating shaft 29 of the holding table 20 than the minimum value of the actually measured values. If cutting is performed while rotating the table 20 a plurality of times and moving the cutting blade 51 to the outer peripheral side, or cutting is performed using a cutting blade having a thick blade thickness, the inclined portion 123 can be completely removed.

また、実測値のうちの最小値ではなく、実測値の平均値や、実測値のうちの最大値を基準として、切削ブレード51を位置付けてもよい。その場合は、最小値を用いる場合と比較して、保持テーブル20の回転軸29と、円形平坦部122と傾斜部123との境界124の間の距離の最小値との差が大きくなるため、その分を考慮して、保持テーブル20の回転軸29に近い位置に切削ブレード51を位置付けて保持テーブル20を複数回回転させながら切削ブレード51を外周側に移動させたり、刃厚の厚い切削ブレードを用いて切削を行ったりすればよい。   Further, the cutting blade 51 may be positioned based on the average value of the actually measured values or the maximum value of the actually measured values instead of the minimum value of the actually measured values. In that case, the difference between the rotation shaft 29 of the holding table 20 and the minimum value of the distance between the boundary 124 between the circular flat portion 122 and the inclined portion 123 is larger than in the case of using the minimum value. In consideration of this, the cutting blade 51 is positioned near the rotation axis 29 of the holding table 20, and the cutting blade 51 is moved to the outer peripheral side while rotating the holding table 20 a plurality of times. Cutting may be performed using

10…積層円形板状物、11…円形板状物、
12…積層部、122…円形平坦部、123…傾斜部、124…境界、125…先端部、
13…接着剤、17…外周縁、
20…保持テーブル、21…保持面、29…回転軸、
30…撮像手段、39…光軸、
40…背圧センサ、41…ノズル、48…流体、
50…切削手段、51…切削ブレード、52…スピンドル、59…回転軸
10 ... laminated circular plate, 11 ... circular plate,
12 ... Laminated portion, 122 ... Circular flat portion, 123 ... Inclined portion, 124 ... Boundary, 125 ... Tip portion,
13 ... Adhesive, 17 ... Outer rim,
20 ... holding table, 21 ... holding surface, 29 ... rotating shaft,
30 ... Imaging means, 39 ... Optical axis,
40 ... back pressure sensor, 41 ... nozzle, 48 ... fluid,
50 ... Cutting means, 51 ... Cutting blade, 52 ... Spindle, 59 ... Rotating shaft

Claims (1)

所定サイズを有する円形板状物上に該所定サイズより小さいサイズの円形平坦部と該円形平坦部から外周側に向けて傾斜し該円形平坦部を囲繞する傾斜部とを有する積層部が形成された積層円形板状物の加工方法であって、
積層円形板状物を保持する保持面を有する回転可能なチャックテーブルの該保持面において積層円形板状物の該円形板状物側を保持して該積層部を露出させる保持ステップと、
該保持ステップを実施した後、該円形平坦部と該傾斜部との境界位置を検出する検出ステップと、
該検出ステップで検出した該境界位置に基づいて、該積層部に回転する切削ブレードを切り込ませつつ積層円形板状物を保持した該保持テーブルを回転させることで、該傾斜部を除去する切削ステップと、
を備え、
前記検出ステップでは、撮像手段を用いて、前記積層部の前記傾斜部が写らないように該保持テーブルの回転軸に対して光軸が傾斜した角度から該積層部を撮像し、撮像画像に基づいて前記境界位置を検出す
加工方法。
A laminated portion having a circular flat portion having a size smaller than the predetermined size and an inclined portion inclined from the circular flat portion toward the outer peripheral side and surrounding the circular flat portion is formed on a circular plate-like object having a predetermined size. A method for processing a laminated circular plate,
A holding step of holding the circular plate side of the laminated circular plate on the holding surface of the rotatable chuck table having a holding surface for holding the laminated circular plate, and exposing the laminated portion;
A detection step of detecting a boundary position between the circular flat portion and the inclined portion after performing the holding step;
Cutting that removes the inclined portion by rotating the holding table holding the laminated circular plate while cutting a rotating blade that rotates into the laminated portion based on the boundary position detected in the detecting step. Steps,
With
In the detection step, the stacking unit is imaged from an angle at which the optical axis is tilted with respect to the rotation axis of the holding table so that the inclined unit of the stacking unit is not captured using an imaging unit, and based on the captured image processing how to detect the boundary position Te.
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