CN112123606A - Method for cutting workpiece - Google Patents

Method for cutting workpiece Download PDF

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Publication number
CN112123606A
CN112123606A CN202010577903.1A CN202010577903A CN112123606A CN 112123606 A CN112123606 A CN 112123606A CN 202010577903 A CN202010577903 A CN 202010577903A CN 112123606 A CN112123606 A CN 112123606A
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CN
China
Prior art keywords
cutting
workpiece
peripheral portion
outer peripheral
edge
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Granted
Application number
CN202010577903.1A
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Chinese (zh)
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CN112123606B (en
Inventor
牧野香一
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Disco Corp
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Disco Corp
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Publication of CN112123606A publication Critical patent/CN112123606A/en
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Publication of CN112123606B publication Critical patent/CN112123606B/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B28D5/029—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a plurality of cutting blades
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0064—Devices for the automatic drive or the program control of the machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B28D5/023—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a cutting blade mounted on a carriage
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
    • G01B21/02—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness
    • G01B21/08—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness for measuring thickness
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection

Abstract

Provided is a method for cutting a workpiece, wherein the outer periphery of the workpiece is cut in consideration of the offset of the center of the outer periphery of the workpiece from the rotation center of a chuck table and the thickness deviation of the workpiece. The method for cutting the workpiece comprises the following steps: a height position detection step of detecting height positions of a plurality of portions of an outer peripheral portion of a front surface of the workpiece by using height position detection means; an edge position detection step of detecting the position of the edge by using an edge position detection means while performing the height position detection step; and an outer peripheral portion cutting step of cutting the outer peripheral portion of the workpiece while adjusting the position of the cutting tool based on the offset amount of the center of the workpiece calculated based on the position of the edge from the rotation center of the chuck table and adjusting the depth based on the height positions of the plurality of portions detected by the height position detecting step.

Description

Method for cutting workpiece
Technical Field
The present invention relates to a method of cutting a workpiece, in which the outer peripheral portion of the workpiece is cut after the height of the outer peripheral portion and the position of the edge of the outer peripheral portion are detected.
Background
When cutting a plate-shaped workpiece such as a semiconductor wafer, for example, a cutting apparatus is used which includes a chuck table for holding the workpiece and a cutting unit to which an annular cutting tool is attached. The cutting unit includes, for example: a main shaft; an annular cutting tool attached to one end side of the main shaft; and a rotation drive source attached to the other end side of the main shaft.
When cutting a workpiece, for example, a lower end of a rotating cutting tool is positioned lower than one surface of the workpiece in a state where the one surface side of the workpiece is held by a holding surface of a chuck table. Then, the chuck table and the cutting unit are relatively moved, and the workpiece is cut along the moving path.
In addition, when the workpiece is thinned by grinding the rear surface side of the workpiece, for example, a grinding apparatus is used which includes a chuck table for holding the workpiece and a grinding unit disposed above the chuck table.
The grinding unit has, for example, a spindle as a rotation axis. A disk-shaped wheel mounting seat is fixed to the lower surface side of the main shaft. Further, an annular grinding wheel is attached to the lower surface side of the wheel attachment seat. A plurality of grinding stones are annularly provided on the lower surface side of the grinding wheel.
When grinding a workpiece, the chuck table is rotated while holding the front side of the workpiece by the chuck table, and the grinding wheel is further rotated in the same direction as the chuck table with the spindle of the grinding unit as a rotation axis. Then, the lower surface side of the grinding wheel is pressed against the back surface side of the workpiece, thereby grinding the back surface side of the workpiece.
However, since a disc-shaped workpiece usually has a bevel on its outer periphery, when the workpiece is ground and thinned, its cross-sectional shape sharply tapers like a knife edge on the outer periphery of the workpiece. If the blade is formed, the workpiece is easily damaged from the outer peripheral portion.
Therefore, in order to prevent damage to the outer peripheral portion during grinding, the following techniques are known (for example, see patent document 1): first, the outer peripheral portion of the front surface side of the workpiece is cut to a predetermined thickness by a cutting device to be removed (that is, edge trimming is performed), and then the rear surface side of the workpiece is ground by a grinding device.
In the edge trimming, for example, the back surface side of the workpiece is sucked and held by a chuck table. Next, the chuck table is rotated while cutting a cutting tool, which rotates with the spindle as a rotation axis, into the outer peripheral portion of the front side of the workpiece.
Patent document 1: japanese patent laid-open No. 2000-173961
When the edge trimming is performed, if the center of the outer circumference of the disc-shaped workpiece is offset from the rotation center of the chuck table, the position of the cutting tool relative to the workpiece is offset with the rotation of the chuck table even if the cutting tool is positioned at the outer circumference of the workpiece.
Further, if the thickness of the workpiece is not uniform in the circumferential direction of the outer peripheral portion of the workpiece, the depth of cut of the cutting tool into the workpiece changes with the rotation of the chuck table even if the lower end of the cutting tool is positioned at a predetermined depth of the workpiece.
Disclosure of Invention
The present invention has been made in view of the above problems, and an object thereof is to provide a method of cutting a workpiece, in which an outer peripheral portion of the workpiece is cut in consideration of an offset amount of a center of an outer peripheral circle of the workpiece with respect to a rotation center of a chuck table and a thickness deviation of the workpiece.
According to one aspect of the present invention, there is provided a method of cutting a workpiece by using a cutting apparatus for cutting an outer peripheral portion of the workpiece on a front side thereof, the cutting apparatus including: a chuck table for holding the disc-shaped workpiece; a 1 st cutting unit and a 2 nd cutting unit each having a cutting tool capable of cutting the object held by the chuck table; an edge position detection unit fixed to the 1 st cutting unit and detecting a position of an edge of the outer peripheral portion of the workpiece; and a height position detection unit fixed to the 2 nd cutting unit and detecting a height position of the front surface of the workpiece held by the chuck table, wherein the method for cutting the workpiece includes the steps of: a holding step of holding the back surface side of the workpiece by the chuck table so as to expose the front surface side of the workpiece; a height position detection step of detecting height positions of a plurality of portions of the outer peripheral portion of the front surface of the workpiece by using the height position detection means; an edge position detection step of detecting the position of the edge using the edge position detection means while performing the height position detection step; and an outer peripheral portion cutting step of cutting the outer peripheral portion of the workpiece while adjusting a position of one of the 1 st cutting unit and the 2 nd cutting unit based on an offset amount of the center of the workpiece calculated based on the position of the edge detected by the edge position detecting step from a rotation center of the chuck table and adjusting a depth of cutting into the workpiece by the one cutting tool based on the height positions of the plurality of portions detected by the height position detecting step.
Preferably, the edge position detection means is a camera or a laser displacement meter for capturing an object with visible light.
Preferably, the height position detecting means is a back pressure sensor.
According to another aspect of the present invention, there is provided a method of cutting a workpiece by using a cutting apparatus for cutting an outer peripheral portion of the workpiece on a front side thereof, the cutting apparatus including: a chuck table for holding the disc-shaped workpiece; a 1 st cutting unit and a 2 nd cutting unit each having a cutting tool capable of cutting the object held by the chuck table; an edge position detection unit fixed to the 1 st cutting unit and detecting a position of an edge of the outer peripheral portion of the workpiece; and a height position detection unit fixed to the 2 nd cutting unit and detecting a height position of the front surface of the workpiece held by the chuck table, wherein the method for cutting the workpiece includes the steps of: a holding step of holding the back surface side of the workpiece by the chuck table so as to expose the front surface side of the workpiece; an edge position detection step of detecting the position of the edge using the edge position detection unit; a height position detection step of detecting height positions of a plurality of portions of the outer peripheral portion of the front surface of the workpiece while adjusting a position of the height position detection means based on an offset amount between a center of the workpiece and a rotation center of the chuck table, the offset amount being calculated based on the position of the edge detected by the edge position detection step; and an outer peripheral portion cutting step of cutting the outer peripheral portion of the workpiece while adjusting a position of one of the cutting tools of the 1 st cutting unit and the 2 nd cutting unit based on the offset amount and adjusting a depth of cutting into the workpiece by the one cutting tool based on the height positions of the plurality of portions detected by the height position detecting step.
In the method for cutting a workpiece according to one aspect of the present invention, the height position detecting step detects the height positions of a plurality of portions of the outer peripheral portion of the front surface of the disc-shaped workpiece. Further, an edge position detecting step of detecting the position of the edge of the workpiece by using the edge position detecting means is performed while the height position detecting step is performed. After the height position detecting step and the edge position detecting step, an outer peripheral portion cutting step of cutting an outer peripheral portion of the workpiece is performed.
In the peripheral portion cutting step, the position of the cutting tool is adjusted based on the offset between the center of the workpiece and the rotation center of the chuck table calculated from the position of the edge of the peripheral portion detected in the edge position detecting step. In the peripheral portion cutting step, the depth of the cutting tool cutting into the workpiece is adjusted based on the height positions of the plurality of portions measured in the height position detecting step.
In this way, since the position of the cutting tool is adjusted according to the offset between the center of the workpiece and the rotation center of the chuck table, the outer peripheral portion can be accurately cut by a predetermined width, as compared with a case where the position of the cutting tool is not adjusted.
Further, since the cutting depth of the cutting tool is adjusted according to the height position of the outer peripheral portion, it is possible to suppress variation in cutting depth from the front surface and to make the cutting depth substantially constant, as compared with the case where the cutting depth is not adjusted. Further, by performing the edge position detecting step while performing the height position detecting step, the time required for the detecting operation can be shortened as compared with a case where both are performed separately.
Drawings
Fig. 1 is a perspective view of a cutting device.
Fig. 2 (a) is a plan view of the 1 st cutting unit and the like, and fig. 2 (B) is a partial cross-sectional side view of the 1 st cutting unit and the like.
Fig. 3 is a flowchart of a method for cutting a workpiece according to embodiment 1.
Fig. 4 (a) is a plan view of a chuck table or the like on which a workpiece is placed, and fig. 4 (B) is a partial cross-sectional side view of the chuck table or the like on which the workpiece is placed.
Fig. 5 (a) is a plan view of the workpiece for explaining the height position detection step, and fig. 5 (B) is an example of data showing the heights at a plurality of positions of the outer peripheral portion.
Fig. 6 is a plan view of a workpiece or the like for explaining the edge position detection step.
Fig. 7 is a side view, partially in cross section, of a workpiece or the like for explaining a peripheral portion cutting step.
Fig. 8 (a) is a plan view of the workpiece or the like at a rotation angle of 0 degrees of the chuck table, fig. 8 (B) is a plan view of the workpiece or the like at a rotation angle of 90 degrees of the chuck table, fig. 8 (C) is a plan view of the workpiece or the like at a rotation angle of 180 degrees of the chuck table, and fig. 8 (D) is a plan view of the workpiece or the like at a rotation angle of 270 degrees of the chuck table.
Fig. 9 is a flowchart of a method of cutting a workpiece according to embodiment 2.
Fig. 10 is a side view, partially in cross section, of a workpiece or the like in a step of detecting an edge position using a laser displacement meter.
Description of the reference symbols
2: a cutting device; 4: a base station; 6: an X-axis moving mechanism (machining feed unit); 8: an X-axis guide rail; 10: an X-axis moving table; 11: a workpiece; 11 a: a front side; 11 b: a back side; 11 c: a peripheral portion; 11 d: a center; 12: an X-axis ball screw; 14: an X-axis pulse motor; 16: theta stage; 18 a: a workbench base station; 18 b: a table cover; 20: a chuck table; 20 a: a frame body; 20 b: a holding plate; 20 c: a holding surface; 24: a rotating shaft; 26: a center of rotation; 30: a support structure; 32: a cutting unit moving mechanism (an indexing feed unit, a cutting feed unit); 34: a Y-axis guide rail; 36: moving the plate along the Y axis; 38: a Y-axis ball screw; 40: a Y-axis pulse motor; 42: a Z-axis guide rail; 44: moving the plate along the Z axis; 46: a Z-axis ball screw; 48: a Z-axis pulse motor; 50: 1 st cutting unit; 52: a spindle housing; 54: a main shaft; 56: a cutting tool; 58: a camera unit (edge position detection unit); 60: a 2 nd cutting unit; 62: a spindle housing; 64: a main shaft; 66: a cutting tool; 68: a back pressure sensor unit (height position detection unit); 68 a: a nozzle; 70: a tool position detection unit; 72: a laser displacement meter; 72 a: a laser beam irradiation unit; A. d: a curve; b: an offset; c: depth; e1, E2: a distance; l: a laser beam.
Detailed Description
An embodiment of one embodiment of the present invention will be described with reference to the drawings. Fig. 1 is a perspective view of a cutting device 2. The cutting device 2 includes a base 4 on which each component is mounted. An X-axis moving mechanism (machining feed means) 6 is provided on the upper surface of the base 4.
The X-axis moving mechanism 6 includes a pair of X-axis guide rails 8 substantially parallel to the X-axis direction (the machining feed direction, the front-rear direction), and an X-axis moving table 10 is slidably attached to the X-axis guide rails 8.
A nut portion (not shown) is provided on the lower surface (back surface) side of the X-axis moving table 10, and an X-axis ball screw 12 parallel to the X-axis guide rail 8 is rotatably connected to the nut portion.
An X-axis pulse motor 14 is connected to one end of the X-axis ball screw 12. The X-axis moving table 10 is moved in the X-axis direction along the X-axis guide rail 8 by rotating the X-axis ball screw 12 by the X-axis pulse motor 14.
A columnar θ stage 16 is provided on the upper surface side (front surface side) of the X-axis moving table 10. The θ table 16 has a rotation drive source (not shown) such as a motor, and a table base 18a and the like are provided on the θ table 16.
The table base 18a has a substantially cylindrical shape and is coupled to the upper surface of the θ table 16. A table cover 18b is provided around the table base 18a, and a bellows-like cover member (not shown) that can expand and contract is provided on one side and the other side of the table cover 18b in the X-axis direction.
The table cover 18b and the cover member cover the upper side of the X-axis movement mechanism 6 including the X-axis movement table 10. A disk-shaped chuck table 20 is provided on the upper surface of the table base 18 a.
The chuck table 20 is connected to the θ table 16 via a table base 18 a. Therefore, the chuck table 20 can rotate about a straight line substantially parallel to the Z-axis direction (the cutting feed direction, the vertical direction) as the rotation axis 24 (see fig. 2B).
The chuck table 20 has a frame 20 a. The frame 20a is made of metal such as stainless steel, and has a disk portion constituting a bottom surface and an annular ring portion having a predetermined width and located on an upper surface side of the disk portion.
A recess is formed on the upper surface side of the frame 20a by the disk portion and the annular portion. A holding plate 20b is fixed in the recess. The holding plate 20b is formed of, for example, porous ceramic.
The holding plate 20b is connected to a suction source (not shown) such as an ejector through a flow path formed in the housing 20 a. When the suction source is operated, a negative pressure is generated on the upper surface of the holding plate 20 b.
The workpiece 11 and the like are placed on the holding plate 20 b. The workpiece 11 is, for example, a disk-shaped wafer made of semiconductor such as silicon, and has a device region and an outer peripheral excess region surrounding the device region on the front surface 11a side.
The device region is further divided into a plurality of regions by planned dividing lines (streets) arranged in a grid pattern, and devices such as an IC (Integrated Circuit) and an LSI (Large Scale Integrated Circuit) are formed in each region.
When negative pressure is generated in a state where the rear surface 11b side of the workpiece 11 is brought into contact with the upper surfaces of the frame 20a and the holding plate 20b, the workpiece 11 is held by the chuck table 20. Therefore, the upper surface of the frame 20a and the upper surface of the holding plate 20b are generally referred to as a holding surface 20c of the chuck table 20. The workpiece 11 is held by the holding surface 20 c.
However, the chuck table 20 may be constituted by only the frame 20 a. In this case, a plurality of suction ports (not shown) are provided on the upper surface of the annular portion of the housing 20 a. For example, when the chuck table 20 is viewed in plan, the plurality of suction ports are provided at substantially equal intervals in the circumferential direction.
Each suction port is located at one end of a flow path formed in the thickness direction of the annular portion. The other end of the flow path is connected to a suction source (not shown) such as an ejector via a flow path (not shown) formed in the disk portion. When the suction source is operated, a negative pressure is generated on the upper surface of the annular portion, and the workpiece 11 is sucked and held by the upper surface of the annular portion.
Therefore, when the chuck table 20 does not have the holding plate 20b and the suction port is formed in the upper surface of the frame 20a, the upper surface of the frame 20a is referred to as a holding surface 20c of the chuck table 20.
A gate-shaped support structure 30 is provided on the upper surface of the base 4 so as to straddle the X-axis movement mechanism 6. Two sets of cutting unit moving mechanisms 32 each having an index feed unit and a plunge feed unit are provided on the upper front surface of the support structure 30. First, the index feeding unit will be explained.
The cutting unit moving mechanisms 32 each have a pair of Y-axis rails 34 in common, and the pair of Y-axis rails 34 are disposed on the front surface of the support structure 30 and are substantially parallel to the Y-axis direction (the indexing direction, the left-right direction). A Y-axis moving plate 36 constituting each cutting unit moving mechanism 32 is slidably attached to the Y-axis guide 34.
A nut portion (not shown) is provided on the rear surface side of each Y-axis moving plate 36. A Y-axis ball screw 38 substantially parallel to the Y-axis guide rail 34 is rotatably connected to each nut portion.
A Y-axis pulse motor 40 is connected to one end of each Y-axis ball screw 38. If the Y-axis ball screw 38 is rotated by the Y-axis pulse motor 40, the Y-axis moving plate 36 moves in the Y-axis direction along the Y-axis guide 34.
A cutting unit is provided on the front surface (front surface) of each Y-axis moving plate 36. The incision unit has a pair of Z-axis rails 42 substantially parallel to the Z-axis direction, and the pair of Z-axis rails 42 is provided on the front surface of the Y-axis moving plate 36.
A Z-axis moving plate 44 is slidably attached to the Z-axis guide rail 42. A nut portion (not shown) is provided on the rear surface side of each Z-axis moving plate 44. A Z-axis ball screw 46 parallel to the Z-axis guide rail 42 is rotatably connected to each nut portion.
A Z-axis pulse motor 48 is connected to one end of each Z-axis ball screw 46. If the Z-axis ball screw 46 is rotated by the Z-axis pulse motor 48, the Z-axis moving plate 44 moves in the Z-axis direction along the Z-axis guide rail 42.
A 1 st cutting unit 50 for cutting the workpiece 11 is fixed to a lower portion of the Z-axis moving plate 44 located on one side in the Y-axis direction. Further, a 2 nd cutting unit 60 for cutting the workpiece 11 is fixed to a lower portion of the Z-axis moving plate 44 located on the other side in the Y-axis direction.
The positions of the 1 st cutting unit 50 and the 2 nd cutting unit 60 in the X-axis direction with respect to the chuck table 20 can be determined by the number of pulses of the pulse signal input to the X-axis pulse motor 14, or the like.
In addition, the positions of the 1 st cutting unit 50 and the 2 nd cutting unit 60 with respect to the chuck table 20 in the Y-axis direction can be determined by the number of pulses of the pulse signal input to the Y-axis pulse motor 40. Similarly, the positions of the 1 st cutting unit 50 and the 2 nd cutting unit 60 with respect to the chuck table 20 in the Z-axis direction can be determined by the number of pulses of the pulse signal input to the Z-axis pulse motor 48.
Here, the 1 st cutting unit 50 and the 2 nd cutting unit 60 will be described with reference to fig. 2 (a) and 2 (B). Fig. 2 (a) is a plan view of the 1 st cutting unit 50 and the like, and fig. 2 (B) is a partial cross-sectional side view of the 1 st cutting unit 50 and the like.
The 1 st cutting unit 50 has a spindle housing 52. A part of the spindle 54 is rotatably housed in the spindle housing 52. An annular cutting tool 56 is attached to one end side of the spindle 54 protruding from the spindle housing 52.
The cutting tool 56 has a cutting edge on the outer peripheral portion thereof, which can cut the workpiece 11. The cutting tool 56 is, for example, a hub-type cutting tool. A motor (not shown) as a rotation drive source is connected to the other end side of the main shaft 54. When the motor is operated, the cutting tool 56 rotates about the spindle 54 as a rotation axis.
A camera unit (edge position detection unit) 58 is fixed to the other side of the spindle housing 52 in the X axis direction. The camera unit 58 captures an image of an object such as the workpiece 11 held by the holding surface 20c of the chuck table 20 with visible light.
The camera unit 58 includes an objective lens (not shown), an imaging element (not shown) such as a CCD image sensor or a CMOS image sensor, for example. The camera unit 58 receives light (visible light) from an object through an objective lens by an image pickup element, thereby picking up an image of the object.
The 2 nd cutting unit 60 also has a spindle housing 62, a spindle 64, a cutting tool 66, and the like. The 2 nd cutting unit 60 has the same configuration as the 1 st cutting unit 50, and thus further description thereof is omitted.
A back pressure sensor unit (height position detection unit) 68 is fixed to the other side of the spindle housing 62 in the X axis direction. The back pressure sensor unit 68 detects, for example, the height position of the front surface 11a of the workpiece 11 held by the holding surface 20c of the chuck table 20 without contacting the workpiece 11.
Here, the structure of the back pressure sensor unit 68 will be described. The back pressure sensor unit 68 includes a gas supply tube (not shown) having one end connected to a gas supply source (not shown). A nozzle 68a is connected to the other end of the gas supply pipe.
The gas supply pipe has a branch portion (not shown) that branches from a position between one end and the other end thereof. The branching portion is connected to the 1 st gas chamber in the differential pressure gauge (not shown). The differential pressure gauge has a 1 st gas chamber and a 2 nd gas chamber spatially separated from the 1 st gas chamber.
The 1 st gas chamber and the 2 nd gas chamber are separated by a diaphragm (not shown), and a strain gauge (not shown) is attached to the diaphragm. A gas release pipe (not shown) is connected to the 2 nd gas chamber, and the pressure inside the gas release pipe is maintained at a constant gas pressure.
Next, a method of measuring an unknown distance from the lower end of the nozzle 68a to an object located below the nozzle 68a using the back pressure sensor unit 68 will be described. In addition, the height position of the nozzle 68a is precisely controlled by the Z-axis pulse motor 48.
An object (for example, the workpiece 11) is disposed below the nozzle 68 a. When gas is ejected from the nozzle 68a at a predetermined gas pressure, the gas is reflected by the object, and a part of the reflected gas is sucked into the nozzle 68 a. The amount of gas sucked into the nozzle 68a (reflection amount) varies depending on the distance between the lower end of the nozzle 68a and the front surface of the object. Therefore, the pressure of the 1 st gas chamber changes according to the distance.
When a pressure difference is generated between the 1 st gas chamber and the 2 nd gas chamber, the resistance value of the strain gauge changes. When the resistance value of the strain gauge changes, the voltage value of a voltmeter (not shown) connected to the strain gauge changes. For example, as the distance between the nozzle 68a and the object becomes larger, the voltage value becomes smaller, and as the distance becomes smaller, the voltage value becomes larger. The correspondence relationship (graph, correspondence table, etc.) between the distance and the voltage value is measured in advance and stored in a storage device of a control unit (not shown).
An unknown distance from the lower end of the nozzle 68a to the front surface of the object located below the nozzle 68a is measured based on the correspondence of each of the previously measured distances to the voltage value. For example, after the gas is ejected from the nozzle 68a toward the front surface of the object, the voltage value measured by the voltmeter is converted into a distance by using the above-described correspondence relationship, thereby measuring an unknown distance to the front surface of the object.
Here, return to fig. 1. A tool position detection unit 70 that detects the position (height) of the lower end of the cutting tool 56 is provided below each of the 1 st cutting unit 50 and the 2 nd cutting unit 60.
The X-axis moving mechanism 6, the θ table 16, the cutting unit moving mechanism 32, the 1 st cutting unit 50, the camera unit 58, the 2 nd cutting unit 60, the back pressure sensor unit 68, the tool position detection unit 70, and the like are connected to a control unit (not shown), respectively. The control unit controls the X-axis moving mechanism 6 and the like in accordance with the processing conditions of the workpiece 11 and the like.
The control Unit is constituted by a computer including a Processing device such as a CPU (Central Processing Unit) and a storage device such as a flash memory. The control unit functions as a specific means for cooperating the software and the processing device (hardware resource) by operating the processing device in accordance with the software such as a program stored in the storage device.
Next, a cutting method for cutting and removing the workpiece 11 on the outer peripheral portion on the front surface 11a side of the workpiece 11 by using the cutting apparatus 2 will be described. Fig. 3 is a flowchart of a method of cutting a workpiece 11 according to embodiment 1.
In embodiment 1, first, the holding surface 20c holds the back surface 11b side of the workpiece 11 to expose the front surface 11a of the workpiece 11 (holding step (S10)). After the holding step (S10), the height positions of a plurality of portions on the outer peripheral portion of the front surface 11a of the workpiece 11 are detected using the back pressure sensor unit 68 (height position detecting step (S20)).
In the height position detecting step (S20), first, the objective lens of the camera unit 58 and the nozzle 68a of the back pressure sensor unit 68 are positioned in different areas on the outer peripheral portion of the workpiece 11 so that the 1 st cutting unit 50 and the 2 nd cutting unit 60 do not contact each other
Fig. 4 (a) and 4 (B) show an example of the arrangement of the 1 st cutting unit 50 and the 2 nd cutting unit 60. Fig. 4 (a) is a plan view of the chuck table 20 and the like on which the workpiece 11 is placed, and fig. 4 (B) is a partial cross-sectional side view of the chuck table 20 and the like on which the workpiece 11 is placed.
Next, a gas such as air is instantaneously sprayed at a predetermined pressure from the nozzle 68a toward a portion of the front surface 11a of the outer peripheral portion 11 c. Then, the height of one portion of the front face 11a is calculated by the control unit.
Next, after the chuck table 20 is rotated by a predetermined angle and is stationary, the gas is instantaneously ejected from the nozzle 68a to another portion of the front surface 11a of the outer peripheral portion 11 c. In this way, the gas is ejected from the nozzle 68a and the chuck table 20 is rotated by a predetermined angle in sequence.
Fig. 5 (a) is a plan view of the workpiece 11 for explaining the height position detection step (S20). In the present embodiment, it takes a predetermined time (for example, 17s), and as shown in fig. 5 a, the 1 st distance from the lower end of the nozzle 68a to the front surface 11a of the workpiece 11 is detected at each of 9 different locations (P1 to P9) on the outer peripheral portion 11c of the front surface 11 a.
In addition, the 2 nd distance from the holding surface 20c to the lower end of the nozzle 68a is measured in advance using the Z-axis pulse motor 48 or the like. Therefore, the height Z of the front surface 11a of the workpiece 11 with respect to the holding surface 20c is calculated by subtracting the 1 st distance from the 2 nd distance (that is, the height Z of the front surface 11a is equal to the 2 nd distance to the 1 st distance).
Fig. 5 (B) is an example of data showing the heights at a plurality of positions of the outer peripheral portion 11 c. Fig. 5 (B) shows a curve a in which the heights of two circumferentially adjacent portions are linearly interpolated. As described later, the curve a is used when the cutting depth of the outer peripheral portion 11c is adjusted.
In the present embodiment, the height position detecting step (S20) is performed while the camera unit 58 is used to capture an image of the workpiece 11, and the position of the edge of the outer peripheral portion 11c of the workpiece 11 is detected from the captured image (edge position detecting step (S30)).
In the edge position detecting step (S30), any several parts (for example, four parts) of the plurality of parts of the outer peripheral portion 11c whose height position is detected in the height position detecting step (S20) are imaged. Fig. 6 is a plan view of the workpiece 11 and the like for explaining the edge position detection step (S30).
For example, in the case where the nozzle 68a used in the height position detecting step (S20) is located above P5 shown in fig. 6, the objective lens of the camera unit 58 used in the edge position detecting step (S30) is positioned above P9 shown in fig. 6. However, the arrangement of the objective lens and the nozzle 68a is not limited to this example.
In the edge position detecting step (S30), for example, an area including four different regions (P2, P5, P7, and P9) in the outer peripheral portion 11c of the front surface 11a is imaged. The area captured in the edge position detection step (S30) is not limited to 4 regions.
The actual length (μm) corresponding to one pixel in each image obtained by imaging is predetermined. In addition, the (X, Y) coordinates of each pixel in each image are automatically calculated in the cutting device 2. Therefore, the position coordinates (P2, P5, P7, and P9) of four points (i.e., four different points on the outer circumference circle) located near P2, P5, P7, and P9 are detected by processing each of the images obtained by the shooting.
The position of the outer circumference circle inscribed in the four points (i.e., the edge of the outer circumference portion 11 c) is detected by these four points. In the edge position detecting step (S30), it is not necessary to specify all the coordinates of the outer circumference circle of the outer circumference portion 11c, and it is only necessary to specify coordinates of three or more points of the outer circumference circle.
In the present embodiment, performing S30 while performing S20 means that the time at which the gas is ejected and the height Z is calculated in S20 partially overlaps or completely overlaps the time at which the image is captured and the position coordinates of the plurality of points are detected in S30.
In the present embodiment, by performing the edge position detection step (S30) while performing the height position detection step (S20), the time required for the detection operation can be shortened as compared with the case where both are performed separately. That is, the problem of shortening the time required for the detection operation can be solved as compared with the case where both are performed separately.
For example, in the case where S20 and S30 are individually performed, respectively, the height position detecting step (S20) requires 17S, and the edge position detecting step (S30) requires 15S. However, for example, by performing S30 in parallel within 17S of S20, the time required for the detection operation can be reduced to about half as compared with the case where both are performed separately.
After the edge position detecting step (S30), the control unit calculates the center 11d of the outer circumference circle when the workpiece 11 is viewed in plan view, for example, using the (X, Y) coordinates of the detected p2, p5, p7, and p9 (center position calculating step (S40)).
Further, S30 and S40 may be performed while S20 is performed. That is, the timing at which the ejection of the gas and the calculation of the height Z are performed in S20, the timing at which the photographing and the detection of the position coordinates of the plurality of points are performed in S30, and the timing at which the center 11d is calculated in S40 may also partially overlap or entirely overlap.
In S40, Wc1, which is the (X, Y) coordinates of the center (i.e., the outer center) of the circle circumscribed by the triangle p2p5p7, is calculated. For example, Wc1 is calculated by obtaining coordinates of an intersection of a vertical bisector of the straight line p2p5 and a vertical bisector of the straight line p5p 7.
Similarly, Wc2, which is the (X, Y) coordinate of the outer center of the triangle p5p7p9, Wc3, which is the (X, Y) coordinate of the outer center of the triangle p7p9p2, and Wc4, which is the (X, Y) coordinate of the outer center of the triangle p9p2p5, are calculated. Further, for example, the center 11d is an average value of Wc1, Wc2, Wc3 and Wc 4.
However, as shown in fig. 6, the center 11d of the workpiece 11 may be offset from the rotation center 26 of the chuck table 20. Fig. 6 shows a case where a straight line connecting the center 11d and the rotation center 26 is along the X-axis direction, and the offset amount (i.e., the eccentric amount) of the center 11d and the rotation center 26 is represented by an offset amount B.
After S20, S30, and S40, the outer peripheral portion 11c of the workpiece 11 is cut using one of the 1 st cutting unit 50 and the 2 nd cutting unit 60 (outer peripheral portion cutting step (S50)). Fig. 7 is a side view, partially in cross section, of the workpiece 11 and the like for explaining the peripheral portion cutting step (S50).
In the example shown in fig. 7, the outer peripheral portion 11c is cut using the 1 st cutting unit 50. However, the 2 nd cutting means 60 may be used to cut the outer peripheral portion 11 c. In the peripheral portion cutting step (S50), first, the cutting tool 56 is rotated at a predetermined rotation speed (e.g., 30000rpm) with the spindle 54 as a rotation axis.
Then, the lower end of the cutting insert 56 is positioned at a predetermined height lower than the front surface 11a and higher than the rear surface 11b while the cutting insert 56 is rotated. Thereby, the depth of cutting the cutting tool 56 into the outer peripheral portion 11c of the workpiece 11 (i.e., the cutting depth) is adjusted.
Then, the chuck table 20 is moved in the X-axis direction by the X-axis moving mechanism 6, and the cutting tool 56 is caused to cut into the outer peripheral portion 11c at the position P1. Next, the chuck table 20 is rotated in a predetermined direction (for example, clockwise when the chuck table 20 is viewed in plan) around the rotation shaft 24.
However, since the center 11d is offset from the rotation center 26, when the position of the cutting insert 56 is fixed, the width of the removed outer peripheral portion 11c is different in the circumferential direction of the outer peripheral portion 11 c. Therefore, in the outer peripheral portion cutting step (S50), as shown in fig. 8 (a) to 8 (D), the outer peripheral portion 11c is cut while the position of the cutting tool 56 is adjusted in accordance with the offset amount B.
Note that the size of the workpiece 11, the offset amount B, and the like are shown in fig. 8 (a) to 8 (D) in an exaggerated manner as compared with fig. 6. Fig. 8 (a) is a plan view of the workpiece 11 and the like when the rotation angle of the chuck table 20 is 0 degree. Fig. 8 (a) shows a state where the cutting insert 56 is caused to cut into the outer peripheral portion 11c at a position P1.
Next, the chuck table 20 is rotated clockwise at a constant rotational speed in a plan view, for example. At this time, the outer peripheral portion 11c located below the cutting insert 56 moves so as to protrude to one side in the Y-axis direction due to the offset amount B, compared with the case of P1 shown in fig. 8 (a).
Therefore, in order to make the width of the removed outer peripheral portion 11c constant, the cutting tool 56 is moved to one side in the Y-axis direction as the chuck table 20 rotates. Fig. 8 (B) is a plan view of the workpiece 11 and the like when the rotation angle of the chuck table 20 is 90 degrees.
When the chuck table 20 is rotated, the outer peripheral portion 11c located below the cutting tool 56 moves to the same position as the case shown in fig. 8 (a) due to the offset amount B. Therefore, the cutting insert 56 is moved to the other side in the Y-axis direction so that the width of the removed outer peripheral portion 11c is constant. Fig. 8 (C) is a plan view of the workpiece 11 and the like when the rotation angle of the chuck table 20 is 180 degrees.
When the chuck table 20 is rotated, the outer peripheral portion 11c located below the cutting tool 56 moves to the other side in the Y-axis direction than the case shown in fig. 8 (a) due to the offset amount B. Therefore, the cutting insert 56 is moved to the other side in the Y-axis direction so that the width of the removed outer peripheral portion 11c is constant. Fig. 8 (D) is a plan view of the workpiece 11 and the like at a rotation angle of 270 degrees of the chuck table 20.
When the chuck table 20 is rotated, the outer peripheral portion 11c located below the cutting tool 56 moves to one side in the Y-axis direction due to the offset amount B than in the case shown in fig. 8 (a). Therefore, the cutting insert 56 is moved to one side in the Y-axis direction so that the width of the removed outer peripheral portion 11c is constant.
In this way, since the position of the cutting insert 56 is adjusted based on the offset B of the center 11d from the rotation center 26, the outer peripheral portion 11c can be accurately cut by a predetermined width, as compared with a case where the position of the cutting insert 56 is not adjusted.
In the outer peripheral portion cutting step (S50), the chuck table 20 may be moved in the X-axis direction as needed in addition to the Y-axis direction by moving the cutting tool 56 so as to make the width of the removed outer peripheral portion 11c constant.
However, as shown by the curve a (see fig. 5B), the height position of the outer peripheral portion 11c is not constant. Therefore, in the peripheral portion cutting step (S50), the cutting depth of the cutting tool 56 is adjusted so that the cutting depth to the peripheral portion 11c becomes constant as the chuck table 20 rotates. .
That is, in the outer peripheral portion cutting step (S50), the outer peripheral portion 11c is cut while adjusting the position of the cutting tool 56 based on the offset amount B and adjusting the depth of cut based on the height positions of the plurality of portions detected in the height position detecting step (S20).
In the outer peripheral portion cutting step (S50) of the present embodiment, the height of the lower end of the cutting insert 56 is adjusted so that a predetermined depth C is removed from the height shown by the curve a by cutting (see fig. 5B). The height of the outer peripheral portion 11c after the outer peripheral portion cutting step (S50) is shown by a curve D (broken line) in fig. 5B.
In the present embodiment, since the cutting depth of the cutting tool 56 is adjusted in accordance with the height position of the outer peripheral portion 11c, it is possible to suppress variation in cutting depth from the front surface 11a, as compared with a case where the cutting depth is not adjusted. That is, the depth of cut can be made substantially constant as compared with the case where the depth of cut is not adjusted.
Next, embodiment 2 will be explained. Fig. 9 is a flowchart of a method of cutting a workpiece 11 according to embodiment 2. In embodiment 2, first, the holding step (S10) is performed. Then, the edge position detecting step (S30) is performed after the holding step (S10).
In the edge position detection step (S30), as in embodiment 1, for example, it takes 15 seconds to capture four different regions on the edge of the outer peripheral portion 11c of the front surface 11 a. Then, by processing each image, the position coordinates of four points of the edge of the outer peripheral portion 11c (i.e., the (X, Y) coordinates of p2, p5, p7, and p9) are detected.
Thereby, the position of the edge of the outer peripheral portion 11c is detected. After the edge position detecting step (S30), the center position calculating step (S40) calculates the center 11d of the outer circumference circle of the workpiece 11 using the detected (X, Y) coordinates of the four points.
Next, while adjusting the position of the nozzle 68a of the back pressure sensor unit 68 based on the offset amount B between the center 11d and the rotation center 26 detected at S40, the height positions of a plurality of portions of the outer peripheral portion 11c of the front surface 11a are detected (height position detecting step (S45)).
For example, in the height position detection step (S45), the nozzle 68a is positioned directly above the outer peripheral portion 11c of the front surface 11a by adjusting the position of the back pressure sensor unit 68 in the Y-axis direction in accordance with the offset amount B, as in fig. 8 (a) to (D).
In the height position detecting step (S45), for example, it takes 17 seconds to detect the distance from the lower end of the nozzle 68a to the front surface 11a of the workpiece 11 at each of 9 different locations (P1 to P9) on the outer peripheral portion 11c of the front surface 11 a.
In embodiment 2, since the position of the nozzle 68a is adjusted in accordance with the offset amount B, the nozzle 68a can be positioned more accurately on the outer peripheral portion 11c of the front surface 11a than in the case where the position of the nozzle 68a is not adjusted. Therefore, the height of the outer peripheral portion 11c can be detected more accurately. That is, the problem of more accurately detecting the height of the outer peripheral portion 11c can be solved, as compared with the case where the position of the nozzle 68a is not adjusted according to the offset amount B.
After S45, the outer peripheral portion 11c is cut while adjusting the position of the cutting tool 56 based on the offset amount B and adjusting the cutting depth based on the height positions of the plurality of portions detected in S45, as in embodiment 1 (outer peripheral portion cutting step (S50)).
Since the position of the cutting insert 56 is adjusted in accordance with the offset amount B in this way, the outer peripheral portion 11c can be accurately cut by a predetermined width, as compared with a case where the position of the cutting insert 56 is not adjusted.
Further, since the cutting depth of the cutting tool 56 is adjusted according to the height position of the outer peripheral portion 11c, it is possible to suppress variation in cutting depth from the front surface 11a, compared to a case where the cutting depth is not adjusted. That is, the depth of cut can be made substantially constant as compared with the case where the depth of cut is not adjusted.
The structure, method, and the like of the above embodiments can be modified as appropriate without departing from the object of the present invention. For example, the position of the outer peripheral portion 11c of the workpiece 11 may be detected using a laser displacement meter (edge position detection means) 72 instead of the camera unit 58.
Fig. 10 is a side view, partly in cross section, of the workpiece 11 and the like when the edge position detecting step (S30) is performed using the laser displacement meter 72. The laser displacement meter 72 includes a laser beam irradiation unit 72a that emits a laser beam L having a wide width. The laser displacement meter 72 includes a light receiving element (not shown) that receives reflected light from the object irradiated with the laser beam L.
When detecting the position of the edge of the outer peripheral portion 11c of the workpiece 11, first, the holding surface 20c holds the rear surface 11b side of the workpiece 11. Next, the laser beam L having a wide width that crosses the outer peripheral portion 11c in the radial direction of the workpiece 11 is irradiated from the laser beam irradiation unit 72a to the front surface 11a and the holding surface 20 c. Then, the light receiving element receives the reflected light from the workpiece 11.
The distance from the laser beam irradiation unit 72a to the object can be measured by the principle of triangulation, for example. The distance measured is substantially constant in a region of a predetermined length inside the edge of the outer peripheral portion 11 c. For example, the distance from the laser beam irradiation unit 72a to the front face 11a is a substantially constant distance E1.
However, the measured distance gradually becomes larger as approaching the edge of the outer peripheral portion 11 c. Further, when reaching the edge of the outer peripheral portion 11c, the measured distance is substantially constant at a distance E2 larger than the distance E1. The distance E2 is a distance from the laser beam irradiation unit 72a to the holding surface 20 c.
Therefore, the contour of the distance measured in the radial direction of the workpiece 11 is substantially stepped at the position of the edge of the outer peripheral portion 11 c. Since the (X, Y) coordinates of the irradiation laser beam L are determined in advance, the coordinates of one point of the edge of the outer peripheral portion 11c can be detected by determining the (X, Y) coordinates that change from the distance E1 to the distance E2 in the profile of the measured distance. Similarly, for example, if coordinates of three or more points on the edge of the outer peripheral portion 11c are acquired, position coordinates of four points on the edge of the outer peripheral portion 11c can be detected.

Claims (4)

1. A method of cutting a workpiece by using a cutting device for cutting an outer peripheral portion of the workpiece on a front side thereof, the cutting device comprising:
a chuck table for holding the disc-shaped workpiece;
a 1 st cutting unit and a 2 nd cutting unit each having a cutting tool capable of cutting the object held by the chuck table;
an edge position detection unit fixed to the 1 st cutting unit and detecting a position of an edge of the outer peripheral portion of the workpiece; and
a height position detection unit fixed to the 2 nd cutting unit and detecting a height position of the front surface of the workpiece held by the chuck table,
it is characterized in that the preparation method is characterized in that,
the method for cutting the workpiece comprises the following steps:
a holding step of holding the back surface side of the workpiece by the chuck table so as to expose the front surface side of the workpiece;
a height position detection step of detecting height positions of a plurality of portions of the outer peripheral portion of the front surface of the workpiece by using the height position detection means;
an edge position detection step of detecting the position of the edge using the edge position detection means while performing the height position detection step; and
an outer peripheral portion cutting step of cutting the outer peripheral portion of the workpiece while adjusting a position of one of the 1 st cutting unit and the 2 nd cutting unit based on an offset amount of the center of the workpiece calculated based on the position of the edge detected by the edge position detecting step from a rotation center of the chuck table and adjusting a depth of cutting into the workpiece by the one cutting tool based on the height positions of the plurality of portions detected by the height position detecting step.
2. The method of cutting a workpiece according to claim 1,
the edge position detection means is a camera or a laser displacement meter that captures an object with visible light.
3. The method of cutting a workpiece according to claim 1 or 2,
the height position detecting unit is a back pressure sensor.
4. A method of cutting a workpiece by using a cutting device for cutting an outer peripheral portion of the workpiece on a front side thereof, the cutting device comprising:
a chuck table for holding the disc-shaped workpiece;
a 1 st cutting unit and a 2 nd cutting unit each having a cutting tool capable of cutting the object held by the chuck table;
an edge position detection unit fixed to the 1 st cutting unit and detecting a position of an edge of the outer peripheral portion of the workpiece; and
a height position detection unit fixed to the 2 nd cutting unit and detecting a height position of the front surface of the workpiece held by the chuck table,
it is characterized in that the preparation method is characterized in that,
the method for cutting the workpiece comprises the following steps:
a holding step of holding the back surface side of the workpiece by the chuck table so as to expose the front surface side of the workpiece;
an edge position detection step of detecting the position of the edge using the edge position detection unit;
a height position detection step of detecting height positions of a plurality of portions of the outer peripheral portion of the front surface of the workpiece while adjusting a position of the height position detection means based on an offset amount between a center of the workpiece and a rotation center of the chuck table, the offset amount being calculated based on the position of the edge detected by the edge position detection step; and
an outer peripheral portion cutting step of cutting the outer peripheral portion of the workpiece while adjusting a position of one of the cutting tools of the 1 st cutting unit and the 2 nd cutting unit based on the offset amount and adjusting a depth at which the one cutting tool cuts into the workpiece based on the height positions of the plurality of portions detected by the height position detecting step.
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