TWI828831B - Exposure device - Google Patents

Exposure device Download PDF

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Publication number
TWI828831B
TWI828831B TW108147659A TW108147659A TWI828831B TW I828831 B TWI828831 B TW I828831B TW 108147659 A TW108147659 A TW 108147659A TW 108147659 A TW108147659 A TW 108147659A TW I828831 B TWI828831 B TW I828831B
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Taiwan
Prior art keywords
light
lens
light shielding
optical system
exposure
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TW108147659A
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Chinese (zh)
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TW202032287A (en
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吉田亮平
井田真高
吉田大輔
野嶋琢己
松橋佑介
渡辺暢章
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日商尼康股份有限公司
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058Mask illumination systems
    • G03F7/70191Optical correction elements, filters or phase plates for controlling intensity, wavelength, polarisation, phase or the like
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058Mask illumination systems
    • G03F7/70075Homogenization of illumination intensity in the mask plane by using an integrator, e.g. fly's eye lens, facet mirror or glass rod, by using a diffusing optical element or by beam deflection
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216Mask projection systems
    • G03F7/70308Optical correction elements, filters or phase plates for manipulating imaging light, e.g. intensity, wavelength, polarisation, phase or image shift
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70716Stages
    • G03F7/70725Stages control

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

本發明的曝光裝置包括:投影光學系統;照明光學系統,對投影光學系統供給照明光;以及掃描載台,將被曝光基板與投影光學系統於掃描方向相對掃描,且掃描載台使被曝光基板相對於投影光學系統相對掃描,以使由投影光學系統形成的掃描曝光視野重疊多個而對被曝光基板進行曝光,照明光學系統或投影光學系統具有照度變更構件,所述照度變更構件以下述方式而設定,即:於曝光中,與於被曝光基板上重疊地被曝光的重疊部的曝光量相比,於被曝光基板上無重疊地被曝光的非重疊部的曝光量變小。The exposure device of the present invention includes: a projection optical system; an illumination optical system that supplies illumination light to the projection optical system; and a scanning stage that relatively scans the exposed substrate and the projection optical system in the scanning direction, and the scanning stage causes the exposed substrate to The illumination optical system or the projection optical system is scanned relative to the projection optical system to expose the substrate to be exposed by overlapping a plurality of scanning exposure fields formed by the projection optical system. The illumination optical system or the projection optical system has an illuminance changing member, and the illuminance changing member is as follows It is set that during exposure, the exposure amount of the non-overlapping portion exposed without overlapping on the exposed substrate is smaller than the exposure amount of the overlapping portion exposed without overlapping on the exposed substrate.

Description

曝光裝置Exposure device

本發明是有關於一種曝光裝置。 The present invention relates to an exposure device.

作為用於將遮罩(mask)上的圖案(pattern)原版曝光轉印於大型基板的裝置,已知一種將遮罩及基板相對於投影光學系統相對掃描而進行曝光的掃描(scan)型曝光裝置。亦已知一種曝光裝置,所述曝光裝置藉由掃描曝光,而曝光視野於掃描方向(掃描方向)擴大,但為了進一步於與掃描方向交叉的方向(非掃描方向)亦將曝光視野擴大,而使曝光區域於非掃描方向重疊(overlap)而進行多次掃描曝光。 As a device for exposing and transferring a pattern master on a mask to a large substrate, there is known a scanning type exposure in which the mask and the substrate are relatively scanned with respect to a projection optical system and exposed. device. There is also known an exposure device that expands the exposure field of view in the scanning direction (scanning direction) by scanning exposure, but in order to further expand the exposure field of view in the direction crossing the scanning direction (non-scanning direction), and The exposure areas are overlapped in the non-scanning direction to perform multiple scanning exposures.

進而,亦已知一種如下方法,即於非掃描方向並列包括多個投影光學系統,使多個投影光學系統所曝光的一部分曝光視野重疊同時進行曝光,藉此藉由一次掃描而將電子電路曝光轉印於基板上(例如專利文獻1)。 Furthermore, a method is also known in which a plurality of projection optical systems are arranged in parallel in the non-scanning direction, and a part of the exposure field of view exposed by the plurality of projection optical systems is overlapped and exposed simultaneously, thereby exposing electronic circuits in one scan. Transferred to a substrate (for example, Patent Document 1).

[現有技術文獻] [Prior art documents] [專利文獻] [Patent Document]

專利文獻1:日本專利特開2016-54230號公報 Patent Document 1: Japanese Patent Application Publication No. 2016-54230

根據第一態樣,曝光裝置包括:投影光學系統;照明光 學系統,對所述投影光學系統供給照明光;以及掃描載台,將被曝光基板與所述投影光學系統沿掃描方向相對掃描,且所述掃描載台使所述被曝光基板相對於所述投影光學系統相對掃描,以使由所述投影光學系統形成的掃描曝光視野重疊多個而對所述被曝光基板進行曝光,所述照明光學系統或所述投影光學系統具有照度變更構件,所述照度變更構件以下述方式而設定,即:於所述曝光中,與於所述被曝光基板上重疊地被曝光的重疊部的曝光量相比,於所述被曝光基板上無重疊地被曝光的非重疊部的曝光量變小。 According to the first aspect, the exposure device includes: a projection optical system; an illumination light an optical system that supplies illumination light to the projection optical system; and a scanning stage that relatively scans the exposed substrate and the projection optical system along the scanning direction, and the scanning stage makes the exposed substrate relative to the The projection optical system relatively scans to expose the substrate to be exposed by overlapping a plurality of scanning exposure fields formed by the projection optical system, and the illumination optical system or the projection optical system has an illumination changing member, The illumination changing member is set so that, in the exposure, the amount of exposure in the overlapped portion is overlapped and exposed on the exposed substrate, so that the exposed substrate is exposed without overlapping. The exposure of the non-overlapping portion becomes smaller.

1:光源 1:Light source

2:橢圓反射鏡 2: Elliptical reflector

3、5:彎折反射鏡 3, 5: Bending reflector

4、6:中繼透鏡 4, 6: Relay lens

7:光纖 7: Optical fiber

8a~8e:輸入透鏡 8a~8e: Input lens

9a~9e:遮光構件保持部 9a~9e: Light shielding member holding part

9c1:滑件 9c1: Slider

10a~10e:遮光構件(照度變更構件) 10a~10e: Light shielding member (illuminance changing member)

10c1、10c2:遮光構件 10c1, 10c2: light-shielding member

11a~11e:複眼透鏡(光學積分器) 11a~11e: compound eye lens (optical integrator)

12a~12e:聚光透鏡 12a~12e: condenser lens

13、24:移動鏡 13, 24: Moving mirror

14、25:雷射干涉計 14, 25: Laser interferometer

15:遮罩 15: Mask

16:遮罩載台 16: Mask stage

17:遮罩載台平台 17: Mask stage platform

19a、19c、19e、19F:投影光學系統(第一行投影光學系統) 19a, 19c, 19e, 19F: Projection optical system (first row of projection optical system)

19b、19d、19R:投影光學系統(第二行投影光學系統) 19b, 19d, 19R: Projection optical system (second row projection optical system)

20:中間像面 20: Middle image surface

21a~21e:視野光圈 21a~21e: Field of view aperture

21ao~21eo:視野光圈的開口部(開口部) 21ao~21eo: The opening of the field of view aperture (opening)

22:基板(被曝光基板) 22: Substrate (exposed substrate)

23:位置檢測光學系統 23: Position detection optical system

26:照度感測器 26: Illuminance sensor

27:掃描載台(基板載台) 27: Scanning stage (substrate stage)

28:基板載台平台 28: Substrate carrier platform

71:光纖的入射側(入射側) 71: The incident side of the optical fiber (incident side)

72a~72e:光纖的射出側(射出側) 72a~72e: Exit side of optical fiber (exit side)

100:曝光裝置 100:Exposure device

110:透鏡單元 110: Lens unit

E、E2、E3:累計曝光量 E, E2, E3: cumulative exposure

E1:累計曝光量的值 E1: The value of cumulative exposure

EE:實效感光量 EE: effective photosensitivity

EE1、EE2:實效感光量的值 EE1, EE2: the value of the actual photosensitivity

ILa~ILe:照明光學系統 ILa~ILe: illumination optical system

IPIc:區域(曝光視野對應區域) IPIc: area (area corresponding to exposure field of view)

IWs:曝光視野對應區域中的與曝光視野的中心區域相對應的部分的Y方向的寬度(寬度) IWs: Width (width) in the Y direction of the portion corresponding to the center area of the exposure field of view in the exposure field of view corresponding area

IXa~IXe:照明光學系統的光軸(光軸) IXa~IXe: Optical axis (optical axis) of the illumination optical system

MIa~MIe:照明區域 MIa~MIe: lighting area

Oa~Od:部分(重疊部) Oa~Od: part (overlapping part)

PIa~PIe:曝光視野 PIa~PIe: exposure field of view

PIac~PIec:中心區域 PIac~PIec: central area

PIal~PIel:左端區域 PIal~PIel: left end area

PIar~PIer:右端區域 PIar~PIer: right end area

PX:透鏡單元的X方向的排列的節距(節距) PX: The pitch (pitch) of the arrangement of the lens units in the X direction

PXa~PXe:投影光學系統的光軸(光軸) PXa~PXe: Optical axis (optical axis) of the projection optical system

Sa~Se:非重疊部(部分) Sa~Se: non-overlapping part (part)

SIa~SIe:掃描曝光視野 SIa~SIe: scanning exposure field of view

W1、W2:遮光構件的Y方向的寬度(寬度) W1, W2: Width (width) of the light shielding member in the Y direction

Wo:左端區域及右端區域的Y方向的長度(寬度) Wo: The length (width) of the left end area and the right end area in the Y direction

Ws:中心區域的Y方向的長度(寬度) Ws: length (width) of the central area in the Y direction

X、Y、Z:方向 X, Y, Z: direction

圖1是表示第一實施形態的曝光裝置的構成的側視圖。 FIG. 1 is a side view showing the structure of the exposure device according to the first embodiment.

圖2是表示第一實施形態的一部分曝光裝置的立體圖。 FIG. 2 is a perspective view showing part of the exposure device according to the first embodiment.

圖3是將第一實施形態的曝光裝置的自複眼透鏡(fly-eye lens)至遮罩放大地表示的立體圖。 3 is an enlarged perspective view showing the exposure device of the first embodiment from a fly-eye lens to a mask.

圖4是表示第一實施形態的曝光裝置的遮罩上的視野與基板上的視野的關係的圖。圖4的(a1)、圖4的(a2)及圖4的(a3)分別是表示圖1中的投影光學系統19c的遮罩上的視野、投影光學系統內的視野光圈、基板上的視野的圖,圖4的(b1)、圖4的(b2)及圖4的(b3)分別是表示圖1中的投影光學系統19b的遮罩上的視野、投影光學系統內的視野光圈、基板上的視野的圖。 4 is a diagram showing the relationship between the visual field on the mask and the visual field on the substrate of the exposure device according to the first embodiment. Figure 4 (a1), Figure 4 (a2) and Figure 4 (a3) respectively show the field of view on the mask of the projection optical system 19c in Figure 1, the field of view aperture in the projection optical system, and the field of view on the substrate. 4 (b1), (b2) and (b3) respectively show the field of view on the mask of the projection optical system 19b in FIG. 1, the field of view aperture in the projection optical system, and the substrate. A diagram of the field of view.

圖5是表示在第一實施形態的曝光裝置對基板進行掃描曝光 時,照射至基板上的曝光能量(energy)、及感光材料的實效感光量的一例的圖。圖5的(a)是表示各投影光學系統的基板上的曝光視野的圖,圖5的(b)是表示形成於基板22上的曝光區域的圖,圖5的(c)是表示照射至基板上的累計曝光量的一例的圖,圖5的(d)是表示感光材料的實效感光量的一例的圖。 FIG. 5 shows scanning exposure of a substrate using the exposure apparatus according to the first embodiment. This is an example of the exposure energy (energy) irradiated onto the substrate and the effective light exposure amount of the photosensitive material. FIG. 5(a) is a diagram showing the exposure field of view on the substrate of each projection optical system. FIG. 5(b) is a diagram showing the exposure area formed on the substrate 22. FIG. 5(c) is a diagram showing the irradiation area. (d) of FIG. 5 is a graph showing an example of the cumulative exposure amount on the substrate. FIG. 5(d) is a graph showing an example of the effective exposure amount of the photosensitive material.

圖6是自光源側觀察第一實施形態的曝光裝置的複眼透鏡、遮光構件及遮光構件保持部的圖。 6 is a view of a fly-eye lens, a light-shielding member, and a light-shielding member holding portion of the exposure device according to the first embodiment as viewed from the light source side.

圖7是表示在第一實施形態的曝光裝置對基板進行掃描曝光時,照射至基板上的曝光能量、及感光材料的實效感光量的一例的圖。圖7的(a)是表示各投影光學系統的基板上的曝光視野的圖,圖7的(b)是表示照射至基板上的累計曝光量的一例的圖,圖7的(c)是表示感光材料的實效感光量的一例的圖。 7 is a diagram showing an example of the exposure energy irradiated onto the substrate and the effective light exposure amount of the photosensitive material when the exposure apparatus according to the first embodiment performs scanning exposure on the substrate. FIG. 7(a) is a diagram showing the exposure field of view on the substrate of each projection optical system, FIG. 7(b) is a diagram showing an example of the cumulative exposure amount irradiated on the substrate, and FIG. 7(c) is a diagram showing A graph showing an example of the effective light sensitivity of a photosensitive material.

(曝光裝置的第一實施形態) (First embodiment of exposure device)

圖1是表示第一實施形態的曝光裝置100的側視圖。如後述般,曝光裝置100包括五個投影光學系統19a~投影光學系統19e,圖1僅表示其中的兩個即投影光學系統19a、投影光學系統19b。 FIG. 1 is a side view showing the exposure device 100 according to the first embodiment. As will be described later, the exposure device 100 includes five projection optical systems 19a to 19e. FIG. 1 shows only two of them, namely, the projection optical system 19a and the projection optical system 19b.

投影光學系統19a~投影光學系統19e為形成投影倍率(橫倍率)+1倍的正立圖像的光學系統,將描繪於遮罩15的圖案曝光轉印至形成於基板22的上表面的感光材料。 The projection optical systems 19a to 19e are optical systems that form an erect image with a projection magnification (horizontal magnification) + 1 times, and expose and transfer the pattern drawn on the mask 15 to the photosensitive pattern formed on the upper surface of the substrate 22 Material.

基板22藉由基板載台27經由未圖示的基板保持器 (holder)保持。基板載台27藉由未圖示的線性馬達(linear motor)等,於基板載台平台28上沿X方向進行掃描,且可於Y方向移動。基板載台27的X方向的位置藉由雷射(laser)干涉計25經由安裝於基板載台27的移動鏡24的位置而測量。同樣地,基板載台27的Y方向的位置亦藉由未圖示的雷射干涉計而測量。 The substrate 22 passes through a substrate holder (not shown) via the substrate stage 27 (holder) keep. The substrate stage 27 is scanned in the X direction on the substrate stage platform 28 by a linear motor (not shown) and can move in the Y direction. The position of the substrate stage 27 in the X direction is measured by a laser interferometer 25 via the position of the moving mirror 24 attached to the substrate stage 27 . Similarly, the position of the substrate stage 27 in the Y direction is also measured by a laser interferometer (not shown).

位置檢測光學系統23檢測形成於基板22上的對準標記(alignment mark)等既有圖案的位置。 The position detection optical system 23 detects the position of existing patterns such as alignment marks formed on the substrate 22 .

遮罩15藉由遮罩載台16而保持。遮罩載台16藉由未圖示的線性馬達等,於遮罩載台平台17上沿X方向掃描,且可於Y方向移動。遮罩載台16的X方向的位置藉由雷射干涉計14經由安裝於遮罩載台16的移動鏡13的位置而測量。同樣地,遮罩載台16的Y方向的位置亦藉由未圖示的雷射干涉計而測量。 The mask 15 is held by the mask stage 16 . The mask stage 16 is scanned in the X direction on the mask stage platform 17 by a linear motor (not shown) and can move in the Y direction. The X-direction position of the mask stage 16 is measured by the laser interferometer 14 via the position of the moving mirror 13 installed on the mask stage 16 . Similarly, the position of the mask stage 16 in the Y direction is also measured by a laser interferometer (not shown).

未圖示的控制系統基於雷射干涉計14、雷射干涉計25等的測量值,控制未圖示的線性馬達等,從而控制遮罩載台16及基板載台27的XY位置。未圖示的控制系統在遮罩圖案朝基板22的曝光時,使遮罩15與基板22在保持藉由投影光學系統19a~投影光學系統19e形成的成像關係下,相對於投影光學系統19a~投影光學系統19e相對地沿X方向以大致同一速度而掃描。 A control system (not shown) controls a linear motor (not shown) and the like based on the measurement values of the laser interferometer 14 and the laser interferometer 25 to control the XY positions of the mask stage 16 and the substrate stage 27 . When the mask pattern is exposed to the substrate 22, the control system (not shown) causes the mask 15 and the substrate 22 to maintain the imaging relationship formed by the projection optical systems 19a to 19e relative to the projection optical systems 19a to 19e. The projection optical system 19e relatively scans in the X direction at substantially the same speed.

於本說明書中,將在曝光時,基板22被掃描的方向(X方向)亦稱為「掃描方向」。又,將基板22的面內所含的方向且與X方向正交的方向(Y方向)亦稱為「非掃描方向」。Z方向為與X方向及Y方向正交的方向。 In this specification, the direction in which the substrate 22 is scanned (X direction) during exposure is also referred to as the "scanning direction." In addition, the direction included in the plane of the substrate 22 and orthogonal to the X direction (Y direction) is also called a “non-scanning direction”. The Z direction is a direction orthogonal to the X direction and the Y direction.

再者,於圖1及以下的各圖中利用箭頭所示的X方向、Y方向、及Z方向,以所述箭頭所指示的方向為+方向。 In addition, in FIG. 1 and the following figures, the X direction, Y direction, and Z direction are indicated by arrows, and the direction indicated by the arrows is the + direction.

圖2是表示第一實施形態的曝光裝置100的自照明光學系統ILa~照明光學系統ILe的下游部至基板22的部分的立體圖。以下,亦參照圖2繼續進行說明。 FIG. 2 is a perspective view showing a portion from the downstream portion of the illumination optical systems ILa to ILe to the substrate 22 of the exposure apparatus 100 according to the first embodiment. Hereinafter, the description will be continued with reference to FIG. 2 as well.

如圖2所示般,五個投影光學系統19a~投影光學系統19e中的3個投影光學系統19a、投影光學系統19c、投影光學系統19e(以下,亦總稱為或單個地稱為「第一行投影光學系統19F」)於Y方向排列地配置。而且,兩個投影光學系統19b、投影光學系統19d(以下,亦總稱為或單個地稱為「第二行投影光學系統19R」),於Y方向排列,且配置於較第一行投影光學系統19F更靠向+X側。 As shown in FIG. 2 , three of the five projection optical systems 19 a to 19 e , namely the projection optical system 19 a , the projection optical system 19 c , and the projection optical system 19 e (hereinafter, are also collectively referred to as or individually referred to as "first The line projection optical systems 19F") are arranged side by side in the Y direction. Moreover, the two projection optical systems 19b and 19d (hereinafter also collectively or individually referred to as the "second row projection optical system 19R") are arranged in the Y direction and are arranged farther than the first row projection optical system. 19F is closer to the +X side.

第一行投影光學系統19F的各投影光學系統以其光軸於Y方向隔開規定的間隔而配置。第二行投影光學系統19R的各光學系統亦與第一行投影光學系統19F同樣地配置。又,投影光學系統19b以其光軸的Y方向的位置與將投影光學系統19a與投影光學系統19c各自的光軸加以連接而成的直線的大致中心一致的方式配置。又,投影光學系統19d亦與投影光學系統19b同樣地配置。 Each projection optical system of the first row projection optical system 19F is arranged with its optical axis separated by a predetermined interval in the Y direction. Each optical system of the second row projection optical system 19R is also arranged similarly to the first row projection optical system 19F. Moreover, the projection optical system 19b is arranged so that the position of the optical axis in the Y direction coincides with the approximate center of a straight line connecting the optical axes of the projection optical system 19a and the projection optical system 19c. In addition, the projection optical system 19d is also arranged similarly to the projection optical system 19b.

第一實施形態的曝光裝置100與各投影光學系統19a~投影光學系統19e各者相對應,而包括多個照明光學系統ILa~照明光學系統ILe。作為一例,而如圖1所示般,與投影光學系統19a相對應的照明光學系統ILa沿著光軸IXa而包括:輸入透鏡(input lens)8a、複眼透鏡11a、及聚光透鏡(condenser lens)12a。 其他照明光學系統ILb~照明光學系統ILe亦同樣地包含:輸入透鏡8b~輸入透鏡8e、複眼透鏡11b~複眼透鏡11e、及聚光透鏡12b~聚光透鏡12e。再者,如所述般,於圖2中,僅表示各照明光學系統ILa~照明光學系統ILe中的複眼透鏡11a~複眼透鏡11e、及聚光透鏡12a~聚光透鏡12e。 The exposure apparatus 100 of the first embodiment includes a plurality of illumination optical systems ILa to ILe corresponding to each of the projection optical systems 19a to 19e. As an example, as shown in FIG. 1 , the illumination optical system ILa corresponding to the projection optical system 19a includes an input lens 8a, a fly-eye lens 11a, and a condenser lens along the optical axis IXa. )12a. The other illumination optical systems ILb to ILe also include input lenses 8b to 8e, fly eye lenses 11b to fly eye lenses 11e, and condenser lenses 12b to 12e. In addition, as mentioned above, in FIG. 2 , only the fly-eye lenses 11a to 11e and the condenser lenses 12a to 12e in each of the illumination optical systems ILa to ILe are shown.

再者,於側視圖即圖1中,投影光學系統19c~投影光學系統19e因與投影光學系統19a或投影光學系統19b在X方向的位置重合,故未予表示。同樣地,照明光學系統ILc~照明光學系統ILe因與照明光學系統ILa或照明光學系統ILb在X方向的位置重合,故未予表示。 Furthermore, in the side view of FIG. 1 , the projection optical systems 19 c to 19 e are not shown because they coincide with the positions of the projection optical system 19 a or 19 b in the X direction. Similarly, the illumination optical systems ILc to ILe are not shown because they coincide with the positions of the illumination optical system ILa or ILb in the X direction.

自燈(lamp)等光源1供給的照明光經由橢圓反射鏡(mirror)2、彎折反射鏡3、中繼透鏡(relay lens)4、彎折反射鏡5、中繼透鏡6、光纖(optical fiber)7等導光光學系統朝各照明光學系統ILa~照明光學系統ILe供給。光纖7將入射至一個入射側71的照明光分支為大致均等,並朝五個射出側72a~射出側72e射出。自光纖7的五個射出側72a~射出側72e分別射出的照明光朝各照明光學系統ILa~照明光學系統ILe中的輸入透鏡8a~輸入透鏡8e入射。然後,照明光進一步經由複眼透鏡11a~複眼透鏡11e、及聚光透鏡12a~聚光透鏡12e,朝遮罩15上的各照明區域MIa~照明區域MIe照射。 Illumination light supplied from a light source 1 such as a lamp passes through an elliptical mirror 2, a flexural reflector 3, a relay lens 4, a flexural reflector 5, a relay lens 6, and an optical fiber. Light guide optical systems such as fiber)7 are supplied to each of the illumination optical systems ILa to ILe. The optical fiber 7 branches the illumination light incident on one incident side 71 into approximately equal parts, and emits the illumination light toward the five emission sides 72a to 72e. The illumination lights respectively emitted from the five emission sides 72a to 72e of the optical fiber 7 are incident on the input lenses 8a to 8e in the respective illumination optical systems ILa to ILe. Then, the illumination light further passes through the fly-eye lenses 11a to 11e and the condenser lenses 12a to 12e, and is irradiated toward the illumination areas MIa to MIe on the mask 15.

圖3是將照明光學系統ILc所含的複眼透鏡11c、及聚光透鏡12c、以及遮罩15上的照明區域MIc作為一例放大地表示 的立體圖。 FIG. 3 is an enlarged view of the fly-eye lens 11 c and the condenser lens 12 c included in the illumination optical system ILc, and the illumination area MIc on the mask 15 as an example. three-dimensional view.

複眼透鏡11c中,於X方向及Y方向排列地形成有多個透鏡單元(lens element)110,所述透鏡單元110具有與照明區域MIc相似形的於Y方向為長的長方形的剖面形狀(XY面內的形狀)。因包括各透鏡單元110及聚光透鏡12c的光學系統,而各透鏡單元110的入射面(圖3中的上方的面,即+Z側的面)形成針對遮罩15上的照明區域MIc的共軛面。因此,亦為針對基板22上的曝光視野PIc的共軛面。朝各個透鏡單元110的入射面照射的照明光於遮罩15上的照明區域MIc重疊地照射。藉此,照明區域MIc內的照明光的照度被大致均一化。 In the fly-eye lens 11c, a plurality of lens elements 110 are formed in an array in the X direction and the Y direction. The lens elements 110 have a rectangular cross-sectional shape (XY) that is similar to the illumination area Mic and is long in the Y direction. shape within the plane). Due to the optical system including each lens unit 110 and the condenser lens 12c, the incident surface of each lens unit 110 (the upper surface in FIG. 3, that is, the surface on the +Z side) forms an optical system with respect to the illumination area MIc on the mask 15. conjugate surface. Therefore, it is also a conjugate surface with respect to the exposure field of view PIc on the substrate 22 . The illumination light irradiated toward the incident surface of each lens unit 110 is irradiated so as to overlap the illumination area MIc on the mask 15 . Thereby, the illumination intensity of the illumination light in the illumination area MIc is substantially uniform.

除了照明光學系統ILc以外的其他照明光學系統ILa~照明光學系統ILe的構成亦與圖3所示的構成相同。 The configurations of the other illumination optical systems ILa to ILe except for the illumination optical system ILc are also the same as those shown in FIG. 3 .

複眼透鏡11a~複眼透鏡11e為朝各個照明區域MIa~照明區域MIe重疊地照射照明光的光學積分器(optical integrator)的一例。 The fly-eye lenses 11a to 11e are an example of an optical integrator that irradiates illumination light to the illumination areas MIa to MIe in an overlapping manner.

投影光學系統19a~投影光學系統19e各者為了形成正立圖像的圖像,而例如包含二次成像型光學系統。此種情形下,藉由構成各投影光學系統19a~投影光學系統19e的上半部分的光學系統,在位於各投影光學系統19a~投影光學系統19e的光軸PXa~光軸PXe的方向(Z方向)的中間附近的中間像面20,形成遮罩15的圖案的中間像。中間像藉由構成各投影光學系統19a~投影光學系統19e的下半部分的光學系統再次成像,而於基板 22上形成遮罩15的圖案的像。 Each of the projection optical systems 19a to 19e includes, for example, a secondary imaging optical system in order to form an image of an erect image. In this case, by the optical system constituting the upper half of each projection optical system 19a to 19e, in the direction (Z The intermediate image plane 20 near the middle of the direction) forms an intermediate image of the pattern of the mask 15 . The intermediate image is formed again on the substrate by the optical system constituting the lower half of each projection optical system 19a to 19e. An image of the pattern of the mask 15 is formed on 22 .

因中間像面20與基板22共軛,故於各投影光學系統19a~投影光學系統19e內的中間像面20分別配置視野光圈21a~視野光圈21e,藉此可規定基板22上的由各投影光學系統19a~投影光學系統19e所形成的曝光視野PIa~曝光視野PIe。 Since the intermediate image plane 20 is conjugate with the substrate 22, the visual field aperture 21a to the visual field aperture 21e are respectively disposed on the intermediate image plane 20 in each of the projection optical systems 19a to 19e, whereby the projections on the substrate 22 can be specified. The exposure fields PIa to PIe formed by the optical systems 19a to the projection optical systems 19e.

圖4是表示遮罩15上的照明區域MIa~照明區域MIe與視野光圈21a~視野光圈21e、及曝光視野PIa~曝光視野PIe的關係的圖。 FIG. 4 is a diagram showing the relationship between the illumination areas MIa to MIe on the mask 15, the visual field apertures 21a to the visual field apertures 21e, and the exposure visual fields PIa to PIe.

圖4的(a1)是表示與投影光學系統19c對應的遮罩15上的照明區域MIc的圖,照明區域MIc形成與複眼透鏡11c的透鏡單元110的剖面形狀相似的長方形。 FIG. 4(a1) is a diagram showing the illumination area MIc on the mask 15 corresponding to the projection optical system 19c. The illumination area MIc forms a rectangle similar to the cross-sectional shape of the lens unit 110 of the fly-eye lens 11c.

圖4的(a2)是表示投影光學系統19c內的視野光圈21c與照射於視野光圈21c處的照明光MIc2的圖。於視野光圈21c,照射有遮罩15上的照明區域MIc的中間像即利用虛線所示的照明光MIc2。照明光MIc2中的照射至視野光圈21c的遮光部(利用斜線所示的部分)的照明光被視野光圈21c遮光。另一方面,於視野光圈21c的開口部21co透射的照明光藉由構成投影光學系統19c的下半部分的光學系統於基板22上再次成像,而於基板22上形成曝光視野PIc。 (a2) of FIG. 4 is a diagram showing the visual field aperture 21c in the projection optical system 19c and the illumination light MIc2 irradiated at the visual field aperture 21c. The field of view aperture 21c is illuminated with illumination light MIc2, which is an intermediate image of the illumination area MIc on the mask 15 and is shown by a dotted line. Among the illumination light MIc2, the illumination light that irradiates the light-shielding portion (the portion indicated by hatched lines) of the visual field aperture 21c is blocked by the visual field aperture 21c. On the other hand, the illumination light transmitted through the opening 21co of the field of view aperture 21c is re-imaged on the substrate 22 by the optical system constituting the lower half of the projection optical system 19c, and an exposure field of view PIc is formed on the substrate 22.

圖4的(a3)是表示基板22上的曝光視野PIc的圖。 (a3) of FIG. 4 is a diagram showing the exposure field of view PIc on the substrate 22.

作為一例,在投影光學系統19c~投影光學系統19e包含全折射光學系統時,中間像即照明光MIc2為相對於照明區域MIc 的倒立圖像(圖像的X方向及Y方向均反轉,而不是鏡像的圖像),曝光視野PIc形成相對於視野光圈21c的倒立圖像。因此,如圖4的(a2)及圖4的(a3)所示般,視野光圈21c的開口部21co的形狀與曝光視野PIc的形狀與相互繞Z軸旋轉180度的形狀一致。 As an example, when the projection optical systems 19c to 19e include a fully refractive optical system, the intermediate image, that is, the illumination light MIc2 is relative to the illumination area MIc. An inverted image (the X and Y directions of the image are both reversed, rather than a mirrored image), and the exposure field of view PIc forms an inverted image relative to the field of view aperture 21c. Therefore, as shown in FIGS. 4(a2) and 4(a3) , the shape of the opening 21co of the field of view aperture 21c and the shape of the exposure field of view PIc match each other by rotating 180 degrees around the Z axis.

曝光視野PIc作為一例,為與Y方向平行的兩條邊中的短邊位於+X側、長邊位於-X側的梯形。此處,將曝光視野PIc中的由+X側的全部短邊與-X側的一部分長邊所包圍的長方形的區域稱為中心區域PIcc。另一方面,將曝光視野PIc中的不包含於中心區域PIcc的+Y方向的端部稱為左端區域PIcl,將曝光視野PIc中的不包含於中心區域PIcc的-Y方向的端部稱為右端區域PIcr。 As an example, the exposure field of view PIc is a trapezoid in which the short side of the two sides parallel to the Y direction is located on the +X side and the long side is located on the -X side. Here, a rectangular area in the exposure field of view PIc surrounded by all the short sides on the +X side and part of the long sides on the -X side is called a central area PIcc. On the other hand, the end of the exposure field of view PIc in the +Y direction that is not included in the central area PIcc is called a left end area PIcl, and the end of the exposure field of view PIc in the -Y direction that is not included in the central area PIcc is called a left end area PIcl. Right end area PIcr.

將中心區域PIcc的Y方向的長度(寬度)稱為寬度Ws,左端區域PIcl及右端區域PIcr的Y方向的長度(寬度)相等,稱其為寬度Wo。 The length (width) of the center area PIcc in the Y direction is called width Ws, and the lengths (widths) of the left end area PIcl and the right end area PIcr in the Y direction are equal, which is called width Wo.

另一方面,圖4的(b1)~圖4的(b3)分別是表示與投影光學系統19b相對應的遮罩15上的照明區域MIb、視野光圈21b、及曝光視野PIb的圖。如圖4的(b2)所示般,於投影光學系統19b,視野光圈21b的開口部21bo的形狀形成將投影光學系統19c的視野光圈21c的開口部21co的形狀沿X方向反轉的形狀。其結果為,如圖4的(b3)所示般,投影光學系統19b的曝光視野PIb的形狀形成將投影光學系統19c的曝光視野PIc的形狀 沿X方向反轉的形狀。 On the other hand, FIGS. 4(b1) to 4(b3) are diagrams respectively showing the illumination area MIb, the visual field aperture 21b, and the exposure visual field PIb on the mask 15 corresponding to the projection optical system 19b. As shown in FIG. 4(b2) , in the projection optical system 19b, the shape of the opening 21bo of the visual field aperture 21b is a shape in which the shape of the opening 21co of the visual field aperture 21c of the projection optical system 19c is inverted in the X direction. As a result, as shown in (b3) of FIG. 4 , the shape of the exposure field of view PIb of the projection optical system 19b is the shape of the exposure field of view PIc of the projection optical system 19c. A shape that is inverted along the X direction.

與所述的曝光視野PIc同樣地,針對曝光視野PIb,亦將由-X側的全部短邊與+X側的一部分長邊所包圍的長方形的區域稱為中心區域PIbc。將曝光視野PIb中的不包含於中心區域PIbc的+Y方向的端部稱為左端區域PIbl,將曝光視野PIb中的不包含於中心區域PIbc的-Y方向的端部稱為右端區域PIbr。 Like the exposure field of view PIc described above, in the exposure field of view PIb, a rectangular area surrounded by all the short sides on the -X side and part of the long sides on the +X side is also called the central area PIbc. The end of the exposure field of view PIb in the +Y direction that is not included in the central area PIbc is called the left end area PIbl, and the end of the exposure field of view PIb in the -Y direction that is not included in the central area PIbc is called the right end area PIbr.

圖5的(a)是表示五個投影光學系統19a~投影光學系統19e在基板22上的各曝光視野PIa~曝光視野PIe的圖。第一行投影光學系統19F即投影光學系統19a、投影光學系統19e的曝光視野PIa、曝光視野PIe與所述的投影光學系統19c的曝光視野PIc同樣地,為與Y方向平行的兩條邊中的短邊位於+X側、長邊位於-X側的梯形。另一方面,第二行投影光學系統19R即投影光學系統19d的曝光視野PId與所述的投影光學系統19b的曝光視野PIb同樣地,為與Y方向平行的兩條邊中的短邊位於-X側、長邊位於+X側的梯形。 (a) of FIG. 5 is a diagram showing the respective exposure fields PIa to PIe of the five projection optical systems 19a to 19e on the substrate 22. The exposure fields PIa and PIe of the first row projection optical system 19F, that is, the projection optical systems 19a and 19e, are the two sides parallel to the Y direction, similarly to the exposure field PIc of the projection optical system 19c. A trapezoid with the short side on the +X side and the long side on the -X side. On the other hand, the exposure field of view PId of the second row projection optical system 19R, that is, the projection optical system 19d, is such that the short side of the two sides parallel to the Y direction is located at -X, similarly to the exposure field of view PIb of the projection optical system 19b. A trapezoid with the side and long side on the +X side.

針對投影光學系統19a、投影光學系統19d、投影光學系統19e的曝光視野PIa、曝光視野PId、曝光視野PIe,亦與所述的曝光視野PIb、曝光視野PIc同樣地,可定義中心區域PIac、中心區域PIdc、中心區域PIec、及左端區域PIal、左端區域PIdl、左端區域PIel、右端區域PIar、右端區域PIdr、右端區域PIer。然而,配置於-Y方向的端部的曝光視野PIa,因藉由視野光圈21a以其-Y方向的端部與X方向平行的方式將照明光予以遮光,故不 存在右端區域PIar。又,配置於+Y方向的端部的曝光視野PIe,因藉由視野光圈21e以其+Y方向的端部與X方向平行的方式將照明光予以遮光,故不存在左端區域PIel。再者,可將視野光圈21a與視野光圈21e的形狀設為與視野光圈21c的形狀不同,亦可使用其他構件,以於曝光視野PIa中不存在右端區域PIar的方式將照明光予以遮光。 For the exposure fields PIa, PId, and PIe of the projection optical systems 19a, 19d, and 19e, similarly to the exposure fields PIb and PIc described above, the center area PIac, the center area PIac, and the center area PIac can be defined. The area PIdc, the center area PIec, the left end area PIal, the left end area PIdl, the left end area PIel, the right end area PIar, the right end area PIdr, and the right end area PIer. However, the exposure field of view PIa arranged at the end in the -Y direction blocks the illumination light by the field of view aperture 21a so that the end in the -Y direction is parallel to the X direction, so it is not There is a right end area PIar. In addition, since the exposure field PIe arranged at the end in the +Y direction blocks the illumination light by the field of view aperture 21e so that the end in the +Y direction is parallel to the X direction, there is no left end area PIel. Furthermore, the shapes of the visual field aperture 21a and the visual field aperture 21e may be different from the shape of the visual field aperture 21c, or other members may be used to block the illumination light so that there is no right end area PIar in the exposure field of view PIa.

各曝光視野PIa~曝光視野PIe的各中心區域PIac~中心區域PIec的Y方向的長度均與寬度Ws相等,左端區域PIal~左端區域PIdl及右端區域PIbr~右端區域PIer的長度均與寬度Wo相等。而且,於曝光視野PIa~曝光視野PIe中於Y方向相鄰的兩個曝光視野中,相鄰的左端區域PIal~左端區域PIdl與右端區域PIbr~右端區域PIer的Y方向的位置為一致。 The Y-direction length of each center area PIac~PIec of each exposure field of view PIa~PIe is equal to the width Ws. The lengths of the left end area PIal~left end area PIdl and the right end area PIbr~right end area PIer are all equal to the width Wo. . Moreover, among the two exposure fields of view PIa to PIe that are adjacent in the Y direction, the positions of the adjacent left end areas PIal to PIdl and the right end areas PIbr to PIer in the Y direction are consistent.

藉由設定投影光學系統19a~投影光學系統19e的配置位置、及視野光圈21a~視野光圈21e的開口部21ao~開口部21eo的形狀及位置而進行各曝光視野PIa~曝光視野PIe的此種形狀及位置的設定。 This shape of each exposure field of view PIa to exposure field of view PIe is achieved by setting the arrangement positions of the projection optical systems 19a to 19e and the shapes and positions of the openings 21ao to 21eo of the visual field apertures 21a to 21e. and location settings.

圖5的(b)是表示當基板22藉由基板載台沿X方向被掃描,且被圖5的(a)所示的曝光視野PIa~曝光視野PIe曝光時,形成於基板22上的曝光區域的圖。於基板22上,形成有藉由掃描曝光而被各曝光視野PIa~曝光視野PIe曝光的掃描曝光視野SIa~掃描曝光視野SIe。於圖5的(b)中,利用兩點鏈線表示第一行投影光學系統19a、第一行投影光學系統19c、第一行投影 光學系統19e所形成的掃描曝光視野SIa、掃描曝光視野SIc、掃描曝光視野SIe,利用一點鏈線表示第二行投影光學系統19b、第二行投影光學系統19d所形成的掃描曝光視野SIb、掃描曝光視野SId。 (b) of FIG. 5 shows the exposure formed on the substrate 22 when the substrate 22 is scanned in the X direction by the substrate stage and exposed by the exposure field of view PIa to the exposure field of view PIe shown in (a) of FIG. 5 . Area map. The scanning exposure field SIa to the scanning exposure field SIe exposed by the respective exposure fields PIa to PIe by scanning exposure are formed on the substrate 22 . In FIG. 5(b) , the first row projection optical system 19a, the first row projection optical system 19c, and the first row projection optical system 19a are represented by a two-dot chain line. The scanning exposure field of view SIa, the scanning exposure field of view SIc, and the scanning exposure field of view SIe formed by the optical system 19e are represented by a dotted chain line, and the scanning exposure field of view SIb and the scanning field formed by the second row projection optical system 19b and 19d are represented by a dotted chain line. Exposure field SId.

該些掃描曝光視野SIa~掃描曝光視野SIe為曝光視野PIa~曝光視野PIe藉由朝X方向的掃描曝光而於X方向上延長者。各掃描曝光視野SIa~掃描曝光視野SIe的Y方向(非掃描方向)的端部與各自相鄰的其他掃描曝光視野SIa~掃描曝光視野SIe的非掃描方向的端部重疊。例如,由左端區域PIal形成的曝光區域與由右端區域PIbr形成的曝光區域一致。因於其他曝光區域中亦相同,故省略說明。 The scanning exposure fields SIa to SIe are the exposure fields PIa to PIe that are extended in the X direction by scanning exposure in the X direction. The Y-direction (non-scanning direction) end portions of each scanning exposure field SIa to SIe overlap with the non-scanning direction end portions of other adjacent scanning exposure fields SIa to SIe. For example, the exposure area formed by the left end area PIal coincides with the exposure area formed by the right end area PIbr. Since the same applies to other exposure areas, description is omitted.

圖5的(c)是表示藉由朝X方向的掃描曝光而於基板22上被曝光的累計曝光量E的圖表。圖表的縱軸為累計曝光量,橫軸為Y方向的座標。如圖5的(a)所示般,因於Y方向的各微小區間將各曝光視野PIa~曝光視野PIe於X方向累計的值相等,且藉由複眼透鏡11的作用等而各曝光視野PIa~曝光視野PIe內的照度均一,故基板22上的累計曝光量E為固定的值E1。 (c) of FIG. 5 is a graph showing the cumulative exposure amount E exposed on the substrate 22 by scanning exposure in the X direction. The vertical axis of the chart is the cumulative exposure, and the horizontal axis is the coordinate in the Y direction. As shown in (a) of FIG. 5 , since the cumulative values of the exposure fields PIa to PIe in the X direction are equal in each minute interval in the Y direction, and the exposure field PIa is affected by the action of the fly-eye lens 11 or the like. ~The illumination within the exposure field of view PIe is uniform, so the cumulative exposure amount E on the substrate 22 is a fixed value E1.

即,Y方向中的被各掃描曝光視野SIa~掃描曝光視野SIe的一個曝光的部分(以下亦稱為「非重疊部」)Sa~部分Se中的累計曝光量E、與被各掃描曝光視野SIa~掃描曝光視野SIe的兩個重疊地曝光的部分(以下亦稱為「重疊部」)Oa~部分Od的累計曝光量E,均為累計曝光量E的值為E1而相等。 That is, the cumulative exposure amount E in the portion Sa to Se exposed by one of the scanning exposure fields SIa to the scanning exposure field SIe in the Y direction (hereinafter also referred to as a "non-overlapping portion"), and the cumulative exposure amount E in each scanning exposure field of view SIe The cumulative exposure amounts E of the two overlapped and exposed portions Oa to Od of the scanning exposure fields SIe (hereinafter also referred to as "overlapping portions") are equal to each other because the value of the cumulative exposure amounts E is E1.

於電子元件(device)等的製造步驟中所使用的光阻劑(photoresist)等感光材料中,實效性感光量(以下,亦稱為「實效感光量」)與累計曝光量成正比。即,若累計曝光量相同,則即便於時間上連續地進行所述曝光的情形下,抑或於時間上分隔為多段而進行所述曝光的情形下,感光材料的實效感光量不變。 In photosensitive materials such as photoresists used in the manufacturing steps of electronic devices, the effective sensitive light amount (hereinafter also referred to as "effective light sensitive amount") is directly proportional to the cumulative exposure amount. That is, if the cumulative exposure amount is the same, the effective light exposure amount of the photosensitive material does not change even if the exposure is performed continuously in time or when the exposure is performed in multiple stages in time.

因此,對感光材料的實效感光量亦成為固定值。 Therefore, the effective amount of light exposure to the photosensitive material also becomes a fixed value.

然而,於一部分感光材料中,於時間上連續地進行曝光的情形,與於時間上分割為多段而進行曝光的情形下,即便累計曝光量相同,感光材料的實效感光量亦變化。具體而言,於時間上分割為多段而進行曝光的情形下,與於時間上連續地進行曝光的情形下相比,實效感光量降低。 However, when a part of a photosensitive material is exposed continuously in time, and when the exposure is divided into multiple stages in time, even if the cumulative exposure amount is the same, the effective light exposure amount of the photosensitive material changes. Specifically, when exposure is performed by dividing the exposure time into a plurality of steps, the effective light exposure amount is lower than when the exposure time is continuously performed.

圖5的(d)是表示針對如此的一部分感光材料(以下,亦稱為「非加算性感光材料」),使用圖5的(a)所示的曝光視野PIa~曝光視野PIe於X方向進行掃描曝光時的非加算性感光材料的實效感光量EE的圖表。 FIG. 5(d) shows that for such a part of the photosensitive material (hereinafter also referred to as "non-additive photosensitive material"), the exposure field of view PIa to the exposure field of view PIe shown in FIG. 5(a) are used in the X direction. A chart of the effective exposure EE of non-additive photosensitive materials during scanning exposure.

被各掃描曝光視野SIa~掃描曝光視野SIe的兩個重疊地曝光的重疊部Oa~重疊部Od,首先被第一行投影光學系統19a、第一行投影光學系統19c、第一行投影光學系統19e曝光,其後被第二行投影光學系統19b、第二行投影光學系統19d曝光,故曝光於時間上分割地進行。換言之,重疊部Oa~重疊部Od於時間上離散地被進行曝光。因此,相對於被各掃描曝光視野SIa~掃描曝光視野SIe的一個於時間上不被分割地被曝光的非重疊部Sa~非重疊 部Se的實效感光量EE,重疊部Oa~重疊部Od的實效感光量EE降低。具體而言,相對於非重疊部Sa~非重疊部Se的實效感光量EE的值為EE1,而重疊部Oa~重疊部Od的實效感光量EE的值小於EE1。 The overlapping portions Oa to Od that are overlappingly exposed by the two scanning exposure fields SIa to the scanning exposure fields SIe are first exposed by the first row projection optical system 19a, the first row projection optical system 19c, and the first row projection optical system. 19e is exposed, and is subsequently exposed by the second row projection optical system 19b and the second row projection optical system 19d, so the exposure is performed in a time-divided manner. In other words, the overlapping portions Oa to Od are exposed discretely in time. Therefore, with respect to the non-overlapping portions Sa to non-overlapping portions Sa to which each scanning exposure field of view SIa to scanning exposure field of view SIe are exposed without being divided in time, The effective light sensitivity EE of the portion Se and the effective light sensitivity EE of the overlapping portions Oa to Od decrease. Specifically, the value of the effective photoreceptor amount EE of the non-overlapping portions Sa to Se is EE1, while the value of the effective photoreceptor amount EE of the overlapping portions Oa to Od is smaller than EE1.

其結果為,於使用非加算性感光材料進行圖案的曝光轉印的情形下,於重疊部Oa~重疊部Od與非重疊部Sa~非重疊部Se,因實效感光量EE不同,故被轉印的圖案的線寬或厚度變化。 As a result, when a non-additive photosensitive material is used for exposure transfer of a pattern, the actual light exposure amount EE is different in the overlapping portion Oa to the overlapping portion Od and the non-overlapping portion Sa to the non-overlapping portion Se. Variations in line width or thickness of printed patterns.

因此,於第一實施形態的曝光裝置100中,於照明光學系統ILa~照明光學系統ILe各自的複眼透鏡11a~複眼透鏡11e的入射面側,即輸入透鏡8a~輸入透鏡8e與複眼透鏡11a~複眼透鏡11e間的位置且複眼透鏡11a~複眼透鏡11e的入射面的附近,設置遮光構件10a~遮光構件10e。而且,遮光構件10a~遮光構件10e藉由遮光構件保持部9a~遮光構件保持部9e,於與各自的照明光學系統ILa~照明光學系統ILe的光軸IXa~光軸IXe大致正交的方向即X方向移動自如地被保持。 Therefore, in the exposure device 100 of the first embodiment, on the incident surface side of the fly-eye lenses 11a to 11e of the illumination optical systems ILa to ILe, respectively, that is, the input lenses 8a to 8e and the fly-eye lenses 11a to Light-shielding members 10a to 10e are provided at positions between the fly-eye lenses 11e and in the vicinity of the incident surfaces of the fly-eye lenses 11a to 11e. Furthermore, the light-shielding members 10a to 10e are arranged in directions substantially orthogonal to the optical axes IXa to IXe of the respective illumination optical systems ILa to ILe via the light-shielding member holding portions 9a to 9e, that is, Free movement in the X direction is maintained.

圖6是自輸入透鏡8c側觀察設置於照明光學系統ILc的複眼透鏡11c、遮光構件10c、及遮光構件保持部9c的圖。以下,參照圖6,對於設置於照明光學系統ILc的遮光構件10c、及遮光構件保持部9c進行說明,但對於設置於其他照明光學系統ILa~照明光學系統ILe的遮光構件10a~遮光構件10e、及遮光構件保持部9a~遮光構件保持部9e亦為同樣。 FIG. 6 is a view of the fly-eye lens 11c, the light-shielding member 10c, and the light-shielding member holding portion 9c provided in the illumination optical system ILc as viewed from the input lens 8c side. Hereinafter, the light shielding member 10c and the light shielding member holding portion 9c provided in the illumination optical system ILc will be described with reference to FIG. 6 . However, the light shielding members 10a to 10e provided in the other illumination optical systems ILa to ILe, The same applies to the light-shielding member holding portion 9a to the light-shielding member holding portion 9e.

複眼透鏡11c於Y方向排列多個透鏡區塊(lens block), 所述透鏡區塊於X方向排列多個剖面於Y方向為長的長方形的透鏡單元110。因各透鏡單元110相對於形成於基板22上的曝光視野PIc為共軛面,故於圖6中,於各透鏡單元110中,利用虛線表示與曝光視野PIc相對應的區域(曝光視野對應區域)IPIc。曝光視野對應區域IPIc中的與曝光視野PIc的中心區域PIcc相對應的部分的Y方向的寬度為寬度IWs。 The fly-eye lens 11c has a plurality of lens blocks arranged in the Y direction. The lens block has a plurality of rectangular lens units 110 arranged in the X direction and having a long cross-section in the Y direction. Since each lens unit 110 is a conjugate surface with respect to the exposure field of view PIc formed on the substrate 22, in FIG. 6, in each lens unit 110, a dotted line indicates an area corresponding to the exposure field of view PIc (exposure field of view corresponding area) )IPIc. The width in the Y direction of the portion of the exposure field of view corresponding region IPIc corresponding to the center area PIcc of the exposure field of view PIc is the width IWs.

構成遮光構件10c的兩個遮光構件10c1、遮光構件10c2相對於所述的透鏡區塊中的兩個,配置於配置在所述透鏡區塊的-X方向側的一個以上的透鏡單元110的+Z側的附近。遮光構件10c1、遮光構件10c2的Y方向的寬度W1、寬度W2與所述的寬度IWs大致相等。 The two light-shielding members 10c1 and 10c2 constituting the light-shielding member 10c are arranged on the + of one or more lens units 110 arranged on the -X direction side of the lens block with respect to two of the lens blocks. Near the Z side. The width W1 and the width W2 of the light shielding member 10c1 and the light shielding member 10c2 in the Y direction are substantially equal to the width IWs described above.

遮光構件10c1、遮光構件10c2保持於遮光構件保持部9c的一部分即滑件(slider)9c1,滑件9c1相對於遮光構件保持部9c的本體,藉由未圖示的控制系統於X方向移動自如。滑件9c1與遮光構件保持部9c的本體的相對位置關係藉由編碼器(encoder)等而測量。 The light-shielding members 10c1 and 10c2 are held by a slider 9c1 which is a part of the light-shielding member holding part 9c. The slider 9c1 is freely movable in the X direction with respect to the body of the light-shielding member holding part 9c by a control system not shown. . The relative positional relationship between the slider 9c1 and the main body of the light-shielding member holding part 9c is measured by an encoder or the like.

遮光構件保持部9c使遮光構件10cl、遮光構件10c2於X方向移動,藉此利用遮光構件10c1、遮光構件10c2將一部分透鏡單元110遮光。如前文所述般,因遮光構件10c1、遮光構件10c2的Y方向的寬度W1、寬度W2與所述的寬度IWs大致相等,故遮光構件10c1、遮光構件10c2可將自一部分透鏡單元110朝基板22上的曝光視野PIc中的中心區域PIcc照射的光予以遮光。進而, 控制滑件9c1,藉此可變更被遮光構件10c1、遮光構件10c2遮光的透鏡單元110的數目、及一個透鏡單元110內的被遮光的部分的比率。藉此,可使曝光視野PIc中的中心區域PIcc的照度相對於左端區域PIcl及右端區域PIcr的照度而大致連續可變地降低。 The light-shielding member holding part 9c moves the light-shielding members 10c1 and 10c2 in the X direction, thereby blocking part of the lens unit 110 from light by the light-shielding members 10c1 and 10c2. As mentioned above, since the widths W1 and W2 of the light-shielding members 10c1 and 10c2 in the Y direction are substantially equal to the width IWs, the light-shielding members 10c1 and 10c2 can be directed from a portion of the lens unit 110 toward the substrate 22 The light irradiated by the central area PIcc in the exposure field of view PIc is blocked. Furthermore, By controlling the slider 9c1, the number of lens units 110 blocked by the light shielding member 10c1 and the light shielding member 10c2, and the ratio of the light blocked portion in one lens unit 110 can be changed. Thereby, the illuminance of the central area PIcc in the exposure field of view PIc can be substantially continuously and variably reduced relative to the illuminance of the left end area PIcl and the right end area PIcr.

因此,可將遮光構件10c解釋為使朝基板22上的非重疊部的累計曝光量相對於朝重疊部的累計曝光量而減小的照度變更構件。 Therefore, the light shielding member 10 c can be interpreted as an illuminance changing member that reduces the cumulative exposure amount toward the non-overlapping portion on the substrate 22 relative to the cumulative exposure amount toward the overlapping portion.

遮光構件10c既可為金屬製薄板,亦可為於透明的玻璃板上藉由遮光構件而形成的遮光膜。遮光構件10c並不限於如濾光器般將照明光完全地遮光者,只要為僅使一部分照明光遮光、透射的構件即可。即遮光構件10c只要為用於變更照度的照度變更構件即可。 The light-shielding member 10c may be a metal thin plate or a light-shielding film formed by a light-shielding member on a transparent glass plate. The light-shielding member 10c is not limited to one that completely blocks the illumination light like a filter, but may be a member that blocks and transmits only a part of the illumination light. That is, the light shielding member 10c only needs to be an illumination changing member for changing the illumination.

針對其他照明光學系統ILa~照明光學系統ILe所包括的遮光構件10a~遮光構件10e、及遮光構件保持部9a~遮光構件保持部9e,亦與所述的遮光構件10c及遮光構件保持部9c的構造相同。 The light-shielding members 10a to 10e and the light-shielding member holding portions 9a to 9e included in other illumination optical systems ILa to ILe are also different from the light-shielding member 10c and the light-shielding member holding portion 9c. The construction is the same.

圖7是說明於包括遮光構件10a~遮光構件10e的第一實施形態的曝光裝置100中,使用非加算性感光材料進行圖案的曝光轉印的情形的結果的圖。圖7的(a)與圖5的(a)同樣地,表示基板22上的各曝光視野PIa~曝光視野PIe。圖7的(b)與圖5的(c)同樣地,是表示藉由朝X方向的掃描曝光而於基板22上曝光的累計曝光量E的圖表。 7 is a diagram illustrating the results of exposure transfer of a pattern using a non-additive photosensitive material in the exposure apparatus 100 of the first embodiment including the light-shielding members 10a to 10e. FIG. 7(a) shows each exposure field of view PIa to exposure field of view PIe on the substrate 22, similarly to FIG. 5(a). Like FIG. 5(c) , FIG. 7( b ) is a graph showing the cumulative exposure amount E exposed on the substrate 22 by scanning exposure in the X direction.

於圖7的(b)所示的情形下,遮光構件10a~遮光構件10e 藉由遮光構件保持部9a~遮光構件保持部9e而插入複眼透鏡11a~複眼透鏡11e的入射面內。因此,與被各掃描曝光視野SIa~掃描曝光視野SIe的兩個重疊地曝光的重疊部Oa~重疊部Od的累計曝光量E3相比較,被各掃描曝光視野SIa~掃描曝光視野SIe的一個曝光的非重疊部Sa~非重疊部Se的累計曝光量E2少。 In the case shown in (b) of FIG. 7 , the light shielding members 10a to 10e The light-shielding member holding portions 9a to 9e are inserted into the incident planes of the fly-eye lenses 11a to 11e. Therefore, compared with the cumulative exposure amount E3 of the overlapping portion Oa to the overlapping portion Od that is overlapped and exposed by two of the scanning exposure fields SIa to SIe, The cumulative exposure amount E2 of the non-overlapping portions Sa to Se is small.

圖7的(c)是表示藉由圖7的(b)所示的累計曝光量,而於所述的非加算性感光材料產生的實效感光量EE的圖表。將於時間上不被分割而被曝光的非重疊部Sa~非重疊部Se的累計曝光量E2,與於時間上被分割而被曝光的重疊部Oa~重疊部Od的累計曝光量E3相比降低,藉此可抵消非加算性感光材料的特性,從而將實效感光量EE設為大致固定的值EE2。 FIG. 7(c) is a graph showing the effective photosensitive amount EE produced by the non-additive photosensitive material based on the cumulative exposure shown in FIG. 7(b). The cumulative exposure amount E2 of the non-overlapping portions Sa to Se that are exposed without being divided in time is compared with the cumulative exposure amount E3 of the overlapping portions Oa to Od that are exposed in time and are divided in time. By reducing, the characteristics of the non-additive photosensitive material can be offset, thereby setting the effective photosensitive amount EE to a roughly fixed value EE2.

藉此,即便在使用非加算性感光材料進行圖案的曝光轉印的情形下,亦可防止於各掃描曝光視野SIa~掃描曝光視野SIe重疊的重疊部Oa~重疊部Od、與非重疊部Sa~非重疊部Se部間的被轉印的圖案的線寬或厚度的變化。 Thereby, even when a non-additive photosensitive material is used for exposure transfer of a pattern, it is possible to prevent the overlapping portions Oa to Od from overlapping the scanning exposure fields SIa to the scanning exposure fields SIe, and the non-overlapping portions Sa. ~Changes in line width or thickness of the transferred pattern between non-overlapping portions Se.

由於遮光構件10c配置於Z方向上自複眼透鏡11c的入射面僅離開規定距離的位置,故於複眼透鏡11c的入射面,遮光構件10c的XY方向的邊緣(edge)模糊地被投影。換言之,只要將遮光構件10c自複眼透鏡11c的入射面於Z方向離開多遠配置則為合適,可基於決定基板22上的遮光構件10c的邊緣的半影模糊的量的參數(parameter)、即複眼透鏡11c的入射面與基板22與的橫倍率、及複眼透鏡11c的入射面內的照明光的開口數而決 定。進而,亦可加入基板22上的重疊部Oa~重疊部Od的Y方向的寬度而決定。再者,遮光構件保持部9a~遮光構件保持部9e亦可具有下述構成,即:可變更遮光構件10a~遮光構件10e的相對於複眼透鏡11a~複眼透鏡11e的入射面的Z方向的位置,即可變更Z方向的遮光構件10a~遮光構件10e與複眼透鏡11a~複眼透鏡11e的距離。 Since the light-shielding member 10c is disposed at a predetermined distance away from the incident surface of the fly-eye lens 11c in the Z direction, the XY-direction edges of the light-shielding member 10c are blurredly projected on the incident surface of the fly-eye lens 11c. In other words, how far away from the incident surface of the fly-eye lens 11 c in the Z direction the light shielding member 10 c is appropriately arranged can be based on a parameter that determines the amount of penumbral blur at the edge of the light shielding member 10 c on the substrate 22 , that is, The horizontal magnification between the incident surface of the fly-eye lens 11c and the substrate 22 is determined by the number of openings of the illumination light in the incident surface of the fly-eye lens 11c. Certainly. Furthermore, it can also be determined by adding the width of the overlapping portion Oa to the overlapping portion Od on the substrate 22 in the Y direction. Furthermore, the light-shielding member holding portion 9a to the light-shielding member holding portion 9e may have a structure in which the Z-direction positions of the light-shielding members 10a to 10e with respect to the incident surfaces of the fly-eye lenses 11a to 11e can be changed. , that is, the distance between the light-shielding members 10a to 10e and the fly-eye lenses 11a to 11e in the Z direction can be changed.

作為一例,於將重疊部Oa~重疊部Od的Y方向的寬度設為DW,將基板22相對於複眼透鏡11c的入射面的橫倍率設為β,將複眼透鏡11c的入射面內的照明光的開口數設為NA時,遮光構件10c的距複眼透鏡11c的入射面的Z方向的距離D可設為0≦D≦1.2×DW/(β.NA)…(1)。 As an example, let the width of the overlapping portion Oa to the overlapping portion Od in the Y direction be DW, let the lateral magnification of the substrate 22 with respect to the incident surface of the fly-eye lens 11 c be β, and let the illumination light in the incident surface of the fly-eye lens 11 c be When the number of openings is NA, the distance D in the Z direction from the light-shielding member 10c to the incident surface of the fly-eye lens 11c can be set to 0≦D≦1.2×DW/(β·NA)…(1).

於距離D滿足式(1)的情形下,可進一步降低由遮光構件10c的邊緣所致的基板22上的曝光量變化(曝光量不均)的影響,且可防止重疊部Oa~重疊部Od的累計曝光量過於降低。 When the distance D satisfies the equation (1), the influence of the exposure change (uneven exposure) on the substrate 22 caused by the edge of the light shielding member 10c can be further reduced, and the overlapping portion Oa to the overlapping portion Od can be prevented. The cumulative exposure is too low.

再者,非加算性感光材料針對在時間上分割地進行曝光的實效感光量與累計曝光量的關係,因各種非加算性感光材料而不同。因此,可在對特定的非加算性感光材料進行實際的曝光之前,例如,在將遮光構件10c的插入量(X方向的位置)設定為不同的數個階段的多種條件下試曝光,即變更藉由遮光構件10c遮光的透鏡單元110的數目而進行試曝光,根據其結果而決定最佳的插入量。 Furthermore, the relationship between the effective photosensitive amount and the cumulative exposure amount for the time-divided exposure of the non-additive photosensitive material differs among various non-additive photosensitive materials. Therefore, before actual exposure of a specific non-additive photosensitive material, for example, trial exposure can be carried out under various conditions in which the insertion amount (position in the X direction) of the light shielding member 10c is set to several different stages, that is, changed. A trial exposure is performed based on the number of lens units 110 that are blocked by the light shielding member 10c, and the optimal insertion amount is determined based on the results.

又,在決定遮光構件10c的插入量時,可使用設置於基板載 台27上的照度感測器26,一面測量曝光視野PIc內的中心區域PIcc的照度一面進行決定。 In addition, when determining the insertion amount of the light shielding member 10c, it is possible to use the The illumination sensor 26 on the stage 27 determines the illumination while measuring the illumination of the central area PIcc within the exposure field of view PIc.

再者,構成圖6所示的遮光構件10c的兩個遮光構件10c1、遮光構件10c2各自的+X方向的端部,分別僅偏移複眼透鏡11c的透鏡單元110的X方向的排列的節距PX的一半。如所述般,於各透鏡單元110中,存在與曝光視野PIc對應的曝光視野對應區域IPIc,但曝光視野對應區域IPIc並非遍至透鏡單元110的X方向的整個面地擴展。即,透鏡單元110的X方向的兩端部不與基板22上的曝光視野PIc對應,而為投影至投影光學系統19c內的視野光圈21c上並被視野光圈21c遮光的部分。 Furthermore, the +X-direction ends of the two light-shielding members 10c1 and 10c2 constituting the light-shielding member 10c shown in FIG. 6 are respectively shifted by only the pitch of the X-direction arrangement of the lens units 110 of the fly-eye lens 11c. Half of PX. As described above, each lens unit 110 has the exposure field corresponding area IPIc corresponding to the exposure field of view PIc. However, the exposure field corresponding area IPIc does not extend over the entire surface of the lens unit 110 in the X direction. That is, both end portions of the lens unit 110 in the X direction do not correspond to the exposure field of view PIc on the substrate 22 but are projected onto the field of view aperture 21c in the projection optical system 19c and are blocked by the field of view aperture 21c.

因此,於遮光構件10c1、遮光構件10c2的+X方向的端部位於透鏡單元110的X方向的兩端部的附近的情形下,即便將遮光構件10c1、遮光構件10c2沿X方向移動,亦無法變更基板22上的累計曝光量。 Therefore, when the +X-direction ends of the light-shielding members 10c1 and 10c2 are located near both ends of the lens unit 110 in the X-direction, even if the light-shielding members 10c1 and 10c2 are moved in the X-direction, they cannot The accumulated exposure amount on the substrate 22 is changed.

因此,於第一實施形態中,將兩個遮光構件10cl、遮光構件10c2各自的+X方向的端部僅偏移透鏡單元110的X方向的配列的節距PX的一半。 Therefore, in the first embodiment, the ends in the +X direction of each of the two light shielding members 10cl and 10c2 are shifted by only half the pitch PX of the arrangement of the lens units 110 in the X direction.

藉由此種配置,於兩個遮光構件10c1、遮光構件10c2中的一者的+X方向端部位於透鏡單元110的X方向的兩端部的附近的情形下,另一者的+X方向端部配置於透鏡單元110的X方向的中心的附近。因此,將兩個遮光構件10c1、遮光構件10c2一起沿X方向移動,藉此可始終變更基板22上的累計曝光量。再者, 亦可將兩個遮光構件10c1、遮光構件10c2的X方向的長度設為相等。此種情形下,較佳的是設為使遮光構件10c1與遮光構件10c2分別沿X方向獨立地移動的構成。藉此,可使遮光量針對每一個透鏡單元110而不同。 With this arrangement, when the +X direction end of one of the two light shielding members 10c1 and 10c2 is located near both ends of the lens unit 110 in the X direction, the +X direction end of the other one of the two light shielding members 10c1 and 10c2 The end portion is arranged near the center of the lens unit 110 in the X direction. Therefore, by moving the two light shielding members 10c1 and 10c2 together in the X direction, the cumulative exposure amount on the substrate 22 can always be changed. Furthermore, The lengths of the two light shielding members 10c1 and 10c2 in the X direction may be equal to each other. In this case, it is preferable to adopt a structure in which the light-shielding member 10c1 and the light-shielding member 10c2 are independently moved in the X direction. Thereby, the amount of light shielding can be made different for each lens unit 110 .

再者,遮光構件10c1、遮光構件10c2並不限於所述的兩個,亦可為3個以上,只要各者配置於不同的透鏡區塊即可。於此種情形下亦較佳的是,若遮光構件的個數為m個(m為2以上的自然數),則各遮光構件的+X方向的端部設定為相對於節距PX僅偏移PX/m。 Furthermore, the light shielding members 10c1 and 10c2 are not limited to the two mentioned above, and may also be three or more, as long as they are arranged in different lens blocks. Also in this case, it is preferable that if the number of light-shielding members is m (m is a natural number of 2 or more), then the +X-direction end of each light-shielding member is set to be offset by only Shift PX/m.

再者,遮光構件10c配置於Z方向上自複眼透鏡11c的入射面僅離開規定距離的位置,但並不限定於此。遮光構件10c只要設置於複眼透鏡11c的入射面、即作為基板的共軛面的位置即可。此種情形下,遮光構件10c只要如Y方向的形狀(寬度)根據X方向的位置而變化者,或根據部位而透射率變化的濾光器般,為照明光的遮光率根據Y方向的位置而連續地變化者即可。若遮光構件10c將照明光完全地遮光,則有重疊部Oa~重疊部Od的累計曝光量相對於非重疊部Sa~非重疊部Se的累計曝光量的比率不連續地變化的擔憂,可防止此種情況。 Furthermore, the light shielding member 10c is arranged at a position separated by a predetermined distance from the incident surface of the fly-eye lens 11c in the Z direction, but it is not limited to this. The light shielding member 10c only needs to be provided on the incident surface of the fly-eye lens 11c, that is, at a position that is the conjugate surface of the substrate. In this case, as long as the shape (width) of the light-shielding member 10c changes in the Y-direction according to the position in the X-direction, or like a filter whose transmittance changes according to the location, the light-shielding rate of the illuminating light depends on the position in the Y-direction. But it can be changed continuously. If the light shielding member 10c completely blocks the illumination light, the ratio of the cumulative exposure amount of the overlapping portions Oa to Od to the cumulative exposure amount of the non-overlapping portions Sa to Se may discontinuously change. This can be prevented. This situation.

(變形例) (Modification)

於以上的第一實施形態中,設為具有五個投影光學系統19a~投影光學系統19e,但投影光學系統的個數並不限於五個,亦可為3個或8個等任意數目。 In the above first embodiment, it is assumed that there are five projection optical systems 19a to 19e. However, the number of projection optical systems is not limited to five, and may be any number such as three or eight.

又,於以上的第一實施形態中,具有多個投影光學系統19a~投影光學系統19e,藉由一次X方向的掃描,而使各投影光學系統所形成的多個掃描曝光視野SIa~掃描曝光視野SIe相互於Y方向重疊。 Furthermore, in the above first embodiment, there are a plurality of projection optical systems 19a to 19e, and a plurality of scanning exposure fields SIa to scanning exposure formed by each projection optical system are performed by scanning in the X direction once. The fields of view SIe overlap with each other in the Y direction.

然而,亦可為投影光學系統為一個,而一面使基板22及遮罩15沿Y方向移動一面多次進行基板22的朝X方向的掃描曝光,從而使藉由各掃描曝光而形成的多個曝光視野相互於Y方向重疊。於此種情形下亦理想的是,與一個投影光學系統相對應的照明光學系統具備與所述照明光學系統ILa~照明光學系統ILe同樣的構成。 However, the projection optical system may be one, and the substrate 22 and the mask 15 may be scanned and exposed in the The exposure fields of view overlap each other in the Y direction. In this case, it is also desirable that the illumination optical system corresponding to one projection optical system has the same configuration as the illumination optical systems ILa to ILe.

再者,如所述的第一實施形態般具有多個投影光學系統19a~投影光學系統19e的裝置可利用一次掃描曝光將基板22上的更大面積予以曝光,且處理能力優異。 Furthermore, a device having a plurality of projection optical systems 19a to 19e like the first embodiment can expose a larger area on the substrate 22 with one scanning exposure, and has excellent processing capabilities.

於以上的第一實施形態中,多個投影光學系統19a~投影光學系統19e包括全折射光學系統,但並不限定於此,亦可採用反射折射光學系統或全反射光學系統。 In the above first embodiment, the plurality of projection optical systems 19a to 19e include a total refractive optical system, but are not limited thereto, and a catadioptric optical system or a total reflection optical system may also be used.

又,於以上的第一實施形態中,將曝光視野PIa~曝光視野PIe的形狀設為梯形,但其並不限於梯形,例如,亦可為其相當於所述中心部分的部分的形狀為圓弧並於圓弧的兩端包括三角形的右端區域及左端區域的視野。 Furthermore, in the above first embodiment, the shapes of the exposure fields PIa to PIe are trapezoidal. However, they are not limited to trapezoids. For example, the shape of the portion corresponding to the center portion may be a circle. The arc includes the right end area and the left end area of the triangle at both ends of the arc.

於以上的實施形態中,各投影光學系統19a~投影光學系統19e的光軸PXa~光軸PXe、及各照明光學系統ILa~照明光 學系統ILe的光軸IXa~光軸IXe基本上設定為與Z方向平行。然而,於任一光學系統中採用彎折反射鏡的情形下,光軸的方向不與Z方向平行。 In the above embodiment, the optical axes PXa to PXe of the projection optical systems 19a to 19e and the illumination optical systems ILa to the illumination light The optical axes IXa to IXe of the optical system ILe are basically set parallel to the Z direction. However, in the case of using a flexural mirror in any optical system, the direction of the optical axis is not parallel to the Z direction.

又,於任一光學系統中採用彎折反射鏡的情形下,遮光構件10a~遮光構件10e的移動方向亦成為與基板22的掃描方向(X方向)不同的方向。然而,於此種情形下,遮光構件10a~遮光構件10e亦只要基於包含彎折反射鏡的基板22與複眼透鏡11a~複眼透鏡11e的共軛關係,沿與基板22的掃描方向光學性地對應的方向移動自如即可。 In addition, when a bending mirror is used in any optical system, the moving direction of the light shielding members 10 a to 10 e is also a direction different from the scanning direction (X direction) of the substrate 22 . However, in this case, the light shielding members 10a to 10e only need to optically correspond to the scanning direction of the substrate 22 based on the conjugate relationship between the substrate 22 including the flexural mirror and the fly eye lens 11a to the fly eye lens 11e. can move freely in the direction.

又,於以上的實施形態中,各投影光學系統19a~投影光學系統19e被設為於X方向配置有第一行投影光學系統19F及第二行投影光學系統19R此兩行光學系統者,但此並不限於兩行,亦可於X方向配置三行以上的光學系統。 Furthermore, in the above embodiment, each of the projection optical systems 19a to 19e has two rows of optical systems, the first row projection optical system 19F and the second row projection optical system 19R, arranged in the X direction. However, This is not limited to two rows, and more than three rows of optical systems can also be configured in the X direction.

作為光學積分器,可採用柱狀積分器(rod integrator)來代替所述的複眼透鏡11。於採用柱狀積分器的情形下,基板22及遮罩15的共軛面成為柱狀積分器的射出側(遮罩15側),故遮光構件10亦配置於柱狀積分器的射出側的附近。而且,構成為將柱狀積分器的射出面的X側的一端的附近局部地遮光。 As an optical integrator, a rod integrator can be used instead of the aforementioned fly-eye lens 11 . When a rod integrator is used, the conjugate surface of the substrate 22 and the mask 15 becomes the exit side of the rod integrator (the mask 15 side), so the light shielding member 10 is also disposed on the exit side of the rod integrator. nearby. Furthermore, the vicinity of the X-side end of the emission surface of the rod-shaped integrator is partially shielded from light.

亦可代替將遮光構件10a~遮光構件10e配置於照明光學系統ILa~照明光學系統ILe內,而將其配置於投影光學系統19a~投影光學系統19e的中間像面20附近。此種情形下,遮光構件亦構成為於中間像面20附近,將與曝光視野PIa~曝光視野PIe 的中心區域PIac~中心區域PIec相對應的部分予以遮光。 Instead of arranging the light shielding members 10a to 10e in the illumination optical systems ILa to ILe, they may be arranged near the intermediate image plane 20 of the projection optical systems 19a to 19e. In this case, the light shielding member is also configured near the intermediate image plane 20 and will be connected to the exposure field of view PIa to the exposure field of view PIe. The corresponding parts of the central area PIac ~ the central area PIec are shaded.

亦可代替於投影光學系統19a~投影光學系統19e內配置視野光圈21a~視野光圈21e,而於照明光學系統ILa~照明光學系統ILe的內部設置中間像面(相對於遮罩15的共軛面),並於照明光學系統ILa~照明光學系統ILe內的中間像面設置規定基板22上的曝光視野PIa~曝光視野PIe的形狀的視野光圈。 Instead of arranging the field of view aperture 21a to the field of view aperture 21e in the projection optical system 19a to 19e, an intermediate image plane (the conjugate plane with respect to the mask 15) may be provided in the illumination optical system ILa to ILe. ), and a field aperture that defines the shapes of the exposure fields PIa to PIe on the substrate 22 is provided at the intermediate image plane in the illumination optical systems ILa to ILe.

於以上的實施形態中,設為投影光學系統19a~投影光學系統19e及照明光學系統ILa~照明光學系統ILe被固定,而基板22藉由基板載台27而移動,代替地,亦可採用下述構成,即:將投影光學系統19a~投影光學系統19e及照明光學系統ILa~照明光學系統ILe設置於掃描載台上,相對於基板22而掃描。 In the above embodiment, it is assumed that the projection optical systems 19a to 19e and the illumination optical systems ILa to ILe are fixed, and the substrate 22 is moved by the substrate stage 27. Alternatively, the following method may be used. In this configuration, the projection optical systems 19a to 19e and the illumination optical systems ILa to ILe are installed on the scanning stage, and the substrate 22 is scanned.

又,遮罩15並不限於在玻璃基板上形成圖案的遮罩,亦可為包含數位多鏡元件(Digital multi-mirror device)或液晶元件的可變整形遮罩。 In addition, the mask 15 is not limited to a mask formed with a pattern on a glass substrate, and may also be a variable shaping mask including a digital multi-mirror device or a liquid crystal element.

根據所述第一實施形態及變形例,可獲得以下的作用效果。 According to the first embodiment and the modified example, the following effects can be obtained.

(1)第一實施形態或變形例的曝光裝置包括:投影光學系統19a~投影光學系統19e;照明光學系統ILa~照明光學系統ILe,對投影光學系統19a~投影光學系統19e供給照明光;以及掃描載台(基板載台)27,將被曝光基板22與投影光學系統19a~投影光學系統19e於掃描方向相對掃描,使由投影光學系統19a~投影光學系統19e形成的掃描曝光視野SIa~掃描曝光視野SIe於非掃 描方向重疊多個而將所述被曝光基板22曝光,且照明光學系統ILa~照明光學系統ILe或投影光學系統19a~投影光學系統19e具有照度變更構件10a~照度變更構件10e,所述照度變更構件以下述方式而設定,即:於曝光中,與於被曝光基板22上重疊地被曝光的重疊部Oa~重疊部Od的累計曝光量相比,於被曝光基板22上無重疊地被曝光的非重疊部Sa~非重疊部Se的累計曝光量變小。 (1) The exposure device of the first embodiment or modification includes: projection optical systems 19a to 19e; illumination optical systems ILa to ILe, which supply illumination light to the projection optical systems 19a to 19e; and The scanning stage (substrate stage) 27 relatively scans the exposed substrate 22 and the projection optical systems 19a to 19e in the scanning direction, so that the scanning exposure field of view SIa to the projection optical system 19e formed by the projection optical system 19a to 19e is scanned. Exposure field of view SIe in non-scanning The exposed substrate 22 is exposed by overlapping a plurality of drawing directions, and the illumination optical systems ILa to ILe or the projection optical systems 19a to 19e have illumination changing members 10a to 10e. The components are set so that during exposure, compared with the cumulative exposure amount of the overlapping portions Oa to Od that are overlapped and exposed on the exposed substrate 22 , the components are exposed without overlapping on the exposed substrate 22 . The cumulative exposure amount of the non-overlapping portion Sa to Se becomes smaller.

根據所述構成,即便使用與於時間上連續地進行曝光的情形相比,於時間上被分割為多段而進行曝光的情形下實效感光量降低的非加算性感光材料進行圖案的曝光轉印的情形下,亦可防止於各掃描曝光視野SIa~掃描曝光視野SIe所重疊的重疊部Oa~重疊部Od與非重疊部Sa~非重疊部Se部間的被轉印的圖案的線寬或厚度的變化。 According to the above configuration, the pattern is exposed and transferred using a non-additive photosensitive material in which the effective light exposure amount is reduced when the time is divided into a plurality of steps and the exposure is performed compared to the case where the time is continuously performed. In this case, it is also possible to prevent the line width or thickness of the transferred pattern between the overlapping portions Oa to Od and the non-overlapping portions Sa to Se where the respective scanning exposure fields SIa to SIe overlap. changes.

(2)照明光學系統ILa~照明光學系統ILe包含光學積分器11a~光學積分器11e,照度變更構件10a~照度變更構件10e為設置於下述位置的遮光構件10a~遮光構件10e,即:在光學積分器11a~光學積分器11e的被曝光基板22的共軛面的附近,且自共軛面朝照明光學系統ILa~照明光學系統ILe的光軸IXa~光軸IXe方向上僅離開規定距離,所述規定距離與重疊部Oa~重疊部Od的非掃描方向的寬度Wo、共軛面與被曝光基板22的橫倍率、及共軛面內的照明光的開口數相應而決定,並具有遮光構件保持部9a~遮光構件保持部9e,所述遮光構件保持部9a~遮光構件保持部9e將遮光構件10a~遮光構件10e於與照明光學系統ILa ~照明光學系統ILe的光軸IXa~光軸IXe大致正交的方向且與掃描方向光學地對應的第一方向移動自在地保持。 (2) The illumination optical systems ILa to ILe include optical integrators 11a to 11e, and the illuminance changing members 10a to 10e are light shielding members 10a to 10e provided at the following positions, that is: at The optical integrators 11a to 11e are located near the conjugate surface of the exposed substrate 22 and are separated from the conjugate surface by a predetermined distance in the direction of the optical axes IXa to IXe of the illumination optical systems ILa to ILe. , the predetermined distance is determined according to the width Wo of the overlapping portion Oa to the overlapping portion Od in the non-scanning direction, the lateral magnification of the conjugate plane and the exposed substrate 22, and the number of illumination light openings in the conjugate plane, and has The light-shielding member holding portion 9a to the light-shielding member holding portion 9e connect the light-shielding member 10a to the light-shielding member 10e to the illumination optical system ILa. The optical axes IXa to IXe of the illumination optical system ILe are substantially orthogonal to each other and the first direction optically corresponding to the scanning direction is movably maintained.

根據此種構成,使遮光構件10a~遮光構件10e於第一方向移動,藉此可使重疊部Oa~重疊部Od的累計曝光量相對於非重疊部Sa~非重疊部Se部的累計曝光量的比率大致連續地變化且降低。 According to this structure, by moving the light shielding members 10a to 10e in the first direction, the cumulative exposure amount of the overlapping portions Oa to Od can be adjusted relative to the cumulative exposure amount of the non-overlapping portions Sa to Se. The ratio changes and decreases roughly continuously.

於所述中,對各種實施形態及變形例進行了說明,但本發明並不限定於所述內容。又,各實施形態及變形例既可分別單獨地應用,亦可組合使用。於本發明的技術思想範圍內可考慮到的其他態樣亦包含於本發明的範圍內。 In the above, various embodiments and modifications have been described, but the present invention is not limited to the above. In addition, each of the embodiments and modifications may be applied individually or in combination. Other aspects that can be considered within the technical scope of the present invention are also included in the scope of the present invention.

以下的優先權基礎申請案的揭示內容作為引文而組入本文中。 The following disclosures of the basic priority application are incorporated herein by reference.

日本專利特願2019-002235號(2019年1月9日申請)。 Japanese Patent Application No. 2019-002235 (filed on January 9, 2019).

9c:遮光構件保持部 9c: Light shielding member holding part

9c1:滑件 9c1: Slider

10c1、10c2:遮光構件 10c1, 10c2: light-shielding member

11c:複眼透鏡 11c: compound eye lens

110:透鏡單元 110: Lens unit

IPIc:區域(曝光視野對應區域) IPIc: area (area corresponding to exposure field of view)

IWs:曝光視野對應區域中的與曝光視野的中心區域相對應的部分的Y方向的寬度(寬度) IWs: Width (width) in the Y direction of the portion corresponding to the center area of the exposure field of view in the exposure field of view corresponding area

PX:透鏡單元的X方向的排列的節距(節距) PX: The pitch (pitch) of the arrangement of the lens units in the X direction

W1、W2:遮光構件的Y方向的寬度(寬度) W1, W2: Width (width) of the light shielding member in the Y direction

Claims (10)

一種曝光裝置包括:載台,保持基板;複眼透鏡,包含第一透鏡單元與第二透鏡單元,且位在入射有照明光的入射面與所述基板形成為共軛面的位置;第一遮光部,位在所述複眼透鏡的所述入射面側,且至少對所述第一透鏡單元的一部分遮光;第二遮光部,位在所述複眼透鏡的所述入射面側,且至少對所述第二透鏡單元的一部分遮光;光圈,位在所述複眼透鏡與所述基板之間的光路中與所述基板共軛的位置,且藉由所述照明光設定所述基板的照射區域;以及控制系統,以改變藉由所述第一遮光部對所述第一透鏡單元的遮光量以及藉由所述第二遮光部對所述第二透鏡單元的遮光量的方式,使所述第一遮光部以及所述第二遮光部朝向規定方向移動,在所述入射面中所述第一透鏡單元以及所述第二透鏡單元分別包含第一區域以及第二區域,所述第一區域對應於所述光圈,所述第二區域對應於所述光圈的開口,在所述複眼透鏡的光軸方向中,所述第一遮光部的所述規定方向中的端部與所述第一透鏡單元的所述第一區域重疊但不與所述第二區域重疊,且所述第二遮光部的所述規定方向中的端部與 所述第二透鏡單元的所述第二區域重疊的狀態下,所述控制系統使所述第一遮光部以及所述第二遮光部朝向所述規定方向移動。 An exposure device includes: a stage holding a substrate; a fly-eye lens including a first lens unit and a second lens unit, and is located at a position where an incident surface where illumination light is incident and the substrate form a conjugate surface; a first light shielding The second light-shielding portion is located on the incident surface side of the fly-eye lens and shields at least a part of the first lens unit; the second light-shielding portion is located on the incident surface side of the fly-eye lens and shields at least part of the first lens unit. A part of the second lens unit blocks light; the aperture is located at a position conjugate to the substrate in the optical path between the fly-eye lens and the substrate, and the illumination area of the substrate is set by the illumination light; and a control system to change the amount of light shielding of the first lens unit by the first light shielding part and the amount of light shielding of the second lens unit by the second light shielding part, so that the third light shielding part A light shielding part and the second light shielding part move in a predetermined direction. In the incident surface, the first lens unit and the second lens unit respectively include a first area and a second area, and the first area corresponds to In the aperture, the second area corresponds to an opening of the aperture, and in the optical axis direction of the fly-eye lens, an end of the first light shielding portion in the predetermined direction is in contact with the first lens. The first area of the unit overlaps but does not overlap with the second area, and an end of the second light-shielding portion in the prescribed direction overlaps with In a state where the second area of the second lens unit overlaps, the control system moves the first light shielding portion and the second light shielding portion in the predetermined direction. 如請求項1所述的曝光裝置,其中所述第一遮光部以及所述第二遮光部設置於所述複眼透鏡的所述入射面的附近,所述複眼透鏡包含第一透鏡區塊以及第二透鏡區塊,所述第一透鏡區塊包括沿著第一方向配列的多個所述第一單元透鏡,所述第二透鏡區塊包括沿著所述第一方向配列的多個所述第二單元透鏡,且所述第一透鏡區塊和所述第二透鏡區塊在與所述第一方向交叉的第二方向上並列,隨著所述第一遮光部以及所述第二遮光部向所述規定方向移動,在所述光軸方向中,以與所述第一遮光部重疊的所述第一透鏡單元的數量以及與所述第二遮光部重疊的所述第二透鏡單元的數量增加的方式,使所述第一遮光部以及所述第二遮光部分別朝向所述規定方向延伸。 The exposure device according to claim 1, wherein the first light shielding part and the second light shielding part are disposed near the incident surface of the fly's eye lens, and the fly's eye lens includes a first lens block and a third lens block. Two lens blocks, the first lens block includes a plurality of the first unit lenses arranged along the first direction, and the second lens block includes a plurality of the first unit lenses arranged along the first direction. A second unit lens, and the first lens block and the second lens block are juxtaposed in a second direction crossing the first direction. With the first light shielding portion and the second light shielding portion part moves in the predetermined direction, in the direction of the optical axis, the number of the first lens units overlapping the first light shielding part and the number of the second lens units overlapping the second light shielding part The first light-shielding portion and the second light-shielding portion are respectively extended toward the predetermined direction by increasing the number of the light-shielding portions. 如請求項2所述的曝光裝置,其中,包括:投影光學系統,包含所述光圈,所述載台以如下的方式將所述基板相對於所述投影光學系統沿著掃描方向、以及與所述掃描方向交叉的非掃描方向移動,即:以通過所述投影光學系統的光多次照射在所述基板中沿著所述掃描方向延伸的重疊部,所述第一遮光部以及所述第二遮光部設置於所述光軸方向上 自所述入射面離開規定距離的位置,所述規定距離與所述重疊部的所述非掃描方向的寬度、所述入射面與所述基板的橫倍率、及所述入射面內的所述照明光的開口數相應而決定。 The exposure device according to claim 2, which includes: a projection optical system including the aperture, and the stage moves the substrate along the scanning direction relative to the projection optical system in the following manner, and with the The non-scanning direction where the scanning direction intersects moves, that is, the overlapping portion extending along the scanning direction in the substrate is irradiated multiple times with the light passing through the projection optical system, the first light shielding portion and the third light shielding portion. Two light shielding parts are arranged in the direction of the optical axis A position separated from the incident surface by a predetermined distance, a width of the overlapping portion between the predetermined distance and the non-scanning direction, a lateral magnification of the incident surface and the substrate, and the width of the incident surface within the incident surface. The number of illumination light openings is determined accordingly. 如請求項1所述的曝光裝置,其中所述第一遮光部以及所述第二遮光部設置於所述入射面、或較所述入射面更靠向光源側的與所述入射面共軛的共軛位置、或自所述共軛位置離開規定距離的位置。 The exposure device according to claim 1, wherein the first light shielding part and the second light shielding part are disposed on the incident surface, or are conjugate to the incident surface closer to the light source side than the incident surface. The conjugate position of , or the position away from the conjugate position by a specified distance. 如請求項4所述的曝光裝置,其中所述控制系統將所述第一遮光部以及所述第二遮光部朝向所述規定方向獨立地移動。 The exposure device according to claim 4, wherein the control system independently moves the first light shielding portion and the second light shielding portion toward the prescribed direction. 如請求項5所述的曝光裝置,其中包括:投影光學系統,包含所述光圈,所述載台以如下的方式將所述基板相對於所述投影光學系統沿著掃描方向、以及與所述掃描方向交叉的非掃描方向移動,即:以通過所述投影光學系統的光多次照射在所述基板中沿著所述掃描方向延伸的重疊部,所述第一遮光部以及所述第二遮光部設置於所述光軸方向上自所述入射面離開規定距離的位置,所述規定距離與所述重疊部的所述非掃描方向的寬度、所述入射面與所述基板的橫倍率、及所述入射面內的照明光的開口數相應而決定。 The exposure device according to claim 5, which includes: a projection optical system including the aperture, and the stage moves the substrate along the scanning direction relative to the projection optical system in the following manner, and with the Movement in the non-scanning direction where the scanning direction intersects, that is, irradiating the overlapping portion extending along the scanning direction in the substrate with light passing through the projection optical system multiple times, the first light shielding portion and the second The light shielding portion is provided at a position separated from the incident surface by a predetermined distance in the optical axis direction, and the predetermined distance is consistent with the width of the overlapping portion in the non-scanning direction and the lateral magnification of the incident surface and the substrate. , and the number of openings for illumination light in the incident surface is determined accordingly. 如請求項6所述的曝光裝置,其中在所述複眼透鏡中,包含排列於與所述光軸方向交叉的所述 第一方向的多個透鏡單元的透鏡區塊,且於與所述光軸方向及所述第一方向交叉的第二方向排列有多個,遮光部件將至少一個所述透鏡區塊的配置於所述第一方向的一側的一個以上的透鏡單元的、與所述重疊部以外的非重疊部共軛的部分的至少一部分予以遮光。 The exposure device according to claim 6, wherein the fly-eye lens includes the A plurality of lens blocks of a plurality of lens units in the first direction are arranged in a second direction intersecting the optical axis direction and the first direction, and the light shielding member arranges at least one of the lens blocks in At least part of a portion of one or more lens units on one side in the first direction that is conjugated to a non-overlapping portion other than the overlapping portion is shielded from light. 如請求項7所述的曝光裝置,其中所述遮光部件與多個所述透鏡區塊中的m個(m為2以上的自然數)透鏡區塊各者相對應,而配置m個。 The exposure apparatus according to Claim 7, wherein m pieces of the light shielding member are arranged corresponding to each of m (m is a natural number greater than or equal to 2) lens blocks among the plurality of lens blocks. 如請求項8所述的曝光裝置,其中與所述m個所述遮光部件的所述第一方向的所述一側為相反側的另一側的端部,以所述透鏡區塊內的所述透鏡單元的所述第一方向的排列週期為P,而設定於在所述第一方向分別僅不同P/m的位置。 The exposure device according to claim 8, wherein the end of the other side opposite to the side of the first direction of the m light-shielding members is within the lens block. The arrangement period of the lens units in the first direction is P, and they are set at positions that differ only by P/m in the first direction. 如請求項6至9中任一項所述的曝光裝置,其中並列包括多個所述投影光學系統及包含所述複眼透鏡的照明光學系統,藉由一次掃描曝光而使多個藉由所述投影光學系統進行的所述掃描曝光視野於所述非掃描方向重疊多個而將所述基板曝光。The exposure device according to any one of claims 6 to 9, which includes a plurality of the projection optical systems and an illumination optical system including the fly-eye lens in parallel, and a plurality of the projection optical systems and the illumination optical system including the fly-eye lens are exposed through one scanning exposure. The scanning exposure fields performed by the projection optical system overlap a plurality of fields in the non-scanning direction to expose the substrate.
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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002258489A (en) * 2000-04-20 2002-09-11 Nikon Corp Device and method for aligner
TW200722936A (en) * 2005-12-09 2007-06-16 Nikon Corp Laser light source device, exposure method, and device
CN101019207A (en) * 2004-08-12 2007-08-15 尼康股份有限公司 Substrate processing apparatus, use state ascertaining method, and false use preventing method
TW201528335A (en) * 2003-09-29 2015-07-16 尼康股份有限公司 Exposure apparatus, exposure method, and method for producing device

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001060546A (en) * 1999-08-20 2001-03-06 Nikon Corp Exposure method and aligner
JP2001297975A (en) * 2000-04-17 2001-10-26 Nikon Corp Aligner and method of exposure
JP6519109B2 (en) * 2014-07-17 2019-05-29 株式会社ニコン Exposure method and apparatus, and device manufacturing method
JP2016054230A (en) 2014-09-04 2016-04-14 キヤノン株式会社 Projection exposure device and exposure method
JP7052242B2 (en) * 2017-07-25 2022-04-12 凸版印刷株式会社 Exposure device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002258489A (en) * 2000-04-20 2002-09-11 Nikon Corp Device and method for aligner
TW201528335A (en) * 2003-09-29 2015-07-16 尼康股份有限公司 Exposure apparatus, exposure method, and method for producing device
CN101019207A (en) * 2004-08-12 2007-08-15 尼康股份有限公司 Substrate processing apparatus, use state ascertaining method, and false use preventing method
TW200722936A (en) * 2005-12-09 2007-06-16 Nikon Corp Laser light source device, exposure method, and device

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