TWI827592B - Method for removing metals in liquid, and anion exchange resin-mixed h-type chelating resin - Google Patents
Method for removing metals in liquid, and anion exchange resin-mixed h-type chelating resin Download PDFInfo
- Publication number
- TWI827592B TWI827592B TW108113136A TW108113136A TWI827592B TW I827592 B TWI827592 B TW I827592B TW 108113136 A TW108113136 A TW 108113136A TW 108113136 A TW108113136 A TW 108113136A TW I827592 B TWI827592 B TW I827592B
- Authority
- TW
- Taiwan
- Prior art keywords
- anion exchange
- resin
- exchange resin
- type
- type chelating
- Prior art date
Links
- 229920001429 chelating resin Polymers 0.000 title claims abstract description 127
- 239000007788 liquid Substances 0.000 title claims abstract description 82
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 55
- 239000002184 metal Substances 0.000 title claims abstract description 55
- 238000000034 method Methods 0.000 title claims abstract description 43
- 150000002739 metals Chemical class 0.000 title claims abstract description 29
- 238000005349 anion exchange Methods 0.000 title description 6
- 239000003957 anion exchange resin Substances 0.000 claims abstract description 127
- 239000003960 organic solvent Substances 0.000 claims description 54
- 239000012458 free base Substances 0.000 claims description 48
- 150000007522 mineralic acids Chemical class 0.000 claims description 33
- 150000002148 esters Chemical group 0.000 claims description 16
- 125000000524 functional group Chemical group 0.000 claims description 13
- 150000002576 ketones Chemical class 0.000 claims description 11
- 125000003277 amino group Chemical group 0.000 claims description 8
- 238000010306 acid treatment Methods 0.000 claims description 5
- 150000001336 alkenes Chemical class 0.000 claims description 5
- IAANMKMHMYZVOC-UHFFFAOYSA-N aminomethyl dihydrogen phosphate Chemical group NCOP(O)(O)=O IAANMKMHMYZVOC-UHFFFAOYSA-N 0.000 claims description 5
- 238000000354 decomposition reaction Methods 0.000 claims description 5
- NBZBKCUXIYYUSX-UHFFFAOYSA-N iminodiacetic acid Chemical group OC(=O)CNCC(O)=O NBZBKCUXIYYUSX-UHFFFAOYSA-N 0.000 claims description 5
- 230000007935 neutral effect Effects 0.000 claims description 5
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 claims description 5
- 150000003839 salts Chemical class 0.000 claims description 5
- 150000002466 imines Chemical class 0.000 claims description 3
- 239000002253 acid Substances 0.000 abstract description 10
- 239000000203 mixture Substances 0.000 abstract description 6
- 229910052500 inorganic mineral Inorganic materials 0.000 abstract description 5
- 239000011707 mineral Substances 0.000 abstract description 5
- 150000007513 acids Chemical class 0.000 abstract 1
- 229920005989 resin Polymers 0.000 description 35
- 239000011347 resin Substances 0.000 description 35
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 33
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 22
- 239000013522 chelant Substances 0.000 description 21
- 239000000243 solution Substances 0.000 description 17
- 239000002904 solvent Substances 0.000 description 16
- 238000012360 testing method Methods 0.000 description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 14
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 13
- 239000011734 sodium Substances 0.000 description 13
- 239000012535 impurity Substances 0.000 description 11
- 229910052708 sodium Inorganic materials 0.000 description 11
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 10
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 9
- 239000002245 particle Substances 0.000 description 9
- 230000007062 hydrolysis Effects 0.000 description 7
- 238000006460 hydrolysis reaction Methods 0.000 description 7
- 229910021645 metal ion Inorganic materials 0.000 description 7
- NWUYHJFMYQTDRP-UHFFFAOYSA-N 1,2-bis(ethenyl)benzene;1-ethenyl-2-ethylbenzene;styrene Chemical compound C=CC1=CC=CC=C1.CCC1=CC=CC=C1C=C.C=CC1=CC=CC=C1C=C NWUYHJFMYQTDRP-UHFFFAOYSA-N 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 230000002378 acidificating effect Effects 0.000 description 5
- 239000011575 calcium Substances 0.000 description 5
- 229920001577 copolymer Polymers 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 5
- DUAWRLXHCUAWMK-UHFFFAOYSA-N 2-iminiopropionate Chemical group CC(=[NH2+])C([O-])=O DUAWRLXHCUAWMK-UHFFFAOYSA-N 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 239000003729 cation exchange resin Substances 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- 229920002125 Sokalan® Polymers 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 3
- 238000001514 detection method Methods 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 239000003456 ion exchange resin Substances 0.000 description 3
- 229920003303 ion-exchange polymer Polymers 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 239000011259 mixed solution Substances 0.000 description 3
- 229910021642 ultra pure water Inorganic materials 0.000 description 3
- 239000012498 ultrapure water Substances 0.000 description 3
- XLLIQLLCWZCATF-UHFFFAOYSA-N 2-methoxyethyl acetate Chemical compound COCCOC(C)=O XLLIQLLCWZCATF-UHFFFAOYSA-N 0.000 description 2
- 239000002635 aromatic organic solvent Substances 0.000 description 2
- 229910052791 calcium Inorganic materials 0.000 description 2
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 description 2
- 230000003750 conditioning effect Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- JMMWKPVZQRWMSS-UHFFFAOYSA-N isopropanol acetate Natural products CC(C)OC(C)=O JMMWKPVZQRWMSS-UHFFFAOYSA-N 0.000 description 2
- 229940011051 isopropyl acetate Drugs 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 125000001302 tertiary amino group Chemical group 0.000 description 2
- ZOKCNEIWFQCSCM-UHFFFAOYSA-N (2-methyl-4-phenylpent-4-en-2-yl)benzene Chemical compound C=1C=CC=CC=1C(C)(C)CC(=C)C1=CC=CC=C1 ZOKCNEIWFQCSCM-UHFFFAOYSA-N 0.000 description 1
- MGRVRXRGTBOSHW-UHFFFAOYSA-N (aminomethyl)phosphonic acid Chemical group NCP(O)(O)=O MGRVRXRGTBOSHW-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 125000004202 aminomethyl group Chemical group [H]N([H])C([H])([H])* 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- 150000001450 anions Chemical class 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- 238000005341 cation exchange Methods 0.000 description 1
- 229940023913 cation exchange resins Drugs 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- -1 isopropyl acetate Ester Chemical class 0.000 description 1
- GWYFCOCPABKNJV-UHFFFAOYSA-N isovaleric acid Chemical compound CC(C)CC(O)=O GWYFCOCPABKNJV-UHFFFAOYSA-N 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 108010063993 lens intrinsic protein MP 64 Proteins 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 125000002467 phosphate group Chemical group [H]OP(=O)(O[H])O[*] 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 230000001376 precipitating effect Effects 0.000 description 1
- 150000003141 primary amines Chemical group 0.000 description 1
- QROGIFZRVHSFLM-UHFFFAOYSA-N prop-1-enylbenzene Chemical compound CC=CC1=CC=CC=C1 QROGIFZRVHSFLM-UHFFFAOYSA-N 0.000 description 1
- 108090000623 proteins and genes Proteins 0.000 description 1
- 125000001453 quaternary ammonium group Chemical group 0.000 description 1
- 150000003335 secondary amines Chemical group 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J41/00—Anion exchange; Use of material as anion exchangers; Treatment of material for improving the anion exchange properties
- B01J41/04—Processes using organic exchangers
- B01J41/05—Processes using organic exchangers in the strongly basic form
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J41/00—Anion exchange; Use of material as anion exchangers; Treatment of material for improving the anion exchange properties
- B01J41/04—Processes using organic exchangers
- B01J41/07—Processes using organic exchangers in the weakly basic form
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J41/00—Anion exchange; Use of material as anion exchangers; Treatment of material for improving the anion exchange properties
- B01J41/08—Use of material as anion exchangers; Treatment of material for improving the anion exchange properties
- B01J41/12—Macromolecular compounds
- B01J41/14—Macromolecular compounds obtained by reactions only involving unsaturated carbon-to-carbon bonds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J45/00—Ion-exchange in which a complex or a chelate is formed; Use of material as complex or chelate forming ion-exchangers; Treatment of material for improving the complex or chelate forming ion-exchange properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J47/00—Ion-exchange processes in general; Apparatus therefor
- B01J47/02—Column or bed processes
- B01J47/04—Mixed-bed processes
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F1/00—Treatment of water, waste water, or sewage
- C02F1/42—Treatment of water, waste water, or sewage by ion-exchange
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Life Sciences & Earth Sciences (AREA)
- Hydrology & Water Resources (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Water Supply & Treatment (AREA)
- Treatment Of Water By Ion Exchange (AREA)
Abstract
Description
本發明係關於使用螯合樹脂來去除水、水溶液或有機溶劑等液體中之金屬雜質之液體中之金屬去除方法。The present invention relates to a method for removing metals from liquids using chelating resins to remove metal impurities in liquids such as water, aqueous solutions or organic solvents.
PGMEA等酯系有機溶劑係使用於作為光阻之溶解溶劑、剝離劑等。當使用作為光阻之溶解溶劑、剝離劑時,有機溶劑中之雜質、尤其金屬雜質由於招致由光阻所製作之半導體元件之劣化,縮短元件之壽命,因此係以僅可能少為較佳。Ester-based organic solvents such as PGMEA are used as photoresist dissolving solvents, strippers, etc. When used as a dissolving solvent or stripper for photoresist, impurities in the organic solvent, especially metal impurities, cause deterioration of semiconductor elements made of photoresist and shorten the life of the element, so it is better to keep them as small as possible.
作為這樣的去除酯系有機溶劑中之金屬雜質之方法,有使金屬去除對象液體接觸螯合樹脂之方法。例如專利文獻1揭示一種電子零件用處理液之製造裝置,其係包含在混合槽內投入並混合2個以上的藥品之步驟,其中在至少1個藥品的投入過程中,包含填充有離子交換樹脂或螯合樹脂之離子交換樹脂或螯合樹脂處理塔。As such a method for removing metal impurities in an ester-based organic solvent, there is a method of bringing a metal removal target liquid into contact with a chelating resin. For example, Patent Document 1 discloses an apparatus for manufacturing a processing liquid for electronic parts, which includes a step of charging and mixing two or more chemicals in a mixing tank, wherein at least one chemical is filled with an ion exchange resin. Or chelating resin ion exchange resin or chelating resin treatment tower.
螯合樹脂之官能基有具有亞胺二乙酸基、胺甲基磷酸基、亞胺丙酸基等胺基者。而且,具有亞胺二乙酸基、胺甲基磷酸基、亞胺丙酸基等之螯合樹脂,通常以Na型和Ca型販售於市面。因此,在不希望漏出Na、Ca的用途中,此等螯合樹脂係以無機酸調節而製備為H型後使用。 [先前技術文獻] [專利文獻]The functional groups of the chelating resin include those with amine groups such as iminodiacetic acid group, aminomethyl phosphate group, and imine propionic acid group. Moreover, chelate resins having iminodiacetic acid groups, aminomethylphosphonic acid groups, iminopropionic acid groups, etc. are usually sold on the market as Na type and Ca type. Therefore, in applications where the leakage of Na and Ca is not desired, these chelating resins are prepared into H type after being adjusted with inorganic acid. [Prior technical literature] [Patent Document]
專利文獻1:日本特開2001-228635號公報Patent Document 1: Japanese Patent Application Publication No. 2001-228635
[發明所欲解決之課題][Problem to be solved by the invention]
經無機酸調節之具有胺基之H型螯合樹脂,由於無機酸會殘留於樹脂中,因此若使用H型螯合樹脂來進行被處理液體中之金屬去除,則殘留於螯合樹脂中之無機酸會漸漸漏出。而且,鹽酸等酸漏出至被處理液體,視用途不同將會損害品質。即使在經無機酸調節後,利用超純水等來進行洗淨,也難以迅速地自樹脂去除殘留無機酸,經無機酸調節後之洗淨未解決該無機酸漏出之問題。H-type chelating resin with amine groups adjusted by inorganic acid. Since the inorganic acid will remain in the resin, if H-type chelating resin is used to remove metals from the liquid to be treated, the amount of residue remaining in the chelating resin will The inorganic acid will gradually leak out. In addition, acid such as hydrochloric acid leaks into the liquid to be processed, which may impair the quality depending on the use. Even if ultrapure water is used for cleaning after conditioning with mineral acid, it is difficult to quickly remove residual mineral acid from the resin. Cleaning after conditioning with mineral acid does not solve the problem of leakage of the mineral acid.
又,在去除被處理液體中之金屬時,有因與金屬之交換而釋放質子,生成酸之可能性。當被處理液體為酯系有機溶劑等時,將會發生水解。In addition, when metals in the liquid to be treated are removed, protons may be released due to exchange with the metals and acid may be generated. When the liquid to be treated is an ester-based organic solvent, etc., hydrolysis will occur.
因此,本發明之目的係提供一種使用H型螯合樹脂的液體中之金屬去除方法,其係不會發生無機酸洩漏之問題的方法。 [用以解決課題之手段]Therefore, the object of the present invention is to provide a method for removing metals from liquid using H-type chelating resin, which is a method that does not cause the problem of leakage of inorganic acid. [Means used to solve problems]
這樣的上述課題可藉由以下的本發明來解決。 亦即,本發明(1)係提供一種液體中之金屬去除方法,其係使被處理液體接觸混合有陰離子交換樹脂之H型螯合樹脂而去除該被處理液體中之金屬,其特徵為該陰離子交換樹脂之混合量相對於該H型螯合樹脂而言為0.10~100.0體積%。Such above-mentioned problems can be solved by the following invention. That is, the present invention (1) provides a method for removing metals from a liquid, which removes metals from the liquid to be treated by bringing the liquid to be treated into contact with an H-type chelating resin mixed with an anion exchange resin, and is characterized by: The mixing amount of the anion exchange resin is 0.10 to 100.0% by volume relative to the H-type chelating resin.
又,本發明(2)係提供如(1)之液體中之金屬去除方法,其特徵為前述H型螯合樹脂之官能基具有胺基。Furthermore, the present invention (2) provides a method for removing metals from liquids as in (1), characterized in that the functional group of the H-type chelating resin has an amine group.
又,本發明(3)係提供如(1)或(2)之液體中之金屬去除方法,其特徵為前述H型螯合樹脂之官能基為亞胺二乙酸基、胺甲基磷酸基或亞胺丙酸基。In addition, (3) of the present invention provides a method for removing metals from liquids as in (1) or (2), characterized in that the functional group of the aforementioned H-type chelating resin is an iminodiacetic acid group, an aminomethyl phosphate group or Imidopropionic acid group.
又,本發明(4)係提供如(1)至(3)中任一者之液體中之金屬去除方法,其特徵為前述被處理液體為酯系有機溶劑、含有酯系有機溶劑之溶液、酮系有機溶劑、含有酮系有機溶劑之溶液、烯系有機溶劑、或含有烯系有機溶劑之溶液,且前述陰離子交換樹脂為游離鹼型弱鹼性陰離子交換樹脂。Furthermore, the present invention (4) provides a method for removing metals from a liquid according to any one of (1) to (3), characterized in that the liquid to be treated is an ester-based organic solvent or a solution containing an ester-based organic solvent. A ketone organic solvent, a solution containing a ketone organic solvent, an olefinic organic solvent, or a solution containing an olefinic organic solvent, and the aforementioned anion exchange resin is a free base type weakly basic anion exchange resin.
又,本發明(5)係提供如(4)之液體中之金屬去除方法,其特徵為前述游離鹼型弱鹼性陰離子交換樹脂之中性鹽分解容量為0.25eq/L-R以下。Furthermore, the present invention (5) provides a method for removing metals from a liquid as in (4), characterized in that the neutral salt decomposition capacity of the free base type weakly basic anion exchange resin is 0.25 eq/L-R or less.
又,本發明(6)係提供一種陰離子交換樹脂混合H型螯合樹脂,其係混合有陰離子交換樹脂之H型螯合樹脂, 其特徵為相對於該H型螯合樹脂之該陰離子交換樹脂之混合量為0.10~100.0體積%。Furthermore, the present invention (6) provides an H-type chelating resin mixed with an anion exchange resin, which is an H-type chelating resin mixed with an anion exchange resin. It is characterized in that the mixing amount of the anion exchange resin relative to the H-type chelating resin is 0.10 to 100.0 volume %.
又,本發明(7)係提供如(6)之陰離子交換樹脂混合H型螯合樹脂,其特徵為前述H型螯合樹脂之官能基具有胺基。Furthermore, (7) of the present invention provides an anion exchange resin mixed H-type chelating resin as in (6), which is characterized in that the functional group of the H-type chelating resin has an amine group.
又,本發明(8)係提供如(6)或(7)之陰離子交換樹脂混合H型螯合樹脂,其特徵為前述H型螯合樹脂之官能基為亞胺二乙酸基、胺甲基磷酸基或亞胺丙酸基。 [發明之效果]In addition, (8) of the present invention provides an anion exchange resin mixed H-type chelating resin such as (6) or (7), characterized in that the functional groups of the aforementioned H-type chelating resin are iminodiacetic acid groups and aminomethyl groups. Phosphate group or iminopropionic acid group. [Effects of the invention]
根據本發明,可提供一種使用H型螯合樹脂的液體中之金屬去除方法,其係不會發生無機酸洩漏之問題的方法。According to the present invention, it is possible to provide a method for removing metals from liquid using H-type chelating resin, which method does not cause the problem of leakage of inorganic acid.
本發明之液體中之金屬去除方法,特徵為以使被處理液體接觸混合有陰離子交換樹脂之H型螯合樹脂而去除該被處理液體中之金屬。The method for removing metals from liquids of the present invention is characterized by removing metals from the liquid to be treated by bringing the liquid to be treated into contact with an H-type chelating resin mixed with an anion exchange resin.
在本發明之液體中之金屬去除方法中,成為去除金屬之處理對象的被處理液體可列舉:純水、超純水等水、PGMEA(丙二醇單甲基醚乙酸酯)、乙酸異丙酯等酯系有機溶劑、環己酮、甲基異丁基酮、丙酮、甲基乙基酮等酮系有機溶劑、2,4-二苯基-4-甲基-1-戊烯、2-苯基-1-丙烯等烯系有機溶劑、含有此等有機溶劑之溶液,例如酯系有機溶劑與芳香族有機溶劑之混合溶液等含有酯系有機溶劑之溶液、酮系有機溶劑與醇系有機溶劑之混合溶液等含有酮系有機溶劑之溶液、烯系有機溶劑與芳香族有機溶劑之混合溶液等含有烯系有機溶劑之溶液等。In the metal removal method from a liquid of the present invention, the liquid to be processed to be treated for removing metals may include: water such as pure water, ultrapure water, PGMEA (propylene glycol monomethyl ether acetate), isopropyl acetate Ester-based organic solvents, cyclohexanone, methyl isobutyl ketone, acetone, methyl ethyl ketone and other ketone-based organic solvents, 2,4-diphenyl-4-methyl-1-pentene, 2- Ethylene-based organic solvents such as phenyl-1-propene, solutions containing these organic solvents, such as mixed solutions of ester-based organic solvents and aromatic organic solvents, solutions containing ester-based organic solvents, ketone-based organic solvents, and alcohol-based organic solvents Mixed solutions of solvents, such as solutions containing ketone organic solvents, mixed solutions of olefinic organic solvents and aromatic organic solvents, and solutions containing olefinic organic solvents, etc.
本發明之液體中之金屬去除方法,由於被處理液體在酯系有機溶劑、酮系有機溶劑、烯系有機溶劑、含有此等有機溶劑之溶液(例如含有酯系有機溶劑之溶液、含有酮系有機溶劑之溶液、含有烯系有機溶劑之溶液)等酸性環境下具有反應性,因此特別適於不能使用強酸性陽離子交換樹脂的溶劑之情形。The metal removal method in the liquid of the present invention is because the liquid to be treated is in an ester-based organic solvent, a ketone-based organic solvent, an olefin-based organic solvent, or a solution containing these organic solvents (for example, a solution containing an ester-based organic solvent, a solution containing a ketone-based organic solvent, etc.) It is reactive in acidic environments such as solutions of organic solvents and solutions containing olefinic organic solvents, so it is particularly suitable for situations where solvents such as strongly acidic cation exchange resins cannot be used.
作為本發明之液體中之金屬去除方法的被處理液體,係以使用作為半導體製程之洗淨水的超純水、光阻之溶解溶劑或剝離劑、晶圓之洗淨劑等要求雜質極少的液體為特佳。又,本發明之液體中之金屬去除方法的被處理液體中之金屬雜質之含量並未特別限制,惟本發明之液體中之金屬去除方法由於適合去除要求雜質極少的用途(例如要求使用的液體中之金屬雜質含量為10ng/L以下的用途)所使用之液體中之金屬,因此本發明之液體中之金屬去除方法的被處理液體中之金屬雜質之含量較佳為10~1000ng/L,特佳為10~500ng/L。As the liquid to be processed in the metal removal method of the present invention, ultrapure water used as cleaning water for semiconductor processes, photoresist dissolving solvents or strippers, wafer cleaners, etc. that require very few impurities are used. Liquids are especially good. In addition, the metal impurity content in the liquid to be treated in the metal removal method of the present invention is not particularly limited. However, the metal removal method of the present invention is suitable for applications that require the removal of very few impurities (such as liquids that require the use of The content of metal impurities in the liquid is less than 10 ng/L). Therefore, the content of metal impurities in the liquid to be processed in the metal removal method of the present invention is preferably 10 to 1000 ng/L. Especially optimal is 10~500ng/L.
作為被處理液體之金屬雜質,可列舉:Li、Na、Mg、Al、K、Ca、Ti、Cr、Mn、Fe、Co、Ni、Cu、Zn、As、Cd、Pb等金屬離子。H型之螯合樹脂具有優異的去除Fe、Cu、Ni等多價之金屬離子之性能。As metal impurities in the liquid to be processed, metal ions such as Li, Na, Mg, Al, K, Ca, Ti, Cr, Mn, Fe, Co, Ni, Cu, Zn, As, Cd, and Pb can be cited. H-type chelating resin has excellent performance in removing multivalent metal ions such as Fe, Cu, Ni, etc.
本發明之液體中之金屬去除方法的H型螯合樹脂係藉由使Na型、Ca型、Mg型等金屬離子型之螯合樹脂與無機酸接觸,進行酸處理,轉換為H型者。換言之,H型螯合樹脂係金屬離子型之螯合樹脂的無機酸接觸處理物。The H-type chelate resin used in the method for removing metals from liquids of the present invention is converted into H-type by contacting Na-type, Ca-type, Mg-type, and other metal ion-type chelate resins with inorganic acids and performing acid treatment. In other words, H-type chelate resin is a metal ion-type chelate resin that is treated with inorganic acid.
本發明之液體中之金屬去除方法的H型螯合樹脂所具有之官能基,只要是可配位於金屬離子而形成螯合物者,則未特別限制,例如可列舉:亞胺二乙酸基、胺甲基磷酸基、亞胺丙酸基等具有胺基之官能基、硫醇基等。此等之中,作為螯合樹脂之官能基,從多數的多價金屬離子之去除性變高的觀點來看,係以具有胺基之官能基為較佳,亞胺二乙酸基、胺甲基磷酸基、亞胺丙酸基為特佳。The functional groups of the H-type chelate resin in the method for removing metals from liquids of the present invention are not particularly limited as long as they can coordinate with metal ions to form chelates. Examples include: imine diacetate groups, Aminomethylphosphate group, iminopropionic acid group, etc. have functional groups such as amine group, thiol group, etc. Among these, functional groups having an amine group are preferred as the functional group of the chelate resin, from the viewpoint of improving the removal properties of many polyvalent metal ions, such as imine diacetyl group, amine methyl group Phosphate group and iminopropionic acid group are particularly preferred.
作為H型螯合樹脂之基體,可列舉苯乙烯-二乙烯苯共聚物。As a matrix of H-type chelate resin, styrene-divinylbenzene copolymer can be cited.
H型螯合樹脂可為凝膠型結構、巨多孔(macroporous)型結構、多孔型結構之任一結構。The H-type chelating resin can have any structure of gel structure, macroporous structure, or porous structure.
H型螯合樹脂之交換容量較佳為0.50~2.50eq/L-R,特佳為1.00~2.50eq/L-R。H型螯合樹脂之平均粒徑(調和平均徑)並未特別限制,而較佳為300~1000μm,特佳為500~800μm。此外,H型螯合樹脂之平均粒徑係藉由雷射繞射式粒度分布測定裝置所測定之値。The exchange capacity of H-type chelating resin is preferably 0.50~2.50eq/L-R, particularly preferably 1.00~2.50eq/L-R. The average particle diameter (harmonic average diameter) of the H-type chelate resin is not particularly limited, but is preferably 300 to 1000 μm, particularly preferably 500 to 800 μm. In addition, the average particle size of the H-type chelate resin is a value measured by a laser diffraction particle size distribution measuring device.
H型螯合樹脂係藉由使Na型、Ca型、Mg型等金屬離子型之螯合樹脂與無機酸接觸以進行酸處理而得。H-type chelate resin is obtained by contacting a metal ion type chelate resin such as Na type, Ca type, Mg type, etc. with an inorganic acid to perform acid treatment.
作為金屬離子型之螯合樹脂,可列舉:三菱化學公司製之CR-10、CR-11、Sumika Chemtex公司製之Duolite C-467、住友化學公司製之MC-700、Lanxess公司製之Lewatit TP207、Lewatit TP208、Lewatit TP260)、Purolite公司製之S930、S950。Examples of the metal ion type chelating resin include: CR-10 and CR-11 manufactured by Mitsubishi Chemical Corporation, Duolite C-467 manufactured by Sumika Chemtex Corporation, MC-700 manufactured by Sumitomo Chemical Corporation, and Lewatit TP207 manufactured by Lanxess Corporation. , Lewatit TP208, Lewatit TP260), S930, S950 made by Purolite Company.
作為金屬離子型之螯合樹脂所接觸之無機酸,可列舉:鹽酸、硫酸、硝酸。此等之中,作為無機酸,從安全性的觀點來看,係以鹽酸、硫酸為較佳。又,從Ca型轉換之情形,因有硫酸鈣析出之虞而以鹽酸為較佳。無機酸之濃度較佳為0.1~6.0N,特佳為1.0~4.0N。Examples of inorganic acids that the metal ion-type chelating resin comes into contact with include hydrochloric acid, sulfuric acid, and nitric acid. Among these, as the inorganic acid, hydrochloric acid and sulfuric acid are preferred from the viewpoint of safety. In addition, when converting from Ca type, there is a risk of calcium sulfate precipitating, so hydrochloric acid is preferred. The concentration of the inorganic acid is preferably 0.1 to 6.0N, particularly preferably 1.0 to 4.0N.
作為使無機酸接觸金屬離子型之螯合樹脂之方法,並未特別限制,可適當選擇接觸方式、接觸溫度、接觸時間等。The method of bringing the inorganic acid into contact with the metal ion type chelating resin is not particularly limited, and the contact method, contact temperature, contact time, etc. can be appropriately selected.
使無機酸接觸金屬離子型之螯合樹脂後,將轉換為H型之H型螯合樹脂進行水洗,進行多餘的無機酸之去除,惟螯合樹脂中之官能基因與無機酸之氫鍵等而鍵結,因此水洗無法完全去除多餘的無機酸。因此,在H型螯合樹脂中,會殘留酸處理所使用之無機酸。After the inorganic acid contacts the metal ion-type chelating resin, the H-type chelating resin converted into H-type is washed with water to remove excess inorganic acid. Only the hydrogen bonds between the functional genes in the chelating resin and the inorganic acid, etc. And bonded, so water washing cannot completely remove excess inorganic acid. Therefore, the inorganic acid used in the acid treatment will remain in the H-type chelating resin.
作為本發明之液體中之金屬去除方法的陰離子交換樹脂,可列舉:OH型強鹼性陰離子交換樹脂、游離鹼型弱鹼性陰離子交換樹脂等。Examples of the anion exchange resin used in the method for removing metals from liquids of the present invention include OH type strong basic anion exchange resin, free base type weak basic anion exchange resin, and the like.
作為強鹼性陰離子交換樹脂之陰離子交換基,可列舉四級銨基。Examples of the anion exchange group of the strongly basic anion exchange resin include quaternary ammonium groups.
作為強鹼性陰離子交換樹脂之基體,可列舉:苯乙烯-二乙烯苯共聚物、丙烯酸-二乙烯苯共聚物。Examples of the matrix of the strongly basic anion exchange resin include styrene-divinylbenzene copolymer and acrylic acid-divinylbenzene copolymer.
強鹼性陰離子交換樹脂可為凝膠型結構、巨多孔型結構、多孔型結構之任一結構。The strong basic anion exchange resin can have any structure including gel structure, macroporous structure, and porous structure.
強鹼性陰離子交換樹脂之陰離子交換容量較佳為0.50~2.00eq/L-R,特佳為0.80~1.50eq/L-R。強鹼性陰離子交換樹脂之平均粒徑(調和平均徑)並未特別限制,而較佳為300~1000μm,特佳為500~800μm。此外,強鹼性陰離子交換樹脂之平均粒徑係藉由雷射繞射式粒度分布測定裝置所測定之値。The anion exchange capacity of the strong basic anion exchange resin is preferably 0.50~2.00eq/L-R, and particularly preferably 0.80~1.50eq/L-R. The average particle diameter (harmonic average diameter) of the strongly basic anion exchange resin is not particularly limited, but is preferably 300 to 1000 μm, particularly preferably 500 to 800 μm. In addition, the average particle size of the strongly basic anion exchange resin is a value measured by a laser diffraction particle size distribution measuring device.
作為強鹼性陰離子交換樹脂,可列舉:三菱化學公司製之Diaion SA10A、SA12A、Sumika Chemtex公司製之Duolite A113OH、Lanxess公司製之Lewatit MonoPlus M500、Purolite公司製之A400等。Examples of strong basic anion exchange resins include Diaion SA10A and SA12A manufactured by Mitsubishi Chemical Corporation, Duolite A113OH manufactured by Sumika Chemtex, Lewatit MonoPlus M500 manufactured by Lanxess, and A400 manufactured by Purolite.
在本發明之液體中之金屬去除方法中,從當被處理液體為在鹼性環境下水解之有機溶劑(例如酯系有機溶劑)時,可使被處理液體之水解難以發生的觀點來看,陰離子交換樹脂係以游離鹼型弱鹼性陰離子交換樹脂為較佳。In the metal removal method from a liquid of the present invention, when the liquid to be treated is an organic solvent (for example, an ester-based organic solvent) that hydrolyzes in an alkaline environment, hydrolysis of the liquid to be treated can be made difficult to occur, The anion exchange resin is preferably a free base type weakly basic anion exchange resin.
作為游離鹼型弱鹼性陰離子交換樹脂之陰離子交換基,可列舉:一級胺基、二級胺基、三級胺基。此等之中,作為陰離子基,係以三級胺基為較佳。Examples of the anion exchange groups of the free base weakly basic anion exchange resin include primary amine groups, secondary amine groups, and tertiary amine groups. Among these, as the anionic group, a tertiary amine group is preferred.
作為游離鹼型弱鹼性陰離子交換樹脂之基體,可列舉:苯乙烯-二乙烯苯共聚物、丙烯酸-二乙烯苯共聚物。Examples of the matrix of the free base type weakly basic anion exchange resin include styrene-divinylbenzene copolymer and acrylic acid-divinylbenzene copolymer.
游離鹼型弱鹼性陰離子交換樹脂可為凝膠型結構、巨多孔型結構、多孔型結構之任一結構。The free base type weakly basic anion exchange resin can have any structure including a gel structure, a macroporous structure, and a porous structure.
游離鹼型弱鹼性陰離子交換樹脂之陰離子交換容量較佳為0.50~2.50eq/L-R,特佳為1.00~2.00eq/L-R。游離鹼型弱鹼性陰離子交換樹脂之中性鹽分解容量較佳為0.25eq/L-R以下,特佳為大於0.01eq/L-R且0.15eq/L-R以下。游離鹼型弱鹼性陰離子交換樹脂之平均粒徑(調和平均徑)並未特別限制,而較佳為300~1000μm,特佳為500~800μm。此外,游離鹼型弱鹼性陰離子交換樹脂之平均粒徑係藉由雷射繞射式粒度分布測定裝置所測定之値。The anion exchange capacity of the free base type weakly basic anion exchange resin is preferably 0.50 to 2.50eq/L-R, and particularly preferably 1.00 to 2.00eq/L-R. The neutral salt decomposition capacity of the free base type weakly basic anion exchange resin is preferably 0.25eq/L-R or less, and particularly preferably is greater than 0.01eq/L-R and less than 0.15eq/L-R. The average particle diameter (harmonic average diameter) of the free base type weakly basic anion exchange resin is not particularly limited, but is preferably 300 to 1000 μm, particularly preferably 500 to 800 μm. In addition, the average particle size of the free base type weakly basic anion exchange resin is a value measured by a laser diffraction particle size distribution measuring device.
作為游離鹼型弱鹼性陰離子交換樹脂,可列舉:三菱化學公司製之Diaion WA30、Sumika Chemtex公司製之Duolite A368MS、Lanxess公司製之Lewatit MP62、Lewatit MonoPlus MP64、Purolite公司製之A100等。Examples of the free base type weakly basic anion exchange resin include Diaion WA30 manufactured by Mitsubishi Chemical Corporation, Duolite A368MS manufactured by Sumika Chemtex, Lewatit MP62 manufactured by Lanxess, Lewatit MonoPlus MP64, and A100 manufactured by Purolite.
而且,在本發明之液體中之金屬去除方法中,係使被處理液體接觸混合有陰離子交換樹脂之H型螯合樹脂而去除液體中之金屬,得到金屬雜質經去除之處理液體。換言之,在本發明之液體中之金屬去除方法中,係使被處理液體接觸H型螯合樹脂與陰離子交換樹脂之混合物。Furthermore, in the method for removing metals from liquids of the present invention, the liquid to be treated is contacted with an H-type chelating resin mixed with an anion exchange resin to remove metals from the liquid, thereby obtaining a treated liquid from which metal impurities have been removed. In other words, in the metal removal method from liquid of the present invention, the liquid to be treated is brought into contact with a mixture of H-type chelating resin and anion exchange resin.
作為於H型螯合樹脂混合陰離子交換樹脂之方法,只要是在H型螯合樹脂與陰離子交換樹脂之混合物中,使離子交換樹脂均勻分散之方法,則未特別限制。The method of mixing the anion exchange resin with the H-type chelating resin is not particularly limited as long as the ion exchange resin is uniformly dispersed in the mixture of the H-type chelating resin and the anion exchange resin.
陰離子交換樹脂之混合量係相對於H型螯合樹脂而言為0.10~100.0體積%,較佳為0.10~50.0體積%,更佳為0.10~5.00體積%。藉由陰離子交換樹脂之混合量在上述範圍,去除從H型螯合樹脂漏出之無機酸的效果變高。另一方面,若陰離子交換樹脂之混合量小於上述範圍,則從H型螯合樹脂漏出之酸的去除變得不充分,在處理液體中混入無機酸;又,若大於上述範圍,則當處理在鹼性環境下水解之有機溶劑時,有被處理液體之水解發生之虞。The mixing amount of the anion exchange resin is 0.10 to 100.0 volume % relative to the H-type chelating resin, preferably 0.10 to 50.0 volume %, and more preferably 0.10 to 5.00 volume %. When the mixing amount of the anion exchange resin is within the above range, the effect of removing inorganic acid leaked from the H-type chelating resin becomes higher. On the other hand, if the mixing amount of the anion exchange resin is less than the above range, the removal of the acid leaked from the H-type chelating resin becomes insufficient, and inorganic acid is mixed into the treatment liquid; on the other hand, if it is greater than the above range, the acid leaked from the H-type chelate resin will be removed when the treatment When an organic solvent is hydrolyzed in an alkaline environment, there is a risk of hydrolysis of the liquid being processed.
作為使被處理液體接觸混合有陰離子交換樹脂之H型螯合樹脂之方法,並未特別限制,可列舉:將H型螯合樹脂與陰離子交換樹脂之混合物填充於樹脂填充塔,使被處理液體通過樹脂填充塔之方法;在反應槽內使混合物與被處理液體接觸之方法等。The method of bringing the liquid to be treated into contact with the H-type chelate resin mixed with an anion exchange resin is not particularly limited. An example of the method is as follows: filling a resin packed tower with a mixture of the H-type chelating resin and anion exchange resin, so that the liquid to be treated The method of filling the tower with resin; the method of bringing the mixture into contact with the liquid to be treated in the reaction tank, etc.
使被處理液體接觸混合有陰離子交換樹脂之H型螯合樹脂時之處理條件可適當選擇,通液速度較佳為1.0~20L/L-樹脂/hr,特佳為1.0~5.0L/L-樹脂/hr,又,通液溫度較佳為5~60℃,特佳為10~30℃。The treatment conditions when the liquid to be treated contacts the H-type chelating resin mixed with anion exchange resin can be appropriately selected. The liquid flow rate is preferably 1.0 to 20L/L-resin/hr, and particularly preferably 1.0 to 5.0L/L- Resin/hr, and the liquid flow temperature is preferably 5 to 60°C, particularly preferably 10 to 30°C.
在本發明之液體中之金屬去除方法中,由於在H型螯合樹脂的附近存在陰離子交換樹脂,因此陰離子交換樹脂迅速地捕捉因使被處理液體接觸H型螯合樹脂而從H型螯合樹脂漏出之無機酸,可防止無機酸混入處理液體中。In the metal removal method from liquid of the present invention, since an anion exchange resin exists in the vicinity of the H-type chelating resin, the anion-exchange resin quickly captures the metal particles removed from the H-type chelating resin by bringing the liquid to be treated into contact with the H-type chelating resin. The inorganic acid leaked from the resin can prevent the inorganic acid from being mixed into the treatment liquid.
在本發明之液體中之金屬去除方法中,從當被處理液體為在鹼性環境下水解之有機溶劑(例如酯系有機溶劑)時,藉由陰離子交換樹脂為游離鹼型弱鹼性陰離子交換樹脂,可使被處理液體之水解難以發生的觀點來看為較佳。In the method for removing metals from liquids of the present invention, when the liquid to be treated is an organic solvent (such as an ester organic solvent) that is hydrolyzed in an alkaline environment, the anion exchange resin is a free base type weakly basic anion exchanger. The resin is preferable from the viewpoint of making it difficult for the liquid to be treated to undergo hydrolysis.
本發明之陰離子交換樹脂混合H型螯合樹脂係混合有陰離子交換樹脂之H型螯合樹脂, 其特徵為相對於該H型螯合樹脂之該陰離子交換樹脂之混合量為0.10~100.0體積%。The anion exchange resin mixed H-type chelating resin of the present invention is an H-type chelating resin mixed with an anion exchange resin. It is characterized in that the mixing amount of the anion exchange resin relative to the H-type chelating resin is 0.10 to 100.0 volume %.
本發明之陰離子交換樹脂混合H型螯合樹脂的H型螯合樹脂、陰離子交換樹脂,係與本發明之液體中之金屬去除方法的H型螯合樹脂、陰離子交換樹脂相同。The H-type chelate resin and the anion exchange resin of the anion exchange resin mixed H-type chelate resin of the present invention are the same as the H-type chelate resin and the anion exchange resin of the metal removal method from the liquid of the present invention.
本發明之陰離子交換樹脂混合H型螯合樹脂,係混合有陰離子交換樹脂之H型螯合樹脂。換言之,本發明之陰離子交換樹脂混合H型螯合樹脂係H型螯合樹脂與陰離子交換樹脂之混合物。The anion exchange resin mixed H-type chelating resin of the present invention is an H-type chelating resin mixed with anion exchange resin. In other words, the anion exchange resin mixed H-type chelating resin of the present invention is a mixture of H-type chelating resin and anion exchange resin.
本發明之陰離子交換樹脂混合H型螯合樹脂中,陰離子交換樹脂之混合量係相對於H型螯合樹脂而言為0.10~100.0體積%,較佳為0.10~50.0體積%,更佳為0.10~5.00體積%。藉由陰離子交換樹脂之混合量在上述範圍,去除從H型螯合樹脂漏出之無機酸的效果變高。另一方面,若陰離子交換樹脂之混合量小於上述範圍,則從H型螯合樹脂漏出之無機酸的去除變得不充分,在處理液體中混入無機酸;又,若大於上述範圍,則當處理在鹼性環境下水解之有機溶劑時,有被處理液體之水解發生之虞。In the anion exchange resin mixed with the H-type chelating resin of the present invention, the mixing amount of the anion exchange resin is 0.10 to 100.0 volume % relative to the H-type chelating resin, preferably 0.10 to 50.0 volume %, and more preferably 0.10 ~5.00 volume%. When the mixing amount of the anion exchange resin is within the above range, the effect of removing inorganic acid leaked from the H-type chelating resin becomes higher. On the other hand, if the mixing amount of the anion exchange resin is less than the above range, the removal of the inorganic acid leaked from the H-type chelate resin becomes insufficient, and the inorganic acid is mixed into the treatment liquid; on the other hand, if it is greater than the above range, when When handling organic solvents that hydrolyze in an alkaline environment, there is a risk of hydrolysis of the liquid being treated.
去除酯系有機溶劑(例如PGMEA、乙酸異丙酯等在鹼性環境下水解之有機溶劑)中之金屬的用途之情形,從可使被處理液體之水解難以發生的觀點來看,本發明之陰離子交換樹脂混合H型螯合樹脂係以陰離子交換樹脂為游離鹼型弱鹼性陰離子交換樹脂為較佳。 [實施例]The present invention is useful in removing metals from ester-based organic solvents (for example, PGMEA, isopropyl acetate, and other organic solvents that are hydrolyzed in an alkaline environment). The anion exchange resin mixed H-type chelating resin is preferably a free base weakly basic anion exchange resin. [Example]
以下,根據實施例來詳細地說明本發明。惟本發明不限於以下的實施例。Hereinafter, the present invention will be described in detail based on examples. However, the present invention is not limited to the following examples.
(實施例1) 使游離鹼型弱鹼性陰離子交換樹脂B1(0.20mL)混合及分散於H型螯合樹脂A1(200.0mL),製備陰離子交換樹脂混合H型螯合樹脂C1。此時的相對於H型螯合樹脂A1之游離鹼型弱鹼性陰離子交換樹脂B1之混合量為0.10體積%。 其次,將100.0mL的陰離子交換樹脂混合H型螯合樹脂C1填充於內徑1.8cm、高度100cm的壓克力管柱。其次,於管柱內以通液速度1L/hr(SV=10)通過試驗用純水1,收集流出初期的1L。 其次,測定收集液中之氯化物離子濃度。將其結果示於表1。(Example 1) Free base weakly basic anion exchange resin B1 (0.20 mL) was mixed and dispersed in H-type chelating resin A1 (200.0 mL) to prepare anion exchange resin mixed H-type chelating resin C1. At this time, the mixing amount of the free base type weakly basic anion exchange resin B1 with respect to the H type chelating resin A1 was 0.10% by volume. Next, 100.0 mL of anion exchange resin mixed H-type chelating resin C1 was filled into an acrylic column with an inner diameter of 1.8 cm and a height of 100 cm. Next, pure water 1 for testing was passed through the column at a flow rate of 1L/hr (SV=10), and 1L of the initial outflow was collected. Next, measure the chloride ion concentration in the collected solution. The results are shown in Table 1.
・H型螯合樹脂:以1N鹽酸4eq/L-樹脂對Na型的亞胺二乙酸型螯合樹脂(Dow Chemical公司製,Amberlite IRC748(陽離子交換容量1.45eq/L-樹脂,調和平均徑550μm))進行接觸處理者 ・游離鹼型弱鹼性陰離子交換樹脂:Dow Chemical公司製,Amberlite IRA96SB,總交換容量1.32eq/L-樹脂,中性鹽分解容量0.20eq/L-樹脂) ・試驗用純水1:氯化物離子濃度>0.1mg/L・H-type chelating resin: 1N hydrochloric acid 4eq/L-resin to Na-type imine diacetic acid-type chelating resin (manufactured by Dow Chemical Co., Ltd., Amberlite IRC748 (cation exchange capacity 1.45eq/L-resin, blended average diameter 550μm) ))Contact handler ・Free base type weakly basic anion exchange resin: Made by Dow Chemical Co., Ltd., Amberlite IRA96SB, total exchange capacity 1.32eq/L-resin, neutral salt decomposition capacity 0.20eq/L-resin) ・Test pure water 1: chloride ion concentration >0.1mg/L
(實施例2) 使游離鹼型弱鹼性陰離子交換樹脂B1(10.0mL)混合及分散於H型螯合樹脂A1(200.0mL),製備陰離子交換樹脂混合H型螯合樹脂C2。此時的相對於H型螯合樹脂A1之游離鹼型弱鹼性陰離子交換樹脂B1之混合量為5.00體積%。 其次,將100.0mL的陰離子交換樹脂混合H型螯合樹脂C2填充於內徑1.8cm、高度100cm的壓克力管柱。其次,於管柱內以通水速度1L/hr(SV=10)通過試驗用純水1,收集流出初期的1L。 其次,測定收集液中之氯化物離子濃度。將其結果示於表1。(Example 2) Free base weakly basic anion exchange resin B1 (10.0 mL) was mixed and dispersed in H-type chelating resin A1 (200.0 mL) to prepare anion exchange resin mixed H-type chelating resin C2. At this time, the mixing amount of the free base type weakly basic anion exchange resin B1 with respect to the H-type chelating resin A1 was 5.00% by volume. Next, 100.0 mL of anion exchange resin mixed with H-type chelating resin C2 was filled into an acrylic column with an inner diameter of 1.8 cm and a height of 100 cm. Next, pure water 1 for testing was passed through the column at a water flow rate of 1L/hr (SV=10), and 1L of the initial outflow was collected. Next, measure the chloride ion concentration in the collected solution. The results are shown in Table 1.
(實施例3) 使游離鹼型弱鹼性陰離子交換樹脂B1(200.0mL)混合及分散於H型螯合樹脂A1(200.0mL),製備陰離子交換樹脂混合H型螯合樹脂C3。此時的相對於H型螯合樹脂A1之游離鹼型弱鹼性陰離子交換樹脂B1之混合量為100.0體積%。 其次,將100mL的陰離子交換樹脂混合H型螯合樹脂C3填充於內徑1.8cm、高度100cm的壓克力管柱。 其次,於管柱內以通水速度1L/hr(SV=10)通過試驗用純水1,收集流出初期的1L。 其次,測定收集液中之氯化物離子濃度。將其結果示於表1。(Example 3) Free base weakly basic anion exchange resin B1 (200.0 mL) was mixed and dispersed in H-type chelating resin A1 (200.0 mL) to prepare anion exchange resin mixed H-type chelating resin C3. At this time, the mixing amount of the free base type weakly basic anion exchange resin B1 with respect to the H-type chelating resin A1 was 100.0% by volume. Next, 100 mL of anion exchange resin mixed with H-type chelating resin C3 was filled into an acrylic column with an inner diameter of 1.8 cm and a height of 100 cm. Next, pure water 1 for testing was passed through the column at a water flow rate of 1L/hr (SV=10), and 1L of the initial outflow was collected. Next, measure the chloride ion concentration in the collected solution. The results are shown in Table 1.
(比較例1) 將100mL的H型螯合樹脂A1填充於內徑1.8cm、高度100cm的壓克力管柱。 其次,於管柱內以通液速度1L/hr(SV=10)通過試驗用純水1,收集流出初期的1L。 其次,測定收集液中之氯化物離子濃度。將其結果示於表1。(Comparative example 1) Fill 100 mL of H-type chelating resin A1 into an acrylic column with an inner diameter of 1.8 cm and a height of 100 cm. Next, pure water 1 for testing was passed through the column at a flow rate of 1L/hr (SV=10), and 1L of the initial outflow was collected. Next, measure the chloride ion concentration in the collected solution. The results are shown in Table 1.
(比較例2) 使游離鹼型弱鹼性陰離子交換樹脂B1(0.10mL)混合及分散於H型螯合樹脂A1(200.0mL),製備陰離子交換樹脂混合H型螯合樹脂C4。此時的相對於H型螯合樹脂A1之游離鹼型弱鹼性陰離子交換樹脂B1之混合量為0.05體積%。 其次,將100mL的陰離子交換樹脂混合H型螯合樹脂C4填充於內徑1.8cm、高度100cm的壓克力管柱。 其次,於管柱內以通液速度1L/hr(SV=10)通過試驗用純水1,收集流出初期的1L。 其次,測定收集液中之氯化物離子濃度。將其結果示於表1。(Comparative example 2) Free base weakly basic anion exchange resin B1 (0.10 mL) was mixed and dispersed in H-type chelating resin A1 (200.0 mL) to prepare anion exchange resin mixed H-type chelating resin C4. At this time, the mixing amount of the free base type weakly basic anion exchange resin B1 with respect to the H-type chelating resin A1 was 0.05% by volume. Next, 100 mL of anion exchange resin mixed with H-type chelating resin C4 was filled into an acrylic column with an inner diameter of 1.8 cm and a height of 100 cm. Next, pure water 1 for testing was passed through the column at a flow rate of 1L/hr (SV=10), and 1L of the initial outflow was collected. Next, measure the chloride ion concentration in the collected solution. The results are shown in Table 1.
【表1】
使游離鹼型弱鹼性陰離子交換樹脂B1混合於H型螯合樹脂A1,且相對於H型螯合樹脂A1之游離鹼型弱鹼性陰離子交換樹脂B1之混合量在本發明之範圍的實施例1~3,其氯化物離子為偵測極限下限以下,顯示可防止無機酸洩漏。 另一方面,在只有H型螯合樹脂A1,未混合游離鹼型弱鹼性陰離子交換樹脂B1的比較例1中,其氯化物離子多,顯示無機酸之洩漏量多。又,在雖然使游離鹼型弱鹼性陰離子交換樹脂B1混合於H型螯合樹脂A1,然而相對於H型螯合樹脂A1之游離鹼型弱鹼性陰離子交換樹脂B1之混合量少的比較例2中,雖然很少但還是偵測到氯化物離子,因此顯示若相對於H型螯合樹脂A1之游離鹼型弱鹼性陰離子交換樹脂B1之混合量少,則防止無機酸洩漏的效果變得不充分。An implementation in which the free base type weakly basic anion exchange resin B1 is mixed with the H-type chelating resin A1, and the mixing amount of the free base type weakly basic anion exchange resin B1 relative to the H-type chelating resin A1 is within the scope of the present invention. In Examples 1 to 3, the chloride ions are below the detection limit, indicating that inorganic acid leakage can be prevented. On the other hand, in Comparative Example 1, which contains only H-type chelate resin A1 and no free-base type weakly basic anion exchange resin B1, there are many chloride ions, indicating a large amount of leakage of inorganic acid. Furthermore, although the free base type weakly basic anion exchange resin B1 is mixed with the H-type chelating resin A1, the mixing amount of the free base type weakly basic anion exchange resin B1 is smaller than that of the H-type chelating resin A1. In Example 2, chloride ions were detected even though they were very small, thus showing the effect of preventing the leakage of inorganic acid if the mixing amount of the free base type weakly basic anion exchange resin B1 is small compared to the H-type chelating resin A1. become inadequate.
(實施例4) 使游離鹼型弱鹼性陰離子交換樹脂B1(0.20mL)混合及分散於H型螯合樹脂A1(200.0mL),製備陰離子交換樹脂混合H型螯合樹脂C1。此時的相對於H型螯合樹脂A1之游離鹼型弱鹼性陰離子交換樹脂B1之混合量為0.10體積%。 其次,將100.0mL的陰離子交換樹脂混合H型螯合樹脂C1填充於內徑1.8cm、高度100cm的壓克力管柱。 其次,於管柱內以通液速度1L/hr(SV=10)通過試驗用溶劑2,收集流出初期的1L。 其次,測定收集液中之氯化物離子濃度、鈉濃度、乙酸濃度、水分。將其結果示於表2。 ・試驗用溶劑2:PGMEA(聚丙二醇單甲基醚乙酸酯)、氯化物離子濃度>0.1mg/L、乙酸濃度20mg/L、鈉濃度400ng/L、水分130ppm(Example 4) Free base weakly basic anion exchange resin B1 (0.20 mL) was mixed and dispersed in H-type chelating resin A1 (200.0 mL) to prepare anion exchange resin mixed H-type chelating resin C1. At this time, the mixing amount of the free base type weakly basic anion exchange resin B1 with respect to the H type chelating resin A1 was 0.10% by volume. Next, 100.0 mL of anion exchange resin mixed H-type chelating resin C1 was filled into an acrylic column with an inner diameter of 1.8 cm and a height of 100 cm. Next, the test solvent 2 was passed through the column at a flow rate of 1L/hr (SV=10), and 1L of the initial outflow was collected. Next, measure the chloride ion concentration, sodium concentration, acetic acid concentration, and moisture in the collection liquid. The results are shown in Table 2. ・Test solvent 2: PGMEA (polypropylene glycol monomethyl ether acetate), chloride ion concentration >0.1mg/L, acetic acid concentration 20mg/L, sodium concentration 400ng/L, moisture 130ppm
(實施例5) 使游離鹼型弱鹼性陰離子交換樹脂B1(10.0mL)混合及分散於H型螯合樹脂A1(200.0mL),製備陰離子交換樹脂混合H型螯合樹脂C2。此時的相對於H型螯合樹脂A1之游離鹼型弱鹼性陰離子交換樹脂B1之混合量為5.00體積%。 其次,將100mL的陰離子交換樹脂混合H型螯合樹脂C2填充於內徑1.8cm、高度100cm的壓克力管柱。 其次,於管柱內以通液速度1L/hr(SV=10)通過試驗用溶劑2,收集流出初期的1L。 其次,測定收集液中之氯化物離子濃度、鈉濃度、乙酸濃度、水分。將其結果示於表2。(Example 5) Free base weakly basic anion exchange resin B1 (10.0 mL) was mixed and dispersed in H-type chelating resin A1 (200.0 mL) to prepare anion exchange resin mixed H-type chelating resin C2. At this time, the mixing amount of the free base type weakly basic anion exchange resin B1 with respect to the H-type chelating resin A1 was 5.00% by volume. Next, 100 mL of anion exchange resin mixed with H-type chelating resin C2 was filled into an acrylic column with an inner diameter of 1.8 cm and a height of 100 cm. Next, the test solvent 2 was passed through the column at a flow rate of 1L/hr (SV=10), and 1L of the initial outflow was collected. Next, measure the chloride ion concentration, sodium concentration, acetic acid concentration, and moisture in the collection liquid. The results are shown in Table 2.
(實施例6) 使OH型強鹼性陰離子交換樹脂B2(0.20mL)混合及分散於H型螯合樹脂A1(200.0mL),製備陰離子交換樹脂混合H型螯合樹脂C5。此時的相對於H型螯合樹脂A1之OH型強鹼性陰離子交換樹脂B2之混合量為0.10體積%。 其次,將100.0mL的陰離子交換樹脂混合H型螯合樹脂C5填充於內徑1.8cm、高度100cm的壓克力管柱。 其次,於管柱內以通液速度1L/hr(SV=10)通過試驗用溶劑2,收集流出初期的1L。 其次,測定收集液中之氯化物離子濃度、鈉濃度、乙酸濃度、水分。將其結果示於表2。(Example 6) OH type strong basic anion exchange resin B2 (0.20 mL) was mixed and dispersed in H type chelating resin A1 (200.0 mL) to prepare anion exchange resin mixed H type chelating resin C5. At this time, the mixing amount of the OH type strong basic anion exchange resin B2 with respect to the H type chelating resin A1 was 0.10% by volume. Next, 100.0 mL of anion exchange resin mixed with H-type chelating resin C5 was filled into an acrylic column with an inner diameter of 1.8 cm and a height of 100 cm. Next, the test solvent 2 was passed through the column at a flow rate of 1L/hr (SV=10), and 1L of the initial outflow was collected. Next, measure the chloride ion concentration, sodium concentration, acetic acid concentration, and moisture in the collection liquid. The results are shown in Table 2.
(實施例7) 使游離鹼型弱鹼性陰離子交換樹脂B1(200.0mL)混合及分散於H型螯合樹脂A1(200.0mL),製備陰離子交換樹脂混合H型螯合樹脂C3。此時的相對於H型螯合樹脂A1之游離鹼型弱鹼性陰離子交換樹脂B1之混合量為100.0體積%。 其次,將100mL的陰離子交換樹脂混合H型螯合樹脂C3填充於內徑1.8cm、高度100cm的壓克力管柱。 其次,於管柱內以通液速度1L/hr(SV=10)通過試驗用溶劑2,收集流出初期的1L。 其次,測定收集液中之氯化物離子濃度、鈉濃度、乙酸濃度、水分。將其結果示於表2。(Example 7) Free base weakly basic anion exchange resin B1 (200.0 mL) was mixed and dispersed in H-type chelating resin A1 (200.0 mL) to prepare anion exchange resin mixed H-type chelating resin C3. At this time, the mixing amount of the free base type weakly basic anion exchange resin B1 with respect to the H-type chelating resin A1 was 100.0% by volume. Next, 100 mL of anion exchange resin mixed with H-type chelating resin C3 was filled into an acrylic column with an inner diameter of 1.8 cm and a height of 100 cm. Next, the test solvent 2 was passed through the column at a flow rate of 1L/hr (SV=10), and 1L of the initial outflow was collected. Next, measure the chloride ion concentration, sodium concentration, acetic acid concentration, and moisture in the collection liquid. The results are shown in Table 2.
・OH型強鹼性陰離子交換樹脂:Organo公司製Amberjet 4002(OH)-HG,總交換容量及中性鹽分解容量1.05eq/L-樹脂,調和平均徑600μm。・OH type strong basic anion exchange resin: Amberjet 4002(OH)-HG manufactured by Organo Co., Ltd., total exchange capacity and neutral salt decomposition capacity 1.05eq/L-resin, blended average diameter 600μm.
(比較例3) 將100mL的H型螯合樹脂A1填充於內徑1.8cm、高度100cm的壓克力管柱。 其次,於管柱內以通液速度1L/hr(SV=10)通過試驗用溶劑2,收集流出初期的1L。 其次,測定收集液中之氯化物離子濃度、鈉濃度、乙酸濃度、水分。將其結果示於表2。(Comparative example 3) Fill 100 mL of H-type chelating resin A1 into an acrylic column with an inner diameter of 1.8 cm and a height of 100 cm. Next, the test solvent 2 was passed through the column at a flow rate of 1L/hr (SV=10), and 1L of the initial outflow was collected. Next, measure the chloride ion concentration, sodium concentration, acetic acid concentration, and moisture in the collection liquid. The results are shown in Table 2.
(比較例4) 使游離鹼型弱鹼性陰離子交換樹脂B1(0.10mL)混合及分散於H型螯合樹脂A1(200.0mL),製備陰離子交換樹脂混合H型螯合樹脂C4。此時的相對於H型螯合樹脂A1之游離鹼型弱鹼性陰離子交換樹脂B1之混合量為0.05體積%。 其次,將100.0mL的陰離子交換樹脂混合H型螯合樹脂C4填充於內徑1.8cm、高度100cm的壓克力管柱。 其次,於管柱內以通液速度1L/hr(SV=10)通過試驗用溶劑2,收集流出初期的1L。 其次,測定收集液中之氯化物離子濃度、鈉濃度、乙酸濃度、水分。將其結果示於表2。(Comparative example 4) Free base weakly basic anion exchange resin B1 (0.10 mL) was mixed and dispersed in H-type chelating resin A1 (200.0 mL) to prepare anion exchange resin mixed H-type chelating resin C4. At this time, the mixing amount of the free base type weakly basic anion exchange resin B1 with respect to the H-type chelating resin A1 was 0.05% by volume. Next, 100.0 mL of anion exchange resin mixed with H-type chelating resin C4 was filled into an acrylic column with an inner diameter of 1.8 cm and a height of 100 cm. Next, the test solvent 2 was passed through the column at a flow rate of 1L/hr (SV=10), and 1L of the initial outflow was collected. Next, measure the chloride ion concentration, sodium concentration, acetic acid concentration, and moisture in the collection liquid. The results are shown in Table 2.
(比較例5) 使游離鹼型弱鹼性陰離子交換樹脂B1(250.0mL)混合及分散於H型螯合樹脂A1(200.0mL),製備陰離子交換樹脂混合H型螯合樹脂C6。此時的相對於H型螯合樹脂A1之游離鹼型弱鹼性陰離子交換樹脂B1之混合量為125.0體積%。 其次,將100.0mL的陰離子交換樹脂混合H型螯合樹脂C6填充於內徑1.8cm、高度100cm的壓克力管柱。 其次,於管柱內以通液速度1L/hr(SV=10)通過試驗用溶劑2,收集流出初期的1L。 其次,測定收集液中之氯化物離子濃度、鈉濃度、乙酸濃度、水分。將其結果示於表2。(Comparative example 5) Free base weakly basic anion exchange resin B1 (250.0 mL) was mixed and dispersed in H-type chelating resin A1 (200.0 mL) to prepare anion exchange resin mixed H-type chelating resin C6. At this time, the mixing amount of the free base type weakly basic anion exchange resin B1 with respect to the H type chelating resin A1 was 125.0% by volume. Next, 100.0 mL of anion exchange resin mixed with H-type chelating resin C6 was filled into an acrylic column with an inner diameter of 1.8 cm and a height of 100 cm. Next, the test solvent 2 was passed through the column at a flow rate of 1L/hr (SV=10), and 1L of the initial outflow was collected. Next, measure the chloride ion concentration, sodium concentration, acetic acid concentration, and moisture in the collection liquid. The results are shown in Table 2.
(比較例6) 將100.0mL的強酸性陽離子交換樹脂D1填充於內徑1.8cm、高度100cm的壓克力管柱。 其次,於管柱內以通液速度1L/hr(SV=10)通過試驗用溶劑2,收集流出初期的1L。 其次,測定收集液中之氯化物離子濃度、鈉濃度、乙酸濃度、水分。將其結果示於表2。(Comparative example 6) 100.0 mL of strongly acidic cation exchange resin D1 was filled into an acrylic column with an inner diameter of 1.8 cm and a height of 100 cm. Next, the test solvent 2 was passed through the column at a flow rate of 1L/hr (SV=10), and 1L of the initial outflow was collected. Next, measure the chloride ion concentration, sodium concentration, acetic acid concentration, and moisture in the collection liquid. The results are shown in Table 2.
・強酸性陽離子交換樹脂D1:Dow Chemical公司製,Amberjet 1024H,總交換容量:2.25eq/L-樹脂,調和平均徑650μm・Strongly acidic cation exchange resin D1: Made by Dow Chemical Co., Ltd., Amberjet 1024H, total exchange capacity: 2.25eq/L-resin, blended average diameter 650μm
【表2】
使游離鹼型弱鹼性陰離子交換樹脂B1或OH型強鹼性陰離子交換樹脂B2混合於H型螯合樹脂A1,且相對於H型螯合樹脂A1之陰離子交換樹之混合量在本發明之範圍的實施例4~7,其氯化物離子為偵測極限下限以下,顯示可防止無機酸洩漏。又,在實施例4~7中,由於乙酸濃度沒有變化、或變化小,因此顯示未發生溶劑之水解、或即使發生也止於少量。 另一方面,在只有H型螯合樹脂A1,未混合游離鹼型弱鹼性陰離子交換樹脂B1的比較例3中,其氯化物離子多,顯示無機酸之洩漏量多。又,在雖然使游離鹼型弱鹼性陰離子交換樹脂B1混合於H型螯合樹脂A1,然而相對於H型螯合樹脂A1之游離鹼型弱鹼性陰離子交換樹脂B1之混合量少的比較例4中,雖然很少但還是偵測到氯化物離子,顯示若相對於H型螯合樹脂A1之游離鹼型弱鹼性陰離子交換樹脂B1之混合量少,則防止無機酸洩漏的效果變得不充分。又,在相對於H型螯合樹脂A1之游離鹼型弱鹼性陰離子交換樹脂B1之混合量多的比較例5、及僅使用強酸性陽離子交換樹脂D1的比較例6中,雖然未偵測到氯化物離子,然而乙酸濃度成為2~5倍,顯示溶劑水解大量發生。The free base type weakly basic anion exchange resin B1 or the OH type strong basic anion exchange resin B2 is mixed with the H-type chelating resin A1, and the mixing amount of the anion exchange tree relative to the H-type chelating resin A1 is within the range of the present invention. In Examples 4 to 7 of the range, the chloride ions are below the detection limit, indicating that leakage of inorganic acid can be prevented. Furthermore, in Examples 4 to 7, since the acetic acid concentration did not change or the change was small, it was shown that hydrolysis of the solvent did not occur or, even if it occurred, it was limited to a small amount. On the other hand, in Comparative Example 3, which contains only H-type chelate resin A1 and no free-base type weakly basic anion exchange resin B1, there are many chloride ions, indicating a large amount of leakage of inorganic acid. Furthermore, although the free base type weakly basic anion exchange resin B1 is mixed with the H-type chelating resin A1, the mixing amount of the free base type weakly basic anion exchange resin B1 is smaller than that of the H-type chelating resin A1. In Example 4, chloride ions were detected even though they were very small. This shows that if the mixing amount of the free base type weakly basic anion exchange resin B1 is small compared to the H-type chelating resin A1, the effect of preventing the leakage of inorganic acid will be reduced. Not enough. Furthermore, in Comparative Example 5 in which a large amount of the free base type weakly basic anion exchange resin B1 was mixed with respect to the H-type chelate resin A1, and in Comparative Example 6 in which only the strongly acidic cation exchange resin D1 was used, no detection was performed. However, the acetic acid concentration became 2 to 5 times higher than that of chloride ions, indicating that solvent hydrolysis occurred in large quantities.
無。without.
Claims (7)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018082243A JP7213023B2 (en) | 2018-04-23 | 2018-04-23 | METHOD FOR REMOVING METAL IN LIQUID AND H-TYPE CHELATE RESIN MIXED WITH ANION EXCHANGE RESIN |
JP2018-082243 | 2018-04-23 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201943650A TW201943650A (en) | 2019-11-16 |
TWI827592B true TWI827592B (en) | 2024-01-01 |
Family
ID=68293972
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW108113136A TWI827592B (en) | 2018-04-23 | 2019-04-16 | Method for removing metals in liquid, and anion exchange resin-mixed h-type chelating resin |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP7213023B2 (en) |
TW (1) | TWI827592B (en) |
WO (1) | WO2019207995A1 (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7437276B2 (en) | 2020-09-18 | 2024-02-22 | オルガノ株式会社 | Ion exchanger analysis method and ion exchanger pretreatment device |
JPWO2022209233A1 (en) | 2021-03-31 | 2022-10-06 | ||
JP2023059066A (en) * | 2021-10-14 | 2023-04-26 | オルガノ株式会社 | Purification method for acid solution |
JP7421019B1 (en) | 2022-10-06 | 2024-01-23 | オルガノ株式会社 | Method for producing cation exchange resin and method for purifying organic acid solution |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52123554A (en) * | 1976-04-06 | 1977-10-17 | Bayer Ag | Method of selectively removing heavy metal |
JP2001228635A (en) * | 2000-02-16 | 2001-08-24 | Sumitomo Chem Co Ltd | Apparatus for preparing processing liquid for electronic parts and method for preparing the same |
JP2005215627A (en) * | 2004-02-02 | 2005-08-11 | Japan Organo Co Ltd | Method and apparatus for regenerating resist-peeling waste liquid |
TW201237885A (en) * | 2010-12-15 | 2012-09-16 | Electric Power Res Inst | Light water reactor primary coolant activity cleanup |
JP2014237131A (en) * | 2011-09-06 | 2014-12-18 | 三菱レイヨン株式会社 | Water purification cartridge and water purifier |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60225689A (en) * | 1984-04-23 | 1985-11-09 | Japan Organo Co Ltd | Treatment of waste boric acid solution |
JP2001269664A (en) | 2000-01-20 | 2001-10-02 | Godo Shigen Sangyo Kk | Treatment method of contaminant to make it almost insoluble |
JP5435708B2 (en) * | 2009-04-27 | 2014-03-05 | 日本フイルコン株式会社 | Metal adsorbent sintered porous body and method for producing the same |
-
2018
- 2018-04-23 JP JP2018082243A patent/JP7213023B2/en active Active
-
2019
- 2019-03-13 WO PCT/JP2019/010156 patent/WO2019207995A1/en active Application Filing
- 2019-04-16 TW TW108113136A patent/TWI827592B/en active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52123554A (en) * | 1976-04-06 | 1977-10-17 | Bayer Ag | Method of selectively removing heavy metal |
JP2001228635A (en) * | 2000-02-16 | 2001-08-24 | Sumitomo Chem Co Ltd | Apparatus for preparing processing liquid for electronic parts and method for preparing the same |
JP2005215627A (en) * | 2004-02-02 | 2005-08-11 | Japan Organo Co Ltd | Method and apparatus for regenerating resist-peeling waste liquid |
TW201237885A (en) * | 2010-12-15 | 2012-09-16 | Electric Power Res Inst | Light water reactor primary coolant activity cleanup |
JP2014237131A (en) * | 2011-09-06 | 2014-12-18 | 三菱レイヨン株式会社 | Water purification cartridge and water purifier |
Also Published As
Publication number | Publication date |
---|---|
TW201943650A (en) | 2019-11-16 |
WO2019207995A1 (en) | 2019-10-31 |
JP7213023B2 (en) | 2023-01-26 |
JP2019188300A (en) | 2019-10-31 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI827592B (en) | Method for removing metals in liquid, and anion exchange resin-mixed h-type chelating resin | |
US11759774B2 (en) | Purification process for hydrophilic organic solvent | |
TW202225131A (en) | Method for purifying organic solvent | |
CN111699040B (en) | Method for purifying liquid to be treated | |
TWI485003B (en) | Method for producing tetraalkylammonium salt solution | |
CN113490658B (en) | Refining method of organic solvent | |
TW200906732A (en) | Method for the treatment of tetraalkylammonium ion-containing development waste liquor | |
WO2022030380A1 (en) | Polar organic solvent purification method, polar organic solvent purification device, analysis method and purified polar organic solvent production method | |
TWI732106B (en) | Method for treating tetrafluoroborate-containing wastewater | |
WO2015016230A1 (en) | Preparation method of aqueous tetraalkyl ammonium salt solution | |
WO2022102263A1 (en) | Purification method and purification apparatus for liquid to be processed containing tetraalkylammonium ions | |
WO2023062925A1 (en) | Acid solution purification method | |
JP2022545155A (en) | Process for purifying organic solvents | |
TW202302499A (en) | Method for refining hydrolyzable organic solvent, and method for producing resin for refining hydrolyzable organic solvent | |
WO2023210370A1 (en) | Organic solvent purification method and purification apparatus | |
TW202306646A (en) | Refining method and refining device for non-aqueous liquid, and production method and pretreatment device for ion exchange resin | |
JP2023081615A (en) | Method for removing impurity of organic solvent | |
KR20220058728A (en) | Method for processing a boron selective adsorption resin for use in the production of ultrapure water | |
CN117083124A (en) | Method and apparatus for producing dry ion exchange resin, and method and apparatus for purifying liquid to be treated | |
JP2008264670A (en) | Method for manufacturing anion exchange resin, anion exchange, mixed bed resin and method for manufacturing ultrapure water for cleaning electric appliance/material | |
CN104744269A (en) | Process for improved recovery of onium hydroxide from compositions containing process residues |