TWI826808B - Electromagnetic wave transmission board and method for manufacturing the same - Google Patents

Abstract

An electromagnetic wave transmission board includes an inner plate, a first outer plate, a second outer plate, a first plated bump, a first conductive bump, a second plated bump and a second conductive bump. The inner plate defines a through hole, a plated metal layer is disposed on the hole wall of the through hole. The first plated bump and the first conductive bump each is disposed between the first outer plate and the inner plate and surrounds the hole. The second plated bump and the second conductive bump each is disposed between the second outer plate and the inner plate and surrounds the hole. The plated metal layer, the first plated bump, the first conductive bump, the first outer plate, the second outer plate, the second conductive bump, and the second plated bump surroundingly defines a chamber filled with air. The electromagnetic wave transmission board is configured to transmit electromagnetic wave signal through the chamber.

Description

Radio wave transmission board and manufacturing method thereof

The present application relates to the technical field of circuit boards, and in particular to a circuit board assembly formed by connecting a plurality of circuit boards and a manufacturing method thereof.

Commonly used composite panels that can be used to transmit radio wave signals have a cavity formed inside them, and the radio wave signals are transmitted through the cavity. The composite panel is generally made by laminating an outer panel on both sides of an inner panel with a through hole and sealing the through hole. However, during the process of laminating the composite board, the colloid used to bond the outer layer board and the inner layer board easily flows into the through hole, and the colloid cannot block the flow through the cavity. transmitted radio signals.

In view of this, it is necessary to provide a radio wave transmission board and a manufacturing method thereof that can solve the above technical problems.

On the one hand, the present application provides a radio wave transmission board, including: an inner layer board provided with a through hole, the hole wall of the through hole is provided with a metal plating layer; a first outer layer board disposed on one side of the inner layer board and covering it One end of the through hole; a second outer layer plate, disposed on a side of the inner layer plate away from the first outer layer plate and covering the other end of the through hole; a first electroplating bump, disposed on the inner layer disposed between the layer board and the first outer layer board and surrounding the through hole; A first conductive bump is sandwiched between the inner layer board and the first outer layer board and is arranged around the first electroplating bump; a first adhesive layer is sandwiched between the inner layer board and the first outer layer board. between the first outer layer plates and located on the side of the first conductive bump away from the first electroplating bump; a second electroplating bump located between the inner layer plate and the second outer layer plate and is arranged around the through hole; a second conductive bump is sandwiched between the inner layer board and the second outer layer board and is arranged around the second electroplating bump; a second adhesive layer is sandwiched between the between the inner layer board and the second outer layer board and located on the side of the second conductive bump away from the second electroplating bump; wherein, the metal plating layer, the first electroplating bump, the The first conductive bump, the first outer layer plate, the second electroplating bump, the second conductive bump and the second outer layer plate are surrounded by a cavity filled with air, and the radio wave transmission The board can use the air in the cavity as a conductive medium to transmit electric wave signals.

Another aspect of the present application provides a method for manufacturing a radio wave transmission board, which includes the following steps: providing an inner layer board, the inner layer board is provided with through holes penetrating its opposite sides, and the wall of the through hole is formed with a metal Plating; providing a first substrate, electroplating to form a first plating bump on one of the first substrate and the inner layer board, and electroplating on the other of the first substrate and the inner layer board First conductive bumps are formed by printing on one of the second substrate and the inner layer board; a second substrate is provided, and a second electroplating bump is formed on one of the second substrate and the inner layer board; Second conductive bumps are printed on the other of the inner layers; a first glue layer with a first opening and a second glue layer with a second opening are provided, wherein the first opening is used for The first conductive bump and the first plating bump are allowed to pass through, and the second opening is used to allow the second conductive bump and the second plating bump to pass through; The first substrate, the first adhesive layer, the inner layer board, the second adhesive layer and the second substrate are sequentially pressed together, wherein the first electroplating bump is located at The first conductive bump is disposed between the first substrate and the inner layer board and surrounds the through hole, and the first conductive bump is sandwiched between the first substrate and the inner layer board and surrounds the first electroplating Bumps are arranged, the second electroplating bumps are located between the second substrate and the inner layer board and are arranged around the through holes, and the second conductive bumps are sandwiched between the second substrate and the inner layer board. The inner layer boards are arranged between and around the through holes; circuits are produced on the first substrate and the second substrate respectively to obtain a first outer layer board and a second outer layer board.

In the radio wave transmission board and its manufacturing method provided by this application, by arranging the first conductive bump and the first electroplating bump between the inner layer board and the first outer layer board, it can effectively Block the first glue layer from flowing into the cavity; by arranging the second conductive bump and the second plating bump between the inner layer board and the second outer layer board, it is possible to prevent the first glue layer from flowing into the cavity. Effectively blocking the second glue layer from flowing into the cavity; and the first conductive bump, the first plating bump, the second conductive bump and the second plating bump define a portion The cavity can effectively block the radio signal transmitted through the cavity.

100: Radio wave transmission board

10:Inner layer board

20:First outer layer board

30:Second outer layer board

41: First glue layer

42:Second glue layer

51: First plating bump

52: Second plating bump

61: First conductive bump

62: Second conductive bump

11: First conductive layer

12: Second conductive layer

13:Insulation layer

14:Third conductive layer

101:Through hole

16:Metal plating

111:First shielding department

121:Second shielding department

21:First grassroots level

22: First conductive circuit layer

23: Second conductive circuit layer

24: First conductive structure

31:The second grassroots level

32: The third conductive circuit layer

33: The fourth conductive circuit layer

34: Second conductive structure

221: first groove

321: Second groove

201:Through hole

90: Filling parts

110: Plating hole

70:Active components

80:Antenna

11a: Third groove

12a, 32a: fourth groove

210:Laminated structure

211: First metal layer

212: Second metal layer

220: First substrate

230: Second substrate

222: The third metal layer

232: The fourth metal layer

401:First opening

402:Second opening

FIG. 1A is a schematic cross-sectional view of the radio wave transmission board provided in the first embodiment of the present application.

FIG. 1B is a schematic cross-sectional view of the radio wave transmission board provided in the second embodiment of the present application.

Figure 2 is a schematic cross-sectional view of a stacked structure provided by an embodiment of the present application.

FIG. 3 is a schematic cross-sectional view after forming an inner layer plate on the laminated structure shown in FIG. 2 .

FIG. 4 is a schematic cross-sectional view of a first substrate and a second substrate respectively provided on both sides of the inner layer board shown in FIG. 3 .

FIG. 5A is a schematic cross-sectional view after forming electroplating bumps on the first substrate and the inner layer board shown in FIG. 4 .

FIG. 5B-1 is a bottom view of the first substrate according to the first embodiment of the present application.

Figure 5B-2 is a bottom view of the first substrate according to the second embodiment of the present application.

FIG. 5C is a schematic cross-sectional view after forming grooves on the inner layer plate and the second substrate shown in FIG. 5A.

FIG. 6 is a schematic cross-sectional view after printing and forming conductive blocks on the inner layer board and the second substrate shown in FIG. 5A.

FIG. 7 is a top view of the second substrate shown in FIG. 6 .

FIG. 8 is a schematic cross-sectional view after the inner layer plate, the first substrate and the second substrate shown in FIG. 6 are pressed together.

FIG. 9 is a schematic cross-sectional view after forming plating holes on the structure shown in FIG. 8 .

The technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope of protection of the present invention.

It should be noted that, unless otherwise defined, all technical and scientific terms used herein have the same meanings as commonly understood by those skilled in the technical field belonging to the present invention. The terminology used in the embodiments of the present invention is for the purpose of describing particular embodiments only and is not intended to limit the present invention.

Please refer to Figure 1A. The radio wave transmission board 100 according to an embodiment of the present application includes an inner layer board 10, a first outer layer board 20, a second outer layer board 30, a first glue layer 41, a second glue layer 42, and a first electroplating bump. 51. The second electroplating bump 52, the first conductive bump 61 and the second conductive bump 62.

The inner layer board 10 includes a first conductive layer 11 and a second conductive layer 12 located on the outside and an insulating layer 13 located between the first conductive layer 11 and the second conductive layer 12 . The first conductive layer 11 and the second conductive layer 12 are arranged opposite to each other. In some embodiments, the inner layer board 10 has a multi-layer board structure, which may also have a plurality of third conductive layers 14 located between the first conductive layer 11 and the second conductive layer 12. The inner layer Two adjacent conductive layers in the board 10 are isolated by the insulating layer 13 .

The inner layer board 10 is provided with a through hole 101 that penetrates the first conductive layer 11 , the second conductive layer 12 and the insulating layer 13 . A metal plating layer 16 is provided on the side wall of the through hole 101 . The first conductive layer 11 includes a first shielding portion 111 disposed adjacent to the through hole 101 , and the second conductive layer 12 includes a second shielding portion 121 disposed adjacent to the through hole 101 . The first shielding part 111 and the second shielding part 121 are respectively connected to both ends of the metal plating layer 16 .

The first outer layer board 20 and the second outer layer board 30 are respectively disposed on the first conductive layer 11 and the second conductive layer 12 and cover opposite ends of the through hole 101 . The first outer panel 20 , the second outer panel 30 and the inner panel 10 can be combined by stacking and pressing.

The first outer layer board 20 includes a first base layer 21 and a first conductive circuit layer 22 and a second conductive circuit layer 23 disposed on two opposite surfaces of the first base layer 21 . The first outer layer board 20 further includes a first conductive structure 24 , and the first conductive structure 24 is electrically connected to the first conductive circuit layer 22 and the second conductive circuit layer 23 . In this embodiment, the first conductive structure 24 is a conductive hole.

The second outer layer board 30 includes a second base layer 31 and third conductive circuit layers 32 and fourth conductive circuit layers disposed on two opposite surfaces of the second base layer 31 . The second outer layer board 30 further includes a second conductive structure 34 , and the second conductive structure 34 is electrically connected to the third conductive circuit layer 32 and the fourth conductive circuit layer 33 . In this embodiment, the second conductive structure 34 is a conductive hole.

The insulating layer 13, the first base layer 21 and the second base layer 31 can all be made of rigid materials, such as glass fiber prepreg, carbon fiber prepreg, Epoxy resin, etc. The insulation layer 13 , the first base layer 21 and the second base layer 31 may also be made of flexible materials, such as polyester, polyimide, etc.

The first plating bump 51 is disposed between the first conductive layer 11 and the first conductive circuit layer 22 and surrounds the through hole 101 . The first electroplated bumps 51 are formed on the first conductive circuit layer 22 by electroplating so that the first electroplated bumps 51 are closely combined with the first conductive circuit layer 22, and the first electroplated bumps One end of the block 51 away from the first conductive circuit layer 22 may or may not be in contact with the first conductive layer 11 . The first conductive bump 61 is arranged around the first electroplating bump 51 , and the first conductive bump 61 is sandwiched between the first conductive layer 11 and the first conductive line. between road layers 22. The first conductive bumps 61 and the first electroplating bumps 51 may be spaced apart or connected. The first conductive bumps 61 are formed on the first conductive layer 11 through a printing process so that the first conductive bumps 61 are closely combined with the first conductive layer 11, and are formed through a lamination process. One end of the first conductive bump 61 away from the first conductive layer 11 is in contact with the first conductive circuit layer 22 . In this embodiment, the first conductive bump 61 is provided on the first shielding part 111 .

The second plating bump 52 is disposed between the second conductive layer 12 and the third conductive circuit layer 32 and surrounds the through hole 101 . The second electroplating bumps 52 are formed on the second conductive layer 12 by electroplating so that the second electroplating bumps 52 are closely combined with the second conductive layer 12, and the second electroplating bumps 52 One end away from the second conductive layer 12 may or may not be in contact with the third conductive circuit layer 32 . The second conductive bumps 62 are arranged around the second electroplating bumps 52 , and the second conductive bumps 62 are sandwiched between the second conductive layer 12 and the third conductive circuit layer 32 . The second conductive bumps 62 and the second electroplating bumps 52 may be spaced apart or connected. The second conductive bumps 62 are formed on the third conductive circuit layer 32 through a printing process so that the second conductive bumps 62 and the third conductive circuit layer 32 are closely combined, and through a lamination process The end of the second conductive bump 62 away from the third conductive circuit layer 32 is in contact with the second conductive layer 12 . In this embodiment, the second conductive bump 70 is disposed on the second shielding part 121 .

In some embodiments, the radio wave transmission board 100 may further include a plurality of first electroplating bumps 51 , a plurality of second electroplating bumps 52 , a plurality of first conductive bumps 61 and a plurality of second conductive bumps 62 . The first electroplating bumps 51 are spaced apart from each other and arranged around the through hole 101 . The plurality of second electroplating bumps 52 are spaced apart from each other and arranged around the through hole 101 . The plurality of first conductive bumps 61 are spaced apart from each other. The plurality of first electroplating bumps 51 are arranged and arranged around them. The plurality of second conductive bumps 62 are arranged at intervals from each other and are arranged around the plurality of second electroplating bumps 52 .

In some embodiments, the thickness of the first electroplating bump 51 and the second electroplating bump 52 are both 30 μm ~ 80 μm, and the width is 0.2 mm ~ 0.5 mm; the first conductive bump 61 and the The thickness of the second conductive bumps 62 is 0.008mm~0.125mm, and the width is 0.25mm~0.35mm.

In some embodiments, the first conductive bump 61 and the second conductive bump 62 are made of conductive paste.

The first conductive circuit layer 22 of the first outer layer board 20, the first electroplating bump 51, the first conductive bump 61, the first shielding portion 111 of the first conductive layer 11, the metal The plating layer 16 , the second shielding portion 121 of the second conductive layer 12 , the second plating bumps 52 , the second conductive bumps 62 and the third conductive circuit layer 32 of the second outer layer plate 30 surround A cavity 102 is formed. The medium contained in the cavity 102 is air, and the radio wave transmission board 10 can use the air in the cavity 102 as a conductive medium to transmit radio wave signals. The first electroplating bump 51, the first conductive bump 61, the first shielding part 111, the metal plating layer 16, the second shielding part 121, the second electroplating bump 52 and the The second conductive bump 62 can block the radio wave signal in the cavity 102 and provide an electromagnetic shielding effect.

Because the first electroplated bumps 51 are electroplated and formed on the first conductive circuit layer 22 of the first outer layer board 20 , and the first conductive bumps 61 are printed and formed on the first conductive layer of the inner layer board 10 on the layer 11 , so that the radio wave signal transmitted in the cavity 102 is difficult to pass from the joint between the first electroplating bump 51 and the first outer layer plate 20 and the first conductive bump 61 and the The leakage at the joint between the inner layer boards 10 reduces the leakage of radio wave signals from the space between the first outer layer board 20 and the inner layer board 10 . Because the second electroplated bumps 52 are electroplated and formed on the second conductive layer 12 of the inner layer board 10 , and the second conductive bumps 62 are printed and formed on the third conductive lines of the second outer layer board 30 on the layer 32 , so that the radio wave signal transmitted in the cavity 102 is difficult to pass from the joint between the second electroplating bump 52 and the inner layer board 10 and the second conductive bump 62 and the Leakage at the joint between the second outer layer boards 30 reduces the leakage of radio wave signals from the space between the second outer layer board 30 and the inner layer board 10 .

In other embodiments, the first electroplating bump 51 can be electroplated and formed on the inner layer board 10, and its end away from the inner layer board 10 may or may not be in contact with the first outer layer board 20; At the same time, the first conductive bump 61 is printed and formed on the first outer layer board 20 , and its end away from the first outer layer board 20 is in contact with the inner layer board 10 through a lamination process. The second plating bump 52 It can be electroplated and formed on the second outer layer board 30, and its end away from the second outer layer board 30 can be in contact with the inner layer board 10 or not; at the same time, the second conductive bumps 62 are printed and formed on On the inner layer board 10, one end thereof away from the inner layer board 10 is in contact with the second outer layer board 30 through a lamination process.

A first groove 221 is provided on the first conductive circuit layer 22 . A portion of the first base layer 21 is exposed from the first groove 221 . A second groove 321 is provided on the third conductive circuit layer 32 , and the second groove 321 exposes a portion of the second base layer 31 . Both the first groove 221 and the second groove 321 are connected with the cavity 102 . The cavity 102 can receive and output an electric wave signal through the first groove 221 and the second groove 321 respectively.

The first glue layer 41 is disposed between the first outer layer board 20 and the inner layer board 10 , and is located on the side of the first conductive bump 61 away from the first electroplating bump 51 . The first glue layer 41 bonds the first outer layer board 20 and the inner layer board 10 . The first glue layer 41 is blocked by the first conductive bump 50 so that it cannot flow into the cavity 102 .

The second glue layer 42 is disposed between the second outer layer board 30 and the inner layer board 10 , and is located on the side of the second conductive bump 62 away from the second electroplating bump 52 . The second glue layer 42 adheres the second outer panel 30 and the inner panel 10 . The second glue layer 42 is blocked by the second conductive bump 62 so that it cannot flow into the cavity 102 .

The first outer layer plate 20 is also provided with a through hole 201, and the through hole 201 connects the cavity 102 with the external environment. During the process of assembling the radio wave transmission board 100, the air in the cavity 102 expanded due to high temperature escapes to the external environment through the through holes 201. In this embodiment, the through hole 201 is connected with the first groove 221 .

The radio wave transmission board 100 further includes a filling piece 90 that is filled in the through hole 201 to seal the cavity 102 .

The radio wave transmission board 100 also includes electroplated holes 110 . The plating holes 110 sequentially penetrate the first outer layer board 20 , the first glue layer 41 , the inner layer board 10 , the second glue layer 42 and the second outer layer board 30 , and are electrically connected to them. The first outer panel 20 , the inner panel 10 and the second outer panel 30 .

The radio wave transmission board 100 also includes an active element 70 and an antenna 80 . The active component 70 is disposed on the second conductive circuit layer 23 . The antenna 80 is disposed on the surface of the second base layer 31 away from the inner layer board 10 and is electrically connected to the fourth conductive circuit layer 33 . The external radio wave signal received by the antenna 80 is transmitted to the active element 70 through the cavity 102 , or the radio wave signal emitted by the active element 70 is transmitted to the antenna 80 through the cavity 102 . In some embodiments, the position of the active element 70 and the position of the antenna 80 both correspond to the position of the cavity 102 . The antenna 80 may be a patch antenna.

Referring to FIG. 1B , in some embodiments, the first conductive layer 11 is provided with a third groove 11 a , and the second conductive layer 12 is provided with a fourth groove 12 a . Both the third groove 11 a and the fourth groove 12 a can expose part of the insulating layer 13 . The first conductive bumps 61 and the second conductive bumps 62 are printed and formed on the first conductive layer 11 and the second conductive layer 12 respectively. The first electroplated bump 51 is electroplated and formed on the first conductive circuit layer 22 , and one end of the bump 51 away from the first outer layer board 20 is received in the third groove 11 a to further block the first electroplated bump 51 . The glue layer 41 flows into the cavity 102 . The second electroplated bump 52 is electroplated and formed on the third conductive circuit layer 32 , and one end thereof away from the second outer layer board 30 is accommodated in the fourth groove 12 a to further block the third conductive circuit layer 32 . The second glue layer 42 flows into the cavity 102 . Wherein, the width of the first electroplating bump 51 and the second electroplating bump 52 may be greater than 0.15mm~0.25mm.

The embodiment of the present application also provides a method for manufacturing the above-mentioned radio wave transmission board 100, which includes the following steps.

Step S1, please refer to FIG. 2, providing a stacked structure 210. The stacked structure 210 includes a first metal layer 211 , a second metal layer 212 , and a plurality of third conductive layers 14 and a plurality of insulating layers 13 located between the first metal layer 211 and the second metal layer 212 . The plurality of third conductive layers 14 are isolated from each other, and the third conductive layer 14 is isolated from the first metal layer 211 and the second metal layer 212 by the insulating layer 13 .

Step S2, please refer to Figure 3, forming a through hole 101 on the laminated structure, performing circuit fabrication on the first metal layer and the second metal layer to form a first conductive layer 11 and a second conductive layer 12, The hole wall of the through hole 101 is electroplated to form a metal plating layer 16 to obtain the inner layer plate 10 . The first conductive layer 11 includes a first shielding portion 111 disposed adjacent to the through hole 101 , and the second conductive layer 12 includes a second shielding portion 121 disposed adjacent to the through hole 101 .

In step S3, please refer to FIG. 4. A first substrate 220 and a second substrate 230 are provided on opposite sides of the inner layer board 10.

The first substrate 220 includes a first base layer 21 , a first conductive circuit layer 22 disposed on one side of the first base layer 21 , and a third metal layer 222 disposed on the other side of the first base layer 21 . A first groove 221 is formed on the first conductive circuit layer 22 to expose a portion of the first base layer 21 .

The second substrate 230 includes a second base layer 31 , a third conductive circuit layer 32 disposed on one side of the second base layer 31 , and a fourth metal layer 232 disposed on the other side of the second base layer 31 . A second groove 321 is formed on the third conductive circuit layer 32 to expose a portion of the second base layer 31 .

Step S4 , please refer to FIG. 5A , electroplating is performed on the first conductive circuit layer 22 to form first electroplating bumps 51 , and electroplating is performed on the second conductive layer 12 to form second electroplating bumps 52 .

Referring to FIG. 5B-1 , the first electroplating bumps 51 are annularly disposed on the first conductive circuit layer 22 . The second electroplated bumps are also annularly disposed on the second conductive layer.

Referring to FIG. 5B-2 , a plurality of first electroplating bumps 51 are formed by electroplating on the first conductive circuit layer 22 , and the plurality of first electroplating bumps 51 are arranged in a ring. A plurality of second electroplating bumps can also be formed on the second conductive layer by electroplating, and the plurality of second electroplating bumps are arranged in a ring.

Referring to FIG. 5C , a third groove 11 a is formed on the first conductive layer 11 , and a fourth groove 32 a is formed on the third conductive circuit layer 32 . The third groove 11 a is used to accommodate a part of the first electroplating bump 51 , and the fourth groove 32 a is used to accommodate a part of the second electroplating bump 52 .

Step S5 , please refer to FIG. 6 , printing first conductive bumps 61 and second conductive bumps 62 on the first conductive layer 11 and the third conductive circuit layer 32 respectively. The first conductive bump 61 and the second conductive bump 62 are annular. Referring to FIG. 7 , a plurality of second conductive bumps 62 are printed on the third conductive circuit layer 32 . The plurality of second conductive bumps 62 are spaced apart from each other and arranged in a ring. The first conductive layer may also be electroplated to form a plurality of first conductive bumps 61 spaced apart from each other and arranged in a ring.

Step S6, please refer to Figure 8, provide a first glue layer 41 and a second glue layer 42, and combine the first substrate 220, the first glue layer 41, the inner layer board 10, and the second glue layer. 42 and the second substrate 230 are pressed together in sequence. The first adhesive layer 41 has a first opening 401 for allowing the first conductive bump 61 and the first plating bump 51 to pass through during lamination. The second adhesive layer 42 has a second opening 402 for allowing the second conductive bump 62 and the second plating bump 52 to pass through during lamination.

After pressing, the first electroplating bump 51 is arranged around the through hole 101 , the first conductive bump 61 is arranged around the first electroplating bump 51 and the first conductive bump 61 is away from the One end of the inner layer board 10 is in contact with the first conductive circuit layer 22, the second electroplating bumps 52 are arranged around the through holes 101, and the second conductive bumps 62 surround the second electroplating bumps 61 is disposed and one end of the second conductive bump 62 away from the second substrate 230 is in contact with the second conductive layer 12 . The first conductive circuit layer 22, the first electroplating bump 51, the first conductive bump 61, the first shielding portion 111 of the first conductive layer 11, the metal plating layer 16, the first A cavity 102 is formed around the second shielding portion 121 of the two conductive layers 12 , the second plating bumps 52 , the second conductive bumps 62 and the third conductive circuit layer 32 .

Step S7, please refer to Figure 9, perform circuit fabrication on the third metal layer of the first substrate and the fourth metal layer of the second substrate to form a second conductive circuit layer 23 and a fourth conductive circuit layer 33, respectively, to obtain The first outer layer plate 20 and the second outer layer plate 30; and form a structure that sequentially penetrates the first outer layer plate 20, the first glue layer 41, the inner layer plate 10, the second glue layer 42, the third Two plating holes 110 of the outer layer board 30 .

Step S8, please refer to FIG. 1A, forming a through hole 201 on the first outer layer board 20, and assembling the active element 70 and the antenna 80 on the first outer layer board 20 and the second outer layer board 30, respectively. The radio wave transmission board 100 is obtained.

In the radio wave transmission board 100 and its manufacturing method provided in the embodiment of the present application, by providing the first conductive bump 61 and the first electroplating bump 51, the first adhesive layer 41 can be effectively blocked Flow into the cavity 102; by providing the second conductive bump 62 and the second electroplating bump 52, the second glue layer 42 can be effectively blocked from flowing into the cavity 102. And one of the first conductive bumps 61 and the first electroplating bumps 51 is directly formed on one of the inner layer board 10 and the first outer layer board 20 , and the other one is directly formed on On the other of the inner layer board 10 and the first outer layer board 20; one of the second conductive bumps 62 and the second electroplating bumps 52 is directly formed on the inner layer One of the plate 10 and the second outer plate 30 is formed directly on the other of the inner plate 10 and the second outer plate 30 , which can reduce the cavity 102 There is a risk that the radio wave signal transmitted in the circuit leaks from the space between the inner layer board 10 and the first outer layer board 20 / the second outer layer board 30 .

In addition, those skilled in the art can also make other changes within the spirit of the present invention. Of course, these changes made based on the spirit of the present invention should be included in the scope of protection claimed by the present invention.

100: Radio wave transmission board

10:Inner layer board

20:First outer layer board

30:Second outer layer board

41: First glue layer

42:Second glue layer

51: First plating bump

52: Second plating bump

61: First conductive bump

62: Second conductive bump

11: First conductive layer

12: Second conductive layer

13:Insulation layer

14:Third conductive layer

101:Through hole

16:Metal plating

111:First shielding department

121:Second shielding department

21:First grassroots level

22: First conductive circuit layer

23: Second conductive circuit layer

24: First conductive structure

31:The second grassroots level

32: The third conductive circuit layer

33: The fourth conductive circuit layer

34: Second conductive structure

221: first groove

321: Second groove

201:Through hole

90: Filling parts

110: Plating hole

70:Active components

80:Antenna

Claims (9)

A radio wave transmission board, which includes: an inner layer board provided with a through hole, the hole wall of the through hole is provided with a metal plating layer; a first outer layer board provided on one side of the inner layer board and covering the through hole One end of the hole; a second outer layer plate, disposed on the side of the inner layer plate away from the first outer layer plate and covering the other end of the through hole; a first electroplating bump, disposed on the inner layer plate and A first conductive bump is sandwiched between the inner layer plate and the first outer layer plate and is arranged around the first electroplating bump; The first glue layer is sandwiched between the inner layer board and the first outer layer board and is located on the side of the first conductive bump away from the first electroplating bump; the second electroplating bump is provided is disposed between the inner layer board and the second outer layer board and surrounds the through hole; a second conductive bump is sandwiched between the inner layer board and the second outer layer board and surrounds the through hole. A second electroplating bump is provided; a second glue layer is sandwiched between the inner layer board and the second outer layer board and is located on the side of the second conductive bump away from the second electroplating bump; Wherein, the metal plating layer, the first electroplating bump, the first conductive bump, the first outer layer plate, the second electroplating bump, the second conductive bump and the second The outer layer board is surrounded by a cavity filled with air, and the radio wave transmission board can use the air in the cavity as a conductive medium to transmit radio wave signals; the inner layer board includes a first conductive layer, a second conductive layer and An insulating layer is located between the first conductive layer and the second conductive layer. The first outer layer board includes a first base layer and a first conductive circuit layer and a third conductive circuit layer disposed on opposite surfaces of the first base layer. Two conductive circuit layers; both ends of the first conductive bump are connected to the first conductive layer and the first conductive circuit layer respectively. The radio wave transmission board according to claim 1, wherein the second outer layer board includes a second base layer and a third conductive circuit layer and a fourth conductive circuit layer disposed on opposite surfaces of the second base layer, Two ends of the second conductive bump are connected to the second conductive layer and the third conductive circuit layer respectively. The radio wave transmission board according to claim 2, wherein the first conductive circuit layer is provided with a first groove that exposes a portion of the first base layer, and the first groove is connected to the cavity. ; The third conductive circuit layer is provided with a second groove that exposes a portion of the second base layer, and the second groove is connected to the cavity. The radio wave transmission board according to claim 2, wherein a third groove is opened on the first conductive layer or the first conductive circuit layer, and one end of the first electroplating bump is accommodated in the third groove. Among the three grooves, a fourth groove is provided on the second conductive layer or the third conductive circuit layer, and one end of the second electroplated bump is accommodated in the fourth groove. The radio wave transmission board according to claim 1, wherein the radio wave transmission board includes a plurality of first electroplating bumps, and the plurality of first electroplating bumps are spaced around the through holes; or, the radio wave transmission board includes A plurality of first conductive bumps, the plurality of first conductive bumps are arranged at intervals around the first electroplating bumps; or the radio wave transmission plate includes a plurality of second electroplating bumps, the plurality of second electroplating bumps surround the The through holes are arranged at intervals; or, the radio wave transmission board includes a plurality of second conductive bumps, and the plurality of second conductive bumps are arranged at intervals around the second electroplating bumps. The radio wave transmission board according to claim 1, wherein the first outer layer plate is provided with a through hole, the through hole connects the cavity and the external environment, and a filling piece is provided in the through hole for sealing the cavity. The radio wave transmission board according to claim 1, wherein the radio wave transmission board further includes an active element and an antenna, and the active element and the antenna are respectively arranged on the first outer layer board and the second outer layer board away from each other. One side of the inner layer board, the position of the active element and the position of the antenna all correspond to the position of the cavity. A method for making a radio wave transmission board, which includes the following steps: Provide an inner layer board, the inner layer board is provided with through holes penetrating its opposite sides, and the hole wall of the through hole is formed with a metal plating layer; provide a first substrate, between the first substrate and the inner layer A first electroplating bump is formed by electroplating on one of the boards, and a first conductive bump is formed by printing on the other of the first substrate and the inner layer board; a second substrate is provided, and the first electroplating bump is formed on the second substrate. Electroplating to form a second electroplating bump on one of the two substrates and the third inner layer board, and printing to form a second conductive bump on the other of the second substrate and the third inner layer board; A first glue layer with a first opening and a second glue layer with a second opening are provided, wherein the first opening is used for the first conductive bump and the first plating bump to pass through , the second opening is used for the second conductive bump and the second plating bump to pass through; connect the first substrate, the first adhesive layer, the inner layer board, the third The two adhesive layers and the second substrate are pressed together in sequence, wherein the first electroplating bump is located between the first substrate and the inner layer board and is arranged around the through hole, and the first plating bump is A conductive bump is sandwiched between the first substrate and the inner layer board and is arranged around the first electroplating bump. The second electroplating bump is located between the second substrate and the inner layer board. The second conductive bump is sandwiched between the second substrate and the inner layer board and arranged around the through hole; the first substrate and the The second substrate is separately manufactured with circuits to obtain a first outer layer board and a second outer layer board. The manufacturing method of a radio wave transmission board according to claim 8, further comprising: forming a first groove on one of the first substrate and the inner layer board on which the first plating bump is not formed. , one end of the first electroplating bump is accommodated in the first groove; and a second electroplating bump is formed on one of the second substrate and the inner layer board where the second electroplating bump is not formed. A groove, one end of the second electroplating bump is accommodated in the second groove.

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