TWI826240B - Wireless circuit module and manufacturing method that can insulate and suppress electromagnetic waves - Google Patents

Abstract

The invention relates to a wireless circuit module and a manufacturing method that can insulate and suppress electromagnetic waves. It includes: a circuit board with a plurality of electronic components and at least one wireless transceiver chip welded on its surface, and is surrounded by There is a metal shielding frame, and the bottom side of the metal shielding frame is connected to the copper foil layer inside the circuit board; an insulating layer is coated on the surface of the circuit board and the electronic components and fused to form an insulating layer, but there is no insulating layer on the surface of the metal shielding frame. Covering the insulating layer; a shielding thermal conductive layer is coated on part of the insulating layer, the wireless transceiver chip and the metal shielding frame to form a shielding thermal conductive layer; a protective anti-scratch layer is coated on the surface of the shielding thermal conductive layer and the insulating layer Partially, a three-layer structure is formed in which the protective anti-scratch layer is larger than the insulating layer, and the insulating layer is larger than the shielding thermal conductive layer.

Description

Wireless circuit module and manufacturing method that can insulate and suppress electromagnetic waves

The present invention provides a wireless circuit module and a manufacturing method that can insulate and suppress electromagnetic waves. In particular, it refers to a wireless circuit module in which electromagnetic waves, noise and other interference from multiple electronic components and wireless transceiver chips are guided to metal through a shielding thermal conductive layer. The copper foil layer inside the shielding frame and the circuit board is grounded and eliminated, and the heat energy of the multiple electronic components and wireless transceiver chips can be quickly dissipated through the shielding thermal conductive layer to the surface of the protective scratch-resistant layer, which can meet the needs of light and thin electronic devices. , shorten and miniaturize the trend, and can effectively reduce the production cost of manufacturing wireless circuit modules.

Press, due to the rapid changes of the times and the rapid advancement of technology, people now pursue a more convenient and faster life, and portable electronic devices (such as smart phones, tablets, laptops and other electronic products) are also in modern life It is becoming more common and important. It has almost become an indispensable part of daily life. With the rise of the Internet and social networking sites, a single portable electronic device can handle most tasks, whether it is communication, The Internet, multimedia applications (such as videos or games), or various types of information can be easily obtained, used or disseminated in portable electronic devices.

However, currently, various portable electronic devices must use electricity to start and operate. Therefore, various portable electronic devices are equipped with batteries that supply power. The power is transmitted to circuit boards with various functions through the batteries. Supplies the power required for circuit board operation source, and power can be transmitted between the battery and the circuit board through the electrical connector. However, the current electrical connectors used to transmit power are assembled and positioned using interlocking and clamping methods between the base body and the plurality of terminals, and then directly used for power transmission. In actual application and implementation, problems still exist. Slight deficiencies and inconveniences, for example: after the electrical connector is assembled and positioned, there is a gap between the base and the plurality of terminals. It is easy for external moisture to penetrate into the circuit board through the electrical connector, causing multiple contacts on the circuit board. , The pins of various electronic components are corroded, oxidized, etc., which can easily affect the operation of the circuit board, leading to abnormal short circuits or open circuits. And when electronic devices encounter rainy days or accidentally spill other liquids containing moisture, their electronics will be damaged. It is easy for moisture to cause a short circuit inside the device, affecting its functionality. Therefore, the waterproofness of circuit boards has gradually attracted the attention of developers.

Moreover, today's electronic devices (especially those with wireless circuit modules inside) require a large amount of signal processing, and the signal processing also needs to be faster. Therefore, during use of the electronic device, the internal electronic components will generate Electromagnetic waves, crosstalk interference and high heat energy can also interfere with other electronic equipment, or cause internal electronic components to interfere with each other and prevent normal operation. Based on the above, in order to solve the problems of electromagnetic waves, crosstalk interference and heat dissipation, some manufacturers install metal covers on the circuit boards of electronic devices to cover the top of the electronic components through the metal covers, and then use the metal covers to Induction absorbs and shields electromagnetic waves and crosstalk interference and provides heat dissipation. However, current electronic devices are developing towards the trend of being light, thin, short, and miniaturized. Installing a metal cover will increase the overall thickness of the electronic device, and the metal cover will Mold opening and assembly will also consume a lot of manufacturing time and cost, which cannot effectively enhance the market competitiveness of electronic devices.

Therefore, how to solve the problems of waterproofness, electromagnetic wave prevention, crosstalk interference and heat dissipation of the above-mentioned electronic devices, and at the same time comply with the development trend of light, thin, short and miniaturized electronic devices, is the relevant manufacturer engaged in this industry. It is urgent to study the direction of improvement.

Therefore, in view of the above problems and deficiencies, the inventor collected relevant information, evaluated and considered many aspects, and used his many years of experience in this industry to design this kind of device that can insulate and suppress electromagnetic waves through continuous creation and research and development. The inventor of wireless circuit modules and manufacturing methods.

The main purpose of the present invention is a wireless circuit module that can insulate and suppress electromagnetic waves. It includes: a circuit board with a plurality of electronic components and at least one wireless transceiver chip welded on its surface, and a metal ring is provided on the outer ring of the electronic components. A shielding frame, and the bottom side of the metal shielding frame is connected to the copper foil layer inside the circuit board; an insulating layer is coated on the surface of the circuit board and the electronic components and fused to form an insulating layer, but the surface of the metal shielding frame is not covered with insulation. layer; a shielding thermally conductive layer, which is coated on part of the insulating layer, the wireless transceiver chip and the partial surface of the metal shielding frame to form a shielding thermally conductive layer; a protective anti-scratch layer, which is coated on the surface of the shielding thermally conductive layer and part of the insulating layer, And it forms a three-layer structure in which the protective anti-scratch layer is larger than the insulating layer, and the insulating layer is larger than the shielding thermal conductive layer. Through the above, the electromagnetic waves, noise and other interference of the multiple electronic components and wireless transceiver chips are guided to the metal shielding frame and the internal copper foil layer of the circuit board through the shielding thermal conductive layer for grounding elimination, and the thermal energy of the multiple electronic components and wireless transceiver chips is The heat conductive shielding layer can be conducted to the surface of the protective anti-scratch layer for rapid dissipation, which can comply with the trend of light, thin, short and miniaturized electronic devices, and can effectively reduce the production cost of manufacturing wireless circuit modules.

Another object of the present invention is that the components of the insulating layer include: 30% to 90% by weight of base material; 0.5% to 30% by weight of polymer cross-linking agent; and 10% by weight. ~30% ionized water.

Another object of the present invention is that the components of the shielding thermal conductive layer include: weight The base material is 20% to 50%; the binder is 0.5% to 20% by weight; the polymer cross-linking agent is 0.5% to 30% by weight; and the polymer is 10% to 30% by weight. Deionized water.

Another object of the present invention is that the components of the protective anti-scratch layer include: 20% to 50% by weight of base material; 10% to 40% by weight of boron nitride; 0.5% to 30% by weight polymer material cross-linking agent; and deionized water with a weight percentage of 10% to 30%.

1:Circuit board

11: Copper foil layer

2: Electronic components

21: Wireless transceiver chip

3: Metal shielding frame

4: Insulation layer

5: Shielding thermal conductive layer

6: Protective anti-scratch layer

71: The first atomization device

72: Second atomization device

81: Provide a circuit board with a plurality of electronic components welded on the surface, and the electronic components include at least one wireless transceiver chip with communication function, and a metal shielding frame is provided on the outer circumference of the electronic components, and the metal shield The bottom side of the frame is connected to a copper foil layer inside the circuit board

82: Coating the insulating material on the surface of the circuit board and the electronic components and fusing it to form a film-like insulating layer, but not dotting the insulating material and forming the insulating layer on the surface of the metal shielding frame

83: Coat on part of the insulating layer, the wireless transceiver chip and part of the metal shielding frame to form a film-like shielding thermal conductive layer that can shield the top side electromagnetic waves.

84: A protective anti-scratch layer is formed on the surface of the shielding thermal conductive layer and the part of the insulating layer not covered by the shielding thermal conductive layer, and the protective anti-scratch layer is larger than the insulating layer and the insulating layer is larger than the shielding thermal conductive layer. three-layer structure

[Figure 1] is a schematic diagram of the first operation of making a wireless circuit module according to the present invention.

[Figure 2] is a schematic diagram of the second operation of manufacturing a wireless circuit module according to the present invention.

[Figure 3] is a schematic diagram of the third operation of manufacturing a wireless circuit module according to the present invention.

[Figure 4] is a schematic diagram of the fourth operation of manufacturing a wireless circuit module according to the present invention.

[Figure 5] is a flow chart of the manufacturing method of the wireless circuit module of the present invention.

In order to achieve the above objects and effects, the technical means, structures, implementation methods, etc. used in the present invention are described in detail below for a complete understanding of the preferred embodiments of the present invention.

Please refer to Figures 1 to 4, which are schematic diagrams of the first, second, third and fourth operations of producing a wireless circuit module according to the present invention. It can be clearly seen from the figures that the present invention can insulate and suppress wireless electromagnetic waves. The main components and features of the circuit module are detailed as follows: a circuit board 1, with a plurality of electronic components 2 welded on its surface, and these circuits The sub-component 2 includes at least one wireless transceiver chip 21 with communication function, and a metal shielding frame 3 that can shield electromagnetic waves is provided on the outer circumference of the electronic components 2, and the bottom side of the metal shielding frame 3 is connected to the circuit. The inside of the board 1 can be used as a copper foil layer 11 for grounding.

As shown in Figures 1 and 2, the insulating layer 4 is applied to the circuit board 1 and the circuit board 1 in a non-contact manner through a first piezoelectric dispensing device (not shown in the figure) controlled by a computer. The surface of some electronic components 2 is fused to form a film-like insulating layer, but the insulating material is not dotted and the insulating layer 4 is not formed on the surface of the metal shielding frame 3, and the surface of the wireless transceiver chip 21 is dotted or not dotted. The insulating material forms the insulating layer 4 . The aforementioned first piezoelectric dispensing device is no different from the generally commercially available products that convert electrical energy into mechanical energy for vibration, so no separate drawings and text explanations are provided. The first piezoelectric dispensing device can also use other non-piezoelectric forms. Implementation using a dispensing device is also within the protection scope of the present invention.

As shown in Figure 3, the shielding thermal conductive layer 5 is sprayed and coated on part of the insulating layer 4, the wireless transceiver chip 21 and the metal shielding frame 3 through a first atomization device 71, and forms a shieldable top. The side electromagnetic wave is in the form of a film-like shielding thermal conductive layer 5; and the shielding thermal conductive layer 5 is directly formed on the surface of the wireless transceiver chip 21, unlike other electronic components 2 where the insulating layer 4 is first formed on the surface and then the shielding thermal conductive layer 5 is formed. The shielding and heat conduction effect on the wireless transceiver chip 21 is further enhanced (the thickness of the shielding heat conductive layer 5 is larger).

As shown in Figure 4, the protective anti-scratch layer 6 is coated and formed on the surface of the shielding thermal conductive layer 5 through a second atomization device 72 or a second piezoelectric dispensing device (not shown in the figure) and is not The thermally shielding layer 5 covers part of the insulating layer 4 and forms a three-layer structure in which the protective anti-scratch layer 6 is larger than the insulating layer 4 and the insulating layer 4 is larger than the shielding thermally conductive layer 5 . The aforementioned second piezoelectric dispensing device is no different from the general commercially available products, so no separate drawings and text explanations are provided, and the second The piezoelectric dispensing device can also be implemented through other non-piezoelectric dispensing devices, which is also within the protection scope of the present invention.

It should be noted in particular that the three-layer film-like structure of the insulating layer 4, the shielding thermal conductive layer 5 and the protective anti-scratch layer 6 formed on the wireless circuit module of the present invention, because the areas of the insulating layer 4 and the protective anti-scratch layer 6 are both larger than The thermally conductive shielding layer 5 is bonded to each other through the polymer material cross-linking agent contained in the three-layer film structure, and the insulating layer 4 on both sides forms a close fit with the edges of the protective scratch-resistant layer 6. The shielding thermal conductive layer 5 is covered to form a structure like "hot pressed toast" (as shown in Figure 4). When repairing the wireless circuit module with this structure, only three layers of film are needed. The like structure can be completely separated from the circuit board 1 by picking up one edge and opening it, so as to facilitate circuit board reprocessing or repair work.

The above-mentioned components of the insulating layer 4 include: 30% to 90% by weight of base material; 0.5% to 30% by weight of polymer material cross-linking agent; and 10% to 30% by weight of ionized water. ; The base material composition of the insulating layer 4 with a weight percentage of 30% to 90% includes: polyurethane, polyimide, polycarbonate, polyamide, epoxy resin, polyethylene imine, polydimethyl One or a combination of siloxane, acrylic polymer, ether polymer or polyolefin; the cross-linking agent of the polymer material with a weight percentage of 0.5% to 30% includes: high imine methyl etherification Melamine resin (hmmm) or aziridine or carbodiimide (Garbodiimide) or epoxy cross-linking agent, and further targeted at amino (-NH2), carboxyl (-COOH), amide bond (-CONH- or -NHCO -) functional groups.

The components of the above-mentioned shielding thermal conductive layer 5 include: 20% to 50% by weight of base material; 0.5% to 20% by weight of adhesive; 0.5% to 30% by weight of polymer material cross-linking agent; and , the weight percentage is 10%~30% deionized water; and the shielding conducts heat The base material components of layer 5 include 20% to 50% by weight: carbon nanotubes, graphene and silver-coated copper; the binder includes 0.5% to 20% by weight: polyurethane and polyimide. , polycarbonate, polyamide, polyethylene terephthalate, polyethylene naphthalate, polyethyleneimine, polydimethylsiloxane, acrylic polymer, ether polymer One or a combination of polymers or polyolefins; the cross-linking agent of the polymer material with a weight percentage of 0.5% to 30% includes: high imine methyl etherified melamine resin (hmmm) or aziridine or carbodiimide (Garbodiimide), and further targets the amino (-NH2), carboxyl (-COOH), and amide bond (-CONH- or -NHCO-) functional groups. The thickness of the shielding thermal conductive layer 5 ranges from 1 to 150 μm (microns), and the thickness of the preferred embodiment of the shielding thermal conductive layer 5 can be from 20 to 60 μm (microns); and the silver-coated copper is in a sheet structure. The particle length range is 10~100μm.

The above-mentioned components of the protective anti-scratch layer 6 include: 20% to 50% by weight of base material; 10% to 40% by weight of boron nitride; and 0.5% to 30% by weight of cross-linked polymer materials. agent; and deionized water with a weight percentage of 10% to 30%; and the base material components of the protective anti-scratch layer 6 with a weight percentage of 20% to 50% include: polyurethane, polyimide, polycarbonate, polyamide Among them, amide, polyethylene terephthalate, polyethylene naphthalate, polyethyleneimine, polydimethylsiloxane, acrylic polymer, ether polymer or polyolefin One or a combination; the polymer material cross-linking agent with a weight percentage of 0.5% to 30% includes: high imine etherified melamine resin (hmmm) or aziridine or carbodiimide (Garbodiimide), and further For amino (-NH2), carboxyl (-COOH), amide bond (-CONH- or -NHCO-) functional groups.

The above-mentioned insulating layer 4, the shielding thermal conductive layer 5 and the protective anti-scratch layer 6 are formed in sequence. The base material of the insulating layer 4 consists of: polyurethane, polyimide, polycarbonate, polyamide, polyethylene oxide. One or a combination of amines and the adhesive (Binder) of the shielding thermal conductive layer 5: one or a combination of polyurethane, polyimide, polycarbonate, polyamide, polyethyleneimine and protection against scratches The base material components of layer 6: one or a combination of polyurethane, polyimide, polycarbonate, polyamide, and polyethyleneimine, together with the polymer material cross-linking agent in each layer of material, further targeting the insulation layer 4 , the adhesive of the shielding thermal conductive layer 5 is cross-linked with the amino (-NH2), carboxyl (-COOH), and amide bond (-CONH- or -NHCO-) functional groups of the protective anti-scratch layer 6 to form each layer of polymer. The cross-linking and combination between materials provide better bonding and better bonding effect between the insulating layer 4, the shielding thermal conductive layer 5 and the protective anti-scratch layer 6.

Please refer to Figure 5, which is a flow chart of the manufacturing method of the wireless circuit module of the present invention, which includes the following steps:

Step 81: Provide a circuit board with a plurality of electronic components welded on the surface, and the electronic components include at least one wireless transceiver chip with communication function, and a metal shielding frame is provided around the outer circumference of the electronic components, and the metal The bottom side of the shielding frame is connected to a copper foil layer inside the circuit board.

Step 82: Coat the insulating material on the surface of the circuit board and the electronic components and fuse to form a film-like insulating layer. However, the insulating material is not dotted and the insulating layer is not formed on the surface of the metal shielding frame; the insulating layer is A computer-controlled first piezoelectric dispensing device is used to apply insulating material on the surface of the circuit board and the electronic components in a non-contact manner, and the insulating material is or is not dotted on the surface of the wireless transceiver chip. This insulation layer is formed.

Step 83: Coat a part of the insulating layer, the wireless transceiver chip and a part of the metal shielding frame to form a film-like shielding thermal conductive layer that can shield the top side electromagnetic waves; the shielding thermal conductive layer passes through a first atomization device Spray coating on part of the insulation layer, the wireless transceiver The chip and the partial surface of the metal shielding frame.

Step 84: Coat the surface of the shielding thermal conductive layer and the part of the insulating layer that is not covered by the shielding thermal conductive layer to form a protective anti-scratch layer, and form a protective anti-scratch layer larger than the insulating layer and the insulating layer is larger than the shielding layer The three-layer structure of the thermally conductive layer; the protective anti-scratch layer is coated and formed on the surface of the shielding thermally conductive layer and the insulating layer that is not covered by the shielding thermally conductive layer through a second atomization device or a second piezoelectric dispensing device. Partially.

The main feature of the present invention is that the electromagnetic waves, noise and other interference from the plurality of electronic components 2 and the wireless transceiver chip 21 on the wireless circuit module are guided to the metal shielding frame 3 and the internal copper foil layer 11 of the circuit board 1 through the shielding heat conductive layer 5 The grounding is eliminated, and the heat energy of the plurality of electronic components 2 and the wireless transceiver chip 21 can be quickly dissipated by being conducted to the surface of the protective anti-scratch layer 6 through the shielding thermal conductive layer 5 (mainly through graphene material), and can comply with the requirements of electronic devices. It has the trend of being light, thin, short and miniaturized, and can effectively reduce the production cost of manufacturing wireless circuit modules. This invention has excellent practicability in the field of producing wireless communication circuit boards, so a patent application is filed to seek protection of patent rights.

The above are only preferred embodiments of the present invention, and do not limit the patent scope of the present invention. Therefore, any simple modifications and equivalent structural changes made by using the description and drawings of the present invention should be included in the present invention. Within the scope of the patent, we will make it clear.

1:Circuit board

11: Copper foil layer

21: Wireless transceiver chip

2: Electronic components

3: Metal shielding frame

4: Insulation layer

5: Shielding thermal conductive layer

6: Protective anti-scratch layer

72: Second atomization device

Claims (9)

A wireless circuit module that can insulate and suppress electromagnetic waves, including: a circuit board with a plurality of electronic components welded on its surface, and these electronic components include at least one wireless transceiver chip with communication function, and on these electronic components The outer ring of the electronic component is equipped with a metal shielding frame that can shield electromagnetic waves, and the bottom side of the metal shielding frame is connected to a copper foil layer inside the circuit board that can be used as a ground; an insulating layer is coated with insulating material on the circuit The surface of the board and the electronic components are fused to form a film-like insulating layer, but the insulating material is not dotted and the insulating layer is not formed on the surface of the metal shielding frame; a shielding thermal conductive layer is coated on part of the insulating layer. The wireless transceiver chip and the metal shielding frame are partially formed with a film-like shielding thermal conductive layer that can shield the top electromagnetic waves; and a protective anti-scratch layer is coated on the surface of the shielding thermal conductive layer and is not covered by the shielding thermal conductive layer. part of the insulating layer, and forms a three-layer structure in which the protective anti-scratch layer is larger than the insulating layer, and the insulating layer is larger than the shielding thermal conductive layer. The wireless circuit module capable of insulating and suppressing electromagnetic waves as described in claim 1, wherein the insulating layer is coated with insulating material on the circuit board and the circuit board in a non-contact manner using a computer-controlled first piezoelectric dispensing device. The surface of some electronic components, and the surface of the wireless transceiver chip is dotted or not dotted with the insulating material and forms the insulating layer; the shielding thermal conductive layer is sprayed and coated on part of the insulating layer and the wireless through a first atomizing device The transceiver chip and the partial surface of the metal shielding frame; the protective anti-scratch layer is coated and formed on the surface of the shielding thermally conductive layer through a second atomization device or a second piezoelectric dispensing device and on the surface of the shielding thermally conductive layer that is not covered by the shielding thermally conductive layer. Part of the insulation layer. The wireless circuit module that can insulate and suppress electromagnetic waves as described in claim 1, wherein the components of the insulating layer include: base material and polymer material cross-linking agent, and the base material components include: polyurethane, polyimide, polycarbonate , one or a combination of polyamide, epoxy resin, polyethyleneimine, polydimethylsiloxane, acrylic polymer, ether polymer or polyolefin; the polymer material is cross-linked The agent system includes: high imine methyl etherified melamine resin (hmmm) or aziridine or carbodiimide (Garbodiimide) or epoxy cross-linking agent, and further targets amino (-NH2), carboxyl (-COOH), Amide bond (-CONH- or -NHCO-) functional group. The wireless circuit module that can insulate and suppress electromagnetic waves as described in claim 1, wherein the components of the shielding thermal conductive layer include: base material, adhesive and polymer material cross-linking agent, and the base material components include: carbon nanotubes, Graphene and silver-coated copper; the binder system includes: polyurethane, polyimide, polycarbonate, polyamide, polyethylene terephthalate, polyethylene naphthalate, polyethyleneimine , one or a combination of polydimethylsiloxane, acrylic polymer, ether polymer or polyolefin; the polymer material cross-linking agent includes: high imine methyl etherified melamine resin (hmmm ) or aziridine or carbodiimide (Garbodiimide), and further targets the amino (-NH2), carboxyl (-COOH), amide bond (-CONH- or -NHCO-) functional groups; and the shielding thermal conductive layer The thickness range is 1~150 μm (micron), and the thickness of the preferred embodiment of the shielding thermal conductive layer can be 20~60 μm (micron); the silver-coated copper is in a sheet structure, and the particle length range is 10~100 μm . The wireless circuit module that can insulate and suppress electromagnetic waves as described in claim 1, wherein the components of the protective anti-scratch layer include: a base material and a polymer cross-linking agent, and the base material includes Including: polyurethane, polyimide, polycarbonate, polyamide, polyethylene terephthalate, polyethylene naphthalate, polyethyleneimine, polydimethylsiloxane, acrylic One or a combination of force-based polymers, ether-based polymers or polyolefins; the polymer material cross-linking agent includes: high imine methyl etherified melamine resin (hmmm) or aziridine or carbodiimide ( Garbodiimide), and further targets the amino (-NH2), carboxyl (-COOH), amide bond (-CONH- or -NHCO-) functional groups. A method of manufacturing a wireless circuit module that can insulate and suppress electromagnetic waves, including the following steps: (A) providing a circuit board with a plurality of electronic components soldered on the surface, and the electronic components include at least one wireless module with communication function Transmit and receive chips, and a metal shielding frame is provided on the outer circumference of the electronic components, and the bottom side of the metal shielding frame is connected to a copper foil layer inside the circuit board; (B) Coating the insulating material on the circuit board and the circuit board The surface of the electronic component is fused to form a film-like insulating layer, but the insulating material is not dotted and the insulating layer is not formed on the surface of the metal shielding frame; (C) Coating on the part of the insulating layer, the wireless transceiver chip and the metal The partial surface of the shielding frame is formed with a film-like shielding thermal conductive layer that can shield the electromagnetic waves on the top side; and (D) a protective anti-scratch layer is formed on the surface of the shielding thermal conductive layer and the part of the insulating layer that is not covered by the shielding thermal conductive layer. layer, and forms a three-layer structure in which the protective anti-scratch layer is larger than the insulating layer, and the insulating layer is larger than the shielding thermal conductive layer. The manufacturing method of a wireless circuit module that can insulate and suppress electromagnetic waves as described in claim 6, wherein in step (B), the insulating layer is a computer-controlled first piezoelectric point The glue device dots and coats the insulating material on the surface of the circuit board and the electronic components in a non-contact manner, and the surface of the wireless transceiver chip does or does not dot the insulating material and forms the insulating layer. The manufacturing method of a wireless circuit module that can insulate and suppress electromagnetic waves as described in claim 6, wherein in step (C), the shielding thermal conductive layer is sprayed and coated on part of the insulating layer and the insulating layer through a first atomizing device. The wireless transceiver chip and the partial surface of the metal shielding frame. The manufacturing method of a wireless circuit module that can insulate and suppress electromagnetic waves as described in claim 6, wherein in step (D), the protective anti-scratch layer is passed through a second atomizing device or a second piezoelectric dispensing device The coating is formed on the surface of the shielding thermally conductive layer and the part of the insulating layer that is not covered by the shielding thermally conductive layer.

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