TWI823105B - Heat sink and its manufacturing method, circuit board and its manufacturing method - Google Patents

Abstract

The application proposes a heat dissipation block, which includes a metal block and a graphene layer. The metal block is provided with a plurality of heat conduction holes, the heat conduction holes pass through the opposite sides of the metal block, and the graphene layer is arranged on the outer surface of the metal block and the inner wall of the heat conduction hole. The heat sink provided by the application can reduce the self weight of the heat sink by setting a plurality of heat conducting holes, which is beneficial to reducing the risk of falling off of the heat sink due to excessive self weight. In addition, the application also provides a method for manufacturing a heat sink, in addition, the application also provides a circuit board and a manufacturing method thereof.

Description

Heat sink block and manufacturing method thereof, circuit board and manufacturing method thereof

The present application relates to a heat dissipation block and a manufacturing method thereof, a circuit board and a manufacturing method thereof.

Most of the electrical energy consumed when the electronic components in the circuit board are running is converted into heat, and the excess heat will affect the reliability and stability of the operation of electronic products. With the development of high density and high power of electronic components, it is limited by the thermal conductivity of materials. Characteristics, increasingly larger thermally conductive metal blocks will be bonded to circuit boards to meet the heat dissipation needs of electronic components. However, the ever-increasing thermally conductive metal block is easily detached from the circuit board due to its own weight.

In order to solve the problems involved in the conventional technology, this application provides a heat sink block and a manufacturing method thereof.

In addition, it is also necessary to provide a circuit board with the above-mentioned heat dissipation block and a manufacturing method thereof.

A method of manufacturing a heat sink block includes the steps of: providing a metal block. A plurality of thermal conductive holes are provided on the metal block, and the thermal conductive holes penetrate two opposite surfaces of the metal block. A graphene layer is provided on the outer surface of the metal block and the inner wall of the thermal hole to obtain the heat dissipation block.

Further, arranging the graphene layer specifically includes the steps of: immersing the metal block with the thermal conductive hole in a suspension, the suspension including graphene and a solvent, and taking out the metal block and drying it. the solvent.

A heat dissipation block includes a metal block and a graphene layer. The metal block is provided with a plurality of thermal conductive holes. The thermal conductive holes penetrate two opposite surfaces of the metal block. The graphene layer is provided on the outside of the metal block. surface and the inner wall of the thermal hole.

Further, the cross section of the thermal conductive hole is hexagonal or circular.

A method of manufacturing a circuit board includes the steps of: providing a circuit substrate, which includes an inner circuit unit, an outer circuit unit and a dielectric layer. The dielectric layer is disposed between the inner circuit unit and the outer circuit unit. The circuit board substrate has openings that penetrate the inner circuit unit, the outer circuit unit and the dielectric layer. . The heat dissipation block as described above is provided, and the heat dissipation block is disposed in the opening. A heating element is arranged on the heat dissipation block, and the heating element and the outer circuit unit are electrically connected to obtain the circuit board.

Further, there is a gap between the inner wall of the opening and the heat dissipation block, and the manufacturing method further includes the step of: setting a barrier layer on one side of the opening, and the barrier layer covers one side of the gap. side. Fill the other side of the gap with adhesive. The adhesive is baked to form a bonded mass, and the barrier layer is removed.

Further, part of the adhesive block is exposed on the outer circuit unit layer, and the manufacturing method further includes the step of removing part of the adhesive block exposed on the outer circuit unit layer.

A circuit board, including a circuit substrate, a heating element and a heat dissipation block as described above. The circuit substrate includes an inner circuit unit, an outer circuit unit and a dielectric layer. The dielectric layer is provided on the inner circuit unit and the outer circuit. Between the units, the circuit board substrate has openings that penetrate the inner circuit unit, the outer circuit unit and the dielectric layer; the heat dissipation block is arranged in the opening, and the heat generating The element is arranged on the heat dissipation block, and the heating element is electrically connected to the outer circuit unit.

Furthermore, an adhesive block is included, and the adhesive block is disposed in the gap between the heat dissipation block and the inner wall of the opening.

Further, the graphene layer is exposed on the outer circuit unit.

The heat dissipation block provided by this application reduces the weight of the heat dissipation block by arranging a plurality of thermal conduction holes, and provides a graphene layer on the inner wall of the thermal conduction holes and the outside of the heat dissipation block to improve the thermal conductivity effect, thereby helping to reduce the number of heat dissipation blocks. self-weight, thereby reducing the risk of the heat sink falling off due to excessive self-weight.

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, rather than all of the embodiments.

It should be noted that when an element is referred to as being "fixed" to another element, it can be directly on the other element or intervening elements may also be present. When an element is said to be "connected" to another element, it can be directly connected to the other element or there may also be intervening elements present. When an element is said to be "disposed on" another element, it can be directly located on the other element or intervening elements may also be present.

Referring to Figures 1 to 10, an embodiment of the present application provides a method of manufacturing a circuit board 100. The manufacturing method includes the steps:

S1: Please refer to Figure 1. A circuit substrate 10 is provided. The circuit substrate 10 is a soft and hard composite board. The circuit substrate 10 includes an inner line unit 11, two outer line units 12 and a dielectric layer 13. The outer side Line units 12 are disposed on opposite sides of the inner line unit 11 , and the dielectric layer 13 is disposed between the inner line unit 11 and the outer line unit 12 .

S2: Please refer to FIG. 2 , the circuit substrate 10 is provided with an opening 14 , and the opening 14 penetrates the inner circuit unit 11 , the outer circuit unit 12 and the dielectric layer 13 . In other embodiments of the present application, the circuit substrate 10 may also be a rigid circuit board or a flexible circuit board.

In this embodiment, the opening 14 is formed by laser irradiation or mechanical drilling in step S2.

S3: Please refer to Figures 7 to 9. A heat dissipation block 200 is provided in the opening 14. The heat dissipation block 200 includes a metal block 20 and a graphene layer 30. The metal block 20 is provided with a plurality of thermal conductive holes 21. The thermal hole 21 penetrates the opposite sides of the metal block 20 , and the graphene layer 30 is disposed on the outer surface of the metal block 20 and the inner wall of the thermal hole 21 .

In this embodiment, please refer to Figures 3 to 5. The manufacturing method of the heat sink block 200 includes:

S30: Please refer to FIG. 3. A metal block 20 is provided. The metal block 20 is generally in the shape of a cube. The metal block 20 includes a first surface 20a, a second surface 20b opposite to the first surface 20a, and a connection. The four connecting surfaces 20c of the first surface 20a and the second surface 20b.

In this embodiment, in step S20, the material of the metal block 20 includes gold, silver, copper, aluminum, iron, etc.

S31: Please refer to Figure 3. A plurality of thermal conductive holes 21 are provided on the metal block 20. The thermal conductive holes 21 penetrate the first surface 20a and the second surface 20b. The cross-sectional shape of the thermal conductive holes 21 is: Hexagon.

In other embodiments of the present application, in step S21, the cross-sectional shape of the thermal hole 21 may also be a circle, an ellipse, a triangle, an irregular polygon, etc.

S32: Referring to Figures 4 and 5, the graphene layer 30 is provided on the outer surface of the metal block 20 and the inner wall of the thermal hole 21 to obtain the heat dissipation block 200.

In this embodiment, step S22 includes: immersing the metal block 20 with the thermal hole 21 in a suspension (not shown), the suspension including graphene and a solvent, and taking out the The metal block 20 is dried and the solvent is dried, so that the first surface 20a, the second surface 20b, the connection surface 20c and the inner wall of the thermal control form the graphene layer 30.

In other embodiments of the present application, step S22 includes: depositing graphene material on the outer surface of the metal block 20 and the inner wall of the thermal hole 21 by electroplating, specifically, in the electroplating solution, The metal block 20 has a negative potential through polarization treatment, and the graphene powder has a positive potential through polarization treatment. The graphene powder is deposited on the outer surface of the metal block 20 and the thermal hole 21 on the inner wall.

In this embodiment, please refer to Figures 6 to 9. There is a gap S between the inner circumference of the opening 14 and the connecting surface 20c. Step S2 includes:

S33: Please refer to FIG. 6 , a barrier layer 40 is provided on one of the outer circuit units 12 , the barrier layer 40 covers the opening 14 , and the second surface 20 b is connected to the barrier layer 40 .

S34: Please refer to FIG. 7 , fill the gap S with adhesive (not shown) from one side of the other outer circuit unit 12 , and the barrier layer 40 blocks the adhesive from passing through the gap S. Outflow from the gap.

S35: Please refer to Figure 8, bake the adhesive to form an adhesive block 50. The adhesive block 50 connects the inner periphery of the opening 14 and the metal block 20, thereby preventing the metal block 20 from fall off from the opening 14 .

S36: Referring to FIG. 9 , remove the barrier layer 40 to expose the second surface 20b in one of the outer circuit units 12 .

In this embodiment, please refer to FIG. 9 , the first surface 20 a is substantially flush with the outside of the outer circuit unit 12 , and part of the adhesive block 50 is exposed on the first surface 20 a , please refer to FIG. 10 , step S25 also includes: removing the part of the adhesive block 50 exposed on the first surface 20a.

S4: Please refer to FIG. 10 , set a heating element 300 on the heat dissipation block 200 , and electrically connect the heating element 300 and the outer circuit unit 12 to obtain the circuit board 100 .

Please refer to FIG. 10 . In this embodiment, step S3 includes: setting a conductive wire 60 between the heating element 300 and the outer circuit unit 12 .

Referring to Figure 10, this application also provides a circuit board 100, which includes a circuit substrate 10, a heating element 300 and the heat dissipation block 200. The circuit substrate 10 includes an inner circuit unit 11, an outer circuit unit 12 and a dielectric layer 13. The dielectric layer 13 is disposed between the inner circuit unit 11 and the outer circuit unit 12. The circuit substrate 10 has an opening 14, and the opening 14 penetrates the inner circuit unit 11 and the outer circuit unit 11. unit 12 and the dielectric layer 13 . The heat dissipation block 200 is disposed in the opening 14 , and the heating element 300 is disposed on the heat dissipation block 200 . The heating element 300 is electrically connected to the outer circuit unit 12 .

In this embodiment, the circuit board 100 further includes an adhesive block 50 , which is disposed in the gap S between the heat dissipation block 200 and the inner wall of the opening 14 .

In this embodiment, the graphene layer 30 is exposed on the outer circuit unit 12 , and the heating element 300 is disposed on the graphene layer 30 .

Compared with the existing technology, the heat dissipation block 200 provided by the present application has the following advantages: (1) By arranging a plurality of the heat conduction holes 21, the weight of the heat dissipation block 200 is reduced, which is beneficial to reducing the heat dissipation caused by excessive weight. Block 200 risk falling off. (2) By providing multiple heat conduction holes 21 to increase the heat dissipation area of the heat dissipation block 200, the heat dissipation effect of the heating element 300 can be improved. (3) By arranging the graphene layer 30 on the outer surface of the metal block 20 and the inner wall of the thermal hole 21, the efficiency of heat conduction from the heating element 300 to the metal block 20 can be improved, thereby improving the heat dissipation effect. , it can be understood that for the same heat dissipation requirements, providing the graphene layer 30 can improve the heat dissipation effect, that is, less metal materials can be used to produce the metal block 20 that also meets the heat dissipation requirements, which is conducive to further reducing the number of heat dissipation blocks. 200 self-respect.

The above description is only an optimized specific implementation mode of the present application, but the actual application process cannot be limited to this implementation mode. For those of ordinary skill in the art, other modifications and changes made based on the technical concept of this application should fall within the patent scope of this application.

100:Circuit board 10:Circuit substrate 11:Inside line unit 12:Outside line unit 13:Media layer 14:Opening 20:Metal block 20a: First surface 20b: Second surface 20c:Connection surface 21: Thermal hole 30: Graphene layer 40: Barrier layer 50: Adhesive block 60:Conducting wire 200:Heating block 300: Heating element S: gap

FIG. 1 is a schematic diagram of a circuit substrate provided by an embodiment of the present application.

FIG. 2 is a schematic diagram of the circuit substrate shown in FIG. 1 after openings are provided.

Figure 3 is a schematic diagram of a metal block provided by an embodiment of the present application.

FIG. 4 is a schematic diagram of a heat dissipation block provided by an embodiment of the present application.

FIG. 5 is a cross-sectional view of the heat dissipation block shown in FIG. 4 along line III-III.

FIG. 6 is a schematic diagram of the circuit substrate shown in FIG. 2 after being provided with a barrier layer.

FIG. 7 is a schematic diagram of the circuit substrate shown in FIG. 6 after being provided with a heat dissipation block.

FIG. 8 is a schematic diagram of arranging an adhesive block in the gap between the inner periphery of the opening of the circuit substrate shown in FIG. 7 and the heat dissipation block.

FIG. 9 is a schematic diagram after removing part of the adhesive block exposed outside the circuit substrate in FIG. 8 .

Figure 10 is a schematic diagram of a circuit board provided by an embodiment of the present application.

without

200:Heating block

20:Metal block

21: Thermal hole

30: Graphene layer

Claims (9)

A method of manufacturing a heat sink block, which includes the steps of: providing a metal block; providing a plurality of thermal conductive holes on the metal block, and the thermal conductive holes penetrate two opposite surfaces of the metal block; A graphene layer is provided on the surface and the inner wall of the thermal hole to obtain the heat dissipation block; wherein the graphene layer is used to improve the heat dissipation effect, and arranging the graphene layer specifically includes the steps of: The metal block is immersed in a suspension, which includes graphene and a solvent; and the metal block is taken out and the solvent is dried. A heat dissipation block manufactured according to the manufacturing method of a heat dissipation block according to claim 1, which includes a metal block and a graphene layer, the metal block is provided with a plurality of thermal conductive holes, and the thermal conductive holes penetrate through the metal block. On opposite surfaces, the graphene layer is disposed on the outer surface of the metal block and the inner wall of the thermal hole. The heat dissipation block according to claim 2, wherein the cross section of the thermal conductive hole is hexagonal or circular. A method of manufacturing a circuit board, which includes the step of: providing a circuit substrate, the circuit substrate includes an inner circuit unit, an outer circuit unit and a dielectric layer, the dielectric layer is provided on the inner circuit unit and the outer circuit unit wherein the circuit board substrate has openings that penetrate the inner circuit unit, the outer circuit unit and the dielectric layer; a heat dissipation block as described in claim 2 or 3 is provided, and the The heat dissipation block is arranged in the opening; a heating element is arranged on the heat dissipation block, and the heating element and the outer circuit unit are electrically connected to obtain the circuit board. The manufacturing method according to claim 4, wherein there is a gap between the inner wall of the opening and the heat dissipation block, the manufacturing method further includes the step of: setting a barrier layer on one side of the opening, so The barrier layer covers one side of the gap; fills the other side of the gap with adhesive; bakes the adhesive to form an adhesive block; and Remove the barrier layer. The manufacturing method according to claim 5, wherein part of the adhesive block is exposed on the outer circuit unit layer, and the manufacturing method further includes the step of: removing part of the adhesive block exposed on the outer circuit unit layer. Connect the block. A circuit board, which includes a circuit substrate, a heating element and a heat dissipation block as described in claim 2 or 3. The circuit substrate includes an inner circuit unit, an outer circuit unit and a dielectric layer, and the dielectric layer is disposed on the inner side. Between the circuit unit and the outer circuit unit, the circuit board substrate has an opening, and the opening penetrates the inner circuit unit, the outer circuit unit and the dielectric layer; the heat dissipation block is provided on the In the opening, the heating element is arranged on the heat dissipation block, and the heating element is electrically connected to the outer circuit unit. The circuit board according to claim 7, further comprising an adhesive block disposed in the gap between the heat dissipation block and the inner wall of the opening. The circuit board according to claim 7, wherein the graphene layer is exposed on the outer circuit unit.

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