TWI821750B - Electronic component measuring equipment, electronic component measuring method, and led manufacturing method - Google Patents

Abstract

An electronic component measuring equipment has a first carrying platform, a second carrying platform, an actuating device, a current output module, a switching device and an optical measuring element. The first carrying platform is used to carry a probe substrate, and a plurality of probe pairs are arranged on the probe substrate. The second carrying platform is used to carry a tested substrate, and a plurality of electronic components to be tested are placed on the tested substrate. The actuating device is used to make at least part of the probe pairs on the probe substrate respectively contact the corresponding electronic components to be tested. The current output module provides a constant current to the probe substrate, and forms a conductive loop between the probe pair and the electronic component to be tested. The switching device is used to switch the constant current provided by the current output module to different probe pairs. The optical measuring component is used to measure the optical signal generated by the electronic component under test.

Description

Electronic component measuring equipment, electronic component measuring method and manufacturing of light emitting diodes manufacturing method

The invention relates to an electronic component measuring equipment, an electronic component measuring method and a manufacturing method of a light emitting diode.

In the prior art, many electronic components to be tested need to be separated from each other from the wafer substrate and then optically inspected individually. Such inspection method is not only time-consuming but also labor-intensive.

The technical problem to be solved by the present invention is to provide an electronic component measuring equipment, an electronic component measuring method and a light-emitting diode manufacturing method in view of the shortcomings of the existing technology.

In order to solve the above technical problems, one of the technical solutions adopted by the present invention is to provide an electronic component measuring equipment, which includes a first carrying platform, a second carrying platform, an actuating device, a current output module, and a switching device and an optical measuring element. The first carrying platform is used to carry a probe substrate, which is provided with a plurality of probe pairs. The second carrying platform is used to carry a substrate under test on which a plurality of electronic components under test are placed. The actuating device is used to bring the first load-bearing platform and the second load-bearing platform close to each other, so that the first load-bearing platform can be leveled At least part of the probe pairs on the probe substrate carried by the stage are respectively in contact with the corresponding electronic components to be tested on the substrate under test carried by the second carrying platform. The current output module can provide a certain current to the probe substrate carried by the first carrying platform, and form a conductive loop through the probe pair and the electronic component to be tested in contact with the probe pair, and the to-be-tested electronic component is in contact with the probe pair. The measuring electronic component can generate an optical signal through the conductive loop. The switching device can switch the constant current provided by the current output module to different probe pairs. The optical measuring element is used to measure the optical signal generated by the electronic component under test on the substrate under test carried by the second carrying platform.

In order to solve the above technical problems, another technical solution adopted by the present invention is to provide an electronic component measuring equipment, which includes: a first carrying platform, a second carrying platform, an actuating device, a current output module, a switching device, a voltage measuring element and a computing device. The first carrying platform is used to carry a probe substrate, which is provided with a plurality of probe pairs. The second carrying platform is used to carry a substrate under test, on which a plurality of electronic components under test are placed. The actuating device is used to bring the first carrying platform and the second carrying platform close to each other, so that at least part of the probe pairs on the probe substrate carried by the first carrying platform are respectively in contact with the corresponding second carrying platform. The electronic components under test on the substrate under test are in contact. The current output module can provide a certain current to the probe substrate carried by the first carrying platform, and form a conductive loop through the probe pair and the electronic component under test in contact with the probe pair. The switching device can switch the constant current provided by the current output module to different probe pairs. The voltage measuring element is used to measure the voltage of the electronic component under test on the substrate under test carried by the second carrying platform.

In order to solve the above technical problems, another technical solution adopted by the present invention is to provide a method for measuring electronic components, which includes: providing a substrate under test on which a plurality of electronic components under test are placed. ; causing the plurality of electronic components to be tested to form a plurality of circuits to be tested through a line; providing a certain current to at least one of the plurality of circuits to be tested to form a conductive circuit; and measuring the plurality of electronic components to be tested A light signal generated by at least one of the components.

In order to solve the above technical problems, another technical solution adopted by the present invention is an electronic component measurement method, which includes: providing a substrate under test on which a plurality of known resistance values are placed. Resistive elements; allowing the plurality of resistive elements with known resistance values to form a plurality of first circuits to be measured through a line; providing a certain current to one of the plurality of first circuits to be measured to form a first conductive circuit , measure the cross-voltage of the first conductive loop under the constant current to obtain a first driving voltage; replace the plurality of resistive elements with known resistance values with a plurality of electronic components; make the plurality of electronic components use A plurality of second circuits to be measured are formed by the circuit; the constant current is provided to one of the plurality of second circuits to be measured to form a second conductive circuit, and a voltage is measured under the constant current to obtain a first two driving voltages; and calculating the voltage difference between the corresponding first driving voltage and the second driving voltage.

In order to solve the above technical problems, another technical solution adopted by the present invention is to provide a manufacturing method of a light emitting diode, which includes the electronic component measurement method as described above.

In order to further understand the features and technical content of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are only for reference and illustration and are not used to limit the present invention.

Z1~Z4: Electronic component measuring equipment

M1: Second carrying platform

M2: the first carrying platform

M3: Optical measuring element

B1: first counterpoint mark

B2: Second counterpoint mark

S: Tested substrate

S1: switching device

C: Electronic components to be tested

C101: First conductive contact

C102: Second conductive contact

C1: Current output module

E1: Actuating device

D: computing device

VD1: Voltage measuring element

V1: Voltage output module

IP: image processing device

1: Probe substrate

101: First conductive line

102: Second conductive line

2G: Conductive probe group

2: Probe pair

21: First conductive contact pin

211:First cylinder

212: First conductive layer

213: First elastic contact layer

22: Second conductive contact pin

221:Second cylinder

222: Second conductive layer

223: Second elastic contact layer

P: Conductive electrode group

PG1: First conductive electrode group

PG2: Second conductive electrode group

P1: first conductive electrode

P2: Second conductive electrode

3: Control chip

T1: The first total conductive electrode

T2: The second total conductive electrode

L: light source

R1: first material layer

R2: Second material layer

W:wafer material

S110, S130, S150, S170, S210, S230, S250, S270, S290, S310, S330: Steps

FIG. 1 is a schematic top view of forming a first material layer on a wafer material during the steps of a method for manufacturing a probe substrate according to one embodiment of the present invention.

FIG. 2 is a schematic side view of forming a first material layer on a wafer material during the steps of a method for manufacturing a probe substrate according to one embodiment of the present invention.

FIG. 3 shows the steps of removing a portion of the first material layer to form a plurality of first pillars, a plurality of second pillars and a plurality of second pillars on the wafer material in the manufacturing method of the probe substrate according to one embodiment of the present invention. A top view of the second counterpoint mark.

FIG. 4 shows the steps of removing a portion of the first material layer to form a plurality of first pillars, a plurality of second pillars and a plurality of second pillars on the wafer material in the manufacturing method of the probe substrate according to one embodiment of the present invention. A side view of the second counterpoint mark.

FIG. 5 shows the steps of forming a second material layer on the wafer material to cover a plurality of first pillars, a plurality of second pillars and a plurality of third pillars in the manufacturing method of a probe substrate according to one embodiment of the present invention. A top view of the two counterpoint marks.

FIG. 6 shows the steps of forming a second material layer on the wafer material to cover a plurality of first pillars, a plurality of second pillars and a plurality of third pillars in the manufacturing method of a probe substrate according to one embodiment of the present invention. Side view of two counterpoint marks.

FIG. 7 is a schematic top view of a probe substrate according to one embodiment of the present invention.

FIG. 8 is a schematic side view of a probe substrate according to one embodiment of the present invention.

FIG. 9 is a functional block diagram of the electrical connection relationship between the first main conductive electrode and the plurality of first conductive electrodes according to one embodiment of the present invention.

FIG. 10 is a functional block diagram of the electrical connection relationship between the second main conductive electrode and the plurality of second conductive electrodes according to one embodiment of the present invention.

FIG. 11 is a schematic top view of the substrate under test according to one embodiment of the present invention.

FIG. 12 is a schematic side view of the substrate under test according to one embodiment of the present invention.

13 is a schematic side view of the probe substrate of the electronic component measuring equipment before electrical contact with the substrate under test according to one embodiment of the present invention.

14 is a schematic side view of the probe substrate of the electronic component measuring equipment according to one embodiment of the present invention after it is electrically in contact with the substrate under test.

FIG. 15 is a functional block diagram of each control chip electrically connected between the corresponding conductive electrode group and the corresponding conductive probe group according to one embodiment of the present invention.

Figure 16 is a schematic diagram of the system architecture of an electronic component measuring device according to one embodiment of the present invention. Figure.

FIG. 17 is a schematic system architecture diagram of an electronic component measuring device according to one embodiment of the present invention.

Figure 18 is a schematic top view of a probe substrate according to one embodiment of the present invention.

FIG. 19 is a schematic system architecture diagram of an electronic component measuring device according to one embodiment of the present invention.

FIG. 20 is a schematic system architecture diagram of an electronic component measuring device according to one embodiment of the present invention.

FIG. 21 is a schematic top view of a probe substrate according to another embodiment of the present invention.

Figure 22 is a schematic side view of a probe substrate according to another embodiment of the present invention.

23 is a schematic side view of an electronic component measuring device according to another embodiment of the present invention after the probe substrate electrically contacts the substrate under test.

FIG. 24 is a schematic flowchart of steps of an electronic component measurement method according to an embodiment of the present invention.

FIG. 25 is a schematic flowchart of the steps of an electronic component measurement method according to another embodiment of the present invention.

The following is a description of the implementation of the "electronic component measurement equipment and electronic component measurement method" disclosed in the present invention through specific embodiments. Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. . The present invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only simple schematic illustrations and are not depictions based on actual dimensions, as is stated in advance. The following embodiments will further describe the relevant technical content of the present invention in detail, but the disclosed content is not intended to limit the scope of the present invention. In addition, the term "or" used in this article shall include any one or combination of more of the associated listed items depending on the actual situation.

Referring to FIGS. 1 to 15 , the present invention provides an electronic component measuring device Z1, which includes: a second carrying platform M1, a first carrying platform M2 and an optical measuring element M3. The second carrying platform M1 is used to carry a substrate S under test, and a plurality of electronic components C under test are placed on the substrate S under test. The first carrying platform M2 is disposed above the second carrying platform M1 , and the first carrying platform M2 includes a probe substrate 1 and a plurality of probe pairs 2 provided on the probe substrate 1 . The optical measurement element M3 is disposed below the second carrying platform M1 for optical detection of a plurality of electronic components C to be tested. Thereby, the electronic component C to be tested can generate the light source L through the power provided by the corresponding probe pair 2, and the light source L generated by the electronic component C to be tested can pass through the optical measurement element M3 for optical detection.

[Example]

Referring to FIGS. 1 to 10 , an embodiment of the present invention provides a method for manufacturing a probe substrate 1 . For example, the manufacturing method of the probe substrate 1 may include the following steps: First, as shown in FIGS. 1 and 2 , a first semiconductor process (such as coating, evaporation, sputtering) or non-semiconductor process may be used to form a first. A material layer R1 is on a wafer material W, where the first material layer R1 can be a polymer material such as epoxy or photoresist (it can also be an inorganic material such as SiOx or SiNx, or Any elastic material or inelastic material, or any conductive material or non-conductive material), and the wafer material W can be sapphire, quartz, glass, silicon and other semiconductor materials; then, as shown in Figures 1 to 4, A portion of the first material layer R1 may be removed through a semiconductor process (such as exposure, development) or a non-semiconductor process to form a plurality of first pillars 211, a plurality of second pillars 221 and multiple pillars on the wafer material W. A second alignment mark B2; then, as shown in Figures 5 and 6, a second material layer R2 can be formed on the wafer material through a semiconductor process (such as coating, evaporation, sputtering) or a non-semiconductor process. above, to cover the plurality of first cylinders 211, the plurality of second cylinders 221 and and a plurality of second alignment marks B2; next, as shown in Figures 5 to 8, the second material layer R2 can be patterned through a semiconductor process (such as exposure, development) or a non-semiconductor process to form a probe. Substrate 1. However, the above examples are only one of the possible embodiments and are not intended to limit the present invention.

Referring to FIG. 16 , an embodiment of the present invention provides an electronic component measuring equipment Z1, which includes: a first carrying platform M2, a second carrying platform M1, an optical measuring element M3, an actuating device E1 and a current Output module C1. The actuating device E1 is electrically connected to the first bearing platform M2 and the second bearing platform M1, and is used to control the relative position between the first bearing platform M2 and the second bearing platform M1, so that the first bearing platform M2 and the second bearing platform M1 are electrically connected. The two carrying platforms M1 are close to each other for contact and alignment. The current output module C1 is used to provide current to the first carrying platform M2. In one embodiment, the current output module C1 outputs a certain current. In one embodiment, the constant current is 20 μA to 20 mA.

First, as shown in FIGS. 11 to 13 , the second carrying platform M1 can be used to carry a substrate S under test, and a plurality of electronic components to be tested C (a plurality of electronic components to be tested) are placed on the substrate S to be tested. C has not been separated from the substrate S under test, and has not been encapsulated by any packaging material, such as a bare chip). For example, the second carrying platform M1 and the substrate under test S both have light-transmitting areas, and the electronic component C under test is a bare chip that has not yet been packaged. In addition, when the electronic component C to be tested may be a horizontal wafer, each electronic component C to be tested may include a first conductive contact C101 and a second conductive contact C102. However, the present invention is not limited to the above examples.

Furthermore, as shown in FIGS. 7 to 10 , 13 and 14 , the first carrying platform M2 is movably disposed above the second carrying platform M1 , and the first carrying platform M2 includes a probe substrate 1 and a A plurality of probe pairs 2 on the probe substrate 1 . In one embodiment, the size of the probe substrate 1 and the substrate under test S may be the same or different, and each probe pair 2 may include a first conductive contact pin 21 and a second conductive contact pin 22 . However, the present invention is not limited to the above examples.

In addition, as shown in Figure 13 and Figure 14, the optical measurement element M3 is arranged on the second carrier Below the platform M1, it is used for optical inspection of at least one of the plurality of electronic components C to be tested. For example, the optical measuring element M3 can be any image capturing device with an image sensing function, but the present invention is not limited to the above examples. Thereby, as shown in FIG. 14 , when the first carrying platform M2 and the second carrying platform M1 are close to and in contact with each other through the actuating device E1 of FIG. 16 , and the first conductive contact pin 21 of each probe pair 2 and When the second conductive contact pins 22 electrically contact the first conductive contact C101 and the second conductive contact C102 of the corresponding electronic component C to be tested respectively, the electronic component C to be tested can establish a standby relationship with the corresponding probe pair 2. The test loop is used to generate the light source L by the power passing through the corresponding probe pair 2, and the light source L generated by the electronic component C to be tested can pass through the optical measurement element M3 for optical detection, thereby ensuring good quality. The electronic components to be tested and the electronic components to be tested with poor quality are screened out. For example, optical detection may include luminescence detection (detecting whether the electronic component C to be tested produces a light source L), brightness detection (detecting the brightness of the light source L generated by the electronic component C to be tested), wavelength detection, and color coordinate detection. (Detect the distribution of the light source L generated by the electronic component C under test on the chromaticity coordinate diagram).

For example, as shown in FIGS. 7 and 8 , the first conductive contact pin 21 includes a first pillar 211 disposed on the probe substrate 1 and a first conductive layer 212 covering the first pillar 211 , and The second conductive contact pin 22 includes a second pillar 221 disposed on the probe substrate 1 and a second conductive layer 222 covering the second pillar 221 . In addition, the probe substrate 1 includes a plurality of first conductive lines 101 and a plurality of second conductive lines 102 that are respectively separated from the plurality of first conductive lines 101. Each first conductive line 101 is electrically connected to the first conductive layer 212 of the corresponding first conductive contact pin 21, and each second conductive line 102 is electrically connected to the corresponding second conductive contact pin 22. Second conductive layer 222. However, the present invention is not limited to the above examples.

For example, as shown in FIGS. 7 and 8 , a plurality of probe pairs 2 can be divided into a plurality of conductive probe groups 2G, and each conductive probe group 2G includes at least two probe pairs 2 (for example, Figure 7 shows that the top conductive probe group 2G includes 3 probe pairs 2). In addition, probe substrate 1 pack It includes a plurality of conductive electrode groups P electrically connected to a plurality of conductive probe groups 2G respectively, and each conductive electrode group P includes a first conductive electrode P1 and a second conductive electrode P2. In addition, the first conductive layer 212 of the first conductive contact pins 21 of each probe pair 2 of each conductive probe group 2G can be electrically connected to (or electrically contacted with) through the corresponding first conductive line 101 ) corresponding to the first conductive electrode P1 of the conductive electrode group P. The second conductive layer 222 of the second conductive contact pins 22 of each probe pair 2 of each conductive probe group 2G can be electrically connected to (or electrically contacted with) the phase through the corresponding second conductive line 102. The corresponding second conductive electrode P2 of the conductive electrode group P. However, the present invention is not limited to the above examples.

For example, as shown in FIGS. 7 , 9 and 10 , the probe substrate 1 further includes a first total conductive electrode T1 electrically connected to a plurality of first conductive electrodes P1 and a plurality of second conductive electrodes P1 . A second overall conductive electrode T2 of the conductive electrode P2. In addition, the first total conductive electrode T1 can be electrically connected to the first conductive layer 212 of the first conductive contact pin 21 of each probe pair 2 of each conductive probe group 2G through the plurality of first conductive electrodes P1 , and the second total conductive electrode T2 can be electrically connected to the second conductive layer 222 of the second conductive contact pin 22 of each probe pair 2 of each conductive probe group 2G through the plurality of second conductive electrodes P2 . Thereby, the first total conductive electrode T1 and the second total conductive electrode T2 can provide the current from the current output module C1 to the corresponding probe pair 2 .

It is worth noting that, as shown in FIGS. 7 and 11 , the substrate S under test includes a plurality of first alignment marks B1 , and the probe substrate 1 includes a plurality of second alignment marks B1 respectively corresponding to the plurality of first alignment marks B1 . Counterpoint mark B2. Thereby, the present invention can align the first conductive contact pins 21 and the second conductive contact pins 22 of each probe pair 2 through the mutual alignment of the plurality of first alignment marks B1 and the plurality of second alignment marks B2. Can accurately electrically contact the first conductive contact C101 and the second conductive contact C102 of the corresponding electronic component C under test (as shown in Figures 13 and 14), so as to reduce the contact between the probe pair 2 and the electronic component under test C possibility of mutual misalignment.

It is worth noting that, as shown in Figure 15, when multiple probe pairs 2 are divided into multiple leads When the electrical probe group 2G (can be divided into a plurality of rectangular areas), the first carrying platform M2 may further include a plurality of control chips 3 electrically connected to the plurality of conductive probe groups 2G, and the probe substrate 1 includes a plurality of conductive electrode groups P electrically connected to a plurality of control chips 3 respectively. For example, when the control chip 3 is a current limiting chip, the current limiting chip controls the amount of current, so that multiple probe pairs 2 of the same conductive probe group 2G can respectively provide fixed currents to the corresponding probes. A plurality of electronic components to be tested C (corresponding to an electronic component to be tested area of one of the conductive probe groups 2G). Therefore, when a plurality of corresponding electronic components C under test generate light sources through fixed currents provided by a plurality of probe pairs 2 of the same conductive probe group 2G, the corresponding plurality of electronic components C under test generate light sources. Optical detection can be performed through the optical measuring element M3, so that a plurality of electronic components to be tested C located in the same area of the electronic component to be tested can be classified according to the luminous quality.

It is worth noting that the first total conductive electrode T1, the second total conductive electrode T2, a plurality of conductive electrode groups P, a plurality of first conductive lines 101, a plurality of second conductive lines 102 and a plurality of The second alignment mark B2 will be covered by an insulating protective layer (not shown), and the first conductive contact pin 21 and the second conductive contact pin 22 of each probe pair 2 are not covered by the insulating protective layer.

Referring to Figures 17 and 18, an embodiment of the present invention provides another electronic component measuring equipment Z2. In this embodiment, the electronic component measuring equipment Z2 further includes a switching device S1, wherein the switching device S1 It is electrically connected to the current output module C1 and the first carrying platform M2, and is used to switch the constant current provided by the current output module C1 to different probe pairs 2 on the first carrying platform M2.

In one embodiment, the switching device S1 can be implemented by, for example, a switching switch or a multi-channel circuit switching box, but the invention is not limited thereto.

In this embodiment, the plurality of probe pairs 2 of the probe substrate 1 may be divided into a plurality of conductive probe groups 2G, and each conductive probe group 2G includes at least two probe pairs 2 (for example, FIG. 18 The top conductive probe group 2G shown includes 5 probe pairs 2). In addition, the probe substrate 1 includes The first conductive electrode group PG1 and the second conductive electrode group PG2 are respectively electrically connected to the plurality of conductive probe groups 2G. The first conductive electrode group PG1 includes a plurality of first conductive electrodes P1, and the second conductive electrode group PG2 includes A plurality of second conductive electrodes P2, a plurality of first conductive electrodes P1 are not electrically connected to each other, a plurality of second conductive electrodes P2 are not electrically connected to each other, and a plurality of probe pairs 2 in the same conductive probe group 2G are not electrically connected to each other. The same first conductive electrode P1 is electrically connected, and a plurality of probe pairs 2 in the same conductive probe group 2G are electrically connected to different second conductive electrodes P2.

Therefore, in this embodiment, according to the control of the switching device S1, at the same point in time, at least one first conductive electrode P1 and at least one first conductive electrode P2 will simultaneously provide power to the corresponding probe pair 2, so that the probe substrate Among the plurality of probe pairs 2 of 1, one probe pair 2 or a plurality of probe pairs 2 can receive power at the same time to perform the aforementioned optical detection.

Referring to FIG. 19 , an embodiment of the present invention provides another electronic component measuring device Z3. In this embodiment, the electronic component measuring device Z3 further includes a voltage output module V1, a voltage measuring element VD1 and a computing unit. Device D, in which the voltage output module V1 is electrically connected to the first carrying platform M2 to provide a certain voltage to the first carrying platform M2. The voltage measurement unit VD1 is electrically connected to the first carrying platform M2 and is used to measure the voltage formed by the electronic component C under test on the substrate S under test carried by the second carrying platform M1. The computing device D is used to receive the voltage measured by the voltage measurement unit VD1 to calculate the driving voltage of the electronic component C under test.

Further, please refer to Figure 18 and Figure 19 at the same time. In this embodiment, at the same time, only one first conductive electrode P1 and one second conductive electrode P2 can provide power to the corresponding electronic component C under test to establish a conductive loop.

Thereby, as shown in FIG. 14 , when the first carrying platform M2 and the second carrying platform M1 are close to and in contact with each other through the actuating device E1 , and the first conductive contact pin 21 and the second conductive contact pin 21 of each probe pair 2 When the contact pins 22 electrically contact the first conductive contact C101 and the second conductive contact C102 of the corresponding electronic component C under test respectively, a plurality of electronic components C under test can establish contact with the corresponding probe pair 2. The circuit under test, and one of the probe pairs 2 will transfer the provided power to the corresponding electronic component under test C, which will make the circuit under test become a conductive circuit, the electronic component under test C generates the light source L, and the electronic component under test C generates The light source L can pass through the optical measuring element M3 for optical detection. At the same time, the voltage measurement unit VD1 (shown in FIG. 19 ) measures the driving voltage generated by the conductive circuit and provides the driving voltage to the computing device D.

In one embodiment, the voltage measurement unit VD1 measures the voltage across the first conductive electrode P1 and the second conductive electrode P2 that establishes a conductive loop with the electronic component C under test to obtain the driving voltage. For example, the voltage measurement unit VD1 measures the voltage value of the first conductive electrode P1 or the second conductive electrode P2 that receives a constant current to obtain the driving voltage.

In one embodiment, the electronic component C to be tested is, for example, a resistor component with a known resistance value.

In one embodiment, the resistance value of the electronic component with a known resistance value is greater than 0 ohms (Ω) and less than or equal to 100 ohms (Ω). For example, the resistance value of an electronic component with a known resistance value is between 0.0001 ohm (Ω) and 100 ohm (Ω), but the present invention is not limited to this.

Therefore, in an embodiment in which the electronic component C to be tested is a resistive component with a known resistance value, one of the plurality of resistive components can establish a first conductive loop with the corresponding probe pair 2 . At the same time, the voltage measurement unit VD1 measures the first driving voltage generated by the first conductive loop and provides the first driving voltage to the computing device D. Thereby, the computing device D can obtain the first driving voltage generated by each resistive element.

In one embodiment, the electronic component C to be tested is, for example, a light-emitting diode.

Therefore, in the embodiment where the electronic component C to be tested is a light-emitting diode, one of the plurality of light-emitting diodes can establish a second conductive loop with the corresponding probe pair 2, wherein the above-mentioned first conductive circuit The loop and the second conductive loop may have a corresponding relationship with each other, that is, the first conductive loop and the second conductive loop are conductive loops established by the same pair of probes 2 . One of the plurality of light-emitting diodes generates a light source L through the power provided by the corresponding probe pair 2, and the light generated by the light-emitting diodes The source L can pass through the optical measuring element M3 for optical detection. At the same time, the voltage measurement unit VD1 measures the second driving voltage generated by the second conductive loop and provides the second driving voltage to the computing device D. Thereby, the computing device D can obtain the second driving voltage generated by each light-emitting diode.

Since the first driving voltage and the second driving voltage are measured by the line formed by the same probe pair 2, and the first driving voltage is generated by a resistive element with a known resistance value, the first driving voltage and the second driving voltage can be measured by The voltage difference between the two driving voltages is the driving voltage of the light-emitting diode itself. Therefore, in the above embodiment, the computing device D can obtain the driving voltage of the light-emitting diode itself by calculating the voltage difference between the corresponding first driving voltage and the second driving voltage. At the same time, since the first driving voltage and the second driving voltage are measured by the circuit formed by the same probe pair 2, the electrical state (wiring resistance, process variation) on the circuit will not affect the light-emitting diode. The measurement result of the driving voltage further improves the accuracy of the measurement of the driving voltage of the light-emitting diode.

In one embodiment, the computing device D is, for example, a computer server, but the invention is not limited to this.

Referring to FIG. 20 , an embodiment of the present invention provides another electronic component measuring equipment Z4. In this embodiment, the electronic component measuring equipment Z4 further includes an image processing device IP, which is configured on the first carrying platform M2. To obtain images including the first alignment mark B1 and the second alignment mark B2 (as shown in Figures 7 and 11), and perform image comparison between the first bearing platform M2 and the second bearing platform M1 Alignment control enables accurate alignment of the probe pair 2 on the probe substrate 1 carried by the first carrying platform M2 and the electronic component under test C on the tested substrate S carried by the second carrying platform M1 (as shown in Figure 13 Show).

In one embodiment, the image processing device IP is, for example, an optical image alignment system, but the invention is not limited to this.

It is worth mentioning that, as shown in Figures 8, 21 and 22, after the step of patterning the second material layer R2 to form the probe substrate 1 as shown in Figure 8, the method for manufacturing the probe substrate 1 can enter One step includes: forming conductive materials with elastic buffering effects (such as nanosilver, silver paste, conductive UV glue) on the plurality of first conductive layers 212 through printing, coating, evaporation, sputtering, impregnation, etc. and a plurality of second conductive layers 222 . For example, the conductive material covers a top end of the first conductive layer 212 to form a first elastic contact layer 213 with an elastic buffering effect, and the conductive material covers a top end of the second conductive layer 222 to form a first elastic contact layer 213 with elastic buffering effect. A second elastic contact layer 223 with elastic buffering effect. Thereby, as shown in FIG. 23 , when the first conductive contact pin 21 and the second conductive contact pin 22 of each probe pair 2 electrically contact the first conductive contact point C101 and the corresponding first conductive contact point C101 of the corresponding electronic component C to be tested. When the two conductive contacts C102 are connected, the first elastic contact layer 213 of the first conductive contact pin 21 and the second elastic contact layer 223 of the second conductive contact pin 22 will directly contact the corresponding first element of the electronic component C to be tested. The conductive contact C101 and the second conductive contact C102, so the impact degree or wear degree of the first conductive contact pin 21 on the first conductive contact C101 can be reduced through the use of the first elastic contact layer 213, and the second conductive contact The degree of impact or wear of the feet 22 on the second conductive contact C102 can be reduced through the use of the second elastic contact layer 223, thereby effectively increasing the service life of the plurality of probe pairs 2.

Furthermore, as shown in FIGS. 22 and 23 , the first conductive contact pin 21 includes a first elastic contact layer 213 that partially (or completely) covers the first conductive layer 212 for electrical contact. The corresponding first conductive contact C101 of the electronic component C under test. In addition, the second conductive contact pin 22 includes a second elastic contact layer 223 that partially (or completely) covers the second conductive layer 222 for electrically contacting the corresponding second conductive contact of the electronic component C to be tested. Click C102.

Furthermore, as shown in FIGS. 21 and 22 , the first elastic contact layer 213 of the first conductive contact pins 21 of each probe pair 2 of each conductive probe group 2G can pass through the corresponding first conductive contact layer 213 . The line 101 is electrically connected to the first conductive electrode P1 of the corresponding conductive electrode group P. In addition, the second elastic contact layer 223 of the second conductive contact pins 22 of each probe pair 2 of each conductive probe group 2G can be electrically connected to the corresponding conductive circuit through the corresponding second conductive line 102. The second conductive electrode P2 of the electrode group P.

Furthermore, as shown in FIGS. 21 and 22 , the first total conductive electrode T1 can be electrically connected to each probe pair 2 of each conductive probe group 2G through a plurality of first conductive electrodes P1 The first elastic contact layer 213 of the first conductive contact pin 21 . In addition, the second total conductive electrode T2 can be electrically connected to the second elastic contact layer of the second conductive contact pin 22 of each probe pair 2 of each conductive probe group 2G through the plurality of second conductive electrodes P2 223. That is to say, since the first total conductive electrode T1 can be electrically connected to multiple first conductive electrodes P1 at the same time, the first carrying platform M2 can simultaneously support all the plurality of first conductive electrodes P1 through the use of the first total conductive electrode T1. A conductive contact pin 21 provides power. In addition, since the second total conductive electrode T2 can be electrically connected to the plurality of second conductive electrodes P2 at the same time, the first carrying platform M2 can simultaneously connect all the plurality of second conductive electrodes P2 through the use of the second total conductive electrode T2. Contact pin 22 provides power.

From the above-mentioned preferred embodiments and application methods of the present invention, an electronic component measurement method can be summarized, which can be implemented by the above-mentioned electronic component measurement equipment (Z1~Z4). As shown in Figure 24, the method includes the following steps: Provide the measured A plurality of electronic components to be tested are placed on the substrate to be tested (S110); a plurality of electronic components to be tested are formed through lines to form a plurality of circuits to be tested (S130); the lines are, for example, the probe pair 2 and the first A loop under test between the conductive electrode P1 and the second conductive electrode P2; providing a constant current to at least one of a plurality of circuits under test to form a conductive loop (S150); and measuring at least one of a plurality of electronic components under test The generated light signal (S170).

From the above-mentioned preferred embodiments and application methods of the present invention, another electronic component measurement method can be summarized, which can be implemented by the above-mentioned electronic component measurement equipment (Z2~Z4). As shown in Figure 25, the method includes the following steps: Provide the subject Test substrate, on which a plurality of resistive elements with known resistance values are placed (S210); Make a plurality of resistive elements with known resistance values pass through lines to form a plurality of first circuits to be measured (S230); provide a constant current to one of the plurality of first circuits to be measured to form a first conductive circuit. Measure the cross-voltage of the first conductive loop to obtain the first driving voltage (S250); replace a plurality of resistive elements with known resistance values with a plurality of electronic components (S270); enable the plurality of electronic components to be connected through the circuit Form a plurality of second circuits to be measured (S290); provide a constant current to one of the plurality of second circuits to be measured to form a second conductive circuit, measure the voltage under the constant current, and obtain the second driving voltage (S310) ; and calculate the voltage difference between the corresponding first driving voltage and the second driving voltage (S330).

In one embodiment, the above-mentioned electronic component is a light-emitting diode, and the manufacturing method of the light-emitting diode includes the above-mentioned electronic component measurement method.

The invention provides an electronic component measuring equipment, which can use "a second carrying platform for carrying a tested substrate, and the tested substrate includes a plurality of electronic components to be tested", and "the first carrying platform is arranged on the second carrying platform." Above the platform, the first carrying platform includes a probe substrate and a plurality of probe pairs arranged on the probe substrate, and the optical measuring element is arranged below the second carrying platform for measuring a plurality of electrons to be measured. The technical solution of "Optical detection of components" enables the electronic component to be tested to generate a light source by passing the electricity through the corresponding probe pair, and the light source generated by the electronic component to be tested can pass through an optical measuring element for optical detection. , thereby improving the optical detection efficiency of the electronic components to be tested.

The invention provides an electronic component measuring equipment, which can adopt the technology of "a plurality of probe pairs are arranged on the probe substrate" and "each probe pair includes a first conductive contact pin and a second conductive contact pin" The solution is such that when the first conductive contact pin and the second conductive contact pin of each probe pair respectively electrically contact a first conductive contact and a first conductive contact of a corresponding electronic component to be tested, When there are two conductive contacts, the electronic component under test can generate a light source by passing the electricity through the corresponding probe pair, and the light source generated by the electronic component under test can pass through an optical measuring element for optical detection, thereby improving the Optical detection efficiency of electronic components under test.

The invention provides an electronic component measuring device that can quickly calculate the drive of the electronic component under test that establishes a conductive loop with a single line by measuring the cross-voltage of a conductive loop established by a single line and different electronic components. voltage to improve the electrical detection efficiency of electronic components under test.

The contents disclosed above are only preferred and feasible embodiments of the present invention, and do not limit the scope of the patent application of the present invention. Therefore, all equivalent technical changes made by using the description and drawings of the present invention are included in the application of the present invention. within the scope of the patent.

Z1: Electronic component measuring equipment

M1: Second carrying platform

M2: the first carrying platform

M3: Optical measuring element

S: Tested substrate

C: Electronic components to be tested

C101: First conductive contact

C102: Second conductive contact

1: Probe substrate

2: Probe pair

21: First conductive contact pin

211:First cylinder

212: First conductive layer

22: Second conductive contact pin

221:Second cylinder

222: Second conductive layer

P: Conductive electrode group

P1: first conductive electrode

P2: Second conductive electrode

L: light source

Claims (13)

An electronic component measuring equipment, which includes: a first carrying platform, which is used to carry a probe substrate, the probe substrate is provided with a plurality of probe pairs; a second carrying platform, which is used to carry A substrate under test, on which a plurality of electronic components under test are placed; an actuating device, which is used to bring the first carrying platform and the second carrying platform close to each other, so that the first carrying platform At least some of the probe pairs on the probe substrate carried by the platform are in contact with the corresponding electronic components to be tested on the substrate under test carried by the second carrying platform; a current output module can provide a certain current to The probe substrate carried by the first carrying platform forms a conductive loop through the probe pair and the electronic component under test in contact with the probe pair, and the electronic component under test can be generated by the conductive loop. An optical signal; a switching device that can switch the constant current provided by the current output module to different probe pairs; and an optical measurement element that is used to measure the receptor carried by the second carrying platform. Measure the optical signal generated by the electronic component under test on the substrate. The electronic component measuring equipment as described in claim 1, wherein the current output module outputs the constant current to a probe pair on the probe substrate carried by the first carrying platform, and then the switching device switches the constant current to a probe pair on the probe substrate carried by the first carrying platform. The current output switches to the other probe pair. The electronic component measuring equipment as described in claim 1, wherein the current output module outputs the constant current to a group of probe pairs on the probe substrate carried by the first carrying platform, and then the switching device switches the The constant current output switches to another set of probe pairs. An electronic component measuring equipment, which includes: A first carrying platform, which is used to carry a probe substrate, on which a plurality of probe pairs are arranged; a second carrying platform, which is used to carry a tested substrate, on which the tested substrate A plurality of electronic components to be tested are placed; an actuating device is used to bring the first carrying platform and the second carrying platform close to each other, so that at least part of the probe substrate carried by the first carrying platform Pairs of probes are respectively in contact with the electronic components to be tested on the substrate under test carried by the corresponding second carrying platform; a current output module can provide a certain current to the probes carried by the first carrying platform The substrate forms a conductive loop through the probe pair and the electronic component under test in contact with the probe pair; a switching device that can switch the constant current provided by the current output module to different probe pairs; A voltage measuring element used to measure the voltage of the electronic component under test on the substrate under test carried by the second carrying platform; and a computing device electrically connected to the voltage measuring element to receive the voltage The voltage measured by the measuring element. The electronic component measuring equipment as described in claim 4, wherein the current output module outputs the constant current to a probe pair on the probe substrate carried by the first carrying platform, and then the switching device switches the constant current to a probe pair on the probe substrate carried by the first carrying platform. The current output switches to the other probe pair. The electronic component measurement equipment as described in claim 1 or 4, further comprising: an image processing device for aligning the probe pair on the probe substrate carried by the first carrying platform with the second carrying platform The electronic components under test on the substrate under test are aligned. An electronic component measurement method, which includes: Provide a substrate under test on which a plurality of electronic components under test are placed; provide a probe substrate on which a plurality of probe pairs are arranged; and use the probe substrate to make the plurality of probe pairs The electronic components under test form a plurality of circuits under test through a line; provide a certain current to at least one of the plurality of circuits under test to form a conductive circuit; and measure at least one of the plurality of electronic components under test The light signal generated by it. The electronic component measurement method as claimed in claim 7, wherein the optical signal is the wavelength of light. The electronic component measurement method as claimed in claim 7, wherein the optical signal is the brightness of light. A method for measuring electronic components, which includes: providing a substrate under test on which a plurality of resistive elements with known resistance values are placed; and providing a probe substrate on which a plurality of resistive elements with known resistance values are placed. A pair of probes; using the probe substrate, the plurality of resistive elements with known resistance values are formed through a line to form a plurality of first circuits to be measured; providing a certain current to one of the plurality of first circuits to be measured To form a first conductive loop, measure the cross-voltage of the first conductive loop under the constant current to obtain a first driving voltage; replace the plurality of resistive elements with known resistance values with a plurality of electronic components; Using the probe substrate, the plurality of electronic components are formed through the circuit to form a plurality of second circuits to be measured; the constant current is provided to one of the plurality of second circuits to be measured to form a second conductive circuit, Measure the voltage under the constant current to obtain a second driving voltage; and Calculate the voltage difference between the corresponding first driving voltage and the second driving voltage. The electronic component measurement method as claimed in claim 10, wherein the resistance value of the electronic component with known resistance value is greater than 0Ω and less than or equal to 100Ω. The electronic component measurement method as described in claim 7 or 10, wherein the constant current is 20 μA to 20 mA. A method for manufacturing a light-emitting diode, which includes the electronic component measurement method according to any one of claims 7 to 12.

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