TWI821491B - Processing equipment with self-diagnosis function - Google Patents

Abstract

[Problem] Provide a processing device that can self-diagnose whether there are changes in each component. [Solution] A processing device equipped with a holding table that holds a workpiece, and a self-diagnostic unit that diagnoses the state of the processing device when the processing unit is not performing processing. The self-diagnostic unit is equipped with a vibration source that The processing device imparts vibration with a vibration number in a predetermined range; a vibration sensor that observes the vibration emitted by the vibration source and propagated in the processing device and obtains a vibration waveform; and a natural vibration number recording unit that records the vibration number in the processing device. The number of vibrations generated by resonance in each component of the processing device is recorded as a natural vibration number; a frequency characteristic storage unit stores the frequency characteristics of the vibration calculated from the vibration waveform acquired by the vibration sensor; and a determination unit When the difference between the vibration number of the vibration peak included in the frequency characteristic of the vibration and the natural vibration number of the component to which the vibration peak belongs exceeds a predetermined range, it is determined that the component to which the vibration peak belongs has changed.

Description

Processing equipment with self-diagnosis function

The present invention relates to a processing device that has a self-diagnostic function and can self-diagnose whether there are changes.

In the step of forming an element wafer including a semiconductor element or an optical element from a workpiece made of silicon, sapphire, or the like, various processing devices are used. For example, a cutting device that divides the workpiece into individual elements, a laser processing device that performs laser processing, a grinding device that grinds the workpiece to thin it to a predetermined thickness, and the like are used.

These processing devices include a holding table that holds a workpiece, and a processing unit that processes the workpiece. Furthermore, a mechanism that rotates a holding table and a processing unit using a motor or the like, and a mechanism that rotates a ball screw using a motor or the like to move a slide to which the holding table and the processing unit are fixed are known (see Patent Document 1 and Patent Document 2).

If a processing device is used for many years, wear and tear will gradually occur in each component of the processing device. For example, the nut may become loose, or the groove of the ball screw may become deeper. Due to these changes, the rotation or movement of the holding table, processing unit, etc. may also change, and it may become impossible to obtain a predetermined result during processing by the processing device.

For example, if the groove of the ball screw used to hold the table for processing is planed and deepened, the slide holding the table can be moved with a lighter force, making it easier to hold the table. Move. In machining equipment, the output of the motor is appropriately controlled in order to suppress excessive movement of the holding table. However, if the slide moves with a light force, overshoot is likely to occur, and the process of overshooting is repeated when the position is controlled. Some controls that move in the opposite direction may cause the worktable to vibrate in the front and rear directions while moving. [Known technical documents] [Patent Document]

[Patent Document 1] Japanese Patent Application Publication No. Sho 62-173147 [Patent Document 2] Japanese Patent Application Publication No. 2012-161861

[Problem to be solved by the invention] If a problem occurs due to changes such as loss of each component of such a processing device, it will directly affect the processing results. Therefore, there is a tendency to detect changes in each component of the processing device at the stage before the problem occurs. Issues to implement countermeasures.

However, detecting the changing tendency of each component cannot be easily implemented by other than a few very capable operators. Therefore, in many cases, countermeasures cannot be implemented until the degree of change reaches an unacceptable level that affects the processing results.

The present invention was made in view of this problem, and an object thereof is to provide a processing device with a self-diagnostic function that can determine whether there is a change in each component.

[Technical means to solve the problem] According to one aspect of the present invention, there is provided a processing device with a self-diagnosis function, including a holding table that holds a workpiece, and a processing unit that processes the workpiece held by the holding table, and is characterized in that: A self-diagnostic unit for diagnosing the state of a processing device when the processing unit is not performing processing. The self-diagnostic unit is provided with: a vibration source that imparts vibration of a predetermined range of vibration numbers to the processing device; and a vibration sensor. Observing the vibration generated by the vibration source and propagating in the processing device, and obtaining the vibration waveform; the natural vibration number recording unit records the vibration number generated by resonance in each component of the processing device as the natural vibration number ; A frequency characteristic storage unit that stores the frequency characteristics of the vibration calculated from the vibration waveform obtained by the vibration sensor; and a determination unit that stores the vibration number of the vibration peak included in the frequency characteristic of the vibration and the vibration peak If the difference in the natural vibration numbers of the assigned constituent elements exceeds a predetermined range, it is determined that the constituent element to which the vibration peak is assigned has changed.

Preferably, the vibration source is an actuator equipped with a servo motor, and the rotation of the servo motor is repeatedly reversed to generate vibration with a vibration number in the predetermined range. Furthermore, it is preferable that the servo motor rotates the ball screw that moves the holding table or the processing unit, or the holding table.

Moreover, it is preferable that the vibration sensor is an acceleration sensor.

[Invention effect] A processing device according to one aspect of the present invention is equipped with a self-diagnosis unit. The self-diagnosis unit is equipped with a vibration source and a vibration sensor. The vibration source can generate vibration that propagates in the processing device, and the vibration sensor can observe the vibration that is emitted by the vibration source and propagates in the processing device, and obtains the vibration waveform.

When a specific vibration propagates through each component of the processing apparatus, resonance caused by the vibration occurs in each component. When the frequency characteristics of vibration are calculated from the vibration waveform acquired by the vibration sensor, a vibration peak caused by the resonance generated by each component appears in the frequency characteristics of the vibration. The number of vibrations caused by resonance in each component is called the natural vibration number, and each component has a different natural vibration number.

Therefore, each vibration peak appearing in the frequency characteristic of this vibration can be attributed to the resonance whose vibration number is a component of the natural vibration number. In addition, if changes such as loss occur in each component, the vibration number of the vibration peak appearing in the frequency characteristic of the vibration will shift.

This self-diagnosis unit includes a natural vibration number recording unit and a determination unit. The natural vibration number recording unit records the vibration number caused by resonance in each component as the natural vibration number. The determination unit compares the vibration number of the vibration peak included in the frequency characteristic of the vibration with the natural vibration number of the component to which the vibration peak belongs, and determines whether there is a change in the component based on the magnitude of the difference. That is, when the difference exceeds the predetermined range, it is determined that the component to which the vibration peak belongs has changed.

In this way, in the processing apparatus according to one aspect of the present invention, when a change occurs in each component, the occurrence of the change can be detected by the self-diagnostic unit. Therefore, countermeasures against the change can be reviewed and implemented before the change becomes large enough to cause problems in the processing results.

Therefore, according to one aspect of the present invention, a processing device having a self-diagnostic function that can determine whether there is a change in each component is provided.

An embodiment of one aspect of the present invention will be described with reference to the drawings. The processing apparatus of this embodiment is a processing apparatus used in the step of forming an element wafer including a semiconductor element or an optical element from a workpiece made of silicon, sapphire, or the like. The processing device is, for example, a cutting device that divides the workpiece into individual components, a laser processing device that performs laser processing, a grinding device that grinds the workpiece to thin it into a predetermined thickness, or a lathe cutting device. Lathe cutting device, etc.

FIG. 1 is a perspective view schematically showing the processing device of this embodiment. The processing device shown in Fig. 1 is a cutting device for cutting a workpiece. In the following, in this embodiment, the case where the processing device is the cutting device 2 is exemplified.

The cutting device 2 includes a base 4 that supports each component. A rectangular opening 4a is formed at the front corner of the base 4, and a cassette support 6 that can rise and fall is provided in the opening 4a. A cassette 8 for accommodating a plurality of frame units 1 is mounted on the upper surface of the cassette support base 6 . In addition, only the outline of the cassette 8 is shown in FIG. 1 for convenience of explanation.

The frame unit 1 has an annular frame 3 , a glue film 5 attached to the opening of the annular frame 3 , and a workpiece 7 supported by the upper surface of the glue film 5 . The workpiece 7 is, for example, a circular wafer made of a semiconductor material such as silicon, and its surface side is divided into a central element region and an outer peripheral remaining region surrounding the element region. The component area is further divided into a plurality of areas by planned dividing lines (dicing lanes) arranged in a grid, and components such as ICs and LSIs are formed in each area.

An adhesive film 5 with a diameter larger than that of the object 7 is pasted on the back side of the object 7 . The outer peripheral part of the adhesive film 5 is fixed to the annular frame 3 . That is, the workpiece 7 is supported by the annular frame 3 through the adhesive film 5 .

In addition, the object 7 does not need to be a circular wafer made of semiconductor materials such as silicon, and the material, shape, structure, etc. of the object 7 are not limited. For example, a rectangular substrate made of materials such as ceramics, resin, or metal may be used as the workpiece 7 . There are no restrictions on the type, quantity, configuration, etc. of components.

The cutting device 2 is provided with a transport mechanism (not shown), which takes out the frame unit 1 accommodated in the cassette 8 mounted on the cassette supporting platform 6, and mounts the frame unit 1 on a holding table to be described later. 14 on. If this transport mechanism is used, the frame unit 1 can be stored in the cassette 8 after the cutting process is completed.

A rectangular opening 4 b elongated in the X-axis direction (front-back direction, processing feed direction) is formed next to the cassette support base 6 . The X-axis moving table 10 , the X-axis moving mechanism 58 (see FIG. 2 ) that moves the X-axis moving table 10 in the X-axis direction, and the dust-proof and waterproof cover 12 covering the X-axis moving mechanism 58 are provided in the opening 4 b.

A holding table 14 for holding the frame unit 1 is provided above the X-axis moving table 10 . A porous member is arranged on the upper surface of the holding table 14 , and the upper surface of the porous member serves as the holding surface 14 a for holding the frame unit 1 . The holding table 14 is provided with a clamp 14b on the outer periphery, and the clamp 14b clamps the frame unit 1 mounted on the holding surface 14a.

The porous member is connected to a suction source (not shown) through a suction path (not shown) formed inside the holding table 14 . When the frame unit 1 is placed on the holding surface 14 a and the suction source is operated to cause negative pressure to act on the frame unit 1 through the suction path and the porous member, the frame unit 1 is suctioned and held by the holding table 14 .

A transport unit (not shown) for transporting the frame unit 1 to the holding table 14 is provided near the opening 4 b. The frame unit 1 transported by the transport unit is mounted on the holding surface 14a of the holding table 14 such that, for example, the upper surface side is exposed upward. In addition, this transport unit transports the frame unit 1 after cutting to the cleaning unit 50 described below.

On the upper surface of the base 4, a door-shaped support structure 24 for supporting the two sets of cutting units 22a and 22b is arranged across the opening 4b. A pair of Y-axis guide rails 28 parallel to the Y-axis direction are disposed on the upper front surface of the support structure 24 . Two Y-axis moving plates 30 are slidably installed in the Y-axis guide rail 28, and the two Y-axis moving plates 30 respectively support two sets of cutting units 22a and 22b.

A nut portion (not shown) is provided on the back side (rear side) of each Y-axis moving plate 30 , and a Y-axis ball screw 32 parallel to the Y-axis guide rail 28 is screwed into the nut portion. A Y-axis pulse motor 34 is connected to one end of each Y-axis ball screw 32 . When the Y-axis ball screw 32 is rotated by the Y-axis pulse motor 34 , the Y-axis moving plate 30 moves in the Y-axis direction along the Y-axis guide rail 28 .

A pair of Z-axis guide rails 36 parallel to the Z-axis direction are provided on the surface (front face) of each Y-axis moving plate 30 . A Z-axis moving plate 38 is slidably installed in the Z-axis guide rail.

A nut portion (not shown) is provided on the back side (rear side) of each Z-axis moving plate 38 , and a Z-axis ball screw 40 parallel to the Z-axis guide rail 36 is screwed into the nut portion. A Z-axis pulse motor 42 is connected to one end of each Z-axis ball screw 40 . When the Z-axis ball screw 40 is rotated by the Z-axis pulse motor 42 , the Z-axis moving plate 38 moves in the Z-axis direction along the Z-axis guide rail 36 .

Cutting units 22a and 22b are respectively provided under each Z-axis moving plate 38. The cutting units 22a and 22b are equipped with an annular cutting blade mounted on one end side of a main shaft serving as a rotation axis. The cutting units 22 a and 22 b are provided with cutting fluid supply means for supplying cutting fluid to the cutting blade and the frame unit 1 held by the holding table 14 . The cutting fluid is, for example, pure water.

Furthermore, an imaging unit (imaging unit) 48 for photographing the workpiece 7 and the like is provided adjacent to the cutting units 22a and 22b. When the Y-axis moving plate 30 is moved in the Y-axis direction, the cutting units 22a, 22b and the imaging unit 48 are indexed and fed in the Y-axis direction. Moreover, when the Z-axis moving plate 38 is moved in the Z-axis direction, the cutting units 22a, 22b and the imaging unit 48 will move up and down.

The X-axis moving mechanism that moves the holding table 14 in the X-axis direction will be described using FIG. 2 . Fig. 2 is a side view schematically showing the X-axis moving mechanism. In Figure 2, the annular frame 3, the adhesive film 5, the X-axis moving table 10, the dustproof and waterproof cover 12, the clamp 14b, etc. are omitted.

The X-axis moving mechanism 58 is disposed on the base 56 at the bottom inside the base 4 of the cutting device 2 . The X-axis moving mechanism 58 includes an X-axis servo motor 60 and an X-axis ball screw 62 having one end connected to the X-axis servo motor 60 . A nut portion that holds the table slider 64 is screwed into the X-axis ball screw 62. When the X-axis ball screw 62 is rotated by the X-axis servo motor 60, the table slider 64 is held in the X-axis direction.

A table base 66 is mounted above the holding table slider 64, and the holding table 14 is supported by the table base 66 through a θ-axis motor 66a. The θ-axis motor 66a rotates the holding table 14 around an axis in a direction perpendicular to the holding surface 14a.

When cutting the workpiece 7, the holding table 14 holds the workpiece 7 through the adhesive film 5, and the θ-axis motor 66a is operated and the photography unit 48 is used to make the direction of the workpiece 7 consistent with the processing feed direction. Then, the annular cutting blade installed on the cutting unit 22 is rotated, the cutting unit 22 is lowered to a predetermined height, and the X-axis moving mechanism 58 is operated to process the feed holding table 14 so that the cutting blade cuts into the workpiece. 7.

A circular opening 4c is formed at a position opposite to the opening 4a with respect to the opening 4b. A cleaning unit 50 is provided in the opening 4c. The cleaning unit 50 is used to clean the processing frame unit 1 and the like after cutting the workpiece 7. The cleaning unit 50 provided inside the opening 4c is provided with a cleaning table 52 that functions as a holding table for holding the frame unit 1, and a cleaning nozzle 54 that is held by the cleaning table 52. The cleaning fluid is sprayed from above the frame unit 1 to the frame unit 1 . The cleaning liquid is, for example, pure water.

The cleaning unit 50 will be described in detail using FIG. 3(A). FIG. 3(A) is a side view schematically showing the cleaning process performed by the cleaning unit 50 . A cross-sectional view of the frame unit 1 loaded into the cleaning unit 50 is shown in FIG. 3(A).

As shown in FIG. 3(A) , the cleaning unit 50 is provided with a servo motor 70b and a rotating shaft 70a. The servo motor 70b becomes a rotational drive source of the cleaning table 52. The rotating shaft 70a supports the cleaning table 52 and rotates the servo motor 70b. The rotational force is transmitted to the cleaning workbench 52. A plurality of legs equipped with a lifting mechanism, for example, are attached to the outer periphery of the servo motor 70b. The lifting mechanism can lift the cleaning workbench 52 .

When the cut workpiece 7 is cleaned by the cleaning unit 50 , the frame unit 1 is first placed on the cleaning table 52 and the frame unit 1 is suctioned and held on the cleaning table 52 . Next, the servo motor 70b is operated to rotate the cleaning table 52. Then, while the cleaning liquid 54a is sprayed downward from the cleaning nozzle 54, the cleaning nozzle 54 is moved above the frame unit 1 in a plane perpendicular to the rotation axis of the servo motor 70b.

As shown in FIG. 1 , the cutting device 2 includes a control unit 16 that controls each component of the cutting device 2 . The components controlled by the control unit 16 are, for example, the cassette support table 6, the holding table 14, the cutting units 22a, 22b, the Y-axis pulse motor 34, the Z-axis pulse motor 42, the photographing unit 48, the cleaning unit 50 and the X-axis movement. Agency 58 etc. However, the components controlled by the control unit 16 are not limited to this.

If the cutting device 2 is used for a long time, each component of the cutting device 2 will gradually wear out and each component will change, so that the intended result may not be obtained during processing of the cutting device 2 . For example, if the groove of the X-axis ball screw 62 is planed and deepened, the holding table slider 64 carrying the holding table 14 can be moved with a lighter force, and the holding table 14 becomes easier to hold. The situation of movement.

Therefore, in order to suppress excessive movement of the holding table 14, the output of the X-axis servo motor 60 is appropriately suppressed. However, if the holding table slide is moved with a light force, overtaking is likely to occur, and control may be repeated to move the overriding part in the opposite direction at the control position. Then, the result holding table 14 vibrates in the front-rear direction while moving, which may adversely affect the machining result. If a problem occurs due to changes such as loss, the processing results will be directly affected. Therefore, the cutting device 2 is further equipped with a self-diagnostic unit that diagnoses the status of the cutting device 2 .

The self-diagnosis unit is provided with, for example, a vibration source that imparts vibration of a predetermined range of vibration numbers to the cutting device (processing device) 2 and a vibration sensor that observes the vibrations emitted by the vibration source and in the The vibration propagating in the device 2 is cut and the vibration waveform is obtained.

For example, the vibration source may be used only to generate the vibration and may be provided at any position of the cutting device 2 . Furthermore, the cutting device 2 may be provided with a plurality of actuators for rotating or moving each component, and the actuators may be used as a vibration source of the self-diagnosis unit.

For example, the actuator used as the vibration source is the X-axis servo motor 60 included in the X-axis moving mechanism 58 . When the X-axis servo motor 60 is operated and reverse rotation is repeated, the X-axis ball screw 62 rotates while repeatedly reverse rotation, thereby keeping the table slider 64 moving forward and backward in the X-axis direction. This movement causes vibration, which propagates inside the cutting device 2 .

At this time, by changing the frequency of rotation of the reverse X-axis servo motor 60, the frequency of the vibration can be adjusted. Then, vibration with a vibration frequency within a predetermined range is generated, and the vibration is propagated inside the cutting device 2 .

The vibration sensor that observes the vibration is appropriately selected from a displacement sensor, a speed sensor, an acceleration sensor, etc. For example, they are piezoelectric elements, AE sensors or MEMS sensors. Examples of installation locations of vibration sensors are shown in FIGS. 1 and 2 . As shown in FIG. 1 , the vibration sensor 18 is disposed, for example, on the cutting units 22 a and 22 b, in front of the support structure 24 or on the upper surface of the support structure 24 . In addition, as shown in FIG. 2 , it is provided on the base 56 or the table base 66 or the like.

When vibration propagates in a vibration sensor, the vibration sensor obtains the relationship between the intensity of the vibration (displacement, speed, acceleration, etc.) and time in the form of a vibration waveform, for example. Then, if the vibration waveform is analyzed using a method such as fast Fourier transform (FFT), the relationship between the intensity of the vibration and the vibration number (frequency) of the vibration is calculated in the form of frequency characteristics. Alternatively, the vibration number of the vibration emitted by the vibration source can also be scanned, and the relationship between the intensity of the vibration observed by the vibration sensor and the vibration number of the vibration emitted by the vibration source can be calculated by plotting.

The vibration source and vibration sensor 18 are connected to the control unit 16 of the cutting device 2 and are controlled by the control unit 16 . The vibration source emits vibration according to the instruction of the control unit 16 , and the vibration sensor 18 observes the vibration according to the instruction of the control unit 16 and sends the obtained vibration waveform to the control unit 16 .

When the vibration propagates through each component of the cutting device 2, if the frequency of the vibration reaches a specific value, resonance occurs in the component. The vibration number of the vibration when this resonance occurs is called the natural vibration number. The natural vibration number is determined based on the shape, material, mass, etc. of the constituent elements, and each constituent element has a different natural vibration number. Among each component, vibrations with vibration frequencies other than the natural vibration frequencies are easily attenuated, and vibrations with natural vibration frequencies are suppressed from being attenuated by resonance.

Therefore, if a vibration source causes a vibration with a vibration number in a predetermined range, the vibration is observed with a vibration sensor to obtain the vibration waveform, and the frequency of the vibration represented by the vibration number on the horizontal axis and the vibration intensity on the vertical axis is calculated. Characteristics, then a vibration peak corresponding to the vibration number of the natural vibration number appears in the frequency characteristic of the vibration. If there is a change such as loss in the constituent elements to which these vibration peaks belong, the vibration number will shift. This self-diagnosis unit determines whether there is a change in each component using the deviation of the vibration number of the vibration peak appearing in the frequency characteristic of the vibration from the natural vibration number.

First, when each component is in a normal state, the vibration source is vibrated, and the vibration propagating in the cutting device 2 is observed with a vibration sensor to obtain the vibration waveform, the frequency characteristics of the vibration are calculated, and the vibration number of the vibration peak is recorded. As the natural vibration number of each component. Thereafter, after the cutting device 2 was operated, the vibration source was vibrated again, and the frequency characteristics of the vibration were calculated. Then, when the vibration number of the vibration peak appearing in the frequency characteristic of the vibration deviates from the natural vibration number, it is detected that the component to which the vibration peak belongs has changed from the normal state.

This self-diagnosis unit further includes a natural vibration number recording unit and a frequency characteristic memory unit in the control unit 16 . The natural vibration number recording unit 16 a records the vibration number generated by resonance in each component of the cutting device (processing device) 2 as the natural vibration number.

In order to know the natural vibration frequency of each component, for example, a hammer test in which a physical impact is given to each component to cause it to vibrate can be performed. The constituent elements of the object whose natural vibration number is to be indexed are given an impulse in a predetermined method, and the resulting vibration is observed with any vibration sensor 18 . In this case, the vibration peak of the natural vibration number of the component of the object mainly appears in the frequency characteristics of the vibration. Therefore, the vibration frequency of the vibration peak is recorded in the natural vibration frequency recording unit 16a as the natural vibration frequency of the component. The frequency characteristic storage unit 16b records and stores the frequency characteristic of the vibration calculated from the vibration waveform acquired by the vibration sensor 18.

When vibration is propagated in the cutting device 2 , the vibration waveform will be greatly changed by operating any actuator as a vibration source or observing the vibration by any vibration sensor 18 . For example, if a vibration waveform is obtained using a vibration source and a vibration sensor 18 that are close to a component whose changes are to be monitored, a peak to which the resonance in the component belongs will easily appear clearly in the frequency characteristics of the vibration. It is easy to grasp whether the constituent elements have changed.

Therefore, the frequency characteristic storage unit 16 b can also store the frequency characteristic of the vibration, and at the same time, the actuator used as the vibration source of the vibration and the vibration sensor 18 used for observation can be stored.

This self-diagnosis unit further includes a determination unit in the control unit 16 . The determination unit 16 c has a function of determining whether changes such as loss occur in each component of the cutting device 2 . When the difference between the vibration number of the vibration peak included in the calculated frequency characteristic of the vibration and the natural vibration number of the component to which the vibration peak belongs exceeds a predetermined range, the determination unit 16c determines that the vibration peak belongs to There are changes in this component.

Next, the determination in the self-diagnosis unit will be described. Here, for example, the actuator that becomes the vibration source is the X-axis servo motor 60 of the X-axis moving mechanism 58 (see FIG. 2 ), and the vibration sensor 18 (see FIG. 2 ) fixed to the table base 66 is described. 2) Used for vibration observation to determine whether there is any change in the X-axis ball screw 62. In this case, the X-axis servo motor 60 is repeatedly driven in the reverse direction to generate the vibration 68 a along the X-axis direction in the holding table slider 64 .

FIG. 4(A) is a graph schematically showing the frequency characteristics of vibration when each component is in a normal state. That is, FIG. 4(A) shows the frequency characteristic 72a before the X-axis ball screw 62 changes. This frequency characteristic 72a is calculated from a vibration waveform obtained at a predetermined time point, for example, before operation of the cutting device 2 or immediately after the completion of maintenance.

Each frequency characteristic shown in this embodiment is represented by a graph in which the horizontal axis represents the logarithmic axis of vibration frequency (Hz) and the vertical axis represents vibration intensity (arbitrary unit). As shown in FIG. 4(A) , vibration peaks appear at multiple vibration numbers (Hz) in the frequency characteristic 72a. Each vibration peak indicates that the component to which the vibration peak belongs resonates.

For example, information that the natural vibration frequency of the X-axis ball screw 62 is approximately 400 Hz is obtained through a hammer test, and the information is registered in the natural vibration frequency recording unit 16a. In this case, in the frequency characteristic 72 a , the vibration peak 76 a that appears near 400 Hz, which is the natural vibration number 74 of the X-axis ball screw 62 , belongs to the X-axis ball screw 62 .

Next, FIG. 4(B) shows the frequency characteristics in a case where a part of the constituent elements obtained after repeated operation of the cutting device 2 changes. FIG. 4(B) is a graph schematically showing the frequency characteristics of vibration in a case where the X-axis ball screw 62 changes. If the frequency characteristic 72b shown in FIG. 4(B) is compared with the frequency characteristic 72a shown in FIG. 4(A), it can be seen that the vibration peak 76b attributed to the X-axis ball screw 62 in the frequency characteristic 72b is derived from the natural vibration number. 74 is shifted to the high vibration number side.

At this time, when the change of the X-axis ball screw 62 is within the allowable range and the difference 82b between the vibration number of the vibration peak 76b and the natural vibration number 74 falls within the allowable predetermined range, the determination unit 16c does not determine There are changes to the X-axis ball screw 62. On the other hand, when the change in the X-axis ball screw 62 exceeds the allowable range and the difference 82b exceeds the predetermined range, the determination unit 16c determines that the X-axis ball screw 62 to which the vibration peak 76b belongs has changed.

In addition, the predetermined range of the difference 82b used to determine whether there is a change can be appropriately set for each component. For example, the range of the difference 82 b that occurs when the change in the component is so large that it is very close to the extent that a defective condition occurs in the processing in the cutting device (processing device) 2 . Or, set it to the range of the difference 82b that occurs when the change in the component is so large that it is very close to the following situation: it is foreseeable that a defect will occur in the processing, and it is considered necessary to take corrective measures for the component before the defect occurs. .

Another example of the determination performed by the determination unit 16c will be described using FIG. 5 . Here, an example of determining whether the table base 66 has changed will be described. As in the above example, the actuator that becomes the vibration source is the X-axis servo motor 60 of the X-axis moving mechanism 58, and the vibration sensor 18 fixed to the table base 66 is used for observation of vibration. Even in this case, the X-axis servo motor 60 is repeatedly driven in the reverse direction, causing the holding table slider 64 to generate the vibration 68 a along the X-axis direction.

FIG. 5(A) is a graph schematically showing the vibration frequency characteristics of each component in a normal state. That is, FIG. 5(A) shows the frequency characteristic 72c before the table base 66 changes. For example, information that the natural vibration frequency of the table base 66 is approximately 180 Hz is obtained through a hammer test, and the information is registered in the natural vibration frequency recording unit 16a. In this case, in the frequency characteristic 72c, the vibration peak 80a that appears near 180 Hz, which is the natural vibration number 78 of the table base 66, belongs to the table base 66.

Next, FIG. 5(B) shows the frequency characteristics of the vibration in which some of the constituent elements obtained after repeated operations of the cutting device 2 change. FIG. 5(B) is a graph schematically showing the frequency characteristics of vibration when there is a change in the table base 66 . If the frequency characteristic 72d shown in FIG. 5(B) is compared with the frequency characteristic 72c shown in FIG. 5(A), it can be seen that the vibration peak 80b attributed to the table base 66 in the frequency characteristic 72d is derived from the natural vibration number. 78 is shifted to the high vibration number side.

At this time, the change of the table base 66 exceeds the allowable range. When the difference 82b between the vibration frequency of the vibration peak 80b and the natural vibration number 78 of the table base 66 exceeds the predetermined range, the determination unit 16c determines the vibration. There is a change in peak 80b.

When the determination part 16c makes a determination, a component other than the X-axis servo motor 60 may be used as a vibration source to generate vibration. For example, a θ-axis motor 66 a that rotates the holding table 14 around an axis in a direction perpendicular to the holding surface 14 a may be used as the vibration source. In this case, as shown in FIG. 2 , the reverse driving is repeated to generate the vibration 68 b at a vibration frequency in a predetermined range.

In addition, the control unit 16 can also store information related to the status of each component of the cutting device 2 when the vibration waveform is obtained. When observing vibration, the control unit 16 can also control each component based on the memorized information. For example, the vibration waveform changes depending on the relative position of the holding table slide 64 relative to the X-axis ball screw 62 . Therefore, when determining whether there is any change in each component before and after operation of the cutting device 2, in order to measure the vibration under certain conditions, the relative position must be the same for each measurement.

Therefore, the relative position of the table slide 64 relative to the X-axis ball screw 62 is stored in the control unit 16 as information related to the status of the X-axis ball screw 62 or the table base 66 . Then, when determining whether there is such a change, the control unit 16 causes the vibration source to vibrate after moving the holding table slider 64 to a predetermined position based on the information, and causes the vibration sensor 18 to acquire the vibration waveform.

In addition, the determination by the determination unit 16 c is performed while cutting (processing) by the cutting unit (processing unit) or cleaning processing of the workpiece 7 by the cleaning unit 50 is not performed. The vibration generated by resonance in each component tends to be weaker than the vibration generated in the cutting device 2 due to processing or cleaning of the workpiece 7 . Therefore, if the determination by the determination unit 16 c is performed while the workpiece 7 is being processed or cleaned, the vibration caused by the resonance may be covered by the vibration waveform generated by the processing or cleaning.

Furthermore, when scanning the vibration frequency of the vibration generated by the vibration source to calculate the frequency characteristics of the vibration, the vibration source of the vibration may be degraded when the determination unit 16c performs the determination. A situation in which the intended vibration cannot be emitted. For example, there is a case where the X-axis ball screw 62 is greatly deteriorated, and even if the X-axis servo motor 60 is operated to generate vibration of a predetermined vibration number, the vibration of the target vibration number is not generated.

Therefore, it can also be verified in advance whether the vibration source is in a state capable of emitting vibration at the target vibration number. For example, a vibration sensor capable of detecting the vibration number of the vibration can be installed on the holding table slide 64, and a command to generate a vibration of a predetermined vibration number is issued to the vibration source, and it is tested whether the vibration sensor can detect the predetermined vibration number. of vibration. In this case, it can also be determined whether there is a change in the X-axis servo motor 60 based on the relationship between the command and the detected vibration.

As described above, the processing device of this embodiment is equipped with a self-diagnostic unit that implements a self-diagnostic function. Therefore, even if a skilled operator does not check the processing device, the occurrence of changes in each component can be detected. Here, the so-called self-diagnostic unit refers to a unit that includes a vibration source, a vibration sensor, a natural vibration number recording unit, a frequency characteristic memory unit, a determination unit, etc., and that cooperates to diagnose the status of the processing device. Therefore, this embodiment provides a processing device equipped with a self-diagnosis function.

In addition, the present invention is not limited to the description of the above embodiment, and can be implemented with various modifications. For example, in the above-mentioned embodiment, the case in which the determination unit 16c of the self-diagnosis unit determines whether or not the components of the X-axis moving mechanism 58 have changed has been described. However, one aspect of the present invention does not Limited by this. For example, the determination part 16c may determine whether the component to which the cleaning unit 50 belongs has changed. FIG. 3(B) is a side view schematically showing vibration occurring in the cleaning unit 50 .

When determining whether a component of the cleaning unit 50 has changed, for example, the servo motor 70b that rotates the cleaning table 52 can be used as the vibration source of the self-diagnosis unit. In this case, the servo motor 70b is operated while repeating the reverse rotation, thereby generating the vibration 68c. In this way, it can be determined whether there is a change in the cleaning table 52 or the rotating shaft 70a, for example.

In addition, the structure, method, etc. of the above-mentioned embodiment can be suitably changed and implemented as long as they do not deviate from the intended scope of the present invention.

1: Frame unit 3:Frame 5: Adhesive film 7: Processed objects 2: Cutting device 4:Abutment 4a, 4b, 4c: opening 6: Cassette support platform 8: Cassette 10:X-axis mobile worktable 12: Dustproof and waterproof case 14: Keep the workbench 14a:Maintenance surface 14b: Fixture 16:Control unit 16a: Natural vibration number recording part 16b: Frequency characteristics memory part 16c: Judgment Department 18:Vibration sensor 22, 22a, 22b: cutting unit 24:Support structure 28: Y-axis guide rail 30: Y-axis moving plate 32: Y-axis ball screw 34: Y-axis pulse motor 36:Z-axis guide rail 38:Z-axis moving plate 40:Z-axis ball screw 42:Z-axis pulse motor 48: Photography unit 50:Cleaning unit 52: Cleaning the workbench 54: Clean the nozzle 54a:Cleaning fluid 56:Pedestal 58:X-axis moving mechanism 60, 70b: Servo motor 62:X-axis ball screw 64: Keep the table slide 66:Workbench base 66a:θ axis motor 68a, 68b, 68c vibration 70a:Rotation axis 72a, 72b: Vibration waveform 74, 78: Natural vibration number 76a, 76b, 80a, 80b: Peak 82a, 82b: difference

Fig. 1 is a perspective view schematically showing a processing device. FIG. 2 is a side view schematically showing an example of the moving mechanism. In FIG. 3 , FIG. 3(A) is a side view schematically showing cleaning performed by the cleaning unit, and FIG. 3(B) is a side view schematically showing vibration occurring in the cleaning unit. In Figure 4, Figure 4(A) is a graph schematically showing the frequency characteristics of vibration in a normal state with no change in each component, and Figure 4(B) is a graph schematically showing a change in the X-axis ball screw. Graph of the frequency characteristics of vibration in this case. In Figure 5, Figure 5(A) is a graph schematically showing the frequency characteristics of vibration in a normal state with no change in each component, and Figure 5(B) is a graph schematically showing a change in the workbench base. Graph of frequency characteristics of vibration in case

1: Frame unit

3:Frame

5: Adhesive film

7: Processed objects

2: Cutting device

4:Abutment

4a, 4b, 4c: opening

6: Cassette support platform

8: Cassette

10:X-axis mobile worktable

12: Dustproof and waterproof case

14: Keep the workbench

14a:Maintenance surface

14b: Fixture

16:Control unit

16a: Natural vibration number recording part

16b: Frequency characteristics memory part

16c: Judgment Department

18:Vibration sensor

22a, 22b: cutting unit

28: Y-axis guide rail

30: Y-axis moving plate

32: Y-axis ball screw

34: Y-axis pulse motor

36:Z-axis guide rail

38:Z-axis moving plate

40:Z-axis ball screw

42:Z-axis pulse motor

48: Photography unit

50:Cleaning unit

52: Cleaning the workbench

54: Clean the nozzle

Claims (4)

A processing device with a self-diagnosis function, which is provided with a holding workbench that holds a workpiece, and a processing unit that processes the workpiece held by the holding worktable. It is characterized in that the processing device is equipped with: a device that controls the processing device. A control unit for each component, and a self-diagnosis unit for diagnosing the state of the processing device when the processing unit is not performing processing. The self-diagnosis unit is provided with a vibration source that imparts a vibration number in a predetermined range to the processing device. vibration; and a vibration sensor that observes the vibration emitted by the vibration source and propagated in the processing device, and obtains the vibration waveform; the self-diagnosis unit further includes in the control unit: a natural vibration number recording unit , when each component of the processing device is in a normal state, the frequency characteristics of the vibration are calculated from the vibration waveform obtained by observing the vibration propagating in the processing device with the vibration sensor, and the frequency characteristics of the vibration are calculated. The number of vibrations generated by resonance in each component of the processing device is recorded as a natural vibration number; a frequency characteristic storage unit stores the frequency characteristics of the vibration calculated from the vibration waveform acquired by the vibration sensor; and a determination unit, When the difference between the vibration number of the vibration peak included in the frequency characteristic of the vibration and the natural vibration number recorded in the natural vibration number recording part of the component to which the vibration peak belongs exceeds a predetermined range, the vibration peak is determined There is a change in the assigned component, and the control unit stores information related to the state of each component of the processing device when the vibration waveform is obtained, and the vibration waveform is the natural vibration recorded by the natural vibration number recording unit. Several times, the control unit controls the components according to the information to cause the vibration source to vibrate. The information is the same as when the frequency characteristic memory unit stores the frequency characteristics after the operation of the processing device. Depends on the status of the constituent elements. The processing device with a self-diagnosis function as described in item 1 of the patent application, wherein the vibration source is an actuator equipped with a servo motor, and the rotation of the servo motor is repeatedly reversed to generate vibration with a vibration number in the predetermined range . For example, in the processing device with self-diagnosis function described in item 2 of the patent application, the servo motor rotates the ball screw that moves the holding table or the processing unit, or the holding table. The processing device with self-diagnosis function as described in any one of items 1 to 3 of the patent application, wherein the vibration sensor is an acceleration sensor.