TWI821245B - Resin composition for wafer level packaging sealing - Google Patents

Abstract

The object of the present invention is to provide a resin composition for wafer-level packaging sealing, which can reduce the warpage of the sealed substrate and has excellent fluidity. A solution to the problem is a resin composition for wafer-level packaging sealing, which contains a specific first epoxy resin, a specific second epoxy resin, a thiol compound having two or more thiol groups in the molecule, and an inorganic filler.

Description

Resin composition for wafer level packaging sealing

The present invention relates to a resin composition for wafer level packaging and sealing.

In recent years, as electronic devices have become smaller and thinner, wafer-level packaging (WLP), which contributes to thinner packaging of semiconductors, has attracted attention. WLP refers to a semiconductor package that is sealed with sealing resin in the wafer (or pseudo-wafer) state. WLP is known to include fan-in type WLP and fan-out type WLP.

For example, in the case of the fan-in type, a rewiring layer or the like is formed on a disk-shaped semiconductor substrate (wafer). In addition, the wafer is sealed with sealing resin. After the sealing step, the wafer is cut into multiple semiconductor packages.

On the other hand, in the case of the fan-out type, the semiconductor wafer is cut in advance to obtain a plurality of semiconductor wafers. The plurality of obtained semiconductor wafers have a size similar to that of a wafer, and are arranged on, for example, a film-like carrier substrate (quasi-wafer). Next, the sealing resin is supplied to the carrier substrate and covers the plurality of semiconductor wafers to seal the plurality of semiconductor wafers together. Then, the carrier substrate is peeled off from the composition of the semiconductor wafer and the sealing resin. Due to peeling of the carrier substrate, the circuit formation surface of each semiconductor chip will be exposed. A rewiring layer and the like are formed on the exposed circuit formation surface. Then, the composition of the plurality of semiconductor wafers and the sealing resin is cut into individual semiconductor wafers. Multiple semiconductor packages can thereby be obtained.

WLP is a sealing step performed on the wafer (or fake wafer). Therefore, it is necessary to form a thin sealing layer over a large area, and a sealing method using compression molding, which is advantageous from this point of view, is gradually being used. In the compression molding method, a thermosetting resin composition is supplied as a sealing resin to items such as wafers. Next, the resin composition is pressurized by a hot plate or the like, whereby the resin composition is pressed apart and a sealing layer is formed in one breath.

In the sealing step of WLP, since the area of the sealing layer is large, warpage of the sealed wafer etc. becomes a problem. As a means of suppressing warpage, it is known to increase the content of the inorganic filler in the sealing resin composition. However, if the content of the inorganic filler is increased, the viscosity of the resin composition increases and the fluidity decreases. As a result, the formability during compression molding decreases.

In order to solve such a problem, Patent Document 1 discloses an epoxy resin composition for manufacturing electronic parts, which contains a specific content of epoxy resin, a specific content of an acid anhydride, a specific microcapsule type hardening accelerator and a specific molten spherical diamine. Silicon oxide. [Prior technical literature] [Patent Document]

[Patent Document 1] International Publication No. 2009/142065

[Problem to be solved by the invention]

The present inventors examined the use of an epoxy resin composition using a thiol compound as a hardener as a resin composition for wafer-level packaging sealing. Thiol compounds are advantageous compared to other hardeners in terms of excellent low-temperature hardening properties. However, epoxy resin compositions using thiol compounds have problems with reducing warpage. Therefore, an object of the present invention is to provide a resin composition for wafer-level packaging sealing, which uses a thiol compound as a hardener, has excellent fluidity, and can reduce warpage of the substrate. [Means used to solve problems]

In order to solve the above-mentioned problems, the present invention includes the following items. [1] A resin composition for wafer-level packaging sealing, which contains: (A1) a first epoxy resin that is liquid at 25°C and has an epoxy equivalent of 250 to 1000; (A2) has a resin composition lower than the aforementioned first epoxy resin; A second epoxy resin having an epoxy equivalent of 1 epoxy resin, (B) a thiol compound having two or more thiol groups in the molecule, and (C) an inorganic filler. [2] The resin composition of [1], wherein the first epoxy resin (A1) has a viscosity of 20 Pa･S or less at 25°C. [3] The resin composition of [1] or [2], wherein the epoxy equivalent of the second epoxy resin (A2) is 80 or more and less than 250. [4] The resin composition according to any one of [1] to [3], wherein the mass ratio (A1:A2) of the first epoxy resin (A1) and the second epoxy resin (A2) is 10 ;1～1:10. [5] The resin composition according to any one of [1] to [4], wherein the aforementioned thiol compound contains ester-free thiol. [6] The resin composition according to any one of [1] to [4], wherein the aforementioned thiol compound contains at least one compound represented by any one of the following formulas (3) to (5), In the formulas (3) to (5), R ₁ to R ₁₁ are each independently represented by a linear or branched divalent hydrocarbon group having 1 to 6 carbon atoms. The hydrocarbon groups from R ₁ to R ₁₁ may further include more than one compound consisting of A divalent group represented by any one of the following formulas (6) to (8), [7] The resin composition according to any one of [1] to [4], wherein the aforementioned thiol compound includes ginseng (3-mercaptopropyl) isocyanurate, trimethylolpropane ginseng (3-mercaptopropyl) isocyanurate, -Mercaptopropionate) (TMTP), trimethylolpropane (thiol acetate), pentaerythritol (thiol acetate), ethylene glycol dithiol acetate, pentaerythritol (β-thiol acetate) At least one compound in the group consisting of polypropionate) and dipentaerythritol poly(beta-thiopropionate). [8] The resin composition according to any one of [1] to [7], wherein the inorganic filler contains silica. [9] The resin composition of [8], wherein the aforementioned silica is fused silica. [10] The resin composition of [8] or [9], wherein the aforementioned silica is spherical. [11] The resin composition according to any one of [1] to [10], wherein the content of the inorganic filler is 30 to 95 parts by mass relative to 100 parts by mass of all non-volatile components in the resin composition. [12] The resin composition according to any one of [1] to [11], further comprising (D) a latent hardening accelerator. [13] The resin composition according to [12], wherein the latent hardening accelerator includes a solid dispersion type latent hardening accelerator. [14] The resin composition according to any one of [1] to [13], further comprising (E) a preservation stabilizer. [15] The resin composition of [14], wherein the aforementioned storage stabilizer includes a compound selected from the group consisting of borate ester compounds, titanate ester compounds, aluminate ester compounds, zirconate ester compounds, isocyanate compounds, carboxylic acids, acid anhydrides and mercapto groups. More than one organic acid. [16] The resin composition according to any one of [1] to [15], wherein the viscosity is 300 Pa･S or less. [17] The resin composition according to any one of [1] to [16], wherein the glass transition temperature of the cured product obtained by heating at 80°C for 30 minutes is 100°C or less. [18] The resin composition according to any one of [1] to [17], wherein the cured product obtained by heating at 80°C for 30 minutes has a tensile elastic modulus at 25°C of 10,000 MPa or less. [19] A wafer level package, which includes a semiconductor substrate and a sealing layer that seals the semiconductor substrate, the sealing layer being made of a cured product of the resin composition according to any one of [1] to [18]. form. [20] A method for manufacturing wafer-level packaging, which includes: supplying the resin composition according to any one of [1] to [18] on a substrate; and compressing the supplied resin into The steps in forming the composition. [Effects of the invention]

According to the present invention, a resin composition for wafer level packaging sealing can be provided, which can reduce the warpage of the sealed substrate.

The resin composition for wafer level packaging sealing according to the embodiment of the present invention includes: (A1) a first epoxy resin having a specific epoxy equivalent, (A2) an epoxy resin having an epoxy equivalent lower than the first epoxy resin. The second epoxy resin, (B) a thiol compound having two or more thiol groups in the molecule, and (C) an inorganic filler. According to this embodiment, it is possible to provide a resin composition for wafer level packaging sealing, which can reduce warpage after sealing by using a combination of a first epoxy resin, a second epoxy resin, a thiol compound, and an inorganic filler. .

[Resin composition for wafer level packaging sealing] The resin composition related to this embodiment can be used as a sealing resin in wafer level packaging. As mentioned previously, wafer-level packaging is a semiconductor package that seals a wafer (or a pseudo-wafer) with a sealing resin. During the manufacturing process of wafer-level packaging, a substrate (semiconductor wafer) containing multiple portions intended to become semiconductor wafers or a substrate (carrying substrate) carrying multiple semiconductor wafers is sealed together. After the sealing step, the substrate is cut corresponding to multiple semiconductor wafers to obtain multiple wafer level packages. Therefore, wafer-level packaging can also be understood as semiconductor packaging obtained by sealing materials together before the final cutting step. As mentioned previously, wafer level packaging is known as fan-in type and fan-out type. The resin composition for wafer level packaging sealing according to this embodiment can be used as either a fan-in type or a fan-out type sealing resin.

The resin composition related to this embodiment is suitable for use as a resin composition for compression molding. In the compression molding method, the sealing resin composition is supplied to the substrate to be sealed. Next, the supplied resin is pressurized between it and the substrate using a hot plate or the like. In the compression molding method, the resin composition is distributed to every corner when pressurized, so the resin composition requires a certain degree of fluidity. The resin composition according to this embodiment has an appropriate degree of fluidity (viscosity) to be used as a resin composition for compression molding.

[(A1) 1st epoxy resin] The first epoxy resin contained in the resin composition according to this embodiment is liquid at 25° C. and has an epoxy equivalent of 250 to 1,000. Here, the epoxy equivalent refers to the mass of the epoxy resin containing one epoxy group, and can be measured according to JIS K 7236 (2009). The epoxy equivalent of the first epoxy resin is preferably 250-800, more preferably 250-700, more preferably 250-650, even 250-600, even 300-600, even 400-600, most preferably 400 ~500.

The content of the first epoxy resin in the resin composition is, for example, 3 to 50 mass %, preferably 5 to 40 mass %, and more preferably 7 to 30 mass %, when the non-volatile component of the resin composition is 100 mass %. mass %, more preferably 10 to 25 mass %. Alternatively, the content of the first epoxy resin in the resin composition is 3 to 10% by mass when the non-volatile component of the resin composition is 100% by mass.

The first epoxy resin has a viscosity of 20 Pa･S or less at 25°C, preferably 0.05 to 20 Pa･S, more preferably 0.1 to 18 Pa･S. The molecular weight of the first epoxy resin is, for example, 300 to 3000, preferably 400 to 2500, and more preferably 500 to 1500.

Examples of the first epoxy resin include bisphenol A-type epoxy resin, polyalkylene-type epoxy resin, and fluorene-type epoxy resin. Examples of the bisphenol A-type resin include vinyl ether-modified bisphenol A-type epoxy resin.

Suitable first epoxy resins include epoxy resins represented by the following formula (1) or (2). Here, in _the formulas (1) and ( ₂ ), X _, (Except for the case where X is -O-CH ₂ -CH(-OH)-CH ₂ -). In addition, Ar, Ar ₁ and Ar ₂ may be the same or different from each other, and are hydrocarbon groups containing a divalent aromatic group having a main skeleton having a divalent aromatic group. n and m are each independently an integer from 1 to 20, preferably an integer from 1 to 10. The n X's in formula (1) may be the same or different from each other. The m X ₁ and m X ₂ in the formula (2) may be the same or different from each other. In addition, in the formulas (1) and (2), the "main skeleton" refers to the skeleton with the longest chain among the skeletons connecting the epoxy groups at both ends.

(a) X, X ₁ and X ₂ Next, X, X ₁ and X ₂ in the formulas (1) and (2) will be described in detail below. As mentioned above, X, X ₁ and X ₂ are "divalent groups whose main skeleton contains two or more non-aromatic hydrocarbon groups -(CH ₂ )-".

_{Among X ,} "Two or more -(CH ₂ )-" can be directly bonded, or can be bonded through ether bond, ester bond, amide bond, two carbons bonded by a double bond, two carbons bonded by a parabond, or thioether bond Come to bond.

Examples of X, X ₁ and X ₂ include an alkylene group and an alkyleneoxy group, which may or may not have a substituent. Examples of the substituent here include a hydroxyl group, a halogen atom, an alkyl group, a cycloalkyl group, an alkoxy group, a cycloalkoxy group, an amino group, a silyl group, a hydroxyl group, a hydroxyl group, a carboxyl group, and a cyano group. , nitro, hydroxyl, sulfhydryl and side oxygen groups.

Examples of the halogen atom used as the substituent include a fluorine atom, a chlorine atom, a bromine atom and an iodine atom.

The alkyl group used as a substituent may be linear or branched. The number of carbon atoms of the alkyl group is preferably 1 to 20, more preferably 1 to 14, more preferably 1 to 12, still more preferably 1 to 6, particularly preferably 1 to 3. Examples of the alkyl group include methyl, ethyl, propyl, isopropyl, butyl, second butyl, isobutyl, third butyl, pentyl, hexyl, heptyl, octyl, and nonyl. and decyl. As will be described later, the alkyl group used as a substituent may further have a substituent ("secondary substituent"). Examples of the alkyl group having this secondary substituent include an alkyl group substituted with a halogen atom. Specific examples include trifluoromethyl, trichloromethyl, tetrafluoroethyl, tetrachloroethyl, and the like.

The number of carbon atoms of the cycloalkyl group used as a substituent is preferably 3 to 20, more preferably 3 to 12, and more preferably 3 to 6. Examples of the cycloalkyl group include cyclopropyl, cyclobutyl, cyclopentyl, and cyclohexyl.

The alkoxy group used as a substituent may be linear or branched. The number of carbon atoms of the alkoxy group is preferably 1 to 20, more preferably 1 to 12, and more preferably 1 to 6. Examples of the alkoxy group include methoxy, ethoxy, propoxy, isopropoxy, butoxy, second butoxy, isobutoxy, third butoxy, and pentoxy, Hexyloxy, heptyloxy, octyloxy, nonyloxy and decyloxy.

The number of carbon atoms of the cycloalkoxy group used as a substituent is preferably 3 to 20, more preferably 3 to 12, and more preferably 3 to 6. Examples of the cycloalkoxy group include cyclopropoxy group, cyclobutoxy group, cyclopentyloxy group and cyclohexyloxy group.

The amino group used as a substituent may be linear or branched aliphatic or aromatic. The number of carbon atoms of the amine group is preferably 1 to 20, more preferably 1 to 12, and more preferably 1 to 6. Examples of the amino group include aminomethyl, aminoethyl, aminopropyl, isopropylamine, aminobutoxy, second butylamino, isobutylamine, third butylamino, and aminepentyl. Aminohexyl, amineheptyl, amineoctyl, aminenonyl, aminedecyl, aminephenyl, etc.

The silyl group used as a substituent may be linear or branched. The number of carbon atoms of the silyl group is preferably 1 to 20, more preferably 1 to 12, and more preferably 1 to 6. Examples of the silyl group include methylsilyl group, ethylsilyl group, propylsilyl group, isopropylsilyl group, butoxysilyl group, second butylsilyl group, and isobutylsilyl group. , tertiary butylsilyl, pentylsilyl, hexylsilyl, heptylsilyl, octylsilyl, nonylsilyl and decylsilyl.

The acyl group used as a substituent refers to the formula: The group represented by -C(=O)-Ra (in the formula, Ra is an alkyl group). The alkyl group represented by Ra may be linear or branched. The number of carbon atoms of the acyl group is preferably 2 to 20, more preferably 2 to 13, and more preferably 2 to 7. Examples of the acyl group include an acetyl group, a propyl group, a butyl group, an isobutyl group and a pivalyl group.

The acyloxy group used as a substituent refers to the formula: The group represented by -O-C(=O)-Rb (in the formula, Rb is an alkyl group). The alkyl group represented by Rb may be linear or branched. The number of carbon atoms of the acyloxy group is preferably 2 to 20, more preferably 2 to 13, and more preferably 2 to 7. Examples of the acyloxy group include an acetyloxy group, a propionyloxy group, a butyloxy group, an isobutyloxy group and a pivalyloxy group.

In addition to " _two or more -(CH ₂ )-", X _, base, cycloalkynylene, polyalkenylene, dialkynylene, trialkynylene, etc.

_{X ,} In addition, here, when the above-mentioned carbon number includes a substituent, it is the number excluding the carbon number of the substituent.

The alkyleneoxy group may have, for example, one or more structures represented by the following formula. Here, p, r, u and w are integers from 1 to 20, with 1 to 10 being preferred, 1 to 6 being preferred, and 1 to 3 being preferred. Here, q, s, t, v, y and z are integers from 1 to 20, with 1 to 10 being preferred, 1 to 6 being preferred, and 1 to 3 being preferred.

(b) Ar, Ar ₁ and Ar ₂ Next, Ar, Ar ₁ and Ar ₂ of the formulas (1) and (2) will be described in detail. As mentioned previously, Ar, Ar ₁ and Ar ₂ are "divalent aromatic-containing hydrocarbon groups whose main skeleton contains a divalent aromatic group". In addition, in formulas (1) and (2), Ar, Ar ₁ and Ar ₂ may be the same or different from each other, and may or may not have a substituent.

In the "divalent aromatic-containing hydrocarbon group having a main skeleton containing a divalent aromatic group", the aromatic group may be, for example, a phenylene group, a naphthyl group, an anthracenyl group, or a biphenyl group. The phenylene group can be o-, m- or p-phenylene. The divalent aromatic-containing hydrocarbon group may contain two or more aromatic groups. In the case of containing more than two aromatic groups, the aromatic groups can be bonded directly, or through an alkylene group, an ether bond, an ester bond, an amide bond, two carbons bonded by a double bond, or a parabond. of two carbons etc. to bond.

Particularly suitable hydrocarbon groups containing divalent aromatic groups include: .

The epoxy resin of formula (2) may have a structure represented by the following formula (2)'. The definitions of X ₃ to X ₆ and Ar ₃ to Ar ₄ in formula (2)' are the same as the definitions of X or Ar above. X ₃ , X ₄ , m' X ₅ , and m' X ₆ in the formula (2)' may be the same or different from each other. X and X ₃ to X ₆ may be groups selected from the above (b1) to (b6). m' is 1 to 20, preferably an integer from 1 to 10.

Examples of the first epoxy resin include resins having the following structures (k is an integer from 1 to 20, preferably an integer from 1 to 5).

In addition, examples of the first epoxy resin include resins having the following structures (h is an integer of 0 to 20, preferably 0 to 5, i and j are each an integer of 1 to 20, preferably 1 to 5). Integer, preferably an integer from i+j=2 to 10). and

Examples of the first epoxy resin include EPICLONEXA-4850-150 manufactured by DIC Corporation (belonging to formula (1)), EXA-4816 (belonging to formula (1)) of the same series, and EXA-4822 (belonging to formula (1)). )); ADEKA RESIN EP-4000S (belonging to formula (2)) manufactured by ADEKA and the same series of EP-4000SS (belonging to formula (2)), EP-4003S (belonging to formula (2)) and EP-4010S (belonging to Formula (2)); RIKARESIN BEO-60E and BPO-20E of the same series manufactured by New Nippon Rika Co., Ltd.; YL7175-500, YL7175-1000, YL7410 and YX7105 of the same series manufactured by Mitsubishi Chemical Corporation; manufactured by Osaka Gas Chemical Company EG-280; and DENACOL EX-830 manufactured by Nagase ChemteX Company, etc.

[(A2) 2nd epoxy resin] The resin composition according to this embodiment contains a second epoxy resin in addition to the above-mentioned first epoxy resin. The second epoxy resin is not particularly limited as long as its epoxy equivalent is lower than that of the first epoxy resin. The epoxy equivalent of the second epoxy resin is, for example, 80 or more and less than 250, preferably 90 or more and 230 or less, preferably 95 or more and 200 or less, more preferably 95 or more and 200 or less, most preferably 150 or more and 200 or less.

The second epoxy resin should have a viscosity of 0.05 Pa･S to 20 Pa･S at 25°C. The second epoxy resin preferably has a molecular weight of 100 to 600.

Examples of the second epoxy resin include polyvalent phenols such as bisphenol A, bisphenol F, bisphenol AD, bisphenol E, catechol, and resorcin, or polyhydric alcohols such as glycerin or polyethylene glycol. Polyglycidyl ethers obtained by reacting with epichlorohydrin; polyglycidyl ether esters obtained by reacting hydroxy acids with epichlorohydrin, such as p-hydroxybenzoic acid and β-hydroxynaphthoic acid; such as phthalic acid and terephthalic acid Polyglycidyl esters generally obtained by reacting polycarboxylic acid with epichlorohydrin; as well as epoxidized phenol novolac resin, epoxidized cresol novolac resin, epoxidized polyolefins, cycloaliphatic epoxy resins, and other urethane resins. Ester-modified epoxy resin, etc., however, are not limited thereto.

From the viewpoint of having high heat resistance and low moisture permeability, the second epoxy resin is bisphenol A type epoxy resin, bisphenol F type epoxy resin, phenol novolac type epoxy resin, biphenyl aromatic resin, etc. Alkyl epoxy resin, phenolic aralkyl epoxy resin, aromatic glycidyl amine epoxy resin, and epoxy resin with dicyclopentadiene structure are preferred. Bisphenol A type epoxy resin and bisphenol A type epoxy resin are preferred. Phenol F type epoxy resin is better, and bisphenol A type epoxy resin is better.

The second epoxy resin may be in liquid or solid form. In addition, a mixture of liquid resin and solid resin can also be used. Here, "liquid state" and "solid state" refer to the state of the epoxy resin at normal temperature (25°C). From the viewpoint of coating properties, processability, and adhesiveness, it is preferable that at least 10% by mass or more of the total epoxy resin used is liquid epoxy resin.

Specific examples of the second epoxy resin include bisphenol A type (hereinafter sometimes abbreviated as BPA type) epoxy resin ("jER828EL" and "jER827" manufactured by Mitsubishi Chemical Corporation); bisphenol F type ring Oxygen resin ("jER807" manufactured by Mitsubishi Chemical Corporation; liquid bisphenol AF type epoxy resin ("ZX1059" manufactured by Nippon Steel and Sumitomo Chemical Corporation), hydrogenated structured epoxy resin ("JER807" manufactured by Mitsubishi Chemical Corporation) jERYX8000"); epoxy resin with butadiene structure ("PB-3600" manufactured by DAICEL Chemical Industry Co., Ltd.), epoxy resin with biphenyl structure ("YX4000" manufactured by Mitsubishi Chemical Corporation); phenol novolac type Epoxy resin ("jER152" manufactured by Mitsubishi Chemical Corporation; and glycidylamine type epoxy resin ("jER630" manufactured by Mitsubishi Chemical Corporation and ADEKA RESIN "EP3980S" manufactured by ADEKA Corporation), etc. In particular, the use of highly heat-resistant and Low-viscosity BPA-type epoxy resins are preferred, and "jER828EL", "jER827" and "jER807" manufactured by Mitsubishi Chemical Corporation are preferred, and "jER828EL" is preferred.

The mass ratio of the first epoxy resin to the second epoxy resin (first epoxy resin: second epoxy resin) is, for example, 10; 1 to 1:10, preferably 10:1 to 1:5, preferably It is 9; 1～1:2, more preferably 8:1～1:1, most preferably 3:7～7:3.

In addition, the composition may contain an epoxy resin other than the first epoxy resin and the second epoxy resin. However, the total content of the first epoxy resin and the second epoxy resin relative to all epoxy resins is preferably 60 mass% or more, more preferably 70 mass% or more, more preferably 80 mass% or more, and 90 mass% The above is the best. In addition, the content of the total epoxy resin in the resin composition is, for example, 5 to 60 mass %, preferably 10 to 50 mass %, and preferably 15 mass %, when the non-volatile components of the resin composition are 100 mass %. ~45 mass%, more preferably 20-40 mass%.

[(B) Thiol compound] The thiol compound is a compound that functions as a hardener for epoxy resin. The thiol compound is not particularly limited as long as it is a compound having two or more thiol groups in the molecule.

As the thiol compound, an ester-containing thiol having an ester structure or an ester-free thiol not having an ester structure can be used. Ideally, the thiol compound contains ester-free thiols. Ester-free thiols do not contain ester groups that can be hydrolyzed in high-temperature and high-humidity environments, so they are suitable from the viewpoint of stability. In addition, in this specification, "ester structure" refers to " The structure represented by -C(=O)O-".

For example, as thiol compounds, ginseng (3-mercaptopropyl) isocyanurate, trimethylolpropane ginseng (3-mercaptopropionate) (TMTP), trimethylolpropane ginseng (mercaptoacetic acid) can be used. ester), pentaerythritol 4 (thiol acetate), ethylene glycol dithiol acetate, pentaerythritol 4 (β-thiopropionate) and dipentaerythritol poly(β-thiopropionate), etc. Thiol compound obtained by the esterification reaction of polyhydric alcohol and mercapto organic acid.

Alternatively, the thiol compound may preferably include at least one compound represented by any one of the following formulas (3) to (5).

In addition, in the above formulas (3) to (5), R ₁ to R ₁₁ each independently represents a linear or branched divalent hydrocarbon group having 1 to 6 carbon atoms, and the hydrocarbon group from R ₁ to R ₁₁ may further include One or more divalent groups represented by the following (6) to (8).

Ideally, the thiol compound is an ester-free thiol represented by the above formula (3) or (4).

On the other hand, as mentioned previously, a thiol compound containing an ester structure can also be used. Examples of the thiol compound containing an ester structure include secondary thiols such as KARENZ MTPE1 manufactured by Showa Denko Co., Ltd., TPMB of the same series, and NR1.

The thiol equivalent of the thiol compound is, for example, 50 to 500, preferably 70 to 300, and more preferably 90 to 200. In addition, thiol equivalent refers to the mass of a thiol compound containing one thiol group.

Thiol compounds are preferably compounds having 2 to 6 thiol groups in one molecule, compounds having 2 to 4 thiol groups in one molecule are preferred, and compounds having 2 to 3 thiol groups in one molecule are preferred. compound is the best.

The content of the thiol compound in the resin composition is based on the ratio of the number of epoxy groups to the number of thiol groups in the resin composition (number of epoxy groups/number of thiol groups; that is, molar ratio) to a content of 0.50 to 10.0 Better. A preferable ratio (epoxy group/thiol group) is 0.75 to 5.00, more preferably 0.80 to 2.0.

[(C) Inorganic filler] The resin composition according to this embodiment contains an inorganic filler as described above. By using inorganic fillers, warpage after sealing can be suppressed.

The content of the inorganic filler is, for example, 30 to 95 parts by mass, preferably 35 to 95 parts by mass, and in one example is 70 to 90 parts by mass relative to 100 parts by mass of the total non-volatile components in the resin composition.

The inorganic filler is not particularly limited, and examples thereof include silicon dioxide, alumina, barium sulfate, talc, clay, mica, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, magnesium oxide, and boron nitride. , at least one of the group consisting of aluminum borate, barium titanate, strontium titanate, calcium titanate, magnesium titanate, bismuth titanate, titanium oxide, barium zirconate and calcium zirconate. The inorganic filler preferably contains at least one selected from the group consisting of silica, calcium carbonate, talc, and mica, and preferably contains silica. As silica, fused silica is preferred, and spherical silica is preferred. Examples of fused silica include silica treated with epoxysilane. The average particle size of the inorganic filler (measured by laser diffraction and scattering method) is, for example, 0.3 to 20 μm, preferably 1.0 to 15.0 μm. The specific surface area of the inorganic filler is, for example, 0.5 to 8.0 m ² /g, preferably 2.0 to 6.0 m ² /g.

[(D) Latent hardening accelerator] Examples of the latent hardening accelerator used in the resin composition according to this embodiment include solid dispersion type latent hardening accelerators. Solid dispersion type latent hardening accelerator refers to a solid that is insoluble in epoxy resin at room temperature (25°C), can be dissolved by heating, and functions as a hardening accelerator for epoxy resin. Examples include Tertiary amine compounds, imidazole compounds that are solid at room temperature, and solid-dispersed amine addition systems are potential hardening accelerators, but are not limited thereto. Specific examples of the tertiary amine compound include dimethylurea compounds such as U-CAT3512T (manufactured by San-Apro Corporation) and U-CAT3513N (manufactured by San-Apro Corporation). Examples of solid dispersion type amine addition system latent hardening accelerators include reaction products of amine compounds and epoxy compounds (amine-epoxy addition system), reaction products of amine compounds and isocyanate compounds or urea compounds ( Urea type addition system) etc. Among these, a solid dispersion type amine addition system latent hardening accelerator is preferred.

Examples of the aforementioned imidazole compounds that are solid at room temperature include 2-heptadecylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, 2-undecylimidazole, and 2-phenyl-4 -Methyl-5-hydroxymethylimidazole, 2-phenyl-4-benzyl-5-hydroxymethylimidazole, 2,4-diamino-6-(2-methylimidazolyl-(1)) -Ethyl-S-triazine, 2,4-diamino-6-(2'-methylimidazolyl-(1)')-ethyl-S-triazine･isocyanuric acid adduct , 2-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-methylimidazole- Trimellitic acid ester, 1-cyanoethyl-2-phenylimidazole-trimellitic acid ester, N-(2-methylimidazolyl-1-ethyl)-urea, N,N'-(2 -Methylimidazolyl-(1)-ethyl)-adipyldiamide and the like, however, are not limited thereto.

Examples of the epoxy compound used as one of the raw materials for producing the solid dispersion type amine addition system latent hardening accelerator (amine-epoxy addition system) include bisphenol A, bisphenol F, catechol, Polyvalent phenols such as resorcin, or polyglycidyl ethers obtained by reacting polyhydric alcohols with epichlorohydrin such as glycerin or polyethylene glycol; polyglycidyl ethers obtained by reacting hydroxy acids with p-hydroxybenzoic acid and β-hydroxynaphthoic acid. Glycidyl ether ester obtained by reacting epichlorohydrin; polyglycidyl ester obtained by reacting polycarboxylic acid with epichlorohydrin like phthalic acid and terephthalic acid; 4,4'-diaminodiphenyl Glycidyl amine compounds obtained by reacting methane or meta-aminophenol with epichlorohydrin; and polyfunctional epoxy compounds or butyl compounds such as epoxidized phenol novolac resin, epoxidized cresol novolac resin, epoxidized polyolefin, etc. Monofunctional epoxy compounds such as glycidyl ether, phenyl glycidyl ether, and glycidyl methacrylate are not limited thereto.

The amine compound used as a raw material for the production of the solid dispersion type amine addition system latent hardening accelerator must have at least one active hydrogen in the molecule that can add to the epoxy group, and at least one selected from the group consisting of Functional groups among the primary amine group, the secondary amine group and the tertiary amine group are sufficient. Examples of such amine compounds include fats such as diethylenetriamine, triethylenetetramine, n-propylamine, 2-hydroxyethylaminopropylamine, cyclohexylamine, and 4,4'-diamino-dicyclohexylmethane. Aromatic amines; 4,4'-diaminodiphenylmethane, 2-methylaniline and other aromatic amine compounds; 2-ethyl-4-methylimidazole, 2-ethyl-4-methylimidazole Heterocyclic compounds containing nitrogen atoms such as pholine, 2,4-dimethylimidazoline, piperidine, piperazine, etc., but are not limited thereto.

In addition, among these, compounds having a tertiary amine group in the molecule, in particular, are raw materials that can produce potential hardening accelerators with excellent hardening accelerating ability. Examples of such compounds include dimethylaminopropylamine, Amine compounds such as diethylaminopropylamine, di-n-propylaminopropylamine, dibutylaminopropylamine, dimethylaminoethylamine, diethylaminoethylamine, N-methylpiperazine, etc., or Imidazole compounds such as 2-methylimidazole, 2-ethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, etc. are primary or secondary amines with tertiary amine groups in the molecule: such as 2-Dimethylaminoethanol, 1-methyl-2-dimethylaminoethanol, 1-phenoxymethyl-2-dimethylaminoethanol, 2-diethylaminoethanol, 1 -Butoxymethyl-2-dimethylaminoethanol, 1-(2-hydroxy-3-phenoxypropyl)-2-methylimidazole, 1-(2-hydroxy-3-phenoxy) Propyl)-2-ethyl-4-methylimidazole, 1-(2-hydroxy-3-butoxypropyl)-2-methylimidazole, 1-(2-hydroxy-3-butoxypropyl) base)-2-ethyl-4-methylimidazole, 1-(2-hydroxy-3-phenoxypropyl)-2-phenylimidazoline, 1-(2-hydroxy-3-butoxypropyl) methyl)-2-methylimidazoline, 2-(dimethylaminomethyl)phenol, 2,4,6-shen(dimethylaminomethyl)phenol, N-β-hydroxyethylmorpholine , 2-dimethylaminoethanethiol, 2-mercaptopyridine, 2-benzimidazole, 2-mercaptobenzimidazole, 2-mercaptobenzothiazole, 4-mercaptopyridine, N,N-dimethyl Aminobenzoic acid, N,N-dimethylglycine, niacin, isonicotinic acid, picolinic acid, N,N-dimethylglycine hydrazine, N,N-dimethylpropane Acid hydrazides, nicotinic acid hydrazides, isonicotinic acid hydrazides and other alcohols, phenols, thiols, carboxylic acids and hydrazides with tertiary amine groups in the molecules are generally used.

When producing a latent hardening accelerator through an addition reaction between the epoxy compound and the amine compound, an active hydrogen compound having two or more active hydrogens in the molecule may be further added. Examples of such active hydrogen compounds include polyvalent phenols such as bisphenol A, bisphenol F, bisphenol S, hydroquinone, catechol, resorcinol, gallic acid, phenol novolac resin, and trimethylol Polyhydric alcohols such as propane, polyvalent carboxylic acids such as adipic acid and phthalic acid, 1,2-dimercaptoethane, 2-mercaptoethanol, 1-mercapto-3-phenoxy-2-propanol, mercapto Acetic acid, anthranilic acid, lactic acid, etc., however, are not limited thereto.

The isocyanate compound used as a raw material for manufacturing the solid dispersion type amine addition type latent hardening accelerator, for example, n-butyl isocyanate, isopropyl isocyanate, phenyl isocyanate, and benzyl isocyanate can also be used. Monofunctional isocyanate compounds such as esters; hexamethylene diisocyanate, toluene diisocyanate (for example: 2,4-toluene diisocyanate, 2,6-toluene diisocyanate), 1,5-naphthalene diisocyanate, diphenylmethane -Polyfunctional isocyanate compounds such as 4,4'-diisocyanate, isophorone diisocyanate, xylene diisocyanate, terephthalene diisocyanate, 1,3,6-hexamethylene triisocyanate, and bicycloheptane triisocyanate; In addition, compounds containing terminal isocyanate groups obtained by the reaction of these polyfunctional isocyanate compounds and active hydrogen compounds, and the like. Examples of such a compound containing a terminal isocyanate group include an addition compound having a terminal isocyanate group obtained by the reaction of toluene diisocyanate and trimethylolpropane, and an addition compound obtained by the reaction of toluene diisocyanate and pentaerythritol. However, it is not limited to addition compounds having a terminal isocyanate group and the like.

Examples of the urea compound used as a raw material for producing the solid dispersion type amine addition system latent hardening accelerator include urea, thiourea, etc., but are not limited thereto.

The above-mentioned solid dispersion type latent hardening accelerator can be prepared, for example, by appropriately mixing the above-mentioned production raw materials, reacting them at a temperature between room temperature and 200°C, cooling and solidifying, and then pulverizing them, or by mixing them in methyl ethyl ketone, It can be easily obtained by reacting it in a solvent such as dioxane or tetrahydrofuran, removing the solvent, and crushing the solid component.

Typical examples of commercially available solid dispersion type latent hardening accelerators include amine-epoxy addition systems (amine addition systems), including "Ajicure PN-23" manufactured by Ajinomoto Fine-Techno Co., Ltd. "Ajicure PN-H", "Hardener Examples of the system include "FXE-1000", "FXR-1030", "FXR-1081" manufactured by T&K TOKA, etc., but are not limited thereto.

When the total content of the epoxy resin is set to 100 parts by mass, the content of the hardening accelerator is preferably 0.1 to 100 parts by mass, more preferably 1 to 60 parts by mass, and more preferably 5 to 30 parts by mass.

[(E) Preservation stabilizer] It is preferable to add a storage stability improving agent to the resin composition according to this embodiment. Examples of storage stability improving agents include borate compounds, titanate compounds, aluminate compounds, zirconate compounds, isocyanate compounds, carboxylic acids, acid anhydrides, and mercapto organic acids.

Examples of the borate compound include trimethyl borate, triethyl borate (TEB), tri-n-propyl borate, triisopropyl borate, tri-n-butyl borate, tripentyl borate, and triallyl borate. , trihexyl borate, tricyclohexyl borate, trioctyl borate, trinonyl borate, tridecyl borate, tridodecyl borate, trihexadecyl borate, trioctadecyl borate , ginseng (2-ethylhexyloxy)borane, bis(1,4,7,10-tetraoxaundecyl)(1,4,7,10,13-pentaoxatetradecyl) )(1,4,7-trioxaundecyl)borane, tribenzyl borate, triphenyl borate, tri-o-tolyl borate, tri-m-creyl borate, triethanolamine borate, etc.

Examples of the titanate compound include tetraethyl titanate, tetrapropyl titanate, tetraisopropyl titanate, tetrabutyl titanate, and tetraoctyl titanate.

Examples of the aluminate compound include triethyl aluminate, tripropyl aluminate, triisopropyl aluminate, tributyl aluminate, trioctyl aluminate, and the like.

Examples of the zirconate compound include tetraethyl zirconate, tetrapropyl zirconate, tetraisopropyl zirconate, and tetrabutyl zirconate.

Examples of the isocyanate compound include n-butyl isocyanate, isopropyl isocyanate, 2-chloroethyl isocyanate, phenyl isocyanate, p-chlorophenyl isocyanate, and benzyl isocyanate. , hexamethylene diisocyanate, 2-ethylphenyl isocyanate, 2,6-dimethylphenyl isocyanate, toluene diisocyanate (for example: 2,4-toluene diisocyanate, 2,6-toluene diisocyanate), 1,5-naphthalene diisocyanate, diphenylmethane-4,4'-diisocyanate, benzidine diisocyanate, isophorone diisocyanate, xylene diisocyanate, p-phenylene diisocyanate, bicycloheptane Triisocyanate, etc.

Examples of the carboxylic acid include saturated aliphatic monocarboxylic acids such as formic acid, acetic acid, propionic acid, butyric acid, caprylic acid, and caprylic acid, unsaturated aliphatic monocarboxylic acids such as acrylic acid, methacrylic acid, and crotonic acid, and monochlorinated acids. Halogenated fatty acids such as acetic acid and dichloroacetic acid, monobasic oxygen-containing acids such as glycolic acid and lactic acid, aliphatic aldehyde acids and keto acids such as glyoxylic acid and gluconic acid, oxalic acid, malonic acid, succinic acid, horse acid Aliphatic polybasic acids such as lenic acid, benzoic acid, halogenated benzoic acid, toluic acid, phenyl acetic acid, cinnamic acid, mandelic acid and other aromatic monobasic acids, phthalic acid, trimesic acid and other aromatic polybasic acids Acid etc.

Examples of the acid anhydride include aliphatic anhydrides such as succinic anhydride, dodecynyl succinic anhydride, maleic anhydride, an adduct of methylcyclopentadiene and maleic anhydride, hexahydrophthalic anhydride, and methyltetrahydrophthalic anhydride. Or aliphatic polybasic acid anhydrides, etc., aromatic polybasic acid anhydrides such as phthalic anhydride, trimellitic anhydride, pyromellitic anhydride, etc. Typical examples of commercially available acid anhydrides include HN-2200 (molecular weight = 166) manufactured by Hitachi Chemical Co., Ltd., which can be used as a hardener for epoxy resins, but is not limited thereto. .

Examples of the above-mentioned mercaptoorganic acid include mercaptoaliphatic monocarboxylic acids such as mercaptoacetic acid, mercaptopropionic acid, mercaptobutyric acid, mercaptosuccinic acid, and dimercaptosuccinic acid, and those obtained by the esterification reaction of hydroxy organic acids and mercaptoorganic acids. Thiol aliphatic monocarboxylic acid, mercapto aromatic monocarboxylic acid such as mercapto benzoic acid, etc.

Storage stability improving agents, from the viewpoint of high versatility and safety, and improving storage stability, borate ester compounds are preferred, such as triethyl borate, tri-n-propyl borate, and triisoborate. Propyl ester and tri-n-butyl borate are preferred, and triethyl borate is even more preferred.

The content of the storage stability enhancer is not particularly limited as long as it can improve the storage stability of the epoxy resin. When the total content of the epoxy resin is set to 100 parts by mass, the content of the storage stability enhancer is 0.001 ~50 parts by mass is preferred, 0.05-30 parts by mass is more preferred, and 0.1-10 parts by mass is more preferred.

The curable resin composition of the present invention can be produced by using the above-described ginseng(3-mercaptopropyl)isocyanurate, epoxy resin, and various additives as optional components as raw materials. The preparation of the curable resin composition is not particularly difficult and can be carried out according to conventionally known methods. For example, the one-liquid thermosetting epoxy resin composition of the present invention can be prepared by mixing each component with a mixer such as a three-roller or a planetary mixer.

[Other ingredients] To the resin composition according to this embodiment, diluents, solvents, pigments, flexibility-imparting agents, coupling agents, antioxidants, thixotropy-imparting agents, dispersants, etc. commonly used in the field of the present invention may be added as necessary. Various additives.

[How to use the resin composition] As mentioned previously, the resin composition related to this embodiment is a resin composition for wafer-level packaging sealing, and is preferably formed by compression molding. That is, the resin composition according to this embodiment is supplied onto the wafer (or pseudo-wafer) of the semiconductor substrate. Next, the supplied resin composition is pressurized by a hot plate or the like, and heated as necessary to compress and mold the resin composition. Then, the formed resin composition is heated to be thermally cured. The thermal hardening temperature is, for example, 60 to 150°C, preferably 70 to 130°C, and more preferably 80 to 120°C. In addition, the thermal hardening time is, for example, 10 minutes to 60 minutes, preferably 10 minutes to 50 minutes, and preferably 15 minutes to 45 minutes. The substrate is then diced to obtain wafer-level packaging. The resin composition according to this embodiment contains a thiol compound excellent in low-temperature curability. Therefore, molding and thermal hardening of the resin composition can be performed simultaneously during compression molding.

[Characteristics of resin composition] The viscosity of the resin composition related to this embodiment is preferably 300 Pa･S or less, more preferably 250 or less, and more preferably 200 or less. As long as the viscosity is such, suitable fluidity can be obtained during compression molding.

The glass transition temperature of the cured product obtained by heating the resin composition according to this embodiment at 80°C for 30 minutes is preferably 100°C or lower, more preferably 80°C or lower, and more preferably 0 to 60°C, for example 5 ~60℃.

The tensile elastic modulus at 25°C of the cured product obtained by heating the resin composition according to this embodiment at 80°C for 30 minutes is preferably 10,000 MPa or less, more preferably 5,000 MPa or less, and more preferably 10 to 4,000 MPa. [Example]

The present invention will be described in more detail below based on examples. However, the present invention is not limited to the following examples.

Each component was mixed according to the formula composition shown in Table 1 to prepare the resin composition related to Examples 1 to 10 and Comparative Example 1. Specifically, take each component into a dedicated plastic container in the amount disclosed in Table 1. Then, the mixture was thoroughly mixed at room temperature (25° C.) at 2000 rpm using a rotary/revolving vacuum mixer (ARE-250 manufactured by Thinky Corporation), and further degassed for 1 minute to obtain the target resin composition. In addition, in Table 1, the blending amount of each component means parts by mass. In addition, in each of the examples and comparative examples, the ratio of the number of epoxy groups to the number of thiol groups in the resin composition is approximately 1:1. In addition, details of the materials used are as follows.

[Epoxy resin] EXA4850-150: Made by DIC, vinyl ether modified bisphenol A type epoxy resin, epoxy equivalent 450g/eq, viscosity 15Pa･S (25℃), molecular weight 900, belongs to formula (1) YX7105: Made by Mitsubishi Chemical Corporation, polyalkylene epoxy resin, epoxy equivalent 485g/eq, molecular weight 970, viscosity 12Pa･S (25℃) YL7410: Made by Mitsubishi Chemical Corporation, vinyl ether modified bisphenol A type epoxy resin, epoxy equivalent 420g/eq, molecular weight 840, viscosity 0.17Pa･S (25℃) EG-280: Made by Osaka Gas Chemical Co., Ltd., fluorene type epoxy resin, epoxy equivalent 460g/eq, molecular weight 520, viscosity 7.4Pa･S (25℃) jER828EL: Made by Mitsubishi Chemical Corporation, viscosity 13Pa･S, molecular weight 380, bisphenol A type (BPA type) epoxy resin, epoxy equivalent 190g/eq, does not fall into either formula (1) or formula (2).

[thiol compound] TMTP: manufactured by Yodo Chemical Co., Ltd., trimethylol type thiol compound, thiol equivalent 140 g/eq, thiol compound containing ester structure (chemical formula below)

BPADT: Made by Ajinomoto Fine-Techno Co., Ltd., thiol equivalent 188g/eq, ester-free thiol (chemical formula below)

TMPIC: Ajinomoto Fine-Techno Co., Ltd., thiol equivalent 117g/eq, ester-free thiol (chemical formula below)

[Latent hardening accelerator] PN-23: Ajinomoto Fine-Techno Co., Ltd., amine addition type hardener

[Inorganic filler] Silica A: average particle size 1.0 μm, maximum particle size cutoff 5 μm, specific surface area 4.0 m ² /g, treated with KBM-403 (3-glycidyl etheroxypropyl trimethoxysilane, Shin-Etsu Spherical silica processed by Chemical Industry Co., Ltd. Silica B: average particle size 9.0 μm, maximum particle size cutoff 25 μm, specific surface area 4.0 m ² /g, treated with KBM-403 (3-glycidoxypropyltrimethoxysilane, manufactured by Shin-Etsu Chemical Industry Co., Ltd.) Processed spherical silica.

[other] TEB: Made by Tokyo Chemical Industry Co., Ltd., triethyl borate

[Measurement method] For the obtained resin compositions related to Examples 1 to 10 and Comparative Example 1, the viscosity, mechanical strength, and glass transition temperature of the cured product were measured according to the following procedures. In addition, press molding was performed according to the following procedure, and warpage was measured.

[Viscosity measurement] The viscosity of each resin composition was measured at 25° C. and 5 rpm using RE-80U (E-type viscometer manufactured by Toki Sangyo Co., Ltd., rotor R9.7×3°).

[Mechanical strength] Each resin composition was applied to a release PTFE film (AFLEX 50N: manufactured by Asahi Glass Co., Ltd.) using rod coating, and heated at 80° C. for 30 minutes to cure. The thickness of the hardened body is 50 μm. Then, the PTFE film was demoulded. According to JIS-K-7161, a universal testing machine TENSILON was used to perform a tensile test at a tensile speed of 50 mm/min at 25°C and 40% RH to obtain the tensile elastic modulus.

[glass transition temperature] The resin composition was poured into a mold with a thickness of 1 mm and a diameter of 10 mm, and was heated at 80° C. for 30 minutes to harden. A test piece was produced, and a TMA measuring device (manufactured by Hitachi High-Technologies, TMASS6100) was used in accordance with JIS-K-7196. , measure the thermal expansion rate under the conditions of compression method, load 10g, heating rate 5°C/min, and measurement temperature range 0°C to 200°C, and determine the change point of the thermal expansion rate, which is determined as the glass transition temperature.

[stamping mold] The resin composition was placed on one side of a 12-inch silicon wafer with a thickness of 0.8 mm so that the thickness became 0.4 mm, and press molding was performed at 60° C. for 15 minutes using a press molding device (CPM1081M manufactured by TOWA Corporation). Then, post-harden at 80°C for 30 minutes. [Measurement of warpage] Using a shadow pattern measuring instrument (manufactured by Akrometrix), the molded silicon wafer obtained by the "stamping mold" is heated and cooled in sequence at 35°C, 260°C, and 35°C, and the warpage before and after heating is measured. high. Regarding the warpage height, place the silicon wafer on a horizontal surface, measure the height of the upper surface, and calculate the difference between the height of the highest part of the upper surface and the height of the lowest part, which is defined as the "warp height."

The obtained measurement results are shown in Table 1. The resin composition related to Comparative Example 1 does not contain the first epoxy resin. In the resin composition related to Comparative Example 1, the warpage height exceeded 1,300 μm before heating and exceeded 6,000 μm after heating. On the other hand, in Examples 1 to 8, the warpage height was 1000 μm or less. Compared with Comparative Example 1, the warp height was significantly reduced both before and after heating.

Claims (19)

A resin composition for wafer-level packaging sealing, which contains: (A1) a first epoxy resin that is liquid at 25° C. and has an epoxy equivalent of 250 to 1000; The epoxy equivalent of the second epoxy resin, (B) a thiol compound having two or more thiol groups in the molecule, and (C) the inorganic filler, relative to 100 of the total non-volatile components in the aforementioned resin composition parts by mass, the content of the aforementioned inorganic filler is 70 to 90 parts by mass. The resin composition of claim 1, wherein the first epoxy resin (A1) has a temperature of 20 Pa at 25°C. Viscosity below S. The resin composition of claim 1 or 2, wherein the epoxy equivalent of the second epoxy resin (A2) is 80 or more and less than 250. The resin composition of claim 1, wherein the mass ratio (A1:A2) of the first epoxy resin (A1) and the second epoxy resin (A2) is 10:1~1:10. The resin composition of claim 1, wherein the aforementioned thiol compound includes ester-free thiol. The resin composition of claim 1, wherein the aforementioned thiol compound includes at least one compound represented by any one of the following formulas (3) to (5),

In the formulas (3) to (5), R ₁ to R ₁₁ are each independently a linear or branched divalent hydrocarbon group having 1 to 6 carbon atoms. The hydrocarbon groups from R ₁ to R ₁₁ may further include one or more A divalent group represented by any one of the following formulas (6) to (8),

The resin composition of claim 1, wherein the aforementioned thiol compound includes ginseng (3-mercaptopropyl) isocyanurate, trimethylolpropane ginseng (3-mercaptopropionate) (TMTP), trisulfhydrylpropionate Hydroxymethylpropane (thiol acetate), pentaerythritol (thiol acetate), ethylene glycol dithiol acetate, pentaerythritol (β-thiopropionate) and dipentaerythritol poly (β - at least one compound in the group consisting of thiopropionate). The resin composition of claim 1, wherein the inorganic filler contains silica. The resin composition of claim 8, wherein the aforementioned silica is fused silica. The resin composition of claim 8 or 9, wherein the aforementioned silica is in a spherical shape. The resin composition of claim 1, further comprising (D) a latent hardening accelerator. The resin composition of claim 11, wherein the latent hardening accelerator includes a solid dispersion type latent hardening accelerator. The resin composition of claim 1, further comprising (E) a preservation stabilizer. The resin composition of claim 13, wherein the aforementioned storage stabilizer includes a compound selected from the group consisting of borate compounds, titanate compounds, aluminate compounds, zirconate compounds, isocyanate compounds, carboxylic acids, acid anhydrides and mercapto organic acids. More than one kind. For example, the resin composition of claim 1 has a viscosity of 300 Pa. Below S. The resin composition of Claim 1, wherein the glass transition temperature of the cured product obtained by heating at 80°C for 30 minutes is 100°C or less. The resin composition of Claim 1, wherein the cured product obtained by heating at 80°C for 30 minutes has a tensile elastic modulus at 25°C of 10,000 MPa or less. A wafer level package includes: a semiconductor substrate; and a sealing layer that seals the semiconductor substrate, wherein the sealing layer is formed of a cured product of the resin composition according to any one of claims 1 to 17. A method for manufacturing wafer-level packaging, which includes: a step of supplying the resin composition according to any one of claims 1 to 17 on a substrate; and a step of molding the supplied resin composition by compression molding. .