TWI820478B - Multi needle of vertical probe card with scrub control - Google Patents

Abstract

The invention relates to a multi-pin for a vertical probe card with controllable wiping. The present invention provides a vertical probe card with controllable wiping that can minimize an increase in manufacturing costs, control wiping according to the test environment, and improve electrical characteristics, thereby significantly improving test reliability. Use multiple needles.

Description

Vertical probe cards with multi-pins for controlled scrubbing

The present invention relates to a vertical probe card with multiple pins that can control scrub. More specifically, it relates to a system that can control the scrub according to the test environment and improve the electrical characteristics, and can thereby greatly improve the test. Vertical probe card with multi-pin for reliable controllable brushing.

Generally speaking, the semiconductor manufacturing process includes the following steps: the fabrication step of forming a pattern on the wafer (wafer); the wafer electrical characteristic selection (Electrical Characteristics) that tests the electrical characteristics of each wafer that constitutes the wafer. Die Sorting: EDS) step; an assembly step that assembles patterned wafers into individual wafers (chips).

Here, the EDS step is a step performed to identify defective wafers among the wafers that make up the wafer. It mainly uses a test device called a "probe card" to apply electrical signals to the wafers that make up the wafer. And the defective condition is judged by checking the signal from the applied electrical signal.

This kind of probe card is equipped with a plurality of needles (Needles) that are in contact with the patterns of each wafer constituting the wafer and apply electrical signals. Normally, the needles of the probe card are in contact with the electrode pads of each device on the wafer. These pins are energized with a specific current, and the electrical characteristics of the output at that time are measured.

In addition, the design rules of recent semiconductor devices have been further refined. While emphasizing high integration, they are also moving towards ultra-miniaturization. Therefore, in order to connect to the patterns of semiconductor devices that are getting smaller and smaller, the pins of the probe card are required to be miniaturized in a size suitable for the probe card, and a narrow pitch between the pins is also required. (Fine pitch), that is, configured according to a narrower pitch.

Therefore, in order to ensure that the probes can be arranged closer to each other, a vertical probe close to the "1" shape was developed. As an example, Korean registered patent No. 1859388 (hereinafter referred to as "existing probe card") discloses a vertical probe card using this probe.

FIG. 1 is a cross-sectional view illustrating a part of a conventional probe card, and FIG. 2 is a schematic diagram illustrating a contact state between a conventional needle and a test object.

As shown in FIG. 1 , the existing probe card 100 is composed of the following parts: a first guide plate 110 with a first guide hole 111 formed on one side; a second guide plate 120 located at the lower part of the first guide plate 110 , is spaced apart from the first guide plate 110, and has a second guide hole 121 formed on one side; a needle 130 is inserted into the first guide hole 111 and the second guide hole 121.

Here, the needle 130 is formed into a substantially straight rod shape, and the upper end and the lower end are inserted into the first guide hole 111 of the first guide plate 110 and the second guide hole 121 of the second guide plate 120 respectively, and are inserted through the first guide hole 111 of the first guide plate 110 and the second guide hole 121 of the second guide plate 120 . The inner surface side of the plate 110 and the second guide plate 120 is supported.

For this kind of existing probe card 100, when the test object G moves upward, when the lower end of the needle 130, that is, the tip T, comes into contact with the test object G, under the action of the contact pressure transmitted upward to the needle 130 , the central area is bent in one direction and provides elastic force to the tip T downward, so that the needle 130 stably contacts the test object G. At the same time, the electrical signal transmitted from the test object G is transmitted to an external test device.

In addition, generally speaking, when the needle of the probe card comes into contact with the test object G, under the action of the contact pressure, the central area bends at a certain angle. Affected by the space between the needle and the guide hole of the guide plate, there will be A scrubbing phenomenon occurs in which the lower end of the needle is pushed away a certain distance from the contact position.

Although this brushing phenomenon has the advantage that the electrical characteristics between the needle and the test object G can be improved according to the environment, thereby improving the reliability of the test. However, there is also the following disadvantage, that is, the test object G may be damaged or damaged as the wiping distance of the needle changes.

In particular, for the existing probe card 100, since the needle 130 is formed in a rod shape close to a 1-shape, the wiping distance is relatively longer compared to the existing needle with a curved central portion, resulting in the above disadvantages becoming more prominent. .

Therefore, there is an urgent need to develop a new method that can control the wiping distance of the needle to take advantage of the wiping phenomenon and offset its shortcomings to improve the test reliability of probe cards.

(The problem that the invention wants to solve)

The present invention was developed to solve the above problems. The purpose of the present invention is to provide a multi-pin vertical probe card with controllable wiping, which can minimize the increase in manufacturing costs and can also be used according to the test environment. Brushing control can not only improve the electrical characteristics, but also greatly improve the reliability of the test. (Technical means to solve problems)

In order to achieve the above object, according to one aspect of the present invention, a multi-pin vertical probe card with controllable brushing is provided, which is used to transmit electrical signals transmitted from the test object to external test equipment in contact with the test object. The vertical probe card uses multiple needles. At least one slit is formed along the length direction in the central area, so that the central area is configured into a multi-beam shape. At least one protruding slit is formed on the inner surface where the slit is formed. A collision protrusion, the upper end and the lower end are respectively inserted into the guide holes formed on the upper guide plate and the lower guide plate that are spaced in the up and down direction. When the lower end comes into contact with the test object, the collision protrusion is supported on the opposite on the inner side to control the movement amount of the lower end.

At the same time, by considering the wiping distance between the upper and lower ends of multiple needles required according to the test environment, the formation position and protruding height of the collision protrusion can be determined.

In addition, preferably, the collision protrusions are respectively provided on the upper and lower parts of the inner surface where the slit is formed.

In addition, at least one side of both sides of the collision protrusion is formed to be inclined or curved. (Compare the effectiveness of previous technologies)

As described above, according to the present invention, while minimizing the increase in manufacturing costs, the wiper can also be controlled according to the test environment, thereby improving the electrical characteristics, thereby significantly improving the reliability of the test.

Below, a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 3 is a schematic diagram illustrating a multi-pin probe card using a vertical probe card with controllable wiping according to an embodiment of the present invention. FIG. 4 is a schematic diagram illustrating a vertical probe card with controllable wiping according to an embodiment of the present invention. A schematic diagram of a vertical probe card using multiple pins. FIG. 5 is a schematic diagram illustrating various shapes of collision protrusions according to an embodiment of the present invention.

First, looking at the probe card 1 using a multi-pin vertical probe card with controllable brushing according to an embodiment of the present invention, it can be seen that, as shown in Figure 3, the probe card 1 includes: a first guide plate 10, The second guide plate 20 and the multi-needle 30 .

The first guide plate 10 is formed in a plate shape with a certain thickness, and has a plurality of first guide holes 11 formed on one side. The first guide plate 10 serves to support the upper end portions of the plurality of needles 30 described below.

Like the first guide plate 10 , the second guide plate 20 is formed into a plate shape with a certain thickness. A plurality of second guide holes 21 are respectively formed on one side corresponding to the plurality of first guide holes 11 . The plate 20 is located at the lower part of the first guide plate 10 and is spaced apart from the first guide plate 10 . Its function is to support the lower end of the multi-needle 30 described below.

In addition, in order to maintain the distance between the first guide plate 10 and the second guide plate 20, a jig plate J may be interposed between the first guide plate 10 and the second guide plate 20.

The multi-needle 30 is formed in a rod shape substantially along the vertical direction. As shown in FIG. 4 , the upper end region, the central region, and the lower end region can be roughly divided into a head portion H, a main body portion B, and a tip portion T, respectively.

In addition, the head H of the multi-needle 30 is inserted into the first guide hole 11 and supported by the inner surface side of the first guide plate 10 . The upper side of the tip T is inserted into the second guide hole 21 and is supported by the inner surface side of the second guide plate 20 .

The function of this multi-needle 30 is that when the tip T makes elastic contact with the test object G arranged at the lower part, a specific current will pass through, and at the same time, the electrical signal output at this time will pass through the space transformer connected to the upper part. K is transmitted to external test equipment.

Describing the multi-needle 30 according to this embodiment in more detail, a slit 31 is formed along the length direction inside the main body B, and the main body B is formed into a multi-beam shape. Hereinafter, for convenience of explanation, the beam located inside when the multi-needle 30 is bent will be referred to as the first beam 30a, and the beam located outside the multi-needle 30 will be referred to as the second beam 30b.

In addition, the multi-needle 30 of this embodiment has at least one protruding and formed collision on the inner surfaces facing each other, in other words, on the opposite surfaces of the first bundle 30a and the second bundle 30b formed by the slit 31. Protrusion 32.

When the tip T comes into contact with the test object G, the collision protrusion 32 contacts and supports the inner surface of the multiple needles 30 facing each other, thereby controlling the bending degree of the multiple needles 30, thereby controlling the moving distance of the tip, that is, the brushing distance. Take control.

Therefore, the wiping distance of the multiple needles 30 can be controlled by forming the collision protrusions 32 to have different protruding heights, or the collision protrusions 32 can be formed at at least one position on the inner upper and lower parts of the multiple needles 30, thereby enabling The brushing distance of the upper and lower ends of the multi-needle 30 is selectively controlled respectively. Next, the action of such collision protrusions 32 will be described in more detail with reference to FIGS. 6 to 9 .

This embodiment has the following features, that is, by changing the position and protrusion height of the collision protrusion 32 according to the inspection environment, the wiping distance of the upper and lower ends of the multi-needle 30 is optimally controlled, thereby minimizing the damage to the test object G and also minimizing the damage to the test object G. Can significantly improve electrical characteristics.

In addition, the collision protrusion 32 according to an embodiment of the present invention can be adopted in any shape as long as it is supported on the opposite inner surface side to form a shape that controls the bending degree of the multi-needle 30 . As shown in FIG. 5 , at least one of the two side portions of the collision protrusion 32 may be formed to be inclined or curved as needed.

For example, the collision protrusion 32 may be formed into a triangle, a trapezoid, a hemisphere, etc. As described above, the reason why at least one of the two side portions of the collision protrusion 32 is formed to be inclined or curved is that when the other bundles 30a, 30b are supported by the collision protrusion 32, the bundles 30a, 30b supported by the inclined area Finely adjust the inclination to precisely adjust the brushing distance.

Figure 6 is a schematic diagram illustrating a state in which a probe card with controllable brushing is bent by contacting a test object with multiple needles according to an embodiment of the present invention. Figure 7 is an enlarged view of "I" shown in Figure 6. Figure 8 is an enlarged view of "II" shown in FIG. 6 , and FIG. 9 is a schematic diagram illustrating a state in which a collision protrusion is formed only at the lower end of the inner surface of the multi-needle according to one embodiment of the present invention.

Next, the operation of the multi-needle 30 for a probe card with controllable brushing according to an embodiment of the present invention having the above structure will be described in detail with reference to FIGS. 6 to 9 .

First, in the following description, a case where the collision protrusions 32 are respectively formed on the upper, lower and central regions of the inner surface of the second beam 30b according to an embodiment of the present invention will be described.

The test object G moves upward. When the tip T of the multi-needle 30 contacts the test object G, as shown in Figure 6, the upper and lower ends of the multi-needle 30 are respectively supported on one side of the space converter K and on the side of the test object G. On one side, under the action of the contact pressure, as shown in FIG. 6 , the main body B of the multi-needle 30 bends in one direction.

During the bending process, the curvature of the first bundle 30a of the multi-needle 30 becomes larger than the curvature of the second bundle 30b, so that one side of the first bundle 30a approaches the second bundle 30b.

In this case, in this embodiment, collision protrusions 32 are formed in the upper part, lower part and central area of the first beam 30a. As shown in FIG. 7, when the first beam 30a approaches the second beam 30b, each collision protrusion 32 supports On the opposite side of the first beam 30a.

Therefore, a certain distance is maintained between the first bundle 30a and the second bundle 30b, and the degree of bending of the multiple needles 30 is limited. Therefore, as shown in FIG. 8, the rubbing phenomenon at the upper and lower ends of the multiple needles 30 is reduced.

By controlling the protruding height of the collision protrusion 32 and adjusting the distance between the first beam 30a and the second beam 30b, the degree of bending of the multiple needles 30 is controlled, so that the multiple needles can be adjusted according to the test environment. The brushing distance can be adjusted to 30 degrees.

In addition, in this embodiment, when the plurality of needles 30 come into contact with the test object G, the first beam 30a and the second beam 30b make electrical contact through the collision protrusion 32, thereby improving the electrical characteristics.

At the same time, according to the multi-needle 30 for a probe card with adjustable wiping according to this embodiment, the wiping distance at the upper and lower ends can be selectively controlled respectively.

For example, as shown in FIG. 9 , a collision protrusion 32 is formed on the lower end of the inner surface of the multi-needle 30 according to this embodiment.

Therefore, when the tip T of the multi-needle 30 comes into contact with the test object G, the lower part of the multi-needle 30 maintains a certain distance between the first beam 30 a and the second beam 30 b through the collision protrusion 32 , thereby affecting the multi-needle 30 The moving distance of the lower end of the multi-pin 30 is limited, that is, the wiping distance. However, the upper part of the multi-pin 30 is bent according to a certain curvature, and the upper end moves a certain distance. Therefore, by changing the position of the collision protrusion 32, the up and down movements of the multi-pin 30 are selectively controlled. End brushing distance l ₂ , l ₁ .

Furthermore, as mentioned above, in this embodiment, at least part of the two sides of the collision protrusion 32 is formed to be inclined or curved, thereby adjusting the inclination of the second beam 30b supported on the collision protrusion to a certain angle to prevent friction. Brush distance is fine-tuned for precise control.

Although the present invention has been described in connection with the above-mentioned preferred embodiments, various modifications or variations may be made without departing from the spirit and scope of the present invention. In addition, the appended patent application scope includes these modifications or variations that fall within the scope of the present invention.

1: Probe card 10: 1st guide plate 11: 1st guide hole 20: 2nd guide plate 21: 2nd guide hole 30:Multiple needles 30a: Bundle 1 30b: Bundle 2 31: slit 32: Collision protrusion 100: Probe card 110: 1st guide plate 111: 1st guide hole 120: 2nd guide plate 121: 2nd guide hole 130: Needle B: Main part G: test subject H: head J: Jig plate K: space converter T: tip

FIG. 1 is a cross-sectional view illustrating part of a conventional probe card. FIG. 2 is a schematic diagram illustrating a contact state between a conventional needle and a test object. 3 is a schematic diagram illustrating a multi-pin probe card using a vertical probe card with controllable wiping according to an embodiment of the present invention. 4 is a schematic diagram illustrating multiple pins of a vertical probe card with controllable wiping according to an embodiment of the present invention. 5(a) to (e) are schematic diagrams illustrating various shapes of collision protrusions according to an embodiment of the present invention. 6 is a schematic diagram illustrating a state in which a probe card with controllable brushing uses multiple pins to contact and bend a test object according to an embodiment of the present invention. FIG. 7 is an enlarged view of "I" shown in FIG. 6 . FIG. 8 is an enlarged view of "II" shown in FIG. 6 . 9 is a schematic diagram illustrating a state in which a collision protrusion is formed only at the lower end of the inner surface of the multi-needle according to an embodiment of the present invention.

1: Probe card

10: 1st guide plate

11: 1st guide hole

20: 2nd guide plate

21: 2nd guide hole

30:Multiple needles

30a: Bundle 1

30b: Bundle 2

31: slit

32: Collision protrusion

G: test subject

J: Jig plate

K: space converter

Claims (4)

A multi-pin vertical probe card with controllable wiping is used for a multi-pin vertical probe card that is in contact with a test object and transmits electrical signals transmitted from the test object to external test equipment, wherein, in At least one slit with a closed cross-sectional space is formed in the central area along the length direction, so that the central area is configured in a multi-beam shape. At least one collision protrusion protrudes from the inner surface where the slit is formed, and the upper end and the lower end are respectively Insert into the guide holes formed on the upper guide plate and the lower guide plate that are spaced in the up and down direction. When the lower end comes into contact with the test object, the collision protrusion is supported on the opposite inner side, thereby impacting the lower end. Movement amount is controlled. For example, in Claim 1, a multi-pin vertical probe card with controllable wiping is used, wherein the formation position and protruding height of the collision protrusion are determined by considering the wiping distance between the upper and lower ends of the multi-pin required according to the test environment. The multi-needle vertical probe card with controllable wiping according to claim 1, wherein the collision protrusion is provided on at least one of the upper and lower parts of the inner surface where the slit is formed. The multi-needle vertical probe card with controllable brushing according to claim 1, wherein at least one side of the two sides of the collision protrusion is formed to be inclined or curved.