TWI819386B - Antenna unit and array antenna - Google Patents
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- 238000003491 array Methods 0.000 description 1
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- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
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Abstract
Description
本發明涉及天線領域,尤其涉及一種天線單元及陣列天線。 The present invention relates to the field of antennas, and in particular, to an antenna unit and an array antenna.
低軌道衛星通訊能夠增加偏遠地區之無線通訊覆蓋率。然而由於低軌道衛星於太空中移動之速度極為快速,使得習知天線與低軌道衛星通訊過程中,切換過程容易出錯,通訊效果較差,甚至可能出現斷線。 Low-orbit satellite communications can increase wireless communications coverage in remote areas. However, due to the extremely fast speed of low-orbit satellites in space, the switching process between conventional antennas and low-orbit satellites is prone to errors, resulting in poor communication results and even possible disconnections.
鑒於以上內容,有必要提供一種天線單元及陣列天線,以實現與低軌道衛星之通訊。 In view of the above, it is necessary to provide an antenna unit and an array antenna to achieve communication with low-orbit satellites.
本申請一方面提供一種天線單元,應用於無線通訊裝置。所述天線單元包括輻射層、第一介質層、第一接地層、第二介質層、第二接地層及複數導柱,所述第一介質層,第一接地層,第二介質層,第二接地層依次層疊設置,所述輻射層設置於所述第一介質層遠離所述第一接地層之表面,所述輻射層設置有饋點,用以為所述天線單元饋電,所述第一接地層對應所述輻射層開設有槽孔,所述導柱沿所述槽孔之周沿設置,且貫穿所述第二介質層,使得其兩端分別連接所述第一接地層及所述第二接地層。 On the one hand, this application provides an antenna unit for use in wireless communication devices. The antenna unit includes a radiation layer, a first dielectric layer, a first ground layer, a second dielectric layer, a second ground layer and a plurality of guide posts. The first dielectric layer, the first ground layer, the second dielectric layer, and the Two ground layers are stacked in sequence, and the radiation layer is provided on a surface of the first dielectric layer away from the first ground layer. The radiation layer is provided with a feed point for feeding power to the antenna unit. A ground layer is provided with a slot corresponding to the radiation layer, and the guide post is provided along the periphery of the slot and penetrates the second dielectric layer, so that its two ends are respectively connected to the first ground layer and the The second ground layer.
本申請另一方面還提供一種陣列天線,包括複數上述天線單元。 Another aspect of the present application also provides an array antenna, including a plurality of the above-mentioned antenna units.
本發明提供之天線單元及陣列天線,具有良好之方向性及天線增益,可實現快速波束切換,從而提高與低軌道衛星通訊時之天線性能。 The antenna unit and array antenna provided by the present invention have good directivity and antenna gain, and can realize fast beam switching, thereby improving the antenna performance when communicating with low-orbit satellites.
100:陣列天線 100:Array antenna
101:第一天線單元組 101: First antenna unit group
102:第二天線單元組 102:Second antenna unit group
103:第三天線單元組 103: The third antenna unit group
104:第四天線單元組 104: The fourth antenna unit group
10:天線單元 10:Antenna unit
11:輻射層 11: Radiation layer
111:饋點 111: Feed point
112:第一饋點 112: First feed point
113:第二饋點 113: Second feed point
114:連接部 114:Connection part
F1:第一等效電流路徑 F1: First equivalent current path
F2:第二等效電流路徑 F2: Second equivalent current path
12:第一介質層 12: First dielectric layer
13:第一接地層 13: First ground layer
131:槽孔 131:Slot
14:第二介質層 14: Second dielectric layer
15:第二接地層 15:Second ground layer
16:導柱 16: Guide pillar
20:相位控制模組 20: Phase control module
21:控制單元 21:Control unit
22:收發電路 22: Transceiver circuit
22a:第一收發電路 22a: First transceiver circuit
22b:第二收發電路 22b: Second transceiver circuit
22c:第三收發電路 22c: The third transceiver circuit
22d:第四收發電路 22d: The fourth transceiver circuit
200:無線通訊裝置 200:Wireless communication device
圖1是本申請一實施例提供之無線通訊裝置與低軌道衛星通訊之示意圖。 FIG. 1 is a schematic diagram of communication between a wireless communication device and a low-orbit satellite provided by an embodiment of the present application.
圖2是本申請一實施例提供之天線單元之立體示意圖。 FIG. 2 is a schematic three-dimensional view of an antenna unit provided by an embodiment of the present application.
圖3是圖2所示之天線單元之另一角度之示意圖。 FIG. 3 is a schematic diagram of the antenna unit shown in FIG. 2 from another angle.
圖4是圖2所示天線單元中之輻射層之示意圖。 FIG. 4 is a schematic diagram of the radiation layer in the antenna unit shown in FIG. 2 .
圖5是圖2所示天線單元中之輻射層產生之電流路徑之示意圖。 FIG. 5 is a schematic diagram of the current path generated by the radiation layer in the antenna unit shown in FIG. 2 .
圖6是圖2所示天線單元產生之圓極化電磁波之示意圖。 FIG. 6 is a schematic diagram of circularly polarized electromagnetic waves generated by the antenna unit shown in FIG. 2 .
圖7A是本申請另一實施例提供之輻射層之示意圖。 FIG. 7A is a schematic diagram of a radiation layer provided by another embodiment of the present application.
圖7B是本申請另一實施例提供之輻射層之示意圖。 FIG. 7B is a schematic diagram of a radiation layer provided by another embodiment of the present application.
圖8是本申請另一實施例提供之槽孔之示意圖。 Figure 8 is a schematic diagram of a slot provided by another embodiment of the present application.
圖9是本申請一實施例中之陣列天線之結構框圖。 Figure 9 is a structural block diagram of an array antenna in an embodiment of the present application.
圖10本申請一實施例提供之陣列天線之示意圖。 Figure 10 is a schematic diagram of an array antenna provided by an embodiment of the present application.
圖11是本申請一實施例提供之天線單元與相位控制模組之連接框圖。 Figure 11 is a connection block diagram of an antenna unit and a phase control module provided by an embodiment of the present application.
圖12是圖10所示陣列天線之輻射場型圖。 Figure 12 is a radiation field pattern diagram of the array antenna shown in Figure 10.
圖13A是本申請另一實施例提供之陣列天線之示意圖。 FIG. 13A is a schematic diagram of an array antenna provided by another embodiment of the present application.
圖13B是本申請另一實施例提供之陣列天線之示意圖。 FIG. 13B is a schematic diagram of an array antenna provided by another embodiment of the present application.
為使本申請實施例之目的、技術方案與優點更加清楚,下面將結合本申請實施例中之附圖,對本申請實施例中之技術方案進行清楚、完整地描述,顯然,所描述之實施例是本申請一部分實施例,而不是全部之實施例。 In order to make the purpose, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments These are part of the embodiments of this application, not all of them.
可理解,當一個元件被稱為“電連接”另一個元件,它可直接於另一個元件上或者亦可存於居中之元件。當一個元件被認為是“電連接”另一 個元件,它可是接觸連接,例如,可是導線連接之方式,亦可是非接觸式連接,例如,可是非接觸式耦合之方式。 It will be understood that when an element is said to be "electrically connected" to another element, it can be directly on the other element or intervening elements may also be present. When one component is said to be "electrically connected" to another A component, it can be connected by contact, for example, by wire connection, or it can be connected by non-contact, for example, by non-contact coupling.
可理解,本申請實施例中“至少一個”是指一個或者多個,多個是指兩個或兩個以上。除非另有定義,本文所使用之所有之技術與科學術語與屬於本申請中之技術領域之技術人員通常理解之含義相同。本申請之說明書中所使用之術語僅是為描述具體之實施例,不是旨在於限制本申請申請。 It can be understood that "at least one" in the embodiments of this application refers to one or more, and multiple refers to two or more. Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terms used in the description of this application are only for describing specific embodiments and are not intended to limit this application.
可理解,本申請實施例中,“第一”、“第二”等詞彙,僅用於區分描述之目的,而不能理解為指示或暗示相對重要性,亦不能理解為指示或暗示順序。限定有“第一”、“第二”之特徵可明示或者隱含地包括一個或者更多個所述特徵。於本申請實施例之描述中,“示例性的”或者“例如”等詞用於表示作例子、例證或說明。本申請實施例中被描述為“示例性的”或者“例如”之任何實施例或設計方案不應被解釋為比其它實施例或設計方案更優選或更具優勢。確切而言,使用“示例性的”或者“例如”等詞旨於以具體方式呈現相關概念。 It can be understood that in the embodiments of this application, words such as "first" and "second" are only used for the purpose of distinguishing descriptions, and cannot be understood as indicating or implying relative importance, nor can they be understood as indicating or implying order. Features defined as "first" and "second" may explicitly or implicitly include one or more of the stated features. In the description of the embodiments of this application, words such as "exemplary" or "for example" are used to represent examples, illustrations or explanations. Any embodiment or design described as "exemplary" or "such as" in the embodiments of the present application is not to be construed as preferred or advantageous over other embodiments or designs. Rather, use of the words "exemplary" or "such as" is intended to present the concepts in a specific manner.
可理解,本申請實施例中,術語“高度”是指於垂直於參考地層之方向上之投影長度。術語“中心”、“上”、“下”、“前”、“後”、“左”、“右”、“豎直”、“水平”、“頂”、“底”、“內”、“外”等指示之方位或位置關係為基於附圖所示之方位或位置關係,僅是為便於描述本申請與簡化描述,而不是指示或暗示所指之裝置或元件必須具有特定之方位、以特定之方位構造與操作,因此不能理解為對本申請之限制。 It can be understood that in the embodiment of the present application, the term "height" refers to the projected length in a direction perpendicular to the reference stratum. The terms "center", "top", "bottom", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", The orientation or positional relationship indicated by "outside" is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or component referred to must have a specific orientation. It is constructed and operated in a specific orientation and therefore cannot be construed as a limitation on this application.
請參閱圖1,本申請一實施例提供一種天線單元10。複數天線單元10成陣列地設置,以形成陣列天線100。可理解,天線單元10或陣列天線100可應用於行動電話、平板電腦、個人數位助理(personal digital assistant,PDA)、
客戶前置設備(Customer Premise Equipment,CPE)、電視等需要設置天線之無線通訊裝置200中,用以發射、接收無線電波以傳遞、交換無線訊號。
Referring to FIG. 1 , an embodiment of the present application provides an
可理解,所述無線通訊裝置200可採用以下一種或多種通訊技術:藍牙(bluetooth,BT)通訊技術、全球定位系統(global positioning system,GPS)通訊技術、無線保真(wireless fidelity,Wi-Fi)通訊技術、全球移動通訊系統(global system for mobile communications,GSM)通訊技術、寬頻碼分多址(wideband code division multiple access,WCDMA)通訊技術、長期演進(long term evolution,LTE)通訊技術、5G通訊技術、SUB-6G通訊技術、低軌道衛星通訊以及未來其他通訊技術等。
It can be understood that the
請一併參閱圖2及圖3,所述天線單元10包括輻射層11、第一介質層12、第一接地層13、第二介質層14、第二接地層15及複數導柱16。其中,所述第一介質層12,第一接地層13,第二介質層14及第二接地層15依次層疊設置。所述輻射層11設置於所述第一介質層12遠離所述第一接地層13之一側。
Please refer to FIG. 2 and FIG. 3 together. The
請繼續參閱圖4及圖5,所述輻射層11設置有饋點111,用以為所述天線單元10饋電。所述輻射層11由導電材料製成。例如,所述輻射層11可由金屬材料製成。於本實施例中,所述輻射層11為一大致呈多邊形之輻射貼片,可由一正方形輻射貼片沿對角線a切去其中一對角得到。
Please continue to refer to FIG. 4 and FIG. 5 . The
於本實施例中,所述饋點111包括第一饋點112及第二饋點113。其中,第一饋點112及第二饋點113均設置於所述輻射層11之另一對角線b上,且第一饋點112與第二饋點113以所述輻射層11之中心O於對角線b上對稱分佈。
In this embodiment, the
可理解,圓極化是指當電磁波之電場大小不變,方向隨時間變化,電場向量末端之軌跡於垂直於傳播方向之平面上投影是一個圓。因此,為接收及/或發射圓極化電磁波,使於所述輻射層11中流動之電流隨著時間經過而旋轉
極為重要。為使於所述輻射層11中流動之電流旋轉,需使電流於正交之方向上流動並產生具有90度之相位差之激勵。
It can be understood that circular polarization means that when the electric field of an electromagnetic wave remains constant in magnitude and changes in direction with time, the trajectory of the end of the electric field vector is a circle when projected on a plane perpendicular to the propagation direction. Therefore, in order to receive and/or emit circularly polarized electromagnetic waves, the current flowing in the
請一併參閱圖5及圖6,可理解,於本實施例中,所述第一饋點112與所述第二饋點113可分別於所述輻射層11上產生正交之第一等效電流路徑F1及第二等效電流路徑F2。且由於所述輻射層11沿對角線a切去對角,如此,可藉由調整切掉之對角之面積之大小,調整第一等效電流路徑F1與第二等效電流路徑F2產生之輻射訊號之相位差。
Please refer to FIG. 5 and FIG. 6 together. It can be understood that in this embodiment, the
於本實施例中,所述第一饋點112藉由饋入電流至所述天線單元10之輻射層11,以使所述輻射層11產生左旋圓極化電磁波或右旋圓極化電磁波兩者中之一種。所述第二饋點113藉由饋入電流至所述天線單元10之輻射層11,以使所述輻射層11產生左旋圓極化電磁波或右旋圓極化電磁波兩者中之另一種。
In this embodiment, the
可理解,於一些實施例中,所述第一饋點112及所述第二饋點113同時饋入電流至所述輻射層11,以使所述輻射層11同時產生左旋圓極化電磁波及右旋圓極化電磁波。於一些實施例中,所述第一饋點112及所述第二饋點113兩個饋點中,僅有一個饋點饋入電流至所述輻射層11,以使所述輻射層11單獨產生左旋圓極化電磁波或單獨產生右旋圓極化電磁波。
It can be understood that in some embodiments, the
請一併參閱圖2及圖5,所述第一介質層12之面積大於所述輻射層11之面積,所述第一介質層12之高度小於所述輻射層11之高度。於一些實施例中,所述第一介質層12可由金屬材料、陶瓷材料或有機材料等介電材料製成。於本實施例中,所述第一介質層12大致呈方形。且所述第一介質層12之材料為有機基板中之玻璃纖維材料,即所述第一介質層12為一FR-4板。
Please refer to FIG. 2 and FIG. 5 together. The area of the
所述第一接地層13設置於所述第一介質層12遠離所述輻射層11之表面。可理解,所述第一接地層13由導電材料製成,例如金屬材料。於本實
施例中,所述第一接地層13亦大致呈方形,且面積與所述第一介質層12之面積大致相等。
The
所述第一介質層12及所述第一接地層13對應所述輻射層11還開設有槽孔131。於所述天線單元10之堆疊方向上(即Z方向),所述槽孔131之投影面積覆蓋所述輻射層11之投影面積。於本實施例中,所述槽孔131大致呈圓形。
The
於本實施例中,所述槽孔131大致開設於所述第一介質層12與所述第一接地層13之中心。如此,所述輻射層11大致對應設置於所述第一介質層12及所述第一接地層13之中心位置。
In this embodiment, the
所述第二介質層14設置於所述第一接地層13遠離所述第一介質層12之一側,且與所述第一接地層13間隔設置。所述第二介質層14大致呈方形。可理解,所述第二介質層14亦可由金屬材料、陶瓷材料或有機材料製成。於本實施例中,所述第二介質層14與所述第一介質層12之組成材料與面積相同,於此不再贅述。
The
所述第二接地層15設置於所述第二介質層14遠離所述第一接地層13之表面。於所述天線單元10之堆疊方向上,所述第二接地層15之投影面積與所述第一接地層13之投影面積至少部分重合。可理解,所述第二接地層15亦由導電材料製成。
The
複數所述導柱16沿所述槽孔131之周沿間隔設置,且貫穿所述第二介質層14,使得其兩端分別連接所述第一接地層13及所述第二接地層15。如此,複數所述導柱16與所述第一接地層13及所述第二接地層15共同形成腔體,以使所述輻射層11之輻射方向更集中,從而增強所述天線單元10之增益值。
A plurality of the
可理解,天線單元10還包括饋入源(圖未示),用於電連接至第一饋點112及第二饋點113,為所述輻射層11饋入電流。請再次參閱圖3,於本實施例中,所述天線單元10還設置有兩連接部114。所述饋入源設置於所述第二接地層15遠離所述第二介質層14之一側。兩所述連接部114均穿過所述第二接地層15、所述第二介質層14及所述槽孔131。其中一所述連接部114一端連接至所述饋入源,另一端電連接至所述第一饋點112。另一所述連接部114一端連接至所述饋入源,另一端電連接至所述第二饋點113。如此,所述饋入源藉由兩所述連接部114分別電連接至所述第一饋點112及所述第二饋點113,用於為所述輻射層11饋入電流。
It can be understood that the
可理解,所述輻射層11不局限於圖2所示之形狀,於其他實施例中,所述輻射層11亦可為其他多邊形之形狀,以使所述第一饋點112及所述第二饋點113饋入電流時,於所述輻射層11產生不同長度之電流路徑。例如,請參閱圖7A,所述輻射層11亦可於方形輻射貼片點之對角線上之兩角增加延伸部132形成;請參閱7B,所述輻射層11亦可呈花瓣形,由方形輻射貼片沿各邊之中線挖設一段距離形成。
It can be understood that the radiating
可理解,於其他實施例中,所述槽孔131亦可為其他形狀。例如,請參閱圖8,所述槽孔131亦可呈方形。
It is understood that in other embodiments, the
可理解,本申請提供之天線單元10,藉由於輻射層11上切去兩對角,且設置第一饋點112及第二饋點113,可輻射左旋圓極化電磁波及/或右旋圓極化電磁波,以減少大氣電離層對輻射訊號之影響,從而更好地接收衛星訊號。再者,由於習知衛星之發射天線可產生左旋圓極化電磁波或右旋圓極化電磁波,如此,本申請提供之天線單元10可適用於多種衛星類型,具有廣闊之應用場景。進一步地,天線單元10還藉由構造間隔設置之第一接地層13及第二接地層15,且第一接地層13與第二接地層15藉由複數所述導柱16連接,從而於
輻射層11之一側形成腔體,以使輻射層11之輻射方向更加集中,有效提高所述天線單元10之增益。
It can be understood that the
請一併參閱圖1及圖9,本申請還提供一種陣列天線100,可與低軌道衛星通訊。所述陣列天線100包括複數所述天線單元10及相位控制模組20。可理解,複數所述天線單元10排列設置,形成一天線陣列。所述相位控制模組20電連接至複數所述天線陣列,用於控制所述陣列天線100之波束方向。
Please refer to Figure 1 and Figure 9 together. This application also provides an
於所述陣列天線100中,每一所述天線單元10與另一所述天線單元10間隔相等距離或互相接觸。於本實施例中,複數天線單元10排列形成一大致呈方形之天線陣列。
In the
於本實施例中,所述相位控制模組20設置於所述第二接地層15遠離所述第二介質層14之一側。所述相位控制模組20包括複數控制單元21。每一所述控制單元21分別電連接至複數所述天線單元10,用於分組控制所述天線單元10激發不同頻段及/或不同相位之電磁波。可理解,於一些實施例中,控制單元21可為相位控制晶片,用於控制饋入所述輻射層11之電流之相位。
In this embodiment, the
可理解,所述陣列天線100之相位控制模組20還包括複數收發電路22。所述控制單元21電連接至所述收發電路22,所述收發電路22藉由所述連接部114電連接至所述天線單元10之饋點111。所述控制單元21藉由控制饋入所述天線單元10之電流之相位,以控制所述陣列天線100之相位。可理解,所述收發電路22可包括一些射頻元件,例如放大器、合路器等。
It can be understood that the
請繼續參閱圖10及圖11,以說明所述陣列天線100之工作過程。
Please continue to refer to FIG. 10 and FIG. 11 to describe the working process of the
可理解,於一實施例中,複數所述天線單元10組成之天線陣列,可進一步劃分為第一天線單元組101、第二天線單元組102、第三天線單元組103及第四天線單元組104。所述陣列天線100中之複數收發電路22包括第一收發電路22a、第二收發電路22b、第三收發電路22c及第四收發電路22d。所述第
一天線單元組101、所述第二天線單元組102、所述第三天線單元組103及所述第四天線單元組104分別與所述第一收發電路22a、所述第二收發電路22b、所述第三收發電路22c及所述第四收發電路22d一一對應連接。
It can be understood that in one embodiment, the antenna array composed of the plurality of
於一些實施例中,所述控制單元21藉由控制所述第一收發電路22a饋入對應之電流,以控制所述第一天線單元組101輻射第一頻段之具有第一相位之電磁波;所述控制單元21藉由控制所述第二收發電路22b饋入對應之電流,以控制所述第二天線單元組102輻射第一頻段之具有第二相位之電磁波;所述控制單元21藉由控制所述第三收發電路22c饋入對應之電流,以控制所述第三天線單元組103輻射第二頻段之具有第三相位之電磁波;所述控制單元21藉由控制所述第四收發電路22d饋入對應之電流,以控制所述第四天線單元組104輻射第二頻段之具有第四相位之電磁波。如此,所述陣列天線100於所述控制單元21之控制下,可產生輻射方向之旋轉,從而有利於所述陣列天線100靈活快速地進行波束追蹤及波束切換。
In some embodiments, the control unit 21 controls the first antenna unit group 101 to radiate the electromagnetic wave with the first phase in the first frequency band by controlling the first transceiver circuit 22a to feed the corresponding current; The control unit 21 controls the second antenna unit group 102 to radiate the electromagnetic wave with the second phase in the first frequency band by controlling the second transceiver circuit 22b to feed the corresponding current. The third transceiver circuit 22c is controlled to feed the corresponding current to control the third antenna unit group 103 to radiate electromagnetic waves with a third phase in the second frequency band; the control unit 21 controls the fourth transceiver by controlling the fourth transceiver circuit 22c. The circuit 22d feeds a corresponding current to control the fourth antenna unit group 104 to radiate electromagnetic waves with a fourth phase in the second frequency band. In this way, the
可理解,本申請不局限所述陣列天線100中之天線單元組及收發電路之數量。且所述陣列天線100中之天線單元組之劃分方式不局限於圖10所示之劃分方式。可理解,每一天線單元組之數量可相同,亦可不相同。本領域技術人員可根據實際需要決定天線單元組之劃分,及天線單元組與對應之收發電路之數量。
It can be understood that this application is not limited to the number of antenna unit groups and transceiver circuits in the
請繼續參閱圖12,圖12為陣列天線100於一實施例中之2D輻射場型圖。由圖12可看出,所述陣列天線100之波束方向較集中,有利於提高陣列天線100之天線增益。
Please continue to refer to FIG. 12 , which is a 2D radiation pattern diagram of the
可理解,於其他實施例中,所述控制單元21可控制陣列天線100輻射28GHz-39Ghz頻段之輻射訊號。即所述控制單元21可控制陣列天線100輻
射Ku頻段之輻射訊號,以與低軌道衛星進行通訊。可理解,於其他實施例中,所述控制單元21還可控制陣列天線100輻射其他毫米波頻段之訊號。
It can be understood that in other embodiments, the control unit 21 can control the
可理解,於其他實施例中,所述陣列天線100亦可呈其他形狀。例如,請參閱圖13A及圖13B,於其他實施例中,所述陣列天線100亦可呈多邊形或菱形。
It is understood that in other embodiments, the
可理解,本申請提供之陣列天線100,可應用於無線通訊裝置200上。所述陣列天線100包括由複數天線單元10形成之天線陣列,藉由相位控制模組20對陣列天線100之控制,使陣列天線100快速調整訊號波束之方向,從而於與低軌道衛星之通訊過程中實現快速波束方向切換,提高無線通訊裝置200與低軌道衛星之通訊效果。
It can be understood that the
最後應說明,以上實施例僅用以說明本發明之技術方案而非限制,儘管參照較佳實施例對本發明進行了詳細說明,本領域具有通常技藝者應當理解,可對本發明之技術方案進行修改或等同替換,而不脫離本發明技術方案之精神與範圍。 Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not limiting. Although the present invention has been described in detail with reference to the preferred embodiments, those with ordinary skill in the art will understand that the technical solutions of the present invention can be modified. or equivalent substitutions without departing from the spirit and scope of the technical solution of the present invention.
10:天線單元 10:Antenna unit
11:輻射層 11: Radiation layer
12:第一介質層 12: First dielectric layer
13:第一接地層 13: First ground layer
131:槽孔 131:Slot
14:第二介質層 14: Second dielectric layer
15:第二接地層 15:Second ground layer
16:導柱 16: Guide pillar
Claims (9)
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