TWI817682B - Protective film forming device - Google Patents

Abstract

The present invention provides a protective film forming device capable of forming a protective film with a flat surface without placing a burden on components. The protective film forming apparatus includes a resin supply part that supplies liquid curable resin to a surface of the substrate on which the component is mounted; a substrate holding part that holds the substrate to which the curable resin is supplied; and a support part that faces the substrate holding part. Provided; a tape supply part that supplies an anti-adhesion tape between the substrate holding part and the support part; and a pressing part that presses the substrate toward the support part and presses the curable resin supplied to the substrate against the anti-adhesion tape so that the curable resin is extends on the substrate; the curing part cures the curable resin extending on the substrate; and the contact part presses the substrate through the pressing part, and when the substrate holding part and the supporting part are in contact, the curable resin is supplied to the substrate A prescribed gap is formed between the surface of the anti-adhesive tape and the surface of the anti-adhesive tape.

Description

Protective film forming device

The present invention relates to a protective film forming device.

In recent years, the development of large-scale display devices or lighting devices has been promoted, in which LED modules equipped with a plurality of light emitting diode (LED) elements are spread across multiple rows and columns on a substrate. In addition, various modules that integrate multiple functional components have also been developed. In such display devices, lighting devices, and modules, elements are sealed with a sealing member such as curable resin from the viewpoint of protection such as deterioration suppression.

The resin as the sealing member is applied in a liquid state to the surface of the substrate on which the element is mounted, and then solidified by heat, light, or the like. At this time, for example, the thickness of the sealing member is likely to differ between the central portion and the end portion. It is particularly difficult to control the thickness of the end portions. Therefore, for example, when the LED modules are covered, the thickness difference at the end portions becomes a step difference, which may affect the display of the display device. Furthermore, in illumination modules such as backlights, the illumination distribution may vary, and in other modules, it may be difficult to mount them in thin packages. In order to solve such a problem, attempts are being made to use a sheet-like sealing member having a fixed thickness instead of a liquid sealing member. For example, in the technology disclosed in Patent Document 1, a sheet-like sealing member having a fixed thickness is used for each module, so that the seams between the modules are not noticeable. [Prior technical literature] [Patent Document]

[Patent Document 1]: Japanese Patent Application Publication No. 2021-9937

[Problem to be solved by the invention]

However, when a sheet-shaped sealing member is used, high pressure is required to press the sheet-shaped sealing member into the gaps such as unevenness of the mounted component, which not only places a burden on the component, but also causes damage to the component. The risk of position deviation or sideways rotation. On the other hand, if the pressure for pressing the sealing member is insufficient, the sealing member cannot fully enter the gap between the components, and the components may not be protected. Furthermore, when the thickness of the sheet-like sealing member is thin relative to the height of the element, the surface of the sealing member may become uneven due to unevenness of the element. In particular, these effects become larger when the thicknesses of components arranged in the module are different.

An object of the present invention is to provide a protective film forming device that can form a protective film with a flat surface without placing a burden on components. [Means to solve the problem]

The protective film forming apparatus of the present invention includes: a resin supply unit that supplies liquid curable resin to a surface of a substrate on which components are mounted; a substrate holding unit that holds the substrate to which the curable resin is supplied; and a support unit. Provided opposite to the substrate holding portion; a tape supply portion supplies an anti-adhesion tape between the substrate holding portion and the support portion; and a pressing portion presses the tape held by the substrate holding portion toward the support portion. The substrate presses the curable resin supplied to the substrate against the anti-adhesive tape to spread the curable resin on the substrate; the curing portion spreads the curable resin on the substrate The curable resin is cured; and a contact portion is used to press the substrate through the pressing portion. When the substrate holding portion is in contact with the support portion, the curable resin is supplied to the substrate. A predetermined gap is formed between the surface of the resin and the surface of the anti-adhesive tape. [Effects of the invention]

The protective film forming device of the present invention can form a protective film with a flat surface without placing a burden on the element.

(A) First Embodiment The first embodiment of the present invention (hereinafter referred to as the present embodiment) will be described in detail with reference to the drawings. First, the protective film formation object and the protective film will be described, and then, the protective film forming apparatus will be described. In addition, each drawing schematically shows this embodiment.

[Protective film formation target] As shown in (A) of FIG. 1 , the workpiece 1 to be formed as a protective film in the present embodiment includes a support substrate 11 , a flexible substrate 12 supported on one side of the support substrate 11 , and components arranged and mounted on the surface of the flexible substrate 12 . Light emitting element 13. The workpiece 1 is a module substrate constituting a display device by peeling off the support substrate 11 after forming the protective film 2 described below, and spreading it in a matrix of multiple rows and columns.

The support substrate 11 is, for example, a glass substrate. The flexible substrate 12 includes, for example, polyimide, and is supported on one side of the supporting substrate 11 . The flexible substrate 12 is a substrate that supports the light-emitting element 13 by forming the protective film 2 after mounting the light-emitting element 13 and removing the supporting substrate 11 . The light-emitting element 13 is, for example, an LED element, and is mounted on the surface of the flexible substrate 12 . The light-emitting element 13 of this embodiment is particularly a micron-level LED element, and its height is, for example, 25 μm.

[protective film] As shown in FIG. 1(B) , a protective film 2 is formed on the workpiece 1 to seal the light-emitting element 13 . The protective film 2 is a film made of solidified liquid curable resin R. The curable resin R is, for example, a thermosetting resin that is cured by heat. The viscosity of the curable resin R in the initial state is, for example, 4000 mPa·s. The curable resin R is supplied to the surface of the workpiece 1 on the side where the light-emitting element 13 is provided, and spreads on the workpiece 1 as will be described later. Then, the curable resin R spread on the workpiece 1 is cured, thereby forming the protective film 2 on the workpiece 1 . In addition, the thickness of the protective film 2 is, for example, 50 μm to 300 μm. The protective film 2 is not formed on the entire surface of the workpiece 1 , but is set not to be formed on the outer peripheral portion of the workpiece 1 . The outer peripheral portion where the protective film 2 is not formed, that is, the portion outside the protective film formation area, is a portion that is cut off in a subsequent process and does not function as a module or a connection terminal with the outside of the module. The portion outside the protective film formation area is used to allow protrusion during formation of the protective film or to hold the workpiece 1 during the formation of the protective film 2 .

[Protective film forming device] [structure] The protective film forming device 3 supplies the curable resin R to the workpiece 1 and spreads and solidifies the curable resin R on the workpiece 1 , thereby forming the protective film 2 on the workpiece 1 . As shown in FIGS. 2 and 3 , the protective film forming device 3 includes a reversing unit 31 that holds the workpiece 1 carried in from the outside and inverts the workpiece 1 after the curable resin R is supplied; and a resin supply unit 32 that supplies the workpiece 1 to the workpiece 1 . One side is supplied with the curable resin R; the substrate holding part 33 receives the workpiece 1 supplied with the curable resin R from the turning part 31 and holds the workpiece 1 in a turned over state; the supporting part 34 is connected to the substrate holding part 33 Provided oppositely; the tape supply part 35 supplies the anti-adhesion tape T that prevents the curable resin R from adhering to the support part 34 between the substrate holding part 33 and the support part 34 ; the pressing part 36 presses the workpiece 1 toward the support part 34 On the other hand, the curable resin R is pressed to the support portion 34 through the anti-adhesive tape T; and the curing portion 37 to cure the curable resin R to form the protective film 2 on the workpiece 1 . Furthermore, the protective film forming apparatus 3 is provided with a control device 8 for controlling these respective structures.

In FIG. 3 , let the pressing direction of the workpiece 1 by the pressing part 36 be the Z direction, and let the feeding direction of the anti-adhesion tape T by the tape supply part 35 be the X direction in a plane orthogonal to the Z direction. The direction orthogonal to the X direction is the Y direction. The Y direction in the figure is the direction running through the paper. For example, when the protective film forming device 3 is installed so that the Z direction becomes the vertical direction, the XY plane becomes a horizontal plane. At this time, the Z direction is the height direction, the installation surface side is called the lower side, and the opposite side is called the upper side. That is, the term "downward" refers to the direction of gravity. Furthermore, the rotation direction parallel to the XY plane is called the θ direction, and the rotation direction parallel to the YZ plane is called the α direction.

As shown in FIG. 2 , the reversing unit 31 makes the surface on which the light-emitting element 13 is mounted, that is, the surface on which the curable resin R is supplied, face upward with respect to the workpiece 1 carried in from the outside by a conveying member or the like (not shown). The place is maintained. Furthermore, after supplying the curable resin R to the workpiece 1 , the inversion unit 31 inverts the workpiece 1 so that the surface on the side to which the curable resin R is supplied faces downward, and delivers the workpiece 1 to the substrate holding unit 33 . Then, after the protective film 2 is formed on the workpiece 1, the inverting part 31 receives the workpiece 1 from the substrate holding part 33 and inverts the workpiece 1 to return to its original position. In addition, the workpiece 1 on which the protective film 2 is formed and returned to its original position is recovered from the reversing unit 31 by a conveying member (not shown) that carries the workpiece 1 out of the protective film forming device 3 .

The turning part 31 includes an arm 311 that holds the workpiece 1 from the support substrate 11 side by, for example, vacuum suction, and an XYZ moving mechanism 312 that supports the arm 311 and moves the arm 311 in the XYZ direction. The arm 311 is, for example, a rectangular parallelepiped-shaped arm extending in a direction parallel to the XY plane. An adsorption hole for holding the workpiece 1 is provided at one end of the arm 311 . The adsorption hole is connected to a pneumatic circuit (not shown), and the arm 311 adsorbs and holds the workpiece 1 through the negative pressure generated by the pneumatic circuit. Furthermore, the arm 311 releases the held workpiece 1 by releasing the negative pressure. Furthermore, the arm 311 is provided to be rotatable in the α direction by the drive mechanism 311a provided at the other end, so that the workpiece 1 held by the suction hole can be turned over 180°. The XYZ moving mechanism 312 includes, for example, a motor, a linear guide, a ball screw, etc., and moves the arm 311 in the XYZ direction.

The resin supply part 32 is connected to a resin supply device (not shown) including a liquid supply device, a valve, etc., and ejects the liquid curable resin R from the nozzle 32a. The nozzle 32 a of this embodiment is provided above the inverting portion 31 and faces the surface of the workpiece 1 held by the inverting portion 31 on which the protective film is formed, that is, the surface on which the light-emitting element 13 is mounted. The resin supply unit 32 is movable in the XYZ direction by a drive mechanism (not shown) and can supply the liquid curable resin R to any part of the surface of the workpiece 1 held by the turning unit 31 on which the light-emitting element 13 is mounted. . Therefore, the curable resin R discharged from the nozzle 32 a is supplied to the surface of the workpiece 1 on which the light-emitting element 13 is mounted.

The substrate holding part 33 holds the workpiece 1 delivered to and from the turning part 31 . As shown in FIG. 2 , the substrate holding portion 33 is provided at a position where the workpiece 1 can be delivered to the turning portion 31 , for example, at a position parallel to the turning portion 31 in the Y direction. The substrate holding portion 33 is supported by a guide (not shown), and is disposed above the support portion 34 so as to be movable up and down while maintaining parallelity. Furthermore, the substrate holding portion 33 is biased in a direction away from the support portion 34 by a spring portion 332 a that is an elastic member. That is, the substrate holding part 33 is supported by the spring part 332a and is arranged spaced apart from the supporting part 34.

The substrate holding part 33 includes a pair of legs 332 . The leg portion 332 is a member that protrudes downward from the lower surface of the substrate holding portion 33 . That is, it extends toward the support portion 34 . The lower end of the leg part 332 is connected to the upper surface 341a of the base 341 of the support part 34 mentioned later via the spring part 332a.

As shown in FIGS. 4 and 5 , the substrate holding portion 33 is a frame. That is, the substrate holding portion 33 is a plate-shaped member in which the center portion of the frame is opened to a size corresponding to the size of the workpiece 1, and the workpiece 1 is held by the step portion 331 provided in the opening. The step portion 331 is provided to protrude from the inner surface of the opening to narrow the lower side of the opening. The upper surface of the protruding portion is in contact with the outer peripheral portion of the workpiece 1, thereby holding the workpiece. 1. Therefore, below, the upper surface of the step portion 331 is also referred to as the substrate holding surface 331a. As described above, the protective film 2 is not formed on the entire surface of the workpiece 1 but is formed in a predetermined area. That is, there is a protective film forming region in an area where the protective film 2 should be formed. Therefore, the protective film 2 is formed on the workpiece 1 by curing the curable resin R extending to the protective film formation region. The protective film forming area is set according to the size of the workpiece 1 . The opening in the substrate holding portion 33 having a size corresponding to the size of the workpiece 1 means an opening having a size including at least the protective film formation region. That is, it is an opening for exposing a region where the curable resin R extends on the workpiece 1 .

The lower surface of the portion of the substrate holding portion 33 connecting the pair of leg portions 332 serves as a contact portion 333 that comes into contact with the anti-adhesion tape T held by the support portion 34 described below. The anti-adhesion tape T is supplied between the substrate holding part 33 and the support part 34 and between the pair of leg parts 332 and the spring part 332a provided at the lower end thereof as will be described later. Therefore, the contact portion 333 is a portion that serves as a blocking portion that contacts the support portion 34 via the anti-adhesion tape T when the substrate holding portion 33 is pressed toward the support portion 34 against the biasing force of the spring portion 332 a. Then, the substrate holding portion 33 is stopped. The contact surface of the contact portion 333 is lower than the substrate holding surface 331a. That is, the distance between the substrate holding surface 331 a and the support part 34 is larger than the contact surface of the contact part 333 . The distance in the height direction (Z direction) between the contact portion 333 and the substrate holding surface 331 a is set so as to have a required thickness of the protective film 2 . Thereby, a predetermined gap is formed between the substrate holding surface 331a and the surface of the anti-adhesion tape T. Therefore, in a state where the workpiece 1 is held on the substrate holding surface 331a, the surface of the workpiece 1 to which the curable resin R is supplied A predetermined gap is formed between the surface of the anti-adhesion tape T and the surface of the anti-adhesive tape T.

The support portion 34 is provided to face the substrate holding portion 33 and supports the surface side of the workpiece 1 pressed by the pressing portion 36 to which the curable resin R is supplied via the anti-adhesion tape T. The support part 34 includes a base 341 and a holding member 342 provided on the upper surface 341 a of the base 341 and holding the anti-adhesion tape T. The base 341 is a base of the support portion 34 and a platform that supports the holding member 342 . The holding member 342 is supported on the base 341 in a detachable manner. The holding member 342 has a flat surface in contact with the curable resin R via the anti-adhesion tape T. In addition, the anti-adhesion tape T is a tape that prevents the curable resin R from directly contacting and adhering to the holding member 342 .

The holding member 342 is, for example, an air-permeable porous plate-shaped member in which fine spaces connected as a whole are densely and substantially uniformly formed, and is made of sintered ceramic or sintered metal. Therefore, the holding member 342 of this embodiment has fine holes substantially uniformly formed on the entire surface. Furthermore, the holding member 342 is connected to a pneumatic circuit (not shown), and the negative pressure generated by the air-permeable porous holding member 342 through the pneumatic circuit can cause negative pressure to act on its surface. Thereby, the holding member 342 attracts and holds the anti-adhesion tape T. Furthermore, the holding member 342 releases the held anti-adhesion tape T by releasing the negative pressure. As described above, the holding member 342 of this embodiment is made of air-permeable porous material. Therefore, fine pores are formed substantially uniformly on the entire surface of the holding member 342. When negative pressure is applied from the back surface of the holding member 342, all of the fine pores are formed. The opening generates negative pressure, so the anti-adhesion tape T can be adsorbed and held on the entire surface.

As shown in FIG. 3 , the tape supply section 35 is provided with a supply reel 351 and a recovery reel 352 provided at a position sandwiching the substrate holding section 33 in the X direction, so that the workpiece 1 held by the substrate holding section 33 is The anti-adhesion tape T is supplied between the holding member 342 of the support portion 34 and the holding member 342 of the support portion 34 . The supply reel 351 is detachable and rotatable, and a tension mechanism (not shown) is used to apply braking force to its rotation. The recovery reel 352 is detachable and rotatable, and is rotationally driven by a motor (not shown). The anti-adhesive tape T is wound around the supply reel 351, is pulled out by the rotational drive of the recovery reel 352, and is wound around the recovery reel 352 to be recovered. That is, the anti-adhesion tape T is fed out to the holding member 342 of the support part 34 by the cooperation of the supply reel 351 and the recovery reel 352 . Furthermore, in the path where the anti-adhesion tape T sent out from the supply reel 351 is wound to the recovery reel 352 , tape support portions TS are provided on both sides of the support portion 34 . The tape support portion TS supports the anti-adhesion tape T sent out to the holding member 342 of the support portion 34 at a height such that the anti-adhesion tape T is sent out to slightly contact or create a gap with the upper surface 342 a of the holding member 342 .

The anti-adhesion tape T prevents the curable resin R supplied to the side of the workpiece 1 on which the light-emitting element 13 is mounted from adhering to the holding member 342 of the support portion 34 when it is pressed against the support portion 34 by the pressing portion 36 . The anti-adhesive tape T is a tape that is liquid-repellent with respect to the curable resin R, and is, for example, a surface of a base material made of polyethylene terephthalate (PET) coated with silicone. belt. Accordingly, after the protective film is formed, the adhesive force generated due to curing of the curable resin R is weakened and acts on the anti-adhesion tape T, making it easier to peel the anti-adhesion tape T from the workpiece 1 .

In addition, in order to prevent the curable resin R from wrapping around the anti-adhesion tape T and adhering to the holding member 342 , it is preferable that the width of the anti-adhesion tape T is wider than the width of the holding member 342 . Furthermore, according to the inventor's research, if the anti-adhesion tape T is too thin, warping or wrinkles will concentrate on the anti-adhesion tape T when the curable resin R is pressed or heated. By being transferred to the curable resin R, deformation or unevenness occurs on the surface of the protective film 2 in which the curable resin R is cured. Furthermore, the unevenness of the surface of the support portion 34 may be transferred. Therefore, the thickness of the anti-adhesion tape T is preferably thick, for example, preferably 190 μm or more.

However, if the thickness of the anti-adhesion tape T is too thick, the length that can be wound on the supply reel 351 or the recovery reel 352 will be shortened, so that the supply reel 351 or the recovery reel 352 must be frequently replaced. Furthermore, the flexibility of the anti-adhesive tape is lost, which may cause difficulty in supplying the anti-adhesion tape T in parallel to the holding member 342 or failure to bring the anti-adhesion tape T into close contact with the holding member 342 . Therefore, the anti-adhesion tape T is selected to have a thickness that takes heat resistance, flexibility, and surface hardness into consideration and prevents warpage or wrinkles from being concentrated when the curable resin R is pressed or heated. The anti-adhesion tape T or the unevenness on the surface of the support portion 34 will not be transferred.

The pressing part 36 is a plate-shaped member that presses the workpiece 1 held by the substrate holding part 33 and presses the substrate holding part 33 to the anti-adhesion tape T. The pressing portion 36 is provided on the opposite side of the supporting portion 34 to face the substrate holding portion 33 . The pressing part 36 includes a flat pressing surface facing the workpiece 1 . Furthermore, the pressing part 36 is lowered or raised by a driving mechanism (not shown) including a cylinder or the like, for example. Thereby, the pressing part 36 presses the workpiece 1 held by the substrate holding part 33, and presses the curable resin R supplied to the workpiece 1 against the surface of the anti-adhesion tape T held by the support part 34. At this time, the curable resin R supplied to the workpiece 1 is pushed between the surface of the anti-adhesion tape T and spreads on the surface of the workpiece 1 .

More specifically, as shown in FIG. 6(C) , the substrate holding part 33 is pressed through the workpiece 1 by the pressing of the pressing part 36 , and the spring of the leg part 332 of the substrate holding part 33 connected to the supporting part 34 The portion 332a shrinks. The leg portion 332 contracts the spring portion 332a, thereby narrowing the distance from the substrate holding surface 331a of the substrate holding portion 33 to the anti-adhesion tape T. The substrate holding part 33 pressed by the pressing part 36 is stopped when the contact part 333 comes into contact with the surface of the anti-adhesion tape T held by the holding member 342 of the supporting part 34 . At this time, the distance from the surface of the anti-adhesion tape T held by the holding member 342 to the surface (substrate holding surface 331 a ) of the workpiece 1 to which the curable resin R is supplied is, for example, 50 μm to 300 μm. The curable resin R extends within said gap. Therefore, the distance becomes the height of the protective film 2 formed by curing the curable resin R. Furthermore, the distance is determined based on the required height (thickness) of the protective film 2 . That is, the distance is a predetermined gap between the surface of the workpiece 1 to which the curable resin R is supplied and the surface of the anti-adhesion tape T. Furthermore, the distance is set by the substrate holding portion 33 being in contact with the supporting portion 34 via the anti-adhesion tape T. As described above, the outer peripheral portion of the surface of the workpiece 1 to which the curable resin R is supplied is in contact with the substrate holding surface 331a. The contact portion 333 is the lower surface of the portion of the substrate holding portion 33 connecting the pair of leg portions 332 , and the distance from the surface (contact surface) with the support portion 34 to the substrate holding surface 331 a becomes the contact portion 333 height (indicated by L in Figure 5). Therefore, the height of the contact portion 333 is the distance from the surface of the anti-adhesion tape T held by the holding member 342 to the surface of the workpiece 1 to which the curable resin R is supplied (substrate holding surface 331 a ), and is a protective The height of membrane 2. Therefore, the height of the contact portion 333 is set according to the required height (thickness) of the protective film 2 .

In this way, when the substrate holding portion 33 is pressed by the pressing portion 36, the contact of the contact portion 333 can ensure a predetermined gap between the surface of the workpiece 1 to which the curable resin R is supplied and the surface of the anti-adhesion tape T. . In addition, the contact portion 333 is the back surface (the surface on the support side, the lower surface) of the portion of the substrate holding portion 33 that spans the support portion 34 . The contact surface of the contact portion 333 may span the entire portion of the support portion 34 or may be provided only on a portion thereof.

As shown in FIGS. 3 and 6(A) to 6(F) , the curing part 37 cures the curable resin R spread on the workpiece 1 by the pressing part 36 to form the protective film 2 on the workpiece 1 . In this embodiment, the curable resin R is a thermosetting resin, and accordingly, the curing portion 37 is, for example, a heater that generates heat by applying a voltage. The curing part 37 is provided on the upper part of the pressing part 36, and is lowered or raised by a driving mechanism (not shown) including a cylinder or the like, for example. The curing part 37 descends from above the pressing part 36 and contacts the pressing part 36 . Thereby, the heat of the curing part 37 is conducted to the curable resin R via the pressing part 36 and the support substrate 11 and the flexible substrate 12 of the workpiece 1, and the curable resin R is cured.

The control device 8 is a device that controls the protective film forming device 3 . The control device 8 includes, for example, a dedicated electronic circuit or a computer that runs a predetermined program. That is, the control device 8 controls the operation of the protective film forming device 3 by controlling the operations of the turning unit 31 , the resin supply unit 32 , the support unit 34 , the tape supply unit 35 , the pressing unit 36 , the curing unit 37 , and the like.

As shown in FIG. 7 , the control device 8 includes a turning unit control unit 81 , a resin supply control unit 82 , a tape adsorption control unit 83 , a tape supply amount control unit 84 , a pressing control unit 85 , a curing control unit 86 , a storage unit 87 , and a setting unit. unit 88 and input/output control unit 89.

The flipping unit control unit 81 controls the adsorption operation and flipping operation of the arm 311 of the flipping unit 31 and the moving operation of the XYZ moving mechanism 312 . The resin supply control unit 82 controls the amount, supply timing, and supply position of the curable resin R supplied to the surface of the workpiece 1 on which the light-emitting element 13 is provided. The amount of curable resin R to be supplied is determined based on the size of the workpiece 1 , that is, the size of the area where the protective film is to be formed (protective film formation area) and the thickness of the protective film. Furthermore, the curable resin R may be supplied in a dotted or linear manner. The point or line can be either single or multiple, and the supply amount of each point or line is determined according to its number. Moreover, at this time, the expansion state of the curable resin R is observed in advance, and the positions of each point and each line or each supply amount are determined so that the entrapment of bubbles or the protrusion from the protective film formation area is within tolerance. Control is performed according to the supply status determined in this way.

The tape adsorption control unit 83 controls the air pressure circuit connected to the support unit 34 to control the adsorption operation of the holding member 342 to the anti-adhesion tape T. For example, before the curable resin R supplied to the workpiece 1 is pressed against the holding member 342 , the anti-adhesion tape T is adsorbed to the holding member 342 . This prevents wrinkles from being concentrated on the anti-adhesion tape T when the anti-adhesion tape T is in close contact with the entire surface of the holding member 342 and the contact portion 333 of the substrate holding portion 33 comes into contact or when the anti-adhesion tape T is heated for curing the curable resin R. , thereby preventing wrinkles from being transferred to the protective film 2. After the curing of the curable resin R of the workpiece 1 is completed, the tape adsorption control unit 83 releases the adhesion prevention tape T before the workpiece 1 leaves the support portion 34 and releases the antiadhesion tape T from the holding member 342 . The tape supply amount control unit 84 controls the feeding of the anti-adhesion tape T. For example, after the formation of the protective film on one workpiece 1 is completed, the anti-adhesion tape T is fed out and the portion pressed against the curable resin R is replaced with an unused portion. In this way, the tape supply amount control unit 84 and the tape adsorption control unit 83 perform control in coordination.

The pressing control unit 85 controls a driving mechanism (not shown) provided in the pressing unit 36 . For example, by lowering the pressing part 36 at a predetermined speed, the surface of the workpiece 1 to which the curable resin R is not supplied is pressed against the pressing part 36 and held on the substrate against the biasing force of the spring part 332a. The workpiece 1 of the holding part 33 faces the support part 34 at a predetermined distance. Similarly, after the protective film 2 is formed, the pressing part 36 is raised to separate from the workpiece 1 .

The curing control unit 86 controls the curing unit 37 in order to cure the curable resin R. When the curable resin R is a thermosetting resin, the curing control part 86 of this embodiment controls the temperature of the curing part 37 so that it becomes the curing temperature required for thermosetting the curable resin R. Furthermore, the curing control unit 86 also controls the lifting and lowering of the curing unit 37.

The storage unit 87 stores data required for the control of this embodiment. The data stored in the storage unit 87 include position coordinates such as the position of each structure, the heating temperature of the curing unit 37, the amount of the anti-adhesion tape T fed out, and the like. The setting unit 88 is a processing unit that sets data to the storage unit 87 based on the input. The input/output control unit 89 is an interface that controls signal conversion or input/output with each unit to be controlled.

An input device 91 and an output device 92 are connected to the control device 8 . The input device 91 is an input member that allows the operator to operate the switches, touch panel, keyboard, mouse, etc. of the protective film forming device 3 via the control device 8 . The operator can input various data set to the storage unit 87 through the input device 91 . The output device 92 is an output member such as a display, a lamp, a meter, etc., which makes data for confirming the status of the device visible to the operator. For example, the output device 92 may display an input screen for data from the input device 91 .

[effect] Next, an operation example of this embodiment will be described with reference to FIGS. 6(A) to 6(F) and FIG. 8 . FIG. 8 is a flowchart showing the formation process of the protective film 2 . As a premise, it is assumed that the workpiece 1 in a state where the curable resin R is not supplied is loaded into the protective film forming device 3 by a transport member (not shown), and the turning unit 31 of the protective film forming device 3 transfers the workpiece 1 from the supporting substrate 11 via the arm 311 . Side adsorbs and holds workpiece 1. Furthermore, it is assumed that the adhesion-preventing tape T is supplied to the support portion 34 by the tape supply amount control unit 84 . Furthermore, it is assumed that the curing control unit 86 raises the temperature of the curing part 37 to, for example, 120° C. as the standby temperature.

In addition, the standby temperature is not limited, but is preferably the same as the curing temperature of the curable resin R or a temperature lower than the curing temperature. If it is the same as the curing temperature, this temperature can be directly used when curing the curable resin R, so the temperature rise time to the curing temperature can be eliminated. When the temperature is lower than the curing temperature, power consumption during standby can be suppressed. At this time, when curing the curable resin R, a heating time is required until the temperature reaches the curing temperature. However, as long as it is within an allowable time, and as will be described later, it only takes a long time until the curing part 37 contacts the pressing part. If the temperature rise is completed during the movement up to 36, no loss time will occur. Therefore, it is preferable to set the standby temperature to a standby temperature that can reach the curing temperature in a stable state during the movement time until contact.

Under the control of the resin supply control unit 82 , the nozzle 32 a of the resin supply unit 32 supplies the curable resin R to the surface of the workpiece 1 on which the light-emitting element 13 is provided (step S01 ). The supply of the curable resin R to the workpiece 1 is, for example, point-like or linear supply to one location or a plurality of locations. Thereby, when pushed by the pressing part 36, the protective film 2 can be formed in the protective film formation area which is a predetermined area. In addition, the curable resin R is supplied to the inner side than the outer peripheral portion of the workpiece 1 . After the curable resin R is supplied, under the control of the inverting unit control unit 81 , the inverting unit 31 inverts the workpiece 1 180° through the arm 311 so that the surface to which the curable resin R is supplied faces downward, and moves the workpiece 1 through the XYZ moving mechanism. 312 to move the workpiece 1 above the substrate holding part 33 . In addition, the arm 311 may be moved in advance by the XYZ moving mechanism 312 until the flipping position is above the substrate holding part 33 , and the flipping part 31 moves the arm 311 at this position.

Next, with the workpiece 1 positioned above the substrate holding part 33 , as shown in FIG. 6(A) , the arm 311 is lowered so that the workpiece 1 comes into contact with the substrate of the step portion 331 in the opening of the substrate holding part 33 Holding surface 331 a and releasing the suction of workpiece 1 , the workpiece 1 is delivered to substrate holding part 33 (step S02 ). The workpiece 1 is held by the substrate holding portion 33 with the surface to which the curable resin R is supplied facing downward and its outer peripheral portion in contact with the substrate holding surface 331 a of the step portion 331 . Furthermore, the curable resin R faces the surface of the anti-adhesion tape T held by the support part 34 through the opening of the substrate holding part 33 . Since the curable resin R is supplied to the inside of the outer peripheral portion of the workpiece 1 , it does not adhere to the substrate holding surface 331 a and faces the anti-adhesion tape T described below through the opening of the substrate holding portion 33 . In addition, after delivering the workpiece 1 , the turning unit 31 retracts the arm 311 from above the substrate holding unit 33 by the XYZ moving mechanism 312 .

Next, as shown by the dotted arrow in FIG. 6(B) , the tape adsorption control unit 83 controls the air pressure circuit (not shown), thereby adsorbing and holding the anti-adhesion tape T on the holding member 342 (step S03 ). Next, as shown in FIG. 6(C) , the pressing control part 85 lowers the pressing part 36 from above the substrate holding part 33 so that the flat pressing surface of the pressing part 36 presses the part of the workpiece 1 to which the curable resin is not supplied. The side of R. The pressed workpiece 1 presses the contacting substrate holding surface 331 a, and thus the substrate holding portion 33 also descends together with the workpiece 1 . The pressing part 36 continues to press the workpiece 1 together with the substrate holding part 33 to sandwich the workpiece 1 between the workpiece 1 and the holding member 342 of the supporting part 34 (step S04 ). At this time, the curable resin R supplied to the workpiece 1 is pressed against the surface of the anti-adhesion tape T held by the holding member 342 and extends in the XY direction between the workpiece 1 and the anti-adhesion tape T. Furthermore, the spring portion 332a of the leg portion 332 contracts, and the contact portion 333 of the substrate holding portion 33 comes into contact with the anti-adhesion tape T held by the holding member 342 of the support portion 34, so that the curable resin is supplied to the workpiece 1 A predetermined distance is maintained between one surface of R and the surface of the anti-adhesion tape T. That is, the curable resin R extends over the distance.

Furthermore, the curing part 37 is controlled by the curing control part 86 to raise the temperature to 170° C. at which the curable resin R of the present embodiment is thermally cured. Furthermore, the curing part 37 is controlled by the curing control part 86 so as to descend toward the pressing part 36 and come into contact with the pressing part 36 as shown in (D) of FIG. 6 . The temperature of the cured portion 37 is controlled so as to reach a stable curing temperature of the curable resin R until the contact. The heat of the cured part 37 is conducted to the curable resin R via the pressing part 36 , the support substrate 11 of the workpiece 1 , and the flexible substrate 12 . As a result, the curing of the curable resin R spread on the workpiece 1 is completed, and the protective film 2 is formed (step S05 ).

After the protective film 2 is formed, the curing part 37 is raised by the curing control part 86 . Subsequently, the pressing part 36 is raised by the pressing control part 85, and the adsorption and holding|maintenance of the adhesion prevention tape T by the holding member 342 is released by the tape adsorption control part 83 (step S06). As the pressing part 36 rises, the substrate holding part 33 pressed by the pressing part 36 together with the workpiece 1 rises due to the biasing force of the spring part 332a. Furthermore, the step portion 331 of the substrate holding portion 33 pushes the workpiece 1 upward. At this time, since the anti-adhesion tape T is in close contact with the protective film 2 formed on the workpiece 1, the anti-adhesion tape T is also pulled upward. This is because the anti-adhesive tape T is pressed against the protective film 2 by atmospheric pressure and therefore adheres to the protective film 2 .

On the other hand, tension is applied to the anti-adhesion tape T by the tension mechanism of the supply reel 351, and since tape support portions TS are provided on both sides of the support portion 34, the anti-adhesion tape T is pulled up along with the workpiece 1. phenomenon is suppressed. Therefore, as shown in FIG. 13 , the anti-adhesion tape T is exerted an upward pulling force with the tape supporting portion TS as a fulcrum, but the tension applied to itself and the tape supporting portion TS resists the force. Therefore, as the workpiece 1 rises, the protective film 2 adhered to the anti-adhesion tape T is peeled off from its edge. Finally, as shown in (E) of FIG. 6 , the protective film 2 is completely peeled off from the anti-adhesion tape T (step S07 ). After the protective film 2 is peeled off, the recovery reel 352 is rotationally driven to wind the anti-adhesion tape T with a length corresponding to the holding member 342 and supplies a new anti-adhesion tape T to the holding member 342 (step S08 ).

Finally, as shown in FIG. 6(F) , under the control of the flipping unit control unit 81 , the XYZ moving mechanism 312 moves the arm 311 of the flipping unit 31 above the substrate holding unit 33 , and holds the protective substrate 11 from the supporting substrate 11 side. Workpiece 1 of film 2 (step S09). Next, the inverting part 31 picks up the workpiece 1 from the substrate holding part 33 using the XYZ moving mechanism 312, retracts it from above, and inverts the arm 311 (step S10). Thus, the workpiece 1 on which the protective film 2 is formed can be obtained. In addition, subsequently, the workpiece 1 on which the protective film 2 is formed is carried out from the protective film forming device 3 by a conveying member (not shown).

[Effect] The effects of the first embodiment having the above-described structure are as follows. (1) The protective film forming apparatus 3 of this embodiment includes a resin supply part 32 that supplies liquid curable resin R to the surface of the substrate on which the component is mounted, and a substrate holding part 33 that holds the supplied curable resin R. the substrate; the supporting portion 34 is provided facing the substrate holding portion 33; the tape supply portion 35 supplies the anti-adhesion tape T between the substrate holding portion 33 and the supporting portion 34; the pressing portion 36 presses the substrate toward the supporting portion 34, and the The curable resin R supplied to the substrate is pressed against the anti-adhesion tape T to spread the curable resin R on the substrate; the curing part 37 cures the curable resin R spread on the substrate; and the contact part 333 passes through The pressing part 36 presses the substrate, and when the substrate holding part 33 and the supporting part 34 come into contact, a predetermined gap is formed between the surface of the substrate to which the curable resin R is supplied and the surface of the anti-adhesion tape T.

This makes it possible to form a protective film with a flat surface without placing a burden on the element. That is, since the liquid curable resin R is pressed against the component mounted on the workpiece 1, the pressure applied to the component is relatively low, thereby reducing the possibility of damaging the component. Furthermore, the possibility of positional deviation or lateral rotation of components can be reduced. Furthermore, since the curable resin R serving as the sealing member can be easily filled into the gap between the elements, the possibility of insufficient sealing can be reduced. Furthermore, the liquid curable resin R is pressed against the holding member 342 of the flat support portion 34 and solidified. Therefore, it is possible to form the protective film 2 with a flat surface without being affected by the unevenness of the component mounted on the workpiece 1 .

(2) The contact portion 333 located at a predetermined distance (a height separated by a predetermined distance L) from the height of the substrate holding surface 331 a is in contact with the support portion 34 , so that the height of the substrate holding surface 331 a can be used as a reference. Ensure a gap for curable resin R to spread. That is, a gap for the curable resin R to spread can be ensured between the surface of the workpiece 1 on which the components are mounted and the surface of the anti-adhesion tape T based on the height of the surface of the workpiece 1 on which the components are mounted. This allows the film thickness of the protective film 2 to be maintained constant without being affected by variations in the thickness of the workpiece 1 (thickness of the support substrate 11 + thickness of the flexible substrate 12 ). In addition, a predetermined gap that is the thickness of the protective film 2 is formed from the height of the substrate holding surface 331 a to the height of the contact portion 333 . That is, the predetermined gap which is the thickness of the protective film 2 is determined according to the shape of the substrate holding portion 33 . Therefore, for example, unlike the case where the distance between the gaps, which is the thickness of the protective film 2, is adjusted by the degree of pressing, there is no need to precisely control the pressing force, and therefore the control is easy. Furthermore, the curable resin R can be spread and filled into gaps at predetermined intervals and then cured. Therefore, compared with the case where the curable resin R is applied and cured in an open state, the protective film 2 can be formed in the area where the protective film 2 should be formed. Formation of protective film without film thickness deviation is carried out.

(3) In the present embodiment, the anti-adhesion tape T is interposed between the support portion 34 and the workpiece 1 , so that the curable resin R can be prevented from directly adhering to the support portion 34 . This can prevent a part of the protective film 2 from remaining on the support portion 34 when the protective film 2 is peeled off, thereby preventing the protective film 2 from forming an obstacle next time. Furthermore, even if there are slight irregularities on the surface of the holding member 342 of the support portion 34, they will be absorbed by the anti-adhesion tape T, thereby preventing the surface of the curable resin R from being affected. That is, even if foreign matter adheres to the surface of the holding member 342, the anti-adhesion tape T can absorb the unevenness caused by the foreign matter, thereby suppressing the unevenness from being transferred to the surface of the protective film. Furthermore, since there is no need to make the surface roughness of the holding member 342 extremely small, the holding member 342 can be prepared at low cost. Even when an opening for sucking and holding the anti-adhesion tape T of the holding member 342 is provided, it is possible to prevent the opening from being transferred. This is also the case in suppressing the influence of fine openings produced on the surface when the holding member 342 is made of a porous member.

(4) The substrate holding portion 33 holds the substrate such that the surface of the substrate to which the curable resin R is supplied faces downward. Thereby, the liquid curable resin R supplied to the workpiece 1 extends downward by gravity. In the initial stage of pressing, the area in contact with the anti-adhesion tape T becomes smaller and is pushed so as to gradually become a predetermined distance. and expands, therefore the possibility of air bubbles being mixed in when the curable resin R is expanded on the workpiece 1 can be reduced. Furthermore, in order to prevent such air bubbles from being mixed in, it is also considered to expand the curable resin R in a depressurized space, but this is not necessary, and large-scale equipment such as a vacuum chamber or a ventable mold cavity is not required. Can restrain the corresponding cost increase. In addition, when the workpiece 1 of this embodiment is pressed, the surroundings are not sealed by being surrounded by members, but are pressed from above in a state of being open to the atmosphere. Thereby, the gas existing between the workpiece 1 and the anti-adhesive tape T is easily extruded outward as the curable resin R expands, thereby reducing the possibility of air bubbles being trapped when the curable resin R expands.

(5) The resin supply part 32 supplies the curable resin R to the substrate from above the substrate, and the protective film forming apparatus further includes an inverting part 31 that inverts the substrate to which the curable resin R is supplied, so that the The substrate is delivered to the substrate holding part 33 with the surface of the substrate supplied with the curable resin R facing downward. Thereby, the curable resin R can be supplied from above, and therefore the supply amount can be adjusted more easily than when it is supplied from below. For example, when supplying from below, the curable resin R may be pulled toward the nozzle 32a side of the resin supply unit 32 by gravity depending on the viscosity of the curable resin R, resulting in an unexpected decrease in the supply amount.

(6) The support portion 34 further includes a holding member 342 that adsorbs and holds the anti-adhesion tape T to which tension is applied. As a result, the entire anti-adhesive tape T is adsorbed and held in a wrinkle-free state. Therefore, even when the curable resin R is pushed or the anti-adhesion tape T shrinks during curing, the formation of the anti-adhesion tape T can be reduced. Wrinkle condition. Therefore, it is possible to reduce the occurrence of the wrinkles being transferred to the protective film 2 .

(7) The holding member 342 is made of air-permeable porous material. Therefore, the openings on the surface used for suction are small, and the surface irregularities formed by the openings are less likely to be transferred to the protective film 2 via the anti-adhesion tape T. Furthermore, the entire surface of the holding member 342 can be used to adsorb and hold the anti-adhesion tape T uniformly, so that the wrinkle-free state can be further maintained.

(8) The curable resin R is a thermosetting resin, and the curing part 37 is a heater. Accordingly, by adjusting the temperature at which the curable resin R is heated, the cured state can be easily adjusted.

(9) The pressing part 36 and the curing part 37 are provided separately, so that the curable resin R can be stretched and cured separately. Thereby, after the liquid curable resin R is pressed against the support portion 34 by the pressing portion 36 and sufficiently spread on the substrate, the curable resin R can be cured by the curing portion 37 . Furthermore, when the curing part 37 heats the curable resin R which is a thermosetting resin, the heating temperature of the curing part 37 may be set in advance to a temperature at which the curable resin R is cured or a temperature in the vicinity thereof. This can reduce the possibility that the curable resin R cannot be sufficiently stretched on the workpiece 1 or that the curable resin R may protrude compared to the case where curing and expansion are performed simultaneously at the temperature at which the curable resin R is cured.

(10) When the curable resin R is heated and pressed at the curing temperature, the curable resin R expands while curing, and the curable resin R whose viscosity increases as curing progresses cannot sufficiently protect the workpiece 1. The area is the protective film formation area. Furthermore, conversely, since the viscosity is low before curing proceeds, the curable resin R may protrude beyond the protective film formation region of the workpiece 1 . In contrast, the protective film forming device 3 of this embodiment performs pressing for stretching and heating for curing separately. Therefore, the curable resin R is not heated during expansion and the viscosity of the curable resin R can be avoided from changing. Therefore, the curable resin R can fully reach the protective film forming area of the workpiece 1 and can suppress protrusion.

(11) For example, it is also considered that a heater is provided in the pressing part 36, and in order to promote the expansion of the curable resin R, heating is not performed while the curable resin R is expanding, and heating is started after the expansion is completed. However, in this case, time is required until the pressing portion 36 reaches a heating temperature sufficient for curing. In this regard, the protective film forming device 3 of the present embodiment can set the heating temperature of the curing part 37 in advance to a temperature at which the curable resin R is cured or a temperature near it at a position spaced apart from the position where the workpiece 1 is pressed. Curable resin R can be cured quickly.

(12) A plurality of heaters provided in the curing part 37 may be provided. Heaters include electric heating wires or halogen lamps, but halogen lamps with high responsiveness are preferred. At this time, as shown in FIGS. 10(A) to 10(D) , it is preferable to arrange the heaters concentrically in a matrix shape (matrix, sawtooth) or frame shape. FIG. 10(A) shows a case where heaters are arranged in a matrix. The upper row of FIG. 10(A) shows a horizontal cross-section of the cured portion 37, and the lower row shows a vertical cross-section of the solidified portion 37. Furthermore, a plurality of heaters are represented by 411 , and each heater 411 is held on the base 401 and covered by a contact plate 402 in contact with the pressing part 36 or the workpiece 1 . (B) of FIG. 10 shows a case where a plurality of heaters are arranged in a zigzag pattern. (C) of FIG. 10 shows a case where a plurality of frame-shaped heaters are arranged concentrically, and (D) of FIG. 10 shows a case where a plurality of heaters are arranged concentrically. When multiple heaters are provided, each heater can be heated individually or in groups as needed. For example, when the curable resin R is expanded, the expansion speed or expansion is controlled so as to be locally heated so that a portion with a higher viscosity is mixed with a portion with an original viscosity. At this time, after a predetermined time has elapsed, heating based on a different amount of heat from the previous heating may be performed to increase the viscosity of the previously unheated portion with a time difference. For example, all the plurality of heaters may be heated to increase the viscosity of the curable resin R gradually extending to the entire protective film formation region to be sealed. Furthermore, at this time, the heating intensity (energy amount (heat × time)) can also be changed locally. For example, when the curable resin R reaches the outer edge of the protective film formation area of the workpiece 1 or just before it reaches it, only the outer edge of the protective film formation area is heated or the heating intensity is increased (increase the amount of energy (heat × time)). , to prevent protrusion.

FIGS. 11(A) to 11(C) illustrate an example of controlling the curing part 37 having the structure of FIG. 10(A) . In FIGS. 11(A) to 11(C) , the upper section shows a vertical cross section, and the lower section shows a horizontal section. In this figure, the curing part 37 presses the workpiece 1 schematically. (A) of FIG. 11 shows a state in which curable resin R is pushed and expansion is started. Soon, the distance between the workpiece 1 and the anti-adhesion tape T becomes a predetermined distance, and the operation of the curing part 37 to push the curable resin R stops. In the space formed in this state, the curable resin R continues to spread. Furthermore, (B) of FIG. 11 shows a state in which the curable resin R is extended and its outer edge reaches the outer edge of the workpiece 1 (the outer edge of the protective film formation region). (C) of FIG. 11 shows a case where the entire surface of the stretched curable resin R is cured.

For example, as shown in FIGS. 11(A) to 11(C) , in order to stop the extension just at the outer edge of the protective film formation area, when the curable resin R reaches the outer edge of the protective film formation area, or when it is cured When the flexible resin R reaches the vicinity of the outer edge of the protective film formation area, the heater at the outer peripheral portion is turned on or controlled so as to increase the temperature, thereby accelerating the curing of the outer peripheral portion of the resin. That is, by increasing the viscosity of the curable resin R, the curing speed is accelerated and the extension is stopped. Therefore, this temperature is above the curing start temperature. Once the extension of the resin in the protective film formation area is completed, all the heaters are turned on or the temperature is raised to solidify the curable resin R as a whole. In addition, in FIGS. 11(A) to 11(C) , 412 indicates an OFF heater, and 413 indicates an ON heater. This state is also the same when the heater described below is replaced by an ultraviolet (UV) light source (light irradiation part). The timing of heating can be detected by using an image sensor, a laser sensor, etc., or can be determined in advance through experiments or the like. By controlling a plurality of heaters in this manner, protrusion can be further suppressed without hindering the discharge of voids.

(13) In the path where the anti-adhesion tape T sent out from the supply reel 351 is wound to the recovery reel 352 , tape support portions TS are provided above the anti-adhesion tape T on both sides of the support portion 34 in the X direction. . Thereby, the anti-adhesive tape T in close contact with the protective film 2 formed on the workpiece 1 can be easily peeled off from the protective film 2 . This is because the anti-adhesion tape T is pressed by the tape support portion TS, so that the anti-adhesion tape T can be peeled off from the outer peripheral side of the protective film 2 .

(B) Second embodiment Hereinafter, a second embodiment of the present invention will be described. In the first embodiment, the curable resin R is a thermosetting resin that is cured by heat, but in the second embodiment, the curable resin R is a photocurable resin that is cured by light. Correspondingly, the curing unit 37 is not a heater but a light irradiation device. For example, the photocurable resin may be an ultraviolet curable resin, and the light may be ultraviolet light. At this time, the light irradiation device is an ultraviolet light source. As the ultraviolet light source, LEDs or lamps capable of irradiating ultraviolet light can be used. Photocurable resin starts to cure when it receives light of a wavelength for resin curing. The curing of photocurable resin proceeds gradually. That is, the viscosity of the photocurable resin changes. Furthermore, the advancement speed of curing changes depending on the intensity and time of the irradiated light. The curing control unit 86 controls the intensity or irradiation time of the light irradiated by the curing unit 37, and changes the energy amount of the irradiated light by changing the intensity or irradiation time when the curable resin R expands, so as to achieve the desired curing effect. The flexible resin R expands to the optimal viscosity in the protective film formation area.

More specifically, when the viscosity of the curable resin R is suitable for expansion in the initial state, light irradiation is started after the curable resin R has expanded to the entire protective film formation area as a predetermined area, so that the curable resin Curing. When the viscosity of the curable resin R is small and is not suitable for expansion in the initial state, irradiation with weak intensity light, light irradiation for a short period of time, or light irradiation from a distance is performed in the state where the expansion is started. The irradiation advances the curing of the curable resin R and adjusts the viscosity to a desired viscosity. At this time, let the energy amount of the light irradiated to the curable resin R be the first energy amount. And once the curable resin R reaches the outer edge of the protective film formation area or its vicinity, light irradiation with a necessary intensity and time is performed to further cure the curable resin R. Once the curable resin R has spread over the protective film formation area and has finished spreading, light irradiation with an intensity and a time sufficient to completely cure the curable resin R is performed to complete the curing of the curable resin R. The energy amount of the light irradiated when the curable resin R is completely cured is defined as the second energy amount. The second amount of energy is greater than the first amount of energy. This can shorten the extension time, suppress protrusion from the protective film formation area, or shorten the curing time.

In addition, the irradiation of light from the curing part 37 is performed on the curable resin R via the pressing part 36 and the substrate of the workpiece 1 . Therefore, the light paths of the curing part 37 , the pressing part 36 , and the substrate are made of materials that can transmit at least light of a wavelength that cures the photocurable resin R.

In the second embodiment, the curing part 37 and the pressing part 36 may be integrated. At this time, the pressing part 36 is made of a material that can transmit light, such as quartz, so that the ultraviolet lamp serving as the curing part 37 can be incorporated into the pressing part 36 .

If light irradiation is started when the pressing part 36 moves toward the substrate holding part 33 from the remote state, the viscosity of the curable resin R can be adjusted to a viscosity suitable for expansion when starting to press the resin. This can shorten the stretching time or suppress protrusion from the protective film formation area. In this way, the vertically movable curing part 37 can be omitted, and an inexpensive device can be achieved.

In the second embodiment, the curing part 37 may have a plurality of irradiation parts such as UV light sources that irradiate light. At this time, like the heater of the first embodiment, it is preferable that the irradiation part is in a matrix shape (matrix, zigzag) or frame shape as shown at 411 in FIGS. 10(A) to 10(D) . set concentrically. When a plurality of irradiation units are provided, each irradiation unit can be irradiated individually or in groups as necessary. For example, when the curable resin R is expanded, the expansion speed or expansion is controlled so that the irradiation is performed locally so that the portion with increased viscosity is mixed with the portion with the original viscosity. At this time, after a predetermined time has elapsed, irradiation with an irradiation part different from the previous irradiation may be performed to increase the viscosity of the portion that was not previously irradiated with light with a time difference. For example, all of the plurality of irradiation parts may be irradiated to increase the viscosity of the curable resin R gradually extending to the entire protective film formation region to be sealed. Furthermore, at this time, the irradiation intensity can also be changed locally. For example, when the curable resin R extends and reaches the outer edge of the protective film formation area of the workpiece 1 or just before it reaches, only the outer edge of the protective film formation area is irradiated or the irradiation intensity is increased (increase the energy amount (illuminance × time) ) to prevent protrusion. Such irradiation can be controlled in the same manner as in the heater of the first embodiment (see (A) to (C) of FIG. 11 ). The timing of irradiation can be determined by detecting the resin using an image sensor, a laser sensor, or the like, or can be determined in advance through experiments or the like. By controlling the plurality of irradiation units in this manner, protrusion can be suppressed without hindering the discharge of the voids. In addition, the light intensity or the irradiation range can also be controlled by providing a light guide lens in the irradiation part of a UV light source or the like, or by providing a cylindrical reflection plate on the light source.

(C) Other implementations The present invention is not limited to the above-described embodiments, and at the implementation stage, the constituent elements may be modified and embodied without departing from the gist of the invention. Furthermore, various inventions can be formed by appropriately combining the plurality of constituent elements disclosed in the embodiments. For example, some structural elements may be deleted from all the structural elements shown in the embodiments. Furthermore, constituent elements spanning different embodiments may be appropriately combined. Specifically, other embodiments described below are also included.

(1) In the above embodiment, the resin supply unit 32 supplies the curable resin R from above the workpiece 1, but the invention is not limited to this. For example, when the curable resin R has a viscosity that does not sag due to gravity, the curable resin R discharged from the nozzle 32a does not sag and adhere to the nozzle 32a, etc., causing the supplied curable resin R to fail. When the amount is reduced, the curable resin R may be supplied from below the workpiece 1 . At this time, the turning portion 31 holds the workpiece 1 so that the surface of the workpiece 1 on which the light-emitting element 13 is mounted faces downward from the beginning. The reversing part 31 can deliver the workpiece 1 to which the curable resin R is supplied to the downward surface to the substrate holding part 33 while maintaining this state. Therefore, it is not necessary to provide a turning mechanism, and the turning part 31 can be simplified. Furthermore, since the workpiece 1 to which the curable resin R is supplied is not turned over, the state of the supplied curable resin R is not affected by centrifugal force. Furthermore, since no time is required for flipping, the takt time can be shortened. Furthermore, since no space for inversion is required, the distance between the substrate holding portion 33 and the pressing portion 36 can be narrowed. Thereby, the device can be miniaturized, the movement time of the pressing part 36 can be shortened, and the takt time can be shortened. Furthermore, the arm 311 of the turning unit 31 performs θ rotation instead of α rotation. This allows the workpiece 1 to be transferred to the substrate holding unit 33 with the surface to which the curable resin R is supplied facing downward. In this case, since horizontal movement for handover can be performed during θ rotation, the movement mechanism can be simplified.

(2) In the above-mentioned embodiment, the holding member 342 is a porous member in which countless holes are randomly arranged. However, the holding member 342 is not limited to this. It suffices as long as it has air permeability that can maintain the anti-adhesion tape T, and the openings for ensuring air permeability only need to have a size and shape that does not exceed the anti-adhesion tape T and affect the curable resin R. For example, the holding member 342 may be a metal plate provided with numerous holes.

(3) In the above-described embodiment, the anti-adhesion tape T is adsorbed and held via the holding member 342. However, the anti-adhesion tape T may not shrink when the curable resin R is pushed or cured. The attached tape T performs adsorption and retention. For example, when the thickness of the anti-adhesion tape is thick and it is difficult to deform or shrink, or when the material of the anti-adhesion tape is difficult to deform or shrink, or when the heating temperature for curing is low and the anti-adhesion tape is difficult to deform or shrink, The anti-adhesion tape T does not need to be adsorbed and held.

(4) In the above embodiment, the leg portion 332 is a member extending from the lower surface of the substrate holding portion 33 and includes the spring portion 332a at the lower end. However, the leg portion 332 is not limited to this. The substrate holding part 33 only needs to be supported at a distance from the supporting part 34 and provided so as to be contactable/separable from the supporting part 34. The spring part 332a may be provided at any part of the substrate holding part 33 except the leg part 332. . Furthermore, the spring portion 332a may be an elastic member such as rubber. Furthermore, it may be an air cylinder that supports the substrate holding part 33 and moves up and down. When the substrate holding part 33 is pressed by the pressing part 36 and moves closer to the supporting part 34, the air pressure is controlled so as not to hinder the movement. The air cylinder replaces the spring part 332a and functions as a driving part for raising the substrate holding part 33 in order to peel off the protective film 2 from the anti-adhesive tape T.

(5) In the above embodiment, the contact portion 333 on the lower surface of the substrate holding portion 33 comes into contact with the anti-adhesion tape T that is stretched and held on the holding member 342 to form a required gap. However, as shown in FIG. 9 , an upright leg 343 may be provided on the upper surface 341 a of the base 341 so that the upper part of the leg 343 abuts against the leg 332 of the substrate holding part 33 pressed by the pressing part 36 , thereby ensuring the same prescribed clearance as in the above embodiment. Furthermore, the foot portion 332 may be replaced by the contact portion 333 . In this way, the substrate holding part 33 comes into contact with the supporting part 34, and the descent of the substrate holding part 33 is prevented. The distance between the workpiece 1 and the anti-adhesion tape T is set to the height of the protective film 2 by the uprightly provided leg portion 343 and the substrate holding portion 33 in contact with the leg portion 343 . Therefore, the portion where the substrate holding portion 33 and the support portion 34 come into contact is included in the contact portion. That is, in the above-mentioned embodiment, the combination of the leg part 332 and the leg part 343 erected on the base 341, or the combination of the contact part 333 and the leg part 343 erected on the base 341 is considered as a contact part. Therefore, when the leg portion 332 or the contact portion 333 that is a part of the substrate holding portion 33 comes into contact with the leg portion 343 that is a portion of the support portion 34 , a predetermined gap is formed by the combined contact portions. At this time, the thickness of the protective film 2 can be determined based on the position where the legs 343 erected on the base 341 are in contact with the substrate holding portion 33 . That is, it can be determined based on the distance from the base 341 to the substrate holding portion 33 in contact with the upright leg portion 343. Therefore, the thickness of the protective film 2 should be set to the required thickness. Alternatively, the thickness of the protective film 2 can be easily changed by simply replacing the legs 343 erected on the base 341 .

(6) In the above-described embodiment, the element mounted on the flexible substrate 12 of the workpiece 1 is the light-emitting element 13. However, it is not limited to this and may be any element. For example, electronic components such as arithmetic elements, storage elements, imaging elements, resistors, and capacitors may be used. The module may be a combination of these elements. Furthermore, the support substrate 11 and the flexible substrate 12 may be integrated into one substrate.

(7) In the above-described embodiment, the pressing portion 36 may include an adsorption hole connected to a pneumatic circuit (not shown) in the center portion of the surface that is in contact with the workpiece 1 . The negative pressure generated by the pneumatic circuit causes the workpiece 1 to be adsorbed to the flat surface of the pressing portion 36 , thereby suppressing thermal deformation of the workpiece 1 due to heating. Regardless of the material of the workpiece 1, thermal deformation will occur when heated. This phenomenon becomes significant especially when the thickness of the workpiece 1 is thin. For example, even if the outer peripheral portion of the workpiece 1 is clamped, thermal deformation is still likely to occur when the central portion is free without any support. On the other hand, in the above embodiment, deformation can be suppressed by sucking and holding the central portion of the workpiece 1 using the pressing portion 36 .

(8) In the above-mentioned embodiment, the curing part 37 is provided so as to be movable independently from the pressing part 36 . At this time, the curing control part 86 may control the curing part 37 to the curing temperature of the thermosetting curable resin R in advance, and in a state where the pressing part 36 presses the workpiece 1, the curing part 37 may As the workpiece 1 is gradually approached to the pressing portion 36 , the temperature at which the workpiece 1 is heated gradually changes. That is, the solidified portion 37 can be gradually brought closer to the workpiece 1 and the workpiece 1 can be gradually heated. Furthermore, by intermittently performing the moving operation of bringing the curing part 37 closer to the pressing part 36, the workpiece 1 can be heated in steps. This case also includes the case where the workpiece 1 is gradually heated. Furthermore, it is also applicable when the curable resin R is photocured. Thereby, the fluidity of the curable resin R during expansion can be easily controlled, and when the curable resin R is to protrude outside the protective film formation region, the curable resin R can be cured to further suppress the protrusion. Furthermore, since expansion and curing can be performed at the same time, the time until the curable resin R is completely cured can be shortened.

(9) In the above embodiment, the pressing portion 36 has a flat surface that presses the entire workpiece 1 . However, the shape of the pressing part 36 is not limited to this, as long as it can press the workpiece 1 and clamp it with the substrate holding part 33 . For example, as shown in FIGS. 12(A) to 12(D) , the pressing part 36 may be a pair of fence-shaped or square frame-shaped members that press the outer peripheral part of the workpiece 1 , and may be used as a curing part. 37 can be raised and lowered by sliding in the opening inside the pressing part 36 . At this time, the curing part 37 may directly apply heat or light for curing to the workpiece 1 without passing through the pressing part 36 . As a result, curing can be performed more efficiently. Therefore, the time until the curable resin R is completely cured can be shortened. Furthermore, the fluidity of the curable resin R during expansion can be controlled more accurately, so that when the curable resin R is to protrude outside the protective film formation area, the curable resin R can be cured to further suppress the protrusion. Furthermore, when light is used for curing as described in the second embodiment, it is not necessary to use the pressing part 36 as a translucent member.

(10) In the above embodiment, the workpiece 1 held by the substrate holding portion 33 is pressed by the pressing portion 36 provided above with respect to the supporting portion 34 provided below. However, the invention is not limited to this. For example, the workpiece 1 held by the substrate holding part 33 may be pressed by the pressing part 36 provided below with respect to the support part 34 provided above. At this time, the support portion 34 does not directly press the workpiece 1 but only needs to press the substrate holding portion 33 from below. Furthermore, the workpiece 1 held by the substrate holding part 33 may be pressed by the pressing part 36 provided on the side with respect to the supporting part 34 provided on the side.

(11) New embodiments can also be created by appropriately combining a plurality of constituent elements disclosed in the first embodiment, the second embodiment, and other embodiments. For example, the embodiment in which the curing part 37 and the pressing part 36 in the second embodiment are integrated may be applied to the first embodiment. Furthermore, the operation of starting the light irradiation when the pressing part 36 is moved toward the substrate holding part 33 from the state of being far away from the curing part 37 may be replaced with heating. All of them can achieve the same effect as the second embodiment.

1: workpiece 2: Protective film 3: Protective film forming device 8:Control device 11:Support substrate 12:Flexible substrate 13:Light-emitting components 31: Turning part 32: Resin supply department 32a:Nozzle 33:Substrate holding part 34:Support part 35: With supply department 36: Compression part 37: Curing Department 81: Turning part control part 82: Resin supply control department 83:With adsorption control part 84:With supply quantity control department 85: Press control part 86:Cure Control Department 87:Storage Department 88: Setting Department 89:Input/output control department 91:Input device 92:Output device 311: arm 311a: Driving mechanism 312:XYZ moving mechanism 331:Step department 331a:Substrate retaining surface 332:Feet 332a: Spring part 333:Butt part 341:Abutment 341a: upper surface of abutment 341 342:Keep components 342a: upper surface of holding member 342 343:Feet 351:Supply reel 352:Recycling reel 401:Base 402:Contact board 411: Heater or UV light source 412: Heater or UV light source is off 413: Heater or UV light source is on L: specified distance R: curable resin S01～S10: steps T: Anti-adhesion tape TS: with support department

1(A) and 1(B) are side views showing the workpiece according to the first embodiment. FIG. 2 is a side view showing the protective film forming apparatus according to the first embodiment. 3 is a front view showing the curing section and its surroundings of the protective film forming apparatus according to the first embodiment. FIG. 4 is a perspective view showing the substrate holding portion of the first embodiment. FIG. 5 is a three-dimensional view showing the substrate holding portion of the first embodiment. 6(A) to 6(F) are diagrams showing the protective film formation flow of the first embodiment. FIG. 7 is a block diagram showing the control device according to the first embodiment. FIG. 8 is a flowchart showing the protective film formation flow of the first embodiment. Fig. 9 is a front view showing a contact portion according to another embodiment. 10(A) to 10(D) are plan views, side views and arrangement examples showing the heater or the irradiation part of the curing part in each embodiment. 11(A) to 11(C) are diagrams illustrating a method of controlling the heater or the irradiation unit during pressing according to each embodiment. 12(A) to 12(D) are diagrams showing a protective film formation flow according to another embodiment. Fig. 13 is a front view of the guard forming device showing the peeling operation of the anti-adhesion tape in each embodiment.

1: workpiece

2: Protective film

33:Substrate holding part

34:Support part

36: Compression part

37: Curing Department

311: arm

331a:Substrate retaining surface

332:Feet

332a: Spring part

333:Butt part

341:Abutment

341a: upper surface of abutment 341

342:Keep components

342a: upper surface of holding member 342

L: specified distance

R: curable resin

T: Anti-adhesion tape

Claims (14)

A protective film forming device including: The resin supply part supplies liquid curable resin to the surface of the substrate on which the component is mounted; a substrate holding portion that holds the substrate to which the curable resin is supplied; A support portion is provided opposite to the substrate holding portion; a tape supply part that supplies an anti-adhesion tape between the substrate holding part and the support part; A pressing part presses the substrate held by the substrate holding part toward the supporting part, presses the curable resin supplied to the substrate against the anti-adhesion tape, and causes the curable resin to Extend on the substrate; a curing part that cures the curable resin spread on the substrate; and The contact portion presses the substrate by the pressing portion. When the substrate holding portion contacts the support portion, the surface of the substrate to which the curable resin is supplied contacts the anti-adhesive portion. A prescribed gap is formed between the surfaces of the belt. The protective film forming device according to claim 1, wherein The curing part can advance toward the pressing part and can retreat from the pressing part. The protective film forming device according to claim 1, wherein The substrate holding portion holds the substrate with a surface of the substrate supplied with the curable resin facing downward, and has an opening for exposing a region where the curable resin extends on the substrate. . The protective film forming device according to claim 1, wherein The resin supply part supplies the curable resin to the substrate from above the substrate, The protective film forming apparatus further includes an inverting unit that inverts the substrate to which the curable resin is supplied so that the surface of the substrate to which the curable resin is supplied faces downward, and the The substrate is delivered to the substrate holding unit. The protective film forming device according to claim 1, wherein The substrate holding part is supported by an elastic member or a cylinder. The protective film forming device according to claim 1, wherein The support portion further includes a holding member holding the anti-adhesive tape. The protective film forming device according to claim 6, wherein The holding member is air-permeable and porous. The protective film forming device according to claim 1, wherein In the tape supply section, a supply reel and a recovery reel are arranged at a position sandwiching the substrate holding section, In a path in which the anti-adhesion tape sent out from the supply reel is wound to the recovery reel, tape support portions are provided on both sides of the support portion, The anti-adhesion tape is supported by the tape support part at a height at which it is fed out so as to slightly contact or create a gap with the support part. The protective film forming device according to claim 1, wherein The pressing part includes a fence-shaped or frame-shaped member that presses the outer peripheral portion of the substrate, and the curing part moves up and down in an opening inside the pressing part. The protective film forming device according to claim 2, wherein The curable resin is gradually cured by moving the curing part closer to the pressing part. The protective film forming device according to claim 1, wherein The curable resin is a thermosetting resin, The solidification part is a heater. The protective film forming device according to claim 1, wherein The curable resin is a thermosetting resin, The curing section includes a plurality of heaters. The protective film forming device according to claim 1, wherein The curable resin is a photocurable resin, The curing part is a light irradiation device. The protective film forming device according to claim 1, wherein The curable resin is a photocurable resin, The curing part includes a plurality of light irradiation devices.