TWI814239B - Relay board assembly for detecting image module and detection system thereof - Google Patents

Abstract

The present invention discloses a relay board assembly for detecting an image module and a detection system thereof. The relay board assembly includes an image capture card and an image test signal generating card. The image capture card includes an image signal receiver and a first switch module. The image test signal generation card includes a second and third switch module and a standard image signal processor. Through the control of the transmission path by the first to third switch modules controlled by ATE, the switch between ATE electrical test and high-speed image test is achieved, and can provide a preset image data built in the standard image signal processor as the high-speed test signal to an image signal processor under test. ATE that does not have the ability to provide high-speed image signals can also be used to perform high-speed image tests, and test costs can be reduced.

Description

Relay carrier board assembly for detecting imaging modules and its detection system

The present invention relates to a detection component of an image module, and more particularly to a relay carrier board component for detecting an image module and a detection system thereof.

The image module may include an image sensor (Image Sensor), an image signal processor (Image Signal Processor, ISP), or either of the two. The image sensor is used to capture images of the environment, and provides the captured original image data to the image signal processor, which allows the image signal processor to analyze, correct, and process the original image data (for example, white Balance adjustment, exposure correction, sharpening, color conversion, noise reduction and encoding, etc.) to generate image data with excellent image quality. As the amount of image data captured by image sensors becomes increasingly large, the processing capabilities of image signal processors become even more important.

During the mass production process of imaging modules, various test items are performed on the imaging modules through Automatic Test Equipment (ATE). In addition to electrical testing of each pin of the image sensor, automated testing equipment is also used to provide a light source to the image sensor to test the sensing capability of the image sensor.

Among them, automated test equipment must also test the image signal processor. In addition, due to the huge amount of image data, the data transmission interface input from the image sensor to the image signal processor must use a high-speed transmission interface, such as: mobile industry processor Interface (Mobile Industry Processor Interface, MIPI), its transmission speed can reach more than 2.5Gsps. In order to send the test signal to the input end of the image signal processor, it must be carried out at a matching transmission speed, which requires the signal output capability of the automated test equipment to be improved. However, the cost of automated test equipment with signal transmission speeds above 1Gsps is already quite expensive, let alone above 2.5Gsps. This makes the cost of testing image signal processors high.

One purpose of the present invention is to reduce the testing cost of an image signal processor.

In order to achieve the above objects and other objects, the present invention proposes a relay carrier board assembly for detecting image modules, which is loaded on a detection interface and controlled by an automated test equipment to provide a standard image signal processor built-in A preset image data is sent to an image signal processor under test in an object under test. The relay carrier board component includes: an image capture card and an image test signal generation card. The image capture card includes an image signal receiver and a first switch module. The first switch module is coupled between the automated test equipment, the image signal receiver and the detection interface. The first switch module The tester module is controlled by the automated test equipment to selectively switch to the first path or the second path. The image test signal generation card is used to carry the standard image signal processor, including a second switch module and a third switch module coupled between the automated test equipment, the detection interface and the standard image signal processor. The second switch module is controlled by the automated test equipment to selectively switch to the first path or the third path. Wherein, the first path is used to connect each switch module and the automated test equipment, and the third path The two paths are used to connect the first switch module and the image signal receiver, the third path is used to connect the second switch module and the standard image signal processor, and the image test signal generating card is The preset image data is provided to an input end of the image signal processor under test through the third path, and the first switch module and the second switch module are coupled to the detection interface.

In one embodiment of the present invention, the third switch module is coupled between the automated test equipment and the standard image signal processor and is floating with the detection interface. The third switch module is used for Controlled by the automated test equipment to switch to simultaneously conduct the first path and the third path, so that the automated test equipment controls the standard image signal processor to cause the standard image signal processor to output the preset image data .

In one embodiment of the present invention, when the automated testing equipment performs an electrical test on the input end of the image signal processor under test, the second switch module can be controlled to switch to the first path. In addition, the third switch module can be controlled to not conduct the first path and the third path at the same time.

In one embodiment of the present invention, the first switch module can be controlled to switch to the second path when the preset image data is provided to an image detection process of the image signal processor to be tested, The image signal receiver is caused to control the image signal processor to be tested and receive an output signal from an output end of the image signal processor to be tested.

In one embodiment of the present invention, when the automated testing equipment performs electrical testing on the output terminal and the plurality of control terminals of the image signal processor under test, the first switch module can be controlled to switch to the First path.

In order to achieve the above objects and other objects, the present invention further proposes an image module detection system, which is used to detect a plurality of objects to be tested, each of which has an image signal processor to be tested. The test system includes: detection interface, test carrier board, automated test equipment and relay array carrier board components. The detection interface is used for electrical connection of the object under test. Automated test equipment is coupled to the test carrier board. The relay array carrier board assembly includes a plurality of the aforementioned relay carrier board components. Each of the relay carrier board components is loaded on the detection interface and coupled to the test carrier board. Each of the relay carrier board components is connected to the test carrier board. One of the objects under test should be waited for to be controlled by the automated test equipment to perform a connection terminal electrical testing process and a high-speed image testing process on the image signal processor under test.

Accordingly, the relay carrier board component used to detect the image module can provide switching between electrical testing (connection end electrical testing process) and high-speed image testing (high-speed image testing process), and can then use standard image signals The processor is used to provide high-speed transmission signals, so that automated test equipment (ATE) without the ability to provide high-speed image signals can also be used to perform high-speed image testing (high-speed image detection procedures), and the cost of image signal processor testing can be reduced. .

110: Detection interface

120: Relay array carrier board assembly

121: First relay carrier board assembly

1211:Image capture card

12112:Image signal receiver

12114:First switch module

1212:Image test signal generation card

12122:Standard image signal processor

12124: Second switch module

12126:Third switch module

122: Second relay carrier board assembly

130: Test carrier board

140: Automated Test Equipment (ATE)

210:Object to be tested

211: Image sensor to be tested (CIS)

212: Image signal processor (ISP) to be tested

300:Host

310: Main computer

320:Image Processing Computer (IPC)

A:Region

L1: first path

L2: Second path

L3: third path

Tx: output terminal

Rx: input terminal

S: pin

V: power input terminal

[Fig. 1] is a schematic diagram of an image module detection system according to an embodiment of the present invention.

[Fig. 2] is a schematic diagram of a relay carrier board assembly for detecting an image module according to an embodiment of the present invention.

[Fig. 3] is a schematic diagram of a relay carrier board assembly under a high-speed image inspection process according to an embodiment of the present invention.

In order to fully understand the purpose, characteristics and effects of the present invention, the present invention is described in detail through the following specific embodiments and the accompanying drawings, as follows: In this document, the term "a" or "an" is used to describe a unit, component, structure, device, module, system, part or region, etc. This is done for convenience of explanation only and to provide a general sense of the scope of the invention. Accordingly, unless it is obvious otherwise, such description shall be understood to include one or at least one, and the singular shall also include the plural.

In this article, the words "including, including, having" or any other similar words described in this article are not limited to the elements listed in this article, but may include elements that are not explicitly listed but are the mentioned elements, Other elements normally inherent in a component, structure, device, module, system, location or area.

In this article, words such as "first" or "second" and similar ordinal numbers are used to distinguish or refer to the same or similar elements, structures, parts or regions, and do not necessarily imply such elements. , the spatial sequence of structures, parts or regions. It should be understood that in certain situations or configurations, ordinal terms may be used interchangeably without affecting the practice of the invention.

Please refer to FIG. 1 , which is a schematic diagram of an image module detection system according to an embodiment of the present invention. The detection system includes a detection interface 110, a relay array carrier board component 120, a test load board (load board) 130 and an automated test equipment (ATE) 140. The detection system provides detection data to the host 300 for subsequent calculation and analysis.

The detection interface 110 may be a Probe Interface Board (PIB) or a socket, but is not limited thereto, and is used to form an electrical connection with the imaging module as the object under test 210 . In addition, the relay array carrier board assembly 120 is mounted on the detection interface 110. The relay array carrier board assembly 120 includes a plurality of boards, which can be installed therein by, for example, plug-in cards.

The host 300 may include a main computer 310 and an image processing computer (IPC) 320. When the detection program of the image module is running, the main computer 310 causes the automated testing equipment (ATE) 140 to perform the testing steps. The automated testing equipment (ATE) 140 Test signals are provided through the test carrier board 130 to perform various testing items. The test carrier board 130 is mainly used as a medium between the relay array carrier board component 120, the object under test 210 and the automated test equipment (ATE) 140, and is responsible for the transmission of power and signals.

In the image module detection system disclosed in the embodiment of the present invention, the object under test 210 can be an image module having an image sensor (CMOS Image Sensor, CIS) and an image signal processor (ISP). The object under test 210 can also be It can be an image module with an image signal processor (ISP) and without an image sensor (CIS). The object under test 210 can also be an image module with an image sensor (CIS) but without an image signal processor (ISP). image module. In order to illustrate the detection of a high-speed image signal processor (ISP), in subsequent embodiments of the present invention, the object under test 210 is an image module having an image sensor (CIS) and an image signal processor (ISP). group as an example.

The image module as the object under test 210 has an image sensor under test (CIS) 211 and an image signal processor (ISP) 212 under test. In the embodiment of the present invention, through switching of the relay array carrier board assembly 120, the automated test equipment (ATE) 140 is established to detect the image sensor (CIS) 211 under test and the image under test in each object under test 210. The signal processor (ISP) 212 performs the detection path for detection. That is, each relay carrier board assembly (the first relay carrier board assembly 121 or the second relay carrier board assembly 122) corresponds to an object under test 210. As shown in Figure 1, the first relay carrier board assembly 121 is used to provide detection path switching for one object 210 to be tested, and the second relay carrier board assembly 122 is used to provide detection path switching for another object 210 to be tested. .

In addition to performing electrical testing procedures (such as detecting open circuits or short circuits) on each connection end (pin) of the object under test 210, the automated test equipment (ATE) 140 can also use an additionally configured light source set. A component (not shown) provides a light source to test the sensing capability of the object under test 210 having the image sensor 211 under test. For tests related to image data (image detection procedures), the image data captured by each test through the relay array carrier board assembly 120 is transmitted to the image processing computer (IPC) 320 for data calculation. and analyze and transmit the results to the host computer 310 to complete the test project. Among them, in an implementation where the object under test 210 has an image sensor (CIS) and does not have an image signal processor (ISP), the automated test equipment (ATE) 140 can use the aforementioned light source component to perform the test on the object under test 210. Testing of sensing capabilities; on the other hand, in an implementation where the object under test 210 has an image signal processor (ISP) and does not have an image sensor (CIS), there is no need to configure an additional light source component.

Next, please refer to Figures 1, 2 and 3 at the same time. Figure 2 is a schematic diagram of a relay carrier board assembly used to detect an image module in one embodiment of the present invention. Figure 3 is a relay carrier board in one embodiment of the present invention. Schematic diagram of components under high-speed imaging inspection program. Each relay carrier board component in the relay array carrier board component 120 may include: an image capture card and an image test signal generation card. For ease of explanation, FIG. 2 illustrates the connection between the first relay carrier board component 121 and the detection interface 110, the automated test equipment (ATE) 140, the image processing computer (IPC) 320 and the image signal processor (ISP) 212 under test. coupling relationship. The automated test equipment (ATE) 140 can provide power to the power input terminal V of the image signal processor (ISP) 212 under test to drive the image signal processor (ISP) 212 under test.

The image capture card 1211 in the first relay carrier board assembly 121 includes an image signal receiver 12112 and a first switch module 12114.

The first switch module 12114 is coupled between three components: the automated test equipment (ATE) 140, the image signal receiver 12112, and the detection interface 110. The first switch module 12114 is used to determine the connection relationship between the three components. The first switch module 12114 is controlled by the automated test equipment (ATE) 140 and is operated to perform path switching according to the control instructions, in order to allow The transmission path is changed to the first path L1 or the second path L2. That is, since the first switch module 12114 is connected to the detection interface 110, the first switch module 12114 can determine whether the detection interface 110 is connected to the image signal receiver 12112 or to the automated test equipment (ATE). 140 connected.

In other words, the first path L1 refers to a path that connects the first switch module 12114 and the automated test equipment (ATE) 140 through the switch in the first switch module 12114, so that the signal can be transmitted in Between automated test equipment (ATE) 140 and detection interface 110. The second path L2 (please refer to FIG. 3 ) refers to a path that connects the first switch module 12114 and the image signal receiver 12112 through the switch in the first switch module 12114, so that the signal can be transmitted in Between the image signal receiver 12112 and the detection interface 110.

In addition, as shown in FIGS. 2 and 3 , when the first switch module 12114 is switched on the first path L1 , the automated test equipment (ATE) 140 can connect to the image signal processor (ISP) 212 under test through the detection interface 110 Pin S is used to perform the electrical testing procedure of the connection end. For ease of explanation, the pin S is only a collective example in Figures 2 and 3. In actual embodiments, the control point S may include SDA, SCL, MCLK, and RESETn. The SDA (serial data) pin is used to transmit I2C (Inter-Integrated Circuit) data path signals. The SCL (serial clock) pin is used to transmit the I2C clock signal. The MCLK (Master Clock) pin is used to transmit the master clock signal. The RESETn pin is used to transmit reset signals.

The image test signal generation card 1212 in the first relay carrier board assembly 121 includes a standard image signal processor 12122, a second switch module 12124 and a third switch module 12126. The standard image signal processor 12122 can be mounted on the image test signal generation card 1212 through a slot or socket configured on the image test signal generation card 1212, or can be mounted by soldering or other methods. On the image test signal generation card 1212.

The standard image signal processor 12122 is defined as the standard of the object under test, that is, the standard image signal processor 12122 is the object under test that has passed the test. Based on the fact that the image signal processor itself has pre-built standard image data (for example, the test image data required to be used in the manufacturing process of the image signal processor), in embodiments of the present invention, it uses automated test equipment (ATE ) 140 is connected to the standard image signal processor 12122, and can be configured to cause the standard image signal processor 12122 to output default image data.

Accordingly, since the signal output by the standard image signal processor 12122 is a high-speed signal, such as a high-speed MIPI signal, the image test signal generation card 1212 equipped with the standard image signal processor 12122 can be used as a MIPI signal generation card, allowing users who do not have The automated test equipment (ATE) 140 with high-speed signal generation capability can be configured in this way to achieve high-speed signal output capability, thereby completing the test of the object under test (image signal processor).

The second switch module 12124 is coupled between three components: the automated test equipment (ATE) 140, the standard image signal processor 12122, and the detection interface 110. The second switch module 12124 is used to determine the connection relationship between the three components. The second switch module 12124 is controlled by the automated test equipment (ATE) 140 and is operated to perform path switching according to the control instructions, with the purpose of changing the transmission path to the first path L1 or the third path L3. That is, since the second switch module 12124 is connected to the detection interface 110, the second switch module 12124 can determine whether the detection interface 110 is connected to the standard image signal processor 12122 or to the automated test equipment (ATE). )140 connected.

In other words, the first path L1 refers to a path that connects the second switch module 12124 and the automated test equipment (ATE) 140 through the switch in the second switch module 12124, so that the signal can be transmitted in between the automated test equipment (ATE) 140 and the detection interface 110, so that the input terminal Rx (image signal input terminal) of the image signal processor (ISP) 212 under test can be tested by the automated test equipment (ATE)140 performs the electrical testing procedure of the connection end. On the other hand, when the second switch module 12124 switches to the third path L3, the switch in the second switch module 12124 allows the second switch module 12124 to form a connected path with the standard image signal processor 12122 , and the signal of the preset image data can be transmitted from the standard image signal processor 12122 to the input terminal Rx (image signal input terminal) of the image signal processor (ISP) under test 212, so that the image signal processor under test (ISP) 212 performs high-speed image detection procedures.

In addition, the third switch module 12126 of the image test signal generating card 1212 has a different operation. As shown in area A of FIG. 2 and FIG. 3 , a floating connection is formed between the third switch module 12126 coupled to the automated test equipment (ATE) 140 and the standard image signal processor 12122 and the detection interface 110 . That is, the third switch module 12126 is not connected to the detection interface 110 . During the high-speed image detection process, the switch in the third switch module 12126 simultaneously allows the third switch module 12126 to form a communication path with the automated test equipment (ATE) 140 and the standard image signal processor 12122.

As shown in Figure 3, the third switch module 12126 conducts the first path L1 and the third path L3 at the same time, and the control instructions from the automated test equipment (ATE) 140 can be transmitted to the computer through the first path L1 and the third path L3. Standard video signal processor 12122. This allows the standard image signal processor 12122 to be controlled by the automated test equipment (ATE) 140 to perform a high-speed image detection process. At the same time, the standard image signal processor 12122 provides high-speed preset image data signals from the second switch module. The group 12124 is transmitted to the input terminal Rx (image signal input terminal) of the image signal processor (ISP) 212 under test.

Furthermore, when there is no need to perform a high-speed image detection process, or when a connection end electrical detection process is performed, the third switch module 12126 can be controlled to not conduct the first path L1 and the third path L3 at the same time. Among them, the switches in the first switch module 12114 and the second switch module 12124 can be three-contact switching control, and the examples shown in FIGS. 2 and 3 are four-point switching control.

In addition, for convenience of explanation, each switch module described in the above embodiment is described with a simplified path. Each switch module has more switches, and each switch is coupled to a corresponding electrical connection point one-to-one, such as each I/O of the automated test equipment (ATE) 140 The control point, the image signal receiver 12112 is used to set the pins (such as SDA, SCL, MCLK, RESETn) of the image signal processor (ISP) 212 under test, and the image signal receiver 12112 is used to receive signals from the image signal processor under test The receiving point of the image data transmitted by the output terminal Tx of (ISP) 212 (such as the differential signal receiving point MDP0-3/MCP, MDN0-3/MCN using MIPI high-speed transmission interface), the standard image signal processor 12122 is used to receive The pins (such as SDA, SCL, MCLK, RESETn) controlled by the automated test equipment (ATE) 140 and the standard image signal processor 12122 are used to transmit the preset image data and communicate with the input of the image signal processor (ISP) 212 under test. Terminal Rx corresponds to the coupled connection point (such as the differential signal receiving point MDP0-3/MCP, MDN0-3/MCN using the MIPI high-speed transmission interface).

In one implementation, the automated test equipment (ATE) 140 may be used to first perform electrical testing (static electrical characteristics and dynamic reading) and then switch to performing image testing. The automated test equipment (ATE) 140 supplies power to the image signal processor (ISP) under test through the power input terminal V. Next, the host computer 310 issues an instruction to the image processing computer (IPC) 320 so that the image processing computer (IPC) controls the image capture card 1211 . Then, the image capture card 1211 sets the state of the image signal processor (ISP) to be tested through the I2C interface according to the instructions from the image processing computer (IPC) 320 . Next, the automated test equipment (ATE) 140 sets the standard image signal processor 12122 on the image test signal generation card 1212 through the third switch module 12126 that is connected to the first path L1 and the third path L3 at the same time, so as to enable It generates a high-speed MIPI signal, and at the same time, outputs the high-speed MIPI signal through the second switch module 12124 that is switched to the third path L3. Subsequently, the image signal receiver 12112 of the image capture card 1211 receives the output signal from the output terminal Tx of the image signal processor (ISP) under test through the first switch module 12114 that is switched to the second path, and The output signal is provided to the image processing computer (IPC) 320 for data calculation and analysis, and the results are transmitted to the host computer 310 .

Based on the above, the relay carrier board assembly disclosed in the embodiment of the present invention for testing the image module can switch between the ATE electrical test (connection terminal electrical test procedure) and the high-speed image test (high-speed image test procedure). Provide an additional connection path, allowing the test system to have the ability to configure additional signal generators. Based on the requirements of the test conditions, the corresponding standard image signal processor can be configured to provide the necessary test signals, thereby reducing the need for automation Test equipment (ATE) requirements effectively reduce the testing cost of image signal processors.

The present invention has been disclosed above with preferred embodiments. However, those skilled in the art should understand that the embodiments are only used to illustrate the present invention and should not be interpreted as limiting the scope of the present invention. It should be noted that any changes and substitutions that are equivalent to this embodiment should be considered to be within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the scope of the patent application.

110: Detection interface

121: First relay carrier board assembly

1211:Image capture card

12112:Image signal receiver

12114:First switch module

1212:Image test signal generation card

12122:Standard image signal processor

12124: Second switch module

12126:Third switch module

130: Test carrier board

140: Automated Test Equipment (ATE)

212: Image signal processor (ISP) to be tested

320:Image Processing Computer (IPC)

A:Region

L1: first path

L2: Second path

L3: third path

Tx: output terminal

Rx: input terminal

S: pin

V: power input terminal

Claims (7)

A relay carrier board component for testing image modules, which is mounted on a detection interface and controlled by an automated test equipment to provide a preset image data built in a standard image signal processor to an object under test An image signal processor to be tested in the relay carrier board component includes: an image capture card, including an image signal receiver and a first switch module, the first switch module is coupled to the Between the automated test equipment, the image signal receiver and the detection interface, the first switch module is controlled by the automated test equipment to selectively switch to the first path or the second path; and an image test signal is generated The card is used to carry the standard image signal processor, including a second switch module and a third switch module coupled between the automated test equipment, the detection interface and the standard image signal processor, the The second switch module is controlled by the automated test equipment to selectively switch to the first path or the third path, wherein the first path is used to connect each switch module and the automated test equipment, and the third path is used to connect each switch module and the automated test equipment. The two paths are used to connect the first switch module and the image signal receiver, the third path is used to connect the second switch module and the standard image signal processor, and the image test signal generating card is The preset image data is provided to an input end of the image signal processor under test through the third path, and the first switch module and the second switch module are coupled to the detection interface. The relay carrier board assembly for detecting an image module as described in claim 1, wherein the third switch module is coupled between the automated test equipment and the standard image signal processor and with the detection interface Floating, the third switch module is used to be controlled by the automated test equipment to switch to simultaneously conduct the first path and the third path, so that the automated test equipment controls the standard image signal processor to make The standard image signal processor outputs the default image data. The relay carrier board assembly for testing an image module as described in claim 1, wherein when the automated testing equipment performs an electrical test on the input end of the image signal processor under test, the second switch module The system is controlled to switch to the first path. The relay carrier board assembly for detecting an image module as described in claim 3, wherein the third switch module is controlled to not conduct the first path and the third path at the same time. The relay carrier board assembly for detecting an image module as described in any one of claims 1 to 4, wherein the preset image data is provided to an image detection program of the image signal processor to be tested, The first switch module is controlled to switch to the second path, so that the image signal receiver controls the image signal processor under test and receives an output from an output end of the image signal processor under test signal. The relay carrier board assembly for testing image modules as described in claim 5, wherein when the automated testing equipment conducts electrical testing on the output terminal and the plurality of control terminals of the image signal processor under test, the third A switch module is controlled to switch to the first path. An image module detection system is used to detect multiple objects to be tested, each of which has an image signal processor to be tested. The detection system includes: a detection interface for providing electrical connection to the object to be tested. ; A test carrier board; an automated test equipment coupled to the test carrier board; and a relay array carrier board assembly including a plurality of image pattern detection devices as described in any one of claims 1 to 6. A set of relay carrier board components, each relay carrier board component is mounted on the detection interface and coupled to the test carrier board, and each relay carrier board component corresponds to one of the objects under test to be tested. The automated testing equipment is controlled to perform a connection terminal electrical testing process and a high-speed image testing process on the image signal processor to be tested.

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