TWI814239B - Relay board assembly for detecting image module and detection system thereof - Google Patents
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本發明係關於一種影像模組的檢測組件,更特別的是關於一種用於檢測影像模組的繼電載板組件及其檢測系統。 The present invention relates to a detection component of an image module, and more particularly to a relay carrier board component for detecting an image module and a detection system thereof.
影像模組可包含影像感測器(Image Sensor)及影像訊號處理器(Image Signal Processor,ISP)或此二者的任一。影像感測器用於環境的影像擷取,並將所擷取到的原始影像資料提供至影像訊號處理器,以供影像訊號處理器對原始影像資料進行分析、校正、處理等程序(例如:白平衡調整、曝光校正、銳化處理、色彩轉換、降噪及編碼等),進而生成畫質優異的影像資料。在影像感測器所擷取之影像資料量日益龐大的趨勢下,影像訊號處理器的處理能力更顯重要。 The image module may include an image sensor (Image Sensor), an image signal processor (Image Signal Processor, ISP), or either of the two. The image sensor is used to capture images of the environment, and provides the captured original image data to the image signal processor, which allows the image signal processor to analyze, correct, and process the original image data (for example, white Balance adjustment, exposure correction, sharpening, color conversion, noise reduction and encoding, etc.) to generate image data with excellent image quality. As the amount of image data captured by image sensors becomes increasingly large, the processing capabilities of image signal processors become even more important.
在影像模組的量產過程中,會藉由自動化測試設備(Automatic Test Equipment,ATE)來對影像模組執行各種測試項目。除了對影像感測器之各個接腳進行電性測試外,也透過自動化測試設備對影像感測器提供光源來對影像感測器的感測能力進行測試。 During the mass production process of imaging modules, various test items are performed on the imaging modules through Automatic Test Equipment (ATE). In addition to electrical testing of each pin of the image sensor, automated testing equipment is also used to provide a light source to the image sensor to test the sensing capability of the image sensor.
其中,自動化測試設備也須對影像訊號處理器進行測試,此外,由於影像資料量的龐大,影像感測器輸入至影像訊號處理器的資料傳輸介面須採用高速傳輸介面,例如:移動產業處理器介面(Mobile Industry Processor Interface,MIPI),其傳輸速度可達2.5Gsps以上。為了在影像訊號處理器的輸入端送入測試訊號,就需以匹配的傳輸速度來進行,這使得自動化測試設備的訊號輸出能力必須被提升。然而,訊號傳輸速度可達1Gsps以上的自動化測試設備其成本就已相當昂貴,更何況需達2.5Gsps以上。這使得影像訊號處理器的測試成本居高不下。 Among them, automated test equipment must also test the image signal processor. In addition, due to the huge amount of image data, the data transmission interface input from the image sensor to the image signal processor must use a high-speed transmission interface, such as: mobile industry processor Interface (Mobile Industry Processor Interface, MIPI), its transmission speed can reach more than 2.5Gsps. In order to send the test signal to the input end of the image signal processor, it must be carried out at a matching transmission speed, which requires the signal output capability of the automated test equipment to be improved. However, the cost of automated test equipment with signal transmission speeds above 1Gsps is already quite expensive, let alone above 2.5Gsps. This makes the cost of testing image signal processors high.
本發明之一目的在於降低影像訊號處理器的測試成本。 One purpose of the present invention is to reduce the testing cost of an image signal processor.
為達上述目的及其他目的,本發明提出一種用於檢測影像模組的繼電載板組件,係裝載於一探測介面並受控於一自動化測試設備,以提供一標準影像訊號處理器內建的一預設影像資料至一待測物內的一待測影像訊號處理器,該繼電載板組件包含:影像擷取卡及影像測試訊號產生卡。影像擷取卡包括一影像訊號接收器及第一切換器模組,該第一切換器模組係耦接於該自動化測試設備、該影像訊號接收器及該探測介面之間,該第一切換器模組受控於該自動化測試設備以選擇性地切換至第一路徑或第二路徑。影像測試訊號產生卡係用於搭載該標準影像訊號處理器,包括耦接於該自動化測試設備、該探測介面及該標準影像訊號處理器之間的第二切換器模組及第三切換器模組,該第二切換器模組受控於該自動化測試設備以選擇性地切換至第一路徑或第三路徑。其中,該第一路徑係用於連通各個切換器模組與該自動化測試設備,該第 二路徑係用於連通該第一切換器模組與該影像訊號接收器,該第三路徑係用於連通該第二切換器模組與該標準影像訊號處理器,該影像測試訊號產生卡係透過該第三路徑提供該預設影像資料至該待測影像訊號處理器的一輸入端,該第一切換器模組及該第二切換器模組係耦接該探測介面。 In order to achieve the above objects and other objects, the present invention proposes a relay carrier board assembly for detecting image modules, which is loaded on a detection interface and controlled by an automated test equipment to provide a standard image signal processor built-in A preset image data is sent to an image signal processor under test in an object under test. The relay carrier board component includes: an image capture card and an image test signal generation card. The image capture card includes an image signal receiver and a first switch module. The first switch module is coupled between the automated test equipment, the image signal receiver and the detection interface. The first switch module The tester module is controlled by the automated test equipment to selectively switch to the first path or the second path. The image test signal generation card is used to carry the standard image signal processor, including a second switch module and a third switch module coupled between the automated test equipment, the detection interface and the standard image signal processor. The second switch module is controlled by the automated test equipment to selectively switch to the first path or the third path. Wherein, the first path is used to connect each switch module and the automated test equipment, and the third path The two paths are used to connect the first switch module and the image signal receiver, the third path is used to connect the second switch module and the standard image signal processor, and the image test signal generating card is The preset image data is provided to an input end of the image signal processor under test through the third path, and the first switch module and the second switch module are coupled to the detection interface.
於本發明之一實施例中,該第三切換器模組係耦接於該自動化測試設備及該標準影像訊號處理器之間並與該探測介面浮接,該第三切換器模組用於受控於該自動化測試設備以切換為同時導通該第一路徑及該第三路徑,使該自動化測試設備對該標準影像訊號處理器進行控制以令該標準影像訊號處理器輸出該預設影像資料。 In one embodiment of the present invention, the third switch module is coupled between the automated test equipment and the standard image signal processor and is floating with the detection interface. The third switch module is used for Controlled by the automated test equipment to switch to simultaneously conduct the first path and the third path, so that the automated test equipment controls the standard image signal processor to cause the standard image signal processor to output the preset image data .
於本發明之一實施例中,於該自動化測試設備對該待測影像訊號處理器的該輸入端進行電性測試時,該第二切換器模組可被控制為切換至該第一路徑。此外,該第三切換器模組可被控制為同時不導通該第一路徑及該第三路徑。 In one embodiment of the present invention, when the automated testing equipment performs an electrical test on the input end of the image signal processor under test, the second switch module can be controlled to switch to the first path. In addition, the third switch module can be controlled to not conduct the first path and the third path at the same time.
於本發明之一實施例中,在該預設影像資料被提供至該待測影像訊號處理器的一影像檢測程序下,該第一切換器模組可被控制為切換至該第二路徑,使該影像訊號接收器對該待測影像訊號處理器進行控制並接收來自該待測影像訊號處理器之一輸出端的一輸出訊號。 In one embodiment of the present invention, the first switch module can be controlled to switch to the second path when the preset image data is provided to an image detection process of the image signal processor to be tested, The image signal receiver is caused to control the image signal processor to be tested and receive an output signal from an output end of the image signal processor to be tested.
於本發明之一實施例中,於該自動化測試設備對該待測影像訊號處理器的該輸出端及複數控制端進行電性測試時,該第一切換器模組可被控制為切換至該第一路徑。 In one embodiment of the present invention, when the automated testing equipment performs electrical testing on the output terminal and the plurality of control terminals of the image signal processor under test, the first switch module can be controlled to switch to the First path.
為達上述目的及其他目的,本發明復提出一種影像模組的檢測系統,係用於對各具有一待測影像訊號處理器的複數待測物進行檢測,該檢 測系統包含:探測介面、測試載板、自動化測試設備及繼電陣列載板組件。探測介面用於供該待測物的電性連接。自動化測試設備係耦接該測試載板。繼電陣列載板組件係包括複數個前述的繼電載板組件,各該繼電載板組件係裝載於該探測介面並與該測試載板耦接,每一該繼電載板組件係對應該等待測物之其一,以受控於該自動化測試設備對該待測影像訊號處理器進行一連接端電性檢測程序及一高速影像檢測程序。 In order to achieve the above objects and other objects, the present invention further proposes an image module detection system, which is used to detect a plurality of objects to be tested, each of which has an image signal processor to be tested. The test system includes: detection interface, test carrier board, automated test equipment and relay array carrier board components. The detection interface is used for electrical connection of the object under test. Automated test equipment is coupled to the test carrier board. The relay array carrier board assembly includes a plurality of the aforementioned relay carrier board components. Each of the relay carrier board components is loaded on the detection interface and coupled to the test carrier board. Each of the relay carrier board components is connected to the test carrier board. One of the objects under test should be waited for to be controlled by the automated test equipment to perform a connection terminal electrical testing process and a high-speed image testing process on the image signal processor under test.
據此,用於檢測影像模組的繼電載板組件,可在電性測試(連接端電性檢測程序)及高速影像測試(高速影像檢測程序)間提供切換,進而可藉由標準影像訊號處理器來實現高速傳輸訊號的提供,使得不具高速影像訊號提供能力的自動化測試設備(ATE)也能被用來執行高速影像測試(高速影像檢測程序),影像訊號處理器測試的成本得以被降低。 Accordingly, the relay carrier board component used to detect the image module can provide switching between electrical testing (connection end electrical testing process) and high-speed image testing (high-speed image testing process), and can then use standard image signals The processor is used to provide high-speed transmission signals, so that automated test equipment (ATE) without the ability to provide high-speed image signals can also be used to perform high-speed image testing (high-speed image detection procedures), and the cost of image signal processor testing can be reduced. .
110:探測介面 110: Detection interface
120:繼電陣列載板組件 120: Relay array carrier board assembly
121:第一繼電載板組件 121: First relay carrier board assembly
1211:影像擷取卡 1211:Image capture card
12112:影像訊號接收器 12112:Image signal receiver
12114:第一切換器模組 12114:First switch module
1212:影像測試訊號產生卡 1212:Image test signal generation card
12122:標準影像訊號處理器 12122:Standard image signal processor
12124:第二切換器模組 12124: Second switch module
12126:第三切換器模組 12126:Third switch module
122:第二繼電載板組件 122: Second relay carrier board assembly
130:測試載板 130: Test carrier board
140:自動化測試設備(ATE) 140: Automated Test Equipment (ATE)
210:待測物 210:Object to be tested
211:待測影像感測器(CIS) 211: Image sensor to be tested (CIS)
212:待測影像訊號處理器(ISP) 212: Image signal processor (ISP) to be tested
300:主機 300:Host
310:主電腦 310: Main computer
320:影像處理電腦(IPC) 320:Image Processing Computer (IPC)
A:區域 A:Region
L1:第一路徑 L1: first path
L2:第二路徑 L2: Second path
L3:第三路徑 L3: third path
Tx:輸出端 Tx: output terminal
Rx:輸入端 Rx: input terminal
S:引腳 S: pin
V:電源輸入端 V: power input terminal
[圖1]為本發明一實施例之影像模組檢測系統的示意圖。 [Fig. 1] is a schematic diagram of an image module detection system according to an embodiment of the present invention.
[圖2]為本發明一實施例之用於檢測影像模組的繼電載板組件的示意圖。 [Fig. 2] is a schematic diagram of a relay carrier board assembly for detecting an image module according to an embodiment of the present invention.
[圖3]為本發明一實施例之繼電載板組件在高速影像檢測程序下的示意圖。 [Fig. 3] is a schematic diagram of a relay carrier board assembly under a high-speed image inspection process according to an embodiment of the present invention.
為充分瞭解本發明之目的、特徵及功效,茲藉由下述具體之實施例,並配合所附之圖式,對本發明做一詳細說明,說明如後: 於本文中,所描述之用語「一」或「一個」來描述單元、部件、結構、裝置、模組、系統、部位或區域等。此舉只是為了方便說明,並且對本發明之範疇提供一般性的意義。因此,除非很明顯地另指他意,否則此種描述應理解為包括一個或至少一個,且單數也同時包括複數。 In order to fully understand the purpose, characteristics and effects of the present invention, the present invention is described in detail through the following specific embodiments and the accompanying drawings, as follows: In this document, the term "a" or "an" is used to describe a unit, component, structure, device, module, system, part or region, etc. This is done for convenience of explanation only and to provide a general sense of the scope of the invention. Accordingly, unless it is obvious otherwise, such description shall be understood to include one or at least one, and the singular shall also include the plural.
於本文中,所描述之用語「包含、包括、具有」或其他任何類似用語意係非僅限於本文所列出的此等要件而已,而是可包括未明確列出但卻是所述單元、部件、結構、裝置、模組、系統、部位或區域通常固有的其他要件。 In this article, the words "including, including, having" or any other similar words described in this article are not limited to the elements listed in this article, but may include elements that are not explicitly listed but are the mentioned elements, Other elements normally inherent in a component, structure, device, module, system, location or area.
於本文中,所描述之「第一」或「第二」等類似序數之詞語,係用以區分或指關聯於相同或類似的元件、結構、部位或區域,且不必然隱含此等元件、結構、部位或區域在空間上的順序。應了解的是,在某些情況或配置下,序數詞語係可交換使用而不影響本發明之實施。 In this article, words such as "first" or "second" and similar ordinal numbers are used to distinguish or refer to the same or similar elements, structures, parts or regions, and do not necessarily imply such elements. , the spatial sequence of structures, parts or regions. It should be understood that in certain situations or configurations, ordinal terms may be used interchangeably without affecting the practice of the invention.
請參照圖1,為本發明一實施例之影像模組檢測系統的示意圖。檢測系統包含探測介面110、繼電陣列載板組件120、測試載板(load board)130及自動化測試設備(ATE)140。檢測系統係將檢測資料提供至主機300,以供後續運算與分析。
Please refer to FIG. 1 , which is a schematic diagram of an image module detection system according to an embodiment of the present invention. The detection system includes a
探測介面110可為探針板(Probe Interface Board,PIB)或插座(socket)但不限於此,用於與作為待測物210的影像模組形成電性連接。此外,繼電陣列載板組件120裝載於探測介面110上,繼電陣列載板組件120包含複數板卡,可藉由例如插卡方式安裝於其中。
The
主機300可包括主電腦310及影像處理電腦(IPC)320,在影像模組的檢測程序運行時,主電腦310係使自動化測試設備(ATE)140執行檢測步驟,由自動化測試設備(ATE)140透過測試載板130提供測試訊號以執行各項檢測項目。測試載板130主要用於做為繼電陣列載板組件120、待測物210與自動化測試設備(ATE)140間的媒介,負責電源與訊號的傳輸。
The
在本發明實施例揭露的影像模組檢測系統中,待測物210可為具有影像感測器(CMOS Image Sensor,CIS)及影像訊號處理器(ISP)的影像模組,待測物210也可為具有影像訊號處理器(ISP)且不具有影像感測器(CIS)的影像模組,待測物210還可為具有影像感測器(CIS)且不具有影像訊號處理器(ISP)的影像模組。為了說明對高速的影像訊號處理器(ISP)的檢測,在本發明後續的實施例中,係以待測物210為具有影像感測器(CIS)及影像訊號處理器(ISP)的影像模組作為示例。
In the image module detection system disclosed in the embodiment of the present invention, the object under
作為待測物210的影像模組具有待測影像感測器(CIS)211及待測影像訊號處理器(ISP)212。在本發明的實施例中,係透過繼電陣列載板組件120的切換,建立自動化測試設備(ATE)140對各個待測物210內的待測影像感測器(CIS)211及待測影像訊號處理器(ISP)212進行檢測的檢測路徑。亦即,每一個繼電載板組件(第一繼電載板組件121或第二繼電載板組件122)係各自對應一個待測物210。如圖1所示,第一繼電載板組件121用於對一個待測物210提供檢測路徑的切換,第二繼電載板組件122用於對另一個待測物210提供檢測路徑的切換。
The image module as the object under
自動化測試設備(ATE)140除了用於對待測物210的各個連接端(腳位)進行電性檢測程序(例如檢測開路或短路)外,另可透過額外配置的光源組
件(圖未示)提供光源來對具有待測影像感測器211的待測物210進行感測能力的測試。對關聯於影像資料的測試(影像檢測程序)來說,每一項測試透過繼電陣列載板組件120所擷取到的影像資料係傳輸至影像處理電腦(IPC)320,以進行資料的運算與分析並將結果傳輸至主電腦310,進而完成該項測試項目。其中,在待測物210具有影像感測器(CIS)且不具有影像訊號處理器(ISP)的實施態樣中,可透過前述之光源組件使自動化測試設備(ATE)140對待測物210進行感測能力的測試;另一方面,在待測物210具有影像訊號處理器(ISP)且不具有影像感測器(CIS)的實施態樣中,即無須額外配置光源組件。
In addition to performing electrical testing procedures (such as detecting open circuits or short circuits) on each connection end (pin) of the object under
接著請同時參照圖1、圖2及圖3,圖2為本發明一實施例中用於檢測影像模組的繼電載板組件的示意圖,圖3為本發明一實施例之繼電載板組件在高速影像檢測程序下的示意圖。繼電陣列載板組件120中的每一繼電載板組件可包含:影像擷取卡及影像測試訊號產生卡。為便於說明,圖2示例出第一繼電載板組件121與探測介面110、自動化測試設備(ATE)140、影像處理電腦(IPC)320及待測影像訊號處理器(ISP)212之間的耦接關係。自動化測試設備(ATE)140可提供電源至待測影像訊號處理器(ISP)212之電源輸入端V,以驅動該待測影像訊號處理器(ISP)212。
Next, please refer to Figures 1, 2 and 3 at the same time. Figure 2 is a schematic diagram of a relay carrier board assembly used to detect an image module in one embodiment of the present invention. Figure 3 is a relay carrier board in one embodiment of the present invention. Schematic diagram of components under high-speed imaging inspection program. Each relay carrier board component in the relay array
第一繼電載板組件121內的影像擷取卡1211包括影像訊號接收器12112及第一切換器模組12114。
The
第一切換器模組12114耦接在三個部件:自動化測試設備(ATE)140、影像訊號接收器12112及探測介面110此三者之間。第一切換器模組12114用來決定此三部件之間的連接關係。第一切換器模組12114受控於自動化測試設備(ATE)140而得以被操作為依據控制指令來進行路徑切換,目的在於讓
傳輸路徑被變更為第一路徑L1或第二路徑L2。亦即,基於第一切換器模組12114係與探測介面110相連通,因此,第一切換器模組12114可決定探測介面110是與影像訊號接收器12112連通或是與自動化測試設備(ATE)140連通。
The
申言之,第一路徑L1是指藉由第一切換器模組12114內的切換器讓第一切換器模組12114與自動化測試設備(ATE)140形成連通的路徑,而可令訊號傳輸在自動化測試設備(ATE)140與探測介面110之間。第二路徑L2(請參照圖3)是指藉由第一切換器模組12114內的切換器讓第一切換器模組12114與影像訊號接收器12112形成連通的路徑,而可令訊號傳輸在影像訊號接收器12112與探測介面110之間。
In other words, the first path L1 refers to a path that connects the
此外,如圖2及3所示,當第一切換器模組12114被切換在第一路徑L1時,自動化測試設備(ATE)140可透過探測介面110連通待測影像訊號處理器(ISP)212的引腳S,以進行連接端電性檢測程序。為便於說明,引腳S在圖2及3中僅為一個集合式的示例,在實際的實施例中,控制點S可包含SDA、SCL、MCLK、RESETn。SDA(serial data)引腳用於傳輸I2C(Inter-Integrated Circuit)的資料通路訊號。SCL(serial clock)引腳用於傳輸I2C的時脈訊號。MCLK(Master Clock)引腳用於傳輸主時脈訊號。RESETn引腳用於傳輸重置訊號。
In addition, as shown in FIGS. 2 and 3 , when the
第一繼電載板組件121內的影像測試訊號產生卡1212包括標準影像訊號處理器12122、第二切換器模組12124及第三切換器模組12126。標準影像訊號處理器12122可藉由配置在影像測試訊號產生卡1212上的插槽(slot)或插座(socket)被搭載在影像測試訊號產生卡1212上,也可藉由焊接方式或其他方式搭載在影像測試訊號產生卡1212上。
The image test
標準影像訊號處理器12122被定義成待測物的標準品,亦即,標準影像訊號處理器12122是通過檢測的待測物。基於影像訊號處理器本身即具有預先建置的標準圖像資料(例如存在於影像訊號處理器在製造過程中所需使用的測試影像資料),本發明的實施例中係透過自動化測試設備(ATE)140與標準影像訊號處理器12122連接,進而可設定令標準影像訊號處理器12122輸出預設影像資料。
The standard
據此,由於標準影像訊號處理器12122輸出的訊號即是高速訊號,例如:高速MIPI訊號,這使得搭載標準影像訊號處理器12122的影像測試訊號產生卡1212可作為MIPI訊號產生卡,讓不具有高速訊號產生能力的自動化測試設備(ATE)140可藉此配置方式達到高速訊號輸出能力的具備,進而完成對待測物(影像訊號處理器)的測試。
Accordingly, since the signal output by the standard
第二切換器模組12124耦接在三個部件:自動化測試設備(ATE)140、標準影像訊號處理器12122及探測介面110此三者之間。第二切換器模組12124用來決定此三部件之間的連接關係。第二切換器模組12124受控於自動化測試設備(ATE)140而得以被操作為依據控制指令來進行路徑切換,目的在於讓傳輸路徑被變更為第一路徑L1或第三路徑L3。亦即,基於第二切換器模組12124係與探測介面110相連通,因此,第二切換器模組12124可決定探測介面110是與標準影像訊號處理器12122連通或是與自動化測試設備(ATE)140連通。
The
申言之,第一路徑L1是指藉由第二切換器模組12124內的切換器讓第二切換器模組12124與自動化測試設備(ATE)140形成連通的路徑,而可令訊號傳輸在自動化測試設備(ATE)140與探測介面110之間,進而讓待測影像訊號處理器(ISP)212的輸入端Rx(影像訊號輸入端)可被自動化測試設備
(ATE)140進行連接端電性檢測程序。另一方面,當第二切換器模組12124切換至第三路徑L3時,第二切換器模組12124內的切換器讓第二切換器模組12124與標準影像訊號處理器12122形成連通的路徑,而可令預設影像資料的訊號自標準影像訊號處理器12122傳輸至待測影像訊號處理器(ISP)212的輸入端Rx(影像訊號輸入端),以對待測影像訊號處理器(ISP)212進行高速影像檢測程序。
In other words, the first path L1 refers to a path that connects the
此外,影像測試訊號產生卡1212的第三切換器模組12126係具有相異的運作。如圖2及圖3的區域A所示,耦接於自動化測試設備(ATE)140及標準影像訊號處理器12122的第三切換器模組12126係與探測介面110之間形成浮接(floating)。亦即,第三切換器模組12126不與探測介面110連通。其中,在高速影像檢測程序時,第三切換器模組12126內的切換器同時讓第三切換器模組12126與自動化測試設備(ATE)140及標準影像訊號處理器12122形成連通的路徑。
In addition, the
如圖3所示,第三切換器模組12126同時導通第一路徑L1及第三路徑L3,來自自動化測試設備(ATE)140的控制指令可透過第一路徑L1及第三路徑L3被傳輸至標準影像訊號處理器12122。這使得標準影像訊號處理器12122可受控於自動化測試設備(ATE)140來執行高速影像檢測程序,同時,由標準影像訊號處理器12122提供高速的預設影像資料的訊號自第二切換器模組12124傳輸至待測影像訊號處理器(ISP)212的輸入端Rx(影像訊號輸入端)。
As shown in Figure 3, the
進一步地,當無須進行高速影像檢測程序時,或者是當進行連接端電性檢測程序時,第三切換器模組12126可被控制為同時不導通第一路徑L1及第三路徑L3。其中,第一切換器模組12114及第二切換器模組12124內的切換器可為三接點式的切換控制,圖2及圖3中係示例為四點式的切換控制。
Furthermore, when there is no need to perform a high-speed image detection process, or when a connection end electrical detection process is performed, the
此外,為便於說明,上述實施例中描述的各個切換器模組係以簡化的路徑來進行描述。每個切換器模組內具有更多的切換器,每個切換器一對一地耦接對應的電性連接點,各種電性連接點例如:自動化測試設備(ATE)140的各個I/O控制點、影像訊號接收器12112用來設定待測影像訊號處理器(ISP)212的引腳(如SDA、SCL、MCLK、RESETn)、影像訊號接收器12112用來接收來自待測影像訊號處理器(ISP)212的輸出端Tx所傳輸的影像資料的接收點(如採用MIPI高速傳輸介面的差分訊號接收點MDP0-3/MCP、MDN0-3/MCN)、標準影像訊號處理器12122用來受控於自動化測試設備(ATE)140的引腳(如SDA、SCL、MCLK、RESETn)及標準影像訊號處理器12122用來傳輸預設影像資料並與待測影像訊號處理器(ISP)212的輸入端Rx對應耦接的連接點(如採用MIPI高速傳輸介面的差分訊號接收點MDP0-3/MCP、MDN0-3/MCN)。
In addition, for convenience of explanation, each switch module described in the above embodiment is described with a simplified path. Each switch module has more switches, and each switch is coupled to a corresponding electrical connection point one-to-one, such as each I/O of the automated test equipment (ATE) 140 The control point, the
在一實施態樣下,可先以自動化測試設備(ATE)140執行電性測試(靜態電器特性及動態讀取)後,切換為影像測試的執行。自動化測試設備(ATE)140透過電源輸入端V對待測影像訊號處理器(ISP)供電。接著,主電腦310對影像處理電腦(IPC)320下達指令以使影像處理電腦(IPC)對影像擷取卡1211進行控制。接著,影像擷取卡1211依據來自影像處理電腦(IPC)320的指令透過I2C介面設定待測影像訊號處理器(ISP)的狀態。接著,自動化測試設備(ATE)140透過第一路徑L1及第三路徑L3被同時連通的第三切換器模組12126對影像測試訊號產生卡1212上的標準影像訊號處理器12122進行設定,以使其產生高速MIPI訊號,同時,透過被切換為第三路徑L3的第二切換器模組12124輸出此高速MIPI訊號。後續,影像擷取卡1211的影像訊號接收器12112透過被切換為第二路徑的第一切換器模組12114接收來自待測影像訊號處理器(ISP)之輸出端Tx的輸出訊號,並將此輸出訊號提供至影像處理電腦(IPC)320進行資料的運算與分析以及將結果傳輸至主電腦310。
In one implementation, the automated test equipment (ATE) 140 may be used to first perform electrical testing (static electrical characteristics and dynamic reading) and then switch to performing image testing. The automated test equipment (ATE) 140 supplies power to the image signal processor (ISP) under test through the power input terminal V. Next, the
綜合上述,本發明實施例揭露之用於檢測影像模組的繼電載板組件,可在ATE電性測試(連接端電性檢測程序)及高速影像測試(高速影像檢測程序)間進行切換,提供一個額外的連接通路,讓測試系統中具有配置附加之訊號產生器的能力,基於測試條件的需求即可配置對應的標準影像訊號處理器來提供必要的測試訊號,也藉此降低了對自動化測試設備(ATE)的要求,有效地降低影像訊號處理器的測試成本。 Based on the above, the relay carrier board assembly disclosed in the embodiment of the present invention for testing the image module can switch between the ATE electrical test (connection terminal electrical test procedure) and the high-speed image test (high-speed image test procedure). Provide an additional connection path, allowing the test system to have the ability to configure additional signal generators. Based on the requirements of the test conditions, the corresponding standard image signal processor can be configured to provide the necessary test signals, thereby reducing the need for automation Test equipment (ATE) requirements effectively reduce the testing cost of image signal processors.
本發明在上文中已以較佳實施例揭露,然熟習本項技術者應理解的是,該實施例僅用於描繪本發明,而不應解讀為限制本發明之範圍。應注意的是,舉凡與該實施例等效之變化與置換,均應設為涵蓋於本發明之範疇內。因此,本發明之保護範圍當以申請專利範圍所界定者為準。 The present invention has been disclosed above with preferred embodiments. However, those skilled in the art should understand that the embodiments are only used to illustrate the present invention and should not be interpreted as limiting the scope of the present invention. It should be noted that any changes and substitutions that are equivalent to this embodiment should be considered to be within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the scope of the patent application.
110:探測介面 110: Detection interface
121:第一繼電載板組件 121: First relay carrier board assembly
1211:影像擷取卡 1211:Image capture card
12112:影像訊號接收器 12112:Image signal receiver
12114:第一切換器模組 12114:First switch module
1212:影像測試訊號產生卡 1212:Image test signal generation card
12122:標準影像訊號處理器 12122:Standard image signal processor
12124:第二切換器模組 12124: Second switch module
12126:第三切換器模組 12126:Third switch module
130:測試載板 130: Test carrier board
140:自動化測試設備(ATE) 140: Automated Test Equipment (ATE)
212:待測影像訊號處理器(ISP) 212: Image signal processor (ISP) to be tested
320:影像處理電腦(IPC) 320:Image Processing Computer (IPC)
A:區域 A:Region
L1:第一路徑 L1: first path
L2:第二路徑 L2: Second path
L3:第三路徑 L3: third path
Tx:輸出端 Tx: output terminal
Rx:輸入端 Rx: input terminal
S:引腳 S: pin
V:電源輸入端 V: power input terminal
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