TWI810335B - 樹脂遮罩剝離用洗淨劑組合物 - Google Patents

樹脂遮罩剝離用洗淨劑組合物 Download PDF

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Publication number
TWI810335B
TWI810335B TW108125973A TW108125973A TWI810335B TW I810335 B TWI810335 B TW I810335B TW 108125973 A TW108125973 A TW 108125973A TW 108125973 A TW108125973 A TW 108125973A TW I810335 B TWI810335 B TW I810335B
Authority
TW
Taiwan
Prior art keywords
mass
component
resin mask
detergent composition
cleaning
Prior art date
Application number
TW108125973A
Other languages
English (en)
Chinese (zh)
Other versions
TW202016662A (zh
Inventor
山田晃平
Original Assignee
日商花王股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商花王股份有限公司 filed Critical 日商花王股份有限公司
Publication of TW202016662A publication Critical patent/TW202016662A/zh
Application granted granted Critical
Publication of TWI810335B publication Critical patent/TWI810335B/zh

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • G03F7/425—Stripping or agents therefor using liquids only containing mineral alkaline compounds; containing organic basic compounds, e.g. quaternary ammonium compounds; containing heterocyclic basic compounds containing nitrogen
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Detergent Compositions (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Paints Or Removers (AREA)
TW108125973A 2018-07-27 2019-07-23 樹脂遮罩剝離用洗淨劑組合物 TWI810335B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
WOPCT/JP2018/028330 2018-07-27
PCT/JP2018/028330 WO2020021721A1 (ja) 2018-07-27 2018-07-27 樹脂マスク剥離用洗浄剤組成物

Publications (2)

Publication Number Publication Date
TW202016662A TW202016662A (zh) 2020-05-01
TWI810335B true TWI810335B (zh) 2023-08-01

Family

ID=69182301

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108125973A TWI810335B (zh) 2018-07-27 2019-07-23 樹脂遮罩剝離用洗淨劑組合物

Country Status (5)

Country Link
JP (1) JP7132214B2 (ja)
KR (1) KR20210021576A (ja)
CN (1) CN111566567B (ja)
TW (1) TWI810335B (ja)
WO (1) WO2020021721A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW202235605A (zh) * 2020-11-17 2022-09-16 日商東京應化工業股份有限公司 膜洗淨液及膜之洗淨方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007254555A (ja) * 2006-03-22 2007-10-04 Sanyo Chem Ind Ltd 洗浄剤組成物
WO2018047631A1 (ja) * 2016-09-09 2018-03-15 花王株式会社 樹脂マスク剥離用洗浄剤組成物

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5185235A (en) 1987-09-09 1993-02-09 Tokyo Ohka Kogyo Co., Ltd. Remover solution for photoresist
JP4044215B2 (ja) * 1998-02-25 2008-02-06 花王株式会社 剥離剤組成物
JP2000019745A (ja) * 1998-07-06 2000-01-21 Kao Corp 剥離剤組成物
US9329486B2 (en) 2005-10-28 2016-05-03 Dynaloy, Llc Dynamic multi-purpose composition for the removal of photoresists and method for its use
KR101328097B1 (ko) * 2006-01-11 2013-11-13 주식회사 동진쎄미켐 티에프티 엘시디용 칼라 레지스트 박리액 조성물
CN101041794B (zh) * 2006-03-24 2012-02-22 达兴材料股份有限公司 清洗液组成物和其用途
SG175559A1 (en) 2006-09-25 2011-11-28 Advanced Tech Materials Compositions and methods for the removal of photoresist for a wafer rework application
CN101201556A (zh) 2006-12-15 2008-06-18 安集微电子（上海）有限公司 低蚀刻性光刻胶清洗剂
KR101333779B1 (ko) * 2007-08-20 2013-11-29 주식회사 동진쎄미켐 티에프티 엘시디용 칼라 레지스트 박리액 조성물

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007254555A (ja) * 2006-03-22 2007-10-04 Sanyo Chem Ind Ltd 洗浄剤組成物
WO2018047631A1 (ja) * 2016-09-09 2018-03-15 花王株式会社 樹脂マスク剥離用洗浄剤組成物

Also Published As

Publication number Publication date
JPWO2020021721A1 (ja) 2021-06-24
WO2020021721A1 (ja) 2020-01-30
KR20210021576A (ko) 2021-02-26
CN111566567B (zh) 2024-07-12
CN111566567A (zh) 2020-08-21
TW202016662A (zh) 2020-05-01
JP7132214B2 (ja) 2022-09-06

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