TWI808190B - Polymerizable composition, inkjet ink, heat-resistant soluble member, three-dimensional structure with support, and method for producing three-dimensional shaped object - Google Patents
Polymerizable composition, inkjet ink, heat-resistant soluble member, three-dimensional structure with support, and method for producing three-dimensional shaped object Download PDFInfo
- Publication number
- TWI808190B TWI808190B TW108119820A TW108119820A TWI808190B TW I808190 B TWI808190 B TW I808190B TW 108119820 A TW108119820 A TW 108119820A TW 108119820 A TW108119820 A TW 108119820A TW I808190 B TWI808190 B TW I808190B
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- Taiwan
- Prior art keywords
- monofunctional
- polymerizable composition
- meth
- heat
- soluble member
- Prior art date
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- 239000000203 mixture Substances 0.000 title claims abstract description 86
- 238000004519 manufacturing process Methods 0.000 title claims description 18
- -1 acrylic compound Chemical class 0.000 claims abstract description 54
- 238000010438 heat treatment Methods 0.000 claims abstract description 32
- 239000007864 aqueous solution Substances 0.000 claims abstract description 31
- 230000005865 ionizing radiation Effects 0.000 claims abstract description 27
- 239000003505 polymerization initiator Substances 0.000 claims abstract description 21
- 229920002554 vinyl polymer Polymers 0.000 claims abstract description 20
- 150000001875 compounds Chemical class 0.000 claims abstract description 19
- 239000007788 liquid Substances 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 18
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 15
- ZQXSMRAEXCEDJD-UHFFFAOYSA-N n-ethenylformamide Chemical compound C=CNC=O ZQXSMRAEXCEDJD-UHFFFAOYSA-N 0.000 claims description 13
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 claims description 12
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 11
- 239000002904 solvent Substances 0.000 claims description 10
- JWYVGKFDLWWQJX-UHFFFAOYSA-N 1-ethenylazepan-2-one Chemical compound C=CN1CCCCCC1=O JWYVGKFDLWWQJX-UHFFFAOYSA-N 0.000 claims description 8
- 239000000243 solution Substances 0.000 claims description 8
- RQAKESSLMFZVMC-UHFFFAOYSA-N n-ethenylacetamide Chemical compound CC(=O)NC=C RQAKESSLMFZVMC-UHFFFAOYSA-N 0.000 claims description 7
- 150000003254 radicals Chemical class 0.000 claims description 5
- 230000000704 physical effect Effects 0.000 claims description 4
- 238000006116 polymerization reaction Methods 0.000 claims description 4
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 claims description 2
- SXIFAEWFOJETOA-UHFFFAOYSA-N 4-hydroxy-butyl Chemical group [CH2]CCCO SXIFAEWFOJETOA-UHFFFAOYSA-N 0.000 claims description 2
- YIMQCDZDWXUDCA-UHFFFAOYSA-N [4-(hydroxymethyl)cyclohexyl]methanol Chemical compound OCC1CCC(CO)CC1 YIMQCDZDWXUDCA-UHFFFAOYSA-N 0.000 claims description 2
- QNILTEGFHQSKFF-UHFFFAOYSA-N n-propan-2-ylprop-2-enamide Chemical compound CC(C)NC(=O)C=C QNILTEGFHQSKFF-UHFFFAOYSA-N 0.000 claims description 2
- 238000007493 shaping process Methods 0.000 claims description 2
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 claims 1
- 239000011342 resin composition Substances 0.000 description 42
- 230000000052 comparative effect Effects 0.000 description 23
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 21
- XLPJNCYCZORXHG-UHFFFAOYSA-N 1-morpholin-4-ylprop-2-en-1-one Chemical compound C=CC(=O)N1CCOCC1 XLPJNCYCZORXHG-UHFFFAOYSA-N 0.000 description 13
- 238000011156 evaluation Methods 0.000 description 13
- 239000004094 surface-active agent Substances 0.000 description 11
- 230000003287 optical effect Effects 0.000 description 10
- 239000000758 substrate Substances 0.000 description 10
- NDWUBGAGUCISDV-UHFFFAOYSA-N 4-hydroxybutyl prop-2-enoate Chemical compound OCCCCOC(=O)C=C NDWUBGAGUCISDV-UHFFFAOYSA-N 0.000 description 6
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 6
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 6
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 6
- 238000001723 curing Methods 0.000 description 5
- 230000001678 irradiating effect Effects 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- OSSNTDFYBPYIEC-UHFFFAOYSA-N 1-ethenylimidazole Chemical compound C=CN1C=CN=C1 OSSNTDFYBPYIEC-UHFFFAOYSA-N 0.000 description 4
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 4
- 239000003513 alkali Substances 0.000 description 4
- 239000000945 filler Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 4
- 239000011259 mixed solution Substances 0.000 description 4
- 239000003960 organic solvent Substances 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 125000003277 amino group Chemical group 0.000 description 3
- JFDZBHWFFUWGJE-UHFFFAOYSA-N benzonitrile Chemical compound N#CC1=CC=CC=C1 JFDZBHWFFUWGJE-UHFFFAOYSA-N 0.000 description 3
- 230000001588 bifunctional effect Effects 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 3
- 125000000524 functional group Chemical group 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- VVBLNCFGVYUYGU-UHFFFAOYSA-N 4,4'-Bis(dimethylamino)benzophenone Chemical compound C1=CC(N(C)C)=CC=C1C(=O)C1=CC=C(N(C)C)C=C1 VVBLNCFGVYUYGU-UHFFFAOYSA-N 0.000 description 2
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 150000003926 acrylamides Chemical class 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- RDOXTESZEPMUJZ-UHFFFAOYSA-N anisole Chemical compound COC1=CC=CC=C1 RDOXTESZEPMUJZ-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 238000011960 computer-aided design Methods 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- BGTOWKSIORTVQH-UHFFFAOYSA-N cyclopentanone Chemical compound O=C1CCCC1 BGTOWKSIORTVQH-UHFFFAOYSA-N 0.000 description 2
- 125000004386 diacrylate group Chemical group 0.000 description 2
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
- UYMKPFRHYYNDTL-UHFFFAOYSA-N ethenamine Chemical class NC=C UYMKPFRHYYNDTL-UHFFFAOYSA-N 0.000 description 2
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 2
- 239000003063 flame retardant Substances 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- 238000011417 postcuring Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- ZUHZGEOKBKGPSW-UHFFFAOYSA-N tetraglyme Chemical compound COCCOCCOCCOCCOC ZUHZGEOKBKGPSW-UHFFFAOYSA-N 0.000 description 2
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 2
- QYGBYAQGBVHMDD-XQRVVYSFSA-N (z)-2-cyano-3-thiophen-2-ylprop-2-enoic acid Chemical compound OC(=O)C(\C#N)=C/C1=CC=CS1 QYGBYAQGBVHMDD-XQRVVYSFSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- NSXOFALHYZPMNH-UHFFFAOYSA-N 1-(3-methylmorpholin-4-yl)prop-2-en-1-one Chemical compound CC1COCCN1C(=O)C=C NSXOFALHYZPMNH-UHFFFAOYSA-N 0.000 description 1
- RRQYJINTUHWNHW-UHFFFAOYSA-N 1-ethoxy-2-(2-ethoxyethoxy)ethane Chemical compound CCOCCOCCOCC RRQYJINTUHWNHW-UHFFFAOYSA-N 0.000 description 1
- JOLQKTGDSGKSKJ-UHFFFAOYSA-N 1-ethoxypropan-2-ol Chemical compound CCOCC(C)O JOLQKTGDSGKSKJ-UHFFFAOYSA-N 0.000 description 1
- LIPRQQHINVWJCH-UHFFFAOYSA-N 1-ethoxypropan-2-yl acetate Chemical compound CCOCC(C)OC(C)=O LIPRQQHINVWJCH-UHFFFAOYSA-N 0.000 description 1
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 1
- DMFAHCVITRDZQB-UHFFFAOYSA-N 1-propoxypropan-2-yl acetate Chemical compound CCCOCC(C)OC(C)=O DMFAHCVITRDZQB-UHFFFAOYSA-N 0.000 description 1
- HFZLSTDPRQSZCQ-UHFFFAOYSA-N 1-pyrrolidin-3-ylpyrrolidine Chemical compound C1CCCN1C1CNCC1 HFZLSTDPRQSZCQ-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 description 1
- JONNRYNDZVEZFH-UHFFFAOYSA-N 2-(2-butoxypropoxy)propyl acetate Chemical compound CCCCOC(C)COC(C)COC(C)=O JONNRYNDZVEZFH-UHFFFAOYSA-N 0.000 description 1
- FPZWZCWUIYYYBU-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl acetate Chemical compound CCOCCOCCOC(C)=O FPZWZCWUIYYYBU-UHFFFAOYSA-N 0.000 description 1
- CKCGJBFTCUCBAJ-UHFFFAOYSA-N 2-(2-ethoxypropoxy)propyl acetate Chemical compound CCOC(C)COC(C)COC(C)=O CKCGJBFTCUCBAJ-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 description 1
- BJINVQNEBGOMCR-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethyl acetate Chemical compound COCCOCCOC(C)=O BJINVQNEBGOMCR-UHFFFAOYSA-N 0.000 description 1
- PUBNJSZGANKUGX-UHFFFAOYSA-N 2-(dimethylamino)-2-[(4-methylphenyl)methyl]-1-(4-morpholin-4-ylphenyl)butan-1-one Chemical compound C=1C=C(N2CCOCC2)C=CC=1C(=O)C(CC)(N(C)C)CC1=CC=C(C)C=C1 PUBNJSZGANKUGX-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- LCZVSXRMYJUNFX-UHFFFAOYSA-N 2-[2-(2-hydroxypropoxy)propoxy]propan-1-ol Chemical compound CC(O)COC(C)COC(C)CO LCZVSXRMYJUNFX-UHFFFAOYSA-N 0.000 description 1
- UHFFVFAKEGKNAQ-UHFFFAOYSA-N 2-benzyl-2-(dimethylamino)-1-(4-morpholin-4-ylphenyl)butan-1-one Chemical compound C=1C=C(N2CCOCC2)C=CC=1C(=O)C(CC)(N(C)C)CC1=CC=CC=C1 UHFFVFAKEGKNAQ-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- NQBXSWAWVZHKBZ-UHFFFAOYSA-N 2-butoxyethyl acetate Chemical compound CCCCOCCOC(C)=O NQBXSWAWVZHKBZ-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- ICPWFHKNYYRBSZ-UHFFFAOYSA-M 2-methoxypropanoate Chemical compound COC(C)C([O-])=O ICPWFHKNYYRBSZ-UHFFFAOYSA-M 0.000 description 1
- HCGFUIQPSOCUHI-UHFFFAOYSA-N 2-propan-2-yloxyethanol Chemical compound CC(C)OCCO HCGFUIQPSOCUHI-UHFFFAOYSA-N 0.000 description 1
- UVRCNEIYXSRHNT-UHFFFAOYSA-N 3-ethylpent-2-enamide Chemical compound CCC(CC)=CC(N)=O UVRCNEIYXSRHNT-UHFFFAOYSA-N 0.000 description 1
- DQFMPTUTAAIXAN-UHFFFAOYSA-N 4,4-dimethyl-1h-imidazol-5-one Chemical compound CC1(C)NC=NC1=O DQFMPTUTAAIXAN-UHFFFAOYSA-N 0.000 description 1
- ACQVEWFMUBXEMR-UHFFFAOYSA-N 4-bromo-2-fluoro-6-nitrophenol Chemical compound OC1=C(F)C=C(Br)C=C1[N+]([O-])=O ACQVEWFMUBXEMR-UHFFFAOYSA-N 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- XXRCUYVCPSWGCC-UHFFFAOYSA-N Ethyl pyruvate Chemical compound CCOC(=O)C(C)=O XXRCUYVCPSWGCC-UHFFFAOYSA-N 0.000 description 1
- KMTRUDSVKNLOMY-UHFFFAOYSA-N Ethylene carbonate Chemical compound O=C1OCCO1 KMTRUDSVKNLOMY-UHFFFAOYSA-N 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- XYVQFUJDGOBPQI-UHFFFAOYSA-N Methyl-2-hydoxyisobutyric acid Chemical compound COC(=O)C(C)(C)O XYVQFUJDGOBPQI-UHFFFAOYSA-N 0.000 description 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 1
- DKGAVHZHDRPRBM-UHFFFAOYSA-N Tert-Butanol Chemical compound CC(C)(C)O DKGAVHZHDRPRBM-UHFFFAOYSA-N 0.000 description 1
- URLYGBGJPQYXBN-UHFFFAOYSA-N [4-(hydroxymethyl)cyclohexyl]methyl prop-2-enoate Chemical compound OCC1CCC(COC(=O)C=C)CC1 URLYGBGJPQYXBN-UHFFFAOYSA-N 0.000 description 1
- GUCYFKSBFREPBC-UHFFFAOYSA-N [phenyl-(2,4,6-trimethylbenzoyl)phosphoryl]-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C(=O)C1=C(C)C=C(C)C=C1C GUCYFKSBFREPBC-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- KXKVLQRXCPHEJC-UHFFFAOYSA-N acetic acid trimethyl ester Natural products COC(C)=O KXKVLQRXCPHEJC-UHFFFAOYSA-N 0.000 description 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 1
- IWPATTDMSUYMJV-UHFFFAOYSA-N butyl 2-methoxyacetate Chemical compound CCCCOC(=O)COC IWPATTDMSUYMJV-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 229940019778 diethylene glycol diethyl ether Drugs 0.000 description 1
- 229940028356 diethylene glycol monobutyl ether Drugs 0.000 description 1
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 1
- 229940075557 diethylene glycol monoethyl ether Drugs 0.000 description 1
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 1
- VFHVQBAGLAREND-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 VFHVQBAGLAREND-UHFFFAOYSA-N 0.000 description 1
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- WNIHNYUROPJCLW-UHFFFAOYSA-N ethyl 2-ethoxy-2-methylpropanoate Chemical compound CCOC(=O)C(C)(C)OCC WNIHNYUROPJCLW-UHFFFAOYSA-N 0.000 description 1
- CKSRFHWWBKRUKA-UHFFFAOYSA-N ethyl 2-ethoxyacetate Chemical compound CCOCC(=O)OCC CKSRFHWWBKRUKA-UHFFFAOYSA-N 0.000 description 1
- JLEKJZUYWFJPMB-UHFFFAOYSA-N ethyl 2-methoxyacetate Chemical compound CCOC(=O)COC JLEKJZUYWFJPMB-UHFFFAOYSA-N 0.000 description 1
- WHRLOJCOIKOQGL-UHFFFAOYSA-N ethyl 2-methoxypropanoate Chemical compound CCOC(=O)C(C)OC WHRLOJCOIKOQGL-UHFFFAOYSA-N 0.000 description 1
- FJAKCEHATXBFJT-UHFFFAOYSA-N ethyl 2-oxobutanoate Chemical compound CCOC(=O)C(=O)CC FJAKCEHATXBFJT-UHFFFAOYSA-N 0.000 description 1
- BHXIWUJLHYHGSJ-UHFFFAOYSA-N ethyl 3-ethoxypropanoate Chemical compound CCOCCC(=O)OCC BHXIWUJLHYHGSJ-UHFFFAOYSA-N 0.000 description 1
- IJUHLFUALMUWOM-UHFFFAOYSA-N ethyl 3-methoxypropanoate Chemical compound CCOC(=O)CCOC IJUHLFUALMUWOM-UHFFFAOYSA-N 0.000 description 1
- 229940116333 ethyl lactate Drugs 0.000 description 1
- 229940117360 ethyl pyruvate Drugs 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 239000010954 inorganic particle Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- GJRQTCIYDGXPES-UHFFFAOYSA-N iso-butyl acetate Natural products CC(C)COC(C)=O GJRQTCIYDGXPES-UHFFFAOYSA-N 0.000 description 1
- FGKJLKRYENPLQH-UHFFFAOYSA-M isocaproate Chemical compound CC(C)CCC([O-])=O FGKJLKRYENPLQH-UHFFFAOYSA-M 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- OQAGVSWESNCJJT-UHFFFAOYSA-N isovaleric acid methyl ester Natural products COC(=O)CC(C)C OQAGVSWESNCJJT-UHFFFAOYSA-N 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- UZKWTJUDCOPSNM-UHFFFAOYSA-N methoxybenzene Substances CCCCOC=C UZKWTJUDCOPSNM-UHFFFAOYSA-N 0.000 description 1
- PPFNAOBWGRMDLL-UHFFFAOYSA-N methyl 2-ethoxyacetate Chemical compound CCOCC(=O)OC PPFNAOBWGRMDLL-UHFFFAOYSA-N 0.000 description 1
- YVWPDYFVVMNWDT-UHFFFAOYSA-N methyl 2-ethoxypropanoate Chemical compound CCOC(C)C(=O)OC YVWPDYFVVMNWDT-UHFFFAOYSA-N 0.000 description 1
- AKWHOGIYEOZALP-UHFFFAOYSA-N methyl 2-methoxy-2-methylpropanoate Chemical compound COC(=O)C(C)(C)OC AKWHOGIYEOZALP-UHFFFAOYSA-N 0.000 description 1
- XPIWVCAMONZQCP-UHFFFAOYSA-N methyl 2-oxobutanoate Chemical compound CCC(=O)C(=O)OC XPIWVCAMONZQCP-UHFFFAOYSA-N 0.000 description 1
- HSDFKDZBJMDHFF-UHFFFAOYSA-N methyl 3-ethoxypropanoate Chemical compound CCOCCC(=O)OC HSDFKDZBJMDHFF-UHFFFAOYSA-N 0.000 description 1
- BDJSOPWXYLFTNW-UHFFFAOYSA-N methyl 3-methoxypropanoate Chemical compound COCCC(=O)OC BDJSOPWXYLFTNW-UHFFFAOYSA-N 0.000 description 1
- CWKLZLBVOJRSOM-UHFFFAOYSA-N methyl pyruvate Chemical compound COC(=O)C(C)=O CWKLZLBVOJRSOM-UHFFFAOYSA-N 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- NTMXFHGYWJIAAE-UHFFFAOYSA-N n,n-diethyl-3-oxobutanamide Chemical compound CCN(CC)C(=O)CC(C)=O NTMXFHGYWJIAAE-UHFFFAOYSA-N 0.000 description 1
- KKFHAJHLJHVUDM-UHFFFAOYSA-N n-vinylcarbazole Chemical compound C1=CC=C2N(C=C)C3=CC=CC=C3C2=C1 KKFHAJHLJHVUDM-UHFFFAOYSA-N 0.000 description 1
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- WVDDGKGOMKODPV-ZQBYOMGUSA-N phenyl(114C)methanol Chemical compound O[14CH2]C1=CC=CC=C1 WVDDGKGOMKODPV-ZQBYOMGUSA-N 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 239000002798 polar solvent Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- UBXSCAIGDWEAQP-UHFFFAOYSA-N propan-2-one propyl acetate Chemical compound CC(C)=O.CCCOC(C)=O UBXSCAIGDWEAQP-UHFFFAOYSA-N 0.000 description 1
- FVSKHRXBFJPNKK-UHFFFAOYSA-N propionitrile Chemical compound CCC#N FVSKHRXBFJPNKK-UHFFFAOYSA-N 0.000 description 1
- CYIRLFJPTCUCJB-UHFFFAOYSA-N propyl 2-methoxypropanoate Chemical compound CCCOC(=O)C(C)OC CYIRLFJPTCUCJB-UHFFFAOYSA-N 0.000 description 1
- RUOJZAUFBMNUDX-UHFFFAOYSA-N propylene carbonate Chemical compound CC1COC(=O)O1 RUOJZAUFBMNUDX-UHFFFAOYSA-N 0.000 description 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
- 239000003586 protic polar solvent Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
- ABDKAPXRBAPSQN-UHFFFAOYSA-N veratrole Chemical compound COC1=CC=CC=C1OC ABDKAPXRBAPSQN-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F226/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/30—Auxiliary operations or equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/40—Structures for supporting 3D objects during manufacture and intended to be sacrificed after completion thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y10/00—Processes of additive manufacturing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y70/00—Materials specially adapted for additive manufacturing
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
- C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/52—Amides or imides
- C08F220/54—Amides, e.g. N,N-dimethylacrylamide or N-isopropylacrylamide
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/52—Amides or imides
- C08F220/54—Amides, e.g. N,N-dimethylacrylamide or N-isopropylacrylamide
- C08F220/56—Acrylamide; Methacrylamide
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- Chemical & Material Sciences (AREA)
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- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Health & Medical Sciences (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Optics & Photonics (AREA)
- Polymerisation Methods In General (AREA)
- Ink Jet Recording Methods And Recording Media Thereof (AREA)
Abstract
本發明提供一種聚合性組成物,其可形成即使經過熱處理亦適當地維持在水系溶解液中的溶解性的硬化物(耐熱性可溶構件)。一種聚合性組成物,其特徵在於含有:單官能型丙烯酸系化合物,包含選自由單官能型丙烯酸酯化合物及單官能型丙烯醯胺化合物所組成的群組中的一種或兩種以上的化合物;單官能型N-乙烯基化合物;以及聚合起始劑,藉由電離放射線的照射而產生自由基。The present invention provides a polymerizable composition capable of forming a cured product (heat-resistant soluble member) that appropriately maintains solubility in an aqueous solution even after heat treatment. A polymerizable composition characterized by containing: a monofunctional acrylic compound, including one or more compounds selected from the group consisting of a monofunctional acrylate compound and a monofunctional acrylamide compound; a monofunctional N-vinyl compound; and a polymerization initiator that generates free radicals by irradiation with ionizing radiation.
Description
本發明是有關於一種聚合性組成物、包含所述聚合性組成物的噴墨用墨水、包含所述聚合性組成物的電離放射線硬化物的耐熱性可溶構件、包括所述耐熱性可溶構件作為支撐部的帶支撐部的立體結構物、及使用所述聚合性組成物的立體造形物的製造方法。The present invention relates to a polymerizable composition, an inkjet ink comprising the polymerizable composition, a heat-resistant soluble member comprising an ionizing radiation-cured product of the polymerizable composition, a three-dimensional structure with a support including the heat-resistant soluble member as a support, and a method for manufacturing a three-dimensional shape using the polymerizable composition.
近年來,作為立體結構物的製造方法,提出了被稱作積層造形法的光學立體造形法,其製成將對製品的三維電腦輔助設計(computer aided design,CAD)資料進行切片所得的薄板重疊般的元資料,並多次重覆對包含使用了自由基聚合性化合物或陽離子聚合性化合物的光硬化性樹脂組成物的薄膜照射光而使其硬化的步驟,藉此製造所期望的形狀的立體結構物。作為藉由所述光學立體造形法而製造立體結構物的裝置,於市場上出現了更廉價的裝置,從而期待不僅於例如樣機的製造等工業用途,而且於普通家庭中亦可利用般的用途的擴大。例如,藉由在此種積層造形法中使用特定的自由基聚合性化合物,可使造形物的尺寸精度、或生產性提昇(專利文獻1)。In recent years, as a method of manufacturing a three-dimensional structure, an optical three-dimensional modeling method called a layered modeling method has been proposed, which creates metadata such as overlapping thin plates obtained by slicing three-dimensional computer-aided design (CAD) data of a product, and repeats the step of irradiating and curing a film containing a photocurable resin composition using a radically polymerizable compound or a cationic polymerizable compound multiple times, thereby manufacturing a three-dimensional structure of a desired shape. As a device for manufacturing a three-dimensional structure by the above-mentioned optical three-dimensional modeling method, cheaper devices have appeared on the market, and the expansion of applications not only for industrial purposes such as prototype production but also for ordinary households is expected. For example, by using a specific radically polymerizable compound in such a build-up method, the dimensional accuracy and productivity of a molded object can be improved (Patent Document 1).
此處,若使用光學立體造形法而最終製造的立體結構物(立體造形物)的形狀複雜,則有在藉由光學立體造形法而製作的結構體(本體部)的階段中會經歷難以承載自重的狀態的情況。在此種情況下,就維持本體部的形狀的觀點而言,有時會藉由光學立體造形法而與本體部一同製成承載本體部的支撐部。包含如此般獲得的本體部與支撐部的帶支撐部的立體結構物可藉由作為最終步驟而將支撐部自帶支撐部的立體結構物去除,來獲得光造形物。於此種製造方法中,作為可形成支撐部的組成物,例如在專利文獻2中揭示了一種於硬化後在水系溶解液中的溶解性良好的光硬化性液狀樹脂組成物。Here, if the shape of the three-dimensional structure (three-dimensional object) finally produced by optical three-dimensional modeling is complex, it may experience a state in which it is difficult to bear its own weight at the stage of the structure (main body) produced by optical three-dimensional modeling. In such a case, from the viewpoint of maintaining the shape of the main body, a supporting portion for supporting the main body may be formed together with the main body by optical three-dimensional modeling. The three-dimensional structure with the support including the main body and the support obtained in this way can be obtained by removing the three-dimensional structure with the support as the final step to obtain a photosculpture. In such a production method, as a composition capable of forming a support portion, for example, Patent Document 2 discloses a photocurable liquid resin composition having good solubility in an aqueous solution after curing.
另一方面,為了將藉由包含光學立體造形法的製造方法而製造的立體造形物用作工作模型(working model),要求該立體造形物具有可耐受使用條件的充分的機械強度或耐熱性。出於該目的,有對藉由光學立體造形法而製成的結構體(本體部)進行加熱或光照射等後硬化(post cure)的情況(例如專利文獻3),亦提出了以藉由加熱的後硬化即後烘烤(post bake)的實施為前提的感光性樹脂組成物(例如專利文獻4)。 [現有技術文獻] [專利文獻]On the other hand, in order to use a three-dimensional object manufactured by a manufacturing method including optical three-dimensional modeling as a working model, the three-dimensional object is required to have sufficient mechanical strength or heat resistance to withstand usage conditions. For this purpose, there are cases where post curing (post cure) such as heating or light irradiation is performed on the structure (main body) produced by the optical three-dimensional modeling method (for example, Patent Document 3), and a photosensitive resin composition based on the implementation of post curing by heating (post bake) has also been proposed (for example, Patent Document 4). [Prior art literature] [Patent Document]
[專利文獻1]日本專利特開2008-189782號公報 [專利文獻2]日本專利特開2010-155889號公報 [專利文獻3]日本專利特開2013-023574號公報 [專利文獻4]日本專利特開2013-194205號公報[Patent Document 1] Japanese Patent Laid-Open No. 2008-189782 [Patent Document 2] Japanese Patent Laid-Open No. 2010-155889 [Patent Document 3] Japanese Patent Laid-Open No. 2013-023574 [Patent Document 4] Japanese Patent Laid-Open No. 2013-194205
[發明所欲解決之課題] 即使在使用如專利文獻4所示的將後烘烤作為前提的組成物來形成本體部的情況下,有時亦需要藉由光學立體造形法來形成如專利文獻2所記載的支撐體。此時,若自藉由光學立體造形法而形成的帶支撐部的立體結構物在進行後烘烤之前將支撐部去除,則本體部有可能無法耐受自重而破損。因此,對於包括將後烘烤作為前提的組成物所形成的本體部的帶支撐部的立體結構物而言,在藉由光學立體造形法來形成的情況下,支撐部亦會受到後烘烤。該後烘烤有可能對支撐部的溶解性帶來影響,但針對該方面並未進行充分的研究。[Problems to be Solved by the Invention] Even when the main body is formed using a composition that presupposes post-baking as disclosed in Patent Document 4, it may be necessary to form a support as described in Patent Document 2 by optical stereolithography. At this time, if the support portion is removed from the three-dimensional structure with the support portion formed by the optical three-dimensional modeling method before post-baking, the main body may not be able to bear its own weight and be damaged. Therefore, in the case of forming a three-dimensional structure with a support part including a body part formed of a composition premised on post-baking, the support part is also post-baked when formed by optical stereolithography. This post-baking may affect the solubility of the support part, but sufficient studies have not been conducted on this point.
如此般,在進行了使對聚合性組成物照射電離放射線而獲得的電離放射線硬化物的溫度提高的處理(熱處理)的情況下,對於所述熱處理後的電離放射線硬化物,有時亦要求相對於水系的溶解液的適當的溶解性。該熱處理有並非以對電離放射線硬化物積極地進行加熱為目的而進行的情況。作為此種情況的具體例,可列舉如下情況:以對形成有電離放射線硬化物的基板的其他部分所設置的構件(焊料等)進行加熱為目的,對基板全體進行加熱。另外,作為另一例,可列舉如下情況:若對形成有電離放射線硬化物的基板進行藉由乾式製程的製膜,則所堆積的材料(金屬等)以高溫與電離放射線硬化物相接,因此電離放射線硬化物的溫度提高。再者,於本說明書中,所謂「電離放射線」是指γ射線、X射線、紫外線、可見光等電磁波,及電子、以及質子或離子等可藉由被照射至聚合起始劑或與聚合起始劑碰撞而產生自由基的能量源的總稱。In this way, when the treatment (heat treatment) of raising the temperature of the ionizing radiation-cured product obtained by irradiating the polymerizable composition with ionizing radiation is performed, the ionizing radiation-cured product after the heat treatment may also be required to have appropriate solubility in an aqueous solution. This heat treatment may not be performed for the purpose of actively heating the ionizing radiation cured product. As a specific example of such a case, the case where the entire substrate is heated for the purpose of heating members (solder, etc.) provided in other parts of the substrate on which the ionizing radiation hardened product is formed. In addition, as another example, when film formation is performed by a dry process on a substrate on which an ionizing radiation-cured product is formed, the deposited material (metal, etc.) contacts the ionizing radiation-cured product at a high temperature, and thus the temperature of the ionized radiation-cured product rises. Furthermore, in this specification, the so-called "ionizing radiation" refers to electromagnetic waves such as γ-rays, X-rays, ultraviolet rays, and visible light, and electrons, protons, or ions, etc., which can generate free radicals by being irradiated to or colliding with a polymerization initiator.
本發明鑑於所述現狀,目的在於提供一種聚合性組成物,其可形成即使經過後烘烤般的熱處理亦適當地維持在水系溶解液中的溶解性的硬化物(耐熱性可溶構件)。本發明的目的在於提供包含所述聚合性組成物的噴墨用墨水、包含所述聚合性組成物的硬化物的耐熱性可溶構件、包括包含所述耐熱性可溶構件的支撐部的帶支撐部的立體結構物、及使用所述聚合性組成物的立體造形物的製造方法。 [解決課題之手段]In view of the above circumstances, the present invention aims to provide a polymerizable composition capable of forming a cured product (heat-resistant soluble member) that appropriately maintains solubility in an aqueous solution even after heat treatment such as post-baking. An object of the present invention is to provide an inkjet ink comprising the polymerizable composition, a heat-resistant soluble member comprising a hardened product of the polymerizable composition, a three-dimensional structure with supports including a support comprising the heat-resistant soluble member, and a method for producing a three-dimensional shape using the polymerizable composition. [Means to solve the problem]
為解決所述課題而提供的本發明如下所述。 [1]一種聚合性組成物,用以形成耐熱性可溶構件,所述聚合性組成物的特徵在於含有:單官能型丙烯酸系化合物,包含選自由單官能型丙烯酸酯化合物及單官能型丙烯醯胺化合物所組成的群組中的一種或兩種以上的化合物;單官能型N-乙烯基化合物;以及聚合起始劑,藉由電離放射線的照射而產生自由基。 [2]如所述[1]所述的聚合性組成物,其中所述單官能型N-乙烯基化合物為單官能型N-乙烯基醯胺化合物。 [3]如所述[2]所述的聚合性組成物,其中所述單官能型N-乙烯基醯胺化合物包含選自N-乙烯基甲醯胺、N-乙烯基乙醯胺、N-乙烯基-ε-己內醯胺的一種或兩種以上的化合物。 [4]如所述[1]至所述[3]中任一項所述的聚合性組成物,其60℃下的黏度為15 mPa・s以下。 [5]如所述[1]至所述[4]中任一項所述的聚合性組成物,其含有相對於所述聚合性組成物全體而為30質量%以下的揮發性溶劑。 [6]一種噴墨用墨水,包含如所述[1]至所述[5]中任一項所述的聚合性組成物。 [7]一種耐熱性可溶構件,包含如所述[1]至所述[5]中任一項所述的聚合性組成物的電離放射線硬化物,所述耐熱性可溶構件即使在大氣中以150℃加熱2小時後亦能夠溶解於水系溶解液中。 [8]如所述[7]所述的耐熱性可溶構件,其中所述水系溶解液為水-醇混合液。所述醇較佳為具有相對於水的混和性的醇,更佳為碳數為4以下的醇。 [9]如所述[7]或所述[8]所述的耐熱性可溶構件,其中所述水系溶解液的pH為8以下。 [10]一種帶支撐部的立體結構物,其特徵在於包括:本體部,提供立體造形物;以及支撐部,承載所述本體部,且所述支撐部包含如所述[7]至所述[9]中任一項所述的耐熱性可溶構件。 [11]一種立體造形物的製造方法,其特徵在於包括:造形步驟,使用用以形成本體部的第一液狀組成物及用以形成支撐部的第二液狀組成物,藉由積層造形法來形成處於所述本體部由所述支撐部支撐的狀態的帶支撐部的立體結構物,所述本體部提供所述立體造形物,所述支撐部支撐所述本體部;以及去除步驟,利用水系溶解液將所述帶支撐部的立體結構物的所述支撐部溶解去除,獲得所述立體造形物,所述第二液狀組成物包含如所述[1]至所述[5]中任一項所述的聚合性組成物,所述支撐部包含如所述[7]至所述[9]中任一項所述的耐熱性可溶構件。 [12]如所述[11]所述的立體造形物的製造方法,其在所述造形步驟之後、所述去除步驟開始前更包括加熱步驟,所述加熱步驟對所述帶支撐部的立體結構物進行加熱而使所述本體部的物性變化。 [發明的效果]The present invention provided to solve the above-mentioned problems is as follows. [1] A polymerizable composition for forming a heat-resistant soluble member, characterized by containing: a monofunctional acrylic compound, including one or more compounds selected from the group consisting of a monofunctional acrylate compound and a monofunctional acrylamide compound; a monofunctional N-vinyl compound; and a polymerization initiator that generates radicals by irradiation with ionizing radiation. [2] The polymerizable composition according to [1], wherein the monofunctional N-vinyl compound is a monofunctional N-vinylamide compound. [3] The polymerizable composition according to [2], wherein the monofunctional N-vinylamide compound contains one or two or more compounds selected from N-vinylformamide, N-vinylacetamide, and N-vinyl-ε-caprolactam. [4] The polymerizable composition according to any one of the above [1] to the above [3], which has a viscosity at 60°C of 15 mPa・s or less. [5] The polymerizable composition according to any one of the above [1] to the above [4], which contains 30% by mass or less of a volatile solvent relative to the entire polymerizable composition. [6] An inkjet ink comprising the polymerizable composition according to any one of [1] to [5]. [7] A heat-resistant soluble member comprising an ionizing radiation-cured product of the polymerizable composition according to any one of [1] to [5], wherein the heat-resistant soluble member can be dissolved in an aqueous solution even after being heated at 150° C. for 2 hours in the air. [8] The heat-resistant soluble member according to [7], wherein the aqueous solution is a water-alcohol mixed solution. The alcohol is preferably an alcohol having miscibility with water, more preferably an alcohol having 4 or less carbon atoms. [9] The heat-resistant soluble member according to [7] or [8], wherein the aqueous solution has a pH of 8 or less. [10] A three-dimensional structure with a support part, characterized by comprising: a body part providing a three-dimensional shape; and a support part carrying the body part, and the support part includes the heat-resistant soluble member as described in any one of [7] to [9]. [11] A method for manufacturing a three-dimensional figure, characterized by comprising: a forming step of using a first liquid composition for forming a main body and a second liquid composition for forming a support, and forming a three-dimensional structure with a support in a state where the main body is supported by the support by a layered molding method, the body provides the three-dimensional figure, and the support supports the main body; and a removing step of dissolving and removing the support of the three-dimensional structure with the support using an aqueous solution to obtain the three-dimensional structure. A molded object, wherein the second liquid composition comprises the polymerizable composition according to any one of [1] to [5], and the support part contains the heat-resistant soluble member according to any one of [7] to [9]. [12] The method for manufacturing a three-dimensional structure according to [11], further comprising a heating step after the forming step and before starting the removing step, wherein the heating step heats the three-dimensional structure with support parts to change the physical properties of the main body. [Effect of the invention]
根據本發明,提供一種聚合性組成物,其可形成即使經過加熱步驟亦適當地維持在水系溶解液中的溶解性的硬化物(耐熱性可溶構件)。另外,根據本發明,提供包含所述聚合性組成物的噴墨用墨水、包含所述聚合性組成物的電離放射線硬化物的耐熱性可溶構件、包括包含所述耐熱性可溶構件的支撐部的帶支撐部的立體結構物、及立體造形物的製造方法。According to the present invention, there is provided a polymerizable composition capable of forming a cured product (heat-resistant soluble member) that appropriately maintains solubility in an aqueous solution even through a heating step. In addition, according to the present invention, there are provided an inkjet ink comprising the polymerizable composition, a heat-resistant soluble member comprising an ionizing radiation-cured product of the polymerizable composition, a three-dimensional structure with a support including a support comprising the heat-resistant soluble member, and a method for producing a three-dimensional shaped object.
以下對本發明的實施形態的聚合性組成物、噴墨用墨水、耐熱性可溶構件、帶支撐部的立體結構物、及立體造形物的製造方法進行說明。Hereinafter, methods for producing the polymerizable composition, inkjet ink, heat-resistant soluble member, three-dimensional structure with support parts, and three-dimensional shaped object according to the embodiment of the present invention will be described.
本發明的一實施形態的聚合性組成物用以形成耐熱性可溶構件,且含有:單官能型丙烯酸系化合物,選自由單官能型丙烯酸酯化合物及單官能型丙烯醯胺化合物所組成的群組中的一種或兩種以上的化合物;單官能型N-乙烯基化合物;以及藉由電離放射線的照射而產生自由基的聚合起始劑。A polymerizable composition according to an embodiment of the present invention is used to form a heat-resistant soluble member, and contains: a monofunctional acrylic compound, one or more compounds selected from the group consisting of a monofunctional acrylate compound and a monofunctional acrylamide compound; a monofunctional N-vinyl compound; and a polymerization initiator that generates radicals by irradiation with ionizing radiation.
單官能型丙烯酸系化合物包含選自由單官能型丙烯酸酯化合物及單官能型丙烯醯胺化合物所組成的群組中的一種或兩種以上的化合物。單官能型丙烯酸酯化合物是具有(甲基)丙烯酸酯或基於(甲基)丙烯酸酯的部分結構且在分子內具有一個乙烯性雙鍵的化合物。再者,本說明書中,為表示「丙烯酸」及「甲基丙烯酸」的一者或兩者,有時表述為「(甲基)丙烯酸」。與(甲基)丙烯酸相關的用語、例如「(甲基)丙烯酸酯」、「(甲基)丙烯醯氧」亦具有相同的含義。The monofunctional acrylic compound includes one or two or more compounds selected from the group consisting of monofunctional acrylate compounds and monofunctional acrylamide compounds. The monofunctional acrylate compound is a compound having a (meth)acrylate or (meth)acrylate-based partial structure and having one ethylenic double bond in the molecule. In addition, in this specification, in order to show one or both of "acrylic acid" and "methacrylic acid", it may express as "(meth)acrylic acid." Terms related to (meth)acrylic acid, such as "(meth)acrylate" and "(meth)acryloxy" also have the same meaning.
就確保對聚合性組成物照射電離放射線而成的電離放射線硬化物在水系溶解液中的溶解性的觀點而言,單官能型丙烯酸酯化合物較佳為具有羥基(-OH)。作為此種含羥基(-OH)的單官能型丙烯酸酯化合物的具體例,可列舉:2-羥基乙基(甲基)丙烯酸酯、2-羥基丙基(甲基)丙烯酸酯、4-羥基丁基(甲基)丙烯酸酯、1,4-環己烷二甲醇單(甲基)丙烯酸酯、N-羥基乙基(甲基)丙烯醯胺、及聚氧乙烯單丙烯酸酯。該些中,就比較不易揮發因此容易確保聚合性組成物的組成穩定性的觀點而言,較佳為4-羥基丁基丙烯酸酯及1,4-環己烷二甲醇單丙烯酸酯,就所獲得的電離放射線硬化物相對於水系溶解液的溶解容易度的觀點而言,尤佳為4-羥基丁基丙烯酸酯。The monofunctional acrylate compound preferably has a hydroxyl group (—OH) from the viewpoint of ensuring solubility in an aqueous solution of an ionizing radiation-cured product obtained by irradiating a polymerizable composition with ionizing radiation. Specific examples of such a hydroxyl group (—OH)-containing monofunctional acrylate compound include 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, 1,4-cyclohexanedimethanol mono(meth)acrylate, N-hydroxyethyl (meth)acrylamide, and polyoxyethylene monoacrylate. Among them, 4-hydroxybutyl acrylate and 1,4-cyclohexanedimethanol monoacrylate are preferable from the viewpoint of relatively less volatilization and therefore easy to ensure the compositional stability of the polymerizable composition, and 4-hydroxybutyl acrylate is particularly preferable from the viewpoint of the ease of dissolution of the obtained ionizing radiation-cured product in an aqueous solution.
作為單官能型丙烯醯胺化合物的具體例,可列舉:N-異丙基丙烯醯胺、N,N-二甲基(甲基)丙烯醯胺、N,N-二甲基胺基乙基(甲基)丙烯醯胺、N,N-二乙基(甲基)丙烯醯胺、N,N-二乙基胺基乙基(甲基)丙烯醯胺、及N,N-二甲基胺基丙基(甲基)丙烯醯胺以及(甲基)丙烯醯基嗎啉。該些中,就比較不易揮發因此容易確保聚合性組成物的組成穩定性的觀點而言,較佳為(甲基)丙烯醯基嗎啉。Specific examples of monofunctional acrylamide compounds include N-isopropylacrylamide, N,N-dimethyl(meth)acrylamide, N,N-dimethylaminoethyl(meth)acrylamide, N,N-diethyl(meth)acrylamide, N,N-diethylaminoethyl(meth)acrylamide, N,N-dimethylaminopropyl(meth)acrylamide, and (methyl) Acryloylmorpholine. Among these, (meth)acryloylmorpholine is preferred from the viewpoint of being relatively less volatile and thus easily ensuring the compositional stability of the polymerizable composition.
單官能型N-乙烯基化合物是具有乙烯性不飽和基鍵結於胺基的結構的化合物,胺基亦可構成羰基與醯胺鍵。在本說明書中,亦將此種鍵結有乙烯性不飽和基的胺基構成了醯胺鍵的單官能型化合物稱為「單官能型N-乙烯基醯胺化合物」。單官能型N-乙烯基醯胺化合物是單官能型N-乙烯基化合物的較佳的一例。作為單官能型N-乙烯基醯胺化合物的具體例,可列舉N-乙烯基甲醯胺、N-乙烯基乙醯胺、N-乙烯基-ε-己內醯胺等,作為單官能型N-乙烯基醯胺化合物以外的單官能型N-乙烯基化合物的具體例,可列舉1-乙烯基咪唑及9-乙烯基咔唑。該些化合物中,就所獲得的電離放射線硬化物相對於水系溶解液的溶解容易度的觀點而言,較佳為N-乙烯基甲醯胺、N-乙烯基乙醯胺、N-乙烯基-ε-己內醯胺及1-乙烯基咪唑,就製品的運輸上的限制的觀點而言,尤佳為N-乙烯基甲醯胺、N-乙烯基乙醯胺及N-乙烯基-ε-己內醯胺。The monofunctional N-vinyl compound is a compound having an ethylenically unsaturated group bonded to an amine group, and the amine group can also form a carbonyl group and an amide bond. In this specification, such a monofunctional compound in which an amine group bonded to an ethylenically unsaturated group constitutes an amide bond is also referred to as a "monofunctional N-vinylamide compound". The monofunctional N-vinylamide compound is a preferable example of the monofunctional N-vinyl compound. Specific examples of monofunctional N-vinylamide compounds include N-vinylformamide, N-vinylacetamide, N-vinyl-ε-caprolactam, etc. Specific examples of monofunctional N-vinyl compounds other than monofunctional N-vinylamide compounds include 1-vinylimidazole and 9-vinylcarbazole. Among these compounds, N-vinylformamide, N-vinylacetamide, N-vinyl-ε-caprolactam, and 1-vinylimidazole are preferred from the viewpoint of ease of dissolution of the obtained ionizing radiation-cured product in an aqueous solution, and N-vinylformamide, N-vinylacetamide, and N-vinyl-ε-caprolactam are particularly preferred from the viewpoint of restrictions on product transportation.
聚合起始劑只要可藉由電離放射線的照射而生成自由基,且可使所述單官能型丙烯酸系化合物及單官能型N-乙烯基化合物的聚合反應開始,則種類並無限定。聚合起始劑的含量亦根據單官能型丙烯酸系化合物及單官能型N-乙烯基化合物的種類及含量以及聚合起始劑的種類而適宜設定。若進行不作限定的例示,則相對於聚合性組成物的全體量,聚合起始劑的含量較佳為0.1重量份~10重量份,更佳為0.1重量份~5重量份,尤佳為0.1重量份~4重量份。The type of the polymerization initiator is not limited as long as it can generate radicals by irradiation with ionizing radiation and can initiate the polymerization reaction of the monofunctional acrylic compound and the monofunctional N-vinyl compound. The content of the polymerization initiator is also appropriately set according to the type and content of the monofunctional acrylic compound and the monofunctional N-vinyl compound, and the type of the polymerization initiator. Without limitation, the content of the polymerization initiator is preferably 0.1 to 10 parts by weight, more preferably 0.1 to 5 parts by weight, and most preferably 0.1 to 4 parts by weight relative to the entire amount of the polymerizable composition.
作為聚合起始劑的具體例,可列舉:二苯甲酮、米其勒酮(Michler's ketone)、4,4'-雙(二乙基胺基)二苯甲酮、氧雜蒽酮、硫雜蒽酮、異丙基氧雜蒽酮、2,4-二乙基硫雜蒽酮、2-乙基蒽醌、苯乙酮、2-羥基-2-甲基苯丙酮、2-羥基-2-甲基-4'-異丙基苯丙酮、1-羥基環己基苯基酮、異丙基安息香醚、異丁基安息香醚、2,2-二乙氧基苯乙酮、2,2-二甲氧基-2-苯基苯乙酮、2,2-二甲氧基-1,2-二苯基乙烷-1-酮、樟腦醌、苯並蒽酮、2-羥基-1-[4-[4-(2-羥基-2-甲基-丙醯基)-苄基]苯基]-2-甲基-丙烷-1-酮、1-[4-(2-羥基乙氧基)-苯基]-2-羥基-2-甲基-1-丙烷-1-酮、2-羥基-2-甲基-1-苯基-丙烷-1-酮、2-甲基-1-[4-(甲硫基)苯基]-2-嗎啉基-1-丙酮、2-苄基-2-二甲基胺基-1-(4-嗎啉基苯基)-1-丁酮、2-二甲基胺基-2-(4-甲基苄基)-1-(4-嗎啉基苯基)-1-丁酮、氧基-苯基-乙酸2-(2-氧代-2-苯基-乙醯氧基-乙氧基)-乙基酯、氧基-苯基-乙酸2-(2-羥基-乙氧基)-乙基酯、氧基-苯基-乙酸2-(2-氧代-2-苯基-乙醯氧基-乙氧基)-乙基酯與氧基-苯基-乙酸2-(2-羥基-乙氧基)-乙基酯的混合物、苯基乙醛酸甲基酯、4-二甲基胺基苯甲酸乙酯、4-二甲基胺基苯甲酸異戊酯、4,4'-二(第三丁基過氧羰基)二苯甲酮、3,4,4'-三(第三丁基過氧羰基)二苯甲酮、3,3',4,4'-四(第三丁基過氧羰基)二苯甲酮、3,3',4,4'-四(第三己基過氧羰基)二苯甲酮、3,3'-二(甲氧羰基)-4,4'-二(第三丁基過氧羰基)二苯甲酮、3,4'-二(甲氧羰基)-4,3'-二(第三丁基過氧羰基)二苯甲酮、4,4'-二(甲氧羰基)-3,3'-二(第三丁基過氧羰基)二苯甲酮、2-(4'-甲氧基苯乙烯基)-4,6-雙(三氯甲基)-均三嗪、2-(3',4'-二甲氧基苯乙烯基)-4,6-雙(三氯甲基)-均三嗪、2-(2',4'-二甲氧基苯乙烯基)-4,6-雙(三氯甲基)-均三嗪、2-(2'-甲氧基苯乙烯基)-4,6-雙(三氯甲基)-均三嗪、2-(4'-戊氧基苯乙烯基)-4,6-雙(三氯甲基)-均三嗪、4-[對-N,N-二(乙氧基羰基甲基)]-2,6-二(三氯甲基)-均三嗪、1,3-雙(三氯甲基)-5-(2'-氯苯基)-均三嗪、1,3-雙(三氯甲基)-5-(4'-甲氧基苯基)-均三嗪、2-(對-二甲基胺基苯乙烯基)苯並噁唑、2-(對-二甲基胺基苯乙烯基)苯並噻唑、2-巰基苯並噻唑、3,3'-羰基雙(7-二乙基胺基香豆素)、2-(鄰氯苯基)-4,4',5,5'-四苯基-1,2'-聯咪唑、2,2'-雙(2-氯苯基)-4,4',5,5'-四(4-乙氧基羰基苯基)-1,2'-聯咪唑、2,2'-雙(2,4-二氯苯基)-4,4',5,5'-四苯基-1,2'-聯咪唑、2,2'-雙(2,4-二溴苯基)-4,4',5,5'-四苯基-1,2'-聯咪唑、2,2'-雙(2,4,6-三氯苯基)-4,4',5,5'-四苯基-1,2'-聯咪唑、3-(2-甲基-2-二甲基胺基丙醯基)咔唑、3,6-雙(2-甲基-2-嗎啉基丙醯基)-9-正十二烷基咔唑、1-羥基環己基苯基酮、雙(η5 -2,4-環戊二烯-1-基)-雙(2,6-二氟-3-(1Η-吡咯-1-基)-苯基)鈦、雙(2,4,6-三甲基苯甲醯基)苯基氧化膦及2,4,6-三甲基苯甲醯基二苯基氧化膦。該些化合物可單獨使用,混合使用兩種以上亦有效。其中,就相對於紫外發光二極體(ultraviolet-light emitting diode,UV-LED)光源的感度高、光硬化性的觀點而言,較佳為2-苄基-2-二甲基胺基-1-(4-嗎啉基苯基)-1-丁酮、2-二甲基胺基-2-(4-甲基苄基)-1-(4-嗎啉基苯基)-1-丁酮、2-甲基-1-[4-(甲硫基)苯基]-2-嗎啉基-1-丙酮、雙(2,4,6-三甲基苯甲醯基)-苯基氧化膦、2,4,6-三甲基苯甲醯基-二苯基-氧化膦。作為聚合起始劑的具體例,可列舉:二苯甲酮、米其勒酮(Michler's ketone)、4,4'-雙(二乙基胺基)二苯甲酮、氧雜蒽酮、硫雜蒽酮、異丙基氧雜蒽酮、2,4-二乙基硫雜蒽酮、2-乙基蒽醌、苯乙酮、2-羥基-2-甲基苯丙酮、2-羥基-2-甲基-4'-異丙基苯丙酮、1-羥基環己基苯基酮、異丙基安息香醚、異丁基安息香醚、2,2-二乙氧基苯乙酮、2,2-二甲氧基-2-苯基苯乙酮、2,2-二甲氧基-1,2-二苯基乙烷-1-酮、樟腦醌、苯並蒽酮、2-羥基-1-[4-[4-(2-羥基-2-甲基-丙醯基)-苄基]苯基]-2-甲基-丙烷-1-酮、1-[4-(2-羥基乙氧基)-苯基]-2-羥基-2-甲基-1-丙烷-1-酮、2-羥基-2-甲基-1-苯基-丙烷-1-酮、2-甲基-1-[4-(甲硫基)苯基]-2-嗎啉基-1-丙酮、2-苄基-2-二甲基胺基-1-(4-嗎啉基苯基)-1-丁酮、2-二甲基胺基-2-(4-甲基苄基)-1-(4-嗎啉基苯基)-1-丁酮、氧基-苯基-乙酸2-(2-氧代-2-苯基-乙醯氧基-乙氧基)-乙基酯、氧基-苯基-乙酸2-(2-羥基-乙氧基)-乙基酯、氧基-苯基-乙酸2-(2-氧代-2-苯基-乙醯氧基-乙氧基)-乙基酯與氧基-苯基-乙酸2-(2-羥基-乙氧基)-乙基酯的混合物、苯基乙醛酸甲基酯、4-二甲基胺基苯甲酸乙酯、4-二甲基胺基苯甲酸異戊酯、4,4'-二(第三丁基過氧羰基)二苯甲酮、3,4,4'-三(第三丁基過氧羰基)二苯甲酮、3,3',4,4'-四(第三丁基過氧羰基)二苯甲酮、3,3',4,4'-四(第三己基過氧羰基)二苯甲酮、3,3'-二(甲氧羰基)-4,4'-二(第三丁基過氧羰基)二苯甲酮、3,4'-二(甲氧羰基)-4,3'-二(第三丁基過氧羰基)二苯甲酮、4,4'-二(甲氧羰基)-3,3'-二(第三丁基過氧羰基)二苯甲酮、2-(4'-甲氧基苯乙烯基)-4,6-雙(三氯甲基)-均三嗪、2-(3',4'-二甲氧基苯乙烯基)-4,6-雙(三氯甲基)-均三嗪、2-(2',4'-二甲氧基苯乙烯基)-4,6-雙(三氯甲基)-均三嗪、2-(2'-甲氧基苯乙烯基)-4,6-雙(三氯甲基)-均三嗪、2-(4'-戊氧基苯乙烯基)-4,6-雙(三氯甲基)-均三嗪、4-[對-N,N-二(乙氧基羰基甲基)]-2,6-二(三氯甲基)-均三嗪、1,3-雙(三氯甲基)-5-(2'-氯苯基)-均三嗪、1,3-雙(三氯甲基)-5-(4'-甲氧基苯基)-均三嗪、2-(對-二甲基胺基苯乙烯基)苯並噁唑、2-(對-二甲基胺基苯乙烯基)苯並噻唑、2-巰基苯並噻唑、3,3'-羰基雙(7-二乙基胺基香豆素)、2-(鄰氯苯基)-4,4',5,5'-四苯基-1,2'-聯咪唑、2,2'-雙(2-氯苯基)-4,4',5,5'-四(4-乙氧基羰基苯基)-1,2'-聯咪唑、2,2'-雙(2,4-二氯苯基)-4,4',5,5'-四苯基-1,2'-聯咪唑、2,2'-雙(2,4-二溴苯基)-4,4',5,5'-四苯基-1,2'-聯咪唑、2,2'-雙(2,4,6-三氯苯基)-4,4',5,5'-四苯基-1,2'-聯咪唑、3-(2-甲基-2-二甲基胺基丙醯基)咔唑、3,6-雙(2-甲基-2-嗎啉基丙醯基)-9-正十二烷基咔唑、1-羥基環己基苯基酮、雙(η 5 -2,4-環戊二烯-1-基)-雙(2,6-二氟-3-(1Η-吡咯-1-基)-苯基)鈦、雙(2,4,6-三甲基苯甲醯基)苯基氧化膦及2,4,6-三甲基苯甲醯基二苯基氧化膦。 These compounds may be used alone, or two or more of them may be used in combination. Among them, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-1-butanone, 2-dimethylamino-2-(4-methylbenzyl)-1-(4-morpholinophenyl)-1-butanone, 2-methyl-1-[4-(methylthio) are preferred from the standpoint of high sensitivity to an ultraviolet-light emitting diode (UV-LED) light source and photocurability. Phenyl]-2-morpholinyl-1-propanone, bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide, 2,4,6-trimethylbenzoyl-diphenyl-phosphine oxide.
就將電離放射線硬化物的形成步驟簡化的觀點而言,本實施形態的聚合性組成物亦可實質上不含有揮發性溶劑,但就對聚合性組成物的黏度進行調整的觀點等而言,亦可含有揮發性溶劑。揮發性溶劑在使用時可與其他組成物混合而構成聚合性組成物。在聚合性組成物含有揮發性溶劑的情況下,揮發性溶劑可在聚合性組成物未硬化的狀態下開始揮發,較佳為藉由在電離放射線的照射之前、中途、及/或之後適宜進行加熱而至少在形成了電離放射線硬化物的階段中揮發。若在聚合性組成物已以某程度硬化的狀態下仍過度殘留未揮發的溶劑,則最終的硬化物(電離放射線硬化物)具有多孔的結構,有機械強度降低的情況。因此,相對於聚合性組成物全體,揮發性溶劑的含量較佳為30質量%以下。From the viewpoint of simplifying the formation steps of the ionizing radiation-cured product, the polymerizable composition of this embodiment may not contain a volatile solvent substantially, but may contain a volatile solvent from the viewpoint of adjusting the viscosity of the polymerizable composition. When used, the volatile solvent can be mixed with other components to form a polymerizable composition. When the polymerizable composition contains a volatile solvent, the volatile solvent can start to volatilize when the polymerizable composition is not hardened, and it is preferable to volatilize at least in the stage where the ionizing radiation-cured product is formed by appropriately heating before, during, and/or after irradiation of ionizing radiation. If the unvolatilized solvent remains excessively in the state where the polymerizable composition is cured to some extent, the final cured product (ionizing radiation cured product) has a porous structure, and the mechanical strength may decrease. Therefore, the content of the volatile solvent is preferably 30% by mass or less with respect to the entire polymerizable composition.
作為揮發性溶劑的具體例,可列舉:二乙基醚、四氫呋喃、二苯基醚、二甲氧基苯、丙酮、甲醇、乙醇、異丙醇、丁醇、第三丁醇、苄基醇、甲基乙基酮、甲基異丁基酮、乙腈、丙腈、苄腈、碳酸伸乙酯、碳酸伸丙酯、乙酸乙基酯、乙酸異丁基酯、乙酸丁基酯、丙酸丁基酯、乳酸乙基酯、氧基乙酸甲基酯、氧基乙酸乙基酯、氧基乙酸丁基酯、甲氧基乙酸甲基酯、甲氧基乙酸乙基酯、甲氧基乙酸丁基酯、乙氧基乙酸甲基酯、乙氧基乙酸乙基酯、3-氧基丙酸甲基酯、3-氧基丙酸乙基酯、3-甲氧基丙酸甲基酯、3-甲氧基丙酸乙基酯、3-乙氧基丙酸甲基酯、3-乙氧基丙酸乙基酯、2-氧基丙酸甲基酯、2-氧基丙酸乙基酯、2-氧基丙酸丙基酯、2-甲氧基丙酸甲基酯、2-甲氧基丙酸乙基酯、2-甲氧基丙酸丙基酯、2-乙氧基丙酸甲基酯、2-乙氧基丙酸乙基酯、2-氧基-2-甲基丙酸甲基酯、2-氧基-2-甲基丙酸乙基酯、2-甲氧基-2-甲基丙酸甲基酯、2-乙氧基-2-甲基丙酸乙基酯、丙酮酸甲基酯、丙酮酸乙基酯、丙酮酸丙基酯、乙醯乙酸甲基酯、乙醯乙酸乙基酯、2-氧代丁酸甲基酯、2-氧代丁酸乙基酯、2-羥基異丁酸甲基酯、二噁烷、乙二醇、乙二醇單甲基醚、乙二醇單乙基醚、二乙二醇、三乙二醇、丙二醇、二丙二醇、三丙二醇、1,4-丁二醇、乙二醇單異丙基醚、乙二醇單丁基醚、丙二醇單甲基醚、丙二醇單甲基醚乙酸酯、丙二醇單乙基醚、丙二醇單乙基醚乙酸酯、丙二醇單丙基醚乙酸酯、二丙二醇單乙基醚乙酸酯、二丙二醇單丁基醚乙酸酯、乙二醇單丁基醚乙酸酯、環己酮、環戊酮、二乙二醇單甲基醚、二乙二醇單甲基醚乙酸酯、二乙二醇單乙基醚、二乙二醇單乙基醚乙酸酯、二乙二醇單丁基醚、二乙二醇單丁基醚乙酸酯、二乙二醇二甲基醚、二乙二醇二乙基醚、二乙二醇乙基甲基醚、四乙二醇二甲基醚、甲苯、二甲苯、苯甲醚、γ-丁內酯、N,N-二甲基乙醯胺、N,N-二甲基甲醯胺、N-甲基-2-吡咯啶酮及二甲基咪唑啉酮等。該些化合物可單獨使用,混合使用兩種以上亦有效。Specific examples of volatile solvents include diethyl ether, tetrahydrofuran, diphenyl ether, dimethoxybenzene, acetone, methanol, ethanol, isopropanol, butanol, tertiary butanol, benzyl alcohol, methyl ethyl ketone, methyl isobutyl ketone, acetonitrile, propionitrile, benzonitrile, ethylene carbonate, propylene carbonate, ethyl acetate, isobutyl acetate, butyl acetate, butyl propionate, ethyl lactate, methyl oxyacetate, oxyethyl acetate Ethyl oxyacetate, butyl oxyacetate, methyl methoxyacetate, ethyl methoxyacetate, butyl methoxyacetate, methyl ethoxyacetate, ethyl ethoxyacetate, methyl 3-oxypropionate, ethyl 3-oxypropionate, methyl 3-methoxypropionate, ethyl 3-methoxypropionate, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, methyl 2-oxypropionate, ethyl 2-oxypropionate, 2 -Propyl oxypropionate, methyl 2-methoxypropionate, ethyl 2-methoxypropionate, propyl 2-methoxypropionate, methyl 2-ethoxypropionate, ethyl 2-ethoxypropionate, methyl 2-oxy-2-methylpropionate, ethyl 2-oxy-2-methylpropionate, methyl 2-methoxy-2-methylpropionate, ethyl 2-ethoxy-2-methylpropionate, methyl pyruvate, ethyl pyruvate, acetone Propyl Acetate, Methyl Acetate, Ethyl Acetate, Methyl 2-Oxobutyrate, Ethyl 2-Oxobutyrate, Methyl 2-Hydroxyisobutyrate, Dioxane, Ethylene Glycol, Ethylene Glycol Monomethyl Ether, Ethylene Glycol Monoethyl Ether, Diethylene Glycol, Triethylene Glycol, Propylene Glycol, Dipropylene Glycol, Tripropylene Glycol, 1,4-Butanediol, Ethylene Glycol Monoisopropyl Ether, Ethylene Glycol Monobutyl Ether , propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether, propylene glycol monoethyl ether acetate, propylene glycol monopropyl ether acetate, dipropylene glycol monoethyl ether acetate, dipropylene glycol monobutyl ether acetate, ethylene glycol monobutyl ether acetate, cyclohexanone, cyclopentanone, diethylene glycol monomethyl ether, diethylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether, diethylene glycol monoethyl ether acetate, Diethylene glycol monobutyl ether, diethylene glycol monobutyl ether acetate, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol ethyl methyl ether, tetraethylene glycol dimethyl ether, toluene, xylene, anisole, γ-butyrolactone, N,N-dimethylacetamide, N,N-dimethylformamide, N-methyl-2-pyrrolidone and dimethylimidazolinone, etc. These compounds may be used alone, or two or more of them may be used in combination.
本實施形態的聚合性組成物亦可包含所述成分以外的成分作為其他添加劑。作為其他添加劑的具體例,可列舉界面活性劑、聚合抑制劑、塑化劑、抗氧化劑、紫外線吸收劑、抗靜電劑、阻燃劑、阻燃助劑、填充劑、顏料、染料等,但在不脫離本發明的主旨的範圍內,只要可與其他成分均勻地混合,且可適當地硬化,則並無特別限定。作為具體例,可列舉包含氧化矽粒子等透光性粒子的填充劑。此種填充劑可在不妨礙聚合性組成物的硬化的情況下提高電離放射線硬化物的機械強度。The polymerizable composition of this embodiment may contain components other than the above-mentioned components as other additives. Specific examples of other additives include surfactants, polymerization inhibitors, plasticizers, antioxidants, ultraviolet absorbers, antistatic agents, flame retardants, flame retardant aids, fillers, pigments, dyes, etc., but are not particularly limited as long as they can be uniformly mixed with other components and can be properly cured without departing from the scope of the present invention. As a specific example, a filler containing light-transmitting particles such as silicon oxide particles may be mentioned. Such a filler can improve the mechanical strength of the ionizing radiation-cured product without hindering the curing of the polymerizable composition.
本實施形態的聚合性組成物在使用時藉由塗佈、滴加等而被供給至基材上,藉此,聚合性組成物在基材上具有膜狀的形狀或者既定的圖案。就提高如此般向基材上供給聚合性組成物的容易度的觀點而言,有本實施形態的聚合性組成物的25℃下的黏度較佳為100 mPa・s以下的情況。尤其在利用噴墨列印機來進行聚合性組成物向基材上的供給的情況下,較佳為滿足所述黏度範圍。進而,包含本實施形態的聚合性組成物的噴墨用墨水的噴出溫度(例如60℃)下的黏度較佳為15 mPa・s以下,尤佳為10 mPa・s以下。The polymerizable composition of this embodiment is supplied onto the substrate by coating, dripping, etc. during use, whereby the polymerizable composition has a film-like shape or a predetermined pattern on the substrate. In some cases, the viscosity at 25° C. of the polymerizable composition of the present embodiment is preferably 100 mPa·s or less from the viewpoint of improving the ease of supplying the polymerizable composition onto the substrate in this way. In particular, when the polymerizable composition is supplied onto the substrate using an inkjet printer, it is preferable to satisfy the above viscosity range. Furthermore, the inkjet ink containing the polymerizable composition of the present embodiment has a viscosity at a discharge temperature (for example, 60° C.) of preferably 15 mPa·s or less, particularly preferably 10 mPa·s or less.
本實施形態的聚合性組成物藉由照射電離放射線而硬化並成為電離放射線硬化物。所述電離放射線硬化物即使在大氣中以150℃加熱2小時後亦可溶於水系溶解液中。水系溶解液為含有水的溶解液,可由水構成,但較佳為與極性溶媒的混合溶媒,更佳為醇之類的質子性極性溶媒與水的混合液。就提高混合液的均勻性的觀點等而言,醇較佳為在水中的溶解度高,即具有相對於水的混和性。水系溶解液中的水的含量根據水系溶解液所含有的水以外的成分的種類、或電離放射線硬化物的組成而適宜設定。在水系溶解液包含水與醇的混合液即水-醇混合液的情況下,當水-醇混合液所含的醇包含乙醇或異丙醇之類的碳數4以下的物質時,醇的含量有時較佳為25體積%以上、90體積%以下,有時更佳為50體積%以上、85體積%以下,有時尤佳為70體積%以上、80體積%以下。The polymerizable composition of this embodiment is cured by irradiation with ionizing radiation to become an ionizing radiation cured product. The ionizing radiation-cured product is soluble in an aqueous solution even after being heated at 150° C. for 2 hours in the air. The aqueous solution is a solution containing water and may be composed of water, but is preferably a mixed solvent with a polar solvent, more preferably a mixed solution of a protic polar solvent such as alcohol and water. From the viewpoint of improving the uniformity of the mixed solution, etc., the alcohol preferably has a high solubility in water, that is, has miscibility with water. The content of water in the aqueous solution is appropriately set according to the types of components other than water contained in the aqueous solution or the composition of the ionizing radiation-cured product. When the water-based solution contains a mixture of water and alcohol, that is, a water-alcohol mixture, when the alcohol contained in the water-alcohol mixture contains a substance with a carbon number of 4 or less such as ethanol or isopropanol, the alcohol content is sometimes preferably 25% by volume or more and 90% by volume or less, sometimes more preferably 50% by volume or more and 85% by volume or less, and sometimes preferably 70% by volume or more and 80% by volume or less.
水系溶解液亦可含有醇以外的有機溶媒。作為此種有機溶媒,例示N-甲基吡咯啶酮、丙酮、乙腈、二甲基亞碸等非質子性的有機溶媒。就降低環境負荷的觀點而言,關於水系溶解液中的醇以外的有機溶媒的含量,較佳為以水系溶解液全體的20體積%以下而含有。The aqueous solution may contain organic solvents other than alcohol. Examples of such organic solvents include aprotic organic solvents such as N-methylpyrrolidone, acetone, acetonitrile, and dimethylsulfoxide. From the viewpoint of reducing the environmental load, the content of organic solvents other than alcohol in the aqueous solution is preferably 20% by volume or less of the entire aqueous solution.
水系溶解液有較佳為無鹼、即非鹼的情況。在為了使水系溶解液成為鹼性而水系溶解液含有氫氧化鈉等無機鹼性物質或氫氧化四甲基銨等有機鹼性物質的情況下,水系溶解液的處理性有時亦降低。再者,一般的鹼系溶解液的pH為9以上,因此在本說明書中,所謂無鹼水系溶解液是指pH小於9。就更確實地為無鹼的觀點而言,水系溶解液的pH較佳為8以下,更佳為7.5以下。The water-based solution may preferably be non-alkali, that is, non-alkali. When the aqueous solution contains an inorganic alkaline substance such as sodium hydroxide or an organic alkaline substance such as tetramethylammonium hydroxide in order to make the aqueous solution alkaline, the handling properties of the aqueous solution may also decrease. Furthermore, the pH of a general alkali-based solution is 9 or more, so in this specification, the so-called non-alkali water-based solution means a pH of less than 9. The pH of the aqueous solution is preferably at most 8, more preferably at most 7.5, from the viewpoint of being more reliably alkali-free.
本實施形態的電離放射線硬化物即使被加熱,亦不易發生形狀變化。若列舉具體例,則在本實施形態的電離放射線硬化物具有形成於玻璃基板上的厚度13 μm~18 μm的膜形狀的情況下,即使在大氣中以150℃加熱2小時,由(熱處理後的厚度)/(熱處理前的厚度)定義的殘膜率亦為80%以上,在較佳的一例中為85%以上,在更佳的一例中為90%以上。因此,即使在包含電離放射線硬化物的可溶性構件受到加熱的情況下,可溶性構件的形狀亦不易變化。The ionizing radiation cured product of this embodiment is less likely to change in shape even when heated. As a specific example, when the ionizing radiation cured product of this embodiment has a film shape with a thickness of 13 μm to 18 μm formed on a glass substrate, even if it is heated at 150° C. for 2 hours in the air, the residual film ratio defined by (thickness after heat treatment)/(thickness before heat treatment) is 80% or more, in a preferable example, it is 85% or more, and in a more preferable example, it is 90% or more. Therefore, even in the case where the soluble member including the ionizing radiation cured product is heated, the shape of the soluble member is less likely to change.
以下,對使用本實施形態的聚合性組成物製造立體造形物的方法進行說明。對本實施形態的聚合性組成物照射電離放射線而獲得的電離放射線硬化物如上所述,即使在以150℃左右加熱2小時的情況下,亦可適當地維持相對於水系溶解液的溶解性,因此可用作耐熱性可溶構件。因此,當進行使用聚合性組成物來形成立體的結構物的立體造形時,作為對處於製造過程的結構物進行承載的支撐部,較佳為包含本實施形態的電離放射線硬化物的耐熱性可溶構件。Hereinafter, a method for producing a three-dimensional shaped object using the polymerizable composition of this embodiment will be described. As described above, the ionizing radiation-cured product obtained by irradiating the polymerizable composition of this embodiment with ionizing radiation can properly maintain solubility in an aqueous solution even when heated at about 150° C. for 2 hours, so it can be used as a heat-resistant soluble member. Therefore, when three-dimensional modeling is performed using a polymerizable composition to form a three-dimensional structure, a heat-resistant soluble member including the ionizing radiation-cured product of this embodiment is preferable as a support portion for supporting the structure during manufacture.
具體而言,立體結構物的製造方法包括以下的造形步驟以及去除步驟,視需要更包括加熱步驟。Specifically, the manufacturing method of the three-dimensional structure includes the following forming steps and removing steps, and further includes a heating step if necessary.
首先,在造形步驟中,使用用以形成本體部的第一液狀組成物及用以形成支撐部的第二液狀組成物,藉由積層造形法來形成處於本體部由支撐部支撐的狀態的帶支撐部的立體結構物,所述本體部提供藉由立體造形而最終獲得的立體造形物,所述支撐部承載所述本體部。First, in the shaping step, using the first liquid composition for forming the body part and the second liquid composition for forming the support part, a three-dimensional structure with a support part in a state where the body part is supported by the support part is formed by a build-up molding method, the body part provides a three-dimensional shape finally obtained by three-dimensional modeling, and the support part carries the body part.
第一液狀組成物含有:在積層造形法中通常使用的具有多個乙烯性不飽和鍵的多官能型聚合性物質、以及相對於用於硬化的電離放射線(例如來自LED燈的光)而具有適當的感度的聚合起始劑。第一液狀組成物視需要可含有填充劑(可列舉氧化矽或二氧化鈦等無機粒子作為具體例),亦可含有塗料或顏料等而經著色。第二液狀組成物包含前文所述的本實施形態的聚合性組成物。The first liquid composition contains: a polyfunctional polymerizable substance having a plurality of ethylenically unsaturated bonds generally used in a build-up method, and a polymerization initiator having appropriate sensitivity to ionizing radiation used for curing (for example, light from an LED lamp). The first liquid composition may contain a filler as necessary (specific examples include inorganic particles such as silicon oxide and titanium dioxide), and may be colored by containing a paint or a pigment. The second liquid composition contains the polymerizable composition of the present embodiment described above.
就製造製程的簡化的觀點而言,較佳為第一液狀組成物的圖案及第二液狀組成物的圖案均藉由噴墨列印機而形成。藉由對第一液狀組成物的圖案及第二液狀組成物的圖案照射電離放射線,第一液狀組成物的圖案成為形成本體部的硬化物,第二液狀組成物的圖案成為形成支撐部的硬化物(耐熱性可溶構件)。From the viewpoint of simplification of the manufacturing process, it is preferable that both the pattern of the first liquid composition and the pattern of the second liquid composition are formed by an inkjet printer. By irradiating the pattern of the first liquid composition and the pattern of the second liquid composition with ionizing radiation, the pattern of the first liquid composition becomes a cured product forming the body portion, and the pattern of the second liquid composition becomes a cured product (heat-resistant soluble member) forming the support portion.
在如此般藉由積層造形法而獲得包含本體部及對該本體部進行承載的支撐部的帶支撐部的立體結構物後,進行對帶支撐部的立體結構物進行加熱而使本體部的物性變化的加熱步驟。作為該情況下的物性的具體例,具體而言可列舉彎曲剛性等機械特性。如上所述,用以形成本體部的第一液狀組成物具有聚合性物質,因此,藉由對利用電離放射線的照射而獲得的硬化物進行加熱,可進一步推進聚合的程度,從而提高所述機械特性。如此般藉由加熱而本體部的機械特性提昇,結果本體部的剛性可提高至無需藉由支撐部的支撐的程度。藉由利用例如批量處理來進行此種本體部的後硬化,可縮短積層造形法所需的作業時間,從而亦有立體造形物的生產性提高的情況。After obtaining a three-dimensional structure with a support including a main body and a support for supporting the main body by the build-up method in this way, a heating step is performed to change the physical properties of the main body by heating the three-dimensional structure with a support. Specific examples of physical properties in this case include mechanical properties such as bending rigidity. As described above, the first liquid composition for forming the main body has a polymerizable substance. Therefore, by heating the cured product obtained by irradiation with ionizing radiation, the degree of polymerization can be further advanced, thereby improving the mechanical properties. In this way, the mechanical properties of the main body portion are improved by heating, and as a result, the rigidity of the main body portion can be increased to such an extent that no support by the support portion is required. By performing such post-hardening of the body portion by, for example, batch processing, the work time required for the build-up method can be shortened, and the productivity of three-dimensional shaped objects may be improved.
最後,進行去除步驟,所述去除步驟利用水系溶解液將帶支撐部的立體結構物的支撐部溶解去除,獲得基於本體部的立體造形物。在去除步驟中,使所述水系溶解液與帶支撐部的立體結構物接觸(具體而言,使帶支撐部的立體結構物浸漬於裝入有水系溶解液的容器中;或者對帶支撐部的立體結構物噴附水系溶解液即可),藉此僅支撐部選擇性地溶解,獲得基於本體部的立體結構物來作為立體造形物。Finally, a removal step is carried out. The removal step uses an aqueous solution to dissolve and remove the support portion of the three-dimensional structure with the support portion to obtain a three-dimensional shape based on the main body. In the removal step, the aqueous solution is brought into contact with the three-dimensional structure with the support (specifically, the three-dimensional structure with the support is immersed in a container containing the aqueous solution; or the three-dimensional structure with the support is sprayed with the aqueous solution), whereby only the support is selectively dissolved, and the three-dimensional structure based on the main body is obtained as a three-dimensional shape.
參照所述實施形態對本發明進行了說明,但本發明並不限定於所述實施形態,可出於改良的目的或在本發明的思想範圍內進行改良或變更。例如,在本體部包括具有開口的中空部的情況下,若以填充所述中空部的至少一部分的方式配置本發明的聚合性組成物的電離放射線硬化物(耐熱性可溶構件)而用來防護構成中空部的壁部的破損,則該耐熱性可溶構件為本發明的一實施形態的支撐部。Although the present invention has been described with reference to the above-mentioned embodiments, the present invention is not limited to the above-mentioned embodiments, and may be improved or changed for the purpose of improvement or within the scope of the idea of the present invention. For example, in the case where the main body includes a hollow portion having an opening, if the ionizing radiation-cured product (heat-resistant soluble member) of the polymerizable composition of the present invention is disposed so as to fill at least a part of the hollow portion to protect the wall constituting the hollow portion from damage, then the heat-resistant soluble member is a support portion in one embodiment of the present invention.
或者,亦可將本實施形態的耐熱性可溶構件用作保護材或暫時固定材。例如,藉由在擔心因與其他構件的碰撞而產生裂紋、缺口等缺損部的構件的表面設置本實施形態的耐熱性可溶構件作為保護材,可保護所述構件不發生缺損。另外,作為另一例,對具有擔心當賦予外力時容易移位而與構件中的其他部位發生碰撞的部位(作為具體例,可列舉舌狀體或隔板)的構件,使用本實施形態的耐熱性可溶構件對該部位進行暫時固定,以抑制該部位的移位,藉此,該構件即使被置於運輸等的賦予了外力的狀態下,亦不易發生破損。如此般經保護・暫時固定的構件若不再需要保護或暫時固定,則可藉由將本實施形態的耐熱性可溶構件溶解去除而適當地發揮原本的功能。 [實施例]Alternatively, the heat-resistant soluble member of this embodiment can also be used as a protective material or a temporary fixing material. For example, by providing the heat-resistant soluble member of the present embodiment as a protective material on the surface of a member that may be damaged by a collision with another member, the member can be protected from damage. In addition, as another example, for a member having a part that is likely to be displaced when an external force is applied and collides with other parts of the member (as a specific example, a tongue or a partition can be mentioned), the heat-resistant soluble member of this embodiment is used to temporarily fix the part to suppress the displacement of the part, whereby the member is less likely to be damaged even if it is placed in a state where an external force is applied such as transportation. If the member thus protected and temporarily fixed no longer needs protection or temporary fixation, it can properly perform its original function by dissolving and removing the heat-resistant soluble member of this embodiment. [Example]
以下,藉由實施例等對本發明進一步進行具體說明,但本發明的範圍並不限定於該些實施例等。Hereinafter, although an Example etc. demonstrate this invention more concretely, the scope of the present invention is not limited to these Examples etc.
(實施例1) 製備含有作為單官能型丙烯酸系化合物的一種即單官能型丙烯醯胺化合物的丙烯醯基嗎啉(acryloylmorpholine,ACMO)7.06質量份、作為單官能型N-乙烯基化合物的N-乙烯基甲醯胺(N-vinyl formamide,NVF)3.55質量份、作為聚合起始劑的豔佳固(IRGACURE)379EG(巴斯夫(BASF)公司製造,以下簡稱為「IRG379」)1.27質量份、以及作為界面活性劑的畢克(BYK)342(日本畢克化學(BYK Chemie Japan)公司製造)0.0053質量份的樹脂組成物。在樹脂組成物中,單官能型丙烯酸系化合物與單官能型N-乙烯基化合物為等莫耳(莫耳比為1:1)。在以下的其他實施例及比較例中,以樹脂組成物所含有的具有乙烯性不飽和鍵的兩種化合物各自的化合物的乙烯性不飽和鍵的數量彼此相等的方式(以官能基數計而成為等莫耳的方式),設定樹脂組成物中的各化合物的含量。在樹脂組成物中,聚合起始劑為相當於單官能型丙烯酸系化合物與單官能型N-乙烯基化合物的合計質量份的12%的量,界面活性劑為相當於單官能型丙烯酸系化合物與單官能型N-乙烯基化合物的合計質量份的500 ppm的量。在以下的其他實施例及比較例中,聚合起始劑的含量及界面活性劑的含量亦分別以滿足所述合計質量份的關係的方式設定。所獲得的樹脂組成物的25℃下的黏度為10.4 mPa・s,在30℃下為8.8 mPa・s。因此,實施例1的樹脂組成物若為30℃以上,則作為噴墨用的墨水而尤佳。(Example 1) Prepare 7.06 parts by mass of acryloylmorpholine (ACMO), which is a monofunctional acrylamide compound as a monofunctional acrylic compound, 3.55 parts by mass of N-vinyl formamide (NVF) as a monofunctional N-vinyl compound, and IRGACURE 379EG (manufactured by BASF) as a polymerization initiator. , hereinafter referred to as “IRG379”) 1.27 parts by mass, and BYK 342 (manufactured by BYK Chemie Japan) as a surfactant 0.0053 parts by mass of the resin composition. In the resin composition, the monofunctional acrylic compound and the monofunctional N-vinyl compound are equimolar (the molar ratio is 1:1). In the following other examples and comparative examples, the content of each compound in the resin composition was set so that the number of ethylenically unsaturated bonds in the respective compounds of the two compounds having ethylenically unsaturated bonds contained in the resin composition were equal to each other (equimolar in terms of the number of functional groups). In the resin composition, the polymerization initiator is an amount corresponding to 12% of the total parts by mass of the monofunctional acrylic compound and the monofunctional N-vinyl compound, and the surfactant is an amount corresponding to 500 ppm of the total parts by mass of the monofunctional acrylic compound and the monofunctional N-vinyl compound. In the following other examples and comparative examples, the content of the polymerization initiator and the content of the surfactant were respectively set so as to satisfy the relationship of the total parts by mass described above. The viscosity of the obtained resin composition was 10.4 mPa·s at 25°C and 8.8 mPa·s at 30°C. Therefore, if the resin composition of Example 1 is 30 degreeC or more, it is especially preferable as the ink for inkjet.
(實施例2) 製備含有作為單官能型丙烯酸系化合物的一種即單官能型丙烯醯胺化合物的丙烯醯基嗎啉(ACMO)7.06質量份、作為單官能型N-乙烯基化合物的N-乙烯基-ε-己內醯胺(N-vinyl caprolactam,NVC)6.96質量份、作為聚合起始劑的IRG379 1.68質量份、以及作為界面活性劑的畢克(BYK)342 0.0070質量份的樹脂組成物。所獲得的樹脂組成物的25℃下的黏度為10.8 mPa・s,在30℃下為9.0 mPa・s。因此,實施例2的樹脂組成物若為30℃以上,則作為噴墨用的墨水而尤佳。(Example 2) Prepare 7.06 parts by mass of acrylylmorpholine (ACMO) which is a monofunctional acrylamide compound as a monofunctional acrylic compound, 6.96 parts by mass of N-vinyl-ε-caprolactam (NVC) as a monofunctional N-vinyl compound, 1.68 parts by mass of IRG379 as a polymerization initiator, and BYK 34 as a surfactant 2 0.0070 parts by mass of the resin composition. The viscosity of the obtained resin composition was 10.8 mPa·s at 25°C and 9.0 mPa·s at 30°C. Therefore, if the resin composition of Example 2 is 30 degreeC or more, it is especially preferable as the ink for inkjet.
(實施例3) 製備含有作為單官能型丙烯酸系化合物的一種即單官能型丙烯醯胺化合物的丙烯醯基嗎啉(ACMO)7.06質量份、作為單官能型N-乙烯基化合物的N-乙烯基乙醯胺(N-vinyl acetamide,NVAc)4.26質量份、作為聚合起始劑的IRG379 1.36質量份、以及作為界面活性劑的畢克(BYK)342 0.0057質量份的樹脂組成物。所獲得的樹脂組成物的25℃下的黏度為6.8 mPa・s。因此,實施例3的樹脂組成物若為25℃以上,則作為噴墨用的墨水而尤佳。(Example 3) Prepare 7.06 parts by mass of acryl morpholine (ACMO), which is a monofunctional acrylamide compound as a monofunctional acrylic compound, 4.26 parts by mass of N-vinyl acetamide (NVAc) as a monofunctional N-vinyl compound, 1.36 parts by mass of IRG379 as a polymerization initiator, and BYK 342 0. 0057 parts by mass of the resin composition. The viscosity at 25° C. of the obtained resin composition was 6.8 mPa·s. Therefore, if the resin composition of Example 3 is 25 degreeC or more, it is especially preferable as the ink for inkjet.
(實施例4) 製備含有作為單官能型丙烯酸系化合物的一種即單官能型丙烯醯胺化合物的丙烯醯基嗎啉(ACMO)7.06質量份、作為單官能型N-乙烯基化合物的N-乙烯基咪唑(N-vinyl imidazole,NVIM)4.71質量份、作為聚合起始劑的IRG379 1.41質量份、以及作為界面活性劑的畢克(BYK)342 0.0059質量份的樹脂組成物。所獲得的樹脂組成物的25℃下的黏度為7.5 mPa・s。因此,實施例4的樹脂組成物若為25℃以上,則作為噴墨用的墨水而尤佳。(Example 4) Prepare 7.06 parts by mass of acryl morpholine (ACMO) which is a monofunctional acrylamide compound as a monofunctional acrylic compound, 4.71 parts by mass of N-vinyl imidazole (N-vinyl imidazole, NVIM) as a monofunctional N-vinyl compound, 1.41 parts by mass of IRG379 as a polymerization initiator, and BYK 342 0.005 as a surfactant 9 parts by mass of the resin composition. The viscosity at 25° C. of the obtained resin composition was 7.5 mPa·s. Therefore, if the resin composition of Example 4 is 25 degreeC or more, it is especially preferable as the ink for inkjet.
(實施例5) 製備含有作為單官能型丙烯酸系化合物的4-羥基丁基丙烯酸酯(4-hydroxybutyl acrylate,4HBA)7.21質量份、作為單官能型N-乙烯基化合物的N-乙烯基甲醯胺(NVF)3.55質量份、作為聚合起始劑的IRG379 1.29質量份、以及作為界面活性劑的畢克(BYK)342 0.0054質量份的樹脂組成物。所獲得的樹脂組成物的25℃下的黏度為9.0 mPa・s。因此,實施例5的樹脂組成物若為25℃以上,則作為噴墨用的墨水而尤佳。(Example 5) A resin composition containing 7.21 parts by mass of 4-hydroxybutyl acrylate (4HBA) as a monofunctional acrylic compound, 3.55 parts by mass of N-vinylformamide (NVF) as a monofunctional N-vinyl compound, 1.29 parts by mass of IRG379 as a polymerization initiator, and 0.0054 parts by mass of BYK 342 as a surfactant thing. The viscosity at 25° C. of the obtained resin composition was 9.0 mPa·s. Therefore, if the resin composition of Example 5 is 25 degreeC or more, it is especially preferable as the ink for inkjet.
(實施例6) 製備含有作為單官能型丙烯酸系化合物的一種即單官能型丙烯醯胺化合物的二乙基丙烯醯胺(二乙烯基乙醯乙醯胺(diethyl acetoacetamide,DEAA))6.36質量份、作為單官能型N-乙烯基化合物的N-乙烯基甲醯胺(NVF)3.55質量份、作為聚合起始劑的IRG379 1.19質量份、以及作為界面活性劑的畢克(BYK)342 0.0050質量份的樹脂組成物。所獲得的樹脂組成物的25℃下的黏度為3.7 mPa・s。因此,實施例6的樹脂組成物若為25℃以上,則作為噴墨用的墨水而尤佳。(Example 6) Prepared are 6.36 parts by mass of diethylacrylamide (diethyl acetoacetamide, DEAA) which is a monofunctional acrylamide compound as a monofunctional acrylic compound, 3.55 parts by mass of N-vinylformamide (NVF) as a monofunctional N-vinyl compound, 1.19 parts by mass of IRG379 as a polymerization initiator, and Surfactant BYK (BYK) 342 0.0050 parts by mass of the resin composition. The viscosity at 25° C. of the obtained resin composition was 3.7 mPa·s. Therefore, if the resin composition of Example 6 is 25 degreeC or more, it is especially preferable as the ink for inkjet.
(比較例1) 製備含有作為單官能型丙烯酸系化合物的一種即單官能型丙烯醯胺化合物的丙烯醯基嗎啉(ACMO)7.06質量份、作為單官能型丙烯酸系化合物的4-羥基丁基丙烯酸酯(4HBA)7.21質量份、作為聚合起始劑的IRG379 1.71質量份、以及作為界面活性劑的畢克(BYK)342 0.0071質量份的樹脂組成物。所獲得的樹脂組成物的25℃下的黏度為12.8 mPa・s,在40℃下為7.9 mPa・s。因此,比較例1的樹脂組成物若為40℃以上,則作為噴墨用的墨水而尤佳。(comparative example 1) A resin composition was prepared containing 7.06 parts by mass of acrylmorpholine (ACMO) which is a monofunctional acrylamide compound which is a monofunctional acrylic compound, 7.21 parts by mass of 4-hydroxybutyl acrylate (4HBA) which is a monofunctional acrylic compound, 1.71 parts by mass of IRG379 as a polymerization initiator, and 0.0071 parts by mass of BYK 342 as a surfactant. The viscosity of the obtained resin composition was 12.8 mPa·s at 25°C and 7.9 mPa·s at 40°C. Therefore, the resin composition of Comparative Example 1 is particularly preferable as an inkjet ink if the temperature is 40° C. or higher.
(比較例2) 製備含有作為單官能型丙烯酸系化合物的一種即單官能型丙烯醯胺化合物的丙烯醯基嗎啉(ACMO)7.06質量份、作為二官能型丙烯酸系化合物的聚乙二醇#400二丙烯酸酯(9EG-A)6.53質量份、作為聚合起始劑的IRG379 1.21質量份、以及作為界面活性劑的畢克(BYK)342 0.0071質量份的樹脂組成物。以官能基的數量變得相等的方式將樹脂組成物中的單官能型丙烯酸系化合物與二官能型丙烯酸系化合物的莫耳比設為1:0.5。所獲得的樹脂組成物的25℃下的黏度為52.8 mPa・s,在60℃下為14.9 mPa・s。因此,比較例2的樹脂組成物若為60℃以上,則作為噴墨用的墨水而尤佳。(comparative example 2) Prepared a resin composition containing 7.06 parts by mass of acryl morpholine (ACMO) which is a monofunctional acrylamide compound as a monofunctional acrylic compound, 6.53 parts by mass of polyethylene glycol #400 diacrylate (9EG-A) as a difunctional acrylic compound, 1.21 parts by mass of IRG379 as a polymerization initiator, and 0.0071 parts by mass of BYK 342 as a surfactant things. The molar ratio of the monofunctional type acrylic compound and the bifunctional type acrylic compound in a resin composition was set to 1:0.5 so that the number of functional groups might become equal. The viscosity of the obtained resin composition was 52.8 mPa·s at 25°C and 14.9 mPa·s at 60°C. Therefore, the resin composition of Comparative Example 2 is particularly preferable as an inkjet ink if the temperature is 60° C. or higher.
(比較例3) 製備含有作為二官能型丙烯酸系化合物的聚乙二醇#400二丙烯酸酯(9EG-A)6.53質量份、作為單官能型N-乙烯基化合物的N-乙烯基甲醯胺(NVF)1.78質量份、作為聚合起始劑的IRG379 1.00質量份、以及作為界面活性劑的畢克(BYK)342 0.0042質量份的樹脂組成物。以官能基的數量變得相等的方式將樹脂組成物中的二官能型丙烯酸系化合物與單官能型N-乙烯基化合物的莫耳比設為0.5:1。所獲得的樹脂組成物的25℃下的黏度為52.8 mPa・s,在60℃下為14.6 mPa・s。因此,比較例3的樹脂組成物若為60℃以上,則作為噴墨用的墨水而尤佳。(comparative example 3) A resin composition containing 6.53 parts by mass of polyethylene glycol #400 diacrylate (9EG-A) as a bifunctional acrylic compound, 1.78 parts by mass of N-vinylformamide (NVF) as a monofunctional N-vinyl compound, 1.00 parts by mass of IRG379 as a polymerization initiator, and 0.0042 parts by mass of BYK 342 as a surfactant was prepared. The molar ratio of the bifunctional acrylic compound and the monofunctional N-vinyl compound in the resin composition was set to 0.5:1 so that the number of functional groups became equal. The viscosity of the obtained resin composition was 52.8 mPa·s at 25°C and 14.6 mPa·s at 60°C. Therefore, the resin composition of Comparative Example 3 is particularly preferable as an inkjet ink if the temperature is 60° C. or higher.
(評價例1)光硬化性的評價 將實施例1~實施例6及比較例1~比較例3的樹脂組成物分別藉由旋塗而在玻璃基板上塗佈10秒鐘,獲得塗膜。 使所獲得的樹脂組成物的塗膜在以下的條件下硬化而獲得電離放射線硬化物。 UV照射裝置:明日技研(Asumi Giken)公司製造的「ASM1503 NM-UV-LED」 燈波長:365 nm 曝光量:500 mJ/cm2 、1000 mJ/cm2 、1500 mJ/cm2 、2000 mJ/cm2 照度:700 mW/cm2 UV光的測定中使用了測定UVA(315 nm~400 nm)的UV監測器(歐普斯太(Opsytec)公司製造的「UV-Pad」)。 對實施例1~實施例6及比較例1~比較例3的樹脂組成物實施塗佈及曝光,在玻璃基板上形成電離放射線硬化物的膜。其後,對硬化膜表面進行指觸來查明完全成為非黏性狀態時的曝光量。將結果示於表1。(Evaluation Example 1) Evaluation of Photocurability The resin compositions of Examples 1 to 6 and Comparative Examples 1 to 3 were each applied on a glass substrate by spin coating for 10 seconds to obtain coating films. The coating film of the obtained resin composition was cured under the following conditions to obtain an ionizing radiation cured product. UV irradiation device: "ASM1503 NM-UV-LED" manufactured by Asumi Giken Inc. Lamp wavelength: 365 nm Exposure amount: 500 mJ/cm 2 , 1000 mJ/cm 2 , 1500 mJ/cm 2 , 2000 mJ/cm 2 Illuminance: 700 mW/cm 2 400 nm) UV monitor ("UV-Pad" manufactured by Opsytec). The resin compositions of Examples 1 to 6 and Comparative Examples 1 to 3 were coated and exposed to form a film of an ionizing radiation cured product on a glass substrate. Then, the cured film surface was touched with a finger, and the exposure amount at the time of completely becoming a non-adhesive state was checked. The results are shown in Table 1.
[表1]
如表1所示,在實施例1至實施例6以及比較例2及比較例3中,非黏性曝光量為1500 mJ/cm2 以下,其中尤其是實施例1、實施例3、實施例4及實施例6以及比較例2及比較例3為500 mJ/cm2 而尤其良好。相對於此,在比較例1中,即使將曝光量設為2000 mJ/cm2 而仍未達成非黏性狀態,樹脂組成物的硬化未完成。As shown in Table 1, in Examples 1 to 6, and Comparative Examples 2 and 3, the non-adhesive exposure amount was 1500 mJ/cm 2 or less, and especially 500 mJ/cm 2 in Examples 1, 3, 4, and 6, and Comparative Examples 2 and 3 were particularly good. In contrast, in Comparative Example 1, even when the exposure amount was set to 2000 mJ/cm 2 , the non-tacky state was not achieved, and the curing of the resin composition was not completed.
(評價例2)熱處理後的殘膜率的評價 對實施例1至實施例6以及比較例2及比較例3的樹脂組成物分別利用與評價例1相同的條件進行塗佈並使其硬化,獲得電離放射線硬化物的膜。作為光硬化條件,在曝光量為評價例1中所確認的非黏性曝光量下進行曝光。其後,相對於所獲得的電離放射線硬化物的膜,利用以下條件進一步進行熱處理。再者,比較例1中,即使將曝光量設為2000 mJ/cm2 而仍未達成非黏性狀態,因此並不作為評價對象,且未進行追加的熱處理。 潔淨烘箱:大和科學(Yamato Scientific)公司製造的「DT610」 溫度:150℃ 加熱時間:2小時 在熱處理前後測定電離放射線硬化物的膜厚(單位: μm),並算出由(熱處理後的厚度)/(熱處理前的厚度)定義的殘膜率(單位:%)。將熱處理前後的膜厚及殘膜率示於表2。(Evaluation Example 2) Evaluation of Residual Film Ratio after Heat Treatment The resin compositions of Examples 1 to 6 and Comparative Examples 2 and 3 were applied and cured under the same conditions as in Evaluation Example 1 to obtain ionizing radiation-cured films. Exposure was performed with the exposure amount being the non-tack exposure amount confirmed in Evaluation Example 1 as photocuring conditions. Thereafter, the obtained film of the ionizing radiation cured product was further heat-treated under the following conditions. In addition, in Comparative Example 1, even if the exposure amount was 2000 mJ/cm 2 , the non-tacky state was not achieved, so it was not evaluated, and additional heat treatment was not performed. Clean oven: "DT610" manufactured by Yamato Scientific, Inc. Temperature: 150°C Heating time: 2 hours The film thickness (unit: μm) of the ionizing radiation cured product was measured before and after heat treatment, and the remaining film rate (unit: %) defined by (thickness after heat treatment)/(thickness before heat treatment) was calculated. Table 2 shows the film thickness and residual film ratio before and after heat treatment.
[表2]
如表2所示,在實施例1至實施例6以及比較例2及比較例3中,殘膜率為80%以上,其中尤其是實施例1及實施例5以及比較例2及比較例3的殘膜率為90%以上而尤其良好。As shown in Table 2, in Example 1 to Example 6 and Comparative Example 2 and Comparative Example 3, the remaining film rate is more than 80%, and especially the remaining film rate of Example 1 and Example 5 and Comparative Example 2 and Comparative Example 3 is more than 90%, which is particularly good.
(評價例3)溶解性的評價 對實施例1至實施例6以及比較例2及比較例3的樹脂組成物分別利用與評價例2相同的條件進行塗佈並使其硬化,獲得電離放射線硬化物。另外,其後,相對於所獲得的電離放射線硬化物,利用與評價例2相同的條件進行熱處理。再者,比較例1中即使將曝光量設為2000 mJ/cm2 而仍未達成非黏性狀態,因此並不作為評價對象,且未進行溶解性的評價。 繼而,準備水與乙醇(EtOH)的混合液(混合比:水/EtOH=25/75)作為溶解液,使熱處理後的電離放射線硬化物浸漬於25℃的溶解液中來觀察電離放射線硬化物的溶解狀態。評價基準如下。 A:在5分鐘以內溶解 B:在經過5分鐘後至15分鐘的期間內溶解 C:經過15分鐘後仍未溶解(Evaluation Example 3) Evaluation of Solubility The resin compositions of Examples 1 to 6 and Comparative Examples 2 and 3 were applied and cured under the same conditions as in Evaluation Example 2 to obtain ionizing radiation cured products. In addition, thereafter, heat treatment was performed on the obtained ionizing radiation cured product under the same conditions as those in Evaluation Example 2. In addition, in Comparative Example 1, even if the exposure amount was set to 2000 mJ/cm 2 , the non-viscous state was not achieved, so it was not used as an evaluation object, and the solubility evaluation was not performed. Next, a mixed solution of water and ethanol (EtOH) (mixing ratio: water/EtOH=25/75) was prepared as a solution, and the heat-treated ionizing radiation-cured product was immersed in the solution at 25° C. to observe the dissolved state of the ionizing radiation-cured product. The evaluation criteria are as follows. A: Dissolved within 5 minutes B: Dissolved within 5 minutes to 15 minutes C: Not dissolved after 15 minutes
[表3]
在實施例1至實施例6的電離放射線硬化物中,熱處理後的電離放射線硬化物在5分鐘以內溶解而良好。相對於此,在比較例2及比較例3的電離放射線硬化物中,熱處理後的電離放射線硬化物即使在浸漬後經過15分鐘仍未溶解。In the ionizing radiation-cured products of Examples 1 to 6, the ionizing radiation-cured products after heat treatment were dissolved within 5 minutes and were good. On the other hand, in the ionizing radiation-cured products of Comparative Example 2 and Comparative Example 3, the ionizing radiation-cured products after heat treatment were not dissolved even after 15 minutes after immersion.
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