TWI808129B - Printed circuit board and battery module having the same - Google Patents

Abstract

A printed circuit board and a battery module having the same are provided. The printed circuit board includes an insulation layer; and a metal layer formed inside the insulation layer and having an end protruded from one side surface of the insulation layer.

Description

Printed circuit board and battery module with the printed circuit board

The disclosure relates to a printed circuit board and a battery module including the printed circuit board.

[CROSS-REFERENCE TO RELATED APPLICATIONS]

This application asserts the rights of Korean Patent Application No. 10-2018-0081645 filed with the Korean Intellectual Property Office on July 13, 2018, the entire disclosure of which is incorporated herein by reference for all purposes.

With the development of technology and the demand for mobile devices, the demand for rechargeable batteries is increasing rapidly. Contrary to primary batteries or primary batteries, secondary batteries, which are rechargeable batteries, are widely used as energy sources for electronic products including mobile devices.

Rechargeable (secondary) batteries are composed of various combustible materials and have serious disadvantages in terms of safety due to the danger of overheating, explosion, etc. due to overcharging, overcurrent and other physical external influences. Therefore, such a secondary battery may be combined with safety elements capable of effectively controlling abnormal conditions such as overcharging and overcurrent.

In Japanese Patent Publication No. 2014-007059 (January 16, 2014), a power supply stabilization device is disclosed.

This Summary is provided to introduce a selection of concepts in a simplified form that are further described below in the Detailed Description. This Summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used as an aid in determining the scope of the claimed subject matter.

The purpose of the present disclosure is to provide a printed circuit board with improved reliability of metal tabs and a battery module including the printed circuit board.

In one general aspect, a printed circuit board includes: an insulating layer; and a metal layer formed inside the insulating layer and having one end protruding from one side surface of the insulating layer.

In another general aspect, a battery module includes: a battery unit including electrodes; and a printed circuit board coupled to the battery unit, wherein the printed circuit board includes: an insulating layer; and a metal layer formed inside the insulating layer and having one end protruding from one side surface of the insulating layer, wherein the one end protruding from one side surface of the insulating layer is electrically connected to the electrode of the battery unit.

Other features and aspects will be apparent from the following detailed description, drawings and claims.

10: Battery unit

11: Electrode

20: Printed circuit board

110: the first insulating layer

120: second insulating layer

200: metal layer

200a, 200b: unit metal layer

210, 210a, 210b: metal tabs

220: metal foil

310: first circuit

320: second circuit

410: the first through hole

420: Second through hole

430: Perforation / third through hole

500: solder resist

C1, C2, C3, C4, C5: cavities

E1, E2: electronic components

M: metal layer/metal material

S: Solder

FIG. 1 is a diagram illustrating a printed circuit board according to an embodiment.

2( a ), FIG. 2( b ), and FIG. 2( c ) are views showing the printed circuit board shown in FIG. 1 according to the embodiment viewed from the other side.

FIG. 3 is a diagram illustrating a printed circuit board according to an embodiment.

FIG. 4 is a diagram illustrating a printed circuit board according to an embodiment.

FIG. 5 is a diagram illustrating a printed circuit board according to an embodiment.

6(a), 6(b) and 6(c) to 8(a), 8(b) and 8(c) are diagrams illustrating a method of manufacturing a printed circuit board according to one or more embodiments.

9 and 10 are diagrams illustrating a battery module according to one or more embodiments.

Like reference numbers refer to like elements throughout the drawings and detailed description. The drawings may not necessarily be drawn to scale and the relative size, proportions and depiction of elements in the drawings may be exaggerated for clarity, illustration and convenience.

The following detailed description is provided to assist the reader in gaining a comprehensive understanding of the methods, devices and/or systems described herein. However, various changes, modifications, and equivalents of the methods, apparatus, and/or systems described herein will become apparent to those of ordinary skill in the art upon understanding the following description. The sequence of operations described herein are examples only, and are not intended to be limited to those described herein, but, after understanding the following description, as will be apparent to those of ordinary skill in the art It is easy to see that, except for the operations that must appear in a certain order, all can be changed.

The features described herein may be implemented in different forms and should not be construed as limited to the examples described herein. Rather, the examples described herein are provided so that this disclosure will be thorough and will convey this disclosure to those of ordinary skill in the art.

It should be understood that although any of the terms "first", "second", "third", "fourth", etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish various elements. For example, a first element could be termed a second element, and, similarly, a second element could be termed a first element, without departing from the scope of the present disclosure. Similarly, when it is stated that a method includes a series of operations, the order of the operations is not the order in which the operations should be performed, any technical operation may be omitted and/or another arbitrary operation not disclosed herein may be added to the method.

Unless otherwise indicated, any statement that a first layer is "on" a second layer or substrate should be construed to encompass both situations where the first layer is in direct contact with the second layer or substrate and situations where one or more other layers are disposed between the first layer and the second layer or substrate.

It is convenient to describe a device or device using terms such as "below", "beneath", "under", "lower", "bottom", "above", "over", "upper", "top", "left" and "right", etc. Spatial relationship between components and other devices or components Tie. Such terms should be construed to encompass the device in the orientation shown in the drawings as well as in other orientations in use or operation. For example, embodiments in which the device includes a second layer disposed above a first layer based on the orientation of the device as shown in the drawings also encompass devices when the device is turned upside down in use or operation.

Hereinafter, some embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.

A printed circuit board

FIG. 1 is a diagram illustrating a printed circuit board according to an embodiment. 2( a ), FIG. 2( b ), and FIG. 2( c ) are views showing the printed circuit board shown in FIG. 1 according to the embodiment viewed from the other side. Specifically, FIG. 2(a) is a diagram showing one surface of the printed circuit board shown in FIG. 1, FIG. 2(b) is a diagram showing the printed circuit board shown in FIG. 1 viewed from the top side, and FIG. 2(c) is a diagram showing only the metal layer shown in FIG. 2(b).

Referring to FIGS. 1 and 2(a), 2(b) and 2(c), a printed circuit board according to an embodiment includes: an insulating layer; and a metal layer 200 having one end protruding from one side surface of the insulating layer. Here, one end of the metal layer 200 protruding from one side surface of the insulating layer may be referred to as a 'metal tab 210'.

The insulating layer may include a first insulating layer 110 and a second insulating layer 120 . The first insulating layer 110 may be laminated on both surfaces of the metal layer 200 , and the second insulating layer 120 may be laminated on the first insulating layer 110 .

The insulating layer (each of the first insulating layer 110 and the second insulating layer 120 ) may be a layer made of insulating material such as resin. The resin of the insulating layer can be various materials, such as thermosetting resin and thermoplastic resin. Specifically, the resin of the insulating layer can be epoxy resin, polyimide, bismaleimide triazine (bismaleimide) triazine, BT) resin, etc. Examples of the epoxy resin may include naphthalene type epoxy resin, bisphenol A type epoxy resin, bisphenol F type epoxy resin, novolac type epoxy resin, cresol novolac type epoxy resin, rubber modified epoxy resin, cycloaliphatic epoxy resin, silicon type epoxy resin, nitrogen type epoxy resin, phosphorus type epoxy resin, etc., but are not limited thereto.

The insulating layer may comprise fiber reinforced material (eg, glass cloth) and may be a prepreg (PPG). The insulating layer may also be a constituent film in which a resin is filled with an inorganic filler (for example, silicon dioxide (SiO ₂ )). As such a constituent film, Ajinomoto Build-up Film (ABF) or the like can be used. The inorganic filler can be at least one of silicon dioxide (SiO ₂ ), barium sulfate (BaSO ₄ ), and aluminum oxide (Al ₂ O ₃ ). The inorganic fillers may be used alone or in combination of two or more. Examples of inorganic fillers may include calcium carbonate, magnesium carbonate, fly ash, natural silica, synthetic silica, kaolin, clay, calcium oxide, magnesium oxide, titanium oxide, zinc oxide, calcium hydroxide, aluminum hydroxide, magnesium hydroxide, talc, mica, hydrotalcite, aluminum silicate, magnesium silicate, calcium silicate, calcined talc, wollastonite, potassium titanate, magnesium sulfate, calcium sulfate, magnesium phosphate, etc., but are not limited thereto.

The first insulating layer 110 and the second insulating layer 120 can be made of the same or different materials, but not limited thereto.

The metal layer 200 is a plate-shaped structure made of, for example, nickel (Ni), copper (Cu), or aluminum (Al). The metal layer 200 is formed inside the insulating layer. That is, the first insulating layer 110 is laminated on the upper and lower surfaces of the metal layer 200 and the second insulating layer 120 is laminated on the first insulating layer 110 so that a sandwich structure is formed in which In the structure, the first insulating layer 110 and the second insulating layer 120 are formed above and below the metal layer 200 .

Since the metal layer 200 is formed in a large area inside the insulating layer and metal has high thermal conductivity, the metal layer 200 can improve the heat dissipation function in the planar direction.

As shown in FIG. 1 and FIG. 2( a ), FIG. 2( b ) and FIG. 2( c ), one end of the metal layer 200 may protrude from one side surface of the insulating layer. One end protruding from one side surface of the insulating layer of the metal layer 200 becomes a “metal bump 210 ”. Although the figure shows that the length of the metal tab 210 is shorter than the length of the portion that is not the metal tab 210 , the length of the metal tab 210 may also be longer.

The metal foil 220 may be provided on one surface of the metal layer 200 . The thickness of the metal foil 220 may be smaller than that of the metal layer 200 . The metal forming the metal layer 200 and the metal forming the metal foil 220 may be different from each other. For example, the metal layer 200 can be made of nickel and the metal foil 220 can be made of copper.

The metal foil 220 formed on one surface of the metal layer 200 may be formed on the entire surface of the metal layer 200 including the metal tab 210 . In this case, the metal foil 220 may protrude from one side surface of the insulating layer together with the metal tab 210 .

Cavities C1 , C2 and C3 may be formed in the metal layer 200 through the upper and lower surfaces of the metal layer 200 . The cavities C1 , C2 and C3 may pass through the metal layer 200 and the first insulating layer 110 formed above and below the metal layer 200 . That is, the cavities C1 , C2 and C3 pass through the metal layer 200 and the first insulating layer 110 together in the vertical direction.

Electronic components E1 and E2 can be inserted into some cavities C1 and C2 and perforated (through via) 430 may pass through another cavity C3. The electronic components E1 and E2 can be inserted into the cavities C1 and C2 for downward displacement. In this case, the lower surfaces of the electronic components E1 and E2 may be located on the lower surfaces of the cavities C1 and C2. The size (thickness) of the electronic components E1 and E2 may be different from each other.

The sizes of the electronic components E1 and E2 may be smaller than the sizes of the cavities C1 and C2. After the electronic components E1 and E2 are inserted into the cavities C1 and C2 , the second insulating layer 120 may be used to fill the remaining spaces of the cavities C1 and C2 .

As shown in FIG. 2( a ), FIG. 2( b ) and FIG. 2( c ), the metal layer 200 can be divided into two regions. That is, the metal layer 200 may be formed of two unit metal layers 200a and 200b, and the two unit metal layers 200a and 200b may be insulated from each other. The unit metal layer 200a and the unit metal layer 200b may respectively include a metal bump 210a and a metal bump 210b. In this case, as shown in FIG. 2( a ), a pair of metal tabs 210 a and 210 b may protrude from one side surface of the insulating layer. The pair of metal tabs 210a and 210b are spaced apart from each other.

The two unit metal layers 200a and 200b may be separated and electrically insulated from each other by forming a cavity C4 between the two unit metal layers 200a and 200b (other cavities C1 to C3 are not shown in FIG. 2( c )). That is, the cavity C4 passes through the upper and lower surfaces of the metal layer 200 while being formed to cross the metal layer 200 in a planar direction.

Referring again to FIG. 1 , the first circuit 310 may be formed on the outer surface of the first insulating layer 110 , and the second circuit 320 may be formed on the outer surface of the second insulating layer 120 . The first circuit 310 and the second circuit 320 may be patterned conductors. first circuit 310 And the second circuit 320 can transmit electrical signals. In addition, the first circuit 310 and the second circuit 320 can be used as grounds.

The first circuit 310 and the second circuit 320 may be formed of metals such as copper (Cu), palladium (Pd), aluminum (Al), nickel (Ni), titanium (Ti), gold (Au), platinum (Pt) or alloys thereof.

The printed circuit board may further include through holes. Specifically, the first through hole 410 can connect the electronic components E1 and E2 to the second circuit 320 . The second via hole 420 can connect the metal layer 200 and the second circuit 320 . The third via hole 430 may connect the second circuits 320 on both surfaces of the second insulating layer 120 to each other. In addition, the printed circuit board may be provided with a through hole connecting the first circuit 310 and the second circuit 320 and connecting the first circuit 310 on both outer surfaces of the first insulating layer 110 to each other.

The first via hole 410 may pass through the second insulating layer 120 to connect the electrodes of the electronic components E1 and E2 to the second circuit 320 . The first through hole 410 may contact the lower surfaces of the electrodes of the electronic components E1 and E2.

The second via hole 420 can pass through the first insulating layer 110 and the second insulating layer 120 to contact the metal foil 220 of the metal layer 200 . The metal foil 220 is formed on the lower surface of the metal layer 200 and the second via hole 420 passes through the first insulating layer 110 and the second insulating layer 120 under the metal layer 200 .

The first via hole 410 and the second via hole 420 may be formed on the same side relative to the metal layer 200 . That is, as shown in FIG. 1 , the first through hole 410 and the second through hole 420 may be formed under the metal layer 200 .

On the other hand, the first through hole 410 and the second through hole 420 can be formed in metal on the upper surface of layer 200. In this case, the first through hole 410 can be electrically connected to the upper surface of the electrodes of the electronic components E1 and E2 , and the metal foil 220 can be formed on the upper surface of the metal layer 200 .

The through hole 430 may pass through the upper surface and the lower surface of the insulating layer. The cavity C3 may be formed in the metal layer 200 , and the through hole 430 passes through the metal layer 200 . That is, the through hole 430 may pass through the first insulating layer 110 , the second insulating layer 120 and the metal layer 200 . The cavity C3 may pass through the metal layer 200 and the first insulating layer 110 . The second insulating layer 120 may be introduced into the cavity C3 and the perforation hole 430 may pass not only through the second insulating layer 120 laminated on the first insulating layer 110 but also through the second insulating layer 120 introduced into the cavity C3.

The through hole 430 may be formed by plating the inner wall of the through hole. The through hole 430 may be formed by plating the entire interior of the through hole.

The printed circuit board may further include a solder resist 500 . The solder resist 500 may be formed on both surfaces of the insulating layer. Specifically, the solder resist 500 may be laminated on the second insulating layer 120 to protect the second circuit 320 . On the other hand, the solder resist 500 may be provided with an opening exposing at least a portion of the second circuit 320 . The exposed second circuit 320 may be used as a pad for external connection.

FIG. 3 is a diagram illustrating a printed circuit board according to an embodiment. Referring to FIG. 3 , roughness may be formed on an outer surface of the second circuit 320 . That is, the outer surface of the second circuit 320 may have concave and convex surfaces. Roughness (concave and convex) can improve the heat dissipation of printed circuit boards.

The second circuit 320 with roughness can transmit electric signal or perform ground function able. For example, roughness may be formed on both the portion of the second circuit 320 for transmitting electrical signals and the portion for performing a grounding function. In addition, roughness may be formed only on a portion of the second circuit 320 for performing a ground function.

In addition, the rough second circuit 320 may be disposed near a hot spot (for example, an integrated circuit (IC)) where heat generation is concentrated.

4 to 5 are diagrams illustrating printed circuit boards according to one or more embodiments. Referring to FIG. 4 , the metal foil 220 may not be formed on one end of the metal layer 200 protruding from one side surface of the insulating layer. Referring to FIG. 5, the metal foil 220 may be formed on both surfaces of the metal layer 200, and the metal foil 220 formed on the two surfaces may protrude from one side surface of the insulating layer. The metal foil 220 may be formed in various forms other than those shown in FIGS. 4 and 5 to achieve the conductivity of the metal foil 220 .

Method for preparing printed circuit boards

6(a) to 8(c) are diagrams illustrating a method of manufacturing a printed circuit board according to one or more embodiments.

Referring to FIG. 6(a), a metal layer 200 having a metal foil 220 on its surface is provided.

Referring to FIG. 6( b ), the first insulating layer 110 may be formed on both surfaces of the metal layer 200 , and the metal layer M may be provided on an outer surface of the first insulating layer 110 . Although the first insulating layer 110 and the metal layer M are shown separated from each other in FIG. 6( b ), the first insulating layer 110 and the metal material M may be integrally formed as a copper clad laminate (CCL).

Referring to FIG. 6( c ), the first circuit 310 may be formed from the metal layer M. Referring to FIG. first electric The via 310 can be formed by, for example, the following methods: semi-additive process (semi-additive process, SAP), modified semi-additive process (modified semi-additive process, MSAP), or tenting. On the other hand, the first circuit 310 may not be formed at a portion where the cavity is to be formed.

Referring to FIG. 7( a ), cavities C1 , C2 and C3 passing through the metal layer 200 and the first insulating layer 110 together may be formed. In addition, the cavity C4 crossing the metal layer 200 in the planar direction may also be formed. A cavity C5 for the metal tab 210 may also be formed. The cavities C1 to C5 can be formed by various drillings.

The shape of the metal layer 200 after the step shown in FIG. 7( a ) is shown on top of that shown in FIG. 7( a ). The metal layer 200 can be divided into two unit metal layers 200a and 200b, and the two unit metal layers 200a and 200b can respectively have a metal tab 210a and a metal tab 210b so that the metal layer 200 can have a pair of metal tabs 210a and 210b.

Referring to FIG. 7(b), electronic components E1 and E2 may be inserted into cavities C1 and C2, respectively. When the electronic components E1 and E2 are inserted, the tape may be temporarily attached to the lower surface of the first insulating layer 110 (the lower surface of the first circuit 310 ), and the electronic components E1 and E2 may be mounted on the tape. In this case, each surface of the electronic components E1 and E2 can be located on the same plane.

Referring to FIG. 7(c), the second insulating layer 120 may be laminated. The second insulating layer 120 may also include a metal layer M. As shown in FIG. The second insulating layer 120 may be filled (flowed) into the cavities C1 , C2 , and C3 passing through the metal layer 200 and the first insulating layer 110 together in the vertical direction. It is also possible to fill (flow) the second insulating layer 120 to the metal layer 200 In the intersecting cavity C4 and in the cavity C5 for the metal tab 210 .

Referring to FIG. 8( a ), the second circuit 320 may be formed from the metal layer M. Referring to FIG. The second circuit 320 can be formed by, for example, the following various methods: SAP, MSAP, or sealing holes. In addition, roughness may be formed on the outer surface of the second circuit 320 . That is, the outer surface of the second circuit 320 may have concave and convex surfaces. The roughness (concave and convex) of the outer surface of the second circuit 320 can be formed by etching.

The first through hole 410 , the second through hole 420 and the through hole 430 may be formed together with the formation of the second circuit 320 . The first via hole 410 may be formed by plating the inside of the via hole passing through the second insulating layer 120 to connect to the electrodes of the electronic components E1 and E2. The second via hole 420 may be formed by plating the inside of the via hole passing through the first insulating layer 110 and the second insulating layer 120 to be connected to the metal foil 220 . The through hole 430 may pass through the cavity C3 and through the second insulating layer 120 flowing into the cavity C3.

Referring to FIG. 8( b ), a solder resist 500 may be formed on the second insulating layer 120 . Optionally, an opening may be formed in the solder resist 500 to expose a portion of the second circuit 320 .

Referring to FIG. 8( c ), the first insulating layer 110 and the second insulating layer 120 may be partially removed to expose the metal bump 210 . The removal of the first insulating layer 110 and the second insulating layer 120 can be performed by blasting or laser.

After that, the exposed metal foil 220 may be removed by etching if necessary. When the metal layer 200 and the metal foil 220 are made of different metals, only the metal foil 220 may be selectively removed by etching.

battery module

The printed circuit board explained with reference to FIGS. 1 to 5 may be a protection circuit module (PCM) substrate to be coupled to a battery cell. Such a PCM substrate may include elements capable of preventing abnormal conditions (eg, overcharging, overcurrent, etc.) of the battery cell.

The battery module can be connected to the main board through the printed circuit board. Here, a connector board may be additionally formed between the printed circuit board and the main board, or a part of the printed circuit board may be used as the connector board.

9 and 10 are diagrams illustrating a battery module according to one or more embodiments.

Referring to FIG. 9 , the battery module may include a battery unit 10 and a protection circuit module (such as a printed circuit board 20 ), the battery unit 10 includes an electrode 11 , and the protection circuit module (such as a printed circuit board 20 ) is coupled to the battery unit 10 . The printed circuit board 20 may be implemented in various ways as described with reference to FIGS. 1 to 5 . The metal tab 210 is electrically connected to the electrode 11 of the battery unit 10 . The exposed metal tab 210 can be bonded to the electrode 11 of the battery unit 10 by solder S. Referring to FIG.

The electrode 11 of the battery cell 10 may include a positive electrode and a negative electrode, and a pair of metal tabs 210 may be respectively bonded to the positive electrode and the negative electrode.

Referring to FIG. 10, the metal tab 210 may be flexible and the printed circuit board 20 may be wrapped around the electrodes.

Although this disclosure includes specific examples, it will be apparent upon reading the disclosure of this application that various changes in form and details could be made in these examples without departing from the spirit and scope of claims and equivalents thereof. The examples presented herein should be considered illustrative only and not intended for limit. Descriptions of features or aspects within each example should be considered as available for similar features or aspects in the other examples. Suitable results may be achieved if the techniques are performed in a different order and/or if components in the described system, architecture, device, or circuit are combined in a different manner and/or are substituted or supplemented with other components or their equivalents. Therefore, the scope of the present disclosure is defined not by the detailed description but by the scope of the patent application and its equivalents, and all modifications within the scope of the patent application and its equivalents should be considered to be included in the present disclosure.

110: the first insulating layer

120: second insulating layer

200: metal layer

210: metal tab

220: metal foil

310: first circuit

320: second circuit

410: the first through hole

420: second through hole

430: Perforation / third through hole

500: solder resist

C1, C2, C3: cavities

E1, E2: electronic components

Claims (27)

A printed circuit board including: an insulating layer including a first insulating layer and a second insulating layer on the first insulating layer; a metal layer formed inside the insulating layer and having one end protruding from one side surface of the insulating layer; a first circuit on an outer surface of the first insulating layer; and a second circuit on an outer surface of the second insulating layer, wherein the first insulating layer is on both surfaces of the metal layer. The printed circuit board as described in item 1 of the patent scope, wherein a cavity is provided in the metal layer and the first insulating layer and vertically passes through the metal layer and the first insulating layer as a whole. The printed circuit board described in item 2 of the scope of the patent application further includes: electronic components inserted into the cavity. The printed circuit board as described in claim 3 of the patent application further includes: a through hole configured to electrically connect the electronic component and the second circuit. The printed circuit board according to claim 1, wherein a cavity crossing the metal layer in a planar direction is formed in the metal layer so that the metal layer is divided into two regions. The printed circuit board according to claim 1, wherein a metal foil is formed on one surface of the metal layer, and the metal foil has a thickness smaller than that of the metal layer. The printed circuit board according to claim 6, wherein the metal foil is not formed at the one end of the metal layer protruding from one side surface of the insulating layer. The printed circuit board as described in claim 1 of the patent application, wherein the outer surface of the second circuit has roughness. The printed circuit board according to claim 1, wherein a metal foil is formed on one surface of the metal layer, the metal foil has a thickness smaller than that of the metal layer, and through holes are provided to electrically connect the metal foil and the second circuit. The printed circuit board as described in item 1 of the scope of the patent application further includes: a through hole passing through the upper surface and the lower surface of the insulating layer, wherein a cavity allowing the through hole to pass through is formed in the metal layer. The printed circuit board as described in item 1 of the scope of the patent application further includes: solder resist on both surfaces of the insulating layer. The printed circuit board according to claim 1, wherein the one end of the metal layer protruding from one side surface of the insulating layer is a pair. The printed circuit board as described in claim 1, wherein the metal layer is made of metal including nickel. A battery module, comprising: a battery unit including electrodes; and a printed circuit board coupled to the battery unit, wherein the printed circuit board includes: an insulating layer including a first insulating layer and a second insulating layer on the first insulating layer; a metal layer formed inside the insulating layer and having one end protruding from one side surface of the insulating layer; a first circuit on an outer surface of the first insulating layer; and a second circuit on an outer surface of the second insulating layer, wherein the first insulating layer is on both surfaces of the metal layer, wherein the one end of the metal layer protruding from one side surface of the insulating layer is electrically connected to the electrode of the battery cell. The battery module according to claim 14, wherein the one end of the metal layer protruding from one side surface of the insulating layer is welded to the electrode of the battery cell. The battery module as described in claim 14 of the patent application, wherein a cavity is provided in the metal layer and the first insulating layer and vertically passes through the metal layer and the first insulating layer as a whole. The battery module as described in item 16 of the scope of the patent application further includes: electronic components inserted into the cavity. The battery module as described in claim 17 of the patent application, wherein the printed circuit board further includes: a through hole configured to electrically connect the electronic component and the second circuit. The battery module according to claim 14, wherein a cavity intersecting the metal layer in the plane direction is formed in the metal layer so that the gold The attribute layer is divided into two areas. The battery module according to claim 14, wherein a metal foil is formed on one surface of the metal layer, and the metal foil has a thickness smaller than that of the metal layer. The battery module according to claim 20, wherein the metal foil is not formed at the one end of the metal layer protruding from one side surface of the insulating layer. The battery module as described in claim 14 of the patent application, wherein the outer surface of the second circuit has roughness. The battery module according to claim 22, wherein a metal foil is formed on one surface of the metal layer, the metal foil has a thickness smaller than that of the metal layer, and through holes are provided to electrically connect the metal foil and the second circuit. The battery module as described in claim 14 of the patent application, wherein the printed circuit board further includes: a perforation passing through the upper surface and the lower surface of the insulating layer, wherein a cavity allowing the perforation to pass through is formed in the metal layer. The battery module as described in claim 14 of the patent application, wherein the printed circuit board further includes: solder resist on both surfaces of the insulating layer. The battery module as described in claim 14 of the patent application, wherein the one end of the metal layer protruding from one side surface of the insulating layer is a pair. The battery module as described in claim 14 of the patent application, wherein the metal layer is made of metal including nickel.