TWI807567B - Multifunctional standard calibration piece and detecting method of optical detecting apparatus - Google Patents

Multifunctional standard calibration piece and detecting method of optical detecting apparatus Download PDF

Info

Publication number
TWI807567B
TWI807567B TW110149739A TW110149739A TWI807567B TW I807567 B TWI807567 B TW I807567B TW 110149739 A TW110149739 A TW 110149739A TW 110149739 A TW110149739 A TW 110149739A TW I807567 B TWI807567 B TW I807567B
Authority
TW
Taiwan
Prior art keywords
light source
detection area
standard calibration
calibration sheet
samples
Prior art date
Application number
TW110149739A
Other languages
Chinese (zh)
Other versions
TW202326101A (en
Inventor
譚培汝
邱奕昌
張巍耀
Original Assignee
致茂電子股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 致茂電子股份有限公司 filed Critical 致茂電子股份有限公司
Priority to TW110149739A priority Critical patent/TWI807567B/en
Application granted granted Critical
Publication of TW202326101A publication Critical patent/TW202326101A/en
Publication of TWI807567B publication Critical patent/TWI807567B/en

Links

Landscapes

  • Investigating, Analyzing Materials By Fluorescence Or Luminescence (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)

Abstract

A multifunctional standard calibration piece includes a carrier and plural defect samples. The carrier has a light test area and a particle test area. The light test area is closer to an edge of the carrier than the particle test area. The defect samples are located on the particle test area of the carrier and are separated from each other.

Description

多功能標準校正片及光學檢測設備的檢測方法Multifunctional standard calibration sheet and detection method of optical detection equipment

本揭露是有關一種多功能標準校正片及一種光學檢測設備的檢測方法。The present disclosure relates to a multifunctional standard calibration sheet and a detection method of optical detection equipment.

光學檢測設備(例如自動光學檢測設備;AOI)需要監控其光源狀態與系統狀態,以確保功能正常。舉例來說,光學檢測設備可利用光源搭配取像系統(如相機)取得待測物(例如晶圓吸盤)的表面狀態,可用來偵測異物微粒之瑕疵。Optical inspection equipment (such as automated optical inspection equipment; AOI) needs to monitor its light source status and system status to ensure proper function. For example, optical inspection equipment can use a light source together with an imaging system (such as a camera) to obtain the surface state of the object under test (such as a wafer chuck), which can be used to detect defects of foreign particles.

由於光源在長時間使用後會有光強衰減的現象,因此需監控光源強度。常見的監控方式是使用一個反射率穩定的物體作為標準片(例如灰卡、色磚、反射率標準片) 並利用光源照射取像,根據所得到影像判斷光源強度是否正常。此外,針對光學檢測設備的3D量檢測值除了系統元件本身變異(例如取像系統損壞)的影響,同時也會受到待測物變異、環境等因素的影響,因此需要有一個穩定的標準來監控,例如階高標準片與微粒(Particle;PA)標準片,並利用光源照射取像,根據所得到影像判斷取像系統是否正常。然而,傳統的標準片無法同時進行光源監控與校正及監控系統元件的3D量檢測值,難以縮短監控流程的時間、降低標準片樣本的成本及降低監控時的量測誤差。Since the light source will have light intensity attenuation after long-term use, it is necessary to monitor the light source intensity. A common monitoring method is to use an object with stable reflectance as a standard film (such as gray card, color brick, reflectance standard film) and use a light source to illuminate and capture images, and judge whether the light source intensity is normal based on the obtained image. In addition, the 3D measurement value of the optical inspection equipment is not only affected by the variation of the system components itself (such as damage to the imaging system), but also affected by the variation of the object to be measured, the environment and other factors. Therefore, a stable standard is required to monitor, such as high-level standard slices and particle (PA) standard slices, and use light sources to illuminate and capture images, and judge whether the imaging system is normal based on the obtained images. However, the traditional standard sheet cannot monitor and calibrate the light source and monitor the 3D measurement values of the system components at the same time. It is difficult to shorten the time of the monitoring process, reduce the cost of the standard sheet sample, and reduce the measurement error during monitoring.

本揭露之一技術態樣為一種多功能標準校正片。One technical aspect of the present disclosure is a multifunctional standard calibration sheet.

根據本揭露之一些實施方式,一種多功能標準校正片包括載體與複數個瑕疵樣品。載體具有光源檢測區與微粒檢測區。光源檢測區較微粒檢測區靠近載體的邊緣。瑕疵樣品位於載體的微粒檢測區上且彼此分開。According to some embodiments of the present disclosure, a multifunctional standard calibration sheet includes a carrier and a plurality of defect samples. The carrier has a light source detection area and a particle detection area. The light source detection area is closer to the edge of the carrier than the particle detection area. The defect samples are located on the particle detection zone of the carrier and separated from each other.

在一些實施方式中,上述瑕疵樣品包括直徑相同的一個部分或直徑不同的複數個部分。In some embodiments, the defect sample includes one portion with the same diameter or a plurality of portions with different diameters.

在一些實施方式中,上述一第一部分的該些瑕疵樣品的直徑相同,一第二部分的該些瑕疵樣品的直徑相同,且該第一部分的該些瑕疵樣品的直徑小於該第二部分的該些瑕疵樣品的直徑。In some embodiments, the diameters of the flawed samples in the first portion are the same, the diameters of the flawed samples in the second portion are the same, and the diameters of the flawed samples in the first portion are smaller than the diameters of the flawed samples in the second portion.

在一些實施方式中,上述第一部分的瑕疵樣品的其中相鄰兩者沿微粒檢測區之長度方向的間距為第一部分的瑕疵樣品的直徑的10倍,第二部分的瑕疵樣品的其中相鄰兩者沿微粒檢測區之長度方向的間距為第二部分的瑕疵樣品的直徑的10倍。In some embodiments, the distance between adjacent two of the first part of the flawed samples along the length direction of the particle detection zone is 10 times the diameter of the first part of the flawed sample, and the distance between two adjacent ones of the second part of the flawed samples along the length direction of the particle detection zone is 10 times the diameter of the second part of the flawed sample.

在一些實施方式中,上述第一部分的瑕疵樣品最靠近第二部分的瑕疵樣品之一者與第二部分的瑕疵樣品最靠近第一部分的瑕疵樣品之一者之間沿微粒檢測區之長度方向的距離在9mm至11mm的範圍中。In some embodiments, the distance along the length direction of the particle detection zone between the defect sample of the first part closest to one of the defect samples of the second part and the defect sample of the second part closest to one of the defect samples of the first part is in the range of 9 mm to 11 mm.

在一些實施方式中,上述多功能標準校正片更包括膠體。膠體配置以將每一瑕疵樣品固定於載體的微粒檢測區上。In some embodiments, the above-mentioned multifunctional standard calibration sheet further includes colloid. The colloid is configured to immobilize each defect sample on the particle detection area of the carrier.

本揭露之一技術態樣為一種光學檢測設備的檢測方法。One technical aspect of the present disclosure is a detection method of an optical detection device.

根據本揭露之一些實施方式,一種光學檢測設備的檢測方法包括放置多功能標準校正片於光學檢測設備的平台上,其中多功能標準校正片具有光源檢測區與微粒檢測區;使用光學檢測設備的光源模組與取像系統對光源檢測區與微粒檢測區進行一次取像以得到影像,其中影像的第一部分對應光源檢測區,影像的第二部分對應微粒檢測區;根據影像的第一部分分析光源模組的狀態;以及當光源模組的狀態分析為正常時,根據影像的第二部分分析取像系統的狀態。According to some embodiments of the present disclosure, a detection method of an optical detection device includes placing a multi-functional standard calibration sheet on the platform of the optical detection device, wherein the multi-functional standard calibration sheet has a light source detection area and a particle detection area; using the light source module and the imaging system of the optical detection device to take an image of the light source detection area and the particle detection area to obtain an image, wherein the first part of the image corresponds to the light source detection area, and the second part of the image corresponds to the particle detection area; analyzing the state of the light source module according to the first part of the image; like the state of the system.

在一些實施方式中,上述光學檢測設備的檢測方法更包括當光源模組的狀態分析為異常時,對光源模組進行校正,使光源模組的狀態在校正後分析為正常。In some embodiments, the detection method of the optical detection device further includes correcting the light source module when the state of the light source module is analyzed as abnormal, so that the state of the light source module is analyzed as normal after correction.

在一些實施方式中,上述光學檢測設備的檢測方法更包括當取像系統的狀態分析為正常時,產出報告。In some embodiments, the detection method of the optical detection device further includes generating a report when the status analysis of the imaging system is normal.

在一些實施方式中,上述放置多功能標準校正片於光學檢測設備的平台上使得光源檢測區位於光源模組與微粒檢測區之間。In some embodiments, the multifunctional standard calibration sheet is placed on the platform of the optical detection device so that the light source detection area is located between the light source module and the particle detection area.

在本揭露上述實施方式中,由於多功能標準校正片的載體具有光源檢測區與微粒檢測區,且直徑不同的瑕疵樣品位於微粒檢測區上且彼此分開,因此當使用光學檢測設備的光源模組與取像系統對光源檢測區與微粒檢測區進行一次取像時可得到一影像,且此影像的第一部分對應光源檢測區,影像的第二部分對應微粒檢測區。如此一來,可根據影像的第一部分分析光源模組的狀態,並根據影像的第二部分分析取像系統的狀態,實現利用單一標準校正片同時進行光源模組監控與校正及監控取像系統的3D量檢測值(判斷系統元件是否異常)。本揭露之多功能標準校正片與光學檢測設備的檢測方法可有效縮短監控流程的時間、降低標準片樣本的成本及降低監控時的量測誤差。In the above embodiments of the present disclosure, since the carrier of the multi-functional standard calibration sheet has a light source detection area and a particle detection area, and defect samples with different diameters are located on the particle detection area and separated from each other, an image can be obtained when using the light source module and imaging system of the optical detection device to capture the light source detection area and the particle detection area at once, and the first part of the image corresponds to the light source detection area, and the second part of the image corresponds to the particle detection area. In this way, the state of the light source module can be analyzed according to the first part of the image, and the state of the imaging system can be analyzed according to the second part of the image, so that the monitoring and calibration of the light source module and the monitoring of the 3D measurement value of the imaging system (judging whether the system components are abnormal) can be realized by using a single standard calibration sheet at the same time. The multifunctional standard calibration sheet and the detection method of the optical detection equipment disclosed in this disclosure can effectively shorten the time of the monitoring process, reduce the cost of the standard sheet sample, and reduce the measurement error during monitoring.

以下揭示之實施方式內容提供了用於實施所提供的標的之不同特徵的許多不同實施方式,或實例。下文描述了元件和佈置之特定實例以簡化本案。當然,該等實例僅為實例且並不意欲作為限制。此外,本案可在各個實例中重複元件符號及/或字母。此重複係用於簡便和清晰的目的,且其本身不指定所論述的各個實施方式及/或配置之間的關係。The description of the embodiments disclosed below provides many different implementations, or examples, for implementing different features of the provided subject matter. Specific examples of components and arrangements are described below to simplify the present case. Of course, these examples are only examples and are not intended to be limiting. In addition, the present case may repeat element symbols and/or letters in various instances. This repetition is for the purposes of brevity and clarity and does not in itself dictate a relationship between the various implementations and/or configurations discussed.

諸如「在……下方」、「在……之下」、「下部」、「在……之上」、「上部」等等空間相對術語可在本文中為了便於描述之目的而使用,以描述如附圖中所示之一個元件或特徵與另一元件或特徵之關係。空間相對術語意欲涵蓋除了附圖中所示的定向之外的在使用或操作中的裝置的不同定向。裝置可經其他方式定向(旋轉90度或以其他定向)並且本文所使用的空間相對描述詞可同樣相應地解釋。Spatially relative terms such as "below," "beneath," "lower," "above," "upper," etc. may be used herein for convenience of description to describe the relationship of one element or feature to another as shown in the figures. Spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

第1圖繪示根據本揭露一實施方式之多功能標準校正片100的上視圖。第2圖繪示第1圖之載體110的微粒檢測區114的放大圖。同時參閱第1圖與第2圖,多功能標準校正片100包括載體110與複數個瑕疵樣品120。載體110具有光源檢測區112與微粒檢測區114。光源檢測區112較微粒檢測區114靠近載體110的邊緣111。瑕疵樣品120位於載體110的微粒檢測區114上且彼此分開,且這些瑕疵樣品120的直徑可以是相同的也可以是不同的。FIG. 1 shows a top view of a multifunctional standard calibration sheet 100 according to an embodiment of the present disclosure. FIG. 2 shows an enlarged view of the particle detection region 114 of the carrier 110 in FIG. 1 . Referring to FIG. 1 and FIG. 2 at the same time, the multifunctional standard calibration sheet 100 includes a carrier 110 and a plurality of defective samples 120 . The carrier 110 has a light source detection area 112 and a particle detection area 114 . The light source detection area 112 is closer to the edge 111 of the carrier 110 than the particle detection area 114 . The defect samples 120 are located on the particle detection area 114 of the carrier 110 and are separated from each other, and the diameters of these defect samples 120 may be the same or different.

在本實施方式中,載體110的材料可包括陶瓷或硫酸鋇,其反射特性為在光源強度變化時與取像的灰階平均可呈線性關係(將於第7圖說明),以用於光源強度的監控與校正。藉由載體110的材料特性,其表面的一部分可作為光源檢測區112。載體110的形狀可為長方形、圓形或其他形狀,依多功能標準校正片100使用的光學檢測設備(例如AOI)設計而定。此外,瑕疵樣品120可以為錫球,但並不以此為限。In this embodiment, the material of the carrier 110 can include ceramics or barium sulfate, and its reflective properties can have a linear relationship with the average gray scale of the image when the intensity of the light source changes (will be described in FIG. 7 ), so as to monitor and correct the intensity of the light source. Due to the material properties of the carrier 110 , a part of its surface can be used as the light source detection area 112 . The shape of the carrier 110 can be a rectangle, a circle or other shapes, depending on the design of the optical inspection equipment (such as AOI) used by the multifunctional standard calibration sheet 100 . In addition, the defective sample 120 may be a solder ball, but not limited thereto.

在監控與校正光學檢測設備時,多功能標準校正片100可放置於光學檢測設備的晶圓吸盤(Chuck)上,接著光學檢測設備的光源模組與取像系統(如相機)可對光源檢測區112與微粒檢測區114進行一次取像時可得到一影像,且此影像的第一部分對應光源檢測區112,影像的第二部分對應微粒檢測區114。如此一來,可根據影像的第一部分分析光源模組的狀態,並根據影像的第二部分分析取像系統的狀態,實現利用單一標準校正片同時進行光源模組監控與校正及監控取像系統的3D量檢測值,其中取像系統對瑕疵樣品120的3D量檢測值可判斷系統元件是否異常,以監控取像系統的異物檢測能力。When monitoring and calibrating the optical inspection equipment, the multifunctional standard calibration sheet 100 can be placed on the wafer chuck (Chuck) of the optical inspection equipment, and then the light source module and imaging system (such as a camera) of the optical inspection equipment can obtain an image when taking an image of the light source inspection area 112 and the particle inspection area 114, and the first part of the image corresponds to the light source inspection area 112, and the second part of the image corresponds to the particle inspection area 114. In this way, the state of the light source module can be analyzed according to the first part of the image, and the state of the imaging system can be analyzed according to the second part of the image, so that the monitoring and calibration of the light source module and the monitoring of the 3D quantity detection value of the imaging system can be performed simultaneously using a single standard calibration sheet.

瑕疵樣品120可包括直徑相同的一個部分(例如只有第一部分的瑕疵樣品122)或直徑不同的複數個部分(例如第一部分的瑕疵樣品122與第二部分的瑕疵樣品124)。在本實施方式中,瑕疵樣品120包括第一部分的瑕疵樣品122與第二部分的瑕疵樣品124,且第一部分的瑕疵樣品122皆具有直徑d1,第二部分的瑕疵樣品124皆具有直徑d2。第一部分的瑕疵樣品122的直徑d1小於第二部分的瑕疵樣品124的直徑d2。此外,在本實施方式中,第一部分的瑕疵樣品122與第二部分的瑕疵樣品124的數量皆為五,但並不用以限制本揭露。The flawed sample 120 may include one portion with the same diameter (eg, only the first portion of the flawed sample 122 ) or multiple portions with different diameters (eg, the first portion of the flawed sample 122 and the second portion of the flawed sample 124 ). In this embodiment, the flawed samples 120 include a first portion of flawed samples 122 and a second portion of flawed samples 124, and the first portion of flawed samples 122 both have a diameter d1, and the second portion of flawed samples 124 both have a diameter d2. The diameter d1 of the flawed sample 122 of the first portion is smaller than the diameter d2 of the flawed sample 124 of the second portion. In addition, in this embodiment, the number of the defective samples 122 in the first part and the defective samples 124 in the second part are both five, but this disclosure is not limited thereto.

在本實施方式中,第一部分的瑕疵樣品122的直徑d1在190μm至210μm的範圍中,例如200μm,第二部分的瑕疵樣品124的直徑d2在580μm至620μm的範圍中,例如600μm。在另一實施方式中,直徑d1可在40μm至60μm的範圍中,直徑d2可在90μm至110μm的範圍中,但並不以上述直徑d1、d2的範圍為限,可有多種排列組合,依設計需求而定。第一部分的瑕疵樣品122的直徑d1與待測光學檢測設備之晶圓吸盤上的微粒的直徑相似,以作為標準瑕疵樣品。第二部分的瑕疵樣品124因直徑d2大,反射光線多,有利於檢測光源位置變化的靈敏度,可作為輔助判斷用的瑕疵樣品。In this embodiment, the diameter d1 of the defect sample 122 of the first part is in the range of 190 μm to 210 μm, for example 200 μm, and the diameter d2 of the defect sample 124 of the second part is in the range of 580 μm to 620 μm, for example 600 μm. In another embodiment, the diameter d1 can be in the range of 40 μm to 60 μm, and the diameter d2 can be in the range of 90 μm to 110 μm, but it is not limited to the range of the above-mentioned diameters d1 and d2, and there can be various arrangements and combinations, depending on the design requirements. The diameter d1 of the defect sample 122 in the first part is similar to the particle diameter on the wafer chuck of the optical inspection device to be tested, so as to serve as a standard defect sample. The defect sample 124 in the second part has a large diameter d2 and reflects more light, which is beneficial to the sensitivity of detecting the position change of the light source, and can be used as a defect sample for auxiliary judgment.

此外,第一部分的瑕疵樣品122的其中相鄰兩者沿微粒檢測區114之長度方向D的間距P1為第一部分的瑕疵樣品122的直徑的10倍,第二部分的瑕疵樣品124的其中相鄰兩者沿微粒檢測區114之長度方向D的間距P2為第二部分的瑕疵樣品124的直徑的10倍。前述間距P1指的是兩相鄰第一部分的瑕疵樣品122之對應位置之間的距離,前述間距P2指的是兩相鄰第二部分的瑕疵樣品124之對應位置之間的距離。第一部分的瑕疵樣品122最靠近第二部分的瑕疵樣品124之一者與第二部分的瑕疵樣品124最靠近第一部分的瑕疵樣品122之一者之間沿微粒檢測區114之長度方向D的距離d在9mm至11mm的範圍中,例如10mm。經由以上微粒檢測區114上的瑕疵樣品120配置,可避免微粒檢測區114照光時瑕疵樣品120所產生的陰影影響檢測結果。In addition, the distance P1 between adjacent two of the flawed samples 122 in the first part along the length direction D of the particle detection area 114 is 10 times the diameter of the flawed sample 122 in the first part, and the distance P2 between the two adjacent flawed samples 124 in the second part along the length direction D of the particle detection zone 114 is 10 times the diameter of the flawed sample 124 in the second part. The pitch P1 refers to the distance between corresponding positions of the defective samples 122 of two adjacent first portions, and the aforementioned pitch P2 refers to the distance between corresponding positions of the defective samples 124 of two adjacent second portions. The distance d along the length direction D of the particle detection region 114 between the defect sample 122 of the first part closest to one of the defect samples 124 of the second part and the defect sample 124 of the second part closest to one of the defect samples 122 of the first part is in the range of 9 mm to 11 mm, for example 10 mm. Through the arrangement of the defective sample 120 on the particle detection area 114 , it is possible to prevent the shadow produced by the defective sample 120 from affecting the detection result when the particle detection area 114 is illuminated.

第3圖第2圖之瑕疵樣品120黏於載體110上之側視圖。如圖所示,多功能標準校正片100更包括膠體130。膠體130配置以將每一瑕疵樣品120固定於載體110的微粒檢測區114上。膠體130可以是UV膠、熱固膠或其他可固化的膠,以避免使用會影響瑕疵檢測的膠體。The side view of the defective sample 120 glued on the carrier 110 in FIG. 3 and FIG. 2 . As shown in the figure, the multifunctional standard calibration sheet 100 further includes a colloid 130 . The colloid 130 is configured to fix each defect sample 120 on the particle detection area 114 of the carrier 110 . The glue 130 can be UV glue, thermosetting glue or other curable glue, so as to avoid the use of glue that would affect the detection of defects.

應瞭解到,已敘述過的元件連接關係、材料與功效將不再重複贅述,合先敘明。在以下敘述中,將說明光學檢測設備的檢測方法及其他型式的多功能標準校正片。It should be understood that the connection relationship, materials and functions of the components that have been described will not be repeated, and will be described first. In the following description, the detection method of the optical detection equipment and other types of multifunctional standard calibration sheets will be described.

第4圖繪示根據本揭露一實施方式之光學檢測設備的檢測方法的流程圖。光學檢測設備的檢測方法包括下列步驟。在步驟S1中,放置多功能標準校正片於光學檢測設備的平台上,其中多功能標準校正片具有光源檢測區與微粒檢測區。接著在步驟S2中,使用光學檢測設備的光源模組與取像系統對光源檢測區與微粒檢測區進行一次取像以得到影像,其中影像的第一部分對應光源檢測區,影像的第二部分對應微粒檢測區。後續在步驟S3中,根據影像的第一部分分析光源模組的狀態。在步驟S4中,當光源模組的狀態分析為正常時,根據影像的第二部分分析取像系統的狀態。光學檢測設備的檢測方法並不限於上述步驟S1至步驟S4,舉例來說,可在兩前後步驟之間進一步包括其他步驟,也可在步驟S4後進一步包括其他步驟。FIG. 4 is a flowchart of a detection method of an optical detection device according to an embodiment of the present disclosure. The detection method of the optical detection device includes the following steps. In step S1, a multifunctional standard calibration sheet is placed on the platform of the optical detection device, wherein the multifunctional standard calibration sheet has a light source detection area and a particle detection area. Then in step S2, use the light source module and imaging system of the optical detection device to take an image of the light source detection area and the particle detection area to obtain an image, wherein the first part of the image corresponds to the light source detection area, and the second part of the image corresponds to the particle detection area. Subsequently, in step S3, the state of the light source module is analyzed according to the first part of the image. In step S4, when the status analysis of the light source module is normal, the status of the imaging system is analyzed according to the second part of the image. The detection method of the optical detection device is not limited to the above steps S1 to S4, for example, other steps may be further included between the two preceding and subsequent steps, and other steps may be further included after step S4.

在以下敘述中,將詳細說明光學檢測設備的檢測方法的各步驟。In the following description, each step of the detection method of the optical detection device will be described in detail.

第5圖繪示根據本揭露一實施方式之多功能標準校正片100a使用於光學檢測設備200中的上視圖。在使用光學檢測設備200的檢測方法時,可放置多功能標準校正片100a於光學檢測設備200的平台(例如晶圓吸盤)上,其中多功能標準校正片100a具有光源檢測區112與微粒檢測區114。在本實施方式中,多功能標準校正片100a的載體110為圓形,以模擬其下方晶圓吸盤(Chuck)的狀況。多功能標準校正片100a具有四光源檢測區112與四微粒檢測區114,但並不以此為限。FIG. 5 shows a top view of the multi-functional standard calibration sheet 100a used in the optical inspection device 200 according to an embodiment of the present disclosure. When using the detection method of the optical detection equipment 200, the multifunctional standard calibration sheet 100a can be placed on the platform (such as a wafer chuck) of the optical detection equipment 200, wherein the multifunctional standard calibration sheet 100a has a light source detection area 112 and a particle detection area 114. In this embodiment, the carrier 110 of the multifunctional standard calibration sheet 100a is circular to simulate the situation of the wafer chuck (Chuck) below it. The multifunctional standard calibration sheet 100 a has four light source detection areas 112 and four particle detection areas 114 , but it is not limited thereto.

接著,可使用光學檢測設備200的光源模組210與取像系統220對多功能標準校正片100a的光源檢測區112與微粒檢測區114進行一次取像以得到影像,其中影像的第一部分對應光源檢測區112,影像的第二部分對應微粒檢測區114。光源模組210的光源212配置以提供光線。取像系統220包括鏡頭,配置以拍攝影像。在本實施方式中,光源模組210的數量為四且為弧形,但並不用以限制本揭露。光源模組210位於多功能標準校正片100a周圍,以針對晶圓吸盤作微粒暗場檢測,例如光源模組210是以小於30度的傾斜光線照射多功能標準校正片100a的光源檢測區112。此外,放置多功能標準校正片100a於光學檢測設備200的平台上時,光源檢測區112可位於光源模組210與微粒檢測區114之間,因光源檢測區112較微粒檢測區114靠近載體110的邊緣111,這樣的配置可讓灰階平均-光源強度的檢測結果(見第7圖)較為線性。Next, the light source module 210 and the image capturing system 220 of the optical detection device 200 can be used to capture an image of the light source detection area 112 and the particle detection area 114 of the multifunctional standard calibration sheet 100a to obtain an image, wherein the first part of the image corresponds to the light source detection area 112, and the second part of the image corresponds to the particle detection area 114. The light source 212 of the light source module 210 is configured to provide light. The imaging system 220 includes a lens configured to capture images. In this embodiment, the number of light source modules 210 is four and is arc-shaped, but this disclosure is not limited thereto. The light source module 210 is located around the multifunctional standard calibration sheet 100a for dark-field detection of particles on wafer chucks. For example, the light source module 210 illuminates the light source detection area 112 of the multifunctional standard calibration sheet 100a with an oblique light less than 30 degrees. In addition, when the multifunctional standard calibration sheet 100a is placed on the platform of the optical detection device 200, the light source detection area 112 can be located between the light source module 210 and the particle detection area 114, because the light source detection area 112 is closer to the edge 111 of the carrier 110 than the particle detection area 114, such a configuration can make the detection result of gray scale average - light source intensity (see FIG. 7 ) more linear.

待取像後,可根據影像的第一部分分析光源模組210的狀態。在一些實施方式中,當光源模組210的狀態分析為正常時,根據影像的第二部分(例如其3D量檢測值)分析取像系統220的狀態。當取像系統220的狀態分析為正常時,產出報告。後續便可從光學檢測設備200取出多功能標準校正片100a。然而,當取像系統220的狀態分析為異常時,可通知人員進行維修。After the image is captured, the state of the light source module 210 can be analyzed according to the first part of the image. In some embodiments, when the status analysis of the light source module 210 is normal, the status of the imaging system 220 is analyzed according to the second part of the image (eg, the 3D volume detection value thereof). When the status analysis of the imaging system 220 is normal, a report is generated. Subsequently, the multifunctional standard calibration sheet 100 a can be taken out from the optical detection device 200 . However, when the status analysis of the imaging system 220 is abnormal, personnel may be notified for maintenance.

在一些實施方式中,當光源模組210的狀態分析為異常時,對光源模組210進行校正,使光源模組210的狀態在校正後分析為正常。舉例來說,由於光源模組210的狀態經分析後為異常,一般可表示光源強度較為衰弱(例如因長期使用),為改善此異常需對光源模組210進行校正,也就是對光源模組210的光源強度調升,又由於光源強度是正比於驅動電流,因此前述之校正可透過增加驅動電流而使光源強度增加。In some implementations, when the state of the light source module 210 is analyzed as abnormal, the light source module 210 is corrected so that the state of the light source module 210 is analyzed as normal after correction. For example, since the status of the light source module 210 is abnormal after analysis, it generally indicates that the light source intensity is relatively weak (for example, due to long-term use). To improve this abnormality, the light source module 210 needs to be corrected, that is, the light source intensity of the light source module 210 is increased. Since the light source intensity is proportional to the driving current, the aforementioned correction can increase the light source intensity by increasing the driving current.

具體而言,多功能標準校正片100a與光學檢測設備200的檢測方法具有以下優點:1.可以同時進行光源模組210的監控與校正以及監控取像系統220對微粒檢測區114的3D量檢測值。2. 因上述兩種監控可以同時進行(一次取像),可以縮短監控流程的時間。3. 因上述兩種監控使用同一片多功能標準校正片100a,可以降低樣本製作的成本。4. 因上述兩種監控同時進行,可避免元件或環境因時間不同而引入的偏差量,可降低監控時的量測誤差。Specifically, the detection method of the multifunctional standard calibration sheet 100a and the optical detection device 200 has the following advantages: 1. The monitoring and calibration of the light source module 210 and the monitoring of the 3D quantity detection value of the particle detection area 114 by the imaging system 220 can be performed simultaneously. 2. Since the above two kinds of monitoring can be carried out simultaneously (one-shot imaging), the time of the monitoring process can be shortened. 3. Since the above two kinds of monitoring use the same multifunctional standard calibration sheet 100a, the cost of sample production can be reduced. 4. Since the above two kinds of monitoring are carried out at the same time, it can avoid the deviation introduced by the components or the environment due to the time difference, and can reduce the measurement error during monitoring.

第6圖繪示根據本揭露另一實施方式之多功能標準校正片100b使用於光學檢測設備200a中的上視圖。與第5圖實施方式不同的地方在於,光學檢測設備200a具有單一的光源模組210a,且多功能標準校正片100a具有單一光源檢測區112與單一微粒檢測區114。此外,光源模組210a為長條形,例如具有複數個光源212a的燈條。FIG. 6 shows a top view of a multifunctional standard calibration sheet 100b used in an optical detection device 200a according to another embodiment of the present disclosure. The difference from the embodiment shown in FIG. 5 is that the optical detection device 200 a has a single light source module 210 a, and the multifunctional standard calibration sheet 100 a has a single light source detection area 112 and a single particle detection area 114 . In addition, the light source module 210a is strip-shaped, such as a light bar with a plurality of light sources 212a.

第7圖繪示根據本揭露一實施方式之光源模組照射載體的光源檢測區後得到的灰階平均-光源強度關係圖。光源模組可能包含不只一個光源,且每個光源的特性可能略有差異,因此針對個別光源選定重點區域(Region of interest;ROI)。舉例來說,線L1與線L2可分別表示第6圖其中兩光源212a的灰階平均-光源強度關係,若線L1的光源212a在標準範圍中,線L2的光源212a可判斷出衰退,因此能從第6圖之多功能標準校正片100b所取得的影像校正已衰退之光源212a的強度,例如增加電流。FIG. 7 shows the relationship between grayscale average and light source intensity obtained after the light source module irradiates the light source detection area of the carrier according to an embodiment of the present disclosure. The light source module may include more than one light source, and the characteristics of each light source may be slightly different, so a key region (Region of interest; ROI) is selected for each light source. For example, the line L1 and the line L2 can respectively represent the relationship between the grayscale average of the two light sources 212a in FIG. 6 and the intensity of the light source. If the light source 212a of the line L1 is within the standard range, the light source 212a of the line L2 can be judged to be degraded. Therefore, the intensity of the degraded light source 212a can be corrected from the image obtained from the multifunctional standard calibration sheet 100b in FIG. 6 , for example, by increasing the current.

前述概述了幾個實施方式的特徵,使得本領域技術人員可以更好地理解本揭露的態樣。本領域技術人員應當理解,他們可以容易地將本揭露用作設計或修改其他過程和結構的基礎,以實現與本文介紹的實施方式相同的目的和/或實現相同的優點。本領域技術人員還應該認識到,這樣的等效構造不脫離本揭露的精神和範圍,並且在不脫離本揭露的精神和範圍的情況下,它們可以在這裡進行各種改變,替換和變更。The foregoing outlines features of several embodiments so that those skilled in the art may better understand aspects of the present disclosure. It should be appreciated by those skilled in the art that they may readily use the present disclosure as a basis for designing or modifying other processes and structures, so as to achieve the same purposes and/or achieve the same advantages as the embodiments described herein. Those skilled in the art should also realize that such equivalent constructions do not depart from the spirit and scope of the present disclosure, and that they can make various changes, substitutions and alterations herein without departing from the spirit and scope of the present disclosure.

100,100a,100b: 多功能標準校正片 110:載體 111:邊緣 112:光源檢測區 114:微粒檢測區 120:瑕疵樣品 122:第一部分的瑕疵樣品 124:第二部分的瑕疵樣品 130:膠體 200,200a:光學檢測設備 210,210a:光源模組 212,212a:光源 220:取像系統 D:長度方向 d:距離 d1,d2:直徑 P1,P2:間距 L1,L2:線 S1,S2,S3,S4:步驟 100, 100a, 100b: multi-function calibration standard 110: carrier 111: edge 112: Light source detection area 114: Particle detection area 120: Blemish samples 122: Blemish samples from part one 124: Blemish samples from part 2 130: colloid 200,200a: Optical detection equipment 210,210a: Light source module 212, 212a: light source 220: Imaging system D: length direction d: distance d1, d2: diameter P1, P2: Pitch L1, L2: line S1, S2, S3, S4: steps

當與隨附圖示一起閱讀時,可由後文實施方式最佳地理解本揭露內容的態樣。注意到根據此行業中之標準實務,各種特徵並未按比例繪製。實際上,為論述的清楚性,可任意增加或減少各種特徵的尺寸。 第1圖繪示根據本揭露一實施方式之多功能標準校正片的上視圖。 第2圖繪示第1圖之載體的微粒檢測區的放大圖。 第3圖第2圖之瑕疵樣品黏於載體上之側視圖。 第4圖繪示根據本揭露一實施方式之光學檢測設備的檢測方法的流程圖。 第5圖繪示根據本揭露一實施方式之多功能標準校正片使用於光學檢測設備中的上視圖。 第6圖繪示根據本揭露另一實施方式之多功能標準校正片使用於光學檢測設備中的上視圖。 第7圖繪示根據本揭露一實施方式之光源模組照射載體的光源檢測區後得到的灰階平均-光源強度關係圖。 Aspects of the present disclosure are best understood from the following embodiments when read with the accompanying figures. It is noted that, in accordance with the standard practice in the industry, various features are not drawn to scale. In fact, the dimensions of the various features may be arbitrarily increased or decreased for clarity of discussion. FIG. 1 shows a top view of a multifunctional standard calibration sheet according to an embodiment of the present disclosure. FIG. 2 shows an enlarged view of the particle detection area of the carrier in FIG. 1 . The side view of the defective sample glued to the carrier in Fig. 3 and Fig. 2. FIG. 4 is a flowchart of a detection method of an optical detection device according to an embodiment of the present disclosure. FIG. 5 shows a top view of a multifunctional standard calibration sheet used in an optical inspection device according to an embodiment of the present disclosure. FIG. 6 shows a top view of a multifunctional standard calibration sheet used in an optical inspection device according to another embodiment of the present disclosure. FIG. 7 shows the relationship between grayscale average and light source intensity obtained after the light source module irradiates the light source detection area of the carrier according to an embodiment of the present disclosure.

國內寄存資訊(請依寄存機構、日期、號碼順序註記) 無 國外寄存資訊(請依寄存國家、機構、日期、號碼順序註記) 無 Domestic deposit information (please note in order of depositor, date, and number) none Overseas storage information (please note in order of storage country, institution, date, and number) none

100: 多功能標準校正片 110:載體 111:邊緣 112:光源檢測區 114:微粒檢測區 120:瑕疵樣品 122:第一部分的瑕疵樣品 124:第二部分的瑕疵樣品 100: Multi-function Standard Calibration Sheet 110: carrier 111: edge 112: Light source detection area 114: Particle detection area 120: Blemish samples 122: Blemish samples from part one 124: Blemish samples from part 2

Claims (10)

一種多功能標準校正片,包括:一載體,具有一光源檢測區與一微粒檢測區,其中該光源檢測區較該微粒檢測區靠近該載體的邊緣,且該光源檢測區與該微粒檢測區配置以供一光學檢測設備取像以分析該光學檢測設備的光源模組與取像系統的狀態;以及複數個瑕疵樣品,位於該載體的該微粒檢測區上且彼此分開。 A multifunctional standard calibration sheet includes: a carrier with a light source detection area and a particle detection area, wherein the light source detection area is closer to the edge of the carrier than the particle detection area, and the light source detection area and the particle detection area are arranged for an optical detection device to take an image to analyze the state of the light source module and the imaging system of the optical detection device; and a plurality of defect samples are located on the particle detection area of the carrier and separated from each other. 如請求項1所述之多功能標準校正片,其中該些瑕疵樣品包括直徑相同的一個部分或直徑不同的複數個部分。 The multifunctional standard calibration sheet as claimed in claim 1, wherein the defective samples include a part with the same diameter or a plurality of parts with different diameters. 如請求項1所述之多功能標準校正片,其中一第一部分的該些瑕疵樣品的直徑相同,一第二部分的該些瑕疵樣品的直徑相同,且該第一部分的該些瑕疵樣品的直徑小於該第二部分的該些瑕疵樣品的直徑。 The multifunctional standard calibration sheet as described in claim 1, wherein the diameters of the defective samples of a first part are the same, the diameters of the defective samples of a second part are the same, and the diameters of the defective samples of the first part are smaller than the diameters of the defective samples of the second part. 如請求項3所述之多功能標準校正片,其中該第一部分的該些瑕疵樣品的其中相鄰兩者沿該微粒檢測區之長度方向的間距為該第一部分的該些瑕疵樣品的直徑的10倍,該第二部分的該些瑕疵樣品的其中相鄰兩者沿該微粒檢測區之長度方向的間距為該第二部分的該些瑕疵樣品的直徑的10倍。 The multifunctional standard calibration sheet as described in claim 3, wherein the distance between adjacent two of the defective samples in the first part along the length direction of the particle detection area is 10 times the diameter of the defective samples in the first part, and the distance between two adjacent two of the defective samples in the second part along the length direction of the particle detection area is 10 times the diameter of the defective samples in the second part. 如請求項3所述之多功能標準校正片,其中該第一部分的該些瑕疵樣品最靠近該第二部分的該些瑕疵樣品之一者與該第二部分的該些瑕疵樣品最靠近該第一部分的該些瑕疵樣品之一者之間沿該微粒檢測區之長度方向的距離在9mm至11mm的範圍中。 The multifunctional standard calibration sheet as described in claim 3, wherein the distance between the defective samples of the first part closest to one of the defective samples of the second part and the defective samples of the second part closest to one of the defective samples of the first part along the length direction of the particle detection area is in the range of 9 mm to 11 mm. 如請求項1所述之多功能標準校正片,更包括:一膠體,配置以將每一該些瑕疵樣品固定於該載體的該微粒檢測區上。 The multifunctional standard calibration sheet as claimed in claim 1 further includes: a colloid configured to fix each of the defective samples on the particle detection area of the carrier. 一種光學檢測設備的檢測方法,包括:放置一多功能標準校正片於該光學檢測設備的一平台上,其中該多功能標準校正片具有一光源檢測區與一微粒檢測區;使用該光學檢測設備的一光源模組與一取像系統對該光源檢測區與該微粒檢測區進行一次取像以得到一影像,其中該影像的一第一部分對應該光源檢測區,該影像的一第二部分對應該微粒檢測區;根據該影像的該第一部分分析該光源模組的狀態;以及當該光源模組的狀態分析為正常時,根據該影像的該第二部分分析該取像系統的狀態。 A detection method for optical detection equipment, comprising: placing a multifunctional standard calibration sheet on a platform of the optical detection equipment, wherein the multifunctional standard calibration sheet has a light source detection area and a particle detection area; using a light source module and an imaging system of the optical detection device to take an image of the light source detection area and the particle detection area to obtain an image, wherein a first part of the image corresponds to the light source detection area, and a second part of the image corresponds to the particle detection area; analyzing the state of the light source module according to the first part of the image; When the status analysis of the group is normal, the status of the imaging system is analyzed according to the second part of the image. 如請求項7所述之光學檢測設備的檢測方法,更包括:當該光源模組的狀態分析為異常時,對該光源模組進行校正,使該光源模組的狀態在校正後分析為正常。 The detection method of optical detection equipment as described in Claim 7 further includes: when the state of the light source module is analyzed as abnormal, correcting the light source module so that the state of the light source module is analyzed as normal after correction. 如請求項7所述之光學檢測設備的檢測方法,更包括:當該取像系統的狀態分析為正常時,產出報告。 The detection method of the optical detection device as described in Claim 7 further includes: when the status analysis of the imaging system is normal, generating a report. 如請求項7所述之光學檢測設備的檢測方法,其中放置該多功能標準校正片於該光學檢測設備的該平台上使得該光源檢測區位於該光源模組與該微粒檢測區之間。 The inspection method of optical inspection equipment as claimed in item 7, wherein the multifunctional standard calibration sheet is placed on the platform of the optical inspection equipment so that the light source detection area is located between the light source module and the particle detection area.
TW110149739A 2021-12-30 2021-12-30 Multifunctional standard calibration piece and detecting method of optical detecting apparatus TWI807567B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW110149739A TWI807567B (en) 2021-12-30 2021-12-30 Multifunctional standard calibration piece and detecting method of optical detecting apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW110149739A TWI807567B (en) 2021-12-30 2021-12-30 Multifunctional standard calibration piece and detecting method of optical detecting apparatus

Publications (2)

Publication Number Publication Date
TW202326101A TW202326101A (en) 2023-07-01
TWI807567B true TWI807567B (en) 2023-07-01

Family

ID=88147599

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110149739A TWI807567B (en) 2021-12-30 2021-12-30 Multifunctional standard calibration piece and detecting method of optical detecting apparatus

Country Status (1)

Country Link
TW (1) TWI807567B (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5247344A (en) * 1988-10-03 1993-09-21 Hughes Aircraft Company Optical inspection system for solder joints and inspection method
TW200636230A (en) * 2005-02-18 2006-10-16 Schott Ag Apparatus and method for detection and/or categorization of defected spots
TW201018898A (en) * 2008-11-11 2010-05-16 Chroma Ate Inc Automatic optical inspection equipment and inspection method thereof
CN105136816A (en) * 2015-09-10 2015-12-09 苏州威盛视信息科技有限公司 Correcting method for inspection frame in AOI (Automatic Optical Inspection) of printed circuit board

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5247344A (en) * 1988-10-03 1993-09-21 Hughes Aircraft Company Optical inspection system for solder joints and inspection method
TW200636230A (en) * 2005-02-18 2006-10-16 Schott Ag Apparatus and method for detection and/or categorization of defected spots
TW201018898A (en) * 2008-11-11 2010-05-16 Chroma Ate Inc Automatic optical inspection equipment and inspection method thereof
CN105136816A (en) * 2015-09-10 2015-12-09 苏州威盛视信息科技有限公司 Correcting method for inspection frame in AOI (Automatic Optical Inspection) of printed circuit board

Also Published As

Publication number Publication date
TW202326101A (en) 2023-07-01

Similar Documents

Publication Publication Date Title
KR100863140B1 (en) Detecting materials on wafer and repair system and method thereof
KR101735403B1 (en) Inspection method, templet substrate and focus offset method
CN107796825B (en) Device detection method
US20060158643A1 (en) Method and system of inspecting mura-defect and method of fabricating photomask
US7477370B2 (en) Method of detecting incomplete edge bead removal from a disk-like object
TWI413768B (en) Pattern inspection method, pattern inspection device, photomask manufacturing method, and pattern transfer method
JP5589888B2 (en) Evaluation apparatus for surface inspection apparatus and evaluation method for surface inspection apparatus
US11796418B2 (en) Contact lens defect analysis and tracing system
TWI495867B (en) Application of repeated exposure to multiple exposure image blending detection method
JP2011158363A (en) Soldering inspection device for pga mounting substrate
JP2008068284A (en) Apparatus and method for correcting defect, and method for manufacturing pattern substrate
KR102145960B1 (en) Apparatus and method for inspecting sealing
TWI807567B (en) Multifunctional standard calibration piece and detecting method of optical detecting apparatus
KR20220044741A (en) Wafer appearance inspection apparatus and method
KR101198406B1 (en) Pattern inspection device
CN111220621B (en) Chip inclined surface detection method
KR100799984B1 (en) Apparatus and method for testing image sensor package
CN116413281A (en) Multifunctional standard calibration sheet and detection method of optical detection equipment
JP2008070202A (en) Method for centering imaging device inspecting apparatus
KR20060108829A (en) Thin film material testing apparatus and method for the same
JP3078784B2 (en) Defect inspection equipment
JP2010190740A (en) Substrate inspection device, method, and program
JP2007315982A (en) Measuring device and inspecting device
US20130015372A1 (en) Light-emitting element detection and classification device
CN114222913B (en) Wafer appearance inspection device and method