TWI801460B - Heating, ventilating and air conditioning (hvac) system, control method for a vapor compression system, and related machine-readable media - Google Patents
Heating, ventilating and air conditioning (hvac) system, control method for a vapor compression system, and related machine-readable media Download PDFInfo
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- 238000000034 method Methods 0.000 title claims description 8
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B49/00—Arrangement or mounting of control or safety devices
- F25B49/02—Arrangement or mounting of control or safety devices for compression type machines, plants or systems
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B41/00—Fluid-circulation arrangements
- F25B41/30—Expansion means; Dispositions thereof
- F25B41/31—Expansion valves
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B41/00—Fluid-circulation arrangements
- F25B41/30—Expansion means; Dispositions thereof
- F25B41/31—Expansion valves
- F25B41/34—Expansion valves with the valve member being actuated by electric means, e.g. by piezoelectric actuators
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2600/00—Control issues
- F25B2600/21—Refrigerant outlet evaporator temperature
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2600/00—Control issues
- F25B2600/25—Control of valves
- F25B2600/2513—Expansion valves
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2700/00—Sensing or detecting of parameters; Sensors therefor
- F25B2700/19—Pressures
- F25B2700/193—Pressures of the compressor
- F25B2700/1933—Suction pressures
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2700/00—Sensing or detecting of parameters; Sensors therefor
- F25B2700/19—Pressures
- F25B2700/197—Pressures of the evaporator
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2700/00—Sensing or detecting of parameters; Sensors therefor
- F25B2700/21—Temperatures
- F25B2700/2115—Temperatures of a compressor or the drive means therefor
- F25B2700/21151—Temperatures of a compressor or the drive means therefor at the suction side of the compressor
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2700/00—Sensing or detecting of parameters; Sensors therefor
- F25B2700/21—Temperatures
- F25B2700/2115—Temperatures of a compressor or the drive means therefor
- F25B2700/21152—Temperatures of a compressor or the drive means therefor at the discharge side of the compressor
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2700/00—Sensing or detecting of parameters; Sensors therefor
- F25B2700/21—Temperatures
- F25B2700/2115—Temperatures of a compressor or the drive means therefor
- F25B2700/21156—Temperatures of a compressor or the drive means therefor of the motor
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2700/00—Sensing or detecting of parameters; Sensors therefor
- F25B2700/21—Temperatures
- F25B2700/2117—Temperatures of an evaporator
- F25B2700/21175—Temperatures of an evaporator of the refrigerant at the outlet of the evaporator
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
- Y02B30/70—Efficient control or regulation technologies, e.g. for control of refrigerant flow, motor or heating
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Air Conditioning Control Device (AREA)
Abstract
Description
本揭露總體上涉及暖通空調系統。具體地,本揭露涉及用於對蒸氣壓縮系統中的電子膨脹閥(EEV)進行控制之系統及方法。 The present disclosure relates generally to heating, ventilation and air conditioning systems. In particular, the present disclosure relates to systems and methods for controlling electronic expansion valves (EEVs) in vapor compression systems.
加熱、通風及空氣調節(Heating,Ventilating and Air Conditioning,HVAC,簡稱「暖通空調」)系統存在廣泛的應用。例如,住宅、商業和工業系統用於利用諸如製冷劑等流體來控制住宅和建築物中的溫度與空氣。HVAC系統可以使製冷劑循環通過蒸發器與冷凝器之間的閉合回路,製冷劑在蒸發器處吸收熱量,製冷劑在冷凝器處釋放熱量。例如,製冷劑可以從第一流體中吸收熱量,並且將熱量傳遞至第二流體,以最終冷卻第一流體和/或加熱第二流體。在流經蒸發器時,製冷劑通過從第一流體中吸收熱量而蒸發成蒸氣。然後,壓縮機對蒸氣進行壓縮以導致蒸氣的壓力和/或溫度上升,以便隨後通過冷凝器 中的第二流體進行冷卻,從而將熱量從第一流體傳遞至第二流體。 Heating, Ventilating and Air Conditioning (HVAC, referred to as "HVAC") systems are widely used. For example, residential, commercial and industrial systems are used to control the temperature and air in homes and buildings using fluids such as refrigerants. HVAC systems circulate a refrigerant through a closed loop between an evaporator and a condenser, where the refrigerant absorbs heat at the evaporator, and where the refrigerant releases heat at the condenser. For example, a refrigerant may absorb heat from a first fluid and transfer heat to a second fluid to ultimately cool the first fluid and/or heat the second fluid. While passing through the evaporator, the refrigerant evaporates into a vapor by absorbing heat from the first fluid. The compressor then compresses the vapor causing an increase in the pressure and/or temperature of the vapor for subsequent passage through the condenser Cooling the second fluid in the fluid transfers heat from the first fluid to the second fluid.
在一些情況下,蒸氣在壓縮機的入口處係過熱的,以確保製冷劑在進入壓縮機之前處於蒸氣狀態。為了控制進入壓縮機的製冷劑的過熱量,現有系統包括對壓縮機內的蒸氣進行冷卻的液體注入裝置。例如,液體注入裝置將液體製冷劑液滴注入到壓縮機中或壓縮機的入口處,以對進入壓縮機的蒸氣的過熱量和/或離開壓縮機的蒸氣的溫度進行調整。遺憾的是,液體注入裝置包括附加部件(例如,管、泵、噴嘴等)以將液體製冷劑注入到壓縮機中。此外,將液體製冷劑注入到壓縮機中可能降低壓縮機的性能,並且因此降低HVAC系統的性能。 In some cases, the vapor is superheated at the inlet of the compressor to ensure that the refrigerant is in a vapor state before entering the compressor. To control the superheat of the refrigerant entering the compressor, existing systems include liquid injection means to cool the vapor within the compressor. For example, the liquid injection device injects liquid refrigerant droplets into the compressor or at the inlet of the compressor to adjust the superheat of the vapor entering the compressor and/or the temperature of the vapor exiting the compressor. Unfortunately, liquid injection devices include additional components (eg, tubes, pumps, nozzles, etc.) to inject liquid refrigerant into the compressor. Furthermore, injecting liquid refrigerant into the compressor may reduce the performance of the compressor, and thus the performance of the HVAC system.
在一個實施方式中,一種暖通空調(HVAC)系統,包括:具有製冷劑的蒸氣壓縮系統;該蒸氣壓縮系統的壓縮機,該壓縮機被配置成使該製冷劑循環通過該蒸氣壓縮系統;該蒸氣壓縮系統的膨脹裝置,該膨脹裝置被配置成通過該蒸氣壓縮系統的製冷劑的流量進行調整;以及控制器,該控制器被配置成基於測得的進入該壓縮機的製冷劑的過熱量、測得的離開該壓縮機的製冷劑的排放溫度或其組合來調整該膨脹裝置的位置,使得測得的進入該壓縮機的製冷劑的過熱量達到目標過熱量、測得的離開該壓縮機的製冷劑的排放溫度達到目標排放溫度或其組合。 In one embodiment, a heating, ventilation and air conditioning (HVAC) system includes: a vapor compression system having a refrigerant; a compressor of the vapor compression system configured to circulate the refrigerant through the vapor compression system; An expansion device of the vapor compression system, the expansion device configured to adjust the flow of refrigerant through the vapor compression system; and a controller configured to based on the measured superheat of the refrigerant entering the compressor amount, the measured discharge temperature of the refrigerant leaving the compressor, or a combination thereof to adjust the position of the expansion device so that the measured superheat of refrigerant entering the compressor reaches the target superheat, the measured The discharge temperature of the refrigerant of the compressor reaches the target discharge temperature or a combination thereof.
在另一個實施方式中,一個或多個有形非暫態機器可讀媒體包括處理器可執行指令,這些指令用於:接收進入蒸氣壓縮系統的壓縮機的製冷劑的溫度和壓力的第一回饋指示,利用進入該蒸氣壓縮系統的壓縮機的製冷劑的溫度和壓力來確定測得的進入該蒸氣壓縮系統的壓縮機的製冷劑的過熱量,接收離開該蒸氣壓縮系統的壓縮機的製冷劑的排放溫度的第二回饋指示,並且基於該測得的進入該壓縮機的製冷劑的過熱量、該測得的離開該壓縮機的製冷劑的排放溫度或其組合來調整該蒸氣壓縮系統的膨脹裝置的位置,從而使得進入該壓縮機的製冷劑達到目標過熱量、離開該壓縮機的製冷劑達到目標排放溫度或其組合。 In another embodiment, one or more tangible, non-transitory machine-readable media include processor-executable instructions for: receiving a first feedback of temperature and pressure of refrigerant entering a compressor of a vapor compression system Indicating, using the temperature and pressure of the refrigerant entering the compressor of the vapor compression system to determine the measured superheat of the refrigerant entering the compressor of the vapor compression system, receiving the refrigerant leaving the compressor of the vapor compression system a second feedback indication of the discharge temperature of the compressor, and adjust the vapor compression system based on the measured superheat of the refrigerant entering the compressor, the measured discharge temperature of the refrigerant leaving the compressor, or a combination thereof The location of the expansion device so that refrigerant entering the compressor reaches a target superheat, refrigerant leaving the compressor reaches a target discharge temperature, or a combination thereof.
在另一個實施方式中,一種方法包括:接收進入蒸氣壓縮系統的壓縮機的製冷劑的溫度和壓力的第一回饋指示,利用進入該蒸氣壓縮系統的壓縮機的製冷劑的溫度和壓力來確定測得的進入該蒸氣壓縮系統的壓縮機的製冷劑的過熱量,接收離開該蒸氣壓縮系統的壓縮機的製冷劑的排放溫度的第二回饋指示,並且基於該測得的進入該壓縮機的製冷劑的過熱量、該測得的離開該壓縮機的製冷劑的排放溫度或其組合來調整該蒸氣壓縮系統的膨脹裝置的位置,從而使得進入該壓縮機的製冷劑達到目標過熱量、離開該壓縮機的製冷劑達到目標排放溫度或其組合。 In another embodiment, a method includes receiving a first feedback indication of the temperature and pressure of refrigerant entering a compressor of a vapor compression system, using the temperature and pressure of refrigerant entering a compressor of a vapor compression system to determine a measured superheat of refrigerant entering the compressor of the vapor compression system, receiving a second feedback indication of a discharge temperature of refrigerant exiting the compressor of the vapor compression system, and based on the measured superheat of refrigerant entering the compressor The superheat of the refrigerant, the measured discharge temperature of the refrigerant leaving the compressor, or a combination thereof to adjust the position of the expansion device of the vapor compression system so that the refrigerant entering the compressor reaches a target superheat, leaves The compressor's refrigerant reaches the target discharge temperature, or a combination thereof.
10:加熱、通風、空氣調節和製冷(HVAC&R)系統 10: Heating, ventilation, air conditioning and refrigeration (HVAC&R) systems
12:建築物 12: Buildings
14:蒸氣壓縮系統 14: Vapor Compression System
16:鍋爐 16: Boiler
18:空氣返回管 18: Air return pipe
20:空氣供應管 20: Air supply pipe
22:空氣處理機 22: Air handler
24:管道 24: pipeline
72:蒸氣壓縮系統 72: Vapor Compression System
73:製冷劑回路 73: Refrigerant circuit
74:壓縮機 74: Compressor
76:冷凝器 76: condenser
78:膨脹閥或膨脹裝置 78: Expansion valve or expansion device
80:蒸發器 80: evaporator
82:控制台 82: Console
84:模數(A/D)轉換器 84: Analog-to-digital (A/D) converter
86:微處理器 86: Microprocessor
88:非易失性記憶體 88: Non-volatile memory
90:介面板 90:Interface board
92:變速驅動裝置(VSD) 92:Variable Speed Drive (VSD)
94:馬達 94: motor
96:環境空氣 96: ambient air
98:供應空氣流 98: Supply air flow
100:控制電路 100: control circuit
104:控制器 104: Controller
106:處理器 106: Processor
108:記憶體 108: memory
110、112、114、116、118:感測器 110, 112, 114, 116, 118: sensors
120:致動器 120: Actuator
140:流程圖 140: Flowchart
142、144、148、150、154:框 142, 144, 148, 150, 154: frame
146:第一控制模組 146: The first control module
152:第二控制模組 152: Second control module
圖1係根據本揭露的一個方面的可以採用一個或多個HVAC單元的用於建築物環境管理的環境控制之示意圖;圖2係根據本揭露的一個方面的可以用於圖1的HVAC單元的蒸氣壓縮系統之示意圖;圖3係根據本揭露的一個方面的圖2的蒸氣壓縮系統之示意圖;並且圖4係根據本揭露的一個方面的可以用於對圖2和圖3的蒸氣壓縮系統的電子膨脹閥進行調整的過程之框圖。 1 is a schematic diagram of environmental control for building environmental management that may employ one or more HVAC units according to one aspect of the present disclosure; FIG. 2 is a schematic diagram of the HVAC unit of FIG. 3 is a schematic diagram of the vapor compression system of FIG. 2 according to one aspect of the present disclosure; and FIG. 4 is a schematic diagram of the vapor compression system of FIGS. 2 and 3 according to one aspect of the present disclosure. Block diagram of the process of adjusting the electronic expansion valve.
本揭露的實施方式涉及暖通空調(HVAC)系統,該系統對膨脹裝置(例如,電子膨脹閥(EEV))的位置進行調整以控制進入壓縮機的製冷劑的過熱量(例如,吸入過熱度)和/或從壓縮機排放的製冷劑的溫度(例如,排放溫度)。根據本揭露的實施方式,HVAC系統包括一個或多個控制裝置,這些裝置被配置成對膨脹裝置的位置進行調整以控制吸入過熱度和/或排放溫度。如以上討論的,現有的HVAC系統使用將液體製冷劑液滴注入到壓縮機中的液體注入裝置。遺憾的是,液體注入裝置使用的附加部件增加了HVAC系統的成本。此外,由於液體製冷劑與壓縮機的活動部件接觸,所以液體注入裝置降低了壓縮機的性能。 Embodiments of the present disclosure relate to heating, ventilation, and air conditioning (HVAC) systems that adjust the position of an expansion device (e.g., an electronic expansion valve (EEV)) to control the superheat (e.g., suction superheat) of refrigerant entering a compressor. ) and/or the temperature of the refrigerant discharged from the compressor (eg, discharge temperature). According to an embodiment of the present disclosure, the HVAC system includes one or more control devices configured to adjust the position of the expansion device to control suction superheat and/or discharge temperature. As discussed above, existing HVAC systems use liquid injection devices that inject droplets of liquid refrigerant into the compressor. Unfortunately, the additional components used by the liquid injection devices add to the cost of the HVAC system. Furthermore, the liquid injection device degrades the performance of the compressor due to the liquid refrigerant coming into contact with the moving parts of the compressor.
因此,對膨脹裝置進行調節以控制壓縮機的吸入過熱度和/或排放溫度,可以從HVAC系統中消除液體注入裝置並且 改善壓縮機的性能。在一些實施方式中,在HVAC系統的第一組運行參數下利用第一控制模組(例如,吸入過熱模組)對膨脹裝置進行控制,並且在HVAC系統的第二組運行參數下利用第二控制模組(例如,排放溫度模組)對膨脹裝置進行控制。例如,在啟動條件期間(例如,在啟動壓縮機運行時達預定時間量)和/或當進入壓縮機的製冷劑的過熱量(例如,由製冷劑的壓力和溫度來確定)超過第一閾值時,可以利用第一控制模組。此外,當從壓縮機排放的製冷劑的溫度超過第二閾值時,可以利用第二控制模組。在某些實施方式中,HVAC系統包括第一控制器(例如,第一比例積分微分(PID)控制器)和第二控制器(例如,第二PID控制器),該第一控制器包括第一控制模組,該第二控制器包括第二控制模組。在其他實施方式中,HVAC系統包括單個控制器(例如,PID控制器),該單個控制器包括第一控制模組與第二控制模組兩者。在任何情況下,基於流入壓縮機的製冷劑的過熱量(例如,吸入過熱度)和從壓縮機排放的製冷劑的溫度(例如,排放溫度)來對膨脹裝置進行調整。如此,可以在不將液滴注入到壓縮機中的情況下對製冷劑的溫度進行控制,從而增加了壓縮機和/或HVAC系統的效率。 Therefore, adjusting the expansion device to control the compressor suction superheat and/or discharge temperature can eliminate the liquid injection device from the HVAC system and Improve compressor performance. In some embodiments, the expansion device is controlled using a first control module (e.g., a suction superheat module) under a first set of operating parameters of the HVAC system, and a second control module is used under a second set of operating parameters of the HVAC system. A control module (eg, a discharge temperature module) controls the expansion device. For example, during start-up conditions (e.g., when starting the compressor to run for a predetermined amount of time) and/or when the superheat of the refrigerant entering the compressor (e.g., as determined by the pressure and temperature of the refrigerant) exceeds a first threshold , the first control module can be used. Additionally, a second control module may be utilized when a temperature of refrigerant discharged from the compressor exceeds a second threshold. In certain embodiments, an HVAC system includes a first controller (eg, a first proportional-integral-derivative (PID) controller) and a second controller (eg, a second PID controller), the first controller including a second A control module, the second controller includes a second control module. In other embodiments, the HVAC system includes a single controller (eg, a PID controller) that includes both the first control module and the second control module. In any case, the expansion device is adjusted based on the amount of superheat of the refrigerant flowing into the compressor (eg, suction superheat) and the temperature of the refrigerant discharged from the compressor (eg, discharge temperature). In this way, the temperature of the refrigerant can be controlled without injecting liquid droplets into the compressor, thereby increasing the efficiency of the compressor and/or the HVAC system.
現在轉到附圖,圖1係用於典型商業環境的建築物12中的加熱、通風、空氣調節和製冷(Heating,Ventilating,Air Conditioning and Refrigeration,HVAC&R)系統10的環境的實施方式之透視圖。HVAC&R系統10可以包括蒸氣壓縮系統14,該蒸氣壓縮系統供應可以用於冷卻建築物12的冷凍液體。
HVAC&R系統10還可以包括供應溫暖液體以加熱建築物12的鍋爐16以及使空氣循環通過建築物12的空氣分配系統。空氣分配系統還可以包括空氣返回管18、空氣供應管20和/或空氣處理機22。在一些實施方式中,空氣處理機22可以包括熱交換器,該熱交換器通過管道24連接至鍋爐16和蒸氣壓縮系統14。空氣處理機22中的熱交換器可以接收來自鍋爐16的加熱液體或來自蒸氣壓縮系統14的冷凍液體,這取決於HVAC&R系統10的運行模式。HVAC&R系統10示出為在建築物12的每個樓層上具有單獨的空氣處理機,但是在其他實施方式中,HVAC&R系統10可以包括可以在樓層之間共用的空氣處理機22和/或其他部件。
Turning now to the drawings, FIG. 1 is a perspective view of an embodiment of an environment for a Heating, Ventilating, Air Conditioning and Refrigeration (HVAC&R)
圖2係可以在上述HVAC單元12中使用的蒸氣壓縮系統72之實施方式。蒸氣壓縮系統72可以使製冷劑循環通過以壓縮機74開始的製冷劑回路73。該回路還可以包括冷凝器76、(多個)膨脹閥或(多個)膨脹裝置78以及蒸發器80。蒸氣壓縮系統72可以進一步包括控制台82,該控制台具有模數(A/D)轉換器84、微處理器86、非易失性記憶體88和/或介面板90。控制台82及其部件可以用於基於來自操作者、來自對運行條件進行檢測的蒸氣壓縮系統72的感測器等的回饋來對蒸氣壓縮系統72的運行進行調整。
FIG. 2 is an embodiment of a
在一些實施方式中,蒸氣壓縮系統72可以使用變速驅動裝置(VSD)92、馬達94、壓縮機74、冷凝器76、膨脹閥或膨脹裝置78和/或蒸發器80中的一個或多個。馬達94可以驅動壓縮機74並且可以由變速驅動裝置(VSD)92供電。VSD92從AC
電源接收具有特定的固定線電壓和固定線頻率的交流(AC)電力,並且向馬達94提供具有可變電壓和頻率的電力。在其他實施方式中,馬達94可以直接由AC或直流(DC)電源供電。馬達94可以包括可由VSD供電或直接由AC或DC電源供電的任何類型的電動馬達,例如開關磁阻馬達、感應馬達、電子整流永磁馬達或其他合適的馬達。
In some embodiments,
壓縮機74對製冷劑蒸氣進行壓縮並且通過排放通道將蒸氣輸送至冷凝器76。在一些實施方式中,壓縮機74可以是離心式壓縮機。由壓縮機74輸送至冷凝器76的製冷劑蒸氣可以將熱量傳遞至穿過冷凝器76的流體,例如周圍或環境空氣96。由於與環境空氣96進行熱量傳遞,製冷劑蒸氣可以在冷凝器76中冷凝成製冷劑液體。來自冷凝器76的液體製冷劑可以流過膨脹裝置78到達蒸發器80。
輸送至蒸發器80的液體製冷劑可以從另一氣流中吸收熱量,例如提供給建築物10或住宅52的供應空氣流98。例如,供應空氣流98可以包括周圍或環境空氣、來自建築物的回流空氣或兩者組合。蒸發器80中的液體製冷劑可以經歷從液態製冷劑到製冷劑蒸氣的相變。以這種方式,蒸發器38可以經由與製冷劑進行熱傳遞來降低供應空氣流98的溫度。此後,蒸氣製冷劑離開蒸發器80並且通過抽吸管線返回至壓縮機74以完成循環。
The liquid refrigerant delivered to
在一些實施方式中,除了蒸發器80之外,蒸氣壓縮系統72可以進一步包括再加熱盤管。例如,再熱盤管可以定位在
蒸發器相對於供應空氣流98的下游,並且可以在供應空氣流98過冷時對供應空氣流98進行再加熱,以便在將供應空氣流98引導至建築物10或住宅52之前從供應空氣流98中除去水分。
In some embodiments,
應當理解的是,本文所述的任何特徵都可以與HVAC單元12、住宅加熱和冷卻系統50或其他HVAC系統合併。此外,雖然在對提供至建築物或其他負載的供應空氣流進行直接加熱和冷卻的實施方式的內容中描述了本文所揭露的特徵,但是本揭露的實施方式也可以應用於其他HVAC系統。例如,本文所述的特徵可以應用於機械冷卻系統、自由冷卻系統、冷卻器系統或其他加熱泵或製冷應用。
It should be understood that any of the features described herein may be incorporated with the
如以上討論的,在一些實施方式中,膨脹裝置78係電子膨脹閥(EEV),可以對其進行調整以便對進入和/或離開壓縮機74的製冷劑的溫度進行控制。現有的系統使用液體注入系統來控制壓縮機74中的製冷劑的溫度。遺憾的是,液體注入系統可以降低壓縮機74和/或HVAC單元12的效率。因此,本揭露的實施方式涉及在HVAC系統的第一組運行參數下利用第一控制模組(例如,吸入過熱模組)、以及在HVAC系統的第二組運行參數下利用第二控制模組(例如,排放溫度模組)對膨脹裝置78進行控制。例如,在啟動條件期間(例如,在啟動壓縮機74運行時達預定時間量)和/或當進入壓縮機74的製冷劑的溫度超過第一閾值時,可以利用第一控制模組。此外,當從壓縮機74排放的製冷劑的溫度超過第二閾值時,可以利用第二控制模組。
As discussed above, in some embodiments,
圖3展示了控制電路100,其可以用於控制如圖2所述的蒸氣壓縮系統72中的膨脹裝置78的運行。可以基於進入壓縮機74(例如,壓縮機74的吸入口)的製冷劑的過熱量和/或離開壓縮機74(例如,壓縮機74的排放口)的製冷劑的溫度來調整膨脹裝置78的位置。即控制電路100可以調整膨脹裝置78的位置以獲得製冷劑的流量,該製冷劑的流量使得在蒸發器80出口處和/或壓縮機74入口處的製冷劑的過熱量達到目標過熱量。此外,控制電路100可以調整膨脹裝置78的位置,以達到導致從壓縮機74排放的製冷劑的溫度達到目標排放溫度的製冷劑的流速。控制電路100可以包括控制器104,例如微控制器。控制器104可以包括處理器106,該處理器可操作地聯接至記憶體108以執行軟體,例如用於控制膨脹裝置78的位置的軟體。而且,處理器106可以包括多個處理器、一個或多個“通用”微處理器、一個或多個專用微處理器和/或一個或多個專用積體電路(ASICS)或其某個組合。例如,處理器106可以包括一個或多個精簡指令集(RISC)處理器、高級RISC機器(ARM)處理器、具有增強型RISC(PowerPC)處理器的性能優化、現場可程式設計閘陣列(FPGA)積體電路、圖形處理單元(GPU)或任何其他合適的處理裝置。
FIG. 3 illustrates a
記憶體件108可以包括易失性記憶體(例如隨機存取記憶體(RAM))、非易失性記憶體(例如唯讀記憶體(ROM))、快閃記憶體或其任何組合。記憶體108可以存儲可以用於多種不同用途的各種資訊。例如,記憶體108可以存儲處理器可執行指
令(例如,固件或軟體),使得處理器106執行諸如用於控制膨脹裝置78的指令。
處理器106可以執行從蒸氣壓縮系統72的一個或多個感測器接收一個或多個信號的指令。例如,控制電路100(例如,控制系統)可以包括定位在蒸氣壓縮系統72的多個不同部件上或周圍的感測器110、112、114、116和/或118。例如,控制電路100可以包括溫度感測器110以及定位在蒸發器80的出口處的壓力感測器112。溫度感測器110可以向控制器104發送信號,指示當製冷劑離開蒸發器80時製冷劑的溫度。類似地,壓力感測器112可以向控制器104發送信號,指示當製冷劑離開蒸發器80時製冷劑的壓力。處理器106可以從溫度感測器110和壓力感測器112接收各個相應信號,並且確定當製冷劑離開蒸發器80(和/或進入壓縮機74)時製冷劑的過熱度,這指示相對於製冷劑飽和點的製冷劑中的熱量。例如,處理器106可以通過使用存儲在記憶體108中的查找表來確定過熱度,該查找表限定了過熱度與蒸發器80的出口處(和/或壓縮機74的入口處)的製冷劑的溫度和壓力之間的關係。查找表可以基於製冷劑的物理特性(例如,飽和點、數量等)。
此外,控制電路100可以包括溫度感測器114(例如,第二溫度感測器),該溫度感測器監測從壓縮機74排出的製冷劑的溫度。如此,處理器106可以確定來自壓縮機74的製冷劑的排放溫度,並且將排放溫度與閾值溫度、預定溫度範圍或其組合進行比較。另外地或可替代地,控制電路100可以包括溫度感
測器116(例如,第三溫度感測器),該溫度感測器監測被配置成對壓縮機74進行驅動的馬達94的溫度。如此,處理器106可以確定馬達溫度,並且將馬達溫度與閾值馬達溫度、預定馬達溫度範圍或其組合進行比較。在一些實施方式中,環境溫度感測器118可以定位在蒸氣壓縮系統72附近以檢測周圍空氣的溫度。雖然詳細描述了感測器110、112、114、116和/或118,但是可以使用對蒸氣壓縮系統72的運行條件進行檢測的任何合適的感測器。
Additionally, the
處理器106可以接收指示蒸氣壓縮系統72的運行條件(例如,溫度、壓力、振動等)的一個或多個信號。然後,處理器106可以配置成基於指示蒸氣壓縮系統72的運行條件的一個或多個信號來啟動和/或使用處理器106的控制模組。例如,處理器106可以將預定的離開蒸發器80(和/或進入壓縮機74)的製冷劑的過熱量(例如,目標過熱量或設定點過熱量)與測得的離開蒸發器80(和/或進入壓縮機74)的製冷劑的過熱量進行比較。此外,處理器106可以將預定的離開壓縮機74的製冷劑的排放溫度(例如,目標排放溫度或設定點排放溫度)與測得的離開壓縮機74的製冷劑的排放溫度進行比較。然後處理器106可以基於由處理器106執行的比較來確定合適的控制模組以使用和/或啟用。
當處理器106在第一控制模組(例如,吸入過熱度控制)下操作時,處理器106基於離開蒸發器80和/或進入壓縮機74的製冷劑的目標過熱度與測得的過熱度之間的差來調整膨脹裝置
78。例如,如果目標過熱度高於製冷劑飽和點10華氏度(℉)並且測得的過熱度(例如,基於離開蒸發器80和/或進入壓縮機74的製冷劑的溫度和壓力)比飽和點高5℉,則處理器106可以向膨脹裝置78的致動器120(例如,馬達或步進馬達)發送信號以調整膨脹裝置78的位置。如此,可以調整膨脹裝置78的位置以降低導向蒸發器80的製冷劑的流速,從而增加製冷劑的過熱量以最終達到10℉的目標過熱度。
When the
此外,當處理器106在第二控制模組(例如,排放溫度控制)下操作時,處理器106基於離開壓縮機74的製冷劑的目標排放溫度與測得的排放溫度之間的差來調整膨脹裝置78。例如,當目標排放溫度為175℉、並且測得的排放溫度為160℉時,處理器106經由致動器120來調整膨脹裝置78的位置。如此,調整膨脹裝置78的位置以減小通過壓縮機74的製冷劑的流量並提高從壓縮機74排放的製冷劑的溫度。進一步地,在一些實施方式中,除了基於製冷劑的排放溫度來調整膨脹裝置78的位置之外或取而代之,處理器106可以基於驅動壓縮機74的馬達94的溫度(例如,由感測器116測量)來調整膨脹裝置78的位置。
Additionally, when the
控制器104可以包括一個或多個比例積分微分(PID)控制器、模糊邏輯控制器或任何其他合適的控制器104以執行控制模組,該控制模組對膨脹裝置78進行調整以達到目標過熱量、目標排放溫度和/或目標馬達溫度。基於從一個或多個感測器110、112、114、116和/或118測得的運行參數,控制器104在
不同控制模組之間(例如,吸入過熱度控制模組、排放溫度控制模組和/或馬達溫度控制模組)切換。
例如,圖4係流程圖140之框圖,其展示了通過控制器104執行以在控制模組之間進行操作和切換的邏輯。例如,在框142,壓縮機74不起作用(例如,斷電或不啟用)。如此,蒸氣壓縮系統72可能不使製冷劑循環。因此,不對膨脹裝置78進行調整以對製冷劑到蒸發器80的流速進行控制,因為製冷劑沒有經由壓縮機74循環通過蒸氣壓縮系統72。
For example, FIG. 4 is a block diagram of a
在框144,可以使壓縮機74的啟動序列開始,並且控制器104在第一控制模組146(例如,吸入過熱度控制)下操作。例如,第一控制模組146可以包括啟動序列,由此控制器104向膨脹裝置78發送信號,將膨脹裝置78的位置調整至啟動位置達預定時間量(例如,1秒、2秒、3秒、4秒、5秒或超過5秒)。例如,當膨脹裝置78處於啟動位置時,膨脹裝置78可以使流速相對較高的製冷劑循環通過蒸氣壓縮系統72,使得蒸氣壓縮系統72可以迅速達到穩狀運行。
At
在框148,一旦膨脹裝置78的啟動位置的預定時間量已經過去,控制器104可以經歷第一控制模組146的吸入過熱度控制斜坡。例如,一旦蒸氣壓縮系統72基本上達到穩狀運行,則控制器104對膨脹裝置78進行調整,使得離開蒸發器80和進入壓縮機74(例如,壓縮機74的吸入口)的製冷劑的過熱度達到目標過熱度。如此,控制器104向膨脹裝置78發送第二信號,以基於從感測器110、112、114、116和/或118接收的回饋來調整膨脹
裝置78的位置。在一些實施方式中,控制器104被配置成將膨脹裝置78調整至閾值位置(例如,使最小量的製冷劑循環通過蒸氣壓縮系統72的預定位置)或基於目標過熱度的命令位置。例如,命令位置由控制器104確定為係使得離開蒸發器80和進入壓縮機74的製冷劑的過熱度達到目標過熱度的膨脹裝置78的位置。控制器104將閾值位置與命令位置進行比較,並且選擇與通過蒸氣壓縮系統72的較高流速的製冷劑相對應的位置。換言之,控制器104可以將膨脹裝置78的位置與同通過蒸氣壓縮系統72的製冷劑的流速成比例的值相關聯。如此,控制器104對位置(例如,閾值位置或命令位置)進行選擇,其包括較高的值而不會阻斷製冷劑循環通過蒸氣壓縮系統72。
At
此外,在框150,一旦測得的製冷劑的過熱度達到目標過熱度,則控制器104可以在第一控制模組146的吸入過熱度控制下操作。在一些實施方式中,吸入過熱度控制可以類似於吸入過熱度控制斜坡,如框148所示,對膨脹裝置78的位置進行較小的調整(例如,吸入過熱度控制斜坡可以對膨脹裝置78的位置進行較大的調整以迅速達到目標過熱度)。換句話說,框150的吸入過熱度控制用於使測得的離開蒸發器80和進入壓縮機74的製冷劑的過熱度保持在目標過熱度。因此,在框150的吸入過熱度控制期間對膨脹裝置78進行相對較小的調節。
Additionally, at
在框150的吸入過熱度控制期間,控制器104向膨脹裝置78發送第三信號,以基於從感測器110、112、114、116和/或118接收的回饋來調整膨脹裝置78的位置。控制器104被配置成
將膨脹裝置78調整到閾值位置(例如,使最小量的製冷劑循環通過蒸氣壓縮系統72的預定位置)或基於目標過熱度的命令位置。在一些實施方式中,框150的吸入過熱度控制的閾值位置與框148的吸入過熱度控制斜坡的閾值位置相同。然而,在其他實施方式中,框150的吸入過熱度控制的閾值位置不同於框架148的吸入過熱度控制斜坡的閾值位置。在任何情況下,命令位置由控制器104確定為係使得離開蒸發器80和進入壓縮機74的製冷劑的過熱度達到目標過熱度的膨脹裝置78的位置。控制器104將閾值位置與命令位置進行比較,並且選擇與通過蒸氣壓縮系統72的較高流速的製冷劑相對應(或者與通過蒸氣壓縮系統72的製冷劑的流速相對應的較高值)的位置,使得不會阻斷製冷劑循環通過蒸氣壓縮系統72。
During suction superheat control at
如上所述,控制器104被配置成基於由感測器110、112、114、116和/或118監測的蒸氣壓縮系統72的運行參數而在第一控制模組146和第二控制模組152之間切換。例如,控制器104可以被配置成至少基於離開壓縮機74的製冷劑的排放溫度(例如,由感測器114測量)從第一控制模組146(例如,吸入過熱度控制)切換至第二控制模組152(例如,排放溫度控制)。控制器104可以將來自感測器114的測得的排放溫度與存儲在控制器104的記憶體108中的一個或多個排放溫度閾值進行比較。在一些實施方式中,當測得的排放溫度超過第一排放溫度閾值達預定時間量(例如,1秒、2秒、3秒、4秒、5秒或超過5秒)時,控制器104從第一控制模組146切換至第二控制模組152。此外,
控制器可以被配置成當測得的排放溫度超過第二排放溫度閾值時立即從第一控制模組146切換至第二控制模組152,其中第二排放溫度閾值比第一排放溫度閾值大一個偏移量。在一些實施方式中,第一排放溫度閾值與第二排放溫度閾值之間的偏移量介於5℉和50℉之間、介於7℉和25℉之間或介於8℉和15℉之間。
As described above,
當控制器104在第二控制模組152下操作時,控制器104基於測得的排放溫度來調整膨脹裝置78的位置以達到目標排放溫度,如框154所示。例如,當測得的排放溫度低於目標排放溫度時,控制器104發送信號以調整膨脹裝置78的位置,以減少通過蒸氣壓縮系統72的製冷劑的流量(例如,減少通過蒸發器80的製冷劑的流量提高了從壓縮機74排放的製冷劑的溫度)。類似地,當測得的排放溫度超過目標排放溫度時,控制器104發送信號以調整膨脹裝置78的位置,以增加通過蒸氣壓縮系統72的製冷劑的流量(例如,增加通過蒸發器80的製冷劑的流量降低了從壓縮機74排放的製冷劑的溫度)。如上所述,在其他實施方式中,除了來自壓縮機74的製冷劑的排放溫度之外或者取而代之,第二控制模組152可以基於馬達94的溫度來調整膨脹裝置78的位置。
When the
如上所述,從控制器104發送的信號可以包括膨脹裝置78的位置,該位置選自於閾值位置(例如,使最少量的製冷劑循環通過蒸氣壓縮系統72的預定位置)和基於測得的排放溫度的命令位置。在一些實施方式中,框154的排放溫度控制的閾值位置與框148的吸入過熱度斜坡控制和/或框150的吸入過熱度控
制的閾值位置相同或不同。命令位置由控制器104確定為係使得離開壓縮機74的製冷劑的排放溫度達到目標排放溫度的膨脹裝置78的位置。控制器104將閾值位置與命令位置進行比較,並且選擇與通過蒸氣壓縮系統72的較高流速的製冷劑相對應的位置。換言之,控制器104可以將膨脹裝置78的位置與同通過蒸氣壓縮系統72的製冷劑的流速成比例的值相關聯。如此,控制器104對位置(例如,閾值位置或命令位置)進行選擇,其包括較高的值而不會阻斷製冷劑循環通過蒸氣壓縮系統72。
As noted above, the signal sent from
在一些實施方式中,第二控制模組152超控第一控制模組146(例如,吸入過熱度超控)。例如,在某些情況下,調整膨脹裝置78以達到目標排放溫度使得吸入過熱度降低到預定量以下。如此,儘管製冷劑的過熱度低於目標過熱度,但是控制器104仍然會超控第一控制模組146。
In some implementations, the
此外,控制器104從感測器110和112接收回饋,這些感測器指示離開蒸發器80(和/或進入壓縮機74)的製冷劑的溫度和壓力。如上所述,離開蒸發器80(和/和進入壓縮機74)的製冷劑的溫度和壓力可以用於確定製冷劑的過熱量。當測得的過熱量(例如,從來自感測器110和112的回饋中確定)超過第一過熱閾值達預定時間量(例如,1秒、2秒、3秒、4秒、5秒或超過5秒),則控制器104可以從第二控制模組152切換至第一控制模組146(例如,從框154至框150)。此外,當測得的過熱量超過第二過熱閾值時,控制器104可以立即從第二控制模組152切換至第一控制模組146,其中第二過熱閾值大於第一過熱閾值。
然後,控制器104可以在第一控制模組146下操作,並且基於測得的離開蒸發器80(和/或進入壓縮機74)的製冷劑的過熱量來調整膨脹裝置78的位置。
Additionally,
如上所述,本揭露的實施方式可以提供用於HVAC系統的運行的一個或多個技術效果以提高壓縮機的效率。例如,本揭露的實施方式涉及基於離開蒸發器的製冷劑和/或進入壓縮機的製冷劑的過熱量以及離開壓縮機的製冷劑的排放溫度來控制電子膨脹閥的位置。電子膨脹閥的控制使得能夠在不使用將液體製冷劑液滴引導到壓縮機中的液體注入系統的情況下對通過壓縮機的製冷劑的運行溫度進行調節。消除和/或減少壓縮機內的液滴提高了壓縮機的效率,並且因此改善了HVAC系統的運行。本說明書中的技術效果和技術問題係示例性而非限制性的。應當注意的是,在本說明書中描述的實施方式可以具有其他技術效果並且可以解決其他技術問題。 As noted above, embodiments of the present disclosure may provide one or more technical effects for operation of an HVAC system to increase compressor efficiency. For example, embodiments of the present disclosure relate to controlling the position of the electronic expansion valve based on the amount of superheat of the refrigerant exiting the evaporator and/or the refrigerant entering the compressor and the discharge temperature of the refrigerant exiting the compressor. Control of the electronic expansion valve enables regulation of the operating temperature of the refrigerant passing through the compressor without the use of a liquid injection system that directs liquid refrigerant droplets into the compressor. Eliminating and/or reducing liquid droplets within the compressor increases the efficiency of the compressor and thus improves the operation of the HVAC system. The technical effects and technical problems in this specification are illustrative rather than restrictive. It should be noted that the implementations described in this specification may have other technical effects and may solve other technical problems.
雖然僅展示和描述了某些特徵和實施方式,但是在實質上不背離申請專利範圍中記載的主題的新穎性教導和優點的情況下,熟悉該項技術者可以想到許多修改和變化(例如,各種元件的大小、尺寸、結構、形狀和比例、參數值(例如,溫度、壓力等)、安裝佈置、材料的使用、顏色、定向等的變化)。可以根據替代性實施方式對任何過程或方法步驟的順序或序列進行改變或重新排序。因此,應理解的是,所附申請專利範圍旨在覆蓋落入本揭露的真實精神內的所有這樣的修改和變化。另外,為了提供對示例性實施方式的簡要描述,可能尚未描述 實際實現方式的所有特徵(即與當前預期的最佳模式無關的那些特徵或者與啟用無關的那些特徵)。應該理解的是,在任何這種實際實現方式的開發中(如在任何工程或設計項目中),可能作出大量實現方式特定的決定。這種開發工作可能是複雜且耗時的,但是對於從本揭露中受益的普通技術人員來說,這仍是常規的設計、生產和製造工作,而無需過多實驗。 While only certain features and implementations have been shown and described, many modifications and changes (e.g., Variations in size, dimensions, structure, shape and proportions of various elements, parameter values (eg, temperature, pressure, etc.), mounting arrangements, use of materials, colors, orientations, etc.). The order or sequence of any process or method steps may be varied or re-sequenced according to alternative embodiments. It is, therefore, to be understood that the appended claims are intended to cover all such modifications and changes as fall within the true spirit of the disclosure. Additionally, in order to provide a brief description of the exemplary embodiments, the All features of the actual implementation (i.e., those features that are not relevant to the currently expected best mode or those features that are not relevant to enabling). It should be appreciated that in the development of any such actual implementation, as in any engineering or design project, a number of implementation-specific decisions may be made. Such a development effort might be complex and time consuming, but would nevertheless be a routine undertaking of design, production, and fabrication without undue experimentation for those of ordinary skill having the benefit of this disclosure.
140:流程圖 140: Flowchart
142、144、148、150、154:框 142, 144, 148, 150, 154: box
146:第一控制模組 146: The first control module
152:第二控制模組 152: Second control module
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