TWI800804B - 退膜、除膠、化銅三合一方法及其系統 - Google Patents

退膜、除膠、化銅三合一方法及其系統 Download PDF

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Publication number
TWI800804B
TWI800804B TW110109192A TW110109192A TWI800804B TW I800804 B TWI800804 B TW I800804B TW 110109192 A TW110109192 A TW 110109192A TW 110109192 A TW110109192 A TW 110109192A TW I800804 B TWI800804 B TW I800804B
Authority
TW
Taiwan
Prior art keywords
removal
copper plating
glue
film
film removal
Prior art date
Application number
TW110109192A
Other languages
English (en)
Other versions
TW202228483A (zh
Inventor
李齊良
Original Assignee
大陸商柏承科技（昆山）股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 大陸商柏承科技（昆山）股份有限公司 filed Critical 大陸商柏承科技（昆山）股份有限公司
Priority to KR1020210077870A priority Critical patent/KR20220128919A/ko
Publication of TW202228483A publication Critical patent/TW202228483A/zh
Application granted granted Critical
Publication of TWI800804B publication Critical patent/TWI800804B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/067—Etchants
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
    • H05K3/146—By vapour deposition
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Paints Or Removers (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • ing And Chemical Polishing (AREA)
TW110109192A 2021-01-13 2021-03-15 退膜、除膠、化銅三合一方法及其系統 TWI800804B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020210077870A KR20220128919A (ko) 2021-01-13 2021-06-16 필름 박리, 탈검 및 코퍼링을 위한 쓰리 인 원 방법

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN2021100422520 2021-01-13
CN202110042252.0A CN112911804A (zh) 2021-01-13 2021-01-13 能防除胶污染的退膜、除胶、化铜三合一工艺

Publications (2)

Publication Number Publication Date
TW202228483A TW202228483A (zh) 2022-07-16
TWI800804B true TWI800804B (zh) 2023-05-01

Family

ID=76112697

Family Applications (3)

Application Number Title Priority Date Filing Date
TW111117227A TW202243557A (zh) 2021-01-13 2021-03-15 除膠、化銅二合一系統
TW110109192A TWI800804B (zh) 2021-01-13 2021-03-15 退膜、除膠、化銅三合一方法及其系統
TW110202765U TWM619792U (zh) 2021-01-13 2021-03-15 退膜、除膠、化銅三合一或除膠、化銅二合一系統

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW111117227A TW202243557A (zh) 2021-01-13 2021-03-15 除膠、化銅二合一系統

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW110202765U TWM619792U (zh) 2021-01-13 2021-03-15 退膜、除膠、化銅三合一或除膠、化銅二合一系統

Country Status (3)

Country Link
KR (1) KR20220128919A (zh)
CN (1) CN112911804A (zh)
TW (3) TW202243557A (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112911804A (zh) * 2021-01-13 2021-06-04 柏承科技(昆山)股份有限公司 能防除胶污染的退膜、除胶、化铜三合一工艺
CN116634675B (zh) * 2023-05-25 2023-11-21 江苏博敏电子有限公司 一种消除任意层互连印刷线路板芯板层激光孔残胶的方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201515536A (zh) * 2013-08-02 2015-04-16 Zhen Ding Technology Co Ltd 電路板及其製作方法
TW201740778A (zh) * 2016-05-13 2017-11-16 Suzhou Weipeng Electrical Technology Co Ltd 一種超薄金屬層的印刷線路板的製備方法
CN111263527A (zh) * 2020-01-21 2020-06-09 柏承科技(昆山)股份有限公司 高密度印刷电路板制造方法
TW202041119A (zh) * 2019-03-27 2020-11-01 日商三井金屬鑛業股份有限公司 印刷配線板用金屬箔、附載體金屬箔及覆金屬層積板、以及使用其等的印刷配線板的製造方法
TWM619792U (zh) * 2021-01-13 2021-11-21 大陸商柏承科技（昆山）股份有限公司 退膜、除膠、化銅三合一或除膠、化銅二合一系統

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201515536A (zh) * 2013-08-02 2015-04-16 Zhen Ding Technology Co Ltd 電路板及其製作方法
TW201740778A (zh) * 2016-05-13 2017-11-16 Suzhou Weipeng Electrical Technology Co Ltd 一種超薄金屬層的印刷線路板的製備方法
TW202041119A (zh) * 2019-03-27 2020-11-01 日商三井金屬鑛業股份有限公司 印刷配線板用金屬箔、附載體金屬箔及覆金屬層積板、以及使用其等的印刷配線板的製造方法
CN111263527A (zh) * 2020-01-21 2020-06-09 柏承科技(昆山)股份有限公司 高密度印刷电路板制造方法
TWM619792U (zh) * 2021-01-13 2021-11-21 大陸商柏承科技（昆山）股份有限公司 退膜、除膠、化銅三合一或除膠、化銅二合一系統

Also Published As

Publication number Publication date
TWM619792U (zh) 2021-11-21
TW202228483A (zh) 2022-07-16
TW202243557A (zh) 2022-11-01
CN112911804A (zh) 2021-06-04
KR20220128919A (ko) 2022-09-22

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