TWI800521B - 基板處理方法、記憶媒體及基板處理系統 - Google Patents

基板處理方法、記憶媒體及基板處理系統 Download PDF

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Publication number
TWI800521B
TWI800521B TW107126989A TW107126989A TWI800521B TW I800521 B TWI800521 B TW I800521B TW 107126989 A TW107126989 A TW 107126989A TW 107126989 A TW107126989 A TW 107126989A TW I800521 B TWI800521 B TW I800521B
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TW
Taiwan
Prior art keywords
substrate processing
memory medium
processing system
processing method
substrate
Prior art date
Application number
TW107126989A
Other languages
English (en)
Other versions
TW201921471A (zh
Inventor
束野憲人
五師源太郎
増住拓朗
清瀬浩巳
福井祥吾
Original Assignee
日商東京威力科創股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商東京威力科創股份有限公司 filed Critical 日商東京威力科創股份有限公司
Publication of TW201921471A publication Critical patent/TW201921471A/zh
Application granted granted Critical
Publication of TWI800521B publication Critical patent/TWI800521B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
TW107126989A 2017-08-09 2018-08-03 基板處理方法、記憶媒體及基板處理系統 TWI800521B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2017-154574 2017-08-09
JP2017154574 2017-08-09
JP2018-094906 2018-05-16
JP2018094906A JP7109989B2 (ja) 2017-08-09 2018-05-16 基板処理方法、記憶媒体及び基板処理システム

Publications (2)

Publication Number Publication Date
TW201921471A TW201921471A (zh) 2019-06-01
TWI800521B true TWI800521B (zh) 2023-05-01

Family

ID=65523663

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107126989A TWI800521B (zh) 2017-08-09 2018-08-03 基板處理方法、記憶媒體及基板處理系統

Country Status (3)

Country Link
JP (1) JP7109989B2 (zh)
KR (1) KR102581314B1 (zh)
TW (1) TWI800521B (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7236338B2 (ja) * 2019-06-28 2023-03-09 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP2023013682A (ja) 2021-07-16 2023-01-26 東京エレクトロン株式会社 基板処理装置及び基板処理方法
TW202345223A (zh) 2022-03-10 2023-11-16 日商東京威力科創股份有限公司 基板處理方法及基板處理裝置
JP7318066B1 (ja) 2022-05-26 2023-07-31 セメス カンパニー，リミテッド 基板処理装置
JP2024082145A (ja) 2022-12-07 2024-06-19 東京エレクトロン株式会社 基板処理装置および基板処理方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001307991A (ja) * 2000-04-25 2001-11-02 Tokyo Electron Ltd 膜形成方法
US20110220152A1 (en) * 2010-03-15 2011-09-15 Yukiko Kitajima Supercritical drying method and supercritical drying apparatus
TW201709405A (zh) * 2015-06-16 2017-03-01 思可林集團股份有限公司 基板處理方法及基板處理裝置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5522124B2 (ja) 2011-06-28 2014-06-18 東京エレクトロン株式会社 基板処理装置、基板処理方法および記憶媒体

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001307991A (ja) * 2000-04-25 2001-11-02 Tokyo Electron Ltd 膜形成方法
US20110220152A1 (en) * 2010-03-15 2011-09-15 Yukiko Kitajima Supercritical drying method and supercritical drying apparatus
TW201709405A (zh) * 2015-06-16 2017-03-01 思可林集團股份有限公司 基板處理方法及基板處理裝置

Also Published As

Publication number Publication date
TW201921471A (zh) 2019-06-01
KR102581314B1 (ko) 2023-09-22
KR20190016919A (ko) 2019-02-19
JP2019033246A (ja) 2019-02-28
JP7109989B2 (ja) 2022-08-01

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