TWI800708B - 疊對計量系統及方法 - Google Patents

疊對計量系統及方法 Download PDF

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Publication number
TWI800708B
TWI800708B TW109102368A TW109102368A TWI800708B TW I800708 B TWI800708 B TW I800708B TW 109102368 A TW109102368 A TW 109102368A TW 109102368 A TW109102368 A TW 109102368A TW I800708 B TWI800708 B TW I800708B
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TW
Taiwan
Prior art keywords
metrology system
overlay metrology
overlay
metrology
Prior art date
Application number
TW109102368A
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English (en)
Other versions
TW202043930A (zh
Inventor
托爾 馬西安諾
諾亞 阿蒙
丹那 克林
Original Assignee
美商科磊股份有限公司
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Publication date
Application filed by 美商科磊股份有限公司 filed Critical 美商科磊股份有限公司
Publication of TW202043930A publication Critical patent/TW202043930A/zh
Application granted granted Critical
Publication of TWI800708B publication Critical patent/TWI800708B/zh

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70633—Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/47—Scattering, i.e. diffuse reflection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/706843—Metrology apparatus
    • G03F7/706849—Irradiation branch, e.g. optical system details, illumination mode or polarisation control
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F17/00—Digital computing or data processing equipment or methods, specially adapted for specific functions
    • G06F17/10—Complex mathematical operations
    • G06F17/18—Complex mathematical operations for evaluating statistical data, e.g. average values, frequency distributions, probability functions, regression analysis

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Data Mining & Analysis (AREA)
  • Pure & Applied Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Theoretical Computer Science (AREA)
  • Computational Mathematics (AREA)
  • Mathematical Physics (AREA)
  • Mathematical Analysis (AREA)
  • Mathematical Optimization (AREA)
  • Databases & Information Systems (AREA)
  • Analytical Chemistry (AREA)
  • Operations Research (AREA)
  • Algebra (AREA)
  • Evolutionary Biology (AREA)
  • Bioinformatics & Computational Biology (AREA)
  • Software Systems (AREA)
  • General Engineering & Computer Science (AREA)
  • Bioinformatics & Cheminformatics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Probability & Statistics with Applications (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
TW109102368A 2019-01-28 2020-01-22 疊對計量系統及方法 TWI800708B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201962797557P 2019-01-28 2019-01-28
US62/797,557 2019-01-28
US16/741,574 US11333982B2 (en) 2019-01-28 2020-01-13 Scaling metric for quantifying metrology sensitivity to process variation
US16/741,574 2020-01-13

Publications (2)

Publication Number Publication Date
TW202043930A TW202043930A (zh) 2020-12-01
TWI800708B true TWI800708B (zh) 2023-05-01

Family

ID=71731223

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109102368A TWI800708B (zh) 2019-01-28 2020-01-22 疊對計量系統及方法

Country Status (6)

Country Link
US (1) US11333982B2 (zh)
JP (1) JP7303887B2 (zh)
KR (1) KR102513718B1 (zh)
CN (1) CN113330550B (zh)
TW (1) TWI800708B (zh)
WO (1) WO2020159737A1 (zh)

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JP7539467B2 (ja) * 2019-11-28 2024-08-23 ケーエルエー コーポレイション 計測ランドスケープに基づく計測最適化のためのシステムおよび方法
US11774863B2 (en) * 2021-10-21 2023-10-03 Kla Corporation Induced displacements for improved overlay error metrology
US11861824B1 (en) * 2022-02-03 2024-01-02 Kla Corporation Reference image grouping in overlay metrology
KR102662778B1 (ko) * 2023-08-16 2024-04-30 (주)오로스 테크놀로지 오버레이 계측 장치의 타겟 선정 방법 및 오버레이 계측 장치의 타겟 선정 시스템

Citations (4)

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US20150185625A1 (en) * 2013-12-30 2015-07-02 Asml Netherlands B.V. Method and apparatus for design of a metrology target
US20180088470A1 (en) * 2016-09-27 2018-03-29 Asml Netherlands B.V. Metrology recipe selection
TW201832020A (zh) * 2016-02-22 2018-09-01 荷蘭商Ａｓｍｌ荷蘭公司 對度量衡資料之貢獻之分離
TW201843534A (zh) * 2017-05-03 2018-12-16 荷蘭商Ａｓｍｌ荷蘭公司 度量衡參數判定及度量衡配方選擇

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JP3391328B2 (ja) * 1993-02-08 2003-03-31 株式会社ニコン 位置合わせ方法、その位置合わせ方法を用いた露光方法、その露光方法を用いたデバイス製造方法、そのデバイス製造方法で製造されたデバイス、並びに位置合わせ装置、その位置合わせ装置を備えた露光装置
US7791727B2 (en) 2004-08-16 2010-09-07 Asml Netherlands B.V. Method and apparatus for angular-resolved spectroscopic lithography characterization
JP2006216796A (ja) * 2005-02-03 2006-08-17 Nikon Corp 基準パターン情報の作成方法、位置計測方法、位置計測装置、露光方法、及び露光装置
US8045786B2 (en) 2006-10-24 2011-10-25 Kla-Tencor Technologies Corp. Waferless recipe optimization
US7873504B1 (en) 2007-05-07 2011-01-18 Kla-Tencor Technologies Corp. Computer-implemented methods, carrier media, and systems for creating a metrology target structure design for a reticle layout
KR101461457B1 (ko) 2009-07-31 2014-11-13 에이에스엠엘 네델란즈 비.브이. 계측 방법 및 장치, 리소그래피 시스템, 및 리소그래피 처리 셀
WO2011023517A1 (en) 2009-08-24 2011-03-03 Asml Netherlands B.V. Metrology method and apparatus, lithographic apparatus, lithographic processing cell and substrate comprising metrology targets
JP5377595B2 (ja) 2011-03-25 2013-12-25 富士フイルム株式会社 着色感放射線性組成物、カラーフィルタ、着色パターンの製造方法、カラーフィルタの製造方法、固体撮像素子、及び液晶表示装置
EP2694983B1 (en) 2011-04-06 2020-06-03 KLA-Tencor Corporation Method and system for providing a quality metric for improved process control
US10267746B2 (en) * 2014-10-22 2019-04-23 Kla-Tencor Corp. Automated pattern fidelity measurement plan generation
WO2016086056A1 (en) * 2014-11-25 2016-06-02 Kla-Tencor Corporation Analyzing and utilizing landscapes
US9903711B2 (en) * 2015-04-06 2018-02-27 KLA—Tencor Corporation Feed forward of metrology data in a metrology system
WO2016162231A1 (en) * 2015-04-10 2016-10-13 Asml Netherlands B.V. Method and apparatus for inspection and metrology
KR102152301B1 (ko) 2015-12-04 2020-09-07 에이에스엠엘 네델란즈 비.브이. 메트롤로지 데이터로부터의 통계적 계층 재구성
US10645777B2 (en) 2016-12-05 2020-05-05 Lutron Technology Company Llc User interface for controlling intensity and color of a lighting load
CN110383442B (zh) 2017-02-28 2023-10-10 科磊股份有限公司 确定随机行为对叠加计量数据的影响

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150185625A1 (en) * 2013-12-30 2015-07-02 Asml Netherlands B.V. Method and apparatus for design of a metrology target
TW201832020A (zh) * 2016-02-22 2018-09-01 荷蘭商Ａｓｍｌ荷蘭公司 對度量衡資料之貢獻之分離
US20180088470A1 (en) * 2016-09-27 2018-03-29 Asml Netherlands B.V. Metrology recipe selection
TW201843534A (zh) * 2017-05-03 2018-12-16 荷蘭商Ａｓｍｌ荷蘭公司 度量衡參數判定及度量衡配方選擇

Also Published As

Publication number Publication date
US11333982B2 (en) 2022-05-17
KR20210110897A (ko) 2021-09-09
TW202043930A (zh) 2020-12-01
JP2022523692A (ja) 2022-04-26
US20200241428A1 (en) 2020-07-30
JP7303887B2 (ja) 2023-07-05
KR102513718B1 (ko) 2023-03-23
WO2020159737A1 (en) 2020-08-06
CN113330550B (zh) 2024-08-06
CN113330550A (zh) 2021-08-31

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