TWI800594B - 用於設計及製作含有微加工元件陣列之裝置之方法，以及從此類方法獲得之裝置 - Google Patents

用於設計及製作含有微加工元件陣列之裝置之方法，以及從此類方法獲得之裝置 Download PDF

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Publication number
TWI800594B
TWI800594B TW108102196A TW108102196A TWI800594B TW I800594 B TWI800594 B TW I800594B TW 108102196 A TW108102196 A TW 108102196A TW 108102196 A TW108102196 A TW 108102196A TW I800594 B TWI800594 B TW I800594B
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TW
Taiwan
Prior art keywords
processes
fabricating
designing
micro
array
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TW108102196A
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English (en)
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TW201940250A (zh
Inventor
布魯諾 奇瑟蘭
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法商索泰克公司
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Publication of TW201940250A publication Critical patent/TW201940250A/zh
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Publication of TWI800594B publication Critical patent/TWI800594B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
    • H10N30/204—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
    • H10N30/2047—Membrane type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/0292—Electrostatic transducers, e.g. electret-type
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Micromachines (AREA)
  • Mechanical Light Control Or Optical Switches (AREA)
  • Piezo-Electric Transducers For Audible Bands (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
TW108102196A 2018-01-22 2019-01-21 用於設計及製作含有微加工元件陣列之裝置之方法，以及從此類方法獲得之裝置 TWI800594B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1850484A FR3077163B1 (fr) 2018-01-22 2018-01-22 Procedes de conception et de fabrication d'un dispositif comprenant un reseau d'elements micro-usines, dispositif obtenu a l'issu de tels procedes
FR1850484 2018-01-22

Publications (2)

Publication Number Publication Date
TW201940250A TW201940250A (zh) 2019-10-16
TWI800594B true TWI800594B (zh) 2023-05-01

Family

ID=63834070

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108102196A TWI800594B (zh) 2018-01-22 2019-01-21 用於設計及製作含有微加工元件陣列之裝置之方法，以及從此類方法獲得之裝置

Country Status (9)

Country Link
US (2) US11706989B2 (zh)
EP (1) EP3743951B1 (zh)
JP (1) JP7215802B2 (zh)
KR (1) KR102702480B1 (zh)
CN (1) CN111630673A (zh)
FR (1) FR3077163B1 (zh)
SG (1) SG11202006940SA (zh)
TW (1) TWI800594B (zh)
WO (1) WO2019141952A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11684951B2 (en) * 2019-08-08 2023-06-27 Bfly Operations, Inc. Micromachined ultrasonic transducer devices having truncated circle shaped cavities
FR3113772B1 (fr) * 2020-08-25 2024-05-03 Commissariat Energie Atomique Procédé de transfert d’une couche mince sur un substrat receveur comportant des cavités et une région dépourvue de cavités en bordure d’une face de collage

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200515530A (en) * 2003-10-17 2005-05-01 Imec Inter Uni Micro Electr Method for processing a semiconductor device comprising a silicon-oxy-nitride dielectric layer
TW201739074A (zh) * 2016-03-23 2017-11-01 伊凡聖斯股份有限公司 使用熔合結合工序在ｃｍｏｓ基板上整合ａｉｎ超音波傳感器

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JP3955241B2 (ja) 2002-06-21 2007-08-08 東京エレクトロン株式会社 Ｍｅｍｓアレイとその製造方法及びそれに基づくｍｅｍｓデバイスの製造方法
TWI240990B (en) 2003-10-21 2005-10-01 Ind Tech Res Inst Preparation method of micromachined capacitive ultrasonic transducer by the imprinting technique
US7293462B2 (en) * 2005-01-04 2007-11-13 General Electric Company Isolation of short-circuited sensor cells for high-reliability operation of sensor array
JP4790315B2 (ja) 2005-05-31 2011-10-12 オリンパスメディカルシステムズ株式会社 静電容量型超音波振動子
DE102008002668A1 (de) * 2008-06-26 2009-12-31 Robert Bosch Gmbh Mikromechanisches Bauelement und entsprechendes Herstellungsverfahren
JP5578836B2 (ja) * 2008-12-25 2014-08-27 キヤノン株式会社 電気機械変換装置及びその作製方法
JP5511260B2 (ja) 2009-08-19 2014-06-04 キヤノン株式会社 容量型電気機械変換装置、及びその感度調整方法
JP5876500B2 (ja) * 2010-12-03 2016-03-02 リサーチ・トライアングル・インスティチュート 超音波振動子の形成方法、ならびに関連する装置
US9375850B2 (en) * 2013-02-07 2016-06-28 Fujifilm Dimatix, Inc. Micromachined ultrasonic transducer devices with metal-semiconductor contact for reduced capacitive cross-talk
DE102013213071B3 (de) * 2013-07-04 2014-10-09 Robert Bosch Gmbh Herstellungsverfahren für ein mikromechanisches Bauteil
WO2016011172A1 (en) * 2014-07-16 2016-01-21 Chirp Microsystems Piezoelectric micromachined ultrasonic transducers using two bonded substrates
KR20160023154A (ko) * 2014-08-21 2016-03-03 삼성전자주식회사 초음파 변환기
WO2016194591A1 (ja) * 2015-05-29 2016-12-08 株式会社日立製作所 超音波トランスデューサおよび超音波検査装置
KR101765006B1 (ko) * 2016-04-21 2017-08-10 한국세라믹기술원 지향성 스피커용 압전 트랜스듀서 및 이를 포함하는 지향성 스피커
US10539539B2 (en) * 2016-05-10 2020-01-21 Invensense, Inc. Operation of an ultrasonic sensor
US10441975B2 (en) * 2016-05-10 2019-10-15 Invensense, Inc. Supplemental sensor modes and systems for ultrasonic transducers
WO2018157050A1 (en) * 2017-02-27 2018-08-30 Butterfly Network, Inc. Capacitive micromachined ultrasonic transducers (cmuts) and related apparatus and methods
JP6438544B2 (ja) 2017-07-31 2018-12-12 キヤノン株式会社 電気機械変換装置
US10966683B2 (en) 2018-03-22 2021-04-06 Exo Imaging Inc. Integrated ultrasonic transducers

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200515530A (en) * 2003-10-17 2005-05-01 Imec Inter Uni Micro Electr Method for processing a semiconductor device comprising a silicon-oxy-nitride dielectric layer
TW201739074A (zh) * 2016-03-23 2017-11-01 伊凡聖斯股份有限公司 使用熔合結合工序在ｃｍｏｓ基板上整合ａｉｎ超音波傳感器

Also Published As

Publication number Publication date
EP3743951A1 (fr) 2020-12-02
JP7215802B2 (ja) 2023-01-31
SG11202006940SA (en) 2020-08-28
CN111630673A (zh) 2020-09-04
US20210043826A1 (en) 2021-02-11
TW201940250A (zh) 2019-10-16
JP2021511219A (ja) 2021-05-06
US11706989B2 (en) 2023-07-18
FR3077163A1 (fr) 2019-07-26
WO2019141952A1 (fr) 2019-07-25
KR102702480B1 (ko) 2024-09-05
FR3077163B1 (fr) 2021-08-27
KR20200108441A (ko) 2020-09-18
EP3743951B1 (fr) 2021-11-10
US20230292618A1 (en) 2023-09-14

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