SG11202006940SA - Processes for Designing and Fabricating a Device Comprising an Array of Micro-Machined Elements, Device Obtained at the End of Such Processes - Google Patents
Processes for Designing and Fabricating a Device Comprising an Array of Micro-Machined Elements, Device Obtained at the End of Such ProcessesInfo
- Publication number
- SG11202006940SA SG11202006940SA SG11202006940SA SG11202006940SA SG11202006940SA SG 11202006940S A SG11202006940S A SG 11202006940SA SG 11202006940S A SG11202006940S A SG 11202006940SA SG 11202006940S A SG11202006940S A SG 11202006940SA SG 11202006940S A SG11202006940S A SG 11202006940SA
- Authority
- SG
- Singapore
- Prior art keywords
- processes
- fabricating
- designing
- micro
- array
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
- H10N30/204—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
- H10N30/2047—Membrane type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/0292—Electrostatic transducers, e.g. electret-type
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR1850484A FR3077163B1 (en) | 2018-01-22 | 2018-01-22 | DESIGN AND MANUFACTURING METHODS OF A DEVICE INCLUDING A NETWORK OF MICRO-FACTORY ELEMENTS, A DEVICE OBTAINED AS A RESULT OF SUCH METHODS |
| PCT/FR2019/050108 WO2019141952A1 (en) | 2018-01-22 | 2019-01-18 | Methods for designing and producing a device comprising an array of micromachined elements, and device produced by said methods |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11202006940SA true SG11202006940SA (en) | 2020-08-28 |
Family
ID=63834070
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11202006940SA SG11202006940SA (en) | 2018-01-22 | 2019-01-18 | Processes for Designing and Fabricating a Device Comprising an Array of Micro-Machined Elements, Device Obtained at the End of Such Processes |
Country Status (9)
| Country | Link |
|---|---|
| US (2) | US11706989B2 (en) |
| EP (1) | EP3743951B1 (en) |
| JP (1) | JP7215802B2 (en) |
| KR (1) | KR20200108441A (en) |
| CN (1) | CN111630673A (en) |
| FR (1) | FR3077163B1 (en) |
| SG (1) | SG11202006940SA (en) |
| TW (1) | TWI800594B (en) |
| WO (1) | WO2019141952A1 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11684951B2 (en) * | 2019-08-08 | 2023-06-27 | Bfly Operations, Inc. | Micromachined ultrasonic transducer devices having truncated circle shaped cavities |
| FR3113772B1 (en) * | 2020-08-25 | 2024-05-03 | Commissariat A Lenergie Atomique Et Aux Energies Alternatives | Process for transferring a thin layer onto a receiving substrate comprising cavities and a region devoid of cavities at the edge of a bonding face |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3955241B2 (en) | 2002-06-21 | 2007-08-08 | 東京エレクトロン株式会社 | MEMS array, manufacturing method thereof, and manufacturing method of MEMS device based thereon |
| EP1524685B1 (en) * | 2003-10-17 | 2013-01-23 | Imec | Method for processing a semiconductor device comprising an silicon-oxy-nitride dielectric layer |
| TWI240990B (en) | 2003-10-21 | 2005-10-01 | Ind Tech Res Inst | Preparation method of micromachined capacitive ultrasonic transducer by the imprinting technique |
| US7293462B2 (en) | 2005-01-04 | 2007-11-13 | General Electric Company | Isolation of short-circuited sensor cells for high-reliability operation of sensor array |
| JP4790315B2 (en) | 2005-05-31 | 2011-10-12 | オリンパスメディカルシステムズ株式会社 | Capacitive ultrasonic transducer |
| JP5578836B2 (en) * | 2008-12-25 | 2014-08-27 | キヤノン株式会社 | Electromechanical transducer and method for manufacturing the same |
| JP5511260B2 (en) | 2009-08-19 | 2014-06-04 | キヤノン株式会社 | Capacitive electromechanical transducer and sensitivity adjustment method thereof |
| JP5876500B2 (en) * | 2010-12-03 | 2016-03-02 | リサーチ・トライアングル・インスティチュート | Ultrasonic vibrator forming method and related apparatus |
| US9375850B2 (en) * | 2013-02-07 | 2016-06-28 | Fujifilm Dimatix, Inc. | Micromachined ultrasonic transducer devices with metal-semiconductor contact for reduced capacitive cross-talk |
| WO2016011172A1 (en) | 2014-07-16 | 2016-01-21 | Chirp Microsystems | Piezoelectric micromachined ultrasonic transducers using two bonded substrates |
| KR20160023154A (en) * | 2014-08-21 | 2016-03-03 | 삼성전자주식회사 | untrasonic transducer |
| JP6470406B2 (en) * | 2015-05-29 | 2019-02-13 | 株式会社日立製作所 | Ultrasonic transducer and ultrasonic inspection device |
| CN108886089B (en) | 2016-03-23 | 2023-04-18 | 应美盛股份有限公司 | Integrating AlN ultrasonic transducers on CMOS substrates using fusion bonding |
| US10441975B2 (en) * | 2016-05-10 | 2019-10-15 | Invensense, Inc. | Supplemental sensor modes and systems for ultrasonic transducers |
| US10539539B2 (en) * | 2016-05-10 | 2020-01-21 | Invensense, Inc. | Operation of an ultrasonic sensor |
| AU2018225762A1 (en) * | 2017-02-27 | 2019-08-22 | Butterfly Network, Inc. | Capacitive micromachined ultrasonic transducers (CMUTs) and related apparatus and methods |
| JP6438544B2 (en) | 2017-07-31 | 2018-12-12 | キヤノン株式会社 | Electromechanical converter |
| US10966683B2 (en) * | 2018-03-22 | 2021-04-06 | Exo Imaging Inc. | Integrated ultrasonic transducers |
-
2018
- 2018-01-22 FR FR1850484A patent/FR3077163B1/en active Active
-
2019
- 2019-01-18 CN CN201980009223.5A patent/CN111630673A/en active Pending
- 2019-01-18 US US16/963,924 patent/US11706989B2/en active Active
- 2019-01-18 SG SG11202006940SA patent/SG11202006940SA/en unknown
- 2019-01-18 EP EP19704360.7A patent/EP3743951B1/en active Active
- 2019-01-18 KR KR1020207021974A patent/KR20200108441A/en not_active Application Discontinuation
- 2019-01-18 WO PCT/FR2019/050108 patent/WO2019141952A1/en unknown
- 2019-01-18 JP JP2020535609A patent/JP7215802B2/en active Active
- 2019-01-21 TW TW108102196A patent/TWI800594B/en active
-
2023
- 2023-05-23 US US18/322,433 patent/US20230292618A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JP2021511219A (en) | 2021-05-06 |
| JP7215802B2 (en) | 2023-01-31 |
| US20210043826A1 (en) | 2021-02-11 |
| EP3743951A1 (en) | 2020-12-02 |
| TW201940250A (en) | 2019-10-16 |
| FR3077163A1 (en) | 2019-07-26 |
| CN111630673A (en) | 2020-09-04 |
| TWI800594B (en) | 2023-05-01 |
| WO2019141952A1 (en) | 2019-07-25 |
| EP3743951B1 (en) | 2021-11-10 |
| FR3077163B1 (en) | 2021-08-27 |
| US11706989B2 (en) | 2023-07-18 |
| KR20200108441A (en) | 2020-09-18 |
| US20230292618A1 (en) | 2023-09-14 |
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