TWI800061B - Plasma treatment device - Google Patents

Plasma treatment device Download PDF

Info

Publication number
TWI800061B
TWI800061B TW110140201A TW110140201A TWI800061B TW I800061 B TWI800061 B TW I800061B TW 110140201 A TW110140201 A TW 110140201A TW 110140201 A TW110140201 A TW 110140201A TW I800061 B TWI800061 B TW I800061B
Authority
TW
Taiwan
Prior art keywords
treatment device
plasma treatment
plasma
treatment
Prior art date
Application number
TW110140201A
Other languages
Chinese (zh)
Other versions
TW202231129A (en
Inventor
徐朝陽
吳磊
王凱麟
Original Assignee
大陸商中微半導體設備（上海）股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 大陸商中微半導體設備（上海）股份有限公司 filed Critical 大陸商中微半導體設備（上海）股份有限公司
Publication of TW202231129A publication Critical patent/TW202231129A/en
Application granted granted Critical
Publication of TWI800061B publication Critical patent/TWI800061B/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H01J37/32633—Baffles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67069—Apparatus for fluid treatment for etching for drying etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32—Processing objects by plasma generation
    • H01J2237/33—Processing objects by plasma generation characterised by the type of processing
    • H01J2237/334—Etching

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Plasma & Fusion (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Drying Of Semiconductors (AREA)
  • Chemical Vapour Deposition (AREA)
  • Plasma Technology (AREA)
TW110140201A 2020-11-27 2021-10-29 Plasma treatment device TWI800061B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202011355183.0 2020-11-27
CN202011355183.0A CN114566415A (en) 2020-11-27 2020-11-27 Plasma processing apparatus

Publications (2)

Publication Number Publication Date
TW202231129A TW202231129A (en) 2022-08-01
TWI800061B true TWI800061B (en) 2023-04-21

Family

ID=81711123

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110140201A TWI800061B (en) 2020-11-27 2021-10-29 Plasma treatment device

Country Status (2)

Country Link
CN (1) CN114566415A (en)
TW (1) TWI800061B (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101088139A (en) * 2004-12-30 2007-12-12 拉姆研究有限公司 Electrically enhancing the confinement of plasma
TWI339404B (en) * 2006-01-27 2011-03-21 Advanced Micro Fab Equip Inc A plasma processing apparatus equipped with plasma confinement apparatus
TWM438698U (en) * 2011-11-23 2012-10-01 Advanced Micro Fabrication Equipment Shanghai Co Ltd Plasma confinement apparatus
TWI494028B (en) * 2008-07-23 2015-07-21 Applied Materials Inc Workpiece support for a plasma reactor with controlled apportionment of rf power to a process kit ring
US10319568B2 (en) * 2013-11-12 2019-06-11 Tokyo Electron Limited Plasma processing apparatus for performing plasma process for target object

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109962000B (en) * 2017-12-25 2022-09-30 中微半导体设备(上海)股份有限公司 Plasma processing device and method capable of reducing pollution particles
CN110416046B (en) * 2018-04-27 2022-03-11 中微半导体设备(上海)股份有限公司 Capacitive coupling plasma processing system with adjustable polar plate distance and method thereof
CN110610841B (en) * 2018-06-14 2022-01-28 中微半导体设备(上海)股份有限公司 Plasma confinement assembly and processing device thereof
JP7264710B2 (en) * 2019-04-23 2023-04-25 株式会社アルバック Plasma processing equipment
CN213212104U (en) * 2020-11-27 2021-05-14 中微半导体设备(上海)股份有限公司 Plasma processing apparatus

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101088139A (en) * 2004-12-30 2007-12-12 拉姆研究有限公司 Electrically enhancing the confinement of plasma
TWI339404B (en) * 2006-01-27 2011-03-21 Advanced Micro Fab Equip Inc A plasma processing apparatus equipped with plasma confinement apparatus
TWI494028B (en) * 2008-07-23 2015-07-21 Applied Materials Inc Workpiece support for a plasma reactor with controlled apportionment of rf power to a process kit ring
TWM438698U (en) * 2011-11-23 2012-10-01 Advanced Micro Fabrication Equipment Shanghai Co Ltd Plasma confinement apparatus
US10319568B2 (en) * 2013-11-12 2019-06-11 Tokyo Electron Limited Plasma processing apparatus for performing plasma process for target object

Also Published As

Publication number Publication date
TW202231129A (en) 2022-08-01
CN114566415A (en) 2022-05-31

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