TWI800032B - 熱介面材料測試裝置 - Google Patents
熱介面材料測試裝置 Download PDFInfo
- Publication number
- TWI800032B TWI800032B TW110138026A TW110138026A TWI800032B TW I800032 B TWI800032 B TW I800032B TW 110138026 A TW110138026 A TW 110138026A TW 110138026 A TW110138026 A TW 110138026A TW I800032 B TWI800032 B TW I800032B
- Authority
- TW
- Taiwan
- Prior art keywords
- testing device
- thermal interface
- interface material
- material testing
- thermal
- Prior art date
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW110138026A TWI800032B (zh) | 2021-10-13 | 2021-10-13 | 熱介面材料測試裝置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW110138026A TWI800032B (zh) | 2021-10-13 | 2021-10-13 | 熱介面材料測試裝置 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW202316108A TW202316108A (zh) | 2023-04-16 |
TWI800032B true TWI800032B (zh) | 2023-04-21 |
Family
ID=86943146
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW110138026A TWI800032B (zh) | 2021-10-13 | 2021-10-13 | 熱介面材料測試裝置 |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI800032B (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI833464B (zh) * | 2022-11-24 | 2024-02-21 | 長聖儀器股份有限公司 | 散熱模組之熱阻量測結果一致化裝置 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI310833B (en) * | 2005-02-04 | 2009-06-11 | Hon Hai Prec Ind Co Ltd | Device and method for measuring thermal conductivity |
TWI321654B (en) * | 2004-09-03 | 2010-03-11 | Hon Hai Prec Ind Co Ltd | A device for measuring thermal conductivity |
US20130301671A1 (en) * | 2012-05-11 | 2013-11-14 | International Business Machines Corporation | Detecting Thermal Interface Material ('TIM') Between A Heat Sink And An Integrated Circuit |
US20150377809A1 (en) * | 2012-05-11 | 2015-12-31 | Lenovo Enterprise Solutions (Singapore) Pte.Ltd. | Detecting thermal interface material ('tim') between a heat sink and an integrated circuit |
-
2021
- 2021-10-13 TW TW110138026A patent/TWI800032B/zh active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI321654B (en) * | 2004-09-03 | 2010-03-11 | Hon Hai Prec Ind Co Ltd | A device for measuring thermal conductivity |
TWI310833B (en) * | 2005-02-04 | 2009-06-11 | Hon Hai Prec Ind Co Ltd | Device and method for measuring thermal conductivity |
US20130301671A1 (en) * | 2012-05-11 | 2013-11-14 | International Business Machines Corporation | Detecting Thermal Interface Material ('TIM') Between A Heat Sink And An Integrated Circuit |
US20150377809A1 (en) * | 2012-05-11 | 2015-12-31 | Lenovo Enterprise Solutions (Singapore) Pte.Ltd. | Detecting thermal interface material ('tim') between a heat sink and an integrated circuit |
Also Published As
Publication number | Publication date |
---|---|
TW202316108A (zh) | 2023-04-16 |
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