TWI799942B - 切斷裝置及切斷品的製造方法 - Google Patents

切斷裝置及切斷品的製造方法 Download PDF

Info

Publication number
TWI799942B
TWI799942B TW110129743A TW110129743A TWI799942B TW I799942 B TWI799942 B TW I799942B TW 110129743 A TW110129743 A TW 110129743A TW 110129743 A TW110129743 A TW 110129743A TW I799942 B TWI799942 B TW I799942B
Authority
TW
Taiwan
Prior art keywords
cutting device
cut product
manufacturing cut
manufacturing
product
Prior art date
Application number
TW110129743A
Other languages
English (en)
Other versions
TW202213478A (zh
Inventor
渡辺創
黄善夏
福元康人
石橋幹司
Original Assignee
日商Ｔｏｗａ股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商Ｔｏｗａ股份有限公司 filed Critical 日商Ｔｏｗａ股份有限公司
Publication of TW202213478A publication Critical patent/TW202213478A/zh
Application granted granted Critical
Publication of TWI799942B publication Critical patent/TWI799942B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW110129743A 2020-09-23 2021-08-12 切斷裝置及切斷品的製造方法 TWI799942B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020158840A JP7068409B2 (ja) 2020-09-23 2020-09-23 切断装置及び切断品の製造方法
JP2020-158840 2020-09-23

Publications (2)

Publication Number Publication Date
TW202213478A TW202213478A (zh) 2022-04-01
TWI799942B true TWI799942B (zh) 2023-04-21

Family

ID=80789702

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110129743A TWI799942B (zh) 2020-09-23 2021-08-12 切斷裝置及切斷品的製造方法

Country Status (4)

Country Link
JP (1) JP7068409B2 (zh)
KR (1) KR20220040393A (zh)
CN (1) CN114256122A (zh)
TW (1) TWI799942B (zh)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016083717A (ja) * 2014-10-24 2016-05-19 Ｔｏｗａ株式会社 ワーク吸着板、ワーク切断装置、ワーク切断方法、およびワーク吸着板の製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5666947B2 (ja) 2011-03-09 2015-02-12 アピックヤマダ株式会社 ワーク吸引治具及びワーク把持方法
JP5979135B2 (ja) 2011-04-26 2016-08-24 株式会社ニコン 基板貼り合わせ装置、基板保持装置、基板貼り合わせ方法、基盤保持方法、積層半導体装置および重ね合わせ基板
JP6935131B2 (ja) 2017-07-13 2021-09-15 株式会社ディスコ 板状の被加工物の切断方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016083717A (ja) * 2014-10-24 2016-05-19 Ｔｏｗａ株式会社 ワーク吸着板、ワーク切断装置、ワーク切断方法、およびワーク吸着板の製造方法
TW201628812A (zh) * 2014-10-24 2016-08-16 Towa Corp 工件吸附板、工件切斷裝置、工件切斷方法、及工件吸附板之製造方法

Also Published As

Publication number Publication date
TW202213478A (zh) 2022-04-01
JP2022052438A (ja) 2022-04-04
JP7068409B2 (ja) 2022-05-16
CN114256122A (zh) 2022-03-29
KR20220040393A (ko) 2022-03-30

Similar Documents

Publication Publication Date Title
JP1738946S (ja) カットポテト製品
ZA201806111B (en) Method of pitting and cutting fruits and multi-lane machine therefor
IT201700111570A1 (it) Apparato e metodo per il taglio al laser o al plasma di pezzi da materiale laminare avvolto in bobina
SG10202008562RA (en) Cutting blade and manufacturing method of cutting blade
EP3939714A4 (en) CUTTING PROCESS AND CUT ARTICLE
JP1738942S (ja) カットポテト製品
GB201907970D0 (en) A cutting element and method of making same
RS61498B1 (sr) Uređaj za sečenje i postupak za odsecanje dužine kontinualne trake za formiranje dela gume
IT201700081298A1 (it) Macchina troncatrice per tagliare prodotti allungati e relativo metodo
JP1722140S (ja) カットポテト製品
TWI799942B (zh) 切斷裝置及切斷品的製造方法
EP3804894A4 (en) METHOD FOR MANUFACTURING A CIRCULAR BAND SAW BLADE AND MANUFACTURING METHOD AND DEVICE
JP1738947S (ja) カットポテト製品
DK3512360T3 (da) Inline-skæresystem til en ekstruderet streng af et analogt kødprodukt,fremgangsmåde til inline-skæring af en ekstruderet streng af et analogt kødprodukt og anvendelse af et inline-skæresystem
GB202214133D0 (en) Tape dispenser having two sided cutter blade and method of manufacture
TWI800424B (zh) 晶棒線切割裝置和晶棒線切割方法
KR20230001649U9 (ko) 흡수성 물품의 개별 포장체 및 흡수성 물품의 개별 포장체의 제조 방법
PL3584024T3 (pl) Brzeszczot piły
IT202200003392A1 (it) Apparato e metodo di taglio capsule
EP3827919A4 (en) CORE CUTTING DEVICE AND CUTTING METHOD USING THE LATTER
IT202200002165A1 (it) Apparato e metodo di taglio per capsule
EP4316757A4 (en) CUTTING DEVICE AND CUTTING PROCESS
JP1738945S (ja) カットポテト製品
JP1749872S (ja) カットポテト製品
JP1738939S (ja) カットポテト製品