TWI799865B - Manufacture method of touch sensing module and motherboard of the touch sensing module - Google Patents

Manufacture method of touch sensing module and motherboard of the touch sensing module Download PDF

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Publication number
TWI799865B
TWI799865B TW110118137A TW110118137A TWI799865B TW I799865 B TWI799865 B TW I799865B TW 110118137 A TW110118137 A TW 110118137A TW 110118137 A TW110118137 A TW 110118137A TW I799865 B TWI799865 B TW I799865B
Authority
TW
Taiwan
Prior art keywords
touch sensing
sensing module
motherboard
manufacture method
touch
Prior art date
Application number
TW110118137A
Other languages
Chinese (zh)
Other versions
TW202245586A (en
Inventor
江顯偉
Original Assignee
大陸商業泓科技（成都）有限公司
業泓科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 大陸商業泓科技（成都）有限公司, 業泓科技股份有限公司 filed Critical 大陸商業泓科技（成都）有限公司
Publication of TW202245586A publication Critical patent/TW202245586A/en
Application granted granted Critical
Publication of TWI799865B publication Critical patent/TWI799865B/en

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Human Computer Interaction (AREA)
  • Multimedia (AREA)
  • Theoretical Computer Science (AREA)
  • Position Input By Displaying (AREA)
TW110118137A 2021-05-14 2021-05-19 Manufacture method of touch sensing module and motherboard of the touch sensing module TWI799865B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202110527891.6A CN113221753B (en) 2021-05-14 2021-05-14 Manufacturing method of touch sensing module and motherboard of touch sensing module
CN202110527891.6 2021-05-14

Publications (2)

Publication Number Publication Date
TW202245586A TW202245586A (en) 2022-11-16
TWI799865B true TWI799865B (en) 2023-04-21

Family

ID=77091928

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110118137A TWI799865B (en) 2021-05-14 2021-05-19 Manufacture method of touch sensing module and motherboard of the touch sensing module

Country Status (2)

Country Link
CN (1) CN113221753B (en)
TW (1) TWI799865B (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201227066A (en) * 2010-12-29 2012-07-01 Au Optronics Corp Touch panel and fabrication method thereof
TW201445384A (en) * 2013-05-30 2014-12-01 Rtr Tech Technology Co Ltd Touch panel and manufacturing method

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JP2006228895A (en) * 2005-02-16 2006-08-31 Alps Electric Co Ltd Three-dimensional circuit module and its manufacturing method
KR20080070318A (en) * 2007-01-26 2008-07-30 삼성전자주식회사 Liquid crystal display panel cutting apparatus and cutting method using the same
KR20100045667A (en) * 2008-10-24 2010-05-04 세메스 주식회사 Substrate cutting apparatus
TWI416384B (en) * 2009-10-06 2013-11-21 Wintek Corp Mother board of touch panel and touch panel
CN101706696B (en) * 2009-11-05 2012-01-25 深超光电（深圳）有限公司 Method and mother board for manufacturing touch control panel
TWI417600B (en) * 2009-12-11 2013-12-01 Century Display Shenzhen Co Method of fabricating touch panel and mother substrate
CN102193667B (en) * 2010-03-12 2013-03-20 胜华科技股份有限公司 Mother board for touch panels
US20120095719A1 (en) * 2010-10-19 2012-04-19 Lenovo (Singapore) Pte. Ltd. Memory thermal management based on slot information
CN102968200B (en) * 2011-09-01 2016-08-03 宸美（厦门）光电有限公司 Eyeglass contactor control device and manufacturing method thereof thereof
CN103365470B (en) * 2013-07-01 2016-02-10 友达光电股份有限公司 Contact panel and manufacture method thereof
CN103412430B (en) * 2013-08-15 2016-04-13 深圳市华星光电技术有限公司 A kind of liquid crystal panel motherboard to be cut and manufacture method thereof
TW201525567A (en) * 2013-12-27 2015-07-01 Wintek Corp Method for fabricating component substrate
CN105022197A (en) * 2014-04-30 2015-11-04 瀚宇彩晶股份有限公司 Mother plate stacking structure and manufacturing method thereof
CN203930286U (en) * 2014-04-30 2014-11-05 瀚宇彩晶股份有限公司 Motherboard stacked structure
CN104635981B (en) * 2014-11-26 2018-06-22 业成光电（深圳）有限公司 Touch module and the touch control display apparatus with the touch module
CN105093632A (en) * 2015-09-01 2015-11-25 京东方科技集团股份有限公司 Display mother board, manufacturing method thereof, display panels and display device
CN106597760A (en) * 2017-03-02 2017-04-26 合肥京东方光电科技有限公司 Display panel mother board and preparation method thereof
CN109976578B (en) * 2019-03-22 2020-09-22 合肥鑫晟光电科技有限公司 Touch substrate, manufacturing method thereof and touch display device
CN109992163B (en) * 2019-04-15 2023-01-03 业成科技（成都）有限公司 Touch sensing module, manufacturing method thereof and electronic device applying touch sensing module
CN112306272A (en) * 2019-07-25 2021-02-02 上海和辉光电有限公司 Touch mother board, touch panel and touch display device
CN111367111B (en) * 2020-04-30 2022-08-23 厦门天马微电子有限公司 Display panel mother board and preparation method of display panel

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201227066A (en) * 2010-12-29 2012-07-01 Au Optronics Corp Touch panel and fabrication method thereof
TW201445384A (en) * 2013-05-30 2014-12-01 Rtr Tech Technology Co Ltd Touch panel and manufacturing method

Also Published As

Publication number Publication date
TW202245586A (en) 2022-11-16
CN113221753B (en) 2023-12-29
CN113221753A (en) 2021-08-06

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