CN103365470B - Contact panel and manufacture method thereof - Google Patents
Contact panel and manufacture method thereof Download PDFInfo
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- CN103365470B CN103365470B CN201310270880.XA CN201310270880A CN103365470B CN 103365470 B CN103365470 B CN 103365470B CN 201310270880 A CN201310270880 A CN 201310270880A CN 103365470 B CN103365470 B CN 103365470B
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Abstract
The invention provides a kind of contact panel and manufacture method thereof, manufacture method comprises: provide motherboard; Induction line layer is formed in the Touch Zone of motherboard; Form perimeter circuit layer in the surrounding zone of motherboard, perimeter circuit layer comprises at least one connection gasket and measurement circuit, and connection gasket is electrically connected corresponding touch-control sensing unit, and measurement circuit is electrically connected corresponding connection gasket; Test signal is passed into test touch-control sensing unit by measurement circuit; The first insulation course is formed in surrounding zone; This first insulation course of patterning, measurement circuit forms open circuit with corresponding connection gasket, and the first insulation course has at least one first contact hole to expose the subregion of corresponding connection gasket; Motherboard is cut to form contact panel along to line of cut.The present invention can make contact panel finished product when ESD test or assembling use, and electrostatic can not enter the measurement circuit come out, thus avoids flexible circuit board, printed circuit-board assembly or touch-control sensing unit to scrap because of damage by static electricity.
Description
Technical field
The invention relates to a kind of contact panel and manufacture method thereof, and relate to a kind of contact panel and the manufacture method thereof of avoiding electrostatic damage especially.
Background technology
Development along with design of electronic products day by day tends to user's guiding, when considering user's operation ease, the product of application touch control panel becomes the main flow on market gradually, such as Smartphone or panel computer, therefore contact panel has become part important and indispensable in these commodity.But, contact panel of the prior art finished product or semi-manufacture carry out electrostatic (ElectroStaticDischarge, ESD) test time, often with being difficult to damage by static electricity (damagebystaticelectricity) problem avoided.
Generally speaking, in order to yield can be judged in advance, after touch-control sensing unit is formed, just need to test contact panel.Contact panel has the measurement circuit be electrically connected with touch-control sensing unit, and measurement circuit extends to motherboard from contact panel, so that before segmentation motherboard, first carries out signal by measurement circuit to touch-control sensing unit and exports input test.But, after motherboard is cut, measurement circuit will certainly come out from the edge of contact panel, this will make follow-up electrostatic test (ElectroStaticDischarge, ESD) or assembling product time, electrostatic can enter contact panel by the above-mentioned measurement circuit come out, and cause the element be electrically connected with measurement circuit in contact panel, such as flexible circuit board, printed circuit-board assembly or touch-control sensing unit are scrapped because of damage by static electricity.
Summary of the invention
Therefore, an object of the present invention is to provide a kind of contact panel and manufacture method thereof, make contact panel finished product when ESD test or contact panel assembling product use, electrostatic can not enter the measurement circuit come out and lead to contact panel inside, with the problem avoiding flexible circuit board, printed circuit-board assembly or touch-control sensing unit to scrap because of damage by static electricity.
For reaching above-mentioned purpose, the invention provides a kind of manufacture method of contact panel, it is characterized in that this manufacture method comprises: provide motherboard, this motherboard has at least one Touch Zone and at least one surrounding zone, and each surrounding zone is around the Touch Zone of correspondence; Form induction line layer in each Touch Zone of this motherboard, this induction line layer has at least one touch-control sensing unit; Perimeter circuit layer is formed in each surrounding zone of this motherboard, this perimeter circuit layer is electrically connected this induction line layer, and this perimeter circuit layer comprises at least one connection gasket and at least one measurement circuit, wherein each connection gasket is electrically connected corresponding touch-control sensing unit, and each measurement circuit is electrically connected corresponding connection gasket; Test signal is passed into test corresponding touch-control sensing unit by each measurement circuit; The first insulation course is formed, to cover this at least one connection gasket and this at least one measurement circuit in each surrounding zone of this motherboard; This first insulation course of patterning, each measurement circuit forms open circuit with corresponding connection gasket, and this first insulation course has at least one first contact hole, and each first contact hole is in order to expose the subregion of corresponding connection gasket; Cut this motherboard to form contact panel along at least one line of cut, the substrate of each contact panel has this Touch Zone and this surrounding zone corresponding with this Touch Zone.
As optional technical scheme, this connection gasket comprises: the first conductive pattern layer, is configured at this surrounding zone of this motherboard; And second conductive pattern layer, be configured in this first conductive pattern layer, and this first conductive pattern layer is between this second conductive pattern layer and this motherboard.
As optional technical scheme, this second conductive pattern layer is formed by identical conductive film layer patterning with this measurement circuit.
As optional technical scheme, this first conductive pattern layer is the first metal layer, and this second conductive pattern layer is the second transparency conducting layer.
As optional technical scheme, this connection is paid somebody's debt and expected repayment later and is comprised the 3rd transparency conducting layer or the 3rd metal level, 3rd transparency conducting layer or the 3rd metal level are configured in this first conductive pattern layer, and the 3rd transparency conducting layer or the 3rd metal level are between this second conductive pattern layer and this first conductive pattern layer.
As optional technical scheme, this manufacture method also comprises: form the second insulation course in each surrounding zone of this motherboard, to cover this at least one connection gasket and this motherboard, and this second insulation course has at least one second contact hole, each second contact hole is in order to expose first contact hole of subregion in correspondence of corresponding connection gasket, and wherein this second insulation course is between this at least one measurement circuit and this motherboard.
As optional technical scheme, this manufacture method each surrounding zone in this in this motherboard forms the first insulation course, also to comprise before the step covering this at least one connection gasket and this at least one measurement circuit: this at least one measurement circuit of patterning, forms open circuit to make each measurement circuit with corresponding connection gasket.
As optional technical scheme, this contact panel also comprises: flexible circuit board, is electrically connected this connection gasket through this first contact hole; And printed circuit-board assembly, be electrically connected this flexible circuit board.
As optional technical scheme, this manufacture method also comprises: form black-matrix layer in each surrounding zone of this motherboard, wherein this black-matrix layer is between this connection gasket and this motherboard.
The present invention also provides a kind of contact panel, and this contact panel has test signal input end, and this contact panel comprises: substrate, and this substrate has Touch Zone and surrounding zone, and this surrounding zone is around this Touch Zone; Induction line layer, is formed at this Touch Zone of this substrate, and this induction line layer has at least one touch-control sensing unit, and this test signal input end is used to pass into test signal in the manufacture process of this contact panel to test this corresponding touch-control sensing unit; Perimeter circuit layer, be formed at this surrounding zone of this substrate, this perimeter circuit layer is electrically connected this induction line layer, and this perimeter circuit layer comprises at least one connection gasket, wherein each connection gasket is electrically connected corresponding touch-control sensing unit, and each connection gasket and this test signal input end form open circuit; And first insulation course, be formed at this surrounding zone of this substrate, in order to cover this at least one connection gasket, and this first insulation course has at least one first contact hole, and each first contact hole is in order to expose the subregion of corresponding connection gasket.
As optional technical scheme, this perimeter circuit layer comprises at least one measurement circuit, this at least one measurement circuit is corresponding with this at least one connection gasket and this test signal input end, and each measurement circuit and corresponding connection gasket form open circuit forms open circuit to make each connection gasket and this test signal input end, this first insulation course covers this at least one measurement circuit.
As optional technical scheme, this connection gasket comprises: the first conductive pattern layer, is configured at this surrounding zone of this substrate; And second conductive pattern layer, be configured in this first conductive pattern layer, and this first conductive pattern layer is between this second conductive pattern layer and this substrate.
As optional technical scheme, this second conductive pattern layer is formed by identical conductive film layer patterning with this measurement circuit.
As optional technical scheme, this first conductive pattern layer is the first metal layer, and this second conductive pattern layer is the second transparency conducting layer.
As optional technical scheme, this connection is paid somebody's debt and expected repayment later and is comprised the 3rd transparency conducting layer or the 3rd metal level, 3rd transparency conducting layer or the 3rd metal level are configured in this first conductive pattern layer, and the 3rd transparency conducting layer or the 3rd metal level are between this second conductive pattern layer and this first conductive pattern layer.
As optional technical scheme, this contact panel also comprises the second insulation course, be formed at this surrounding zone of this substrate, this second insulation course covers this at least one connection gasket and this substrate, and this second insulation course has at least one second contact hole, each second contact hole is in order to expose first contact hole of subregion in correspondence of corresponding connection gasket, and wherein this second insulation course is between this at least one measurement circuit and this substrate.
As optional technical scheme, this contact panel also comprises:
Flexible circuit board, is electrically connected this connection gasket through this first contact hole; And
Printed circuit-board assembly, is electrically connected this flexible circuit board.
As optional technical scheme, this contact panel also comprises black-matrix layer, and be formed at this surrounding zone of this substrate, wherein this black-matrix layer is between this connection gasket and this substrate.
Compared with prior art, the invention provides a kind of contact panel and manufacture method thereof, by utilizing patterning first insulation course after touch-control sensing unit signal testing completes, make to form open circuit between measurement circuit with corresponding connection gasket, thus make contact panel finished product when ESD test or contact panel assembling product use, electrostatic can not enter the measurement circuit come out and lead to contact panel inside, with the problem avoiding flexible circuit board, printed circuit-board assembly or touch-control sensing unit to scrap because of damage by static electricity.
Can be further understood by following detailed Description Of The Invention and institute's accompanying drawings about the advantages and spirit of the present invention.
Accompanying drawing explanation
Figure 1 shows that the schematic diagram of the manufacture method according to contact panel of the present invention;
Figure 2 shows that the flow chart of steps of the manufacture method according to contact panel of the present invention;
Figure 3 shows that the schematic diagram of the first embodiment according to contact panel of the present invention;
Fig. 4 A is depicted as the part-structure diagrammatic cross-section that contact panel is cut A2A2 line in the Fig. 3 of forward position;
Along the diagrammatic cross-section of C2C2 line in Fig. 3 after the contact panel that Fig. 4 B is depicted as the first embodiment is cut;
Figure 5 shows that the contact panel of the first embodiment after being cut along the diagrammatic cross-section of C3C3 line in Fig. 3;
Figure 6 shows that the contact panel of the first embodiment after being cut along the diagrammatic cross-section of the first embodiment of A2A2 line in Fig. 3;
Figure 7 shows that the schematic diagram of the second embodiment according to contact panel of the present invention;
Figure 8 shows that the diagrammatic cross-section of the second embodiment of A3A3 line in contact panel Fig. 7 of the second embodiment.
Embodiment
The technology contents disclosed to make the application is more detailed and complete, and can refer to accompanying drawing and following various specific embodiment of the present invention, mark identical in accompanying drawing represents same or analogous assembly.But those of ordinary skill in the art should be appreciated that hereinafter provided embodiment is not used for limiting the scope that contains of the present invention.In addition, accompanying drawing, only for being schematically illustrated, is not drawn according to its life size.With reference to the accompanying drawings, the embodiment of various aspects of the present invention is described in further detail.
Refer to Fig. 1-Fig. 6, Figure 1 shows that the schematic diagram of the manufacture method according to contact panel of the present invention; Figure 2 shows that the flow chart of steps of the manufacture method according to contact panel of the present invention; Figure 3 shows that the schematic diagram according to contact panel of the present invention; Fig. 4 A is depicted as the diagrammatic cross-section that contact panel is cut the part-structure of A2A2 line in the Fig. 3 of forward position; Along the diagrammatic cross-section of C2C2 line in Fig. 3 after the contact panel that Fig. 4 B is depicted as the first embodiment is cut; Figure 5 shows that the contact panel of the first embodiment after being cut along the diagrammatic cross-section of C3C3 line in Fig. 3; Figure 6 shows that the diagrammatic cross-section of the contact panel of the first embodiment along the first embodiment of A2A2 line in Fig. 3.The invention provides a kind of manufacture method of contact panel 100, above-mentioned manufacture method comprises the following steps.
First, as step S1: provide motherboard 40, wherein motherboard 40 has at least one Touch Zone 23 and at least one surrounding zone 22, and each surrounding zone 22 is around the Touch Zone 23 of correspondence.Wherein, motherboard 40 can be hard substrate or soft substrate plate, and the material of concrete motherboard such as comprises inorganic transparent material (as: glass, quartz or other material), organic transparent material (as: polyalkenes, poly-Hai class, polyalcohols, polyesters, rubber, thermoplastic polymer, thermosetting polymer, poly aromatic hydro carbons, poly-methyl propionyl acid methyl esters class, polycarbonate-based or other or above-mentioned derivant or above-mentioned combination), inorganic transparent materials (as: silicon chip, pottery or other or above-mentioned combination) or above-mentioned combination.For example, motherboard 40 is the use as substrate in the substrate being used in contact panel, and with the glass of inorganic transparent material for implementing example, but not as limit.
Then, as step S2: form induction line layer in each Touch Zone 23 of motherboard 40, induction line layer has at least one touch-control sensing unit.It should be noted that thus embodiments of the invention only depict the concrete structure of the surrounding zone around Touch Zone, and remaining part then repeats no more because main innovation part of the present invention is surrounding zone.
Then, as step S3: form perimeter circuit layer in each surrounding zone 22 of motherboard 40, perimeter circuit layer is electrically connected induction line layer, and perimeter circuit layer comprises at least one connection gasket 25 and at least one measurement circuit 26, wherein each connection gasket 25 is electrically connected corresponding touch-control sensing unit, and each measurement circuit 26 is electrically connected corresponding connection gasket 25.
Then, as step S4: pass into test signal to test corresponding touch-control sensing unit by each measurement circuit 26.Wherein, please continue see Fig. 1, Fig. 4 A and Fig. 6, the mode of test touch-control sensing unit is such as pass into signal by testing cushion 30, this signal is sequentially sent to corresponding touch-control sensing unit via measurement circuit 26, connection gasket 25 and metal routing 24 (wherein metal routing 24 is electrically connected touch-control sensing unit and connection gasket 25), carry out signal by this and export input test, but be not limited in this way.
Then, as step S5: after signal output input test completes, form the first insulation course 29 in each surrounding zone 22 of motherboard 40, to cover these connection gaskets 25 and these measurement circuits 26.Wherein the material of the first insulation course 29 is such as inorganic (as: monox, silicon nitride, silicon oxynitride, silit, hafnia, aluminium oxide or other material or above-mentioned combination), organic material (as: photoresist, benzocyclobutene (enzocyclobutane, BCB), cyclenes class, polyimide, polyamide-based, polyesters, polyalcohols, polyethylene oxide class, polyphenyl class, resene, polyethers, polyketone class or other material or above-mentioned combination) or above-mentioned combination.
Then, as step S6: patterning first insulation course 29, each measurement circuit 26 forms open circuit with corresponding connection gasket, and the first insulation course 29 has at least one first contact hole, and each first contact hole is in order to expose the subregion of corresponding connection gasket 25.Wherein, please continue see Fig. 5 and Fig. 6, be with carrying out the first insulation course 29 patterning while in present embodiment, and also measurement circuit 26 being patterned to the discontinuous line segment of multistage is that example is described.But the present invention is not as limit, such as, in another embodiment, above-mentioned manufacture method forms the first insulation course 29 in each surrounding zone 22 of this motherboard 40, also to comprise before the step covering these connection gaskets 25 and these measurement circuits 26: these measurement circuits 26 of patterning, form open circuit to make each measurement circuit 26 with corresponding connection gasket 25.That is measurement circuit 26 also can coordinate before formation first insulation course 29 photomask to carry out Patternized technique with connection gasket 25 between form open circuit and such as form the discontinuous line segment of multistage, and do not need to be formed in the process of patterning first insulation course simultaneously.
Then, as step S7: cut motherboard 40 to form contact panel 100 along at least one line of cut SL, the substrate 21 of each contact panel 100 has Touch Zone 23 and the surrounding zone 22 corresponding with Touch Zone 23.Because motherboard 40 comprises multiple contact panel unit, therefore, after motherboard 40 completes, must pass through laser cutting technique, cutter technique, cutting wheel technique or other cutting technique or the combination of above-mentioned cutting technique and each contact panel unit is divided into multiple independently contact panel 100 separately.
Then, as step S8, fabricator can carry out electrostatic (ElectroStaticDischarge, ESD) test to each contact panel 100.Now because measurement circuit 26 is patterned into the discontinuous line segment of multistage, thus no matter whether measurement circuit 26 comes out from the side of contact panel 100, the connection gasket 25 corresponding with it due to measurement circuit 26 defines open circuit, so electrostatic can not be imported contact panel 100 by measurement circuit 26, allow electronic component in contact panel 100 by damage by static electricity (damagebystaticelectricity).
After electrostatic test, fabricator can engage contact panel 100 and display panel (not illustrating), to form touch-control display panel.In the present embodiment, contact panel 100 can be embedded (in-cell), external hanging type (out-cell) or other suitable junctures with the concrete juncture of display panel.Display panel can be display panels, organic light emitting diode (OLED) display panel or other panel of Presentation Function can be provided.
In addition, please continue see Fig. 4 A to Fig. 6, in present embodiment, connection gasket 25 comprises the first conductive pattern layer 32, the 3rd transparency conducting layer 31 and the second conductive pattern layer 33.Wherein the first conductive pattern layer 32 is configured at the surrounding zone 22 of motherboard 40; 3rd transparency conducting layer 31 is configured in the first conductive pattern layer 32, and the second conductive pattern layer 33 is configured at the 3rd transparency conducting layer 31, and the 3rd transparency conducting layer 31 is between the second conductive pattern layer 33 and the first conductive pattern layer 32.And for coordinating the manufacture processing procedure of Touch Zone touch-control sensing unit, second conductive pattern layer 33 is such as the second transparency conducting layer, first conductive pattern layer 32 is such as the first metal layer, and wherein the material of the first conductive pattern layer is such as metal, above-mentioned alloy or the above-mentioned combinations such as gold, silver, copper, iron, tin, lead, hafnium, tungsten, molybdenum, neodymium, titanium, tantalum, aluminium, zinc; The transparent conductive material that transparency conducting layer adopts is such as indium tin oxide, indium-zinc oxide, indium tin zinc oxide, hafnia, zinc paste, aluminium oxide, aluminium tin-oxide, aluminium zinc oxide, cadmium tin-oxide, cadmium zinc oxide etc. or above-mentioned combination.
And in present embodiment, preferably, the second conductive pattern layer 33 is formed by identical conductive film layer patterning with measurement circuit 26.
Certainly, in another embodiment, the 3rd transparency conducting layer 31 also can adopt metal level to substitute, such as, be the 3rd metal level 31.The material of the 3rd metal level is such as metal, above-mentioned alloy or the above-mentioned combinations such as gold, silver, copper, iron, tin, lead, hafnium, tungsten, molybdenum, neodymium, titanium, tantalum, aluminium, zinc.
But the structure of connection gasket is not limited with above-mentioned, in another embodiment, connection gasket also only can comprise the first conductive pattern layer and the second conductive pattern layer, and the first conductive pattern layer is such as the first metal layer, and this second conductive pattern layer is transparency conducting layer or the second metal level.That is connection gasket can be single conductive layer or plurality of conductive layers, and conductive layer can be metal level or transparency conducting layer.
In addition, above-mentioned manufacture method is further comprising the steps of: form the second insulation course 20 in each surrounding zone 22 of motherboard 40, to cover these connection gaskets 25 and motherboard 40, and the second insulation course 20 has at least one second contact hole 54, each second contact hole 54 is in order to expose first contact hole of subregion in correspondence of corresponding connection gasket 25, and wherein the second insulation course 20 is between these measurement circuit 26 and motherboards 40.
And contact panel 100 also comprises above-mentioned flexible circuit board 27 and printed circuit-board assembly 28, flexible circuit board 27 is electrically connected connection gasket 25 through the first contact hole 54 and the second contact hole; Printed circuit-board assembly 28 is electrically connected flexible circuit board 27.
Please continue see Fig. 6, in present embodiment, this manufacture method is further comprising the steps of: form black-matrix layer 37 in each surrounding zone 22 of motherboard 40, wherein black-matrix layer 37 is between connection gasket 25 and motherboard 40.Black-matrix layer 37 can be such as be arranged on motherboard 40, encloses the opaque resin around touch-control sensing unit periphery.
Refer to Fig. 7 and Fig. 8, Figure 7 shows that the schematic diagram of the second embodiment according to contact panel of the present invention, Figure 8 shows that the diagrammatic cross-section of the second embodiment of A3A3 line in contact panel Fig. 7 of the second embodiment.In present embodiment, the manufacture method of the manufacture method of contact panel and the contact panel of above-mentioned embodiment is similar, difference is, is with carrying out the first insulation course 29 patterning while in present embodiment, is also also etched away completely as example is described by measurement circuit 26 patterning.But the present invention is not as limit, such as, in another embodiment, above-mentioned manufacture method forms the first insulation course 29 in each surrounding zone 22 of this motherboard 40, also to comprise before the step covering these connection gaskets 25 and these measurement circuits 26: these measurement circuits 26 of patterning, form open circuit to make each measurement circuit 26 with corresponding connection gasket 25.That is measurement circuit 26 also can coordinate before formation first insulation course 29 photomask to carry out Patternized technique with connection gasket 25 between form open circuit and such as etch away completely, and do not need to be formed in the process of patterning first insulation course simultaneously.In addition, please continue see Fig. 7, while etching measurement circuit 26, also by the second conductive pattern layer 33 on connection gasket 25, (such as present embodiment is that the second conductive pattern layer 33 is formed by identical conductive film layer patterning with measurement circuit 26 in the present embodiment.) also together etched away, but not as limit, in another embodiment, this second conductive pattern layer also can be retained.
Then, in rear, electrostatic (ElectroStaticDischarge is carried out to contact panel 100, ESD) during test, because measurement circuit 26 has been now completely etched away, thus measurement circuit 26 is not had to come out from the side of contact panel 100, also the connection gasket 25 that can be regarded as measurement circuit 26 corresponding with it defines open circuit, so electrostatic can not be imported contact panel 100 by measurement circuit 26, allow electronic component in contact panel 100 by damage by static electricity (damagebystaticelectricity).
Same, please continue see Fig. 3-Fig. 6, the present invention also provides a kind of contact panel, and this contact panel is the contact panel adopting the manufacture method of above-mentioned contact panel to be formed.Contact panel 100 has test signal input end, and contact panel 100 comprises substrate 21, induction line layer, perimeter circuit layer and the first insulation course 29.Substrate 21 has Touch Zone 23 and surrounding zone 22, and surrounding zone 22 is around Touch Zone 23, and substrate 21 is a part for motherboard 40.Induction line layer is formed at the Touch Zone 23 of substrate 21, and induction line layer has at least one touch-control sensing unit, and test signal input end is used to pass into test signal in the manufacture process of contact panel 100 to test corresponding touch-control sensing unit.Perimeter circuit layer is formed at the surrounding zone 22 of substrate 21, perimeter circuit layer is electrically connected induction line layer, and perimeter circuit layer comprises at least one connection gasket 25, wherein each connection gasket 25 is electrically connected corresponding touch-control sensing unit, and each connection gasket 25 forms open circuit with test signal input end, here test signal input end is also the cut end of contact panel 100, and each connection gasket 25 and test signal input end form open circuit and namely can be regarded as each measurement circuit 26 and form open circuit with corresponding connection gasket 25.
First insulation course 29 is formed at the surrounding zone 22 of substrate 21, first insulation course 29 covers these connection gaskets 25 and these measurement circuits 26, and measurement circuit 26 forms open circuit with corresponding connection gasket 25, first insulation course 29 has at least one first contact hole, and each first contact hole is in order to expose the subregion of corresponding connection gasket 25.Please continue see Fig. 5 and Fig. 6, in present embodiment, measurement circuit 26 is the discontinuous line segment of multistage, forms open circuit by this kind of mode and connection gasket 25.But the present invention is not as limit, such as, refer to Fig. 7 and Fig. 8, it is the second embodiment of contact panel, contact panel 100 ' in present embodiment is similar to the contact panel 100 in the first embodiment, difference is that in present embodiment, measurement circuit 26 has also been etched away completely in contact panel manufacture process, thus contact panel 100 ' its surrounding zone after cutting does not have measurement circuit existence, also constitutes each connection gasket 25 equally and forms open circuit with test signal input end.
Wherein the material of the first insulation course 29 is such as inorganic (as: monox, silicon nitride, silicon oxynitride, silit, hafnia, aluminium oxide or other material or above-mentioned combination), organic material (as: photoresist, benzocyclobutene (enzocyclobutane, BCB), cyclenes class, polyimide, polyamide-based, polyesters, polyalcohols, polyethylene oxide class, polyphenyl class, resene, polyethers, polyketone class or other material or above-mentioned combination) or above-mentioned combination.
In addition, please continue see Fig. 4 A to Fig. 6, in present embodiment, connection gasket 25 comprises the first conductive pattern layer 32, the 3rd transparency conducting layer 31 and the second conductive pattern layer 33.Wherein the first conductive pattern layer 32 is configured at the surrounding zone 22 of motherboard 40; 3rd transparency conducting layer 31 is configured in the first conductive pattern layer 32, and the second conductive pattern layer 33 is configured at the 3rd transparency conducting layer 31, and the 3rd transparency conducting layer 31 is between the second conductive pattern layer 33 and the first conductive pattern layer 32.And for coordinating the manufacture processing procedure of Touch Zone touch-control sensing unit, second conductive pattern layer 33 is such as the second transparency conducting layer, first conductive pattern layer 32 is such as the first metal layer, and wherein the material of the first conductive pattern layer is such as metal, above-mentioned alloy or the above-mentioned combinations such as gold, silver, copper, iron, tin, lead, hafnium, tungsten, molybdenum, neodymium, titanium, tantalum, aluminium, zinc; The transparent conductive material that transparency conducting layer adopts is such as indium tin oxide, indium-zinc oxide, indium tin zinc oxide, hafnia, zinc paste, aluminium oxide, aluminium tin-oxide, aluminium zinc oxide, cadmium tin-oxide, cadmium zinc oxide etc. or above-mentioned combination.
And in present embodiment, preferably, the second conductive pattern layer 33 is formed by identical conductive film layer patterning with measurement circuit 26.
Certainly, in another embodiment, the 3rd transparency conducting layer 31 also can adopt metal level to substitute, such as, be the 3rd metal level 31.The material of the 3rd metal level is such as metal, above-mentioned alloy or the above-mentioned combinations such as gold, silver, copper, iron, tin, lead, hafnium, tungsten, molybdenum, neodymium, titanium, tantalum, aluminium, zinc.
But the structure of connection gasket is not limited with above-mentioned, in another embodiment, connection gasket also only can comprise the first conductive pattern layer and the second conductive pattern layer, and the first conductive pattern layer is such as the first metal layer, and this second conductive pattern layer is transparency conducting layer or the second metal level.That is connection gasket can be single conductive layer or plurality of conductive layers, and conductive layer can be metal level or transparency conducting layer.
In addition, upper contact panel 100,100 ' also comprises the second insulation course 20, be formed at the surrounding zone 22 of substrate 21, to cover these connection gaskets 25 and substrate 21, and the second insulation course 20 has at least one second contact hole 54, each second contact hole 54 is in order to expose first contact hole of subregion in correspondence of corresponding connection gasket 25, and wherein the second insulation course 20 is between these measurement circuit 26 and substrates 21.
And contact panel 100,100 ' also comprises above-mentioned flexible circuit board 27 and printed circuit-board assembly 28, flexible circuit board 27 is electrically connected connection gasket 25 through the first contact hole 54 and the second contact hole; Printed circuit-board assembly 28 is electrically connected flexible circuit board 27.
Please continue see Fig. 6, in present embodiment, contact panel 100,100 ' also comprises black-matrix layer 37, the surrounding zone 22 being formed at substrate 21 wherein black-matrix layer 37 between connection gasket 25 and substrate 21.Black-matrix layer 37 can be such as be arranged on substrate 21, encloses the opaque resin around touch-control sensing unit periphery.
Above-mentioned contact panel 100,100 ' can with display panel (not illustrating), to form touch-control display panel.In the present embodiment, contact panel 100,100 ' and the concrete juncture of display panel can be embedded (in-cell), external hanging type (out-cell) or other suitable junctures.Display panel can be display panels, organic light emitting diode (OLED) display panel or other panel of Presentation Function can be provided.
In sum, the invention provides a kind of contact panel and manufacture method thereof, by utilizing patterning first insulation course after touch-control sensing unit signal testing completes, make to form open circuit between measurement circuit with corresponding connection gasket, thus make contact panel finished product when ESD test or contact panel assembling product use, electrostatic can not enter the measurement circuit come out and lead to contact panel inside, with the problem avoiding flexible circuit board, printed circuit-board assembly or touch-control sensing unit to scrap because of damage by static electricity.
By the above detailed description of preferred embodiments, be wish clearly to describe feature of the present invention and spirit, and not with above-mentioned disclosed preferred embodiment, protection scope of the present invention limited.On the contrary, its objective is wish to contain various change and tool equality be arranged in the present invention institute in the protection domain of claim applied for.Therefore, the protection domain of the claim that the present invention applies for should do the broadest explanation, with the arrangement causing it to contain all possible change and tool equality according to above-mentioned explanation.
Claims (13)
1. a manufacture method for contact panel, is characterized in that this manufacture method comprises:
There is provided motherboard, this motherboard has at least one Touch Zone and at least one surrounding zone, and each surrounding zone is around the Touch Zone of correspondence;
Form induction line layer in each Touch Zone of this motherboard, this induction line layer has at least one touch-control sensing unit;
Perimeter circuit layer is formed in each surrounding zone of this motherboard, this perimeter circuit layer is electrically connected this induction line layer, and this perimeter circuit layer comprises at least one connection gasket and at least one measurement circuit, wherein each connection gasket is electrically connected corresponding touch-control sensing unit, and each measurement circuit is electrically connected corresponding connection gasket;
Test signal is passed into test corresponding touch-control sensing unit by each measurement circuit;
The first insulation course is formed, to cover this at least one connection gasket and this at least one measurement circuit in each surrounding zone of this motherboard;
This first insulation course of patterning, each measurement circuit forms open circuit with corresponding connection gasket, and this first insulation course has at least one first contact hole, and each first contact hole is in order to expose the subregion of corresponding connection gasket;
Cut this motherboard to form contact panel along at least one line of cut, the substrate of each contact panel has this Touch Zone and this surrounding zone corresponding with this Touch Zone.
2. the manufacture method of contact panel as claimed in claim 1, it is characterized in that, this manufacture method also comprises: form the second insulation course in each surrounding zone of this motherboard, to cover this at least one connection gasket and this motherboard, and this second insulation course has at least one second contact hole, each second contact hole is in order to expose first contact hole of subregion in correspondence of corresponding connection gasket, and wherein this second insulation course is between this at least one measurement circuit and this motherboard.
3. the manufacture method of contact panel as claimed in claim 1, it is characterized in that, the first insulation course is formed in each surrounding zone of this motherboard, also to comprise before the step covering this at least one connection gasket and this at least one measurement circuit: this at least one measurement circuit of patterning, forms open circuit to make each measurement circuit with corresponding connection gasket.
4. the manufacture method of contact panel as claimed in claim 1, it is characterized in that, this manufacture method also comprises: form black-matrix layer in each surrounding zone of this motherboard, wherein this black-matrix layer is between this connection gasket and this motherboard.
5. a contact panel, this contact panel has test signal input end, it is characterized in that this contact panel comprises:
Substrate, this substrate has Touch Zone and surrounding zone, and this surrounding zone is around this Touch Zone;
Induction line layer, is formed at this Touch Zone of this substrate, and this induction line layer has at least one touch-control sensing unit, and this test signal input end is used to pass into test signal in the manufacture process of this contact panel to test corresponding touch-control sensing unit;
Perimeter circuit layer, be formed at this surrounding zone of this substrate, this perimeter circuit layer is electrically connected this induction line layer, and this perimeter circuit layer comprises at least one connection gasket, wherein each connection gasket is electrically connected corresponding touch-control sensing unit, and each connection gasket and this test signal input end form open circuit; And
First insulation course, is formed at this surrounding zone of this substrate, and in order to cover this at least one connection gasket, and this first insulation course has at least one first contact hole, and each first contact hole is in order to expose the subregion of corresponding connection gasket.
6. contact panel as claimed in claim 5, it is characterized in that this perimeter circuit layer comprises at least one measurement circuit, this at least one measurement circuit is corresponding with this at least one connection gasket and this test signal input end, and each measurement circuit and corresponding connection gasket form open circuit forms open circuit to make each connection gasket and this test signal input end, this first insulation course covers this at least one measurement circuit.
7. contact panel as claimed in claim 6, is characterized in that this connection gasket comprises:
First conductive pattern layer, is configured at this surrounding zone of this substrate; And
Second conductive pattern layer, is configured in this first conductive pattern layer, and this first conductive pattern layer is between this second conductive pattern layer and this substrate.
8. contact panel as claimed in claim 7, is characterized in that this second conductive pattern layer is formed by identical conductive film layer patterning with this at least one measurement circuit.
9. contact panel as claimed in claim 7, it is characterized in that this first conductive pattern layer is the first metal layer, this second conductive pattern layer is the second transparency conducting layer.
10. contact panel as claimed in claim 7, it is characterized in that this connection is paid somebody's debt and expected repayment later and comprise the 3rd transparency conducting layer or the 3rd metal level, 3rd transparency conducting layer or the 3rd metal level are configured in this first conductive pattern layer, and the 3rd transparency conducting layer or the 3rd metal level are between this second conductive pattern layer and this first conductive pattern layer.
11. contact panels as claimed in claim 7, it is characterized in that, this contact panel also comprises the second insulation course, be formed at this surrounding zone of this substrate, this second insulation course covers this at least one connection gasket and this substrate, and this second insulation course has at least one second contact hole, each second contact hole is in order to expose first contact hole of subregion in correspondence of corresponding connection gasket, and wherein this second insulation course is between this at least one measurement circuit and this substrate.
12. contact panels as claimed in claim 5, it is characterized in that, this contact panel also comprises:
Flexible circuit board, is electrically connected this connection gasket through this first contact hole; And
Printed circuit-board assembly, is electrically connected this flexible circuit board.
The manufacture method of 13. contact panels as claimed in claim 5, it is characterized in that, this contact panel also comprises black-matrix layer, and be formed at this surrounding zone of this substrate, wherein this black-matrix layer is between this connection gasket and this substrate.
Priority Applications (1)
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| CN201310270880.XA CN103365470B (en) | 2013-07-01 | 2013-07-01 | Contact panel and manufacture method thereof |
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| CN201310270880.XA CN103365470B (en) | 2013-07-01 | 2013-07-01 | Contact panel and manufacture method thereof |
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| CN103365470A CN103365470A (en) | 2013-10-23 |
| CN103365470B true CN103365470B (en) | 2016-02-10 |
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Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
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| TWI512568B (en) * | 2013-11-15 | 2015-12-11 | Au Optronics Corp | Touch panel and manufacturing method thereof |
| TWI510914B (en) * | 2013-11-19 | 2015-12-01 | Henghao Technology Co Ltd | Touch Panel and Testing Device Thereof |
| CN104102383B (en) * | 2014-07-15 | 2016-08-17 | 京东方科技集团股份有限公司 | Color membrane substrates, liquid crystal module and touch control display apparatus |
| TWI576804B (en) * | 2015-11-23 | 2017-04-01 | 友達光電股份有限公司 | Driving signal modifiable displayer and modifying method thereof |
| CN105867680A (en) * | 2016-03-25 | 2016-08-17 | 信利光电股份有限公司 | A film structure and a manufacturing method therefor |
| CN106569632A (en) * | 2016-10-20 | 2017-04-19 | 业成科技（成都）有限公司 | Touch module and fabrication method therefor |
| CN114333615B (en) * | 2020-09-30 | 2023-08-08 | 合肥鑫晟光电科技有限公司 | Substrate mother board, preparation method thereof, driving substrate and display device |
| CN113221753B (en) * | 2021-05-14 | 2023-12-29 | 业泓科技(成都)有限公司 | Manufacturing method of touch sensing module and motherboard of touch sensing module |
| TWI789906B (en) * | 2021-09-13 | 2023-01-11 | 友達光電股份有限公司 | Touch device |
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| CN102193671A (en) * | 2010-03-05 | 2011-09-21 | 三星移动显示器株式会社 | Flat panel display integrated with touch screen panel |
| TWM434256U (en) * | 2011-09-27 | 2012-07-21 | Zhang Jin Fa | Electrostatic protection structure for touch panel |
| CN102693041A (en) * | 2012-05-29 | 2012-09-26 | 友达光电股份有限公司 | Touch panel capable of realizing electrostatic protection |
| CN103150053A (en) * | 2013-03-08 | 2013-06-12 | 友达光电股份有限公司 | Touch panel with static protection function |
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| KR20120092365A (en) * | 2011-02-11 | 2012-08-21 | 삼성전자주식회사 | Electrostatic capacity type touch screen panel display device |
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|---|---|---|---|---|
| CN102193671A (en) * | 2010-03-05 | 2011-09-21 | 三星移动显示器株式会社 | Flat panel display integrated with touch screen panel |
| TWM434256U (en) * | 2011-09-27 | 2012-07-21 | Zhang Jin Fa | Electrostatic protection structure for touch panel |
| CN102693041A (en) * | 2012-05-29 | 2012-09-26 | 友达光电股份有限公司 | Touch panel capable of realizing electrostatic protection |
| CN103150053A (en) * | 2013-03-08 | 2013-06-12 | 友达光电股份有限公司 | Touch panel with static protection function |
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