CN105867680A - A film structure and a manufacturing method therefor - Google Patents
A film structure and a manufacturing method therefor Download PDFInfo
- Publication number
- CN105867680A CN105867680A CN201610177377.3A CN201610177377A CN105867680A CN 105867680 A CN105867680 A CN 105867680A CN 201610177377 A CN201610177377 A CN 201610177377A CN 105867680 A CN105867680 A CN 105867680A
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- cabling
- film
- antistatic
- line
- bar
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Elimination Of Static Electricity (AREA)
Abstract
The invention provides a film structure manufacturing method comprising the steps of forming a conductive pattern on the surface of a film substrate, the conductive pattern including multiple wires and an anti-static wire connected with the multiple wires electrically; forming a function layer covering the conductive pattern; breaking the electrical connection between the anti-static wire and the multiple wires to form the film structure. The conductive pattern formed on the surface of the film substrate not only includes the multiple wires but also includes the anti-static wire electrically connected with the multiple wires, and thus the electrostatic potentials of the different wires are identical, so that the static electricity damage occurring in the film structure forming process can be avoided; after the function layer covering the conductive pattern is formed, the original film structure is formed finally by breaking the electrical connection between the anti-static wire and the multiple wires. Thus, the method can prevent the static electricity damage of film structures and can increase the yield of film structures.
Description
Technical field
The application relates to technical field of touch-control display, particularly to a kind of film structure and making side thereof
Method.
Background technology
Along with the development of science and technology, touch control display apparatus is more and more applied to the work of people
And in the middle of daily life, work and daily life to people bring huge facility.
Film structure is the important component part of touch control display apparatus, and film structure includes film substrate, with
And a plurality of electric conduction routing on film substrate, every electric conduction routing forms a circuit transmitting signal and leads to
Road.Film structure is for realizing touching signals and the transmission of display signal in touch control display apparatus.
But, in the manufacturing process of film structure, owing to different electric conduction routing has different potentials
Electrostatic, when the electrostatic potential difference of adjacent conductive trace reaches certain value, easily produces static discharge, from
And wound electric conduction routing, cause the damage by static electricity of film structure.
Summary of the invention
For solving above-mentioned technical problem, the present invention provides a kind of film structure and preparation method thereof, can keep away
Exempt from the damage by static electricity of film structure, improve the yield rate of film structure.
Technical scheme is as follows:
A kind of manufacture method of film structure, including:
Forming conductive pattern at film substrate surface, described conductive pattern includes a plurality of cabling and electrical connection
The antistatic line of cabling described in each bar；
Form the functional layer covering described conductive pattern；
Disconnect the electrical connection of described antistatic line and cabling described in each bar, form film structure.
Preferably, described conductive pattern also includes bindings bit region, cabling described in each bar all through described in tie up
Region, location.
Preferably, cabling described in each bar in described antistatic line electrically connects described bindings bit region.
Preferably, the electrical connection of cabling described in described disconnection described antistatic line and each bar, including:
Excise the antistatic line in described bindings bit region, to disconnect described antistatic line and cabling described in each bar
Electrical connection.
Preferably, the described functional layer forming the described conductive pattern of covering, including:
Form the insulating barrier covering described cabling；
Form the conductive layer covering described insulating barrier；
Form the adhesive linkage covering described conductive layer；
Described adhesive linkage covers cover plate.
Preferably, described conductive pattern includes multiple film construction unit and correspondence each film construction unit
Antistatic line, each described film construction unit for formed a film structure, each described film
Construction unit includes a plurality of cabling, the antistatic line of cabling described in each bar and corresponding each film construction unit
Electrical connection.
Preferably, described conductive pattern also includes, antistatic connecting line, and described antistatic connecting line is electrically connected
Connect the antistatic line of corresponding each film construction unit.
Preferably, described film substrate include resulting structure district for forming described film construction unit and
It is positioned at the invalid structure district outside described film construction unit, described antistatic line and described antistatic to connect
Line is positioned at described invalid structure district.
Preferably, described disconnection described antistatic line and the electrical connection of cabling described in each bar, form film knot
Structure, including:
Excision antistatic line, to disconnect the electrical connection of described antistatic line and cabling described in each bar；
Cut described film substrate, form single film structure.
A kind of film structure, uses the film structure that said method makes.
Compared with prior art, the invention have the benefit that
Film structure in the present invention and preparation method thereof, at the conductive pattern that film substrate surface is formed
Case, does not only include a plurality of cabling, also includes that each bar cabling is electrically connected by antistatic line, described antistatic line
Connect, so that the electrostatic potential of different cablings is equal, such that it is able to avoid forming film knot
The damage by static electricity occurred during structure.After forming the functional layer covering described conductive pattern, by disconnected
Open the electrical connection of antistatic line and each bar cabling, ultimately form original film structure.Therefore, the method
The damage by static electricity of film structure can be avoided, improve the yield rate of film structure.
Accompanying drawing explanation
For the technical scheme being illustrated more clearly that in the embodiment of the present application, embodiment will be described below
The accompanying drawing used required in is briefly described, it should be apparent that, the accompanying drawing in describing below is only
It is only some embodiments of the application, for those of ordinary skill in the art, is not paying wound
On the premise of the property made is laborious, it is also possible to obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is the manufacture method schematic flow sheet of the film structure of the present invention；
Fig. 2 is the schematic diagram of the film structure of embodiments of the invention one；
Fig. 3 is the intention of the film structure of the embodiment of the present invention two.
Detailed description of the invention
Below in conjunction with the accompanying drawing in the embodiment of the present application, to the technical scheme in the embodiment of the present application
It is clearly and completely described, it is clear that described embodiment is only that the application part is real
Execute example rather than whole embodiments.Based on the embodiment in the application, ordinary skill
The every other embodiment that personnel are obtained under not making creative work premise, broadly falls into this
The scope of application protection.
As stated in the Background Art, in the manufacturing process of film structure, due to different electric conduction routing
There is the electrostatic of different potentials, when the electrostatic potential difference of adjacent conductive trace reaches certain value, easily
Produce static discharge, thus wound electric conduction routing, cause the damage by static electricity of film structure.
Based on this, the present invention proposes a kind of film structure and preparation method thereof, as it is shown in figure 1, include:
A kind of manufacture method of film structure, including:
Step S11: forming conductive pattern at film substrate surface, described conductive pattern includes a plurality of cabling
And electrically connect the antistatic line of cabling described in each bar；
Concrete, described film substrate can be transparency carrier, it is also possible to for opaque substrate, at touch-control
In display device, transparency carrier typically chosen by described film substrate, concrete, and described film substrate is permissible
For ito substrate.Described at film substrate surface formation conductive pattern, photoetching can be used to add the side of etching
Method realizes.
Step S12: form the functional layer covering described conductive pattern；
Concrete, on the conductive pattern of described film substrate, need the product according to concrete film structure
Product design, and form insulating barrier and the conductive layer with predetermined pattern, obtain constituting the multilamellar knot of film structure
Structure
Step S13: disconnect the electrical connection of described antistatic line and cabling described in each bar, forms film structure.
Concrete, described disconnection described antistatic line and the electrical connection of cabling described in each bar, can use
The method of etching disconnects the electrical connection of described antistatic line and cabling described in each bar, it would however also be possible to employ cutting
Method, comes described antistatic line with cabling cutting described in each bar, ultimately forms required film structure.
Film structure in the present invention and preparation method thereof, at the conductive pattern that film substrate surface is formed
Case, does not only include a plurality of cabling, also includes that each bar cabling is electrically connected by antistatic line, described antistatic line
Connect, so that the electrostatic potential of different cablings is equal, such that it is able to avoid forming film knot
The damage by static electricity occurred during structure.After forming the functional layer covering described conductive pattern, by disconnected
Open the electrical connection of antistatic line and each bar cabling, ultimately form original film structure.Therefore, the method
The damage by static electricity of film structure can be avoided, improve the yield rate of film structure.
It is above the central idea of the present invention, below in conjunction with the accompanying drawing in the embodiment of the present invention, to this
Technical scheme in bright embodiment is clearly and completely described, it is clear that described embodiment is only
It is a part of embodiment of the present invention rather than whole embodiments.Based on the embodiment in the present invention, this
The every other embodiment that field those of ordinary skill is obtained under not making creative work premise,
Broadly fall into the scope of protection of the invention.
Embodiment one
The present embodiment provides the manufacture method of a kind of film structure, refer to the present embodiment shown in Fig. 1 luxuriant and rich with fragrance
The manufacture method schematic flow sheet of woods structure, including:
Step S11: forming conductive pattern at film substrate surface, described conductive pattern includes a plurality of cabling
And electrically connect the antistatic line of cabling described in each bar；
Concrete, described film substrate can be transparency carrier, it is also possible to for opaque substrate, at touch-control
In display device, transparency carrier typically chosen by described film substrate, concrete, and described film substrate is permissible
For ito substrate.
Concrete, the described conductive pattern of part is as in figure 2 it is shown, include a plurality of cabling 101, and is electrically connected
Connect the antistatic line 102 of cabling described in each bar.It can be seen that described cabling 101 dense distribution is described
On film substrate, every described cabling 101 is for forming a signal transmission passage.And antistatic line 102
Electrically connect with cabling 102 described in each bar.
In the present embodiment, described conductive pattern also includes bindings bit region 103, such as the dotted line in Fig. 2
Region in frame, cabling described in each bar is all through described bindings bit region 103.And described antistatic line 102
It is positioned at described bindings bit region, electrically connects cabling described in each bar in described bindings bit region.
In this step, described at film substrate surface formation conductive pattern, photoetching can be used to add etching
Method realize, concrete, may include steps of:
Step S111: form photoresist layer at described film substrate surface；
Concrete, in this step, include conductive layer at described film substrate, have at film substrate and lead
The one side of electric layer forms photoresist layer.Described photoresist layer can be positive photoresist layer, it is also possible to for negativity light
Photoresist layer.
Step S112: graphical described optical resistance glue layer；
Concrete, in this step, described graphical described optical resistance glue layer specifically may include that exposure institute
State optical resistance glue layer, and described optical resistance glue layer of developing.In the present embodiment, at the described photoresistance of described exposure
During glue-line, use the mask with predetermined pattern that described photoresist layer is exposed, described pre-
If pattern is different according to the difference of photoresist, it will be understood by those skilled in the art that no matter be positivity light
Photoresist layer or negative photo glue-line, as long as after using the mask of described predetermined pattern to be exposed,
The patterned optical resistance glue layer that development is formed eventually is consistent with conductive pattern to be formed.By development,
Optical resistance glue layer after obtaining graphically.
Step S113: the optical resistance glue layer graphically changed is mask, etches described film substrate, forms conduction
Pattern；
Concrete, in this step, the optical resistance glue layer graphically changed is mask, etches described film substrate
Conductive layer, formed conductive pattern；
Step S114: remove described patterned optical resistance glue layer；
Concrete, in this step, described patterned optical resistance glue layer can be removed by techniques such as strippings.
Step S12: form the functional layer covering described conductive pattern；
Concrete, on the conductive pattern of described film substrate, need the product according to concrete film structure
Product design, and form insulating barrier and the conductive layer with predetermined pattern, obtain constituting the multilamellar knot of film structure
Structure.
Concrete, in the present embodiment, step S12 may include steps of:
Step S121: form the insulating barrier covering described cabling；
Concrete, in this step, described insulating barrier is according to the design needs of film structure, part or complete
Portion covers described cabling, thus forms the insulating barrier covering described cabling.Those skilled in the art can manage
Solving, the method for described formation insulating barrier can be evaporation etc., ultimately forms the design need meeting film structure
The insulating barrier asked.
Step S122: form the conductive layer covering described insulating barrier；
In this step, described conductive layer, according to the design needs of film structure, partly or entirely covers institute
State insulating barrier.Concrete, described conductive layer can comprise the conductor wire bridging described cabling, it is also possible to bag
Containing the conductive electrode with specific function.The forming method of described conductive layer can be evaporation etc..
Step S123: form the adhesive linkage covering described conductive layer；
In this step, described film substrate forms the adhesive linkage covering described conductive layer, concrete,
Described adhesive linkage all covers the one side on described film substrate with conductive layer, thus follow-up lid
Plate bonding.Concrete, described adhesive linkage can be OCA (Optically Clear Adhesive) layer.
Step S124: cover cover plate on described adhesive linkage.
In this step, by bonding cover plate, can on the surface of described film structure as protective layer,
Protect the circuit of described film structure.
In the present embodiment, described film structure is single layer structure, thus, it is only required to will be on film substrate
Form circuit structure bonding cover plate.And in other embodiments of the application, described film structure
Can also be double-decker, i.e. the film substrate having made each functional layer by two is glued by adhesive linkage
Being connected together, concrete, one side another film substrate bonding that film substrate has functional layer does not has
There is the one side of functional layer, form lamination film substrate, and there is at the lamination film substrate one side of functional layer
Form adhesive linkage, bonding cover plate, form double-decker.
Step S13: disconnect the electrical connection of described antistatic line and cabling described in each bar, forms film structure.
Concrete, described disconnection described antistatic line and the electrical connection of cabling described in each bar, can use
The method of etching disconnects the electrical connection of described antistatic line and cabling described in each bar, it would however also be possible to employ cutting
Method, comes described antistatic line with cabling cutting described in each bar, ultimately forms required film structure.
Concrete, in the present embodiment, described in each bar in described antistatic line electrical connection bindings bit region
Cabling, therefore, described disconnection described antistatic line and the electrical connection of cabling described in each bar, can pass through to cut
Except the antistatic line in described bindings bit region, to disconnect being electrically connected of described antistatic line and cabling described in each bar
Connect.
In other embodiments of the application, described step S12 can not include step S124, this
Sample, in this step, the electrical connection of cabling, Ke Yitong described in described disconnection described antistatic line and each bar
The method of over etching disconnects the electrical connection of described antistatic line and cabling described in each bar, afterwards, then walks
Rapid 124, ultimately form the film structure of the application.
The manufacture method of the film structure in the present embodiment, at the conductive pattern that film substrate surface is formed
Case, does not only include a plurality of cabling, also includes that each bar cabling is electrically connected by antistatic line, described antistatic line
Connect, so that the electrostatic potential of different cablings is equal, such that it is able to avoid forming film knot
The damage by static electricity occurred during structure.After forming the functional layer covering described conductive pattern, by disconnected
Open the electrical connection of antistatic line and each bar cabling, ultimately form original film structure.Therefore, the method
The damage by static electricity of film structure can be avoided, improve the yield rate of film structure.
Embodiment two
The present embodiment provides the manufacture method of a kind of film structure, unlike a upper embodiment, this reality
Execute example for once forming multiple film structure.
Concrete, the present embodiment comprises the following steps:
Step S21: forming conductive pattern at film substrate surface, described conductive pattern includes a plurality of cabling
And electrically connect the antistatic line of cabling described in each bar；
Concrete, described film substrate can be transparency carrier, it is also possible to for opaque substrate, at touch-control
In display device, transparency carrier typically chosen by described film substrate, concrete, and described film substrate is permissible
For ito substrate.
Concrete, as it is shown on figure 3, described conductive pattern includes multiple film construction unit 300 and correspondence
The antistatic line 302 of each film construction unit, each described film construction unit is for forming a phenanthrene
Woods structure, each described film construction unit includes a plurality of cabling 301, and cabling described in each bar is every with corresponding
The antistatic line electrical connection of individual film construction unit.
Further, in the present embodiment, described conductive pattern also includes, antistatic connecting line 303 is described
Antistatic connecting line electrically connects the antistatic line 302 of corresponding each film construction unit.
By arranging antistatic connecting line 303, the cabling of different film construction unit can be avoided to occur quiet
The possibility of electric burn.
Wherein, described film substrate includes that the resulting structure district for forming described film construction unit is (empty
Region in wire frame 300) and it is positioned at the invalid structure district outside described film construction unit, described anti-quiet
Electric wire 302 and described antistatic connecting line 303 are positioned at described invalid structure district
Step S22: form the functional layer covering described conductive pattern；
Concrete, on the conductive pattern of described film substrate, need the product according to concrete film structure
Product design, and form insulating barrier and the conductive layer with predetermined pattern, obtain constituting the multilamellar knot of film structure
Structure.
Step S23: disconnect the electrical connection of described antistatic line and cabling described in each bar, forms film structure.
Concrete, in the present embodiment, the electricity of cabling described in described disconnection described antistatic line and each bar
Connect, form film structure, including:
Step S231: excise described antistatic line, to disconnect described antistatic line and cabling described in each bar
Electrical connection；
Concrete, in this step, it is only necessary to excise described antistatic line, disconnect described antistatic line with
The electrical connection of cabling described in each bar, and without antistatic connecting line is processed.
Step S231: cut described film substrate, forms single film structure.
Concrete, in this step, described cutting described film substrate, refer to the described film
The invalid structure district of substrate, is only left the resulting structure district of described film construction unit, thus is formed
Single film structure.
Wherein, owing to described antistatic line 302 and antistatic connecting line 303 are respectively positioned on invalid structure district,
Therefore, in other embodiments of the application, can only pass through step S231, both realize disconnection described
Antistatic line and the purpose of the electrical connection of cabling described in each bar, realize again being formed the mesh of single film structure
's.
The manufacture method of the film structure in the present embodiment, at the conductive pattern that film substrate surface is formed
Case, does not only include a plurality of cabling, also includes that each bar cabling is electrically connected by antistatic line, described antistatic line
Connect, so that the electrostatic potential of different cablings is equal, such that it is able to avoid forming film knot
The damage by static electricity occurred during structure.After forming the functional layer covering described conductive pattern, by disconnected
Open the electrical connection of antistatic line and each bar cabling, ultimately form original film structure.Therefore, the method
The damage by static electricity of film structure can be avoided, improve the yield rate of film structure.
Embodiment three
The present embodiment provides and a kind of is made, by above-mentioned manufacture method, the film structure that obtains, this structure by
In in manufacturing process, at the conductive pattern that film substrate surface is formed, do not only include a plurality of cabling,
Also including antistatic line, each bar cabling is electrically connected by described antistatic line, so that different cablings
Electrostatic potential equal, such that it is able to avoid forming the damage by static electricity occurred in film configuration process.
It should be noted that each embodiment in this specification all uses the mode gone forward one by one to describe,
What each embodiment stressed is the difference with other embodiments, between each embodiment
Identical similar part sees mutually.For device class embodiment, due to itself and method
Embodiment basic simlarity, so describe is fairly simple, relevant part sees the portion of embodiment of the method
Defend oneself bright.
Finally, in addition it is also necessary to explanation, in this article, the relation of such as first and second or the like
Term is used merely to separate an entity or operation with another entity or operating space, and not
Necessarily require or imply and there is the relation of any this reality or suitable between these entities or operation
Sequence.And, term " includes ", " comprising " or its any other variant are intended to nonexcludability
Comprise, so that include that the process of a series of key element, method, article or equipment not only include
Those key elements, but also include other key elements being not expressly set out, or also include for this
The key element that process, method, article or equipment are intrinsic.In the case of there is no more restriction,
The key element limited by statement " including ... ", it is not excluded that including the process of described key element, side
Method, article or equipment there is also other identical element.
Principle and the embodiment of the application are set forth by specific case used herein, with
The explanation of upper embodiment is only intended to help and understands the present processes and core concept thereof；Meanwhile,
For one of ordinary skill in the art, according to the thought of the application, in detailed description of the invention and should
All will change with in scope, in sum, this specification content should not be construed as this Shen
Restriction please.
Claims (10)
1. the manufacture method of a film structure, it is characterised in that including:
Forming conductive pattern at film substrate surface, described conductive pattern includes a plurality of cabling and electrical connection
The antistatic line of cabling described in each bar；
Form the functional layer covering described conductive pattern；
Disconnect the electrical connection of described antistatic line and cabling described in each bar, form film structure.
Method the most according to claim 1, it is characterised in that described conductive pattern also includes tying up
Positioning region, described in each bar, cabling is all through described bindings bit region.
Method the most according to claim 2, it is characterised in that described antistatic line electrically connects institute
State cabling described in each bar in bindings bit region.
Method the most according to claim 4, it is characterised in that described disconnection described antistatic line
With the electrical connection of cabling described in each bar, including:
Excise the antistatic line in described bindings bit region, to disconnect described antistatic line and cabling described in each bar
Electrical connection.
Method the most according to claim 1, it is characterised in that described formation covers described conduction
The functional layer of pattern, including:
Form the insulating barrier covering described cabling；
Form the conductive layer covering described insulating barrier；
Form the adhesive linkage covering described conductive layer；
Described adhesive linkage covers cover plate.
Method the most according to claim 1, it is characterised in that described conductive pattern includes multiple
Film construction unit and the antistatic line of correspondence each film construction unit, each described film construction unit
For forming a film structure, each described film construction unit includes a plurality of cabling, walks described in each bar
Line electrically connects with the antistatic line of corresponding each film construction unit.
Method the most according to claim 6, it is characterised in that described conductive pattern also includes,
Antistatic connecting line, described antistatic connecting line electrically connects the antistatic of corresponding each film construction unit
Line.
Method the most according to claim 7, it is characterised in that described film substrate include for
Formed the resulting structure district of described film construction unit and be positioned at outside described film construction unit invalid
Structural area, described antistatic line and described antistatic connecting line are positioned at described invalid structure district.
Method the most according to claim 8, it is characterised in that described disconnection described antistatic line
With the electrical connection of cabling described in each bar, form film structure, including:
Excision antistatic line, to disconnect the electrical connection of described antistatic line and cabling described in each bar；
Cut described film substrate, form single film structure.
10. a film structure, it is characterised in that use claim 1～9 any claim institute
The film structure that the method stated makes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610177377.3A CN105867680A (en) | 2016-03-25 | 2016-03-25 | A film structure and a manufacturing method therefor |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610177377.3A CN105867680A (en) | 2016-03-25 | 2016-03-25 | A film structure and a manufacturing method therefor |
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| CN105867680A true CN105867680A (en) | 2016-08-17 |
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| CN201610177377.3A Pending CN105867680A (en) | 2016-03-25 | 2016-03-25 | A film structure and a manufacturing method therefor |
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| CN108089750A (en) * | 2017-12-21 | 2018-05-29 | 帝晶光电（深圳）有限公司 | A kind of design for touch-screen film circuit antistatic |
| CN109753175A (en) * | 2017-11-07 | 2019-05-14 | 南昌欧菲显示科技有限公司 | Inductive module and preparation method |
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