TWI799833B - 聚醯亞胺前驅物、樹脂組成物、聚醯亞胺，用於半導體晶片與封裝膠材之間的保護犧牲層的聚醯亞胺，及具有保護犧牲層的半導體元件 - Google Patents

聚醯亞胺前驅物、樹脂組成物、聚醯亞胺，用於半導體晶片與封裝膠材之間的保護犧牲層的聚醯亞胺，及具有保護犧牲層的半導體元件 Download PDF

Info

Publication number
TWI799833B
TWI799833B TW110113613A TW110113613A TWI799833B TW I799833 B TWI799833 B TW I799833B TW 110113613 A TW110113613 A TW 110113613A TW 110113613 A TW110113613 A TW 110113613A TW I799833 B TWI799833 B TW I799833B
Authority
TW
Taiwan
Prior art keywords
polyimide
sacrificial layer
protective sacrificial
resin composition
encapsulation material
Prior art date
Application number
TW110113613A
Other languages
English (en)
Other versions
TW202241998A (zh
Inventor
葉冠樑
林季延
Original Assignee
達興材料股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 達興材料股份有限公司 filed Critical 達興材料股份有限公司
Priority to TW110113613A priority Critical patent/TWI799833B/zh
Priority to CN202210373342.2A priority patent/CN115216006A/zh
Priority to JP2022066334A priority patent/JP7414881B2/ja
Priority to US17/720,734 priority patent/US20220340754A1/en
Priority to KR1020220046397A priority patent/KR20220142949A/ko
Publication of TW202241998A publication Critical patent/TW202241998A/zh
Application granted granted Critical
Publication of TWI799833B publication Critical patent/TWI799833B/zh
Priority to JP2023089641A priority patent/JP2023109995A/ja

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1039—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
    • C08G73/105—Polyimides containing oxygen in the form of ether bonds in the main chain with oxygen only in the diamino moiety
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
    • C08G73/1053—Polyimides containing oxygen in the form of ether bonds in the main chain with oxygen only in the tetracarboxylic moiety
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/106—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/1064—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing sulfur
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1075—Partially aromatic polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1075—Partially aromatic polyimides
    • C08G73/1078—Partially aromatic polyimides wholly aromatic in the diamino moiety
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/14—Polyamide-imides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
TW110113613A 2021-04-15 2021-04-15 聚醯亞胺前驅物、樹脂組成物、聚醯亞胺，用於半導體晶片與封裝膠材之間的保護犧牲層的聚醯亞胺，及具有保護犧牲層的半導體元件 TWI799833B (zh)

Priority Applications (6)

Application Number Priority Date Filing Date Title
TW110113613A TWI799833B (zh) 2021-04-15 2021-04-15 聚醯亞胺前驅物、樹脂組成物、聚醯亞胺，用於半導體晶片與封裝膠材之間的保護犧牲層的聚醯亞胺，及具有保護犧牲層的半導體元件
CN202210373342.2A CN115216006A (zh) 2021-04-15 2022-04-11 聚酰亚胺前驱物、树脂组合物、聚酰亚胺、及具有牺牲保护层的半导体组件
JP2022066334A JP7414881B2 (ja) 2021-04-15 2022-04-13 犠牲保護層、及び該犠牲保護層含有半導体デバイス
US17/720,734 US20220340754A1 (en) 2021-04-15 2022-04-14 Polyimide precursor, resin composition including, and polyimide formed from such precursor, and use of the polyimide
KR1020220046397A KR20220142949A (ko) 2021-04-15 2022-04-14 폴리이미드 전구체, 이러한 전구체를 포함하는 수지 조성물 및 이러한 전구체로부터 형성된 폴리이미드, 및 폴리이미드의 용도
JP2023089641A JP2023109995A (ja) 2021-04-15 2023-05-31 ポリイミド前駆体、樹脂組成物及びポリイミド

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW110113613A TWI799833B (zh) 2021-04-15 2021-04-15 聚醯亞胺前驅物、樹脂組成物、聚醯亞胺，用於半導體晶片與封裝膠材之間的保護犧牲層的聚醯亞胺，及具有保護犧牲層的半導體元件

Publications (2)

Publication Number Publication Date
TW202241998A TW202241998A (zh) 2022-11-01
TWI799833B true TWI799833B (zh) 2023-04-21

Family

ID=83606074

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110113613A TWI799833B (zh) 2021-04-15 2021-04-15 聚醯亞胺前驅物、樹脂組成物、聚醯亞胺，用於半導體晶片與封裝膠材之間的保護犧牲層的聚醯亞胺，及具有保護犧牲層的半導體元件

Country Status (5)

Country Link
US (1) US20220340754A1 (zh)
JP (2) JP7414881B2 (zh)
KR (1) KR20220142949A (zh)
CN (1) CN115216006A (zh)
TW (1) TWI799833B (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115710352B (zh) * 2022-10-31 2024-04-16 浙江中科玖源新材料有限公司 一种锂离子电池硅负极用粘结剂及锂离子电池硅负极

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109679095A (zh) * 2018-12-18 2019-04-26 苏州予信天材新材料应用技术有限公司 一种耐高温型聚酰胺-聚醚酰亚胺增韧聚合物及其制备方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3427713B2 (ja) * 1997-01-22 2003-07-22 株式会社日立製作所 樹脂封止型半導体装置およびその製造方法
JP2007183388A (ja) * 2006-01-06 2007-07-19 Toray Ind Inc 感光性樹脂組成物、耐熱性樹脂パターンの製造方法および有機電界発光素子
JP7052384B2 (ja) * 2018-01-31 2022-04-12 東レ株式会社 仮保護膜用樹脂組成物、およびこれを用いた半導体電子部品の製造方法
JP7230398B2 (ja) * 2018-09-26 2023-03-01 東レ株式会社 犠牲層用樹脂組成物、およびこれを用いた半導体電子部品の製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109679095A (zh) * 2018-12-18 2019-04-26 苏州予信天材新材料应用技术有限公司 一种耐高温型聚酰胺-聚醚酰亚胺增韧聚合物及其制备方法

Also Published As

Publication number Publication date
US20220340754A1 (en) 2022-10-27
CN115216006A (zh) 2022-10-21
JP2022164609A (ja) 2022-10-27
TW202241998A (zh) 2022-11-01
KR20220142949A (ko) 2022-10-24
JP7414881B2 (ja) 2024-01-16
JP2023109995A (ja) 2023-08-08

Similar Documents

Publication Publication Date Title
TWI456645B (zh) 半導體裝置用膜以及半導體裝置
JP2010199541A5 (zh)
JP2011228450A5 (zh)
JP2010134466A5 (ja) 液晶表示装置の作製方法
JP2010199542A5 (zh)
JP2017017320A5 (zh)
JP2011151379A5 (ja) トランジスタ
TWI799833B (zh) 聚醯亞胺前驅物、樹脂組成物、聚醯亞胺，用於半導體晶片與封裝膠材之間的保護犧牲層的聚醯亞胺，及具有保護犧牲層的半導體元件
JP2013219151A5 (zh)
JP2008311638A5 (zh)
JP2006054425A5 (zh)
JP2016033937A5 (ja) 圧電デバイス
EP3790039A4 (en) RESIN COMPOSITION, LAMINATE, SEMICONDUCTOR WAFER WITH RESIN COMPOSITION LAYER, SUBSTRATE FOR MOUNTING SEMICONDUCTOR WITH RESIN COMPOSITION LAYER, AND SEMICONDUCTOR DEVICE
SG11202100176VA (en) Method for manufacturing semiconductor device, heat-curable resin composition, and dicing-die attach film
JP2013095809A5 (zh)
SG11201805612PA (en) Resin Composition, Resin Layer, Permanent Adhesive, Adhesive For Temporary Bonding, Laminated Film, Processed Wafer, And Method For Manufacturing Electronic Component Or Semiconductor Device
WO2019110680A3 (en) Composition and process for selectively etching a layer comprising an aluminium compound in the presence of layers of low-k materials, copper and/or cobalt
EP3466992A4 (en) RESIN COMPOSITION, LAMINATE, SEMICONDUCTOR WAFER WITH RESIN COMPOSITION LAYER, SEMICONDUCTOR ASSEMBLY SUBSTRATE WITH RESIN COMPOSITION LAYER, AND SEMICONDUCTOR DEVICE
TWI799618B (zh) 切割用黏著帶及半導體晶片之製造方法
JP2010171411A5 (ja) 半導体装置の作製方法
TWI799582B (zh) 半導體裝置以及在其製造中使用的熱硬化性樹脂組成物以及切晶黏晶一體型帶
EP3992221A4 (en) RESIN COMPOSITION, RESIN SHEET, LAMINATE, SEMICONDUCTOR WAFER WITH RESIN COMPOSITION LAYER, SUBSTRATE WITH RESIN COMPOSITION LAYER FOR SEMICONDUCTOR MOUNTING, AND SEMICONDUCTOR DEVICE
RU2019123744A (ru) Деталь, содержащая подложку и внешний барьер
TWI799478B (zh) 半導體裝置、及半導體裝置之製造方法
JP2014220463A5 (zh)