TWI798586B - Object defect inspection method and device - Google Patents
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Abstract
本發明係一種物件缺陷之檢查方法及裝置,包括:提供一待檢查的物件;提供一光線導引模組,其設有一光源、一光柵和一折射穿透鏡;提供一缺陷檢查單元;該缺陷檢查單元根據該光源之光源照射該光柵並經該折射穿透鏡折射於該物件表面的光柵影像,判斷該物件表面是否存在缺陷;該光線導引模組在保持一間距下直接相鄰該物件,在該光線導引模組下方並未設有任何光源對該物件照射,使該缺陷檢查單元直接攝入擷取僅有單一光源折射至該物件並反射的該光柵影像;藉此避免光源直接照射該物件表面造成干擾。The present invention is an inspection method and device for object defects, including: providing an object to be inspected; providing a light guide module, which is provided with a light source, a grating and a refraction lens; providing a defect inspection unit; The defect inspection unit judges whether there is a defect on the surface of the object according to the light source of the light source irradiating the grating and refracting the grating image on the surface of the object through the refraction lens; the light guide module is directly adjacent to the object while maintaining a distance Object, there is no light source under the light guide module to irradiate the object, so that the defect inspection unit directly captures and captures the grating image that only a single light source is refracted to the object and reflected; thereby avoiding the light source Directly illuminate the surface of the object to cause interference.
Description
本發明係有關於一種缺陷檢查方法及裝置,尤指一種檢查物件表面並藉反射物件表面影像以檢查物件缺陷之檢查方法及裝置。The present invention relates to a defect inspection method and device, in particular to an inspection method and device for inspecting the surface of an object and inspecting the defect of the object by reflecting the surface image of the object.
按,一般電子元件體積相當微小,若發生缺陷則難以用肉眼檢查,因此在高科技產業中常以CCD鏡頭進行檢查,一方面把缺陷部位進行放大,另一方面透過數位化的影像來檢查其缺陷部位的確實位置及缺陷狀況,以進行補救或淘汰程序;先前技術一種申請人所提出公告號碼I544213號「物件檢測方法及裝置」的專利申請案,該專利申請案以一第一光源投射檢測物表面,使其反射受一第一檢測單元擷取檢測物表面影像;另以一第二光源向光柵投射光源,使光柵上之網格經一第二分光鏡折射至檢測物表面,再使其反射經一第一分光鏡折射受一第二檢測單元擷取檢測物表面具網格之影像,藉此以第一檢測單元觀測檢測物表面影像,並以第二檢測單元作強化表面瑕疵特徵之凹痕、裂痕檢查。 By the way, the volume of general electronic components is quite small, and it is difficult to inspect with the naked eye if a defect occurs. Therefore, in the high-tech industry, a CCD lens is often used for inspection. On the one hand, the defect is enlarged, and on the other hand, the defect is inspected through digital images. The exact position and defect status of the part, so as to perform remedial or elimination procedures; a prior art patent application with publication number I544213 "object detection method and device" proposed by the applicant, the patent application uses a first light source to project the detection object The surface is reflected by a first detection unit to capture the surface image of the detection object; and a second light source is used to project the light source to the grating, so that the grid on the grating is refracted to the surface of the detection object through a second beam splitter, and then made Reflected by a first beam splitter and refracted by a second detection unit to capture the image of the grid on the surface of the test object, thereby using the first detection unit to observe the image of the surface of the test object, and using the second detection unit to enhance the characteristics of surface defects Dent, crack inspection.
該公告號碼I544213號「物件檢測方法及裝置」專利申請案之先前技術,由於電子元件表面具有平整度以及超亮的光澤,使得電子元件表面縱有缺陷或裂痕,在第一光源投射檢測物表面,使其反射受一第一檢測單元擷取檢測物表面影像時,該第一光源直接照射下,電子元件表面光澤的反射,會使第二光源向光柵投射使光柵上之網格經一第二分光鏡折射至檢測物表面的光柵影像,受到該第一光源影響下而減少其反射能量,使得第二檢測單元擷取檢測物表面具網格之影像受到光源之干擾,而不易檢查出電子元件表面的缺陷或裂痕。The previous technology of the patent application No. I544213 "Object Detection Method and Device" is that due to the flatness and super bright gloss of the surface of the electronic component, there are defects or cracks on the surface of the electronic component, and the surface of the detection object is projected on the first light source. When the reflection is captured by a first detection unit to capture the surface image of the detection object, under the direct irradiation of the first light source, the reflection of the surface gloss of the electronic component will cause the second light source to project to the grating so that the grid on the grating passes through a first The grating image refracted by the two beam splitters to the surface of the detection object is affected by the first light source to reduce its reflected energy, so that the second detection unit captures the image of the grid on the surface of the detection object and is interfered by the light source, making it difficult to detect electrons. Defects or cracks in the surface of a component.
爰是,本發明之目的,在於提供一種能夠克服光源干擾的物件缺陷之檢查方法。Therefore, the object of the present invention is to provide a method for inspecting object defects that can overcome light source interference.
本發明之另一目的,在於提供一種能夠克服光源干擾的物件缺陷之檢查裝置。Another object of the present invention is to provide an inspection device capable of overcoming object defects caused by light source interference.
依據本發明目的之物件缺陷之檢查方法,包括:提供一待檢查的物件;提供一光線導引模組,其設有一光源、一光柵和一折射穿透鏡,該光柵具有複數條線條;提供一缺陷檢查單元,設有CCD鏡頭;該缺陷檢查單元根據該光源之光線照射該光柵並經該折射穿透鏡折射於該物件表面的光柵影像,判斷該物件表面是否存在缺陷;其中,該光線導引模組在保持一間距下直接相鄰該物件,在該光線導引模組下方並未設有任何光源對該物件照射,使該缺陷檢查單元直接攝入擷取僅有單一光源折射至該物件並反射的該光柵影像。The object defect inspection method according to the object of the present invention includes: providing an object to be inspected; providing a light guide module, which is provided with a light source, a grating and a refraction through lens, and the grating has a plurality of lines; providing A defect inspection unit is equipped with a CCD lens; the defect inspection unit judges whether there is a defect on the surface of the object according to the light of the light source irradiating the grating and refracting the grating image on the surface of the object through the refraction lens; wherein, the light The guiding module is directly adjacent to the object while maintaining a distance, and there is no light source under the light guiding module to irradiate the object, so that the defect inspection unit directly captures and captures only a single light source refracted to The raster image that the object reflects.
依據本發明另一目的之物件缺陷之檢查裝置,在於一種用以執行如所述物件缺陷之檢查方法的裝置。An object defect inspection device according to another object of the present invention is a device for performing the object defect inspection method described above.
本發明實施例之物件檢查方法及裝置,由於該光線導引模組在保持一間距下直接相鄰該載盤的該物件,在該光線導引模組下方並未設有任何光源對該物件照射,使該缺陷檢查單元直接攝入擷取僅有單一光源折射至該物件並反射的光柵影像,有效地避免先前技術採用第一、二光源之雙光源方式,而因為其中一第一光源直接照射該物件表面造成干擾該缺陷檢查單元檢查功能的困擾,達成克服光源干擾之目的。In the object inspection method and device according to the embodiment of the present invention, since the light guide module is directly adjacent to the object on the tray while maintaining a distance, there is no light source below the light guide module to detect the object. Irradiation, so that the defect inspection unit directly captures and captures only a single light source refracted to the object and reflects the grating image, effectively avoiding the dual light source method of the first and second light sources in the prior art, and because one of the first light sources directly Irradiating the surface of the object interferes with the inspection function of the defect inspection unit, so as to achieve the purpose of overcoming the interference of the light source.
請參閱圖1所示,本發明任一實施例可使用如圖所示承載以矩陣排列複數物件51之載盤5為例進行說明,該載盤5設有分別各對應每一各該物件51的複數個基準點52,且每一該物件51分別各具有一寬度D1。Please refer to FIG. 1 , any embodiment of the present invention can be described by using a tray 5 carrying a plurality of
請參閱圖2、3,本發明第一實施例可以圖中所示之裝置為例作說明;該裝置設有:
一載台T,供承載複數待檢查的物件51之該載盤5置放;
一光線導引模組1,設於該載台T上方,該光線導引模組1設有一光源11、具有規律性複數條線條121之一光柵12及左上右下之四十五度偏斜角度的一折射穿透鏡13,該光柵12成垂直立設並與該折射穿透鏡13呈四十五度夾角;其中,該光柵12的每一該線條121為相互平行且彼此不重疊及相交的直線,每兩條該線條121間並保持一間距D2,而該光柵12位於該光源11與該折射穿透鏡13之間的該光源11投射路徑上;
一缺陷檢查單元2,可為一具有第一解析度之電荷耦合元件(CCD)或互補金屬氧化半導體(CMOS)的面陣相機(area scan camera),其設於該載台T與該光線導引模組1的該折射穿透鏡13連成之垂直Z軸向上,該光線導引模組1在保持一間距下直接相鄰位於該缺陷檢查單元2與該載盤5之間。Referring to Fig. 2, 3, the first embodiment of the present invention can be described as an example with the device shown in the figure; This device is provided with:
A loading platform T for placing the loading tray 5 carrying a plurality of
請參閱圖4、5,使該光源11之光線照射該光柵12,並經呈四十五度偏斜角度之該折射穿透鏡13偏折向下,而以九十度角向下以一照射光路L1垂直照射於該物件51表面上,並將該光柵12之複數條線條121投影至該物件51表面形成如圖5中所示的一光柵影像,該光源11之光線折射於該物件51表面,並反射向上且穿透該折射穿透鏡13至該缺陷檢查單元2的CCD鏡頭,而形成一檢查光路L2將該光柵影像傳遞至該缺陷檢查單元2;該缺陷檢查單元2藉由所擷取的該光柵影像,判斷該物件51表面是否存在缺陷;即,供該缺陷檢查單元2擷取該光柵影像的該檢查光路L2,係藉由照射該光柵12的該光源11之光線經該折射穿透鏡13照射於該物件51表面的照射光路L1,反射透過該折射穿透鏡13向上至該缺陷檢查單元2所形成。Referring to Fig. 4 and 5, the light from the
請參閱圖5、6,該光柵影像同時投影覆蓋該載盤5的複數個物件51表面,該光柵影像之複數條線條121被設定每兩線條121彼此的該間距D2小於每一該物件51之該寬度D1,且同一該線條121同時投影覆蓋至該載盤5之縱向排列的複數個物件51表面;該缺陷檢查單元2係以一次對單一個該物件51上的光柵影像作逐一進行檢查,由於該物件51表面會將該光源11所照射出的光線進行反射,使得該物件51表面上沒有複數條線條121覆蓋的區域如圖6所示的白色影像與有複數條線條121覆蓋的區域如圖6所示的黑色影像會產生黑白相間之光柵影像。Please refer to Figures 5 and 6, the grating image is simultaneously projected onto the surface of a plurality of
請參閱圖7、8,當該物件51上面存在可能為凹痕、裂痕---等的一缺陷A時,該光柵影像將顯示出該物件51上圍繞在該缺陷A外的複數條線條121呈現變形的一個區域,該線條121變形係根據該缺陷A所在的位置,越接近該缺陷A的位置,則該線條121原呈平行狀態變形的幅度越大,根據該線條121變形幅度較大的區域,可判讀是否存在缺陷。Please refer to FIGS. 7 and 8. When there is a defect A that may be a dent, a crack, etc. on the
本發明第一實施例物件缺陷之檢查方法及裝置,由於該光線導引模組1在保持一間距下直接相鄰該載盤5的該物件51,在該光線導引模組1下方並未設有任何光源對該物件51照射,使該缺陷檢查單元2直接攝入擷取僅有單一光源11折射至該物件51並反射的光柵影像,有效地避免先前技術採用第一、二光源之雙光源方式,而因為其中一第一光源直接照射該物件表面51造成干擾該缺陷檢查單元2檢查功能的困擾,達成克服光源干擾之目的。The object defect inspection method and device of the first embodiment of the present invention, since the
請參閱圖9,本發明第二實施例,該缺陷檢查單元2進行該物件51的缺陷檢查方式如上述第一實施例所揭示,故不再贅述,其與上述第一實施例差異在於:更將一分光鏡3A裝設於該載台T與該光線導引模組1連成之垂直Z軸向上方,再將該缺陷檢查單元2對應設於該分光鏡3A之一側,使得該缺陷檢查單元2與該分光鏡3A呈四十五度夾角;該光源11自該物件51表面反射穿透該折射穿透鏡13,再經該分光鏡3A折射至該缺陷檢查單元2的檢查光路L2將該光柵影像傳遞至該缺陷檢查單元2;其中,該分光鏡3A係呈一左上右下之方位並與該折射穿透鏡13之偏斜角度平行,且該分光鏡3A的設置亦可呈一左下右上之方位,並與該缺陷檢查單元2A保持四十五度夾角,但不以此設限。Please refer to FIG. 9, the second embodiment of the present invention, the
本發明第二實施例係將該缺陷檢查單元2設置於該分光鏡3A與該載台T及該光線導引模組1連成之垂直Z軸向的一側,使得本實施例不僅保有上述第一實施例所提及之功效,更具有使得機台整體的高度大幅降低及以側面觀察該光柵影像來精確地檢查物件表面細微缺陷之功能。In the second embodiment of the present invention, the
請參閱圖10、11,本發明第三實施例的該照射光路L1及該檢查光路L2的光路傳遞方式與上述第二實施例無異,故不再贅述;
而第三實施例與上述第二實施例差異在於:將一位移檢查單元4B設置於該載台T與該分光鏡3A連成之垂直Z軸向上方,該位移檢查單元4B可為一具有第一解析度之電荷耦合元件(CCD)或互補金屬氧化半導體(CMOS)的線陣相機(line scan camera),透過該分光鏡3A將該光柵影像分別經該檢查光路L2傳遞至該缺陷檢查單元2及經一擷取光路L3B傳遞至該位移檢查單元4B;該擷取光路L3B係藉由照射該光柵的該光源11之光線,經該折射穿透鏡13照射於該物件51表面的照射光路,反射向上透過該折射穿透鏡13及該分光鏡3A至該位移檢查單元4B所形成;
因為該位移檢查單元4B係線陣相機,且在本實施例中,設定經由該擷取光路L3B僅攝入擷取該載盤5上覆蓋該物件51之光柵影像中一條該線條121的一線型區間的影像,該線型區間攝入的影像包含該載盤5上同一行中每一該物件51相對應的一側邊511與各該物件51相對應的該載盤5上的該基準點52;
使用者可根據該物件51的該側邊511至該基準點52的一距離D3作為該物件51是否偏移之參考;例如:該距離D3在原先系統設定值為5mm,若該位移檢查單元4B所攝入擷取到在該線型區間中的影像中,該物件51的該側邊511至該基準點52的該距離D3若不等於5mm,則判斷該物件51置放在該載盤5的位置有偏移,藉以快速判斷該物件51是否存在偏移的缺陷產生;本實施例係以該物件51的該側邊511至該基準點52的直線距離作為該距離D3之依據,但也可使用該物件51的中心點至該基準點52的直線距離作為該距離D3之依據,但不以此設限。Please refer to Figs. 10 and 11, the optical path transmission modes of the illumination optical path L1 and the inspection optical path L2 in the third embodiment of the present invention are the same as those in the second embodiment above, so no further description is given;
The difference between the third embodiment and the above-mentioned second embodiment is that a
本發明第三實施例,不僅可以透過該缺陷檢查單元2根據該光柵影像快速進行判讀該物件51是否存在缺陷,亦可由該位移檢查單元4B根據該線型區間的影像快速進行判讀該物件51是否存在位移,進而達成克服光源干擾、精確地檢查該物件51表面細微缺陷及判讀該物件51於該載盤5內是否存在位移之功效。In the third embodiment of the present invention, not only can the
惟以上所述者,僅為本發明之較佳實施例而已,當不能以此限定本發明實施之範圍,即大凡依本發明申請專利範圍及發明說明內容所作之簡單的等效變化與修飾,皆仍屬本發明專利涵蓋之範圍內。But what is described above is only a preferred embodiment of the present invention, and should not limit the scope of implementation of the present invention with this, that is, all simple equivalent changes and modifications made according to the patent scope of the present invention and the content of the description of the invention, All still belong to the scope covered by the patent of the present invention.
1:光線導引模組
11:光源
12:光柵
121:線條
13:折射穿透鏡
2:缺陷檢查單元
3:分光鏡
4B:位移檢查單元
5:載盤
51:物件
511:側邊
52:基準點
D1:寬度
D2:間距
D3:距離
L1:照射光路
L2:檢查光路
L3B:擷取光路
T:載台1: Light guide module
11: Light source
12: Grating
121: line
13: Refraction through the lens
2: Defect inspection unit
3:
圖1係本發明第一實施例中載盤之示意圖。 圖2係本發明第一實施例之機構配置示意圖。 圖3係本發明第一實施例中光柵之複數條線條示意圖。 圖4係本發明第一實施例中照射光路及檢查光路之形成路徑示意圖。 圖5係本發明第一實施例中光柵影像投影至載盤上每一物件之示意圖。 圖6係本發明第一實施例中缺陷檢查單元檢查單一物件之示意圖。 圖7係本發明第一實施例中物件存在缺陷之示意圖。 圖8係本發明第一實施例中物件上線條變形之示意圖。 圖9係本發明第二實施例之機構配置示意圖。 圖10係本發明第三實施例中機構配置示意圖。 圖11係本發明第三實施例中擷取光路之形成路徑示意圖。 圖12係本發明第三實施例中位移檢查單元擷取無線條影像之示意圖。 圖13係本發明第三實施例中位移檢查單元判斷是否偏移之示意圖。FIG. 1 is a schematic diagram of a carrier plate in the first embodiment of the present invention. Fig. 2 is a schematic diagram of the mechanism configuration of the first embodiment of the present invention. Fig. 3 is a schematic diagram of multiple lines of the grating in the first embodiment of the present invention. Fig. 4 is a schematic diagram of the forming paths of the illumination light path and the inspection light path in the first embodiment of the present invention. FIG. 5 is a schematic diagram of projecting a raster image onto each object on the carrier disc in the first embodiment of the present invention. FIG. 6 is a schematic diagram of a defect inspection unit inspecting a single object in the first embodiment of the present invention. Fig. 7 is a schematic diagram of defects in the object in the first embodiment of the present invention. Fig. 8 is a schematic diagram of deformation of lines on an object in the first embodiment of the present invention. Fig. 9 is a schematic diagram of the mechanism configuration of the second embodiment of the present invention. Fig. 10 is a schematic diagram of mechanism configuration in the third embodiment of the present invention. FIG. 11 is a schematic diagram of the formation path of the extraction optical path in the third embodiment of the present invention. FIG. 12 is a schematic diagram of the wireless line image captured by the displacement inspection unit in the third embodiment of the present invention. Fig. 13 is a schematic diagram of the displacement checking unit in the third embodiment of the present invention judging whether there is a displacement.
1:光線導引模組1: Light guide module
11:光源11: Light source
12:光柵12: Grating
13:折射穿透鏡13: Refraction through the lens
2:缺陷檢查單元2: Defect inspection unit
5:載盤5: Carrier
51:物件51: object
T:載台T: stage
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Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2006125967A (en) * | 2004-10-28 | 2006-05-18 | Lasertec Corp | Inspection device, inspection method, and manufacturing method of pattern substrate |
TWM487433U (en) * | 2014-03-04 | 2014-10-01 | All Ring Tech Co Ltd | Object inspection device |
US10816482B2 (en) * | 2016-10-26 | 2020-10-27 | Board Of Regents, The University Of Texas System | High throughput, high resolution optical metrology for reflective and transmissive nanophotonic devices |
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Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2006125967A (en) * | 2004-10-28 | 2006-05-18 | Lasertec Corp | Inspection device, inspection method, and manufacturing method of pattern substrate |
TWM487433U (en) * | 2014-03-04 | 2014-10-01 | All Ring Tech Co Ltd | Object inspection device |
US10816482B2 (en) * | 2016-10-26 | 2020-10-27 | Board Of Regents, The University Of Texas System | High throughput, high resolution optical metrology for reflective and transmissive nanophotonic devices |
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