TWI796956B - Metal shell packaging combination of internal components of endoscope - Google Patents

Metal shell packaging combination of internal components of endoscope Download PDF

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TWI796956B
TWI796956B TW111105870A TW111105870A TWI796956B TW I796956 B TWI796956 B TW I796956B TW 111105870 A TW111105870 A TW 111105870A TW 111105870 A TW111105870 A TW 111105870A TW I796956 B TWI796956 B TW I796956B
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circuit board
metal shell
internal components
endoscope
rigid circuit
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TW111105870A
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TW202333616A (en
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林銘源
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醫電鼎眾股份有限公司
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Abstract

一種內視鏡內部元件之金屬殼封裝組合,用於安裝在一內視鏡的一頭管中,主要具有:一硬式電路板;一光源鏡頭組,結合於該硬式電路板而共同組成一塊體;一軟性電路板,具有一連接面貼接於該硬式電路板的底面;一電纜,具有複數電線,連接於該軟性電路板;一金屬殼,圍合成管狀而兩端呈開放狀,該金屬殼包圍該光源鏡頭組的部分、該硬式電路板、該軟性電路板以及該複數電線;一固化膠,至少位於該金屬殼所圍合的範圍內,且包覆該光源鏡頭組的局部、該硬式電路板、該軟性電路板、及該複數電線而整體共同形成一整體化元件。A metal shell packaging combination of internal components of an endoscope is used to be installed in a head tube of an endoscope, mainly comprising: a rigid circuit board; a light source lens group, combined with the rigid circuit board to form a body; A flexible circuit board, having a connection surface attached to the bottom surface of the rigid circuit board; a cable, having a plurality of wires, connected to the flexible circuit board; a metal shell, surrounded by a tubular shape with open ends, the metal shell Surrounding the part of the light source lens group, the hard circuit board, the flexible circuit board and the plurality of wires; a curing glue, at least located in the range enclosed by the metal shell, and covering the part of the light source lens group, the hard circuit board The circuit board, the flexible circuit board, and the plurality of wires together form an integral component.

Description

內視鏡內部元件之金屬殼封裝組合Metal shell packaging combination of internal components of endoscope

本發明係與內視鏡的元件封裝技術有關,特別是指一種內視鏡內部元件之金屬殼封裝組合。 The invention is related to the component packaging technology of the endoscope, in particular to a metal shell package combination of the internal components of the endoscope.

我國I730621號發明專利,揭露了一種影像感測器封裝件以及內視鏡,此案主要是在一個基座上設置影像感測器、發光元件以及封裝體,而在該基座底部則可以設置導電接點來與其他的轉接器或導電連接器電性連接,並且此案於其圖7中也揭露了於該基座底部可以設置保護膠體來將轉接器的導電接點及導線包覆而加以保護。 my country's invention patent No. I730621 discloses an image sensor package and an endoscope. In this case, an image sensor, a light-emitting element, and a package are arranged on a base, and the bottom of the base can be set The conductive contacts are used to electrically connect with other adapters or conductive connectors, and this case also discloses in Figure 7 that a protective colloid can be provided at the bottom of the base to wrap the conductive contacts and wires of the adapter overwhelm and protect.

前述已知技術之影像感測器與發光元件都是設置在基座頂面,而是類似COB(Chip On Board,晶片直接封裝)製程的設置方式,此種設置方式下,該影像感測器上方不能再設置鏡片組,因此其光學特性即受到限制。此外,在內視鏡內部這樣微小空間內,即使設置了保護膠體,整體而言仍然很小,在組裝時仍然有可能因為人員的操作不慎而導致損壞,且在施用夾具時也有難以設置的問題。 The image sensor and light-emitting element of the aforementioned known technology are all arranged on the top surface of the base, but it is similar to the arrangement method of COB (Chip On Board, chip direct packaging) process. In this arrangement method, the image sensor The lens group can no longer be placed on top, so its optical properties are limited. In addition, in such a small space inside the endoscope, even if the protective colloid is installed, it is still small overall, and it is still possible to cause damage due to inadvertent operation by personnel during assembly, and it is also difficult to install when applying the clamp. question.

本發明之主要目的即在於提出一種內視鏡內部元件之金屬殼封裝組合,其可在固化膠外再設置一金屬殼,除了可以保護組裝後的整體組合外,還可以方便施用夾具。 The main purpose of the present invention is to provide a metal shell packaging assembly for the internal components of the endoscope, which can be provided with a metal shell outside the curing glue, which can not only protect the entire assembly after assembly, but also facilitate the application of fixtures.

本發明之再一目的即在於提出一種內視鏡內部元件之金屬殼封裝組合,其可在設置金屬殼後,使組裝後的整體組合具有防水的功能。 Another object of the present invention is to provide a metal shell packaging assembly for internal components of an endoscope, which can make the assembled whole assembly have a waterproof function after the metal shell is installed.

為了達成上述目的,本發明提出一種內視鏡內部元件之金屬殼封裝組合,用於安裝在一內視鏡的一頭管中,該內視鏡內部元件之金屬殼封裝組合包含有:一硬式電路板;一光源鏡頭組,具有一取像單元以及複數光源,該取像單元由一取像裝置以及設於該取像裝置上方的一鏡片組所組成,該取像單元呈長形而且以該取像裝置的底部設於該硬式電路板頂面且電性連接於該硬式電路板,該複數光源設於至少一高台之頂面,該至少一高台係位於該取像單元側邊,且以底面設於該硬式電路板頂面且使該複數光源電性連接於該硬式電路板,且該複數光源藉由該至少一高台與該取像單元一起結合於該硬式電路板而共同組成一塊體;一軟性電路板,具有一連接面貼接於該硬式電路板的底面且電性連接於該硬式電路板,該軟性電路板具有複數連接導電接點;一電纜,具有複數電線,以及具有一外披覆層包覆該複數電線,該複數電線由該電纜之一端向外延伸而伸出該外披覆層,各該電線均具有一金屬芯,而以其金屬芯分別連接於該軟性電路板上的該複數導電接點;一金屬殼,圍合成管狀而兩端呈開放狀,該金屬殼包圍該光源鏡頭組的部分、該硬式電路板、該軟性電路板以及該複數電線;一固化膠,至少位於該金屬殼所圍合的範圍內,且位於該硬式電路板、該軟性電路板以及該複數電線與該金屬殼之間,且包覆該光源鏡頭組的局部、該硬式電路板、該軟性電路板、及該複數電線而整體共同形成一整體化元件。 In order to achieve the above object, the present invention proposes a metal shell packaging combination of internal components of an endoscope, which is used to be installed in a head tube of an endoscope. The metal shell packaging combination of internal components of the endoscope includes: a hard circuit plate; a light source lens group, which has an imaging unit and a plurality of light sources, the imaging unit is composed of an imaging device and a lens group arranged above the imaging device, the imaging unit is elongated and uses the The bottom of the imaging device is arranged on the top surface of the rigid circuit board and is electrically connected to the rigid circuit board. The plurality of light sources are arranged on the top surface of at least one high platform, and the at least one high platform is located on the side of the imaging unit, and The bottom surface is set on the top surface of the rigid circuit board and the plurality of light sources are electrically connected to the rigid circuit board, and the plurality of light sources are combined with the rigid circuit board by the at least one high platform and the imaging unit to form a body together ; a flexible circuit board, with a connecting surface attached to the bottom surface of the rigid circuit board and electrically connected to the rigid circuit board, the flexible circuit board has a plurality of connecting conductive contacts; a cable, with a plurality of wires, and a The outer covering layer covers the plurality of electric wires, and the plurality of electric wires extend outward from one end of the cable to protrude from the outer covering layer, each of the electric wires has a metal core, and is connected to the flexible circuit by its metal core The plurality of conductive contacts on the board; a metal shell, which is formed into a tube shape with open ends, and the metal shell surrounds the part of the light source lens group, the rigid circuit board, the flexible circuit board and the plurality of electric wires; a solidified Glue, located at least in the range enclosed by the metal shell, and between the rigid circuit board, the flexible circuit board, the plurality of wires and the metal shell, and covering part of the light source lens group, the rigid circuit board , the flexible circuit board, and the plurality of electric wires together form an integral component.

藉由上述技術內容,本發明在固化膠外再設置一金屬殼,除了可以保護組裝後的整體組合外,還可以方便施用夾具。此外,本發明可在設置金屬殼後,使組裝後的整體組合具有防水的功能。 Based on the above technical content, the present invention sets a metal shell outside the curing glue, which can not only protect the overall combination after assembly, but also facilitate the application of fixtures. In addition, the present invention can make the assembled whole combination have a waterproof function after the metal shell is provided.

10:內視鏡內部元件之金屬殼封裝組合 10: Metal shell packaging combination of internal components of the endoscope

11:硬式電路板 11: Rigid circuit board

21:光源鏡頭組 21: Light source lens group

22:取像單元 22: Image acquisition unit

221:取像裝置 221: Imaging device

222:鏡片組 222: Lens group

24:光源 24: light source

241:高台 241: high platform

27:膠體 27: colloid

29:塊體 29: block

31:軟性電路板 31: Flexible printed circuit board

32:連接面 32: connection surface

34:導電接點 34: Conductive contact

41:電纜 41: cable

42:電線 42: wire

43:金屬芯 43: metal core

44:外披覆層 44: Outer coating layer

51:金屬殼 51: metal shell

52:縫隙 52: Gap

61:固化膠 61: curing glue

69:整體化元件 69: Integrated components

91:頭管 91: Head tube

10’:內視鏡內部元件之金屬殼封裝組合 10': Metal shell packaging combination of internal components of the endoscope

31’:軟性電路板 31': Flexible circuit board

34’:導電接點 34': Conductive contacts

41’:電纜 41': cable

42’:電線 42': wire

43’:金屬芯 43': metal core

44’:外披覆層 44': Outer coating

49’:套管 49': Casing

51’:金屬殼 51': metal shell

61’:固化膠 61': curing glue

圖1係本發明第一較佳實施例之立體圖。 Fig. 1 is a perspective view of the first preferred embodiment of the present invention.

圖2係本發明第一較佳實施例之部分元件爆炸圖,顯示移開金屬殼的狀態。 Fig. 2 is an exploded view of some components of the first preferred embodiment of the present invention, showing the state of removing the metal shell.

圖3係本發明第一較佳實施例之爆炸圖。 Fig. 3 is an exploded view of the first preferred embodiment of the present invention.

圖4係本發明第一較佳實施例之透視示意圖,顯示移除金屬殼後的內部組裝狀態。 Fig. 4 is a schematic perspective view of the first preferred embodiment of the present invention, showing the internal assembly state after removing the metal shell.

圖5係本發明第一較佳實施例之剖視示意圖。 Fig. 5 is a schematic cross-sectional view of the first preferred embodiment of the present invention.

圖6係本發明第一較佳實施例之安裝示意圖。 Fig. 6 is an installation diagram of the first preferred embodiment of the present invention.

圖7係本發明第二較佳實施例之透視示意圖,顯示移除金屬殼後的內部組裝狀態。 Fig. 7 is a schematic perspective view of the second preferred embodiment of the present invention, showing the internal assembly state after removing the metal shell.

圖8係本發明第一較佳實施例之剖視示意圖。 Fig. 8 is a schematic cross-sectional view of the first preferred embodiment of the present invention.

為了詳細說明本發明之技術特點所在,茲舉以下之較佳實施例並配合圖式說明如後,其中:如圖1至圖6所示,本發明提出第一較佳實施例來說明一種內視鏡內部元件之金屬殼封裝組合10,用於安裝在一內視鏡(圖中未示)的一頭管91中,該內視鏡內部元件之金屬殼封裝組合10主要由一硬式電路板11、光源鏡頭 組21、一軟性電路板31、一電纜41、一金屬殼51以及一固化膠61所組成,其中:該光源鏡頭組21,具有一取像單元22以及複數光源24,該取像單元22由一取像裝置221以及設於該取像裝置221上方的一鏡片組222所組成,該鏡片組222由於係習知元件,因此於圖式中僅以簡單線條表示之,該取像單元22呈長形而且以該取像裝置221的底部設於該硬式電路板11頂面且電性連接於該硬式電路板11,該複數光源24可以選用LED晶片,而設於二高台241之頂面,該二高台241係位於該取像單元22的二側邊,且以底面設於該硬式電路板11頂面且使該複數光源24電性連接於該硬式電路板11,且該複數光源24藉由該二高台241與該取像單元22一起結合於該硬式電路板11,並且以一膠體27固定而共同組成一塊體29,這個塊體29即可以一整個拿起來組裝,進而可以方便後續與其他元件的組裝。 In order to describe the technical features of the present invention in detail, hereby give the following preferred embodiments and describe them in conjunction with the drawings as follows, wherein: as shown in Figures 1 to 6, the present invention proposes a first preferred embodiment to illustrate a The metal shell packaging assembly 10 of the internal components of the mirror is used to be installed in a head pipe 91 of an endoscope (not shown in the figure), and the metal shell packaging assembly 10 of the internal components of the endoscope is mainly composed of a rigid circuit board 11 , light source lens Group 21, a flexible circuit board 31, a cable 41, a metal shell 51 and a curing glue 61, wherein: the light source lens group 21 has an imaging unit 22 and a plurality of light sources 24, the imaging unit 22 consists of An image-taking device 221 and a lens group 222 arranged on the top of the image-taking device 221 are formed. Since the lens group 222 is a conventional component, it is only represented by simple lines in the drawings. The image-taking unit 22 is The bottom of the imaging device 221 is elongated and is arranged on the top surface of the rigid circuit board 11 and is electrically connected to the rigid circuit board 11. The plurality of light sources 24 can be selected from LED chips, and are arranged on the top surface of the two high platforms 241. The two high platforms 241 are located on the two sides of the imaging unit 22, and are arranged on the top surface of the rigid circuit board 11 with the bottom surface, and the plurality of light sources 24 are electrically connected to the rigid circuit board 11, and the plurality of light sources 24 are borrowed The two high platforms 241 and the imaging unit 22 are combined with the rigid circuit board 11 and fixed with a colloid 27 to form a block 29. This block 29 can be picked up and assembled as a whole, which can facilitate subsequent contact with Assembly of other components.

該軟性電路板31,具有一連接面32貼接於該硬式電路板11的底面且電性連接於該硬式電路板11,該軟性電路板31具有複數連接導電接點34。 The flexible circuit board 31 has a connection surface 32 attached to the bottom surface of the rigid circuit board 11 and is electrically connected to the rigid circuit board 11 . The flexible circuit board 31 has a plurality of connecting conductive contacts 34 .

該電纜41,內部具有複數電線42,以及外部具有一外披覆層44包覆該複數電線42,該複數電線42有粗有細,由該電纜41之一端向外延伸而伸出該外披覆層44,各該電線42均具有一金屬芯43,而以其金屬芯43分別連接於該軟性電路板31上的該複數導電接點34。 The cable 41 has a plurality of wires 42 inside and an outer sheath 44 covering the plurality of wires 42. The plurality of wires 42 are thick and thin, extending outward from one end of the cable 41 and extending out of the outer sheath. The covering layer 44 , each of the wires 42 has a metal core 43 , and the metal core 43 is respectively connected to the plurality of conductive contacts 34 on the flexible circuit board 31 .

該金屬殼51,圍合成管狀而兩端呈開放狀,該金屬殼51包圍該光源鏡頭組21的部分、該硬式電路板11、該軟性電路板31以及該複數電線42。於本第一實施例中,該金屬殼51圍合成管狀的斷面形狀可以選擇為呈矩形,這裡呈矩形的斷面可以提供平整且平行的兩相對側面,進而提供方便夾具夾取的 效果,藉此提升組裝的方便性。此外,該金屬殼51可以視需要而選擇管狀周壁沒有縫隙的結構,但在本第一實施例中是選擇該金屬殼51由一片體圍合成管狀,而具有一縫隙52,這個縫隙52可以選擇使其位於在斷面上的該矩形的一邊的中段位置,該縫隙52主要可以用來吸收灌膠時的膨脹或收縮。 The metal shell 51 is formed into a tubular shape with open ends. The metal shell 51 surrounds the light source lens group 21 , the rigid circuit board 11 , the flexible circuit board 31 and the plurality of wires 42 . In the first embodiment, the cross-sectional shape of the metal shell 51 surrounded by a tubular shape can be selected as a rectangle, where the rectangular cross-section can provide two flat and parallel opposite sides, thereby providing a convenient clamping position. effect, thereby improving the convenience of assembly. In addition, the metal shell 51 can choose a structure without gaps in the tubular peripheral wall as required, but in this first embodiment, the metal shell 51 is selected to be surrounded by a single piece into a tubular shape, and has a gap 52. This gap 52 can be selected It is located in the middle of one side of the rectangle on the section, and the gap 52 can be mainly used to absorb the expansion or contraction during glue pouring.

該固化膠61,位於該金屬殼51所圍合的範圍內,而且位於該硬式電路板11、該軟性電路板31以及該複數電線42與該金屬殼51之間,且包覆該光源鏡頭組21的局部、該硬式電路板11、該軟性電路板31、及該複數電線42而整體共同形成一整體化元件69。於本第一實施例中,該固化膠61係由該金屬殼51底端再向下延伸定長度並包覆該電纜41的外披覆層44的局部,且該固化膠61係貼附於該金屬殼51內壁面。在實際操作時,該固化膠61可以先加熱使其熔融後,再灌入該金屬殼51內而待其冷卻固化。或者,可以分多次上膠而以多塊膠體黏合而成,這種分次上膠的方式,可以在該光源鏡頭組21與該硬式電路板11結合時先上膠固定,再於該軟性電路板31結合於該硬式電路板11時再一次上膠固定,此外,還可以在該複數電線42連接於該軟性電路板31的位置上膠固定,之後再整體性的灌膠固定,而這些分次上膠的膠體即相黏合而形成該固化膠61。由於這種分次上膠的多個膠體黏合狀態難以用圖式表示,因此於本案圖式中僅以一體性的該固化膠61表示之。 The curing glue 61 is located in the range enclosed by the metal shell 51, and is located between the rigid circuit board 11, the flexible circuit board 31, the plurality of electric wires 42 and the metal shell 51, and covers the light source lens group 21 , the rigid circuit board 11 , the flexible circuit board 31 , and the plurality of electric wires 42 form an integrated component 69 as a whole. In this first embodiment, the cured glue 61 extends downward for a certain length from the bottom of the metal shell 51 and covers part of the outer covering layer 44 of the cable 41, and the cured glue 61 is attached to The inner wall surface of the metal shell 51 . In actual operation, the cured glue 61 can be heated to melt first, and then poured into the metal shell 51 to be cooled and solidified. Or, it can be glued multiple times and bonded with multiple pieces of glue. In this way of gluing in stages, when the light source lens group 21 is combined with the rigid circuit board 11, it can be glued and fixed first, and then glued to the flexible circuit board 11. When the circuit board 31 is combined with the rigid circuit board 11, it is glued and fixed again. In addition, the position where the plurality of electric wires 42 are connected to the flexible circuit board 31 can be glued and fixed, and then integrally glued and fixed, and these The colloids glued in stages are bonded together to form the cured glue 61 . Since it is difficult to show the bonding state of multiple colloids that are glued step by step, it is only shown as the integral solidified glue 61 in the drawing of this case.

以上說明了本第一實施例的結構,接下來說明本第一實施例的組裝狀態及所能達成的功效。 The structure of the first embodiment has been described above, and the assembled state and the achieved effects of the first embodiment will be described next.

如圖3至圖6所示,在灌注該固化膠61前,係先將該硬式電路板11、該光源鏡頭組21、該軟性電路板31以及該電纜41相結合,並且將該金屬殼51套圍在前述元件的組合物周圍,之後再灌注該固化膠61於該金屬殼51內,待 該固化膠61固化後,即完成組裝,藉由該固化膠61來將所有的元件都固定在一起,即形成前述的整體化元件69,這個整體化元件69即可方便操作者將之組裝於內視鏡(圖中未示)的頭管91中。在灌注的過程中,該金屬殼51若是具有該縫隙52,則可以提供吸收膨脹或收縮的效果。組裝完成後的這個整體化元件69,其金屬殼51可以對該固化膠61以及內部的所有元件提供保護效果,而且在要組裝至內視鏡內時,由於該金屬殼51的斷面呈矩形,因此還可以藉方便施用夾具(圖中未示)。此外,由於該金屬殼51內已灌膠,因此這個整體化元件69可以防止水或水氣進入該金屬殼51內,藉以保護內部的元件不會損壞。 As shown in Figures 3 to 6, before pouring the curing glue 61, the hard circuit board 11, the light source lens group 21, the flexible circuit board 31 and the cable 41 are first combined, and the metal shell 51 Cover around the composition of the aforementioned components, and then pour the cured glue 61 into the metal shell 51, to be After the curing glue 61 is cured, the assembly is completed, and all the components are fixed together by the curing glue 61, that is, the aforementioned integrated component 69 is formed. This integrated component 69 can be easily assembled by the operator. In the head tube 91 of the endoscope (not shown). During the pouring process, if the metal shell 51 has the slit 52 , it can provide the effect of absorbing expansion or contraction. After the assembly is completed, the metal shell 51 of the integrated component 69 can provide protection for the curing glue 61 and all internal components, and when it is to be assembled into the endoscope, since the cross section of the metal shell 51 is rectangular , so it is also possible to apply the clamp (not shown in the figure) conveniently. In addition, since the metal shell 51 has been filled with glue, the integral component 69 can prevent water or moisture from entering the metal shell 51 , so as to protect the internal components from being damaged.

如圖7至圖8所示,本發明提出第二較佳實施例來說明一種內視鏡內部元件之金屬殼封裝組合10’,主要概同於前揭第一實施例,不同之處在於:該電纜41’更包含有一套管49’,套於該電纜41’的該外披覆層44’的部分以及該複數電線42’的部分,且該複數電線42’的金屬芯43’係露出於該套管49’外,進而可以連接於該軟性電路板31’上的該複數導電接點34’。於本實施例中,該套管49’係選用熱縮套管,而可在加熱後緊縮來將該複數電線42’的部分束緊。 As shown in Figures 7 to 8, the present invention proposes a second preferred embodiment to illustrate a metal shell packaging combination 10' of internal components of an endoscope, which is basically the same as the first embodiment disclosed above, except that: The cable 41' further includes a sleeve 49', covering the part of the outer coating 44' of the cable 41' and the part of the plurality of wires 42', and the metal core 43' of the plurality of wires 42' is exposed Outside the sleeve 49', it can be connected to the plurality of conductive contacts 34' on the flexible circuit board 31'. In this embodiment, the sleeve 49' is a heat-shrinkable sleeve, which can be shrunk after heating to tighten the plurality of electric wires 42'.

該固化膠61’係由該金屬殼51’底端向下延伸預定長度並包覆該套管49’的局部。 The cured glue 61' extends downward for a predetermined length from the bottom of the metal shell 51' and covers a part of the casing 49'.

藉此,該固化膠61’並不是如同前述第一實施例般的包覆於該電纜41’的該外披覆層44’,而是在套設該套管49’後,該固化膠61’再包覆於該套管49’。這樣的做法有助於在套設該套管49’之前,容許預留該複數電線42’露出於該電纜41’的該外披覆層44’更長的長度,藉以方便操作者進行焊接之組裝動 作。在組裝完成後,即可套上該套管49’,之後再灌注該固化膠61’來完成最後的組裝。 In this way, the curing glue 61' is not coated on the outer covering layer 44' of the cable 41' as in the aforementioned first embodiment, but after the casing 49' is set, the curing glue 61 'Then cover the casing 49'. Such a practice helps to allow a longer length of the plurality of electric wires 42' to be exposed to the outer covering layer 44' of the cable 41' before the sleeve 49' is set, so as to facilitate the operator to perform welding. Assembly motion do. After the assembly is completed, the sleeve 49' can be put on, and then the curing glue 61' is poured to complete the final assembly.

本第二實施例的其餘結構及所能達成的功效均概同於前揭第一實施例,容不再予贅述。 The rest of the structures and functions of the second embodiment are the same as those of the first embodiment disclosed above, and will not be repeated here.

10:內視鏡內部元件之金屬殼封裝組合 10: Metal shell packaging combination of internal components of the endoscope

11:硬式電路板 11: Rigid circuit board

21:光源鏡頭組 21: Light source lens group

22:取像單元 22: Image acquisition unit

221:取像裝置 221: Imaging device

222:鏡片組 222: Lens group

24:光源 24: light source

241:高台 241: high platform

27:膠體 27: colloid

29:塊體 29: block

31:軟性電路板 31: Flexible printed circuit board

32:連接面 32: connection surface

41:電纜 41: cable

42:電線 42: wire

43:金屬芯 43: metal core

44:外披覆層 44: Outer coating layer

51:金屬殼 51: metal shell

61:固化膠 61: curing glue

69:整體化元件 69: Integrated components

Claims (10)

一種內視鏡內部元件之金屬殼封裝組合,用於安裝在一內視鏡的一頭管中,該內視鏡內部元件之金屬殼封裝組合包含有: 一硬式電路板; 一光源鏡頭組,具有一取像單元以及複數光源,該取像單元由一取像裝置以及設於該取像裝置上方的一鏡片組所組成,該取像單元呈長形而且以該取像裝置的底部設於該硬式電路板頂面且電性連接於該硬式電路板,該複數光源設於至少一高台之頂面,該至少一高台係位於該取像單元側邊,且以底面設於該硬式電路板頂面且使該複數光源電性連接於該硬式電路板,且該複數光源藉由該至少一高台與該取像單元一起結合於該硬式電路板而共同組成一塊體; 一軟性電路板,具有一連接面貼接於該硬式電路板的底面且電性連接於該硬式電路板,該軟性電路板具有複數連接導電接點; 一電纜,具有複數電線,以及具有一外披覆層包覆該複數電線,該複數電線由該電纜之一端向外延伸而伸出該外披覆層,各該電線均具有一金屬芯,而以其金屬芯分別連接於該軟性電路板上的該複數導電接點; 一金屬殼,圍合成管狀而兩端呈開放狀,該金屬殼包圍該光源鏡頭組的部分、該硬式電路板、該軟性電路板以及該複數電線; 一固化膠,至少位於該金屬殼所圍合的範圍內,且位於該硬式電路板、該軟性電路板以及該複數電線與該金屬殼之間,且包覆該光源鏡頭組的局部、該硬式電路板、該軟性電路板、及該複數電線而整體共同形成一整體化元件。 A metal shell packaging combination of internal components of an endoscope is used to be installed in a head tube of an endoscope. The metal shell packaging combination of internal components of the endoscope includes: a rigid circuit board; A light source lens group has an imaging unit and a plurality of light sources. The imaging unit is composed of an imaging device and a lens group arranged above the imaging device. The imaging unit is elongated and uses the imaging unit The bottom of the device is arranged on the top surface of the rigid circuit board and is electrically connected to the rigid circuit board. The plurality of light sources are arranged on the top surface of at least one high platform. The plurality of light sources are electrically connected to the rigid circuit board on the top surface of the rigid circuit board, and the plurality of light sources are combined with the rigid circuit board by the at least one high platform and the imaging unit together to form a body; A flexible circuit board, having a connection surface attached to the bottom surface of the rigid circuit board and electrically connected to the rigid circuit board, the flexible circuit board has a plurality of connecting conductive contacts; a cable having a plurality of wires and having an outer coating covering the plurality of wires, the plurality of wires extending outwardly from one end of the cable beyond the outer coating, each of the wires having a metal core, and respectively connected to the plurality of conductive contacts on the flexible circuit board with their metal cores; A metal shell, formed into a tubular shape with open ends, the metal shell surrounds the part of the light source lens group, the rigid circuit board, the flexible circuit board and the plurality of electric wires; A curing glue, located at least within the range enclosed by the metal shell, and between the rigid circuit board, the flexible circuit board, the plurality of wires and the metal shell, and covering part of the light source lens group, the rigid circuit board The circuit board, the flexible circuit board, and the plurality of wires together form an integral component. 依據請求項1所述之內視鏡內部元件之金屬殼封裝組合,其中:該金屬殼圍合成管狀之斷面形狀係呈矩形。According to the metal shell packaging combination of internal components of the endoscope described in claim 1, wherein: the cross-sectional shape of the metal shell enclosing a tubular shape is rectangular. 依據請求項1所述之內視鏡內部元件之金屬殼封裝組合,其中:該金屬殼係由一片體圍合成管狀,而具有一縫隙。According to the metal shell encapsulation combination of internal components of the endoscope described in claim 1, wherein: the metal shell is surrounded by a piece of body to form a tubular shape, and has a gap. 依據請求項3所述之內視鏡內部元件之金屬殼封裝組合,其中:該金屬殼圍合成管狀之斷面形狀係呈矩形,而該金屬殼之該縫隙係位於該矩形的一邊的中段位置。According to the metal shell packaging combination of the internal components of the endoscope described in claim 3, wherein: the cross-sectional shape of the metal shell enclosing a tubular shape is a rectangle, and the gap of the metal shell is located in the middle of one side of the rectangle . 依據請求項1所述之內視鏡內部元件之金屬殼封裝組合,其中:該電纜更包含有一套管,套於該電纜的該外披覆層的部分以及該複數電線的部分,且該複數電線的金屬芯係露出於該套管外。According to the metal shell packaging combination of the internal components of the endoscope described in claim 1, wherein: the cable further includes a sleeve, which is sleeved on the part of the outer covering layer of the cable and the part of the plurality of electric wires, and the plurality of The metal core of the electric wire is exposed outside the casing. 依據請求項5所述之內視鏡內部元件之金屬殼封裝組合,其中:該套管係為熱縮套管。According to the metal shell packaging combination of internal components of the endoscope described in claim 5, wherein: the sleeve is a heat shrinkable sleeve. 依據請求項5所述之內視鏡內部元件之金屬殼封裝組合,其中:該固化膠係由該金屬殼底端向下延伸預定長度並包覆該套管之局部。According to the metal shell packaging combination of the internal components of the endoscope described in claim 5, wherein: the curing glue extends downward for a predetermined length from the bottom of the metal shell and covers a part of the casing. 依據請求項1所述之內視鏡內部元件之金屬殼封裝組合,其中:該固化膠係由該金屬殼底端向下延伸預定長度並包覆該電纜的外披覆層的局部。According to the metal shell encapsulation combination of internal components of the endoscope according to claim 1, wherein: the curing glue extends downward for a predetermined length from the bottom end of the metal shell and covers a part of the outer covering layer of the cable. 依據請求項1所述之內視鏡內部元件之金屬殼封裝組合,其中:該固化膠係貼附於該金屬殼內壁面。According to the metal shell packaging combination of internal components of the endoscope described in claim 1, wherein: the cured glue is attached to the inner wall of the metal shell. 依據請求項1所述之內視鏡內部元件之金屬殼封裝組合,其中:該固化膠係由多塊膠體黏合而成。According to the metal shell packaging combination of the internal components of the endoscope described in claim 1, wherein: the curing glue is formed by bonding multiple pieces of glue.
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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103070660A (en) * 2013-01-18 2013-05-01 浙江大学 Three-dimensional electronic endoscope image pick-up device
US20190328217A1 (en) * 2018-04-26 2019-10-31 Deka Products Limited Partnership Endoscope with Rotatable Camera and Related Methods
TWM597628U (en) * 2019-12-11 2020-07-01 鑫視科技股份有限公司 Observing module of endoscope
US20210085162A1 (en) * 2009-06-18 2021-03-25 Endochoice, Inc. Circuit board assembly of a multiple viewing elements endoscope
US20210153729A1 (en) * 2010-12-09 2021-05-27 Endochoice, Inc. Flexible electronic circuit board for a multi-camera endoscope
TWI730621B (en) * 2020-02-11 2021-06-11 晉弘科技股份有限公司 Image sensor package and endoscope
TWM629459U (en) * 2022-02-17 2022-07-11 醫電鼎眾股份有限公司 Metal shell package assembly of internal components of endoscope

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20210085162A1 (en) * 2009-06-18 2021-03-25 Endochoice, Inc. Circuit board assembly of a multiple viewing elements endoscope
US20210153729A1 (en) * 2010-12-09 2021-05-27 Endochoice, Inc. Flexible electronic circuit board for a multi-camera endoscope
CN103070660A (en) * 2013-01-18 2013-05-01 浙江大学 Three-dimensional electronic endoscope image pick-up device
US20190328217A1 (en) * 2018-04-26 2019-10-31 Deka Products Limited Partnership Endoscope with Rotatable Camera and Related Methods
TWM597628U (en) * 2019-12-11 2020-07-01 鑫視科技股份有限公司 Observing module of endoscope
TWI730621B (en) * 2020-02-11 2021-06-11 晉弘科技股份有限公司 Image sensor package and endoscope
TWM629459U (en) * 2022-02-17 2022-07-11 醫電鼎眾股份有限公司 Metal shell package assembly of internal components of endoscope

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