TW201633468A - Package module and its substrate structure - Google Patents

Abstract

A substrate structure is provided, including a first insulating layer; a first wiring layer connected to the first insulating layer; a plurality of first conductive pillars disposed in the first insulating layer and electrically connected to the first wiring layer; a second wiring layer disposed over the first insulating layer and electrically connected to the first conductive pillars; a plurality of second conductive pillars and a plurality of conductive bumps disposed over the second wiring layer; and a second insulating layer disposed over the first insulating layer, the second wiring layer, the second conductive pillars and the conductive bumps, wherein the second insulating layer is formed with an opening for exposing the conductive bumps therefrom and allowing a sensor to be disposed therein when applied to camera lenses to thereby reduce the overall thickness of the packing module.

Description

Package module and its substrate structure

The invention relates to a substrate structure, in particular to a substrate structure for embedding electronic components.

With the development of the electronics industry, today's electronic products have been designed in a light, short, and versatile manner, and semiconductor packaging technologies have also developed different packaging types. Most of the electronic components currently used in sensor components or camera lenses are still in the wire bonding package type or the Chip On Board (COB) type.

The camera module shown in FIG. 1 is a conventional wire-type package module 1 including a circuit component 10, a lens 11, a package 12, a transmission member 13, and a support. A holder 14 and an IC electronic component 18 of a camera lens. The circuit component 10 is a Rigid-Flex circuit board having a plurality of electrical contacts 100 and an external cable 102. The support member 14 is disposed on the circuit member 10 and carries the package body 12. The package body 12 encloses the electronic component 18, and the package body 12 has a circuit layer (not shown) electrically connected to the electronic component 18. The external pad of the circuit layer is soldered by a plurality of wires such as gold wires. The wire 19 is electrically connected to the electrical contact 100 of the circuit component 10. The electronic component 18 The upper surface has a sensing region 18a exposed to the package 12 for light sensing. The transmission member 13 is a voice coil motor (VCM), which is disposed on the support member 14. The lens 11 is disposed on the transmission member 13 and covers the sensing area 18a.

Another camera module as shown in FIG. 1A is a conventional wire-type package module 1 ′, which includes: a package substrate 10 ′, a lens 11 , a light transmissive member 12 ′, and a transmission member 13 . , a support member 14 and an IC electronic component 18 of a camera lens. The package substrate 10' carries the electronic component 18 and is electrically connected to the electronic component 18 by a plurality of bonding wires 19 such as gold wires. The support member 14 is disposed on the package substrate 10' by the adhesive 140 and covers the electronic component 18, and the support member 14 has an opening 141. The upper surface of the electronic component 18 has a sensing area 18a for light sensing, and the sensing area 18a is exposed to the opening 141. The light transmissive member 12' is, for example, glass, which is disposed on the bottom end of the opening 141 of the support member 14 and covers the sensing region 18a. The transmission member 13 is a voice coil motor (VCM) which is disposed on a wall surface of the opening 141 of the support member 14. The lens 11 is disposed on the transmission member 13 and covers the light transmissive member 12'.

However, the conventional wire-type package modules 1, 1' have a large number of components, resulting in high cost and high assembly complexity.

Moreover, the number of component layers of the package module 1, 1' is extremely large, which makes it difficult to reduce the thickness of the entire module and to reduce the size. For example, the thickness of the transmission member 13 of the package module 1 is extremely thick, and the support member 14 and the transmission member 13 are required to be joined by the support member 14 , which makes it difficult to reduce the thickness of the package module 1 . The package body 12 and the transmission member 13 need to be connected on four sides. (For example, the external pad 16), the module size is difficult to be reduced; or the support member 14 of the package module 1' needs to cover the electronic component 18, resulting in a large volume, so it is difficult to reduce the size of the package module 1' .

Moreover, in the conventional package module 1, 1 ', the bonding wires 19 have a certain height of the arc, so that the support member 14 needs to have a certain height to make the transmission member 13 (or the transparent member 12' The solder wire 19 is not touched, which makes it difficult to further thin the wire-type package module 1, 1'.

In addition, in the conventional package module 1', the adhesive member 14 and the package substrate 10' need to be connected by the adhesive 140, thereby causing problems of alignment problems and thickness increase.

Therefore, how to avoid all kinds of defects in the prior art has become a problem that is currently being solved.

In view of the above-mentioned various deficiencies of the prior art, the present invention provides a substrate structure comprising: a first insulating layer having opposite first and second surfaces; and a first circuit layer embedded in and bonded to the a first surface of the first insulating layer; a plurality of first conductive pillars are disposed in the first insulating layer and electrically connected to the first circuit layer; and a second circuit layer is disposed on the first insulating layer The first circuit layer is electrically connected to the first circuit layer by the first conductive pillars; the plurality of second conductive pillars and the plurality of conductive bumps are disposed on the second circuit layer; a second insulating layer is disposed on the second surface of the first insulating layer and covers the second circuit layer, the second conductive pillars and the conductive bumps, and the second insulating layer is formed with at least An opening is formed to expose the conductive bumps to the opening.

In the foregoing substrate structure, the surface of the conductive bump is lower than, higher than or flush with the bottom surface of the opening.

In the foregoing substrate structure, a third circuit layer formed on the second insulating layer is electrically connected to the second circuit layer by the second conductive pillars. Also included are a plurality of external pads formed on the third circuit layer. Also included is an insulating protective layer formed on the second insulating layer and the third wiring layer. Or comprising a plurality of third conductive pillars formed on the third circuit layer, and a third insulating layer formed on the second insulating layer, so that the third insulating layer covers the third wiring layer and The third conductive pillars include a fourth wiring layer formed on the third insulating layer, so that the fourth wiring layer is electrically connected to the third wiring layer by the third conductive pillars.

In the foregoing substrate structure, a circuit component is further disposed on the first surface or the second surface of the first insulating layer.

In the foregoing substrate structure, a plurality of conductive elements are included on the first surface of the first insulating layer or on the second insulating layer.

In the foregoing substrate structure, if applied to a camera lens, the present invention also provides a package module comprising: a substrate structure as described above; and at least one electronic component having a sensing region disposed in the opening and electrically connected The conductive bumps are exposed to the opening to reduce the thickness of the overall module.

Furthermore, if the substrate structure is applied to a camera lens, the package body (or package substrate) and the support member (even the circuit component and the transmission component) are fabricated together to form the substrate structure, so that the overall structure of the camera lens can be effectively reduced. Thickness and greatly simplifying the components, thus significantly reducing production costs and For assembly.

Moreover, in the foregoing package module, a light transmissive member or a lens covering the sensing area is further included.

In addition, the foregoing package module further includes a transmission member disposed on the second insulation layer.

1,1',5a-5d‧‧‧Package Module

10,28,38‧‧‧circuit parts

10'‧‧‧Package substrate

100,280‧‧‧Electrical contacts

102,282‧‧‧External cable

11,52‧‧‧ lenses

12‧‧‧Package

12', 51‧‧‧ light transmissive parts

13,53‧‧‧ Transmission parts

14‧‧‧Support

140‧‧‧Viscos

141,250‧‧‧ openings

16,260,460‧‧‧External mat

18,50,50’‧‧‧Electronic components

18a, 50a‧‧ Sensing area

19,500’‧‧‧welding line

2,3,4,4’‧‧‧substrate structure

20‧‧‧Loading board

21‧‧‧First line layer

21'‧‧‧First Conductive Cylinder

21a‧‧‧Surface

21b‧‧‧ end face

210‧‧‧Electrical connection pads

211‧‧‧ conductive traces

22‧‧‧Second circuit layer

22’‧‧‧Second conductive cylinder

23‧‧‧First insulation

23a‧‧‧ first surface

23b‧‧‧ second surface

24‧‧‧Electrical bumps

25‧‧‧Second insulation

250a‧‧‧ bottom

26‧‧‧ Third circuit layer

26'‧‧‧3rd conductive cylinder

27‧‧‧Insulation protective layer

281‧‧‧ functional joints

29a, 29b‧‧‧ conductive elements

380‧‧‧Opening

45‧‧‧ third insulation layer

46‧‧‧fourth circuit layer

500‧‧‧Electrical materials

1 is a schematic partial cross-sectional view of a conventional package module; FIG. 1A is a schematic cross-sectional view of another conventional package module; and FIGS. 2A to 2G are first embodiment of a substrate structure of the present invention; FIG. 3A to 3C are schematic cross-sectional views showing the manufacturing method of the second embodiment of the substrate structure of the present invention; FIG. 4 is a schematic cross-sectional view of the second embodiment; FIG. 4A is a cross-sectional view showing a fourth embodiment of the substrate structure of the present invention; and FIGS. 5A and 5A' are diagrams showing a substrate structure to which the present invention is applied. FIG. 5B and FIG. 5B are cross-sectional views of a package module to which the substrate structure of the present invention is applied; and FIGS. 5C and 5C' are diagrams of a package module to which the substrate structure of the present invention is applied. A schematic cross-sectional view; and a 5D and 5D' diagram are schematic cross-sectional views of a package module to which the substrate structure of the present invention is applied.

The other embodiments of the present invention will be readily understood by those skilled in the art from this disclosure.

It is to be understood that the structure, the proportions, the size, and the like of the present invention are intended to be used in conjunction with the disclosure of the specification, and are not intended to limit the invention. The conditions are limited, so it is not technically meaningful. Any modification of the structure, change of the proportional relationship or adjustment of the size should remain in this book without affecting the effects and the objectives that can be achieved by the present invention. The technical content disclosed in the invention can be covered. At the same time, the terms "upper", "lower", "first", "second", "third", "fourth" and "one" as used in this specification are also for convenience only. It is to be understood that the scope of the invention is not limited by the scope of the invention.

2A to 2G are schematic cross-sectional views showing the manufacturing method of the first embodiment of the substrate structure 2 of the present invention.

As shown in FIG. 2A, a first wiring layer 21 is formed on a carrier 20 by a patterning process, and a plurality of first conductive pillars 21' are formed on the first wiring layer 21.

In the present embodiment, the carrier 20 is a substrate, such as a copper foil substrate or other plate, and is not particularly limited.

Furthermore, the first circuit layer 21 includes a plurality of electrical connection pads 210 and a plurality of conductive traces 211, and the first conductive pillars 21' are copper pillars.

As shown in FIG. 2B, a first insulating layer 23 having a first surface 23a and a second surface 23b opposite to each other is formed on the carrier 20 such that the first insulating layer 23 covers the first wiring layer 21. And the first conductive pillars 21', and the first insulating layer 23 is bonded to the carrier 20 by the first surface 23a thereof.

In this embodiment, one end surface 21b of the first conductive pillars 21' is exposed on the second surface 23b of the first insulating layer 23.

Furthermore, the surface 21a of the first wiring layer 21 is flush with the first surface 23a of the first insulating layer 23.

Moreover, the first insulating layer 23 is formed by pressing or molding, and the first insulating layer 23 is a molding compound, a dielectric material, such as an epoxy resin (Epoxy), a polyfluorene. An organic resin such as an imide (PI) or other photosensitive or non-photosensitive material.

As shown in FIG. 2C, a second circuit layer 22 is formed on the second surface 23b of the first insulating layer 23, so that the second circuit layer 22 is electrically connected by the first conductive pillars 21'. The first circuit layer 21. Then, a plurality of second conductive pillars 22 ′ and conductive bumps 24 are formed on the second circuit layer 22 , and a second insulating layer 25 is formed on the second surface 23 b of the first insulating layer 23 to The second insulating layer 25 covers the second circuit layer 22 , the second conductive pillars 22 ′ and the conductive bumps 24 .

In the embodiment, the second circuit layer 22 directly connects the first conductive pillars 21' and the conductive bumps 24.

Furthermore, the second conductive pillar 22' is a copper pillar, and the second conductive One end face of the cylinder 22' is exposed to the second insulating layer 25.

Moreover, the conductive bumps 24 are not exposed to the second insulating layer 25.

In addition, the second insulating layer 25 is formed by pressing or molding, and the first insulating layer 23 is a molding compound, a dielectric material, such as an epoxy resin (Epoxy), and a polyfluorene. An organic resin such as an imide (PI) or other photosensitive or non-photosensitive material.

As shown in FIG. 2D, a third circuit layer 26 is formed on the second insulating layer 25, so that the third circuit layer 26 is electrically connected to the second circuit layer by the second conductive pillars 22'. twenty two. Next, a plurality of external pads 260 are formed on the third circuit layer 26.

As shown in FIG. 2E, an insulating protective layer 27 is formed on the second insulating layer 25 and the third wiring layer 26, and the external pads 260 are exposed to the insulating protective layer 27.

In the present embodiment, the material forming the insulating protective layer 27 is, for example, a solder mask, a dielectric material or a molding compound.

Moreover, the surface of the insulating protective layer 27 may be flush or not flush with the top surface of the external pads 260, so that the insulating protective layer 27 exposes the top surfaces of the external pads 260. Alternatively, the insulating protective layer 27 has a plurality of openings, such that the external pads 260 are exposed to the respective openings.

As shown in FIG. 2F, the insulating protective layer 27 extends inwardly into the second insulating layer 25 to form at least one opening 250, and the conductive bumps 24 are exposed to the opening 250.

In the embodiment, the opening 250 is made by physical or chemical methods. The method includes, but is not limited to, physical grinding, laser ablation, or chemical etching, etc., and is not formed by a conventional milling cutter, so that the opening angle of the opening 250 at the turn (such as the bottom surface and the opening) can be reduced.

Moreover, the surfaces of the conductive bumps 24 are flush, slightly higher or slightly lower than the bottom surface 250a of the opening 250.

As shown in FIG. 2G, the carrier board 20 is removed, so that the first circuit layer 21 is still embedded in the first surface 23a of the first insulating layer 23, and a circuit member 28 is disposed on the first insulating layer 23. On the first surface 23a.

In this embodiment, the circuit component 28 is a Rigid-Flex circuit board having a plurality of electrical contacts 280, functional contacts 281 (such as power supply, heat dissipation or grounding) and external cables. 282, as shown in FIG. 2G', and the electrical contacts 280 and the functional contacts 281 are electrically connected to the first circuit layer 21.

Furthermore, a plurality of conductive elements 29b can be formed on the second insulating layer 25, and the conductive elements 29b are electrically connected to the external pads 260, so as to be combined with other electronic devices by the conductive elements 29b (not shown). . Specifically, the conductive elements 29b are such as solder balls, solder bumps, copper bumps, and the like.

3A to 3C are schematic cross-sectional views showing the manufacturing method of the second embodiment of the substrate structure 3 of the present invention. The difference between this embodiment and the first embodiment lies only in the process sequence of the circuit component, and the other processes are substantially the same, so only the differences will be described in detail below.

As shown in FIG. 3A, following the process of FIG. 2B, a circuit member 38 is disposed on the second surface 23b of the first insulating layer 23, and the circuit member 38 is formed with a plurality of openings 380 to make the first End face 21b of the conductive cylinder 21' Exposed to the openings 380.

As shown in FIG. 3B, the process shown in FIGS. 2C to 2E is performed, wherein the second circuit layer 22 extends along the opening 380 to electrically connect the first conductive pillars 21'. .

As shown in FIG. 3C, the process shown in FIG. 2F is performed, and the insulating protective layer 27 extends inwardly into the second insulating layer 25 to form at least one opening 250, so that the conductive bumps 24 are exposed. At the opening 250. Thereafter, the carrier board 20 is removed to expose the first circuit layer 21 to the first surface 23a of the first insulating layer 23.

Figure 4 is a schematic cross-sectional view showing a third embodiment of the substrate structure 4 of the present invention. The difference between this embodiment and the first embodiment is only in the layering design, and the other processes are substantially the same, so only the differences will be described in detail below.

As shown in FIG. 4, following the process of FIG. 2D, a plurality of third conductive pillars 26' are formed on the third circuit layer 26, and a third insulating layer 45 is formed on the second insulating layer 25 to The third insulating layer 45 is wrapped around the third circuit layer 26 and the third conductive pillars 26'.

Then, a fourth circuit layer 46 is formed on the third insulating layer 45, so that the fourth circuit layer 46 is electrically connected to the third circuit layer 26 by the third conductive pillars 26'. A plurality of external pads 460 are formed on the fourth circuit layer 46.

Then, an insulating protective layer 27 is formed on the third insulating layer 45 and the fourth wiring layer 46, and the external pads 460 are exposed to the insulating protective layer 27.

The subsequent process extends inward from the insulating protective layer 27 to the second The edge layer 25 is formed with at least one opening 250 to expose the conductive bumps 24 to the opening 250. Finally, the carrier 20 is removed and the circuit component 28 is placed.

Therefore, the present invention can increase the number of layers of the circuit layer and the depth of the opening 250 as needed to enhance the applicability of the product.

In addition, in the first and third embodiments, the solder ball or the solder ball is implanted on the lower side of the circuit member 28.

Fig. 4' is a schematic cross-sectional view showing a fourth embodiment of the substrate structure 4' of the present invention. The difference between this embodiment and the above embodiments is that the circuit component is not provided, and the other processes are substantially the same, so only the differences will be described in detail below.

As shown in FIG. 4', the first insulating layer 23 is not bonded to the circuit member, and the first circuit layer 21 is exposed on the first surface 23a of the first insulating layer 23, so that a plurality of conductive elements 29a can be formed thereon. The first surface 23a of the first insulating layer 23 is electrically connected to the first circuit layer 21 to be combined with other electronic devices (not shown) by the conductive elements 29a.

In this embodiment, the conductive elements 29a are solder balls, solder bumps, copper bumps, and the like.

Therefore, the substrate structure 2, 3, 4, 4' of the present invention is fabricated by a Copper Connection in Molding (C2iM) technology, and is applied to a fingerprint identification or an image sensor (Image Sensor). The product can be used to make a circuit component, a package (or package substrate) and a support (holder) into the substrate structure 2, 3, 4, 4', and even a voice coil motor can be produced according to requirements (such as Figure 4). The substrate structure shown 4) can thus be obtained The thinner structure and the simplification of the components are greatly simplified, that is, the substrate structure 2, 3, 4, 4' is assembled with the sensor elements, so that the manufacturing cost can be greatly reduced and the assembly can be easily performed.

Moreover, the design of the opening 250 enables the sensor component to be buried in the insulating layer, thereby reducing the thickness of the overall package module.

Moreover, since the circuit member and the package (or the package substrate) are integrally formed with the support member, it is not necessary to connect the respective members with the adhesive, so that the problem of the conventional alignment and the increase in thickness do not occur.

Further, the application of each of the substrate structures 2, 3, 4, 4' will be described in detail below, as shown in Figs. 5A to 5D'.

The 5A and 5A' drawings are one of the modes in which the substrate structure 2 of the present invention is applied to the package module 5a of the camera lens.

As shown in FIG. 5A, at least one electronic component 50 is disposed in the opening 250, and the electronic component 50 is electrically connected to the conductive bumps 24. Next, a light transmissive member 51 is disposed on the opening 250 such that the light transmissive member 51 covers the sensing region 50a of the electronic component 50, but the light transmissive member 51 does not contact the electronic component 50.

In the embodiment, the electronic component 50 is a sensor component, such as a semiconductor wafer structure, and has an optical sensing area or a fingerprint sensing area 50a on the upper side to expose the sensing area 50a to the opening 250.

Furthermore, the electronic component 50 is a flip chip package, and has a plurality of electrode pads (not shown) on the lower side thereof, which are fixed by a conductive material 500 (such as solder, bump or conductive paste) such as printing or dispensing. Electrically connected to the conductive bumps 24.

Moreover, the light transmitting member 51 is a filter or glass, such as infrared glass, which covers the sensing region 50a.

In addition, in other embodiments, as shown in FIG. 5A', the electronic component 50' may also be a wire-bonding package having a plurality of electrode pads (not shown) on the upper side thereof, which are electrically connected by a plurality of bonding wires 500'. The conductive bumps 24, and the lower side of the electronic component 50' is disposed on the bottom surface of the opening 250 by the adhesive 501, and the conductive bumps are not required to be formed on the second circuit layer 22 under the electronic component 50. twenty four.

5B and 5B' are diagrams showing one embodiment of the substrate structure 3 of the present invention applied to the package module 5b of the camera lens, wherein the light transmissive member 51 can contact the electronic component 50 as shown in FIG. 5B.

The 5C and 5C' drawings are one of the modes in which the substrate structure 2, 4 of the present invention is applied to the package module 5c of the camera lens, wherein a lens 52 can be added.

As shown in FIG. 5C, a lens 52 is disposed at the end of the opening 250 of the substrate structure 4 shown in FIG. 4, that is, the lens 52 is disposed on the insulating protective layer 27 so that the lens 52 covers the sensing area. 50a.

As shown in FIG. 5C', a transmission member 53 is disposed on the conductive member 29b of the substrate structure 2 shown in FIG. 2G, and the lens 52 is mounted on the transmission member 53 to cover the lens 52. Sensing area 50a.

The 5D and 5D' drawings are one of the modes of the package structure 5d applied to the camera lens of the substrate structure 4' of the present invention, wherein the conductive elements 29a disposed on the first circuit layer 21 can be combined into one On the circuit board (figure omitted).

In each of the above package modules 5a-5d, an insulation fill can be formed according to requirements The material (not shown) is in the opening 250 such that the insulating filler covers the electronic component 50.

Therefore, each of the above-mentioned camera lenses can be made into the substrate structure 2, 3, 4, 4' by combining the required package and the support member (or even the transmission member), so that the component parts can be reduced, thereby reducing Cost and simplify assembly steps.

Furthermore, since the package required for the camera lens is made together with the support member (or even the transmission member), the thickness of each layer can be controlled to reduce the thickness and size of the overall module. For example, the thickness of the transmission member of the substrate structure 4 is extremely thick, and the substrate structure 2, 3, 4, 4' is provided with a connection point (such as the electrical connection pad 210) as needed to reduce the module of the camera lens. Alternatively, the support member of the substrate structure 2, 3, 4, 4' need not cover the electronic component 50, thereby reducing the size of the package module 5a-5d.

Moreover, the circuit member 28 directly fits the first insulating layer 23, and the electronic component 50 is disposed in the opening 250 of the substrate structure 2, 3, 4, 4', so that the arc of the bonding wire can be overcome. The problem is that if the electronic component 50 is bonded by a conductive material 500 such as a solder ball, the curvature is not generated, and the thickness of the overall structure is reduced, thereby effectively thinning the camera lens.

In addition, the camera lens can be applied to a Ball Grid Array (BGA) or a Land Grid Array (LGA).

The above embodiments are intended to illustrate the principles of the invention and its effects, and are not intended to limit the invention. Any of the above-described embodiments may be modified by those skilled in the art without departing from the spirit and scope of the invention. Therefore, the scope of protection of the present invention should be as follows. Listed around.

2‧‧‧Substrate structure

21‧‧‧First line layer

21'‧‧‧First Conductive Cylinder

22‧‧‧Second circuit layer

22’‧‧‧Second conductive cylinder

23‧‧‧First insulation

23a‧‧‧ first surface

23b‧‧‧ second surface

24‧‧‧Electrical bumps

25‧‧‧Second insulation

250‧‧‧ openings

26‧‧‧ Third circuit layer

260‧‧‧External mat

27‧‧‧Insulation protective layer

28‧‧‧ Circuitry

29b‧‧‧Conducting components

Claims (20)

A substrate structure includes: a first insulating layer having opposite first and second surfaces; a first circuit layer embedded in and bonded to the first surface of the first insulating layer; a conductive pillar is disposed in the first insulating layer and electrically connected to the first circuit layer; a second circuit layer is disposed on the second surface of the first insulating layer and is formed by the first The conductive pillar is electrically connected to the first circuit layer; the plurality of second conductive pillars and the plurality of conductive bumps are disposed on the second circuit layer; and a second insulating layer is disposed on the first insulating layer And coating the second circuit layer, the second conductive pillars and the conductive bumps on the second surface, and the second insulating layer is formed with at least one opening to expose the conductive bumps to the second conductive layer Opening. The substrate structure of claim 1, wherein the surface of the conductive bump is lower than, higher than or flush with the bottom surface of the opening. The substrate structure of claim 1, further comprising a third circuit layer formed on the second insulating layer, wherein the third circuit layer is electrically connected to the second conductive pillar Two circuit layers. The substrate structure of claim 3, comprising a plurality of external pads formed on the third circuit layer. The substrate structure as described in claim 3 of the patent application, including the formation And protecting the protective layer from one of the second insulating layer and the third circuit layer. The substrate structure of claim 3, further comprising a plurality of third conductive pillars formed on the third wiring layer, and a third insulating layer formed on the second insulating layer, so as to The third insulating layer covers the third circuit layer and the third conductive pillars. The substrate structure of claim 6, further comprising a fourth circuit layer formed on the third insulating layer, so that the fourth circuit layer is electrically connected by the third conductive pillars. The third circuit layer. The substrate structure of claim 1, further comprising a circuit component disposed on the first surface or the second surface of the first insulating layer. The substrate structure of claim 1, further comprising a plurality of conductive elements disposed on the first surface of the first insulating layer or on the second insulating layer. The package module includes: a substrate structure as described in claim 1; and at least one electronic component having a sensing region disposed in the opening and electrically connected to the conductive bumps, and The sensing area is exposed to the opening. The package module of claim 10, wherein the surface of the conductive bump is lower than, higher than or flush with the bottom surface of the opening. The package module of claim 10, further comprising a third circuit layer formed on the second insulating layer, the third circuit layer being electrically connected by the second conductive pillars The second circuit layer. Such as the package module described in claim 12, the complex includes formation a plurality of external pads on the third circuit layer. The package module of claim 12, further comprising an insulating protective layer formed on the second insulating layer and the third circuit layer. The package module of claim 12, further comprising forming a plurality of third conductive pillars formed on the third circuit layer and a third insulating layer formed on the second insulating layer, The third insulating layer is coated with the third circuit layer and the third conductive pillars. The package module of claim 15 further comprising a fourth circuit layer formed on the third insulating layer, such that the fourth circuit layer is electrically connected by the third conductive pillars The third circuit layer. The package module of claim 10, further comprising a circuit component disposed on the first surface or the second surface of the first insulating layer. The package module of claim 10, comprising a plurality of conductive elements disposed on the first surface of the first insulating layer or on the second insulating layer. The package module of claim 10, further comprising a light transmissive member or a lens covering the sensing area. The package module of claim 10, further comprising a transmission member disposed on the second insulation layer.